KR20140082263A - Thermosetting Resin Composition - Google Patents

Abstract

The present invention relates to a thermosetting resin composition. More particularly, provided is a thermosetting resin composition which is very suitable for a material forming a protective film for an optical device because it is possible to produce a protective film having sufficient adhesion to a substrate, heat resistance, acid resistance and alkali resistance even in a curing process and a post-process (annealing and sputtering) at high temperatures (200 to 300°C).

Description

TECHNICAL FIELD [0001] The present invention relates to a thermosetting resin composition,

The present invention relates to a thermosetting resin composition, and more particularly, to a thermosetting resin composition suitable for forming a protective film for preventing deterioration of a substrate generated during a manufacturing process of an optical device such as a liquid crystal display device.

An optical device such as a liquid crystal display (LCD) is immersed in an organic solvent, an acid, an alkali solution or the like during the manufacturing process, or subjected to a severe treatment such as receiving a local high-temperature heating of the surface by sputtering . Therefore, there is a case where a high-temperature high-stability material is provided as a protective film in these devices in order to prevent the deterioration at the time of manufacturing.

The protective film serves to protect the colored layer and to flatten the color filter. Therefore, the protective film must be able to withstand such a severe treatment as described above, and must have excellent adhesion to the substrate or the underlayer, and it is required to have excellent heat resistance and light resistance without deterioration such as high smoothness, surface hardness, transparency, do. It is also required to have excellent chemical resistance such as solvent resistance, acid resistance and alkali resistance, and excellent water resistance.

The protective film composition is prepared in the form of a curable resin composition and satisfactorily classified into thermosetting and photocurable (photosensitive). When a pattern of a protective film is required, a photosensitive resin composition is required. Otherwise, a thermosetting resin composition is used. This is because it is convenient in the process and can increase the crosslinking density and is excellent in mechanical properties and heat resistance.

Japanese Patent Application Laid-Open Nos. 2000-103937, 2000-119472, and 2000-143772 disclose a thermosetting resin composition as a composition constituting a protective film. However, when a protective film is prepared using these compositions, the mechanical properties are not excellent, and in particular, when the post-processing is carried out at a high temperature, the adhesiveness to the substrate, heat resistance, chemical resistance,

The main object of the present invention is to provide a thermosetting resin composition having excellent mechanical properties, heat resistance and chemical resistance even in a high temperature curing step and a post-step (annealing and sputtering), and securing sufficient adhesion with a substrate.

The present invention also provides a protective film for an optical device formed of the thermosetting resin composition for improving lifetime and luminance characteristics of an optical device.

An embodiment of the present invention provides a thermosetting resin composition comprising a copolymer [A] of an unsaturated carboxylic acid or its anhydride (a1), an epoxy group-containing unsaturated compound (a2) and an adamantane group-containing unsaturated compound (a3).

In a preferred embodiment of the present invention, the copolymer [A] comprises 5 to 40% by weight of an unsaturated carboxylic acid or its anhydride (a1), 10 to 70% by weight of an epoxy group-containing unsaturated compound (a2) and an adamantane- and a3) 0.5 to 50% by weight.

In a preferred embodiment of the present invention, the copolymer [A] has a number average molecular weight of 3,000 to 100,000.

In a preferred embodiment of the present invention, the thermosetting resin composition further comprises 200 parts by weight or less of a polymerizable compound [B] having an ethylenically unsaturated bond, relative to 100 parts by weight of the copolymer [A] .

In a preferred embodiment of the present invention, the thermosetting resin composition may further comprise 1 to 50 parts by weight of a curing agent [C] containing a carboxylic acid or an anhydride thereof, based on 100 parts by weight of the copolymer [A] have.

Another embodiment of the present invention provides a protective film for an optical device formed from the thermosetting resin composition.

The thermosetting resin composition according to the present invention can form a protective film having sufficient adhesiveness with the substrate and ensuring heat resistance, acid resistance and alkali resistance even at a high temperature (200 to 300 ° C) curing step and post-processing (annealing and sputtering) It is possible to provide a thermosetting resin composition highly suitable as a protective film forming material.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise.

The present invention relates to a thermosetting resin composition comprising a copolymer [A] of an unsaturated carboxylic acid or its anhydride (a1), an epoxy group-containing unsaturated compound (a2) and an adamantane-containing unsaturated compound (a3).

Hereinafter, the present invention will be described in more detail.

The thermosetting resin composition according to the present invention comprises a copolymer obtained by introducing an adamantane group into an unsaturated carboxylic acid or its anhydride (a1) and an epoxy group-containing unsaturated compound (a2), thereby improving the crosslinking progress of the composition at a high temperature, It is possible to exhibit excellent mechanical properties, heat resistance and chemical resistance, without deteriorating adhesion with the substrate even in the post-process.

 The copolymer [A] is obtained by a conventionally known polymerization method, and the compounds (a1), (a2) and (a3) can be synthesized by radical polymerization in the presence of a solvent and a polymerization initiator.

The copolymer [A] preferably contains 5 to 40% by weight, more preferably 10 to 30% by weight, of the constituent unit derived from the compound (a1). When the content of the constituent unit is less than 5% by weight, the heat resistance, chemical resistance and surface hardness of the protective film to be produced later tend to decrease. When the content exceeds 40% by weight, the storage stability is deteriorated.

Examples of the compound (a1) include monocarboxylic acids such as acrylic acid, methacrylic acid and crotonic acid; Dicarboxylic acids such as maleic acid, fumaric acid, citraconic acid, mesaconic acid and itaconic acid; And anhydrides of these dicarboxylic acids. One of these dicarboxylic acids may be used alone, or two or more dicarboxylic acids may be used in combination. Of these, acrylic acid, methacrylic acid, maleic anhydride and the like are mainly used because they are excellent in copolymerization reactivity and heat resistance and are easily available.

The copolymer [A] preferably contains 10 to 70% by weight, more preferably 20 to 60% by weight, of the constituent unit derived from the compound (a2). When the content of the constituent unit is less than 10% by weight, heat resistance and surface hardness of a protective film produced later tends to be lowered, and when it exceeds 70% by weight, storage stability tends to decrease.

Examples of the compound (a2) include glycidyl acrylate, glycidyl methacrylate, glycidyl? -Ethyl acrylate, glycidyl? -N-propyl acrylate, glycidyl? -N-butyl acrylate, Epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl,? -Ethylacrylic acid- vinylbenzyl glycidyl ether, and p-vinyl benzyl glycidyl ether. The copolymerization reactivity and the heat resistance and hardness of the obtained protective film are evaluated by It is advantageously used in terms of increasing the amount of water.

The copolymer [A] preferably contains 0.5 to 50% by weight, more preferably 5 to 30% by weight, of the constituent unit derived from the compound (a3). When the content of the constituent unit is less than 10% by weight, storage stability tends to decrease. When the content exceeds 70% by weight, heat resistance and surface hardness of a protective film produced later tend to decrease.

Examples of the compound (a3) include 1-adamantyl methacrylate, 3-hydoxy-1-adamantyl methacrylate, 1- [2- (1-adamantyl) ethyl] adamantane {1- [2- (1-adamantyl) ethyl] adamantane}, 1- [4- (1-adamantyl) -1,3-butadinyl] Adamantyl} -1,3-butadiynyl] adamantane}, 2-methyl-2-adamantyl ester, 2-ethyl- Adamantyl esters, or a combination of two or more thereof. Among them, 1-adamantyl methacrylate and 3-hydoxy-1-adamantyl methacrylate are preferred because of their copolymerization reactivity, heat resistance and chemical resistance. .

The copolymer [A] used in the present invention has a carboxyl group and / or a carboxylic acid anhydride and an epoxy group, and can be easily cured by heating even without using a special curing agent. However, the curing agent [C] When used, the crosslinking density can be sufficiently increased.

The molecular weight of the copolymer [A] is not particularly limited, but may be appropriately selected depending on the thickness of the film to be formed, solution application conditions of the composition, application and the like. The number average molecular weight of the copolymer [A] is preferably 3,000 to 100,000, more preferably 3,000 to 50,000 in view of the surface smoothness of the protective film to be produced later.

Examples of the solvent used in the synthesis of the copolymer [A] include alcohols such as methanol and ethanol; Ethers such as tetrahydrofuran, diethylene glycol dimethyl ether and diethylene glycol diethyl ether; And propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, propylene glycol propyl ether acetate and propylene glycol butyl ether acetate, or a combination of two or more thereof.

The polymerization initiator used in the synthesis of the copolymer [A] is not particularly limited as long as it is generally known as a radical polymerization initiator. Azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis- (2,4-dimethylvaleronitrile), 2,2'-azobis- (4-methoxy- Dimethylvaleronitrile); and the like; Organic peroxides such as benzoyl peroxide, t-butyl peroxypivalate, and 1,1'-bis- (t-butylperoxy) cyclohexane; And hydrogen peroxide. When a peroxide is used as a radical polymerization initiator, the peroxide can be used as a redox type initiator together with a reducing agent.

The thermosetting resin composition according to the present invention may further comprise a polymerizable compound [B] having an ethylenic unsaturated bond in order to improve the curing density.

The polymerizable compound [B] having an ethylenically unsaturated bond is preferably a (meth) acrylate having a monofunctional, bifunctional or trifunctional or more functional (meth) acrylate because of its good polymerizability and heat resistance and surface hardness Do.

Examples of the monofunctional (meth) acrylate include 2-hydroxyethyl (meth) acrylate, carbitol (meth) acrylate, isobonyl (meth) acrylate, 3-methoxybutyl And 2- (meth) acryloyloxyethyl 2-hydroxypropyl phthalate.

Examples of the bifunctional (meth) acrylate include ethylene glycol (meth) acrylate, 1,6-hexanediol (meth) acrylate, 1,9-nonanediol (meth) acrylate, propylene glycol Tetraethylene glycol (meth) acrylate, bisphenoxy ethyl alcohol fluorene diacrylate, and the like.

Examples of the above (meth) acrylate having three or more functional groups include (meth) acrylic esters such as trishydroxyethylisocyanurate tri (meth) acrylate, trimethylpropane tri (meth) acrylate, pentaerythritol tri Tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like.

The polymerizable compound [B] may be used alone or in combination of two or more selected from monofunctional, bifunctional or trifunctional (meth) acrylates.

The polymerizable compound [B] is preferably contained in an amount of 150 parts by weight or less, preferably 120 parts by weight or less, more preferably 20 to 70 parts by weight, based on 100 parts by weight of the copolymer [A]. If the content of the polymerizable compound [B] exceeds 150 parts by weight based on 100 parts by weight of the copolymer [A], the adhesion of the obtained protective film tends to be deteriorated.

The thermosetting resin composition according to the present invention may further comprise a curing agent [C] optionally containing a carboxylic acid or its anhydride together with the above-mentioned copolymer [A], the polymerizable compound [B]

The curing agent [C] containing the carboxylic acid or its anhydride is a component causing a curing reaction with the [A] component. Examples of the carboxylic acid anhydrides include 4-methyltetrahydrophthalic anhydride, methylnadic anhydride, anhydrous pyromellitic acid, trimellitic anhydride, and phthalic anhydride, and these anhydrides may be chemically modified.

It is preferable that the curing agent [C] is 1 to 50 parts by weight, preferably 5 to 20 parts by weight based on 100 parts by weight of the copolymer [A], and its content is less than 1 part by weight based on 100 parts by weight of the copolymer [A] , It is difficult to obtain a protective film having a sufficiently high crosslinking density and various resistance of the protective film may be lowered. If more than 50 parts by weight of the copolymer [A] is used in an amount of more than 50 parts by weight, unreacted materials tend to remain in the film of the protective film to a large extent. As a result, the protective film tends to have unstable properties or poor adhesion.

The thermosetting resin composition of the present invention may further contain a surfactant, an adhesion promoter, a thermal radical polymerization initiator, an antioxidant, an ultraviolet absorber and the like as the other additives [D].

Examples of the surfactant include FC-129, FC-170C and FC-430 manufactured by 3M Company. The surfactant may be fluorine or silicon surfactant. The surfactant may be used in an amount of 5 parts by weight or less, more preferably 2 parts by weight or less, based on 100 parts by weight of the copolymer [A]. When a surfactant is used in an amount exceeding 5 parts by weight based on 100 parts by weight of the copolymer [A], there is a problem that bubbles easily occur during application.

The adhesive aid serves to improve adhesion with the substrate. As the adhesion aid, a functional silane coupling agent is preferably used. Examples thereof include trimethoxysilylbenzoic acid,? -Isocyanate propyltriethoxysilane,? -Glycidoxypropyltrimethoxysilane, and the like. It may be used in an amount of 50 parts by weight or less, more preferably 20 parts by weight or less, based on 100 parts by weight of the copolymer [A]. The amount of the adhesive agent used is more than 50 parts by weight per 100 parts by weight of the copolymer [A] The heat resistance tends to deteriorate.

On the other hand, the thermal radical polymerization initiator can be used for accelerating the crosslinking reaction of the polymerizable compound [A], and generally known as a radical polymerization initiator can be used and used for the polymerization of the copolymer [A] A polymerization initiator can be used. The thermal radical polymerization initiator is contained in an amount of 20 parts by weight or less, more preferably 15 parts by weight or less based on 100 parts by weight of the copolymer [A]. If the amount of the thermal radical polymerization initiator exceeds 20 parts by weight, the heat resistance and planarizing property of the protective film, which will be obtained later, are liable to be lowered.

The thermosetting resin composition of the present invention can be produced by dissolving the curing agent [C] and the other additives [D] together with the above-mentioned copolymer [A] and the polymerizable compound [B] in a solvent. The solvent used here is one which does not react with any one component. For example, a solvent used for the polymerization of the copolymer [A] can be used. Of these solvents, diethylene glycol dimethyl ether, diethylene glycol diethyl ether and propylene glycol methyl ether are preferable from the viewpoints of solubility, reactivity, Acetate is preferred.

It is also possible to use a high boiling point solvent together with the above solvent. Examples of the high boiling point solvent include N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, And the like. When such a high boiling point solvent is used in combination, the mixing ratio with the solvent is preferably "(the above solvent): (high boiling point solvent) = 100: 0 to 40".

It is preferable that the total solids content of the solution containing the above [A], [B], [C], [D] and solvent is 10 to 40% by weight. When the solids content is less than 10% by weight, When the solid content is 40% by weight or more, the storage stability is lowered.

The thermosetting resin composition thus mixed can be used after filtration using a filter having a diameter of about 0.1 to 5 탆.

In another aspect, the present invention relates to a protective film for an optical device formed from the thermosetting resin composition.

In the thermosetting resin composition of the present invention, for example, a protective film can be formed by the following method.

The protective film can be obtained by applying the thermosetting resin composition of the present invention to a substrate and removing the solvent to form a coating film of the thermosetting resin composition, followed by heat treatment. As the substrate, glass, quartz, silicon, resin, or the like can be used, and examples of the resin include a ring-opening polymer of polyethylene terephthalate, polybutylene terephthalate, polyether sulfone, polycarbonate, polyimide and cyclic olefin, Hydrogenated products, and the like.

The method of applying the thermosetting resin composition solution is not particularly limited, and for example, a spray method, a roll coating method, a spin coating method, or the like can be used.

The removal of the solvent is preferably performed by a heat treatment (preliminary firing). The conditions of the preliminary firing are preferably baked at 60 to 120 DEG C for about 0.5 to 20 minutes though they vary depending on the kind, ratio, and the like of each component of the composition solution.

The protective film for an optical device can be prepared by treating the substrate at a temperature of 150 to 250 DEG C for 5 to 100 minutes. The thickness of the protective film formed as described above is preferably 0.1 to 6 占 퐉. In the case where there is unevenness on the substrate on which the protective film is formed, the value should be understood as a value at the uppermost surface of the unevenness.

Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to these Examples.

< Manufacturing example  1>

The reaction vessel equipped with a cooling tube and a stirrer was charged with 100 parts by weight of the monomer (compound (al), compound (a2) and compound (a3)) used in the synthesis of the copolymer, 5 parts by weight of azobisisobutyronitrile and 200 parts by weight of diethylene glycol dimethyl ether as a solvent. Then, 30% by weight of methacrylic acid, 50% by weight of glycidyl methacrylate as the compound (a2), and 50% by weight of 3-hydroxy-1-adamantane as the compound (a3), which are the monomers used in the synthesis of the copolymer, 20% by weight of 3-hydoxy-1-adamantyl methacrylate was added, and the mixture was gradually replaced with nitrogen. The temperature of the solution was raised to 80 캜 and maintained at this temperature for 4 hours to obtain a polymer solution containing the copolymer [A1]. The solid content concentration of the obtained copolymer solution was found to be 33.0% by weight and the number average molecular weight was 10,000.

< Manufacturing example  2>

A copolymer was prepared in the same manner as in Production Example 1 except that 1-adamantyl methacrylate (1-adamantyl methacrylate) was used in place of 3-hydoxy-1-adamantyl methacrylate, adamantyl methacrylate) was used to prepare the copolymer [A2]. The solid content concentration of the copolymer solution thus obtained was found to be 33.0% by weight and the number average molecular weight was 10,000.

< Example  1>

100 g of the copolymer [A1] prepared in Preparation Example 1 and 0.1 part by weight of FC430 (fluorinated surfactant) of 3M Company as a surfactant were mixed with 100 parts by weight (solid content: 33 g) of the copolymer [A1] 100 g of methyl ether acetate and 10 g of diethylene glycol dimethyl ether were dissolved to give a solid content concentration of 25% by weight. Thereafter, the solution was filtered through a filter having a pore diameter of 0.45 mu m to prepare a thermosetting resin composition solution.

The thermosetting resin composition solution was coated on the glass substrate using a spin coater so as to have a thickness of 2 탆 and fired in a clean oven at 230 캜 for 30 minutes to form a protective film on the glass substrate.

< Example  2>

A thermosetting resin composition solution was prepared in the same manner as in Example 1 by using the copolymer [A2] prepared in Preparation Example 2, and a protective film was formed on a glass substrate in the same manner.

< Example  3>

50 parts by weight of pentaerythritol tetramethacrylate as a polymerizable compound [B] and 50 parts by weight of a curing agent [C] were added to 100 parts by weight of the copolymer [A1] in the thermosetting resin composition of Example 1, ], 10 parts by weight of trimellitic anhydride was further mixed to prepare a thermosetting resin composition solution, and a protective film was formed on the glass substrate in the same manner.

< Comparative Example  1>

A thermosetting resin composition was prepared in the same manner as in Example 1, except that the copolymer [A] containing no 3-hydoxy-1-adamantyl methacrylate was used in Example 1, Solution, and a protective film was formed on the glass substrate in the same manner.

The evaluation method of the protective film used in the present invention is as follows, and the evaluation results of the protective film prepared in the above Examples and Comparative Examples are shown in Table 1 below.

(1) Adhesiveness

According to a checkerboard tape method, 11 lines of cuts having a spacing of 1 mm were cut out to a depth of the upper surface of the glass substrate using a cutter knife using a cutter knife, After forming a checkerboard pattern, an adhesive tape (Elcometer Co., Part Number K0001539M001) was placed on a checkerboard pattern and peeled off. The number of peeled checkerboard patterns was measured, and the adhesion of the cured film was evaluated according to the following criteria.

○: Number of peeled checkered patterns No more than 5

B: Number of peeled checkered patterns 6 to 49

X: Number of peeled checkered patterns 50 or more

(2) Surface hardness

The cured film was subjected to the pencil hardness test according to the pencil hardness method (test standard: ASTM D3363) to evaluate the surface hardness.

(3) Transparency

The transmittance of the protective film was measured at 400 to 700 nm using a spectrophotometer (Shimadzu Corporation, UV-3101), and the transparency of the protective film was evaluated according to the following criteria.

○: Minimum transmittance exceeded 95%

?: Minimum transmittance: 90 to 95%

×: Minimum transmittance less than 90%

(4) UV resistance

The transmittance of the protective film was measured at 400 to 700 nm using a spectrophotometer (UV-3101PC, manufactured by Shimadzu Corporation). Separately, the cured film was irradiated with UV (wavelength: 254 nm, irradiation amount: 200 mJ / cm 2), and the transmittance was measured by the same method. From each transmittance, the UV resistance of the protective film was evaluated according to the following criteria.

?: Transmission spectrum change within 1%

X: Change in transmission spectrum exceeds 1%

(5) Heat resistance (degree of yellowing)

The transmittance of the protective film was measured at 400 to 700 nm using a spectrophotometer (UV-3101PC, manufactured by Shimadzu Corporation). Separately, the cured film was heated in a clean oven at 250 DEG C for 60 minutes and the transmittance was measured in the same manner. The heat resistance of the protective film was evaluated from each transmittance by the following criteria.

○: Transmission spectrum change within 1% (no yellowing phenomenon)

X: Change in transmission spectrum exceeding 1% (yellowing phenomenon)

(6) Acid resistance

The glass substrate on which the protective film had been formed was immersed in a 25 wt% hydrochloric acid aqueous solution at 30 DEG C for 20 minutes, and then the appearance change of the protective film was observed to evaluate the acid resistance of the protective film.

(7) Alkalinity

The glass substrate on which the protective film was formed was immersed in a 10 wt% aqueous solution of sodium hydroxide at 30 DEG C for 60 minutes, and then the change in appearance of the protective film was observed to evaluate the alkali resistance of the protective film.

division Curing temperature
(° C) Adhesiveness Surface hardness Transparency UV resistance Heat resistance Acid resistance Naal Kali Castle Example 1


180 △ 3H ○ ○ ○ Slightly turbid Slightly turbid 200 ○ 4H ○ ○ ○ No change No change 230 ○ 5H ○ ○ ○ No change No change 250 ○ 5H ○ ○ ○ No change No change Example 2


180 ○ 4H ○ ○ ○ No change No change 200 ○ 5H ○ ○ ○ No change No change 230 ○ 5H ○ ○ ○ No change No change 250 ○ 5H ○ ○ ○ No change No change Example 3

180 ○ 5H ○ ○ ○ No change No change 200 ○ 5H ○ ○ ○ No change No change 230 ○ 5H ○ ○ ○ No change No change 250 ○ 5H ○ ○ ○ No change No change Comparative Example 1


180 × 1H × × × muddiness muddiness 200 × 2H × × × muddiness muddiness 230 × 3H × × × muddiness muddiness 250 × 3H × × × muddiness muddiness

As shown in Table 1, in Examples 1 to 3, the surface hardness, flatness, UV resistance, and heat resistance were superior to those of Comparative Example 1 under various curing temperature conditions. Accordingly, when the thermosetting resin of the present invention is applied to a protective film, it can be applied to devices requiring a post-process such as high-temperature annealing and sputtering while satisfying characteristics as a protective film, thereby providing a protective film excellent in mechanical properties in various optical device processes .

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims (6)

A thermosetting resin composition comprising a copolymer (A) of an unsaturated carboxylic acid or its anhydride (a1), an epoxy group-containing unsaturated compound (a2), and an adamantane group-containing unsaturated compound (a3).
The positive resist composition as claimed in claim 1, wherein the copolymer (A) comprises 5 to 40% by weight of an unsaturated carboxylic acid or its anhydride (a1), 10 to 70% by weight of an epoxy group containing unsaturated compound (a2) To 50% by weight of the thermosetting resin composition.
The thermosetting resin composition according to claim 1, wherein the copolymer [A] has a number average molecular weight of 3,000 to 100,000.
The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition further comprises 200 parts by weight or less of a polymerizable compound [B] having an ethylenically unsaturated bond, based on 100 parts by weight of the copolymer [A] .
The thermosetting resin composition according to claim 1, wherein the thermosetting resin composition further comprises 1 to 50 parts by weight of a curing agent [C] containing a carboxylic acid or an anhydride thereof, based on 100 parts by weight of the copolymer [A].
A protective film for an optical device formed from the thermosetting resin composition according to any one of claims 1 to 5.