KR20140134349A - Method for recovering hydrofluoric acid from waste water produced etching process - Google Patents
Method for recovering hydrofluoric acid from waste water produced etching process Download PDFInfo
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- KR20140134349A KR20140134349A KR1020130053605A KR20130053605A KR20140134349A KR 20140134349 A KR20140134349 A KR 20140134349A KR 1020130053605 A KR1020130053605 A KR 1020130053605A KR 20130053605 A KR20130053605 A KR 20130053605A KR 20140134349 A KR20140134349 A KR 20140134349A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
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Abstract
Description
본 발명은 에칭공정에서 발생된 폐산으로부터 불산의 회수방법에 관한 것으로, 더욱 상세하게는 에칭공정에서 발생된 폐산에서 불산을 회수하여 재사용할 수 있기 때문에, 에칭공정의 운전비용을 절감시켜주며 폐수의 양을 줄여주기 때문에 친환경적인 효과를 나타내는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법에 관한 것이다.
The present invention relates to a method for recovering hydrofluoric acid from waste acid generated in an etching process, more particularly, to recovering hydrofluoric acid from waste acid generated in an etching process and reusing it, The present invention relates to a method for recovering a hydrofluoric acid from a waste acid generated in an etching process that exhibits an environmentally friendly effect.
본 발명은 에칭공정에서 발생된 폐산으로부터 불산의 회수방법에 관한 것으로, 더욱 상세하게는 에칭공정에서 발생된 폐산에서 불산을 회수하여 재사용할 수 있기 때문에, 에칭공정의 운전비용을 절감시켜주며 폐수의 양을 줄여주기 때문에 친환경적인 효과를 나타내는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법에 관한 것이다.The present invention relates to a method for recovering hydrofluoric acid from waste acid generated in an etching process, more particularly, to recovering hydrofluoric acid from waste acid generated in an etching process and reusing it, The present invention relates to a method for recovering a hydrofluoric acid from a waste acid generated in an etching process that exhibits an environmentally friendly effect.
LCD 및 휴대폰 액정에 사용되는 유기 기판의 에칭공정에는 불산에 질산 또는 황산이 혼합된 혼합산을 이용한다. 이렇게 사용된 혼합산은 유리의 주성분인 Si성분이 불산과 반응하여 규불화수소산(H2SiF6)의 형태로 존재한다.In the etching process of the organic substrate used for LCD and mobile phone liquid crystal, a mixed acid in which nitric acid or sulfuric acid is mixed with hydrofluoric acid is used. The mixed acid thus used is present in the form of hydrofluoric acid (H 2 SiF 6 ) by reacting the Si component, which is the main component of the glass, with hydrofluoric acid.
전술한 공정을 통해 발생된 혼합산은 불산의 농도가 대략 5 내지 10%로 알칼리제를 이용하여 안정화하는 방법 외에는 특별한 처리방법이 없는 실정이다.The mixed acid generated through the above-mentioned process has no special treatment other than the method of stabilizing the concentration of hydrofluoric acid by about 5 to 10% using an alkali agent.
따라서, 폐산을 법적 규제치까지 처리할 수 있는 명확한 시설이 없고, 안정화된 후에도 잔류된 불산 성분 외에 다른 유해물질을 처리하기 위해 설비투자비가 과도하게 발생하여 대부분의 업체는 자체 처리보다는 전문 처리업체에 위탁하고 있는 실정이며, 이러한 처리업체에서도 안정화 시에 발생되는 폐기물을 토양에 매립하여 처리하기 때문에 폐기물에 의한 토양오염이 발생하는 문제점이 있었다.
Therefore, there is no clear facility to treat the waste acid up to the legal limit, and after the stabilization, the capital investment cost is excessively incurred in order to treat other harmful substances other than the residual hydrofluoric acid component. In such a processing company, the waste generated during stabilization is buried in the soil and treated, thereby causing soil contamination due to waste.
본 발명의 목적은 에칭공정에서 발생된 폐산에서 불산을 우수한 회수율로 회수하여 재사용할 수 있도록 하기 때문에, 에칭공정의 운전비용을 절감시켜주는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 제공하는 것이다.It is an object of the present invention to provide a method for recovering hydrofluoric acid from waste acid generated in an etching process that reduces the operation cost of the etching process because the hydrofluoric acid in the waste acid generated in the etching process can be recovered and recovered at a good recovery rate .
본 발명의 다른 목적은 에칭공정에서 발생되는 폐산의 양을 줄여주기 때문에, 폐산의 처리비용과 토양의 오염을 줄여주는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 제공하는 것이다.
Another object of the present invention is to provide a method for recovering hydrofluoric acid from waste acid generated in an etching process for reducing waste treatment cost and soil contamination, because it reduces the amount of waste acid generated in the etching process.
본 발명의 목적은 에칭공정에서 발생된 폐산을 반응조에 투입하는 폐산투입단계, 상기 폐산투입단계를 통해 폐산이 투입된 반응조를 가열하는 가열단계 및 상기 가열단계를 통해 증발된 불산을 회수하는 제1불산회수단계로 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 제공함에 의해 달성된다.An object of the present invention is to provide a method of recovering hydrofluoric acid, which comprises the steps of charging a waste acid generated in an etching process into a reaction tank, heating the reaction tank into which the waste acid has been introduced through the waste acid introduction step, And recovering the hydrofluoric acid from the waste acid generated in the etching step.
본 발명의 바람직한 특징에 따르면, 상기 제1불산회수단계 이후에는 상기 제1불산회수단계를 통해 불산이 회수된 폐산에 수산성분을 투입하여 폐산 내에 잔존하는 불산을 회수하는 제2불산회수단계가 더 진행되는 것으로 한다.According to a preferred aspect of the present invention, after the first hydrofluoric acid recovery step, a second hydrofluoric acid recovery step for recovering hydrofluoric acid remaining in the waste acid by adding a component of the hydrochloric acid to the waste acid recovered by hydrofluoric acid through the first hydrofluoric acid recovery step It is assumed that it proceeds.
본 발명의 더 바람직한 특징에 따르면, 상기 반응조는 교반장치 및 증발된 불산을 회수하는 컨덴서가 구비되어 있는 것으로 한다.According to a further preferred feature of the present invention, the reaction tank is provided with a stirring device and a condenser for recovering the vaporized hydrofluoric acid.
본 발명의 더욱 바람직한 특징에 따르면, 상기 가열단계는 100 내지 110℃의 온도로 이루어지는 것으로 한다.According to a further preferred feature of the present invention, the heating step is performed at a temperature of 100 to 110 ° C.
본 발명의 더욱 더 바람직한 특징에 따르면, 상기 제1불산회수단계는 상기 가열단계를 통해 증발된 불산을 반응조에 구비된 컨덴서를 통해 회수탱크로 200 내지 300분 동안 회수한 후에, 25 내지 35℃의 온도로 냉각 및 응축하여 이루어지는 것으로 한다.According to still another more preferred characteristic of the present invention, the first hydrofluoric acid recovery step comprises recovering the hydrofluoric acid evaporated through the heating step through the condenser provided in the reaction tank for 200 to 300 minutes, And cooled and condensed at a predetermined temperature.
본 발명의 더욱 더 바람직한 특징에 따르면, 상기 제2불산회수단계는 상기 제1불산회수단계를 통해 불산이 회수된 폐산의 pH가 7이 되도록 수산성분을 투입하여 이루어지는 것으로 한다.According to still another more preferred characteristic of the present invention, the second hydrofluoric acid recovery step is performed by inputting the hydrous acid component so that the pH of the waste acid recovered from hydrofluoric acid is 7 through the first hydrofluoric acid recovery step.
본 발명의 더욱 더 바람직한 특징에 따르면, 상기 수산성분은 수산화나트륨 으로 이루어지는 것으로 한다.
According to a further preferred feature of the present invention, the above-mentioned fish-based ingredient is made of sodium hydroxide.
본 발명에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법은 에칭공정에서 발생된 폐산에서 불산을 우수한 회수율로 회수하여 재사용할 수 있도록 하기 때문에, 에칭공정의 운전비용을 절감시켜주는 탁월한 효과를 나타낸다.The method for recovering hydrofluoric acid from the waste acid generated in the etching process according to the present invention has an excellent effect of reducing the operation cost of the etching process because the hydrofluoric acid in the waste acid generated in the etching process can be recovered at a good recovery rate and reused .
또한, 에칭공정에서 발생되는 폐산의 양을 줄여주기 때문에, 폐산 처리비용 및 토양의 오염을 줄여주는 탁월한 효과를 나타낸다.
In addition, since the amount of waste acid generated in the etching process is reduced, it shows an excellent effect of reducing waste acid treatment cost and soil contamination.
도 1은 본 발명의 일 실시예에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 나타낸 순서도이다.
도 2는 본 발명의 다른 실시예에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 나타낸 순서도이다.1 is a flowchart showing a method of recovering hydrofluoric acid from waste acid generated in an etching process according to an embodiment of the present invention.
2 is a flowchart illustrating a method of recovering hydrofluoric acid from waste acid generated in an etching process according to another embodiment of the present invention.
이하에는, 본 발명의 바람직한 실시예와 각 성분의 물성을 상세하게 설명하되, 이는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 발명을 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로 인해 본 발명의 기술적인 사상 및 범주가 한정되는 것을 의미하지는 않는다.
Hereinafter, preferred embodiments of the present invention and physical properties of the respective components will be described in detail with reference to the accompanying drawings. However, the present invention is not limited thereto, And this does not mean that the technical idea and scope of the present invention are limited.
본 발명에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법은 에칭공정에서 발생된 폐산을 반응조에 투입하는 폐산투입단계(S101), 상기 폐산투입단계(S101)를 통해 폐산이 투입된 반응조를 가열하는 가열단계(S103) 및 상기 가열단계(S103)를 통해 증발된 불산을 회수하는 제1불산회수단계(S105)로 이루어진다.
In the method for recovering hydrofluoric acid from the waste acid generated in the etching process according to the present invention, a waste acid input step (S101) for inputting the waste acid generated in the etching process into the reaction tank, a step of heating the reaction tank into which the waste acid is charged through the waste acid input step (S101) And a first hydrofluoric acid recovery step (S105) for recovering the hydrofluoric acid evaporated through the heating step (S103) and the heating step (S103).
상기 폐산투입단계(S101)는 에칭공정에서 발생된 폐산을 반응조에 투입하는 단계다.The waste acid input step (S101) is a step of inputting the waste acid generated in the etching process into the reaction tank.
상기 폐산은 LCD 및 휴대폰 액정에 사용되는 유기 기판의 에칭공정을 통해 발생된 것을 사용하되, 전처리하여 질산성분을 제거한 것을 사용하는데, 전처리되어 질산성분이 제거된 폐산에는 불산이 약 5 내지 10 중량% 함유되어 있다.The waste acid generated through the etching process of the organic substrate used for LCD and mobile phone liquid crystal is pretreated by removing the nitric acid component. The waste acid from which the pretreated nitric acid component is removed contains about 5 to 10 wt% .
또한, 상기 반응조에는 가열장치가 구비되어 있으며, 교반장치 및 상기 가열단계를 통해 증발된 불산을 회수할 수 있도록 컨덴서가 구비되어 있는 것을 사용하는 것이 바람직하며, 반응조의 용량은 공업적으로 사용하기에 적합한 규격인 10톤 내외인 것을 사용하는 것이 바람직하다.
In addition, it is preferable that the reaction tank is equipped with a heating device, a stirring device and a condenser for recovering the hydrofluoric acid evaporated through the heating step, and the capacity of the reaction tank is industrially used It is preferable to use a suitable standard of about 10 tons.
상기 가열단계(S103)는 상기 폐산투입단계(S101)를 통해 폐산이 투입된 반응조를 가열하는 단계로, 폐산이 투입된 반응조를 100 내지 110℃의 온도 200 내지 300분 동안 가열하여 이루어진다.The heating step (S103) is a step of heating the reaction tank into which the waste acid is charged through the waste acid injection step (S101), and heating the reaction tank charged with the waste acid at a temperature of 100 to 110 ° C for 200 to 300 minutes.
상기의 온도조건과 시간으로 반응조를 가열하는 이유는, 상기 반응조 내의 존재하는 불산은 유리의 주성분인 Si와 결합된 규불화수소산의 형태로 존재하기 때문에, 규불화수소산에서 불산 성분만을 휘발시키기 위해 반응조를 가열하여 규불화수소산의 결합을 끊어 불산성분을 증발시키기 위함이다.
The reason why the reaction tank is heated at the above-described temperature condition and time is that the hydrofluoric acid present in the reaction tank exists in the form of hydrofluoric acid hydrogencarbonate combined with Si, which is the main component of the glass, To heat the hydrofluoric acid to dissociate the hydrofluoric acid to evaporate the hydrofluoric acid component.
상기 제1불산회수단계(S105)는 상기 가열단계(S103)를 통해 증발된 불산을 회수하는 단계로, 상기 가열단계(S103)를 통해 증발된 불산을 반응조에 구비된 컨덴서를 통해 회수탱크로 200 내지 300분 동안 회수한 후에, 회수탱크의 온도를 25 내지 35℃로 조절하여 회수된 불산을 냉각 및 응축하여 이루어진다.The first hydrofluoric acid recovery step (S105) is a step of recovering the hydrofluoric acid evaporated through the heating step (S103). The hydrofluoric acid evaporated through the heating step (S103) is supplied to the recovery tank through a condenser provided in the reaction tank To 300 minutes, then the temperature of the recovery tank is adjusted to 25 to 35 DEG C, and the recovered hydrofluoric acid is cooled and condensed.
상기의 제1불산회수단계(S105)를 거치면, 상기 폐산투입단계(S101)에서 투입된 폐산에 함유되어 있는 불산의 회수율이 약 70 내지 80%에 달하게 된다.
After the first hydrofluoric acid recovery step (S105), the recovery rate of hydrofluoric acid contained in the waste acid charged in the waste acid addition step (S101) reaches about 70 to 80%.
또한, 상기 제1불산회수단계(S105) 이후에는 상기 제1불산회수단계(S105)를 통해 불산이 회수된 폐산에 수산성분을 투입하여 폐산 내에 잔존하는 불산을 회수하는 제2불산회수단계(S107)가 더 진행될 수도 있다.After the first hydrofluoric acid recovery step (S105), a second hydrofluoric acid recovery step (S107) is performed in which the hydrofluoric acid remaining in the waste acid is recovered by injecting a water acid component into the waste acid recovered by the hydrofluoric acid recovery step (S105) ) May proceed further.
이때, 상기 제2불산회수단계(S107)는 상기 제1불산회수단계(S105)를 통해 불산이 회수된 폐산의 pH가 7이 되도록 수산성분을 투입하여 이루어지는데, 수산성분으로 인해 발생하는 수산화이온(OH-)이 규불화수소산의 결합을 끊는 역학을 하여, 반응조 내 폐산에 잔류된 규불화수소산으로부터 불산을 회수할 수 있다.At this time, the second hydrofluoric acid recovery step (S107) is performed by inputting the hydrous acid component such that the pH of the waste acid recovered from hydrofluoric acid is 7 through the first hydrofluoric acid recovery step (S105) (OH < "& gt ; ) breaks bonds of hydrous silicic acid, and hydrofluoric acid can be recovered from the hydrous silicic acid remaining in the waste acid in the reaction tank.
이때, 상기 수산성분의 투입량은 상기 제1불산회수단계를 통해 회수되는 불산의 양에 따라 결정되는데, 상기 제1불산회수단계를 통해 회수되는 불산의 회수율이 약 70 내지 80%에 달하기 때문에, 최초로 투입되는 폐수 100 중량부 대비 1 내지 5 중량부가 투입되며, 상기 수산성분으로는 수산화나트륨이 사용되고, 반응기의 온도는 100 내지 110℃의 온도를 유지한 상태에서 약 2시간 동안 회수과정을 진행되는 것이 바람직하다.
At this time, the input amount of the aquatic component is determined according to the amount of hydrofluoric acid recovered through the first hydrofluoric acid recovery step. Since the recovery rate of the hydrofluoric acid recovered through the first hydrofluoric acid recovery step reaches about 70 to 80% 1 to 5 parts by weight of sodium hydroxide is used as the above-mentioned water component, and the temperature of the reactor is recovered for about 2 hours while maintaining the temperature of 100 to 110 ° C .
이하에서는, 본 발명에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법을 통해 불산을 회수하는 방법을 실시예를 들어 설명하기로 한다.
Hereinafter, a method for recovering hydrofluoric acid from a waste acid generated in an etching process according to the present invention through a method of recovering hydrofluoric acid will be described.
<실시예 1>≪ Example 1 >
에칭공정에서 발생되었으며, 불산의 농도가 8%인 폐산 7톤을 가열장치 및 컨덴서가 구비된 10톤 용량의 반응조에 투입하고, 반응조를 100℃의 온도로 가열하여 폐산에 함유된 불산을 증발시킨 후에, 상기 반응조에 구비된 컨덴서를 통해 증발된 불산을 회수탱크로 240분 동안 회수하고, 회수된 불산을 30℃의 온도로 냉각 및 응축하였다.
7 tons of waste acid generated in the etching process and having a concentration of 8% of hydrofluoric acid was charged into a reaction tank having a capacity of 10 tons equipped with a heating device and a condenser, and the reaction tank was heated at a temperature of 100 ° C to evaporate hydrofluoric acid contained in the waste acid Thereafter, the hydrofluoric acid evaporated through the condenser provided in the reaction tank was recovered into the recovery tank for 240 minutes, and the recovered hydrofluoric acid was cooled and condensed at a temperature of 30 ° C.
<실시예 2>≪ Example 2 >
상기 실시예 1과 동일하게 진행하되, 반응조를 105℃의 온도로 가열하여 폐산에 함유된 불산을 회수하였다.
The procedure of Example 1 was followed except that the reactor was heated to a temperature of 105 ° C to recover the hydrofluoric acid contained in the waste acid.
<실시예 3>≪ Example 3 >
상기 실시예 1과 동일하게 진행하되, 반응조를 110℃의 온도로 가열하여 폐산에 함유된 불산을 회수하였다.
The procedure of Example 1 was followed except that the reaction vessel was heated to a temperature of 110 ° C to recover the hydrofluoric acid contained in the waste acid.
상기 실시예 1 내지 3을 통해 회수된 불산의 양과 회수율을 측정하여 아래 표 1에 나타내었다.
The amounts and recovery rates of the recovered hydrofluoric acid obtained through Examples 1 to 3 were measured and are shown in Table 1 below.
<표 1><Table 1>
위에 표 1에 나타낸 것처럼, 본 발명의 실시예 1 내지 3을 통해 이루어진 불산의 회수방법은 우수한 불산 회수율을 나타내는 것을 알 수 있다.
As shown in Table 1 above, it can be seen that the method for recovering hydrofluoric acid through Examples 1 to 3 of the present invention exhibits excellent recovery of hydrofluoric acid.
<실시예 4><Example 4>
상기 실시예 1을 거친 반응조 내 폐수의 pH가 7이 될 때까지 수산화나트륨 277kg을 투입하여 폐산에 함유된 잔류 불산을 회수하였다.
The residual hydrofluoric acid contained in the waste acid was recovered by adding 277 kg of sodium hydroxide until the pH of the wastewater in the reaction tank after Example 1 was 7.
<실시예 5>≪ Example 5 >
상기 실시예 2를 거친 반응조 내 폐수의 pH가 7이 될 때까지 수산화나트륨을 231kg을 투입하여 폐산에 함유된 잔류 불산을 회수하였다.
231 kg of sodium hydroxide was added to recover the residual hydrofluoric acid contained in the waste acid until the pH of the wastewater in the reaction tank after Example 2 was 7.
<실시예 6>≪ Example 6 >
상기 실시예 3을 거친 반응조 내 폐수의 pH가 7이 될 때까지 수산화나트륨 185kg을 투입하여 폐산에 함유된 잔류 불산을 회수하였다.
The residual hydrofluoric acid contained in the spent acid was recovered by adding 185 kg of sodium hydroxide until the pH of the wastewater in the reaction tank passed through Example 3 was 7.
상기 실시예 4 내지 6을 통해 회수된 불산의 양과 회수율(표 1의 불산 회수율과 합산)을 측정하여 아래 표 2에 나타내었다.
The amount of the hydrofluoric acid recovered through Examples 4 to 6 and the recovery rate (sum of the hydrofluoric acid recovery rate in Table 1) were measured and shown in Table 2 below.
<표 2><Table 2>
위에 표 2에 나타낸 것처럼, 본 발명의 실시예 4 내지 6을 통해 이루어지는 회수과정을 통해 폐산에 잔류되어 있는 불산을 대부분 회수할 수 있었다.
As shown in Table 2 above, most of the hydrofluoric acid remaining in the spent acid was recovered through the recovery process of Examples 4 to 6 of the present invention.
따라서, 본 발명에 따른 에칭공정에서 발생된 폐산으로부터 불산의 회수방법은 에칭공정에서 발생된 폐산에서 불산을 우수한 회수율로 회수하여 재사용할 수 있도록 하기 때문에, 에칭공정의 운전비용을 절감시켜주는 탁월한 효과를 나타내며, 에칭공정에서 발생되는 폐산의 양을 줄여주기 때문에, 폐산 처리비용 및 토양의 오염을 줄여주는 탁월한 효과를 나타낸다.
Therefore, the method of recovering the hydrofluoric acid from the waste acid generated in the etching process according to the present invention can recover the hydrofluoric acid from the waste acid generated in the etching process at a good recovery rate and reuse it. Therefore, And reduces the amount of waste acid generated in the etching process. Therefore, it shows an excellent effect of reducing waste acid treatment cost and soil contamination.
S101 ; 폐산투입단계
S103 ; 가열단계
S105 ; 제1불산회수단계
S107 ; 제2불산회수단계S101; Waste acid input step
S103; Heating step
S105; The first hydrofluoric acid recovery step
S107; The second hydrofluoric acid recovery step
Claims (7)
상기 폐산투입단계를 통해 폐산이 투입된 반응조를 가열하는 가열단계; 및
상기 가열단계를 통해 증발된 불산을 회수하는 제1불산회수단계;로 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
A step of injecting waste acid generated in an etching process into a reaction tank;
A heating step of heating the reaction tank into which waste acid is introduced through the waste acid introduction step; And
And a first hydrofluoric acid recovery step of recovering the hydrofluoric acid evaporated through the heating step.
상기 제1불산회수단계 이후에는 상기 제1불산회수단계를 통해 불산이 회수된 폐산에 수산성분을 투입하여 폐산 내에 잔존하는 불산을 회수하는 제2불산회수단계가 더 진행되는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
The method according to claim 1,
And a second hydrofluoric acid recovery step of recovering the hydrofluoric acid remaining in the waste acid by adding a component of hydrochloric acid to the waste acid recovered from the hydrofluoric acid through the first hydrofluoric acid recovery step after the first hydrofluoric acid recovery step And recovering the hydrofluoric acid.
상기 반응조는 교반장치 및 증발된 불산을 회수하는 컨덴서가 구비되어 있는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
The method according to claim 1,
Wherein the reaction tank is provided with a stirring device and a condenser for recovering the vaporized hydrofluoric acid.
상기 가열단계는 100 내지 110℃의 온도에서 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
The method according to claim 1,
Wherein the heating step is performed at a temperature of 100 to 110 ° C.
상기 제1불산회수단계는 상기 가열단계를 통해 증발된 불산을 반응조에 구비된 컨덴서를 통해 회수탱크로 200 내지 300분 동안 회수한 후에, 25 내지 35℃의 온도로 냉각 및 응축하여 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
The method according to claim 1,
The first hydrofluoric acid recovery step is characterized in that the vaporized hydrofluoric acid is recovered in the recovery tank through the condenser provided in the reaction vessel for 200 to 300 minutes and then cooled and condensed at a temperature of 25 to 35 ° C And recovering the hydrofluoric acid from the waste acid generated in the etching process.
상기 제2불산회수단계는 상기 제1불산회수단계를 통해 불산이 회수된 폐산 의 pH가 7이 되도록 수산성분을 투입하여 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.
The method of claim 2,
Wherein the second hydrofluoric acid recovery step is performed by introducing a hydrochloric acid component into the waste acid recovered from the hydrofluoric acid through the first hydrofluoric acid recovery step so that the pH of the waste acid recovered is 7.
상기 수산성분은 수산화나트륨으로 이루어지는 것을 특징으로 하는 에칭공정에서 발생된 폐산으로부터 불산의 회수방법.The method of claim 2,
Wherein the acid component is sodium hydroxide.
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