KR20140081232A - Vacuum degas chamber and cassette with uniform temperature distribution - Google Patents

Vacuum degas chamber and cassette with uniform temperature distribution Download PDF

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Publication number
KR20140081232A
KR20140081232A KR1020120150778A KR20120150778A KR20140081232A KR 20140081232 A KR20140081232 A KR 20140081232A KR 1020120150778 A KR1020120150778 A KR 1020120150778A KR 20120150778 A KR20120150778 A KR 20120150778A KR 20140081232 A KR20140081232 A KR 20140081232A
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KR
South Korea
Prior art keywords
cassette
frame
docking
substrate
gas
Prior art date
Application number
KR1020120150778A
Other languages
Korean (ko)
Inventor
김윤수
한성
김진구
권영도
Original Assignee
삼성전기주식회사
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Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120150778A priority Critical patent/KR20140081232A/en
Publication of KR20140081232A publication Critical patent/KR20140081232A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Disclosed are a vacuum degas chamber and a cassette having uniform temperature distribution. The cassette includes a top frame and a bottom frame which are separately arranged in a vertical direction; guide frames which are arranged to face each other between both end parts of the top frame and the bottom frame and in which multiple guide slots guiding the outer circumference of a substrate are separately arranged corresponding to each other; and a docking pipe installed on the bottom center of the bottom frame to be docked on a cassette holder and receiving heat from the cassette holder. Therefore, the cassette has an effect of improving the uniformity of the inner temperature of the cassette by conducting the heat to the cassette itself as a heat block is installed on the cassette holder.

Description

[0001] The present invention relates to a vacuum degassing chamber and a cassette having a uniform temperature distribution,

The present invention relates to a vacuum degassing chamber and a cassette having a uniform temperature distribution.

For example, water or oxygen, which can remove foreign substances such as moisture existing on the surface of a polymer such as a substrate and inhibit the production of the substrate or change the characteristics of the produced substrate, for example, by heating in a vacuum atmosphere The process of activating and removing is a degas process.

In a vacuum atmosphere, the temperature is increased by radiation, not heat transfer such as conduction or convection, and an infrared lamp or a halogen lamp is used as the heat source. In some installations, nitrogen is also injected at low pressures to improve temperature drift.

Existing vacuum degassing chambers have an exhaust port and a nitrogen gas inlet which form a vacuum, and a lamp is provided on the inner wall. In addition, a pedestal on which the cassette can be placed is at the center bottom, and the substrate is laid in a layered structure inside the cassette.

Since the method of raising the temperature in the vacuum state is a temperature raising method using radiation, there is a problem in forming the temperature uniformity. That is, the temperature near the lamp is the highest.

In some facilities, nitrogen gas is injected in the mTorr region lower than room temperature to improve the temperature uniformity in order to utilize the convection method. However, even in this case, since the temperature near the gas injection port is relatively low, there is a weakness in forming the temperature uniformity.

As described above, convection at the radiation or low pressure is disadvantageous in that it is difficult to minimize the temperature variation within the facility.

Korean Unexamined Patent Publication No. 2004-0038236 discloses a heating apparatus which conducts conduction heating by using a plurality of electrodes attached to one side and the other side of the inner side wall of a hollow square shaped cassette with a predetermined spacing therebetween, There is a limitation in that a separate electrode is required.

Korean Patent Publication No. 2004-0038236

The present invention provides a vacuum degassing chamber and a cassette in which a heat block is installed in a cassette pedestal to transmit heat to the cassette itself to improve temperature uniformity inside the cassette.

The present invention is to provide a vacuum degassing chamber and a cassette in which a gas pipe is formed to a position where a substrate is loaded in a cassette when nitrogen gas is used so that gas is injected around the substrate to improve the internal temperature deviation.

Other objects of the present invention will become readily apparent from the following description.

According to an aspect of the present invention, there is provided a cassette for loading at least one substrate, comprising: a top frame and a bottom frame arranged up and down; A guide frame disposed opposite to the upper surface frame and between the opposite ends of the lower surface frame and spaced apart from each other by a plurality of guide slots for guiding an outer periphery of the substrate, And a docking tube installed at a center of a lower surface of the lower surface of the frame so as to be dockable to the cassette pedestal and receiving heat from the cassette pedestal.

The lower portion of the cassette may have a minimum cross-sectional area of the metal portion, and the cross-sectional area of the metal portion may gradually increase toward the upper portion.

And a gas pipe connected to the docking tube and extending toward the guide frame and extending upwardly along the guide frame and having a plurality of gas injection holes spaced apart from each other by a predetermined distance in a portion where the gasket is fitted to the guide frame .

The gas delivered from the cassette pedestal may be transmitted through the docking tube and the gas pipe and discharged from the vicinity of the substrate through the plurality of gas injection ports at the same time.

According to another aspect of the present invention, there is provided a vacuum degasser chamber for performing a degassing process in a vacuum atmosphere, wherein a dugging groove having a predetermined diameter is formed in a vertical direction at a central portion of the vacuum degassing chamber A cassette base on which a heat block is installed; And a cassette for accommodating one or more substrates, wherein the docking tube insertable into the docking groove is formed at the center of the lower surface and is docked to the cassette pedestal.

The cassette includes: a top frame and a bottom frame spaced apart from each other; And a guide frame disposed opposite to the upper surface frame and the lower surface of the lower frame so as to face each other and corresponding to each other with a plurality of guide slots guiding the outer periphery of the substrate, The heat generated by the heat block can be transmitted through the docking groove.

The lower portion of the cassette may have a minimum cross-sectional area of the metal portion, and the cross-sectional area of the metal portion may gradually increase toward the upper portion.

Wherein the cassette includes a plurality of gas injection ports connected to the docking tube and extending toward the guide frame and extending upwardly along the guide frame, As shown in FIG.

A gas line is connected to a lower portion of the docking groove, and gas delivered from the cassette pedestal may be transmitted through the docking tube and the gas pipe, and may be simultaneously discharged from the substrate through the plurality of gas injection ports.

Other aspects, features, and advantages will become apparent from the following drawings, claims, and detailed description of the invention.

According to the embodiment of the present invention, a heat block is installed in the cassette pedestal, and heat is transferred to the cassette itself by conduction so that temperature uniformity inside the cassette is improved.

In addition, when nitrogen gas is used, a gas pipe is formed up to a position where the substrate is loaded in the cassette, and gas is injected around the substrate, thereby improving the internal temperature deviation.

1 is a perspective view showing the inside of a vacuum degassing chamber according to an embodiment of the present invention,
FIG. 2 is a perspective view illustrating a cassette of a vacuum degassing chamber according to an embodiment of the present invention; FIG.
3 is a view showing a state where a cassette and a cassette pedestal are docked;

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions include plural expressions unless the context clearly dictates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. Referring to the accompanying drawings, the same or corresponding components are denoted by the same reference numerals, .

FIG. 2 is a perspective view of a cassette of a vacuum degassing chamber according to an embodiment of the present invention, and FIG. 3 is a perspective view showing a cassette and a cassette And the base is docked.

The degassing step is a step in the substrate manufacturing process in which moisture or oxygen is activated by heating in a vacuum atmosphere and removed. A vacuum degassing chamber according to an embodiment of the present invention is a device for performing a degassing process in a vacuum atmosphere.

Referring to FIG. 1, a vacuum degassing chamber 10 according to an embodiment of the present invention includes a lamp 20, a cassette pedestal 30, and a vacuum exhaust port 40. The cassette holder 30 can be docked with the cassette 50 shown in Figs.

The vacuum degassing chamber 10 is loaded with one or more substrates on the inside for the degassing process. One or more substrates are loaded onto the cassette 50 and then docked on the cassette pedestal 30 provided on the underside of the vacuum degassing chamber 10.

A lamp 20 is provided on the inner surface of the vacuum degassing chamber 10 to heat the internal air for the degassing process. The lamp 20 may be, for example, an infrared lamp or a halogen lamp. In this embodiment, the vacuum degassing chamber 10 allows heat to be conducted in a conduction manner, so that the lamp 20 may be omitted.

The vacuum exhaust port 40 is provided on the lower surface of the vacuum degassing chamber 10 and is connected to a vacuum line (not shown) to form a vacuum atmosphere in the vacuum degassing chamber 10.

Referring to FIG. 2, a cassette 50 is a structure for inserting a plurality of substrates.

The cassette 50 is positioned between the upper frame 51 and the lower frame 52 and the upper frame 51 and the lower frame 52 so as to face each other, And guide frames 53 and 54 spaced apart from each other and arranged corresponding to each other. Accordingly, the cassette 50 has a simple structure that facilitates loading or unloading of the substrate while supporting both sides of the substrate.

A docking tube (64), which can be inserted into the docking groove (62) formed in the cassette support (30), is provided at the center of the lower surface of the cassette (50). The docking tube 64 is connected to the gas pipe 66 extending toward the both side guide frames 53 and 54 at the bottom center of the cassette 50 and upwardly extending along the guide frames 53 and 54.

A plurality of gas injection ports (not shown) are formed at predetermined intervals in the gas pipe 66 at the portions where the gas pipes 66 meet the guide frames 53 and 54. The gas delivered through the docking pipe 64 flows through the gas injection port ) Of the vacuum degassing chamber (10).

In this case, gas injection is simultaneously performed at a plurality of gas injection holes formed in the periphery of the substrate, which is advantageous in that temperature uniformity is advantageously formed compared to gas injection through a single gas injection hole.

3, the cassette pedestal 30 is installed on a lower surface of the vacuum degassing chamber 10 and has a heat block 32 formed therein. The cassette 50 is connected to a cassette 50, And the heat is transferred in a manner as described above.

A docking groove 62 is vertically formed at the center of the cassette holder 30 so that the docking tube 64 of the cassette 50 can be inserted. A gas line (not shown) is connected to the lower end of the docking groove 62. When the convection mode is to be supplementarily used, the gas is delivered through the docking tube 64 and the gas pipe 66 of the cassette 50 at low pressure So as to be injected into the vacuum degassing chamber 10. Here, the gas used for forming the vacuum atmosphere may be, for example, nitrogen gas.

The outer circumferential surface of the docking tube 64 comes into contact with the inner circumferential surface of the docking groove 62 and the heat block 32 disposed around the docking groove 62 is brought into contact with the inner circumferential surface of the docking tube 62, Heat can be transferred to the cassette 50 through the docking tube 64 and the gas pipe 66. [ In other words, it is possible to transfer heat by a conduction method other than the conventional radiation method.

In this case, since heat is transferred from the cassette pedestal 30 to the cassette 50, that is, from the lower side to the upper side, a lower temperature and a lower temperature gradient may appear. This temperature gradient can be solved by adjusting the cross-sectional area of the metal part with good thermal conductivity.

Since the heat conduction is proportional to the cross-sectional area of the metal, the lower portion of the cassette 50 is made of the insulating material so that the cross-sectional area of the metal portion is minimized. By increasing the cross-sectional area of the metal portion toward the upper portion of the cassette 50, the thermal deviation according to the position from the heat source can be solved.

The lower portion of the cassette 50 means the lower portion of the lower frame 52 and the guide frames 53 and 54. The upper portion of the cassette 50 corresponds to the upper portions of the guide frames 53 and 54 and the upper surface frame 51, .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the following claims And changes may be made without departing from the spirit and scope of the invention.

10: vacuum degassing chamber 20: lamp
30: cassette base 32: heat block
40: Vacuum exhaust port 50: Cassette
51: upper frame 52: lower frame
53, 54: guide frame 55: guide slot
62: docking groove 64: docking tube
66: Gas pipe

Claims (9)

In a cassette for loading one or more substrates,
A top frame and a bottom frame spaced apart from each other;
A guide frame disposed opposite to the upper surface frame and between the opposite ends of the lower surface frame and spaced apart from each other by a plurality of guide slots for guiding an outer periphery of the substrate, And
And a docking tube installed at a center of the lower surface of the frame so as to be dockable on the cassette pedestal and receiving heat from the cassette pedestal.
The method according to claim 1,
Wherein a lower portion of the cassette is configured such that the cross-sectional area of the metal portion is minimized and the cross-sectional area of the metal portion gradually increases toward the upper portion.
The method according to claim 1,
Further comprising a gas pipe connected to the docking tube and extending toward the guide frame and extending upwardly along the guide frame and having a plurality of gas injection ports spaced apart from each other by a predetermined distance, cassette.
The method according to claim 1,
Wherein the gas delivered from the cassette pedestal is transmitted through the docking tube and the gas pipe and is simultaneously discharged from the vicinity of the substrate through the plurality of gas injection ports.
In a vacuum degassing chamber for performing a degassing process in a vacuum atmosphere,
A cassette pedestal provided on an inner bottom surface of the vacuum degassing chamber, having a dugging groove of a predetermined diameter formed in a central portion thereof in a vertical direction and having a heat block installed therein; And
And a docking tube insertable into the docking groove is formed at a central portion of the lower surface of the docking tube and is coupled to the cassette pedestal and is coupled to the at least one substrate.
6. The method of claim 5,
The cassette
A top frame and a bottom frame spaced apart from each other; And
And a guide frame disposed to face each other between the upper surface frame and the lower surface of the lower frame and spaced apart from each other by a plurality of guide slots for guiding an outer periphery of the substrate,
Wherein the docking tube is installed at a center of a lower surface of the lower frame and receives heat generated by the heat block through the docking groove.
The method according to claim 6,
Wherein a lower portion of the cassette has a minimum cross-sectional area of the metal portion and a cross-sectional area of the metal portion gradually increases toward the upper portion.
The method according to claim 6,
Wherein the cassette includes a plurality of gas injection ports connected to the docking tube and extending toward the guide frame and extending upwardly along the guide frame, Further comprising a vacuum degassing chamber.
The method according to claim 6,
The docking groove has a gas line connected to a lower portion thereof,
Wherein the gas delivered from the cassette pedestal is transmitted through the docking tube and the gas pipe and is simultaneously discharged from the vicinity of the substrate through the plurality of gas injection ports.
KR1020120150778A 2012-12-21 2012-12-21 Vacuum degas chamber and cassette with uniform temperature distribution KR20140081232A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120150778A KR20140081232A (en) 2012-12-21 2012-12-21 Vacuum degas chamber and cassette with uniform temperature distribution

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Application Number Priority Date Filing Date Title
KR1020120150778A KR20140081232A (en) 2012-12-21 2012-12-21 Vacuum degas chamber and cassette with uniform temperature distribution

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298585A (en) * 2015-06-03 2017-01-04 北京北方微电子基地设备工艺研究中心有限责任公司 Chamber and semiconductor processing equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298585A (en) * 2015-06-03 2017-01-04 北京北方微电子基地设备工艺研究中心有限责任公司 Chamber and semiconductor processing equipment

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