KR20140093803A - Apparatus for supplying organometallic compound - Google Patents

Abstract

The present invention relates to an apparatus for supplying organometallic compound to generate and feed carrier gas that contains the organometallic compound having stable concentration and vapor pressure by supplying the carrier gas into a container having the organometallic compound of solid phase at the normal temperature. The apparatus for supplying organometallic compound according to the present invention includes a container, a cover and a plurality of partitions. The container is formed at an upper portion thereof with an opening part and has a filling space to contain the organometallic compound of solid phase. The cover covers the opening part of the container and is formed with an inlet port to feed carrier gas into the container and an outlet port to exhaust the carrier gas that contains the organometallic compound to the outside of the container. The partitions are vertically installed inside the filling space defined by the container and the cover. Since gas paths are oppositely formed at upper and lower portions of adjacent partitions, the carrier gas fed into the inlet port moves up and down along the partitions through the gas path and makes contact with the organometallic compound of solid phase filled between the partitions.

Description

[0001] Apparatus for supplying organometallic compound [0002]

The present invention relates to an apparatus for supplying an organometallic compound, and more particularly, to a method for producing a carrier gas containing an organometallic compound having a stable concentration and a vapor pressure by supplying a carrier gas into a charging container containing an organometallic compound which is solid at room temperature To an organometallic compound supply device for supplying the organometallic compound.

Organometallic compounds are used as raw materials in the epitaxial growth of compound semiconductors. Organometallic compounds are often used in metal organic vapor phase epitaxy (MOCVD), which is superior in mass productivity and controllability.

The organometallic compound supply device for supplying the organometallic compound includes a charging container filled with the organometallic compound and generates a carrier gas containing the sublimed organometallic compound by supplying the carrier gas to the charging container containing the organometallic compound And supplied to a vapor growth apparatus or the like. That is, the organometallic compound is charged into a filling container, and a carrier gas is flowed into the filling container. Then, the organometallic compound in contact with the carrier gas is introduced into the carrier gas as vapor, is taken out of the filling container along with the carrier gas, do.

As the filling container of the organometallic compound supply device, a cylindrical container made of stainless steel is generally used, and in order to improve the thermal efficiency, the controllability of the concentration of the organometallic compound in the carrier gas, the utilization rate, etc., the structure of the bottom of the filling container, A filling container having various characteristics is known. In addition, as a charging container, a larger charging container is used from the viewpoint of productivity improvement.

On the other hand, when the solid organometallic compound is directly charged at room temperature, such as trimethly indium (TMI), the organometallic compound in direct contact with the carrier gas is preferred over the other organometallic compounds I.e., into the carrier gas.

That is, since the solid organometallic compound has poor fluidity, once the partial consumption is started, the consumption of the portion is continuously promoted, and a flow path through which the carrier gas flows is formed. When such a flow path is formed, the contact area between the carrier gas and the organometallic compound decreases, the concentration of the organic metal compound in the carrier gas derived from the filling container gradually decreases, and the vapor pressure also drops. As a result, it is impossible to stably supply the organometallic compound to the reaction furnace of the vapor phase growth apparatus.

Since the use of the organometallic compound is normally stopped when the concentration of the organometallic compound in the carrier gas is lowered, the solid organometallic compound that has not been consumed remains in the charging vessel.

Therefore, when the solid organometallic compound is directly charged at room temperature, the carrier gas containing the organometallic compound in a stable concentration can not be obtained over a long period of time, and the organometallic compound is not efficiently used.

If the utilization rate of the solid organometallic compound remaining in the filling container is low, the productivity is lowered, which is not preferable.

For this reason, it is possible to supply the carrier gas containing the solid organometallic compound charged in the charging container at a stable concentration, and to use the organic metal compound efficiently, the carrier gas It is necessary to take countermeasures to flow uniformly.

Accordingly, an object of the present invention is to provide an organometallic compound supply device capable of supplying and supplying a carrier gas containing an organometallic compound having a stable concentration and a vapor pressure by supplying a carrier gas into a charging container containing a solid organometallic compound at room temperature I have to.

It is another object of the present invention to provide an organometallic compound supplying device capable of generating and supplying a carrier gas containing an organometallic compound having a stable concentration and a vapor pressure by sufficiently contacting an organometallic compound which is solid in a charging container and a carrier gas There is.

In order to achieve the above object, the present invention provides an organometallic compound supply apparatus including a container, a cover, and a plurality of partitions. The container is provided with an opening at the top thereof and has a filling space through which the solid organometallic compound can be filled. The lid covers an opening of the container and has a supply port for supplying a carrier gas into the container and an outlet for discharging a carrier gas contained in the container outside the container. The plurality of partition walls are vertically installed in a filling space formed by the container and the cover. And a gas passage formed on the opposite side of the barrier ribs adjacent to each other so that the carrier gas supplied to the supply port moves up and down on the plurality of barrier ribs through the gas passage, Lt; / RTI >

In the apparatus for supplying an organometallic compound according to the present invention, the plurality of partition walls may have a tubular shape, and may be interposed between the container and the cover in such a form that the size decreases from the inner wall to the center of the container.

In the apparatus for supplying an organometallic compound according to the present invention, the supply port of the cover may be formed to penetrate the cover so as to be positioned between the inner wall of the container and the outermost partition. The discharge port of the lid may be formed to penetrate the lid so as to be connected to the inside of the central partition wall positioned at the center of the plurality of partition walls.

In the apparatus for supplying an organometallic compound according to the present invention, the plurality of partitions are three or more, the gas passages are formed in the lower part of the odd-numbered partitions from the inner wall of the container, Can be formed.

In the apparatus for supplying an organometallic compound according to the present invention,

The odd-numbered partition walls may have a top fixed to the bottom surface of the cover, and a bottom end spaced from the bottom surface of the container to form a first gas passage. The even-numbered partition walls may have a lower end fixed to the bottom surface of the container and an upper end spaced apart from the lower surface of the cover to form a second gas passage.

In the apparatus for supplying an organometallic compound according to the present invention, both ends of the plurality of partitions are fixed to a lower surface of the lid and a bottom surface of the container, and the odd-numbered partitions penetrate the partitions at the lower end, 1 gas passages are formed in the upper portion of the partition wall, and a plurality of second gas passages may be formed in the upper portion through the partition walls.

In the apparatus for supplying an organometallic compound according to the present invention, the odd-numbered partition walls and the first and second gas passages formed on the even-numbered partition walls may be formed on opposite sides.

In the apparatus for supplying an organometallic compound according to the present invention, the first gas passage may be located on the opposite side of the side where the supply port is located, and the second gas passage may be located on the side where the supply port is located.

In the apparatus for supplying an organometallic compound according to the present invention, the container has a cylindrical shape with an open top, and the plurality of partition walls may have the shape of a circular tube.

In the apparatus for supplying an organometallic compound according to the present invention, the center partition wall positioned at the center among the plurality of partition walls is empty without filling the solid organometallic compound.

The apparatus for supplying an organometallic compound according to the present invention may further include a filter for selectively discharging only a carrier gas containing an organic metal compound between the partition walls adjacent to the central partition wall and the central partition wall into the central partition wall.

In the apparatus for supplying an organometallic compound according to the present invention, the filter may be disposed at a position where the first gas passage of the central partition wall is formed.

In the apparatus for supplying an organometallic compound according to the present invention, the filter may be one of a mesh filter having a pore size of 5 mm or less or a porous filter.

In the apparatus for supplying an organometallic compound according to the present invention, the container has a cylindrical shape with an open top, and the plurality of partition walls may have the shape of a circular tube.

In the organometallic compound supply apparatus according to the present invention, the container and the cover may be integrally formed.

In the apparatus for supplying an organometallic compound according to the present invention, the lid may be provided with a plurality of filling ports capable of filling solid organic metal compounds in the space between the container and the plurality of partition walls.

The organometallic compound supply device according to the present invention is installed on the inner wall of the vessel or on the part of the vessel which is in contact with the bottom surface of the vessel on both sides of the first gas passage, And an inclined wall formed at a position where the bottom surface of the container meets the inner wall or the lower end of the partition wall located on both sides of the container.

Since the organometallic compound supplying apparatus according to the present invention induces the solid organometallic compound filled between the plurality of partition walls provided in the vertical direction in the vessel to sufficiently contact with the carrier gas moving up and down along the multiple partition walls, A carrier gas containing an organometallic compound having a stable concentration and a vapor pressure can be generated and provided.

That is, since the partition wall provided in the vessel is used to sufficiently secure the movement distance of the carrier gas in the vessel, and the contact time between the carrier gas and the solid organic metal compound can be sufficiently secured, stable concentration and vapor pressure Can be produced and provided.

1 is a perspective view showing an apparatus for supplying an organometallic compound according to a first embodiment of the present invention.
2 is a cross-sectional view showing the organometallic compound supply apparatus of FIG.
3 is a plan view showing an apparatus for supplying an organometallic compound according to a second embodiment of the present invention.
4 is a cross-sectional view showing the organometallic compound supply apparatus of FIG.
5 is a plan view showing an apparatus for supplying an organometallic compound according to a third embodiment of the present invention.
6 is a cross-sectional view showing the organometallic compound supply apparatus of FIG.

In the following description, only parts necessary for understanding the embodiments of the present invention will be described, and the description of other parts will be omitted so as not to obscure the gist of the present invention.

The terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary meanings and the inventor is not limited to the meaning of the terms in order to describe his invention in the best way. It should be interpreted as meaning and concept consistent with the technical idea of the present invention. Therefore, the embodiments described in the present specification and the configurations shown in the drawings are merely preferred embodiments of the present invention, and are not intended to represent all of the technical ideas of the present invention, so that various equivalents And variations are possible.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

1 is a perspective view showing an apparatus for supplying an organometallic compound according to a first embodiment of the present invention. 2 is a cross-sectional view showing the organometallic compound supply apparatus of FIG.

1 and 2, an apparatus 100 for supplying an organometallic compound according to the first embodiment includes a vessel 10, a lid 20, and a plurality of partitions 30. The container 10 is provided with an opening 11 at its upper portion and has a filling space 17 in which a solid organometallic compound can be filled. The lid 20 covers the opening portion 11 of the container 10 and includes a supply port 21 through which the carrier gas 60 is supplied into the container 10 and a supply port 21 through which the organic metal compound A discharge port 23 for discharging the carrier gas 70 (hereinafter referred to as "mixed gas") is formed. The plurality of partition walls 30 are installed vertically in the filling space 17 formed by the vessel 10 and the lid 20. [ The carrier gas 60 supplied to the supply port 21 is supplied through the gas passages 35 and 37 to the plurality of the partition walls 30 through the gas passages 35 and 37, And moves up and down on the barrier ribs 30 to contact the solid organometallic compound filled between the plurality of barrier ribs 30 to generate the mixed gas 70. The organometallic compound supplying apparatus 100 according to the first embodiment may further include a filter 80 for selectively discharging only the mixed gas 70 generated while passing through the plurality of partitions 30 through the discharge port 23 .

As described above, the organometallic compound supply apparatus 100 according to the first embodiment is characterized in that the solid organometallic compound filled between the plurality of partition walls 30 provided in the vertical direction in the vessel 10 is arranged along the plurality of partition walls 30 It is possible to generate and supply the mixed gas 70 containing the organometallic compound having a stable concentration and the vapor pressure because it is sufficiently brought into contact with the carrier gas 60 moving up and down.

That is, the partition wall 30 provided in the vessel 10 is used to sufficiently secure the movement distance of the carrier gas 60 in the vessel 10, and the carrier gas 60 and the solid organic metal compound A sufficient contact time can be ensured. Therefore, a mixed gas 70 containing an organometallic compound having a stable concentration and a vapor pressure can be generated and provided.

The constitution of the organometallic compound supply apparatus 100 according to the first embodiment will be described in detail as follows.

The container 10 is in the form of a cylinder with an opening 11 at the top and with a bottom surface 15 and the filling space 17 inside the container 10 is filled with a solid organometallic compound. As will be described later, at least one partition 30 is provided on the bottom surface 15 of the vessel 10. As the material of the container 10, stainless steel may be used.

The container 10 may be integrally formed or a bottom portion having a bottom portion 15 and a tube portion having an inner wall 13 may be separately manufactured and then joined to each other by welding or the like. At this time,

The solid organometallic compound to be filled in the vessel 10 may include an indium compound, a zinc compound, an aluminum compound, a gallium compound or a magnesium compound. The indium compound includes, but is not limited to, trimethyl indium, dimethyl chloro indium, cyclopentadienyl indium, trimethyl indium trimethyl arsine adduct, trimethyl indium trimethylphosphine adduct, and the like. The zinc compound includes, but is not limited to, ethyl zinc iodide, ethyl cyclopentadienyl zinc, cyclopentadienyl zinc, and the like. The aluminum compound includes methyldichloroaluminum, but is not limited thereto. The gallium compound includes, but is not limited to, methyl dichlorogallium, dimethyl chlorogallium, dimethyl bromogallium and the like. The magnesium compound includes biscyclopentadienyl magnesium, but is not limited thereto.

The solid organometallic compound to be charged into the vessel 10 is charged into the space between the partitions 30 provided inside the vessel 10.

The lid 20 covers the opening 11 of the container 10 and is coupled to the container 10 via the fastening bolt 25. The supply port (21) and the discharge port (23) are formed through the cover (20). A supply pipe (40) for supplying a carrier gas (60) is connected to the supply port (21). A discharge pipe 50 for discharging a mixed gas 70 containing an organometallic compound to the outside of the vessel 10 is connected to the discharge pipe 50. As will be described later, a plurality of partition walls 30 are provided on the lower surface 27 of the lid 20. FIG. As the material of the lid 20, stainless steel may be used.

The plurality of partitions 30 serve to lengthen the travel distance of the carrier gas 60 in the vessel 10 and ultimately to lengthen the contact time of the solid organic metal compound in the vessel 10. The plurality of partition walls 30 have a tubular shape and are inserted between the container 10 and the lid 20 in such a manner that the size decreases from the inner wall 13 of the container 10 toward the center. For example, when the vessel 10 has the form of a cylinder, the plurality of partitions 30 may have the form of a circular tube.

At this time, the supply port 21 is formed through the lid 20 so as to be positioned between the inner wall 13 of the container 10 and the outermost partition 30. The discharge port 23 of the lid 20 is formed through the lid 20 so as to be located inside the partition 30 located at the center of the plurality of the partition 30. [ That is, the discharge port 23 is formed to penetrate through the lid 20 so as to be connected to the inside of the partition 30 located at the center.

The plurality of partition walls 30 are three or more. The plurality of partitions 30 may be installed at a predetermined interval from the center of the vessel 10. The odd numbered partition walls 31 and 33 from the inner wall 13 of the vessel 10 are provided with a first gas passage 35 at the bottom and the even gas partition walls 32 are provided with the second gas passage 37 Is formed. The odd numbered partition walls 31 and 33 are fixed to the lower surface 27 of the lid 20 and the lower end is spaced apart from the bottom surface 15 of the vessel 10 to form the first gas passage 35 do. The even-numbered partition walls 32 are fixed to the bottom surface 15 of the vessel 10 at the lower end and the upper end is separated from the lower surface 27 of the lid 20 to form the second gas passage 37.

At this time, the partition wall 30 located at the center among the plurality of barrier ribs 30 is empty without filling the solid organometallic compound.

The filter 80 selectively discharges only a carrier gas containing an organic metal compound into a partition wall positioned at the center between the partition 30 adjacent to the partition 30 located at the center and the partition 30 located at the center. . Since the partition 30 located at the center is the odd-numbered partition, the first gas passage 35 is formed at the lower portion. The filter 80 is disposed at a position where the first gas passage 35 of the partition located at the center is formed. At this time, a metal mesh filter having a void of 5 mm or less may be used as the filter 80, or a porous filter may be used.

When an odd number of barrier ribs 30 are provided in the vessel 10, the carrier gas 60 may be supplied as follows to generate the mixed gas 70. The supply port 21 is positioned between the inner wall 13 of the container 10 and the first partition 31 located at the outermost position as described above so that the bottom of the container 10 (15). The carrier gas 60 moves with the sublimed organometallic compound while moving. The first gas passage 35 is formed in the lower portion of the first partition 31 so that the mixed gas 70 can move to the space between the second partition 32 and the first partition 31 located next have. The mixed gas 70 supplied through the first gas passage 35 of the first partition 31 again flows through the second partition wall 32 through the second gas passage 37 formed at the upper end of the second partition 32, And the third partition wall (33). Then, only the generated mixed gas 70 passes through the filter 80 formed on the lower portion of the (2n + 1) -th partition wall (n is a natural number) and then flows through the first gas passage 35 of the (2n + 1) 1, and the moved mixed gas 70 is discharged to the outside through the discharge port 23 of the lid 20 connected to the inside of the (2n + 1) th partition wall.

The reason for forming the plurality of partitions 30 in the vertical direction is that the carrier gas 60 supplied through the supply port 21 is sufficiently in contact with the solid organometallic compound filled between the plurality of partitions 30 The mixture gas 70 having a stable concentration and a vapor pressure through the discharge port 23 is discharged. That is, since the carrier gas 60 is in contact with the solid organometallic compound filled in the vessel 10 while moving up and down on the first and second gas passages 37 formed in the plurality of partition walls 30, The apparatus 100 for supplying an organometallic compound according to an embodiment can generate and provide a mixed gas 70 containing an organometallic compound having a stable concentration and a vapor pressure.

The apparatus 100 for supplying an organometallic compound according to the first embodiment can generate and provide a mixed gas 70 having a stable concentration and a vapor pressure as follows. In the first embodiment, the structure in which three partition walls 30 are installed in the container 10 is illustrated, but the present invention is not limited thereto.

The carrier gas 60 is supplied to the bottom surface 15 of the vessel 10 from the top of the lid 20 through the supply port 21 and between the inner wall 13 of the vessel 10 and the first partition wall 31 do. The carrier gas 60 moves toward the bottom surface 15 of the vessel 10 and comes into contact with the solid organometallic compound so that the sublimed organometallic compound is added to the moving carrier gas 60.

The mixed gas 70 generated between the inner wall 13 of the vessel 10 and the first partition wall 31 is supplied through the first gas passage 35 formed in the lower portion of the first partition wall 31, (31) and the second bank (32). The mixed gas 70 moves from the lower part of the first partition wall 31 and the second partition wall 32 toward the lower surface 27 of the lid 20 and contacts the solid organometallic compound, It is added.

The mixed gas 70 moves to the space between the second partition wall 32 and the third partition wall 33 through the second gas passage 37 formed on the upper portion of the second partition wall 32. The mixed gas 70 moves downward from the top of the second partition wall 32 and the third partition wall 33 toward the bottom surface 15 of the vessel 10 to form a sublimated organic metal The compound is added.

The mixed gas 70 positioned between the second bank 32 and the third bank 33 passes through the filter 80 formed in the lower portion of the third bank 33 and then flows through the first gas passage 35 And moves into the third partition wall 33 through the second partition wall 33. [

The mixed gas 70 moved into the third partition wall 33 is discharged to the outside of the vessel 10 through the discharge port 23 of the lid 20 connected to the inside of the third partition wall 33.

On the other hand, in the first embodiment, the example in which the plurality of partitions 30 are provided so as to be equally spaced from each other with respect to the center of the vessel 10 is described, but the present invention is not limited thereto. For example, in order to control the flow rate of the mixed gas 70 discharged to the vessel 10 and the amount of the organic metal compound contained in the mixed gas 70, It can be formed narrower or wider toward the center.

Or at least a part of the plurality of partition walls 30 may be installed in the vessel 10 such that the centers thereof are shifted from each other. For example, the centers of the odd-numbered partition walls 31 and 33 and the even-numbered partition walls 32, respectively, while the centers of the odd-numbered partition walls 31 and 33 and the even- ).

Second Embodiment

In the first embodiment, an example in which a part of the partition 30 is installed on the bottom surface 15 of the container 10 and the remaining partitions 30 is installed on the bottom surface 15 of the lid 20 It is not limited thereto. 3 and 4, the plurality of partitions 30 may be installed in any one of the bottom surface 15 of the container 10 or the bottom surface 27 of the lid 20. As shown in Fig.

3 is a plan view showing an organometallic compound supply apparatus 200 according to a second embodiment of the present invention. 4 is a cross-sectional view showing the organometallic compound supply apparatus 200 of FIG.

3 and 4, the apparatus 200 for supplying an organometallic compound according to the second embodiment includes a vessel 10, a lid 20, and a plurality of partitions 30. The apparatus 200 for supplying an organometallic compound according to the second embodiment differs from the apparatus 100 for supplying an organometallic compound according to the first embodiment in that a plurality of partition walls 30 are formed on both sides of the bottom surface (15) and the lower surface (27) of the lid (20).

Therefore, in the explanation of the organometallic compound supply apparatus 200 according to the second embodiment, the description of the parts overlapping with the description of the organometallic compound supply apparatus 100 according to the first embodiment will be omitted, A description will be given with reference to the partition 30 of FIG.

The lower ends of the plurality of partition walls (30) are fixed to the bottom surface (15) of the vessel (10). The upper ends of the plurality of partition walls 30 are installed in close contact with the lower surface 27 of the lid 20 covering the opening portion 11 of the container 10. [

Of course, the first and second gas passages 37 are formed in the plurality of barrier ribs 30. That is, the odd-numbered barrier ribs 31 and 33 are formed at the lower end thereof with a plurality of first gas passages 35 passing through the barrier ribs 31 and 33. The even-numbered partition walls 32 are formed with a plurality of second gas passages 37 through the partition walls 32 at the upper end.

The first gas passage 35 is formed to penetrate the odd-numbered partition walls 31 and 33 including the lower end thereof. That is, the first gas passage 35 is formed to be connected to the bottom surface 15 of the vessel 10. The reason for this is that the mixed gas 70 can smoothly move through the first gas passage 35.

And the second gas passage 37 penetrates the lower part rather than the upper end of the even-numbered partition wall 32. [ Or the second gas passage 37 may be formed through the partition wall 32 such that the even-numbered partition wall 32 includes the upper end as in the first gas passage 35.

At this time, the first and second gas passages 35 and 37 may be uniformly formed around the plurality of barrier ribs 30, but the first and second gas passages 35 and 37 may be uniformly formed around the barrier ribs 30 so that the carrier gas 60 can sufficiently contact the solid organometallic compound. 1 and the second gas passages 35, 37 may be formed on opposite sides of each other. The first gas passage 35 is located on the opposite side to the position of the supply port 21 and the second gas passage 37 is located on the side where the supply port 21 is located.

As described above, the organometallic compound supply apparatus 200 according to the second embodiment is also applicable to the organometallic compound supply apparatus 200 according to the second embodiment in which the solid organometallic compound filled between the plurality of partition walls 30, It is possible to generate and supply a mixed gas 70 containing an organometallic compound having a stable concentration and a vapor pressure because it is sufficiently brought into contact with the carrier gas 60 moving upward and downward along the partition 30 of the partition wall 30 .

Third Embodiment

On the other hand, in the first and second embodiments, the example in which the container 10 and the lid 20 are coupled through the fastening bolt 25 has been described, but is not limited thereto. For example, as shown in Figs. 5 and 6, the container 10 and the lid 20 can be integrally formed through welding or the like.

5 is a plan view showing an apparatus for supplying an organometallic compound according to a third embodiment of the present invention. 6 is a cross-sectional view showing the organometallic compound supply apparatus of FIG.

5 and 6, the organometallic compound supply apparatus 300 according to the third embodiment includes a vessel 10, a lid 20, and a plurality of partitions 30. The organometallic compound supply apparatus 300 according to the third embodiment differs from the organometallic compound supply apparatus 200 according to the second embodiment in that the vessel 10 and the lid 20 are integrally formed, .

Therefore, in the description of the organometallic compound supply apparatus 300 according to the third embodiment, the description overlapping with the description of the organometallic compound supply apparatus 200 according to the second embodiment will be omitted, The cover 10 and the lid 20 are integrally formed.

The contact portions of the container 10 and the lid 20 can be integrally joined to each other through welding or the like. Therefore, the organometallic compound supply apparatus 300 according to the third embodiment can not open the lid 20 and fill the solid organometallic compound. Therefore, the lid 20 is provided with the supply port 21 and the discharge port 23 ), A plurality of charging ports 29 capable of charging solid organometallic compounds are formed.

A plurality of filling ports 29 are formed at the position of the lid 20 capable of filling solid organic metal compounds in the space between the vessel 10 and the plurality of partition walls 30, respectively. In this embodiment, three partition walls 30 are provided in the container 10, so that three filling ports 29 are formed in the lid 20. FIG. That is, the three charging ports 29 are provided between the inner wall 13 of the vessel 10 and the first bank 31, a first charging port 29a capable of charging a solid organometallic compound, a first bank 31, A second filling port 29b capable of filling a solid organometallic compound between the second bank 32 and the third bank 33 and a second charging port 29b capable of charging a solid organometallic compound between the second bank 32 and the third bank 33 And a third charging port 29c. The three charging ports 29a, 29b and 29c are respectively connected with three charging terminals 91, 93 and 95 through which the solid organometallic compound can be charged, through the upper surface of the lid 20.

Three partition walls 31, 32 and 33 in the shape of a tube are provided in the vessel 10 and mixed through first and second gas passages 35 and 37 formed in the three partition walls 31, The inclined wall 90 can be formed so that the mixed gas 70 can move more smoothly between the partition walls 30 when the gas 70 is moved up and down. A point where the inner wall 13 and the bottom surface 15 of the vessel 10 intersect or the plurality of the partition walls 30 and the bottom surface 15 intersect is a point where the carrier gas 60 or the mixed gas 70 moves The organic metal compound of the solid is not exhausted and may remain in the place. However, this problem can be solved by forming the inclined wall 90 there.

At this time, the inclined wall 90 is installed on the inner wall 13 or the partition 30 of the vessel 10 which is in contact with the bottom surface 15 of the vessel 10 on both sides of the first gas passage 35 And is formed at a position where the bottom surface 15 of the vessel 10 meets the inner wall 13 of the vessel 10 or the lower end of the partition 30 located on both sides of the first gas passage 35. For example, in the second embodiment, since the three partition walls 31, 32, 33 are provided in the vessel 10, the vessels 10 positioned on both sides of the first gas passage 35 of the first partition 31 The inner wall 13 and the second partition wall 32 of the container 10 and the bottom surface 15 of the container 10 meet.

Although the example in which the inclined wall 90 is formed in the organometallic compound supply apparatus according to the third embodiment is described above, the inclined wall 90 may also be formed in the organometallic compound supply apparatus according to the first or second embodiment. Of course.

It should be noted that the embodiments disclosed in the present specification and drawings are only illustrative of specific examples for the purpose of understanding, and are not intended to limit the scope of the present invention. It will be apparent to those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: container 11: opening
13: inner wall 15: bottom surface
17: Charging space 20: Cover
21: supply port 23: discharge port
25: fastening bolt 27: bottom surface
29: Charging port 30:
31: first barrier rib 32: second barrier rib
33: third partition 35: first gas passage
37: second gas passage 40: supply pipe
50: discharge pipe 60: carrier gas
70: mixed gas 80: filter
90: inclined walls 91, 93, 95:
100,200: Organometallic compound supply device

Claims (16)

A container having an opening formed on its upper portion and having a filling space in which solid organometallic compounds can be filled;
A cover for covering an opening of the container and having a supply port for supplying a carrier gas into the container and a discharge port for discharging a carrier gas contained in the organic metal compound outside the container;
A plurality of partition walls vertically extending in a filling space formed by the container and the cover, wherein neighboring partition walls are formed with gas passages vertically opposite to each other, so that the carrier gas supplied to the supply port flows through the gas passages The plurality of partitions contacting the solid organometallic compound filled between the plurality of partitions while moving up and down the partitions of the plurality of partitions;
Wherein the organometallic compound supply device comprises: The method according to claim 1,
Wherein the plurality of partition walls have a tubular shape and are inserted between the container and the cover in such a manner that the size decreases from the inner wall to the center of the container. 3. The method of claim 2,
Wherein a feed port of the lid is formed through the lid so as to be positioned between an inner wall of the container and an outermost partition,
Wherein an outlet of the lid is formed through the lid so as to be connected to the inside of a central partition wall positioned at a center of the plurality of partition walls. The plasma display panel of claim 3, wherein the plurality of barrier ribs
Wherein a gas passage is formed in a lower portion of an odd-numbered partition wall from an inner wall of the vessel, and a gas passage is formed in an upper portion of the even-numbered partition. The plasma display apparatus according to claim 4, wherein, among the plurality of barrier ribs,
The odd-numbered partition walls are fixed to the lower surface of the lid and the lower end is spaced apart from the bottom surface of the container to form a first gas passage,
Wherein the even-numbered partition walls are fixed to the bottom surface of the container, and the upper end is spaced apart from the lower surface of the cover to form a second gas passage. 5. The apparatus of claim 4, wherein both ends of the plurality of partitions are fixed to a bottom surface of the cover and a bottom surface of the container,
The odd-numbered partition walls are formed with a plurality of first gas passages through the partition walls at the lower end thereof,
Wherein the even-numbered partition walls are formed with a plurality of second gas passages through the partition at the upper end thereof. The method according to claim 6,
And the first and second gas passages formed on the odd-numbered partition walls and the even-numbered partition walls are formed on the opposite sides. 8. The method of claim 7,
Wherein the first gas passage is located on the opposite side of the side where the supply port is located, and the second gas passage is located on the side where the supply port is located. 5. The method of claim 4,
Wherein the center partition wall positioned at the center of the plurality of partition walls is empty without being filled with the solid organometallic compound. 10. The method of claim 9,
A filter for selectively discharging only a carrier gas containing an organic metal compound into the central partition between the partition walls adjacent to the central partition and the central partition;
Wherein the organic metal compound supply device further comprises: 11. The filter according to claim 10,
Wherein the first gas passage is formed at a position where the first gas passage of the central partition wall is formed. 11. The method of claim 10,
Wherein the filter is one of a mesh filter having a pore size of 5 mm or less or a porous filter. 3. The method of claim 2,
Wherein the container has a cylindrical shape with an open upper portion, and the plurality of partition walls have the shape of a circular tube. 3. The method of claim 2,
Wherein the container and the lid are integrally formed. 15. The method according to claim 14,
Wherein a plurality of charging ports capable of charging solid organometallic compounds are formed in the space between the container and the plurality of partition walls. 6. The method of claim 5,
Wherein the first and second gas passages are disposed on the inner wall or the partition wall of the container which is in contact with the bottom surface of the container on both sides of the first gas passage, An inclined wall formed at a position at which the bottom surface of the container meets;
Wherein the organic metal compound supply device further comprises:

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