KR20140076427A - Photocurable composition, barrier layer comprising the same and encapsulated apparatus comprising the same - Google Patents

Abstract

The present invention relates to a photocurable composition including a silicone compound with an amide group (A) represented by the following formula 1, a barrier layer including the same, a barrier stack including the same, an encapsulated device including the same, and an encapsulation method using the same.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a photocurable composition, a barrier layer containing the same, and an encapsulated device comprising the same. BACKGROUND OF THE INVENTION < RTI ID =

The present invention relates to a photocurable composition, a barrier layer comprising the barrier layer, a barrier stack comprising the same, an encapsulated device comprising the same, and a method of encapsulating the device using the same.

Display devices such as organic optoelectronic devices such as organic light emitting diodes, devices containing photovoltaic cells, and organic thin film transistors must be sealed to protect their sensitive components from atmospheric gases (primarily oxygen and / or moisture). If adequate protection is not achieved, the quality of the device may be degraded. In addition, a dark spot, which is mainly black, may occur, which may result in degradation of the quality of the apparatus. Particularly, in the case of organic light emitting diodes, the quality of the cathode (or anode) / organic film interface portion may be deteriorated due to the water vapor penetrating into the diode.

The encapsulation can typically be accomplished by bonding a glass cap to a display device using a particular adhesive, especially an adhesive with low water permeability. Generally, a solid moisture getter can be placed between the substrate and the cap to extend the lifetime of the device. The encapsulation with a cap is well suited to a rigid device, but may not fit well with devices that include a flexible support (e.g., a flexible display).

The encapsulation technique is also not feasible when there is insufficient space in the circuitry of the substrate, as for example in complementary metal-oxide semiconductor (CMOS) microdisplays, and should be avoided, especially in the case of large emissive areas, if desired to minimize the weight of the device.

In all cases where encapsulation with a cap is not feasible, generally a "monolithic" encapsulation is used, namely a encapsulation using a thin film with good oxygen barrier and water vapor barrier properties. The most commonly used materials for this process are generally oxides of the formulas SiOx, SiNx, SiOxNy and AlxOy deposited using chemical vapor deposition (CVD), optionally plasma enhanced chemical vapor deposition (PECVD) or atomic layer deposition (ALD) Dielectric and / or nitride. The method may be preferred over physical vapor deposition (PVD), such as sputtering, which is predominantly aggressive in organic semiconductors and the like, resulting in the formation of films with properties that are not satisfactory for application of the protective layer due to defects such as pinholes in the deposited film . Plasma enhanced chemical vapor deposition and atomic layer deposition have the advantage that they have much fewer defects than the films obtained by physical vapor deposition and that the deposited films are very uniform. That is, the two methods can provide excellent step coverage.

Efforts have been made to produce multilayers, such as organic / inorganic / organic / inorganic materials, for example, Barix, where defects in the inorganic layer are not "associated " with other inorganic layers. In this way, it is possible to reduce the vapor permeability to about 10 g < ^-6 > / m < ² > / day at present, and thus to have a sufficient lifetime so as to commercialize the organic light emitting diode display device.

Another large group of multilayer encapsulation structures is the "NONON" from Philips, which is composed of multiple layers, such as SiNx / SiOx / SiNx / SiOx, which alternately contain a nitride layer and an oxide layer.

In this connection, according to U.S. Patent No. 7767498, by repeating vapor deposition of about 5 layers of acrylic organic material and 5 layers of inorganic material by vacuum deposition, moisture permeation preventing property of about 10 ^-6 g / m ² / day is obtained Respectively. However, when the organic deposition is stacked as described above, the organic layer is made of an organic material having no barrier properties, and the reliability characteristic is weak due to the failure that the light emission phenomenon does not occur due to corrosion of the cathode layer due to penetration of moisture It has disadvantages. In addition, when the deposition layer has a ten-layer structure and the thickness of the organic layer is insufficient, there arises a problem that the organic layer is deposited on the inorganic layer and the smoothness is lowered. Also, when only aluminum oxide having excellent barrier properties is used, even if the thickness of the layer is increased, the pin-hole generated during deposition can be grown as it is, and moisture and oxygen can be easily permeated. As a result, the adhesion between the inorganic layer and the organic layer may be lowered and the water barrier effect may be lowered.

It is an object of the present invention to provide a photocurable composition capable of forming a barrier layer for a member for an environmentally sensitive device.

Another object of the present invention is to provide a photocurable composition capable of realizing a barrier layer for encapsulation with high photo-curability, high adhesion to an inorganic barrier layer, and good reliability.

It is a further object of the present invention to provide a barrier layer embodied in the photocurable composition, a barrier stack comprising the same, an encapsulated device comprising the barrier stack, and a method of encapsulating the device using the same.

A photocurable composition which is one aspect of the present invention may comprise (A) a silicone-based compound having an amide group represented by the following formula (1)

≪ Formula 1 >

Another aspect of the present invention is that the barrier layer has an adhesion to the inorganic barrier layer of at least ²⁰ kgf / (mm) ² and may comprise a cured product of the photocurable composition.

An encapsulated device, which is another aspect of the present invention, comprises a device member; And a barrier stack formed on the member for the device and including an inorganic barrier layer and an organic barrier layer, wherein the organic barrier layer may comprise a cured product of the photocurable composition.

The present invention provides a photocurable composition which can be used as an encapsulating member for a device because it can form a barrier layer having high photo-curability, high adhesion to an inorganic barrier layer, and high reliability.

1 is a cross-sectional view of an encapsulated device of one embodiment of the present invention.
2 is a cross-sectional view of an encapsulated device of another embodiment of the present invention.

In the present specification, the term "substituted or unsubstituted" means that at least one hydrogen atom of the functional groups of the present invention is a halogen (F, Cl, Br or I), a hydroxyl group, a nitro group, a cyano group, (R "), R ', R" and R "' each independently represent an alkyl group having 1 to 10 carbon atoms, An alkyl group having 1-20 carbon atoms, an alkyl group having 1-20 carbon atoms, an aryl group having 6-20 carbon atoms, a cycloalkyl group having 3-10 carbon atoms, a heteroaryl group having 3-20 carbon atoms, a heterocycloalkyl group having 2-30 carbon atoms, May be substituted with an arylalkyl group having 7 to 21 carbon atoms.

As used herein, the term " compound " may include monomers or oligomers thereof.

As used herein, the term " oligomer " may refer to a polymer polymerized with the corresponding monomer.

In the present specification, '*' may indicate an inter-element linkage site.

As used herein, the term "heteroatom" is an atom other than a carbon atom and may be oxygen, halogen, nitrogen, sulfur, phosphorus, boron, silicon, or aluminum.

The photocurable composition which is one aspect of the present invention may comprise (A) a silicon-based compound having an amide group.

In one embodiment, the photocurable composition may comprise (A) a silicone-based compound having an amide group.

A silicone compound having an amide group

The amide group-containing silicon-based compound may be a photocurable monomer having a photocurable functional group (e.g., (meth) acrylate group).

In an embodiment, the compound may be represented by the formula:

≪ Formula 1 >

(Wherein, R ₁ , R ₂ , and R ₃ are the same or different and each independently Y is hydrogen, Y, Y having the following general formula (2), (3)

(2)

(Wherein * is a nitrogen or Y connecting site of formula (1)

Y ₁ , Y ₂ and Y ₃ are the same or different and each represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted alkyl group having 1-10 hetero atoms, a substituted or unsubstituted 6- A substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted silyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms)

(3)

(Wherein * is a nitrogen or Y linking site of formula (I) and R < ⁴ > is hydrogen, a substituted or unsubstituted alkyl group having 1-30 carbon atoms)

Y represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted alkyl group having 1-10 hetero atoms, a substituted or unsubstituted alkenyl group having 2-20 carbon atoms, a substituted or unsubstituted A substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms and a substituted or unsubstituted carbon number A substituted or unsubstituted C1-C10 alkoxy group, a substituted or unsubstituted C1-

At least one of R ₁ , R ₂ , and R ₃ is the above-described Formula 3,

At least one of R ₁ , R ₂ , and R ₃ is Y having the formula (2) or (2)

Each of Y ₁ , Y ₂ and Y ₃ is independently selected from the group consisting of a hydroxy group, a substituted or unsubstituted alkoxy group having 1-10 carbon atoms, an acetoxy group, an epoxy group, a substituted or unsubstituted alkenyl group having 2-20 carbon atoms, An alkenyl group containing a hetero atom of 2 to 20 carbon atoms, a mercapto group, an isocyanate group, a substituted or unsubstituted amine group having 2 to 20 carbon atoms, and a substituted or unsubstituted heteroatom having 2 to 20 carbon atoms A substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms, or a mixture thereof.

Preferably, the compound of formula (1) may be represented by formula (4): < EMI ID =

≪ Formula 4 >

(Wherein R < ⁴ > is hydrogen or an alkyl group having 1-5 carbon atoms,

R ⁵ and R ⁶ are the same or different and each independently represents hydrogen, an alkyl group having 1-10 carbon atoms, an alkyl group containing 1-10 hetero atoms, an alkenyl group having 2-20 carbon atoms, a hetero atom having 2-20 carbon atoms, An aryl group having 6 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, a substituted or unsubstituted silyl group having 1 to 10 carbon atoms,

At least one of R < ⁵ > and R < ⁶ >

For example, the silicon-based compound may be represented by one of the following formulas (5-11):

≪ Formula 5 >

(6)

≪ Formula 7 >

(8)

≪ Formula 9 >

≪ Formula 10 >

≪ Formula 11 >

(Wherein R < ⁴ > is hydrogen or an alkyl group having 1-5 carbon atoms,

R ⁷ , R ⁸ and R ⁹ are the same or different and each represents an alkyl group having 1 to 10 carbon atoms.

The silicone compound can be prepared by a conventional method. For example, the silicone compound may be prepared by reacting a silyl group-containing amine compound with (meth) acryloyl chloride, but is not limited thereto.

The silicone compound may be contained in an amount of 1-99% by weight, preferably 5-98% by weight, based on the solid content of the photocurable composition. Within the above range, the photo-curable composition may have excellent photosensitivity and adhesion and good reliability.

The composition may further comprise (B) an initiator.

Initiator

The initiator may include, without limitation, conventional photopolymerization initiators capable of carrying out photo-curable reactions. For example, the photopolymerization initiator may include triazine, acetophenone, benzophenone, thioxanthone, benzoin, phosphorus, oxime, or a mixture thereof. Preferably, phosphorous can be used.

Phosphorous can be bisbenzoylphenylphosphine oxide, benzoyldiphenylphosphine oxide or mixtures thereof.

The initiator may comprise from 1 to 99% by weight, preferably from 1 to 10% by weight or from 1 to 5% by weight of the photocurable composition on a solids basis. In the above range, photopolymerization can sufficiently take place at the time of exposure, and the transmittance can be prevented from being lowered due to the unreacted initiator remaining after the photopolymerization.

In another embodiment, the photocurable composition may further comprise (C) a silicone-based compound not containing an amide group. The silicon-based compound may be a photocurable monomer containing a siloxane group and a photocurable functional group (e.g., a vinyl group or a (meth) acrylate group).

The silicon-based compound may be represented by the following formula (12): < EMI ID =

≪ Formula 12 >

(Wherein R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ , R ₁₄ and R ₁₅ are the same or different and are each independently selected from the group consisting of hydrogen, Z, Z having the formula (3)

(3)

(Wherein * is a connecting site of Si or Z of formula (12), and R ⁴ is hydrogen, a substituted or unsubstituted alkyl group having 1-30 carbon atoms)

Z represents an alkyl group having 1-10 carbon atoms, an alkyl group having 1-10 carbon atoms, an alkenyl group having 2-20 carbon atoms, an alkenyl group having 2-20 carbon atoms having a heteroatom, an aryl group having 6-20 carbon atoms, An aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a silyl group having 1 to 10 carbon atoms,

At least one of R ₁₀ , R ₁₁ and R ₁₂ is Z having the formula (3)

And at least one of R ₁₃ , R ₁₄ and R ₁₅ is Z having the formula (3).

Preferably, R ₁₀ , R ₁₁ and R ₁₂ may be an alkyl group having 1 to 5 carbon atoms or an alkyl group having 1 to 10 carbon atoms having the formula (3).

Preferably, R ₁₃ , R ₁₄ and R ₁₅ may be an alkyl group having 1 to 5 carbon atoms or an alkyl group having 1 to 10 carbon atoms having the formula (3).

In an embodiment, the silicone-based compound may be 1,3-bis ((meth) acryloxyalkyl) tetraalkyldisiloxane or a mixture comprising thereof.

The silicone compound (C) may be contained in an amount of 10 to 80% by weight, preferably 15 to 50% by weight, based on the solids content of the photocurable composition. Within the above range, the photo-curable composition may have excellent photosensitivity and adhesion and good reliability.

In another embodiment, the photocurable composition may further comprise (D) a non-silicon-based compound that does not comprise silicon. The non-silicone compound may be a photocurable monomer containing a photocurable functional group (e.g., a vinyl group or a (meth) acrylate group).

For example, the non-silicone compound may be a (meth) acrylate having an alkyl group of 1-20 carbon atoms, a di (meth) acrylate of a diol having 2-20 carbon atoms, a tri (meth) Tetra (meth) acrylate of tetraol having a carbon number of 4-20.

The non-silicone compound (D) may be contained in an amount of 10 to 80% by weight, preferably 5 to 55% by weight, based on the solid content of the photocurable composition. Within the above range, the photo-curable composition may have excellent photosensitivity and adhesion and good reliability.

In one embodiment, the photocurable composition may comprise 90-99% by weight of (A) and 1-10% by weight of (B) on a solids basis.

In another embodiment, the photocurable composition may comprise 40-55% by weight of (A), 1-5% by weight of (B), 40-55% by weight of (C) or (D) on a solids basis.

In another embodiment, the photocurable composition comprises 40-55% by weight of (A), 1-5% by weight of (B), 35-45% by weight of (C) .

The photocurable composition can be formed by mixing the silicon compound or the like with an initiator. Preferably, it may be formed into a solventless type solventless type.

The photocurable composition may have a photocurability of 80% or more. When the degree of photo-curing is less than 80%, the cured shrinkage stress after curing is high, so that a layer in which a shift is not generated can be realized and used for sealing. Preferably, it may be 90% or more, and more preferably 90-95%.

The photocurable composition may have an adhesion to the inorganic barrier layer after curing of 20 kgf / (mm) ² or more. When the adhesive force is less than ²⁰ kgf / (mm) ² , water or oxygen penetrated from the outside easily penetrates between the barrier layers, resulting in reliability failure. The inorganic barrier layer is an inorganic barrier layer which is described below: may comprise (for example, _{SiOx, SiNx, Al 2 O 3} ), but is not limited thereto. Preferably, the adhesive force is 20-100 kgf / (mm) ² , more preferably 30-100 kgf / (mm) ² .

In one embodiment, the adhesion of the inorganic barrier layer to silicon oxide or aluminum oxide can be 30-43 kgf / (mm) ² . In another embodiment, the adhesion to the silicon nitride with the inorganic barrier layer may be 33-45 kgf / (mm) ² . The adhesive force can be measured with reference to the following experimental examples.

The member for the device, in particular the display member, may be decomposed or defective by the permeation of gases or liquids in the surrounding environment, such as oxygen and / or moisture in the atmosphere and / or water vapor and chemicals used in processing into electronics. To this end, the member for the device needs to be encapsulated or encapsulated. Such a device member may be an organic light emitting diode (OLED), a lighting device, a flexible organic light emitting diode display, a metal sensor pad, a microdisk laser, an electrochromic device, a photochromic device, a microelectromechanical system, , A charge coupled device, a light emitting polymer, a light emitting diode, and the like.

The photocurable composition of the present invention may form an organic barrier layer that is used for encapsulation or encapsulation of such devices, particularly flexible display devices.

An organic barrier layer, which is another aspect of the present invention, may be formed from the composition.

The organic barrier layer can be formed by photocuring the photocurable composition described above. Although not limited, the photocurable composition can be coated to a thickness of 0.1 탆 - 20 탆 and cured by irradiation at 10 -500 J / cm 2 for 1-50 seconds.

The organic barrier layer has the physical properties of the photocurable composition after curing as described above. Thus, a barrier stack can be formed with the inorganic barrier layer described below to be used for encapsulation of the device.

A barrier stack, another aspect of the present invention, can comprise the organic barrier layer and the inorganic barrier layer.

The inorganic barrier layer may be formed of an inorganic layer different from the organic barrier layer, so that the effect of the organic barrier layer can be compensated.

The inorganic barrier layer is not particularly limited as long as it is an inorganic layer excellent in light transmittance and excellent in moisture and / or oxygen barrier properties. For example, a metal, an intermetallic compound or an alloy, an oxide of a metal or a mixed metal, a fluoride of a metal or a mixed metal, a nitride of a metal or a mixed metal, a metal carbide, an oxygen nitride of a metal or a mixed metal, Carbohydrates, oxygen borides of metals or mixed metals, silicides of metals or mixed metals, or mixtures thereof. The metal may be selected from the group consisting of Si, Al, Se, Zn, Sb, In, Ge, Sn, Bi, , Lanthanide metals, and the like, but are not limited thereto. And specifically, the inorganic barrier layer is SiOx, SizNx, SiOxNy, ZnSe, ZnO, Sb 2 O 3, Al 2 O 3, In 2 O 3, SnO 2 ( In the above, x is 1-5, y is 1-5, And z is 1-5), and the like.

The inorganic barrier layer and the organic barrier layer may be deposited by a vacuum process such as sputtering, chemical vapor deposition, metal organic chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma enhanced chemical vapor deposition, and combinations thereof .

The organic barrier layer secures the above-mentioned physical properties. As a result, when the organic barrier layer is deposited alternately with the inorganic barrier layer, the smoothing property of the inorganic barrier layer can be secured. In addition, the organic barrier layer can prevent the defects of the inorganic barrier layer from propagating to another inorganic barrier layer.

The barrier stack includes the organic barrier layer and the inorganic barrier layer, but the number of barrier stacks is not limited. And the level of permeation resistance to oxygen and / or moisture and / or water vapor and / or chemicals of the combination of barrier stacks.

In the barrier stack, the organic barrier layer and the inorganic barrier layer can be alternately deposited. This is due to the effect of the organic barrier layer produced on the barrier layer due to the physical properties of the photocurable composition described above. This makes it possible to supplement or reinforce the effect on the display device arising from the organic barrier layer and the inorganic barrier layer.

Preferably, the organic barrier layer and the inorganic barrier layer can be deposited in total two or more layers each in total 10 times or less, preferably 7 times or less (e.g., 2-7 times), more preferably, An inorganic barrier layer, an organic barrier layer, an inorganic barrier layer, an organic barrier layer, an inorganic barrier layer, an organic barrier layer, and an inorganic barrier layer.

In the barrier stack, the thickness of one organic barrier layer may be 0.1 占 퐉 -20 占 퐉, preferably 1 占 퐉 -20 占 퐉, and the thickness of one inorganic barrier layer may be 5 nm-500 nm, preferably 5 nm-200 nm.

The barrier stack may be a thin-film encapsulant and have a thickness of 5 占 퐉 or less, preferably 1.5 占 퐉 to 5 占 퐉.

An encapsulated device, which is another aspect of the present invention, may include a member for the device, and the barrier layer or barrier stack formed over the device member. For example, the device may include a display device.

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a cross-sectional view of an encapsulated device of one embodiment of the present invention.

1, an encapsulated device 100 includes a substrate 10; (For example, organic light emitting element) 20 formed on the substrate 10; And a barrier stack 30 formed on the device member 20 and composed of an inorganic barrier layer 31 and an organic barrier layer 32.

2, the encapsulated device 200 includes a substrate 10; (For example, organic light emitting element) 20 formed on the substrate 10; And a barrier stack 30 formed on the device member 20 and composed of an inorganic barrier layer 31 and an organic barrier layer 32.

Fig. 1 shows an embodiment in which the device member 20 and the inorganic barrier layer 31 are in contact with each other. Fig. 2 shows a specific example in which an empty space 40 is formed between the device member 20 and the inorganic barrier layer 31 to be.

The contents for the device, the organic barrier layer, the inorganic barrier layer, and the barrier stack are as described above.

The substrate is not particularly limited as long as it is a substrate on which a member for an apparatus can be laminated. For example, a transparent glass, a plastic sheet, a silicon or metal substrate, or the like.

 The encapsulated device may be manufactured in a conventional manner. In embodiments, a device member is formed over the substrate and an inorganic barrier layer is formed. The photo-curable composition can be applied by spin coating, slit coating, or the like, and the organic barrier layer can be formed by irradiating light. The formation process of the inorganic barrier layer and the organic barrier layer may be repeated (preferably, the inorganic barrier layer-organic barrier layer-inorganic barrier layer-organic barrier layer-inorganic barrier layer-organic barrier layer-inorganic barrier layer) ).

Methods for forming the inorganic barrier layer and the organic barrier layer are not limited, but may include deposition.

A method of encapsulating an apparatus, which is another aspect of the present invention, may comprise the steps of:

Stacking a member for the at least one device on the substrate; And

Depositing at least one barrier layer that includes at least one inorganic barrier layer and an organic barrier layer and is adjacent to the device member.

 Details of the substrate, the device member, the inorganic barrier layer, the organic barrier layer, and the barrier stack are as described above.

  A member for a device is laminated on a substrate. This can be performed in the same manner as the inorganic barrier layer and the organic barrier layer formation method, but is not limited thereto.

The inorganic barrier layer and the organic barrier layer may be formed by a vacuum process, such as sputtering, chemical vapor deposition, plasma chemical vapor deposition, evaporation, sublimation, electron cyclotron resonance-plasma vapor deposition, and combinations thereof.

Hereinafter, the configuration and operation of the present invention will be described in more detail with reference to preferred embodiments of the present invention. It is to be understood, however, that the same is by way of illustration and example only and is not to be construed in a limiting sense.

Synthetic example  1: N, N- bis (3- triethoxysilyl ) propyl) 메acrylacrylamide  Produce

A jacketed reactor capable of controlling the temperature of 100.00 g of bis (3- (triethoxysilyl) propyl) amine (C18H43NO6Si2, Gelest) and methylene chloride (CH2Cl2, TCI) And the mixture was stirred at room temperature for 30 minutes. Then, while the reactor was cooled to 0 ° C, methacryloyl chloride (C4H5ClO, TCI) was slowly added dropwise to the reactor over 1 hour by 1 equivalent of (A). After the addition, the reactor was stirred at room temperature for 6 hours, and the reaction was terminated. The organic solution in the reactor was neutralized with water until the pH became neutral and then dried under reduced pressure to obtain the final product. The obtained product was identified by analyzing the final structure by NMR and GC.

Synthetic example  2: N, N- bis (3- trimethoxysilyl ) propyl) 메acrylacrylamide  Produce

Bis (3- (trimethoxysilyl) propyl) amine (C12H31NO6Si2, Gelest) was used in place of bis (3- (triethoxysilyl) propyl) amine.

Examples Comparative Example

The components (a-1), (a-2), (b), (c) and (d) were mixed in the amounts shown in Table 2 (unit: parts by weight, based on solids) For 3 hours to prepare a photocurable composition.

The following properties of the photocurable compositions prepared in Examples and Comparative Examples were evaluated, and the results are shown in Table 2 below.

(1) photo-degree (%) using the FT-IR (NICOLET 4700, Thermo Co.) with respect to the photocurable composition of the vicinity of 1635cm ^-1 (C = C), 1720cm ^-1 vicinity (C = O) absorption band at Is measured. Applying the composition on a glass substrate to a thickness 5㎛ and was UV cured by irradiation for 10 seconds to 100J / cm ^2, to obtain a sample of 20cm x 20cm x 5㎛ (length x width x thickness). Obtain a cured film and, FT-IR (NICOLET 4700, Thermo Co.) is used in the vicinity of 1635cm ^-1 (C = C), 1720cm ^-1 measured intensity of the absorption peak in the vicinity of the (C = O) a. The degree of photo-curing is calculated according to the following formula (1).

<Formula 1>

Photocuring degree (%) = | 1- (A / B) | x 100

(Where A is the ratio of the intensity of the absorption peak at about 1635 cm ^-1 to the intensity of the absorption peak at about 1720 cm ^-1 for the cured film,

B is the ratio of the intensity of the absorption peak at about 1635 cm ^-1 to the intensity of the absorption peak at about 1720 cm ^-1 for the composition)

(2) Adhesive strength 1 (kgf / (mm) ² ): The adhesive force was measured by the same method as that for measuring the die shear strength as a method for measuring the adhesion between glass and glass. The adhesive strength meter dage series 4000PXY was used to measure the force exerted by pushing the upper glass from the side with a force of 200 kgf at 25 캜. The size of the lower glass was 2 cm x 2 cm x 1 mm (width x length x thickness), and the size of the upper glass was 1.5 cm x 1.5 cm x 1 mm (width x length x thickness) Respectively.

(3) Adhesive strength 2 (kgf / (mm) ² ): The adhesion force was measured by the same method as that for measuring the die shear strength as a method for measuring the adhesion between silicon nitride and silicon nitride. The adhesive strength meter dage series 4000PXY was used to measure the force exerted by pushing the upper glass from the side with a force of 200 kgf at 25 캜. The size of the lower glass was 2 cm x 2 cm x 1 mm (width x length x thickness), and the size of the upper glass was 1.5 cm x 1.5 cm x 1 mm (width x length x thickness) Respectively. The lower glass where the adhesive layer is located and the upper glass are coated with silicon nitride.

(4) Reliability: The reliability evaluation device can be manufactured by a conventional method. The device is deposited on the substrate and an inorganic barrier layer is formed. The photo-curable composition is applied in a thickness of 1 占 퐉 to 5 占 퐉 using spin coating, slit coating, or the like, and light is irradiated to form an organic barrier layer. The organic barrier layer and the inorganic barrier layer are alternately formed and deposited three times in total. The reliability is determined by observing the time during which the discoloration occurs inside the package under a microscope while being left under the conditions of 85 캜 and 85% relative humidity. The reliability score is evaluated based on the time point of discoloration as shown in Table 1 below.

When discoloration occurred Reliability score Less than 1 week 0 point More than 1 week ~ 2 weeks 1 point More than 2 weeks ~ less than 3 weeks 2 points Less than 3 weeks to less than 4 weeks 3 points Less than 4 weeks to less than 5 weeks 4 points More than 5 weeks ~ less than 6 weeks 5 points More than 6 weeks ~ less than 7 weeks 6 points More than 7 weeks ~ less than 8 weeks 7 points More than 8 weeks ~ less than 9 weeks 8 points Less than 9 weeks to less than 10 weeks 9 points More than 10 weeks 10 points

Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7 Example 8 Comparative Example 1 Comparative Example 2 (a-1) N, N-bis (3-triethoxysilyl) propyl) methacrylamide 98 49 49 49 0 0 0 0 0 0 (a-2) N, N-bis (3-trimethoxysilyl) propyl) methacrylamide 0 0 0 0 98 49 49 49 0 0 (c) 1,3-bis (methacryloxypropyl) tetramethyldisiloxane 0 49 0 39 0 49 0 39 49 0 (d) hexanediol diacrylate 0 0 49 10 0 0 49 10 49 98 (b) Darocur TPO (BASF) 2 2 2 2 2 2 2 2 2 2 Photocuring condition 100 J / cm ² , 10 sec Photocurability (%) 94.1 94.0 90.2 92.3 94.0 93.9 90.8 92.6 94.0 94.0 Adhesion, glass (kgf / (mm) ² ) 43 32 30 31 43 33 30 31 17 15 Adhesion force, SiN (kgf / (mm) ² ) 44 39 33 35 45 38 34 36 15 12 responsibility 10 points 9 points 8 points 9 points 10 points 9 points 8 points 9 points 4 points 3 points

As shown in Table 2, the photocurable composition of the present invention has high photo-curability, high adhesion to inorganic barrier layers such as silicon oxide and silicon nitride after curing, and reliability It was good. On the other hand, the composition of the comparative example not containing the compound of formula (1) of the present invention had low adhesion to the inorganic barrier layer and poor reliability.

The present invention is not limited to the above embodiments and drawings but may be variously different forms. Therefore, it should be understood that the above-described embodiments and drawings are to be considered in all respects as illustrative and not restrictive.

Claims (22)

1. A photocurable composition comprising: (A) a silicone compound having an amide group represented by the following formula (1):
&Lt; Formula 1 >

(Wherein, R ₁ , R ₂ and R ₃ are the same or different and each independently Y is hydrogen, Y, Y having the formula (2), (3) or (3)
(2)

(Wherein * is a linking site of nitrogen or Y of formula 1,
Y ₁ , Y ₂ and Y ₃ are the same or different and each represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted alkyl group having 1-10 hetero atoms, a substituted or unsubstituted 6- A substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted silyl group having 1 to 10 carbon atoms, or a substituted or unsubstituted alkoxy group having 1 to 20 carbon atoms)
(3)

(Wherein * is a nitrogen or Y linking site of Formula 1 and R ⁴ is hydrogen, a substituted or unsubstituted alkyl of 1-30 carbon atoms)
Y represents a substituted or unsubstituted alkyl group having 1-10 carbon atoms, a substituted or unsubstituted alkyl group having 1-10 hetero atoms, a substituted or unsubstituted alkenyl group having 2-20 carbon atoms, a substituted or unsubstituted A substituted or unsubstituted aryl group having 6 to 20 carbon atoms, a substituted or unsubstituted aryl group having 6 to 20 carbon atoms and a substituted or unsubstituted carbon number A substituted or unsubstituted C1-C10 alkoxy group, a substituted or unsubstituted C1-
At least one of R ₁ , R ₂ and R ₃ is the above-described formula (3)
At least one of R ₁ , R ₂ and R ₃ is Y having the formula (2) or (2).
The photocurable composition according to claim 1, wherein the (A) amide group-containing silicone compound is represented by one of the following formulas (5) to (11)
&Lt; Formula 5 >

(6)

&Lt; Formula 7 >

(8)

&Lt; Formula 9 >

&Lt; Formula 10 >

&Lt; Formula 11 >

(Wherein R < ⁴ > is hydrogen or an alkyl group having 1-5 carbon atoms,
R ⁷ , R ⁸ , and R ⁹ are the same or different and each represents an alkyl group having 1 to 10 carbon atoms.
The photocurable composition of claim 1, wherein the photocurable composition further comprises (B) an initiator.
4. The photocurable composition of claim 3, wherein the photocurable composition comprises 1-99% by weight of (A) and 1-99% by weight of (B) based on solids.
The photocurable composition of claim 3, wherein the photocurable composition further comprises a compound represented by the following formula (C):
&Lt; Formula 12 >

(Wherein R ₁₀ , R ₁₁ , R ₁₂ , R ₁₃ , R ₁₄ and R ₁₅ are the same or different and are each independently selected from the group consisting of hydrogen, Z, Z,
(3)

(Wherein * is a linking site of Si or Z in the above formula (12), and R ⁴ is hydrogen, a substituted or unsubstituted alkyl group having 1-30 carbon atoms)
Z represents an alkyl group having 1-10 carbon atoms, an alkyl group having 1-10 carbon atoms, an alkenyl group having 2-20 carbon atoms, an alkenyl group having 2-20 carbon atoms having a heteroatom, an aryl group having 6-20 carbon atoms, An aryl group having 6 to 20 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, or a silyl group having 1 to 10 carbon atoms,
At least one of R < ₁₀ &gt;, R &lt; ₁₁ &gt; and R &lt; ₁₂ &
R _13, R ₁₄ and R ₁₅ is one or more of Z having the general formula (3)).
6. The photocurable composition of claim 5, wherein the compound represented by formula (C) is a 1,3-bis ((meth) acryloxyalkyl) tetraalkyldisiloxane or a mixture containing the same.
The photocurable composition according to claim 5, wherein the photocurable composition comprises 40-55 wt% of the (A), 1-5 wt% of the (B), and 40-55 wt% of the (C).
The photocurable composition according to claim 3, wherein the photocurable composition further comprises (D) a non-silicon-based photocurable compound that does not include silicon.
(Meth) acrylate having an alkyl group of 1-20 carbon atoms, a di (meth) acrylate of a diol having 2-20 carbon atoms, a di (meth) acrylate having a carbon number of 2-20, Tri (meth) acrylate of triol of 3-20 and tetra (meth) acrylate of tetraol of 4-20 carbon atoms.
The photocurable composition of claim 8, wherein said photocurable composition comprises 40-55 wt% of said (A), 1-5 wt% of said (B), and 40-55 wt% of (D) .
6. The photocurable composition of claim 5, wherein the photocurable composition further comprises (D) a non-silicon photocurable compound that does not comprise silicon.
The non-silicon photocurable compound (D) according to claim 11, wherein the (D) silicon-free photocurable compound is a (meth) acrylate having an alkyl group of 1-20 carbon atoms, a di (meth) acrylate of a diol having 2-20 carbon atoms, Tri (meth) acrylate of triol of 3-20 and tetra (meth) acrylate of tetraol of 4-20 carbon atoms.
12. The photocurable composition of claim 11, wherein the photocurable composition comprises 40-55 wt.% Of (A), 1-5 wt.% Of (B), 35-45 wt. To 15% by weight of the composition.
The adhesion to the inorganic barrier layer after curing is not less than ²⁰ kgf / (mm) ² ,
A photocurable composition comprising (A) a silicone-based compound having an amide group of claim 1.
The adhesion to the inorganic barrier layer is 20 kgf / (mm) ² or more,
A barrier layer comprising a cured product of the photocurable composition of any of claims 1-13.
A member for a device; And
And a barrier stack formed on the member for the device and including an inorganic barrier layer and an organic barrier layer,
Wherein the organic barrier layer comprises a cured product of the photocurable composition of any of claims 1-13.
17. The encapsulated device of claim 16, wherein the organic barrier layer has an adhesion to the inorganic barrier layer of 20 kgf / (mm) ² or greater.
17. The method of claim 16, wherein the inorganic barrier layer is formed of a metal, an intermetallic compound or an alloy, an oxide of a metal or a mixed metal, a fluoride of a metal or a mixed metal, a nitride of a metal or a mixed metal, a metal carbide, Borides of metals or mixed metals, oxygen borides of metals or mixed metals, silicides of metals or mixed metals or mixtures thereof,
The metal may be selected from the group consisting of Si, Al, Se, Zn, Sb, In, Ge, Sn, Bi, , And lanthanide metals.
17. The encapsulated device of claim 16, wherein the organic barrier layer and the inorganic barrier layer are alternately formed.
17. The encapsulated device of claim 16, wherein the barrier stack is stacked with less than a total of ten layers of the organic barrier layer and the inorganic barrier layer.
17. The encapsulated device of claim 16, wherein the thickness of the organic barrier layer is 0.1 占 퐉 -20 占 퐉 and the thickness of the inorganic barrier layer is 5nm-500nm.
17. The method of claim 16, wherein the device member is selected from the group consisting of a flexible organic light emitting device, an organic light emitting device, a lighting device, a metal sensor pad, a microdisk laser, an electrochromic device, a photochromic device, An integrated circuit, a charge coupled device, an encapsulated device that is a light emitting polymer or a light emitting diode.

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