KR20140074067A - Adhesive layer and structure of adhesive tape for fixing electronic parts - Google Patents

Abstract

The present invention relates to an adhesive layer and a structure of an adhesive tape for fixing an electronic part. The adhesive layer of the adhesive tape for fixing the electronic part includes a first compound having the structure of the following Formula 1, a second compound and a third compound. In this case, m is 0 to 1, and n is 12 to 24 in the first compound; m is 0 to 1, and n is 1 to 5 in the second compound; and m is 0 to 1 and n is 0 in the third compound. Here, R_1 is C_mH_2m_+1, R_2 is C_nH_2n_+1, and m and n are an integer.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an adhesive layer and an adhesive tape,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive layer and a structure of an adhesive tape for fixing electronic components, and more particularly to an adhesive layer and a structure of a recycled adhesive tape for fixing electronic components.

Recently, due to the demands of environmental protection, much attention is paid to green and environmental protection processes. Due to the high demand for sperm information products, low-pollution and low-emission process technologies for manufacturing electronic components have become an important issue. For example, light emitting diodes, multilayer ceramic capacitors (MLCC), inductors, or transistors are widely used, and therefore process technology for manufacturing electronic components is more important.

For example, in the case of a patch type light emitting diode, in the process of manufacturing the light emitting diode, when the light emitting diode chip is packaged in the patch type light emitting diode substrate, the ultraviolet (UV) curing adhesive tape needs to be used for fixing the light emitting diode substrate have. Next, after the light emitting diode substrate is placed on a platform of the cutter and the cutting position is found using a charge coupled device (CCD), the light emitting diode substrate is cut using a diamond wheel. After being irradiated by ultraviolet (UV) light, the adhesive layer of the adhesive tape is cured and the adhesive force is lost as a result. After cutting, the patch type light emitting diode component is peeled from the adhesive tape.

A commonly used adhesive tape is a UV light curable adhesive tape. Since the cross-linking is cured after being irradiated with UV light, the adhesive force of the adhesive tape disappears, so that the adhesive tape can not be repeatedly used and a large amount of product waste is produced. During the curing of the crosslinking of the UV light curable adhesive tape, harmful organic gases are released, which inevitably leads to occupational illness for a long time.

An object of the present invention is to provide an adhesive layer for fixing electronic parts and a structure of an adhesive tape.

The present invention provides an adhesive layer of an adhesive tape for fixing electronic parts. Wherein the adhesive layer comprises a first compound, a second compound and a third compound having a structure of at least the following Formula 1 wherein m is 0 to 1 and n is 12 to 24; M in the second compound is 0 to 1 and n is 1 to 5; M in the third compound is 0 to 1, n is 0,

Here, R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers.

The content of the first compound is 30 wt% to 65 wt%, the content of the second compound is 30 wt% to 65 wt%, and the content of the third compound is 1 wt% to 2 wt%. The adhesive layer may comprise a cross-linking agent, which may be an isocyanate, polyamine or polyhydric alcohol.

The present invention provides a structure of an adhesive tape for fixing electronic parts. Wherein the structure comprises a substrate material film, an adhesive layer and a protective film, wherein the adhesive layer is formed by the polymerization of a first compound, a second compound and a third compound having a structure of Formula 1, 1 and n is 12 to 24; The second compound has m = 0 to 1 and n = 1 to 5; And the third compound is a compound wherein m is 0 to 1, n is 0,

[Chemical Formula 1]

,

,

Here, R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers.

The material film may include an unsaturated polyester. The material film may include at least one selected from the group consisting of polypropylene, polycarbonate, polyester, vinyl terephthalate and polyvinyl chloride. The content of the first compound is 30 wt% to 65 wt%, the content of the second compound is 30 wt% to 65 wt%, and the content of the third compound is 1 wt% to 2 wt%. The adhesive layer may comprise a cross-linking agent, which may be an isocyanate, polyamine or polyhydric alcohol. The protective film may be paper, metal or plastic.

The details of one or more embodiments are set forth in the accompanying drawings and the description below. Other functions will be apparent from the description, drawings and claims.

The present invention will be more fully understood from the detailed description given hereinafter, which should not be construed as limiting the invention.
1 is a structural view of an adhesive tape for fixing electronic parts according to an embodiment of the present invention.

In the description of an embodiment of the present invention, when the layer (or film), region, pattern or structure is on the "upper" or "lower" portion of another layer (or film), another region, another pad, , It can be understood that it may be "directly" or "indirectly" above or below another layer (or film), another region, another pad, or other pattern. In addition, for each layer with respect to the "upper" and "lower ", reference is made to the drawings.

In the drawings, the size of each layer (film), area, pattern, or structure may be expanded or omitted for convenience and clarity of explanation. In addition, the size of the component may not fully reflect the actual size.

Hereinafter, according to the embodiment of the present invention, the adhesive layer and the structure of the adhesive tape for fixing electronic parts are specifically described.

An embodiment of the present invention provides an adhesive layer of an adhesive tape for fixing electronic parts. Wherein the adhesive layer comprises a first compound, a second compound and a third compound having a structure of at least the following Formula 1 wherein m is 0 to 1 and n is 12 to 24; M in the second compound is 0 to 1 and n is 1 to 5; M in the third compound is 0 to 1, n is 0,

[Chemical Formula 1]

,

,

Here, R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers.

The first compound may further be acrylate or methacrylate, and the content of the first compound may be 30 wt% to 65 wt%. The second compound may additionally be acrylate or methallylate, and the content of the second compound may be 30 wt% to 65 wt%. The third compound may additionally be acrylic acid or methacrylic acid, and the content of the third compound may be 1 wt% to 2 wt%. The adhesive layer may comprise a cross-linking agent, which may be an isocyanate, polyamine or polyhydric alcohol.

1 is a structural view of an adhesive tape 1 for fixing electronic parts according to an embodiment of the present invention. 1, an adhesive tape 1 for fixing an electronic component according to an embodiment of the present invention includes a substrate material film 11, an adhesive layer 12 and a protective film 13, 1 structure, a second compound and a third compound, wherein the first compound has m = 0 to 1 and n = 12 to 24; The second compound has m = 0 to 1 and n = 1 to 5; And the third compound is a compound wherein m is 0 to 1, n is 0,

[Chemical Formula 1]

,

,

Here, R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers.

The material film 11 may include an unsaturated polyester. The material film 11 may include at least one selected from the group consisting of polypropylene, polycarbonate, polyester, vinyl terephthalate and polyvinyl chloride. The thickness of the material film 11 may be 50 탆 to 250 탆. The surface of the material film 11 undergoes a corona discharge treatment, a plasma treatment, a sandblasting treatment, a primer treatment, a chemical treatment and the like so that the adhesive force between the material film 11 and the adhesive layer 12 Can be improved. The first compound may further be acrylate or methacrylate, and the content of the first compound may be 30 wt% to 65 wt%. The second compound may additionally be acrylate or methacrylate, and the content of the second compound may be 30 wt% to 65 wt%. The third compound may additionally be acrylic acid or methacrylic acid, and the content of the third compound may be 1 wt% to 2 wt%. The adhesive layer 12 may comprise a cross-linking agent, which may be an isocyanate, polyamine or polyhydric alcohol. The protective film 13 may be paper, metal or plastic and is used to protect the adhesive layer 12 from being contaminated during storage or transportation.

The confinement layer 12 of the present invention is formed by copolymerizing a first compound, a second compound, and a third compound. Since the main chain or side chain of the first compound, the second compound and the third compound is determined and the molecular chain of R ₂ is sufficiently long, the temperature point at which the adhesive layer 12 is crystallized The adhesive layer 12 does not exhibit adhesiveness at room temperature but exhibits adhesiveness at a temperature higher than room temperature. That is, the adhesive layer 12 has a crystallization property, the crystallization temperature is between 20 ° C and 35 ° C, and exhibits a non-adhesive property; The non-crystallization temperature is between 45 ° C and 70 ° C and exhibits adhesive properties. Therefore, the adhesive force can be changed by changing the content ratio of the first compound, the second compound and the third compound.

The physical reaction of the adhesive layer 12 from crystallization to non-crystallization is reversible. That is, when the temperature of the adhesive layer 12 is raised from 45 캜 to 70 캜 at a temperature of 20 캜, the adhesive layer 12 exhibits adhesiveness without being crystallized, and when the temperature of the adhesive layer 12 is 45 캜 - When the temperature is lowered to 20 to 35 占 폚 at 70 占 폚, the adhesive layer 12 is crystallized and does not exhibit adhesion.

For example, the adhesive layer of the present invention may be placed on a heating bench at a temperature higher than 50 ° C., so that the adhesive layer of the adhesive tape may have an adhesive force. As a result, the packaged light- . The heating conditions are maintained, the cutting position is found via a charge coupled device (CCD), and the light emitting diode is cut using a diamond wheel. After cutting, the light emitting diodes come off the heating bench with the adhesive layer. The temperature of the substrate of the light emitting diode bonded to the adhesive tape is lowered to 35 DEG C or lower, and the adhesive force of the adhesive tape is lost. Therefore, the cut patch-type light emitting diode is peeled from the adhesive tape. Since the crystallization reaction of the adhesive layer of the adhesive tape is reversible, the adhesive layer of the adhesive tape can be recycled without losing the adhesive force. Furthermore, crystallization is a physical reaction and does not involve any chemical reaction that can generate any harmful organic gas.

The adhesive properties of the adhesive layer include initial adhesive force, adhesive force, cohesive force and base adhesive force. The relationship of the four adhesion forces is an initial adhesion force <adhesion force <cohesion force <basic adhesion force. If the cohesive force of the adhesive tape where the light emitting diode is adhered is not sufficient, the adhesive residue can be observed after the light emitting diode substrate is peeled from the adhesive tape. In this case, the light emitting diode is contaminated, resulting in a reduced yield. In the case where a hydrocarbon radical such as acrylic acid or methacrylic acid and a hydrocarbyl ethylenically unsaturated monomer are contained, the cohesive force of the adhesive layer is influenced by the amount of unsaturated monomer having a hydrocarbon radical and an ethylene bond. When the amount of acrylic acid or methacrylic acid is 1% or less of the total amount of the adhesive layer, the cohesive force of the adhesive layer is insufficient. When the amount of acrylic acid or methacrylic acid is 2% or more of the total amount of the adhesive layer, the intramolecular hydrogen bonding of the adhesive layer is strengthened, the intermolecular force is reduced, the intramolecular sliding easily occurs, . Therefore, the optimum amount of acrylic acid or methacrylic acid is 1% to 2%. The cohesive force and the adhesive force of the adhesive layer can be improved by adding a crosslinking agent such as a polyisocyanate, a polyamine, a polyhydric alcohol, and an organic substance. However, if the addition amount of the crosslinking agent is excessive, the degree of crosslinking of the adhesive layer is excessively high, and therefore, the adhesive layer loses adhesiveness.

In an embodiment of the present invention, a light emitting diode is shown as an example. However, for example, a multilayer ceramic capacitor (MLCC), an inductor, or a transistor is all within the scope of the present invention, and the embodiment of the present invention is not intended to be limited thereto.

The invention is illustrated by the following examples, but it is not limited thereto.

Step 1: Preparation of adhesive layer

Example  One

200 parts of ethyl acetate, 35 parts of behenyl acrylate, 64 parts of methyl acrylate, 1 part of acrylic acid and 0.5 parts of dilauryl peroxide. The mixture was stirred, mixed and polymerized at 70 占 폚 for 12 hours to form the adhesive layer of Example 1.

Example  2

200 parts of ethyl acetate, 45 parts of behenyl acrylate, 52 parts of methyl acrylate, 3 parts of acrylic acid and 0.5 parts of dilauryl peroxide. The mixture was stirred, mixed and polymerized at 70 캜 for 12 hours to form the adhesive layer of Example 2.

Step 2: Preparation of adhesive tape

Example  3

The adhesive layer of Example 1 was added to ethyl acetate to prepare a solution containing 30% of the adhesive layer of Example 1 in ethyl acetate. 0.2% polyisocyanate was added as a crosslinking agent to a solution of 30% of the adhesive layer of Example 1 in ethyl acetate. Thereafter, the solution was coated on a PET film having a thickness of 100 mu m using a knife coater to prepare an adhesive tape of Example 3. [ The thickness of the adhesive was about 50 탆.

A peel force test (g / 25 mm) of the adhesive tape of Example 3 was performed in accordance with JIS C2107, and the results were recorded in Table 1. After the peel strength test, it was confirmed whether adhesive remnants remained, and the results were recorded in Table 2.

The peel strength test (g / 25 mm) of the adhesive tape of Example 3 was repeatedly performed at different temperatures in accordance with JIS C2107, and the results were recorded in Table 3a.

Example  4

An adhesive tape of Example 4 was produced in the same manner as in Example 3 except that the adhesive layer of Example 2 was used.

A peel strength test (g / 25 mm) of the adhesive tape of Example 4 was performed in accordance with JIS C2107, and the results were recorded in Table 1. After the peel strength test, it was confirmed whether adhesive remnants remained, and the results were recorded in Table 2.

Comparative Example

A UV curable adhesive tape commonly used for cutting patchy light emitting diodes is used as a control for comparison.

The peel strength test (g / 25 mm) of the adhesive tape of the comparative example was carried out before and after the UV irradiation at room temperature (25 ° C) according to JIS C2107, and the results were recorded in Table 3b.

[Table 1]

[Table 2]

[Table 3a]

[Table 3b]

Referring to Table 1, the adhesive tapes of Examples 3 and 4 were prepared from the adhesive layers of Examples 1 and 2, respectively. Through the above table, it can be seen that the adhesive tapes of Examples 3 and 4 do not have adhesive property at room temperature; At temperatures higher than room temperature, the adhesive tapes of Examples 3 and 4 start to exhibit adhesiveness at 50 캜 and 60 캜, respectively.

Referring to Table 2, the adhesive tapes of Examples 3 and 4 were prepared from the adhesive layers of Examples 1 and 2, respectively. However, the amount of acrylic acid (equivalent to 3 parts, 3%) in the adhesive layer of Example 3 exceeds the proposed range (1% to 2%) of the present invention. This is understood from the above description that the intramolecular hydrogen bonding of the adhesive layer is strengthened, the intermolecular force is reduced, the intramolecular sliding is easily generated, and the cohesive force of the adhesive layer is remarkably reduced. It can be seen from Table 2 that the adhesive residue can be observed after the adhesive tape of Example 4 is peeled off.

Referring to Table 3a, the adhesive tape of Example 3 is made of the adhesive layer of Example 1. It can be seen that the adhesive tape of Example 3 does not have adhesive properties at room temperature after being recycled four times. However, at temperatures higher than room temperature, the adhesive tape of Example 3 can maintain good adhesion at 50 캜, indicating that the adhesive tape can be recycled.

Referring to Table 3b, the adhesive tape of Example 4 is made of the adhesive layer of Example 2. After UV irradiation, the adhesive properties of the adhesive tape of Example 4 were lost, indicating that the adhesive tape could be recycled.

As such, the invention has been described and it will be obvious that the invention can be modified in various ways. Such modifications are not to be regarded as a departure from the spirit and scope of the invention, and all such modifications as would be obvious to one of ordinary skill in the art are deemed to be within the scope of the following claims.

Claims (11)

1. An adhesive layer of an adhesive tape for fixing electronic parts comprising a first compound, a second compound and a third compound having a structure represented by the following formula (1)
M in the first compound is 0 to 1 and n is 12 to 24;
M in the second compound is 0 to 1 and n is 1 to 5; And
M in the third compound is 0 to 1, and n is 0;
[Chemical Formula 1]

R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers. The method according to claim 1,
Wherein the content of the first compound is 30 wt% to 65 wt%, the content of the second compound is 30 wt% to 65 wt%, and the content of the third compound is 1 wt% to 2 wt%. The method according to claim 1,
Wherein the adhesive layer comprises a crosslinking agent. The method of claim 3,
Wherein the crosslinking agent is an isocyanate, a polyamine, or a polyhydric alcohol. A structure of an adhesive tape for fixing electronic parts comprising a film of a material for a component, an adhesive layer and a protective film,
Wherein the adhesive layer is formed by polymerizing a first compound, a second compound and a third compound having the structure of Formula 1 wherein m is 0 to 1 and n is 12 to 24, M is 0 to 1 and n is 1 to 5, m is 0 to 1 and n is 0 in the third compound,
[Chemical Formula 1]

R ₁ is C _m H _{2m +1} , R ₂ is C _n H _{2n +1} , and m and n are integers. 6. The method of claim 5,
Characterized in that the material film comprises an unsaturated polyester. 6. The method of claim 5,
Wherein the material film comprises at least one selected from the group consisting of polypropylene, polycarbonate, polyester, vinyl terephthalate and polyvinyl chloride. 6. The method of claim 5,
Wherein the content of the first compound is 30 wt% to 65 wt%, the content of the second compound is 30 wt% to 65 wt%, and the content of the third compound is 1 wt% to 2 wt%. 6. The method of claim 5,
Wherein the adhesive layer comprises a crosslinking agent. 10. The method of claim 9,
Wherein the crosslinking agent is an isocyanate, a polyamine, or a polyhydric alcohol. 6. The method of claim 5,
Wherein the protective film comprises paper, metal, or plastic.

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