KR20140088341A - Scanning micro mirror package - Google Patents

Scanning micro mirror package Download PDF

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Publication number
KR20140088341A
KR20140088341A KR1020130000123A KR20130000123A KR20140088341A KR 20140088341 A KR20140088341 A KR 20140088341A KR 1020130000123 A KR1020130000123 A KR 1020130000123A KR 20130000123 A KR20130000123 A KR 20130000123A KR 20140088341 A KR20140088341 A KR 20140088341A
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KR
South Korea
Prior art keywords
mirror
electrode array
scanning
substrate
electrode
Prior art date
Application number
KR1020130000123A
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Korean (ko)
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KR102014781B1 (en
Inventor
이병구
안재용
정문기
최동준
정치환
Original Assignee
엘지전자 주식회사
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Application filed by 엘지전자 주식회사 filed Critical 엘지전자 주식회사
Priority to KR1020130000123A priority Critical patent/KR102014781B1/en
Publication of KR20140088341A publication Critical patent/KR20140088341A/en
Application granted granted Critical
Publication of KR102014781B1 publication Critical patent/KR102014781B1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/085—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting means being moved or deformed by electromagnetic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/10—Scanning systems
    • G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors
    • G02B7/1821—Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors for rotating or oscillating mirrors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
    • H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
    • H04N1/113—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using oscillating or rotating mirrors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Electromagnetism (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
  • Micromachines (AREA)

Abstract

An embodiment of the present invention is directed to a mirror assembly comprising a mirror disposed between a pair of first elastic members facing each other in a first direction, gimbal connected to the mirror through the pair of first elastic members, A scanning micromirror including a frame connected to the gimbals through a pair of second elastic bodies; A first substrate and a second substrate disposed on upper and lower sides of the scanning micro-mirror, respectively; And a magnetic body disposed opposite to the first elastic body and the rear surface of the mirror, wherein the first electrode array and the second electrode array, which are respectively connected to the pair of second elastic bodies, And provides a micro mirror package.

Description

[0001] SCANNING MICRO MIRROR PACKAGE [0002]

An embodiment relates to a scanning micro-mirror package, and more particularly, to a magnetically driven laser scanning mirror package using MEMS technology.

In addition to the development of optical device technology, various technologies using light as an input, output, and information transmission medium of various information have been suggested. For example, a barcode scanner or a basic level scanning laser display A typical example is the technique of using a beam from a light source to scan.

In particular, recently, a system using beam scanning with a high spatial resolution has been developed. Such systems include a projection display system having high resolution and high reproducibility of primary color using laser scanning, A head mounted display (HMD), and a laser printer.

Such a beam scanning technique requires scanning mirrors having various scanning speeds, scanning ranges, angular displacements, and tilting angles according to application examples. A scanning micromirror is a device that images an image or reads data by scanning a light beam coming from a light source (light source) through a mirror in a one- or two-dimensional area.

1 is a view showing a structure and a principle of a conventional two-dimensional scanning micrometer.

As shown in the figure, the scanning micro-mirror 100 includes a mirror 10 for reflecting light, horizontal springs 21 and 22 for horizontally rotating the mirror 10, Vertical springs 41 and 42 for rotating the mirror 10 and a gimbal 30 for separating the vertical and horizontal rotations of the mirror 10 from each other.

The mirror 10 rotates in the vertical direction and the horizontal direction through the vertical springs 41 and 420 and the horizontal springs 21 and 22, thereby operating the principle of scanning the incident light to form a screen or to read data. The pair of horizontal springs 41 and 42 may be connected to and supported by an anchor (not shown), respectively, and the light reflected by the mirror 10 may be projected onto a screen, Direction, respectively.

The scanning micromirror using the electromagnetic force requires a magnetic body to drive in a manner that a current is applied to a mirror and a Lorentz driving force is generated by a magnetic field generated by an external magnetic substance.

FIG. 2 is a view showing a conventional packaging of a scanning micromirror, and FIG. 3 is a view showing the electrode arrangement of FIG.

The scanning micromirror package 200 includes a scanning micromirror 210 and a circuit board 240 such as a printed circuit board (PCB) connected to the scanning micromirror 210. The scanning micromirror package 200 includes a first substrate 220, 2 substrate 230 and a magnetic material array 250 may be disposed below the second substrate 230. [

The scanning micromirror package 200 described above can reduce the width and length of the entire package using the circuit board 220 similar to the length and breadth of the scanning micromirror 210. [

The first substrate 220 and the scanning micromirror 210 may be bonded with an adhesive or may be formed and bonded to the frame 210a of the scanning micromirror 210 as shown in FIG. .

3, the scanning micromirror 210 includes a mirror 211 for reflecting light, and a first gimbal and a second gimbal 213a connected to the mirror 211 via first springs 212a and 212b. And a frame 210a connected to the second gimbals 213b through second elastic members 214a and 214b and the electrode array 215 is disposed on one side of the frame 210a .

The above-described scanning micromirror package is composed of many parts as compared with a conventional semiconductor device, and the structure is complicated and there is a possibility of breakage in the assembling process. In addition, in the dicing process of separating the scanning micromirror devices manufactured in the wafer into individual device units, PR (photo-resisr) coating may be performed to prevent impurities from being adsorbed on the mirror surface , It may take time to remove each PR afterwards and the mirror may be broken.

Further, in the structure shown in Fig. 2, since the circuit board 240 is extended to one side of the scanning micro-mirror 210, the volume of the entire package may be increased.

The embodiment attempts to reduce the volume of the scanning micromirror package and achieve stable contact with the circuit board.

An embodiment of the present invention is directed to a mirror assembly comprising a mirror disposed between a pair of first elastic members facing each other in a first direction, gimbal connected to the mirror through the pair of first elastic members, A scanning micromirror including a frame connected to the gimbals through a pair of second elastic bodies; A first substrate and a second substrate disposed on upper and lower sides of the scanning micro-mirror, respectively; And a magnetic body disposed opposite to the first elastic body and the rear surface of the mirror, wherein the first electrode array and the second electrode array, which are respectively connected to the pair of second elastic bodies, And provides a micro mirror package.

The first electrode array and the second electrode array may be disposed facing each other with the mirror therebetween.

The first electrode array and the second electrode array may be arranged symmetrically.

A hole is formed in the second substrate, and the magnetic body may be inserted into the hole.

The scanning micromirror package may further include a first electrode pad and a second electrode pad corresponding to the first electrode array and the second electrode array and disposed on the second substrate.

At least one of the first electrode pad and the second electrode pad may be arranged in a via hole type.

The gimbals may include an inner first gimbals and an outer second gimbals.

The magnetic body and the mirror may be disposed apart from each other by a predetermined interval.

The first direction and the second direction may be perpendicular to each other.

The mirror may be rotated in the first direction and the second direction, and the rotational frequency in the first direction may be different from the rotational frequency in the second direction.

The scanning micromirror package according to the present embodiment can arrange electrode arrays on both sides of a frame in which scanning micromirrors are arranged and can be bonded to electrode pads on a lower substrate such as a circuit board, The FPCB of the present invention can be electrically connected to reduce the size of the package, and it is possible to stably integrate the devices using an ACF or a reflow method.

FIG. 1 is a view showing a structure and a principle of a conventional two-dimensional scanning micromirror,
2 is a view showing a conventional scanning micromirror packaging, and FIG.
FIG. 3 is a view showing the electrode arrangement of FIG. 2,
4 is a view illustrating an embodiment of a scanning micromirror package according to the present invention,
FIG. 5 is a view showing the electrode arrangement of FIG. 4,
6 is a view showing the electrode arrangement of the lower package of FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features and advantages of the present invention will be more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG.

In the description of the embodiment according to the present invention, in the case of being described as being formed "on or under" of each element, the upper (upper) or lower (lower) or under are all such that two elements are in direct contact with each other or one or more other elements are indirectly formed between the two elements. Also, when expressed as "on or under", it may include not only an upward direction but also a downward direction with respect to one element.

FIG. 4 is a view showing an embodiment of a scanning micromirror package according to the present invention, FIG. 5 is a view showing the electrode arrangement of FIG. 4, and FIG. 6 is a view showing the electrode arrangement of the lower package of FIG.

The scanning micromirror package 300 includes a first substrate 320 and a second substrate 330 disposed with a scanning micromirror 310 interposed therebetween and a magnetic array 350 disposed below the second substrate 330 And the electromagnetic force driving method is used.

The scanning micromirror 310 includes a mirror 311 for reflecting light and a first gimbal and second gimbal 313a and 313b connected to the mirror 311 through the first elastic members 312a and 312b, A frame 310a connected to the second gimbal 313b via the second elastic members 314a and 314b and a first electrode array 315a and a second electrode array 315b disposed on the frame 310a .

The mirror 311 can reflect light in the direction of a screen (not shown) by the action of the first and second elastic members 312a, 312b, 314a, and 314b and the magnetic body 350. The first elastic bodies 312a and 312b may include a pair of elastic bodies 312a and 312b facing each other in the first direction so as to rotate the mirror 311 in the first direction and the second elastic bodies 314a and 314b The mirror 311 can be rotated in the second direction.

In the present embodiment, the first and second elastic members 312a, 312b, 314a, and 314b may be springs, and the first direction may be a vertical direction and the second direction may be a direction perpendicular to the first direction, have. The mirror 311 can rotate in the first direction and the second direction, and the rotational frequency in the first direction and the rotational frequency in the second direction can be different from each other.

The pair of gimbals 313a and 313b are connected to the frame 370 through a pair of second elastic bodies 314a and 314b facing each other in the second direction and the pair of second elastic bodies 314a and 314b And the light reflected by the mirror 311 may be projected onto a screen and scanned in the horizontal direction and the vertical direction, respectively.

A hole is formed in the first substrate 320. The hole may be a path through which the light enters the mirror 311 and is reflected and traveled. A hole 338 is also formed in the second substrate 330, The magnetic substance 350 may be disposed in the hole 338 formed in the magnetic layer 330 and the magnetic substance 350 may be disposed apart from the mirror 311 by a predetermined distance.

The pair of electrode arrays 315a and 315b disposed on the frame 370 may be arranged symmetrically with respect to each other with the mirror 311 interposed therebetween and may include a plurality of electrodes.

A first electrode pad 335a and a second electrode pad 335b may be disposed on the second substrate 330. The first electrode pad 335a and the second electrode pad 335b may be electrically connected to the first electrode array 315a and the second electrode array 315b, respectively, The first electrode pad 335a and the second electrode pad 335b may be disposed symmetrically with respect to each other.

As shown in FIG. 6, a conductive material may be disposed on the first electrode pad 335a and the second electrode pad 335b in the form of via holes 335a 'and 335b'. In the scanning micromirror 310, The one electrode array 315a and the second electrode array 315b are electrically connected to the second substrate 330 through the via holes 335a 'and 335b' formed in the first electrode pad 335a and the second electrode pad 335b, As shown in FIG.

The number of the first electrode array 315a and the second electrode array 315b shown in FIG. 5 is different from the number of the first electrode pad 335a and the second electrode pad 335b shown in FIG. 6 However, it can be the same.

The bonding of the first substrate 320 and the scanning micromirror 310 in the scanning micromirror package 300 may be performed by using an adhesive or by using a reflow process using the first electrode array 315a and the second electrode array 315b reflow method. The second substrate 330 has the shape of a circuit board by patterning the first electrode pad 335a and the second electrode pad 335b including the via holes 335a 'and 335b' 330 may be bonded to the scanning micromirror 310 by an ACF (anisotropic conductive film) bonding or reflow method.

In addition, a flexible printed circuit board (FPCB), a metal PCB, a ceramic PCB, or the like may be connected to a lower portion of the second substrate 330, which may serve as a circuit board, through a connector or the like.

The scanning micromirror package described above can arrange electrode arrays on both sides of a frame on which the scanning micromirrors are arranged and can be bonded to electrode pads on a lower substrate such as a circuit board and via holes are formed in the electrode pads, So that the size of the package can be reduced, and stable coupling can be achieved by using the ACF or the reflow method.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood that various modifications and applications are possible. For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that all changes and modifications that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.

10, 211, 311: mirror 21, 22: first spring
30: gimbals 41, 42: second elastic body
100, 210, 310: scanning micro mirror
200, 300: scanning micro mirror package 210a, 310a: frame
212a, 212b, 312a, 312b: a first elastic body
213a, 213b, 313a and 3143: first and second gimbals
214a, 214b, 314a, 314b: a second elastic body
215: Electrode array
220, 320: first substrate 230, 330: second substrate
240: circuit board 250, 350: magnetic substance
315a, 315b: first and second electrode arrays 335a, 335b: first and second electrode pads
335a ', 335b': via hole 338: hole

Claims (10)

A mirror disposed between the pair of first elastic bodies facing each other in the first direction; a gimbal connected with the mirror through the pair of first elastic bodies; A scanning micromirror including a frame connected to the gimbals through the second elastic body;
A first substrate and a second substrate disposed on upper and lower sides of the scanning micro-mirror, respectively; And
Further comprising: a first elastic body and a magnetic body arranged to face the back surface of the mirror,
And a first electrode array and a second electrode array, which are respectively connected to the pair of second elastic bodies, are arranged on the frame. The method according to claim 1,
Wherein the first electrode array and the second electrode array are disposed facing each other with the mirror therebetween. 3. The method according to claim 1 or 2,
Wherein the first electrode array and the second electrode array are arranged symmetrically. The method according to claim 1,
Wherein a hole is formed in the second substrate, and the magnetic substance is inserted in the hole. The method according to claim 1 or 4,
And a first electrode pad and a second electrode pad corresponding to the first electrode array and the second electrode array and disposed on the second substrate. 6. The method of claim 5,
Wherein at least one of the first electrode pad and the second electrode pad is arranged in a via hole type. The method according to claim 1,
Wherein the gimbal comprises a first gimbal therein and an outer second gimbal. The method according to claim 1,
Wherein the magnetic body and the mirror are spaced apart from each other by a predetermined interval. The method according to claim 1,
Wherein the first direction and the second direction are perpendicular to each other. The method according to claim 1,
Wherein the mirror is rotatable in the first direction and the second direction, and the rotational frequency in the first direction and the rotational frequency in the second direction are different from each other.
KR1020130000123A 2013-01-02 2013-01-02 Scanning micro mirror package KR102014781B1 (en)

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KR1020130000123A KR102014781B1 (en) 2013-01-02 2013-01-02 Scanning micro mirror package

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KR20140088341A true KR20140088341A (en) 2014-07-10
KR102014781B1 KR102014781B1 (en) 2019-08-27

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170085875A (en) * 2016-01-15 2017-07-25 엘지전자 주식회사 MEMS Scanner

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002182136A (en) * 2000-12-18 2002-06-26 Olympus Optical Co Ltd Mirror oscillating body for optical deflector
JP2002321197A (en) * 2001-02-22 2002-11-05 Canon Inc Micro structural body, micromechanical sensor, microactuator, microoptical polariscope, optical scanning display and manufacruring method thereof
KR20060016637A (en) * 2004-08-18 2006-02-22 엘지전자 주식회사 Raster scanning display system
KR20060124079A (en) * 2005-05-30 2006-12-05 엘지전자 주식회사 Mems scanning micromirror and dual-axis electromagnetic mems scanning micromirror device
KR20070024141A (en) * 2005-08-26 2007-03-02 엘지전자 주식회사 Micro-mirror device and micro-mirror device array of using the same
JP2008034000A (en) * 2006-07-27 2008-02-14 Seiko Instruments Inc Head gimbal mechanism and information recording/reproducing device
KR20100102340A (en) * 2009-03-11 2010-09-24 엘지전자 주식회사 Mems package

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002182136A (en) * 2000-12-18 2002-06-26 Olympus Optical Co Ltd Mirror oscillating body for optical deflector
JP2002321197A (en) * 2001-02-22 2002-11-05 Canon Inc Micro structural body, micromechanical sensor, microactuator, microoptical polariscope, optical scanning display and manufacruring method thereof
KR20060016637A (en) * 2004-08-18 2006-02-22 엘지전자 주식회사 Raster scanning display system
KR20060124079A (en) * 2005-05-30 2006-12-05 엘지전자 주식회사 Mems scanning micromirror and dual-axis electromagnetic mems scanning micromirror device
KR20070024141A (en) * 2005-08-26 2007-03-02 엘지전자 주식회사 Micro-mirror device and micro-mirror device array of using the same
JP2008034000A (en) * 2006-07-27 2008-02-14 Seiko Instruments Inc Head gimbal mechanism and information recording/reproducing device
KR20100102340A (en) * 2009-03-11 2010-09-24 엘지전자 주식회사 Mems package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170085875A (en) * 2016-01-15 2017-07-25 엘지전자 주식회사 MEMS Scanner

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