KR20140071099A - optical transceiver module using silicon optical bench - Google Patents

optical transceiver module using silicon optical bench Download PDF

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Publication number
KR20140071099A
KR20140071099A KR1020120139065A KR20120139065A KR20140071099A KR 20140071099 A KR20140071099 A KR 20140071099A KR 1020120139065 A KR1020120139065 A KR 1020120139065A KR 20120139065 A KR20120139065 A KR 20120139065A KR 20140071099 A KR20140071099 A KR 20140071099A
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KR
South Korea
Prior art keywords
optical
receiving groove
grating coupler
silicon
bench
Prior art date
Application number
KR1020120139065A
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Korean (ko)
Inventor
강세경
이상수
Original Assignee
한국전자통신연구원
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Publication date
Application filed by 한국전자통신연구원 filed Critical 한국전자통신연구원
Priority to KR1020120139065A priority Critical patent/KR20140071099A/en
Publication of KR20140071099A publication Critical patent/KR20140071099A/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/43Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/40Transceivers

Abstract

The present invention relates to an optical transceiver module using an optical bench to increase optical coupling efficiency by converting the profile of a Gaussian form outputted from a light source to the profile of a plane wave to allow the profile incident into a grating coupler or by focusing an optical signal outputted from the grating coupler and transmitting an optical waveguide to increase interference conditions. The optical transceiver module comprises: a silicon optical bench (SiOB) fixed at one surface of a silicon photonics chip formed with the grating coupler and having a receiving groove recessed to the internal; and an optical device mounted on the receiving groove of the SiOB to transmit and receive the grating coupler and the optical signal.

Description

[0001] The present invention relates to an optical transceiver module using a silicon optical bench,

The present invention relates to an optical transceiver module using a silicon optical bench, and more particularly, to an optical transceiver module using a silicon optical bench for enhancing optical coupling efficiency between an optical device based on a silicon photonics and an external functional block.

Recently, as the cost, the speed, and the capacity of the optical communication system have been reduced, technologies for implementing the CMOS circuit based on the electronic circuit and the optical circuit on a single chip are getting more and more popular. These technologies have been studied for a long time since 10 years ago, and now there have been companies that offer foundries for these manufacturing processes.

As a silicon photonics-based optical circuit chip, there are an optical waveguide grating (AWG), an optical modulator (PN modulator), a PIN modulator, a ring modulator, a photodiode (Ge photodiode) A Y-branch, an optical filter, and an optical coupler (grating coupler, edge coupler) for external and optical coupling. The optical circuit implemented using the optical device is optically coupled to the outside using a grating coupler or a side coupler implemented on a silicon photonics. In the case of grating coupler, the optical alignment tolerance is relatively large, but it is sensitive to the wavelength. The side optical coupler has a disadvantage in that the optical alignment tolerance is very small regardless of the wavelength.

The physical size of the implemented optical waveguide on silicon photonics is about 0.5 um x 0.22 um. In addition, the refractive index of silicon, which is a core material, is about 3.5 and the refractive index of silicon oxide, which is a cladding material, is about 1.4. That is, the refractive index difference between the core and the cladding is considerably large and the size of the optical waveguide is so small that optical coupling to a single mode optical fiber is almost impossible.

Figure 1 shows a grating optical coupler implemented in Luxtera, USA. The grating optical coupler as described above has a grating 11 formed at one end of the optical waveguide 10 and a core 11 to be optically coupled with the grating 11 is formed in parallel with the refraction angle? So as to be optically coupled. Such a grating optical coupler has disadvantages in that it is sensitive to wavelengths and has a disadvantage that the height of the optical module is increased and the package becomes larger.

Fig. 2 shows a side-view optical combiner structure disclosed by Ghent University, a European silicon photonics research group. As shown in the figure, an inverted taper 31 is applied to the silicon optical waveguide and a polymer cladding 40 is formed on the top of the silicon optical waveguide to gradually decrease the effective refractive index of the silicon core 30, The optical signal is transferred to the silicon oxide located at the lower end of the silicon core 30 to increase the size of the optical mode from the side to about 3 占 퐉 x 3 占 퐉 so that optical coupling with the single mode optical fiber becomes possible. At this time, optical signal loss occurs in the optical signal transfer to the silicon oxide, and additional loss occurs in the optical coupling at the side.

SUMMARY OF THE INVENTION The present invention has been made in order to solve the above-mentioned problems of the related art, and it is an object of the present invention to provide a grating coupler which converts a Gaussian profile output from a conventional light source into a plane wave profile, And to increase the optical coupling efficiency by increasing the interference condition by transmitting to the waveguide.

According to an aspect of the present invention, there is provided an optical transmission / reception module using a silicon optical bench, comprising: a silicon optical bench fixed on one surface of a silicon photonics chip having a grating coupler formed therein, An optical bench (SiOB), and an optical element mounted in a receiving groove of the silicon optical bench and transmitting and receiving an optical signal with the grating coupler.

According to an embodiment of the present invention, the receiving groove includes a primary receiving groove formed inwardly of the silicon optical bench and a secondary receiving groove formed so as to form a step with the primary receiving groove.

According to an embodiment of the present invention, the optical device is provided with a light source including a VCSEL device, and the grating coupler receives the optical signal output from the optical device.

According to an embodiment of the present invention, the optical element is disposed in the secondary receiving groove, and a collimating lens for passing the light output from the optical element and outputting the parallel light to the primary receiving groove Lt; / RTI >

According to an embodiment of the present invention, the collimating lens changes the traveling direction of incident light so as to correspond to an allowable incidence angle of the grating coupler.

According to an embodiment of the present invention, the optical element is disposed in the primary receiving groove.

According to an embodiment of the present invention, the heights of the step formed between the primary receiving groove and the secondary receiving groove are different from each other, and the optical element is inclined at a predetermined angle to correspond to the allowable incident angle of the grating coupler And outputs an optical signal.

According to an embodiment of the present invention, the optical device is provided with an optical fiber, and receives the optical signal output from the grating coupler.

According to an embodiment of the present invention, the optical element is disposed in the secondary receiving groove, and a focusing lens for focusing and outputting the light output from the grating coupler is mounted in the primary receiving groove.

According to an embodiment of the present invention, a mirror surface is formed at one end of the optical element to reflect the optical signal output from the focusing lens at a specific angle and transmit the optical signal to the core inside the optical element.

According to the optical transmission / reception module using the silicon optical bench according to the present invention, the Gaussian profile output from the light source is converted into a plane wave profile to be incident on the grating coupler, or the optical signal output from the grating coupler is condensed, The optical coupling efficiency can be increased by increasing the interference condition.

In addition, miniaturization of the optical coupling module and the silicon photonics chip can be realized.

In addition, since the structure is simple, the productivity is improved, the manufacturing cost is reduced, and it is also applicable to various fields.

1 is a view showing a structure of a conventional optical coupler using a grating,
2 is a view showing a structure of a conventional side optical coupler,
FIG. 3 illustrates an optical coupling module using a silicon optical bench according to an embodiment of the present invention. FIG.
4 is a view illustrating an optical coupling module using a silicon optical bench according to another embodiment of the present invention.
5 is a view illustrating an optical coupling module using a silicon optical bench according to another embodiment of the present invention.

The present invention will now be described in detail with reference to the accompanying drawings. Here, the same reference numerals are used for the same components, and repeated descriptions and known functions and configurations that may obscure the gist of the present invention will not be described in detail. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Accordingly, the shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

3, the optical transmitter / receiver module using the silicon optical bench according to an embodiment of the present invention is fixed to one surface of a silicon photonics chip 10 having a grating coupler 11 formed therein, And optical devices 201 and 202 mounted on the receiving grooves 110 of the silicon optical bench 100 and transmitting and receiving optical signals to and from the grating coupler 11.

Although the grating coupler 11 formed on the silicon photonics chip 10 has been described above or described below as an example, the present invention is not limited thereto and may be applied to a variety of devices such as a multiplexer, a wide-band multiplexer, an optical waveguide, The optical element can be applied in place of the grating coupler.

The silicon optical bench 100 is fixed to one surface of the silicon photonics chip 10 on which the grating coupler 11 is formed and is provided with receiving grooves 110 recessed inward. The receiving groove 110 may be formed in a rectangular shape and both sides may be inclined to be formed in a V shape and an electrode pattern 20 may be formed on an inner surface of the receiving groove 110 .

The silicon optical bench 100 can facilitate the mounting of the collimating lens and the focusing lens as well as the optical elements 201 and 202 described below. The silicon optical bench 100 and the silicon photonics chip 10 may be connected in various ways, but may be connected through a solder bump 30 in particular.

The optical elements 201 and 202 are mounted on the receiving groove 110 of the silicon optical bench 100 and transmit and receive optical signals to and from the grating coupler 11 and may be made of a light source or an optical fiber. For this, a light emitting unit for transmitting an optical signal to the silicon photonics chip 10 or a light receiving unit for receiving an optical signal outputted from the silicon photonics chip 10 may be included.

According to an embodiment of the present invention, the receiving groove 110 includes a first receiving groove 111 formed inside the silicon optical bench 100 and a second receiving groove 111 formed between the first receiving groove 111 and the step 113, And a secondary receiving groove 112 formed to have a smaller diameter than the primary receiving groove 111 so as to form the second receiving groove 112.

When the receiving groove 110 is formed in a multi-step shape as described above, it is possible to more easily mount the collimating lens and the focusing lens, which will be described later, in addition to the optical elements 201 and 202 have. For example, optical elements 201 and 202 are mounted on the secondary receiving groove 112, and a step 103 formed between the primary receiving groove 111 and the secondary receiving groove 112 is provided with a collimating Devices for flickering or processing optical signals such as collimating lenses and focusing lenses may be implemented.

According to an embodiment of the present invention, the optical element 201 is provided as a light source including a VCSEL element, and the grating coupler 11 receives an optical signal output from the optical element 201.

According to an embodiment of the present invention, the optical element 201 is disposed in the secondary receiving groove 112 and the light output from the optical element 201 is passed through the primary receiving groove 111 And a collimating lens 300 for outputting collimated light is mounted. The optical signal output from the VCSEL device has a Gaussian profile. In the present invention, the collimating lens 300 is disposed as a means for converting the Gaussian profile into a plane wave profile and transmitting the profile to the photonics chip 10.

According to an embodiment of the present invention, the collimating lens 300 changes the traveling direction of incident light so as to correspond to an allowable incident angle of the grating coupler 11, and outputs the changed direction. The collimating lens 400 has a function of converting Gaussian light into a parallel beam shape and has a function of advancing an optical signal to a permissible incident angle of the grating coupler 11 on the photonics chip 10. [ A method of causing the optical signal to proceed with a certain angle through the collimating lens 11 is a method of reflecting the optical signal at the design of the collimating lens 11 and a method of reflecting off- set) can be applied.

Referring to FIG. 4, the optical element 201 is disposed in the primary receiving groove 110. That is, the structure in which the light source is disposed directly on the silicon photonics chip 10 optically coupled by using the grating coupler 11 is not structurally simple since means for deforming or machining the optical signal output from the light source is not additionally disposed can do.

According to an embodiment of the present invention, the height of the step 113 formed between the first receiving groove 110 and the second receiving groove 120 is different from that of the first receiving groove 110, And is mounted in a state of being tilted by a predetermined angle corresponding to the allowable incident angle of the light source 11 to output an optical signal.

That is, the optical element 201 is arranged to be inclined so as to output an optical signal at an allowable incident angle? Of the grating coupler 11. For this purpose, a height difference h1 is formed between the first receiving groove 110 and the second receiving groove 120 when the optical element 201 is mounted with a step difference in the height of the step 113 formed between the first receiving groove 110 and the second receiving groove 120 . The height h2 from the optical element 201 to the electrode solder portion formed at the end of the silicon optical bench 100 is calculated in consideration of the divergence angle of the light source and the coupling area of the grating coupler 11 on the photonic chip 10 Can be designed.

Referring to FIG. 5, the optical element 202 is provided with an optical fiber, and receives the optical signal output from the grating coupler 11.

The optical element 202 may include a core layer and a cladding layer. The optical signal output from the grating coupler 11 may be transmitted to the core layer of the optical device 202 through a focusing or reflecting process to pass the optical signal. In the above description, the optical signal output from the grating coupler 11 is received by the optical element 202, but the present invention is not limited thereto. Conversely, the optical signal output from the optical fiber- The grating coupler 11 can be transmitted.

According to an embodiment of the present invention, the optical element 202 is disposed in the secondary receiving groove 120, and the light output from the grating coupler 11 is condensed in the primary receiving groove 110 And a focusing lens 400 for outputting the image.

As described above, the focusing lens 400 is mounted on the primary receiving groove 110. The focusing lens 400 focuses the optical signal output from the grating coupler 11 and transmits the optical signal to the optical fiber type optical element 202. Since the focusing lens 400 is mounted on the silicon optical bench 100 , And can be protected from external impact or vibration. The optical element 202 is mounted in the secondary receiving groove 120 so that the optical element 202 is received in the secondary receiving groove 120 so that the optical element 202 can be easily mounted A third receiving groove can be formed, and the third receiving groove communicates with the passage through which the optical element 202 passes. The optical element 202 may be entirely accommodated in the third accommodating groove, but a part of the optical element 202 may be exposed in the second accommodating groove 120 and only a portion of the optical element 202 may be accommodated in the third accommodating groove.

According to an embodiment of the present invention, one end of the optical element 202 is formed to be inclined, and the optical signal output from the focusing lens 400 is reflected to a specific angle and transmitted to the core inside the optical element 202 A mirror surface 500 is formed. The focusing lens 400 focuses the optical signal output from the grating coupler 11 and outputs the optical signal with a specific angle θ and perpendicular to the optical element 202, 202, and then transmitted to the core of the optical device 202 to be optically coupled. In this case, an inclined surface corresponding to the inclination of the optical element 202 may be formed on one surface of the third receiving groove. The mirror surface 500 may be implemented by attaching a metal film to one end of the inclined optical element 202, and the mirror surface 500 may be disposed between the third inclined groove and the optical element 202 .

According to the optical coupling module using the silicon optical bench of the present invention as described above, the Gaussian profile output from the light source is converted into a plane-wave profile to be incident on the grating coupler, or the optical signal output from the grating coupler is condensed, It is possible to increase the optical coupling efficiency by increasing the interference condition by transmitting to the waveguide, and it is possible to realize miniaturization of the optical coupling module and the silicon photonics chip, and also the productivity is improved by the simple structure, the manufacturing cost is reduced, There are advantages that can be applied.

It will be apparent to those skilled in the art that various modifications, substitutions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are intended to illustrate and not to limit the technical spirit of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings . The scope of protection of the present invention should be construed according to the following claims, and all technical ideas falling within the scope of the same shall be construed as falling within the scope of the present invention.

10: Silicon Photonics Chip
11: Grating coupler
100: Silicon optical bench
110: receiving groove
111: primary receiving groove
112: Secondary receiving groove
113: step
201, 202: optical element
300: Collie mating stove
400: focusing lens
500: mirror face

Claims (10)

An optical transceiver module for optically coupling to a silicon photonics-based grating coupler,
A silicon optical bench (SiOB) fixed on one surface of the silicon photonics chip having the grating coupler formed therein and provided with receiving grooves formed therein;
And an optical element mounted in a receiving groove of the silicon optical bench and transmitting and receiving an optical signal to and from the grating coupler.
The method according to claim 1,
Wherein the receiving groove comprises a primary receiving groove formed inwardly of the silicon optical bench and a secondary receiving groove formed so as to form a step with the primary receiving groove. .
3. The method of claim 2,
Wherein the optical device is a light source including a vertical cavity surface emitting laser (VCSEL) device, and the grating coupler receives an optical signal output from the optical device.
The method of claim 3,
And a collimating lens for receiving the light output from the optical element and outputting the collimated light is mounted on the first accommodating groove in the second accommodating groove. Optical Transmit / Receive Module.
5. The method of claim 4,
Wherein the collimating lens changes the traveling direction of incident light so as to correspond to an allowable incident angle of the grating coupler and outputs the changed light.
The method of claim 3,
Wherein the optical element is disposed in the primary receiving groove.
The method according to claim 6,
The height of the step formed between the primary receiving groove and the secondary receiving groove is different and the optical element is mounted in a state of being tilted by a predetermined angle so as to correspond to an allowable incident angle of the grating coupler to output an optical signal Optical module using a silicon optical bench.
3. The method of claim 2,
Wherein the optical device comprises an optical fiber, and receives the optical signal output from the grating coupler.
9. The method of claim 8,
And a focusing lens for focusing and outputting the light output from the grating coupler is mounted on the primary receiving groove. The optical receiving and receiving apparatus using the silicon optical bench according to claim 1, module.
10. The method of claim 9,
Wherein one end of the optical element is formed to be inclined and a mirror surface for reflecting the optical signal output from the focusing lens at a specific angle and transmitting the optical signal to the core inside the optical element is formed.
KR1020120139065A 2012-12-03 2012-12-03 optical transceiver module using silicon optical bench KR20140071099A (en)

Priority Applications (1)

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KR1020120139065A KR20140071099A (en) 2012-12-03 2012-12-03 optical transceiver module using silicon optical bench

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3070209A1 (en) * 2017-08-17 2019-02-22 Robert Bosch Gmbh INTEGRATED OPTICAL SYSTEM AND METHOD FOR MANUFACTURING THE SAME
CN110637246A (en) * 2017-05-17 2019-12-31 法国原子能源和替代能源委员会 Photonic chip with integrated collimating structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110637246A (en) * 2017-05-17 2019-12-31 法国原子能源和替代能源委员会 Photonic chip with integrated collimating structure
FR3070209A1 (en) * 2017-08-17 2019-02-22 Robert Bosch Gmbh INTEGRATED OPTICAL SYSTEM AND METHOD FOR MANUFACTURING THE SAME

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