KR20140123139A - Organic light emitting diode display device - Google Patents

Abstract

The present invention relates to an organic light emitting diode display device capable of preventing a signal transmission failure due to the disconnection of a connection wire which transmits a signal of a gate driving unit to an organic light emitting diode array on a display region. The organic light emitting diode display device according to the present invention includes a substrate which includes a display region and a non-display region, an organic light emitting diode array which is formed on the display region of the substrate, a gate driving unit which is formed on the non-display region and includes a plurality of circuit blocks, and the connection wire which connects the circuit block to the organic light emitting diode array. Two or more connection wires are connected in parallel. Both ends of the connection wire are connected to the circuit block and the organic light emitting diode array through a horizontal connection part, respectively.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic light emitting diode (OLED) display device,

The present invention relates to an organic light emitting diode display device, and more particularly, to an organic light emitting diode display device capable of preventing a signal transfer failure from occurring due to disconnection of a connection wiring for transmitting a signal of a gate driver to an organic light emitting diode array in a display area will be.

The image display device that realizes various information on the screen is a core technology of the information communication age and it is becoming thinner, lighter, more portable and higher performance. Accordingly, an organic light emitting diode (OLED) display device for displaying an image by controlling the amount of light emitted from the organic light emitting layer by using a flat panel display capable of reducing weight and volume, which is a disadvantage of a cathode ray tube (CRT)

The organic light emitting diode display includes an organic light emitting diode array formed in a display region of a substrate. The organic light emitting diode array includes a thin film transistor and an organic light emitting diode connected to the thin film transistor. Since the organic light emitting diode is vulnerable to moisture and oxygen, an encapsulation substrate is formed to cover the organic light emitting diode.

The organic light emitting diode has a structure in which a first electrode, which is an anode, an emission layer (EML), and a second electrode, which is a cathode are stacked in order. In the organic light emitting diode, when a voltage is applied to the first and second electrodes, holes and electrons recombine in the light emitting layer to form an exciton, and the exciton falls to a ground state and emits light.

In this case, when the organic light emitting diode is formed on a flexible substrate, a flexible organic light emitting diode display device can be realized. In particular, if the edge of the flexible substrate is bent to the back surface of the flexible substrate, the width of the bezel region of the organic light emitting diode display device can be reduced.

However, when the flexible substrate as described above is warped or bent, when the wiring is provided in the bending area, there arises a problem that the wiring is disconnected. In particular, when a gate driver is formed in a non-display area of a substrate using a gate in panel (GIP) method, the connection wiring for transmitting the signal of the gate driver to the organic light emitting diode array in the display area is broken in the bent area of the substrate.

FIG. 1A is a plan view of a general organic light emitting diode display device, and shows only a substrate, a display region, a gate driver, and a connection wiring. 1B is an enlarged view of the area A in FIG. 1A.

1A and 1B, in a general organic light emitting diode display device, the signal of each circuit block 13A of the gate driver 13 is transmitted to the gate wiring of the display area 10A through one connection wiring 14 . Accordingly, when the connection wiring 14 is broken due to the stress and the drag force of the bending area, normal driving of the thin film transistor connected to the connection wiring 14 becomes impossible, and reliability of the organic light emitting diode display device is deteriorated do.

It is an object of the present invention to provide an organic light emitting diode display device having improved reliability by forming connection wirings in parallel or by forming a plurality of layers with an insulating film interposed therebetween.

According to an aspect of the present invention, there is provided an organic light emitting diode display comprising: a substrate including a display region and a non-display region; An organic light emitting diode array formed in the display region of the substrate; A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And a connection wiring connecting the circuit block and the organic light emitting diode array, wherein at least two connection wiring lines are connected in parallel, and both ends of the connection wiring line are connected through a horizontal connection portion, And the organic light emitting diode array.

The two or more connection wires are further connected via one or more vertical connections.

The vertical connection portion connects the two or more connection wirings to each other irregularly or regularly.

The connection wiring, the horizontal connection portion and the vertical connection portion are formed of the same material in the same layer.

According to another aspect of the present invention, there is provided an organic light emitting diode display comprising: a substrate including a display region and a non-display region; An organic light emitting diode array formed in the display region of the substrate; A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And a connection wiring connecting the circuit block and the organic light emitting diode array, wherein the connection wiring includes at least one hole formed to penetrate the connection wiring.

The hole is formed in at least one shape selected from a circle, an ellipse, and a polygon.

The at least one hole is arranged regularly or irregularly.

According to another aspect of the present invention, there is provided an organic light emitting diode display comprising: a substrate including a display region and a non-display region; An organic light emitting diode array formed in the display region of the substrate; A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And a connection wiring connecting the circuit block and the organic light emitting diode array, wherein the connection wiring is formed by connecting two or more connection wirings formed on different layers through one or more contact holes.

The contact holes are formed at both ends of the two or more connection wirings.

One of the two or more connection wirings completely overlaps with the remaining connection wirings.

In the organic light emitting diode display device of the present invention as described above, the circuit block of the gate driver is connected to the gate wiring of the display region through a plurality of connection wirings, or through the connection wiring having at least one hole penetrating the connection wiring, By connecting to the gate wiring, even if some connection wirings are disconnected, signals are transmitted through the unconnected connection wirings, so that the thin film transistors can operate normally.

1A is a plan view of a general organic light emitting diode display device.
1B is an enlarged view of region A of FIG. 1A.
2A is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention.
FIG. 2B is a cross-sectional view of the organic light emitting diode array formed in the display region of FIG. 2A.
2C is an enlarged view of the area B in FIG. 2A.
Figures 2d and 2e are plan views according to another embodiment of Figure 2a.
3A and 3B are plan views of an organic light emitting diode display device according to a second embodiment of the present invention.
4A to 4E are plan views of an organic light emitting diode display device according to a third embodiment of the present invention.
5A to 5D are plan views of an organic light emitting diode display according to a fourth embodiment of the present invention.
6A and 6B are plan views of an OLED display according to a fifth embodiment of the present invention.
7A is a plan view of an organic light emitting diode display device according to a sixth embodiment of the present invention.
7B is a cross-sectional view taken along line I-I 'of FIG. 7A.
Figs. 7C to 7E are plan views according to another embodiment of Fig. 7A.
8A is a plan view of an OLED display according to a seventh embodiment of the present invention.
8B is a cross-sectional view taken along line II-II 'in FIG. 8A.
8C-8E are plan views in accordance with another embodiment of FIG. 8A.
9A is a plan view of an organic light emitting diode display device according to an eighth embodiment of the present invention.
9B is a cross-sectional view taken along line III-III 'of FIG. 9A.
9C-9E are plan views in accordance with another embodiment of FIG. 9A.

Hereinafter, the organic light emitting diode display device of the present invention will be described in detail with reference to the accompanying drawings.

* First Embodiment *

2A is a plan view of an organic light emitting diode display device according to a first embodiment of the present invention. FIG. 2B is a cross-sectional view of the organic light emitting diode array formed in the display region of FIG. 2A, and FIG. 2C is an enlarged view of the region B of FIG. 2A. 2D and 2E are plan views according to another embodiment of FIG. 2A.

2A, an organic light emitting diode display device according to a first embodiment of the present invention includes a substrate 100 having a display region 100A and a non-display region, an organic light emitting diode 100B formed on a display region 100A of the substrate 100, A gate driver 130 including a plurality of circuit blocks 130A formed in a gate in panel (GIP) manner in a non-display area of the substrate 100, and each circuit block (not shown) 130A and the display area 100A. At this time, two or more connection wirings 140 connected in parallel are connected to one circuit block 130A, and both ends of the two or more connection wirings 140 are connected through the horizontal connection portion 140a.

Specifically, as shown in FIG. 2B, the organic light emitting diode array includes an organic light emitting diode connected to a thin film transistor (TFT) and a thin film transistor (TFT). The substrate 100 may be formed of a material selected from the group consisting of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyethylene ether phthalate, polycarbonate, polyarylate, A polyether imide, a polyether sulfonate, a polyimide, a polyacrylate, and the like. The plastic substrate is a plastic substrate made of at least one organic material selected from the group consisting of polyimide, polyether imide, polyether sulfonate, polyimide, and polyacrylate.

The thin film transistor TFT is formed for every sub pixel region defined by intersecting gate wirings (not shown) and data wirings (not shown). The thin film transistor includes a gate electrode 105, a gate insulating film 110, a semiconductor layer 115, a source electrode 120a and a drain electrode 120b. At this time, the gate electrode 105 protrudes from the gate wiring (not shown) or is defined as a part of the gate wiring (not shown), and the source electrode 120a protrudes from the data wiring (not shown). The drain electrode 120b is spaced apart from the source electrode 120a by a predetermined distance to expose a part of the semiconductor layer 115. [

A protective film 150 is formed to cover the thin film transistor (TFT). An organic light emitting diode including a first electrode 155, an organic light emitting layer 160, and a second electrode 170 sequentially stacked on the passivation layer 150 is formed.

The first electrode 155 of the organic light emitting diode is connected to the exposed drain electrode 120b by selectively removing the protective film 150. [ A bank insulating layer 160 is formed on the passivation layer 150 to expose a portion of the first electrode 155. The bank insulating layer 160 defines a light emitting region of the organic light emitting diode, . The organic light emitting layer 165 is formed on the exposed first electrode 155 and the second electrode 170 is formed to cover the organic light emitting layer 165.

In the organic light emitting diode, when a voltage is applied to the first and second electrodes 155 and 170, holes and electrons recombine in the organic light emitting layer 165 to form an exciton, and the exciton falls to a ground state And emits light.

The gate driver 130 formed in the non-display region of the substrate 100 includes a plurality of circuit blocks 130A. Although not shown, each circuit block 130A includes a plurality of switching elements, capacitors, and the like. The circuit block 130A generates a scan signal for driving the thin film transistor connected through the connection wiring 140 according to a gate control signal from a timing controller (not shown), and supplies the generated scan signal to the display region (Not shown) of the gate electrode 100A.

However, as described above, in a general organic light emitting diode display device, the circuit block of the gate driver is connected to the gate wiring of the display region through one connection wiring, so that the connection wiring is disconnected when the substrate is bent or bent. Accordingly, normal driving of the thin film transistor connected to the connection wiring becomes impossible, and reliability of the organic light emitting diode display device is lowered.

Accordingly, in the organic light emitting diode display device according to the first embodiment of the present invention, as shown in FIG. 2C, two or more connection wirings 140 connected in parallel to one circuit block 130A are connected. In the drawing, three connection wirings 140 are shown connected in parallel, and a plurality of connection wirings 140 are provided in the same layer. The connection wiring 140 is formed in the same layer as the gate wiring or the data wiring of the organic light emitting diode array.

Both ends of the plurality of connection wirings 140 may be connected through the horizontal connection portion 140a and connected to each other only at both ends or may be further connected through one or more vertical connection portions 140b as shown in FIG. 2d and FIG. 2e. 2D, the plurality of connection wirings 140 may be connected at a time through one vertical connection part 140b or the vertical connection part 140b may be irregularly connected to the plurality of connection wirings 140 as shown in FIG. 2E, Can be connected to each other. In particular, the plurality of connection wirings 140, the horizontal connection portions 140a, and the vertical connection portions 140b are all formed of the same material in the same layer.

Therefore, even if a part of the plurality of connection wirings 140 is disconnected due to an external impact and warping of the substrate 100, the plurality of connection wirings 140 are connected to each other like a network Therefore, the sub-pixels in the display area connected to each circuit block 130A are normally driven.

* Second Embodiment *

3A and 3B are plan views of an organic light emitting diode display device according to a second embodiment of the present invention.

3A, in the organic light emitting diode display device according to the second embodiment of the present invention, the connection wiring 240 connecting each circuit block 130A and the display area 100A is connected to the connection wiring 240 The holes 240H are formed. The connection wiring 240 is formed on the same layer as the gate wiring or the data wiring of the organic light emitting diode array.

The at least one hole 240H may have a circular shape having the same size as each other or a circular shape having a different size as shown in Fig. 3B. At this time, the holes 240H may be regularly or irregularly arranged. Also, though not shown, the hole 240H may be an elliptical shape.

* Third Embodiment *

4A to 4E are plan views of an organic light emitting diode display device according to a third embodiment of the present invention.

4A to 4E, the organic light emitting diode display device according to the third embodiment of the present invention includes a hole 340H formed in a connection wiring 340 connecting each circuit block 130A and a display region 100A, It is a triangular shape. At this time, the holes 340H are arranged regularly or irregularly, and the sizes of the holes 340H are equal to or different from each other.

* Fourth Embodiment *

5A to 5D are plan views of an organic light emitting diode display according to a fourth embodiment of the present invention.

5A to 5C, the organic light emitting diode display device according to the fourth embodiment of the present invention includes a hole 440H formed in a connection wiring 440 connecting each circuit block 130A and the display area 100A, It is a rectangular shape. At this time, the holes 440H are arranged regularly or irregularly, and the sizes of the holes 440H are equal to or different from each other. In particular, as shown in FIG. 5D, the rectangular hole 440H may have a slanted structure, that is, a rhombus shape.

* Fifth Embodiment *

6A and 6B are plan views of an OLED display according to a fifth embodiment of the present invention.

6A and 6B, in the organic light emitting diode display device according to the fifth embodiment of the present invention, the hole 540H formed in the connection wiring 540 connecting each circuit block 130A and the display area 100A is a hexagon . At this time, the holes 540H are arranged regularly or irregularly, and the sizes of the holes 540H are equal to or different from each other.

The organic light emitting diode display according to the second to fifth embodiments of the present invention includes the connection wiring 240, 340, 440, 540 formed to penetrate the connection wiring 240, 340, 440, 540 And at least one hole 240H, 340H, 440H, and 540H. Holes 240H, 340H, 440H, and 540H are formed in a polygonal shape such as a circle, an ellipse, a triangle, 340H, 440H, and 540H may be formed on one surface of the substrate 400. One or more holes 240H, 340H, 440H, and 540H having different sizes and shapes may be formed for the connection wirings 240, 340, 440, At this time, the holes 240H, 340H, 440H, and 540H prevent the connection wirings 240, 340, 440, and 540 from being completely disconnected so that the signal of the circuit block 130A passes through the non- 110A.

* Sixth Embodiment *

FIG. 7A is a plan view of an OLED display according to a sixth embodiment of the present invention, and FIG. 7B is a cross-sectional view taken along the line I-I 'of FIG. 7A. 7C to 7E are plan views according to another embodiment of FIG. 7A. FIG.

7A and 7B, the organic light emitting diode display device according to the sixth embodiment of the present invention includes a circuit block 130A and connection wirings 640a and 640b for connecting the organic light emitting diode array of the display area 100A, And at least two connection wirings 640a and 640b formed in different layers are connected to each other through one or more contact holes 640H. The connection wirings 640a and 640b are formed of two or more connection wirings 640a and 640b formed on different layers.

In detail, the first and second connection wirings 640a and 640b are connected to each other, and two contact holes 640H are formed. The first and second connection wirings 640a and 640b are formed of the same layer and the same material as the gate wirings and the data wirings and the first and second connection wirings 640a and 640b are formed of the same material as the gate wirings and the data wirings, As shown in FIG.

As shown in FIG. 7C, the contact hole 640H can be formed not only at both ends of the second connection wiring 640b but also at the center of the second connection wiring 640b. 7D and 7E, the second connection wiring 640b overlaps only the first connection wiring 640a, or the second connection wiring 640b may overlap the first connection wiring 640a, as shown in FIGS. 7A and 7C, Can be completely overlapped with the first connection wiring 640a.

The organic light emitting diode display device according to the sixth embodiment of the present invention is characterized in that when the second connection wiring 640b is disconnected, the scan signal of the circuit block 130A is applied to the display area 100A through the first connection wiring 640a ). Similarly, when the first connection wiring 640a is disconnected, the scan signal of the circuit block 130A can be supplied to the display area 100A through the second connection wiring 640b.

* Seventh Embodiment *

8A is a plan view of an OLED display according to a seventh embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along line II-II 'of FIG. 8A. 8C to 8E are plan views according to another embodiment of FIG. 8A.

8A and 8B, the organic light emitting diode display according to the seventh embodiment of the present invention includes two first connection wirings 840a connected in parallel on the same layer with a second connection (not shown) formed on the gate insulating layer 110, And are connected to each other through the wiring 840b. At this time, the first connection wiring 840a is formed on the same layer as the gate wiring, the second connection wiring 840b is formed on the same layer as the data wiring, and the second connection wirings 840a and 840b are formed on the gate insulation film 110 are selectively removed through a contact hole 840H.

That is, the second connection wiring 840b has the same function as the vertical connection part 140a (see FIGS. 2d and 2e) disclosed in the organic light emitting diode display device according to the first embodiment of the present invention.

Further, the first and second connection wirings 840a and 840b of the organic light emitting diode display device according to the seventh embodiment of the present invention may be formed in the same structure as the connection wirings according to the first to sixth embodiments have. 8C and 8D, even when three first connection wirings 840a are connected in parallel, the second connection wirings 840b can be selectively connected to the first connection wirings 840a. As shown in FIG. 8E, not only the second connection wiring 840b but also the first connection wiring 840a connected in parallel may be connected to each other.

 In particular, the second connection wiring 840b may be formed in the same layer as the gate wiring, and the first connection wiring 840a may be formed in the same layer as the data wiring.

* Eighth Embodiment *

FIG. 9A is a plan view of an organic light emitting diode display according to an eighth embodiment of the present invention, and FIG. 9B is a cross-sectional view taken along line III-III 'of FIG. 9A. 9C to 9E are plan views according to another embodiment of FIG. 9A.

9A, the organic light emitting diode display according to the eighth exemplary embodiment of the present invention includes first, second, and third connection wirings 940a, 940b, and 940c formed on different layers, two contact holes 940H, Respectively.

Specifically, the first and second connection wirings 940a and 940b are formed of the same layer and the same material as the gate wiring and the data wiring, respectively. The third connection wiring 940c may be formed of the same layer or the same material as the first electrode 135 (see FIG. 2B) of the organic light emitting diode, or may be formed by further depositing a material such as a gate wiring and a data wiring, The wiring 940c may be formed. The contact hole 940H is formed by selectively removing the gate insulating film 110 (see FIG. 2B) and the protective film 150 (see FIG. 2B).

Only one contact hole 940H may be formed or may be formed at both ends of the third connection wiring 940c, as shown in the figure. Although not shown, it can be formed at both ends and the middle of the third connection wiring 940b. As shown in FIG. 9A, the third connection wiring 940c may be integrally formed to cover the two contact holes 940H, or may be formed as a separate structure as shown in FIG. 9C. 9D and 9E, the first connection wiring 940a may be formed to have at least one hole, and the shape of the hole may be a polygonal shape such as a circle, an ellipse, a triangle, a square, or the like.

The first, second, and third connection wirings 940a, 940b, and 940c of the organic light emitting diode display device according to the eighth embodiment of the present invention are also similar to the connection wirings according to the first to sixth embodiments Structure.

Further, although not shown, when two or more connecting wirings are provided in different layers as in the sixth to eighth embodiments of the present invention, the connecting wirings formed in different layers may be formed of the same material or formed of different materials do.

In the organic light emitting diode display device of the present invention as described above, the circuit block of the gate driver is connected to the gate wiring of the display region through a plurality of connection wirings, or through the connection wiring having at least one hole penetrating the connection wiring, By connecting to the gate wiring, even if some connection wirings are disconnected, signals are transmitted through the unconnected connection wirings, so that the thin film transistors can operate normally.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. Will be clear to those who have knowledge of.

100: substrate 100A: display area
105: gate electrode 110: gate insulating film
115: semiconductor layer 120a: source electrode
120b: drain electrode 130: gate driver
130A: circuit block
140, 240, 340, 440, 540, 640, 740, 840, 940:
140a: Horizontal connection part 140b: Vertical connection part
150: Protective layer 155: First electrode
160: bank insulating film 165: organic light emitting layer
170: second electrode 240H, 340H, 440H, 540H: hole
640a, 740a, 840a, 940a: first connection wiring
640b, 740b, 840b, 940b: second connection wiring
640H, 740H, 840H, 940H: Contact hole 940c: Third connection wiring

Claims (11)

A substrate including a display region and a non-display region;
An organic light emitting diode array formed in the display region of the substrate;
A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And
And a connection wiring connecting the circuit block and the organic light emitting diode array,
Wherein the connection wiring is a structure in which two or more connection wiring lines are connected in parallel and both ends of the connection wiring line are connected to the circuit block and the organic light emitting diode array through a horizontal connection portion, . The method according to claim 1,
Wherein the at least two connection wirings are further connected through at least one vertical connection. 3. The method of claim 2,
Wherein the vertical connection part connects the at least two connection wirings to each other irregularly or regularly. 3. The method of claim 2,
Wherein the connection wiring, the horizontal connection portion, and the vertical connection portion are formed of the same material in the same layer. A substrate including a display region and a non-display region;
An organic light emitting diode array formed in the display region of the substrate;
A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And
And a connection wiring connecting the circuit block and the organic light emitting diode array,
Wherein the connection wiring includes at least one hole formed to penetrate the connection wiring. 6. The method of claim 5,
Wherein the hole is formed in at least one shape selected from a circle, an ellipse, and a polygon. 6. The method of claim 5,
Wherein the at least one hole is regularly or irregularly arranged. A substrate including a display region and a non-display region;
An organic light emitting diode array formed in the display region of the substrate;
A gate driver formed in the non-display area of the substrate, the gate driver including a plurality of circuit blocks; And
And a connection wiring connecting the circuit block and the organic light emitting diode array,
Wherein the connection wirings are connected to each other via at least one contact hole. 9. The method of claim 8,
And the contact holes are formed at both ends of the two or more connection wirings. 9. The method of claim 8,
And one of the connection wirings of the two or more connection wirings is completely overlapped with the remaining connection wirings. 9. The method of claim 8,
Wherein the connection wiring is a connection wiring according to any one of the first to seventh aspects.

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