KR20140048354A - A heat sink comprising a metal mesh and fabricating method of the same - Google Patents

Abstract

The present invention relates to a heat sink and a method for manufacturing the same. The heat sink includes a base material; a metal mesh layer located on the base material; and an adhesive layer located between the base material and the metal mesh layer. The metal mesh layer includes a plurality of metal mesh patterns and a hole located between the metal mesh patterns. The base material, the metal mesh layer, and the adhesive layer are very thin in comparison with the heat sink of a general structure so that the heat sink is not big. Therefore, the heat sink does not influence determination on a product size.

Description

TECHNICAL FIELD [0001] The present invention relates to a heat sink including a metal mesh layer and a method of manufacturing the same,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink including a metal mesh layer and a method of manufacturing the same. More particularly, the present invention relates to a heat sink, To a heat sink and a method of manufacturing the same.

Generally, a heat sink is a device that attaches to a component generating high heat and spontaneously discharges the heat to the outside.

Particularly, the heat sink is attached to an element such as a microcomputer or a transistor used in an electronic product to prevent the performance of the element from being degraded due to the high heat generated in the element, or to prevent the element from being damaged due to overheating.

Metals such as aluminum, used as a common heat sink, have a very high thermal conductivity and a low specific heat, which allows the temperature to rise easily even at low calories.

Accordingly, the heat capacity of the conventional heat sink is small, so that the temperature of the heat generating element immediately reaches the saturation temperature which corresponds to the temperature of the heat generating element immediately after the heat generating element starts to heat, that is, the steady state temperature in which the temperature no longer changes over time.

Therefore, heat transfer due to conduction to the heat sink is no longer generated in the heat generating element, and heat generated in the heat generating element is not sufficiently discharged, thereby damaging the heat generating element.

Also, in designing a heat sink for heat dissipation of a heat-generating element that generates a lot of heat at the initial stage of operation of a product, such as a heat-generating element provided in an electric rice cooker, It is necessary to design a heatsink larger than necessary considering the saturation temperature.

That is, the heat sink included in the product used for one hour and the heat sink provided in the product used for 10 minutes had to be designed to have the same size.

In order to solve this problem, it is necessary to increase the heat dissipation area of the heat sink by increasing the price of the electronic device provided with the heat generating element and the heat sink, and increasing the size of the product. Can not.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a heat sink capable of reducing the size of a product by making it possible to downsize the heat sink and a method of manufacturing the heat sink.

The objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to solve the above-mentioned problems, the present invention provides a semiconductor device comprising: a base substrate; A metal mesh layer positioned on the base substrate; And an adhesive layer positioned between the base substrate and the metal mesh layer, wherein the metal mesh layer includes a plurality of metal mesh patterns and holes positioned between the metal mesh patterns.

Further, in the present invention, the adhesive layer includes a first adhesive layer and a second adhesive layer, and the metal mesh layer includes a first metal mesh layer and a second metal mesh layer, And the second adhesive layer is located between the second surface of the base substrate and the second metal mesh layer.

In the present invention, the adhesive layer includes a first adhesive layer and a second adhesive layer, and the metal mesh layer includes a first metal mesh layer and a second metal mesh layer, and the first metal mesh layer includes a plurality of first metal mesh layers Wherein the second metal mesh layer comprises a plurality of second metal mesh patterns, wherein the first adhesive layer is positioned between the first surface of the base substrate and the first metal mesh pattern, The second adhesive layer provides a heat sink located between the second surface of the base substrate and the second metal mesh pattern.

The present invention also provides a method of manufacturing a semiconductor device, comprising: providing a base substrate; Providing a metal mesh layer comprising a plurality of metal mesh patterns and holes positioned between the metal mesh patterns; Forming an adhesive layer on the metal mesh layer; And positioning and bonding the adhesive layer on the base substrate.

In the present invention, the metal mesh layer may include a first metal mesh layer and a second metal mesh layer, and the step of forming an adhesive layer on the metal mesh layer may include forming a first adhesive layer on the first metal mesh layer And forming a second adhesive layer on the second metal mesh layer, wherein the first adhesive layer is located on a first side of the base substrate and the second adhesive layer is located on a second side of the base substrate A method of manufacturing a heat sink is provided.

Further, the present invention provides a method of manufacturing a heat sink, further comprising a second water rinsing step of washing the metal mesh layer on which the adhesive layer is formed, after forming the adhesive layer on the metal mesh layer.

According to another aspect of the present invention, the step of providing the metal mesh layer includes: providing a pole master including a mesh having a shape corresponding to a shape of a metal mesh layer to be manufactured; At least any one of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe), cobalt (Co), and alloys thereof dissolved in an electrolytic solution is electrodeposited Electrodepositing the metal mesh by electrodeposition; An electrodeposited layer peeling step of peeling the metal mesh from the mesh; And a number of electrodeposition layers for washing the peeled electrodeposited layer.

The step of providing the metal mesh layer may include providing a metal mesh layer including a protective film, positioning the metal mesh layer on the adhesive layer, compressing the metal mesh layer, And removing the protective film. The present invention also provides a method of manufacturing a heat sink.

In the present invention, the step of providing the metal mesh layer including the protective film may include a step of applying an adhesive to the protective film in the step of peeling the electrodeposited layer, laminating the adhesive on the metal mesh formed on the mesh, Wherein the step of peeling the protective film and the metal mesh simultaneously or the step of attaching the protective film and the metal mesh to a protective film on a metal mesh cloth washed through three steps of the electrodeposition layer.

According to the present invention as described above, since the thickness of the base substrate, the metal mesh layer, and the adhesive layer constituting the heat sink is extremely thin compared with the heat sink having the general structure, the heat sink itself is not made large, The heat sink does not have a large influence on the size determination.

Further, since the heat sink according to the present invention can be manufactured with a very thin thickness, it is possible to apply the heat sink to a component of an electronic device which is getting smaller and smaller.

Further, since the heat sink according to the present invention is easily manufactured in a large area, it is also possible to apply the heat sink to a component of a large-sized electronic product.

1 is a sectional view showing a general heat sink.
FIG. 2A is a cross-sectional view illustrating a heat sink according to a first embodiment of the present invention, and FIG. 2B is a cross-sectional view illustrating a heat sink according to a second embodiment of the present invention.
FIG. 2C is a sectional view showing an application example of the heat sink according to the first embodiment of the present invention, and FIG. 2D is a sectional view showing an application example of the heat sink according to the second embodiment of the present invention.
FIG. 3A is a schematic perspective view showing a mesh type cathode drum of the apparatus for manufacturing a metal mesh according to the present invention, FIG. 3B is a sectional view showing a part of the mesh cathode drum, FIG. 3C is a cross- FIG. 3D is a process flow chart showing a method of manufacturing a metal mesh according to the present invention. FIG.
4A to 4D are cross-sectional views illustrating a method of manufacturing the heat sink according to the present invention.
FIG. 5A is a schematic structural view for manufacturing a heat sink according to the first embodiment of the present invention, FIG. 5B is a process flowchart showing a method of manufacturing the heat sink according to the first embodiment of the present invention, 5c are schematic structural diagrams for manufacturing a heat sink according to a second embodiment of the present invention.
FIG. 6A is a schematic structural view for manufacturing a heat sink according to a modification of the first embodiment of the present invention, FIG. 6B is a view showing a process for manufacturing a heat sink according to a modification of the first embodiment of the present invention And FIG. 6C is a schematic configuration diagram for manufacturing a heat sink according to a modification of the second embodiment of the present invention.
FIG. 7A is a view showing an example of a metal mesh layer according to the present invention, and FIG. 7B is a view showing another example of a metal mesh layer according to the present invention.
8A is a cross-sectional view illustrating a heat sink according to a third embodiment of the present invention, FIG. 8B is a cross-sectional view illustrating a heat sink according to a fourth embodiment of the present invention, FIG. 8C is a cross- Sectional view showing the heat sink according to the second embodiment of the present invention.
FIG. 9A is a photograph showing a cross section of a metal mesh pattern of a heat sink according to a third embodiment of the present invention, FIG. 9B is a photograph showing a cross section of a metal mesh pattern of a heat sink according to the fourth embodiment of the present invention And FIG. 9C is a photograph showing a cross section of the metal mesh pattern of the heat sink according to the fifth embodiment of the present invention.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Is provided to fully convey the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. &Quot; and / or "include each and every combination of one or more of the mentioned items. ≪ RTI ID = 0.0 >

Although the first, second, etc. are used to describe various components, it goes without saying that these components are not limited by these terms. These terms are used only to distinguish one component from another. Therefore, it goes without saying that the first component mentioned below may be the second component within the technical scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. The terms " comprises "and / or" comprising "used in the specification do not exclude the presence or addition of one or more other elements in addition to the stated element.

Unless defined otherwise, all terms (including technical and scientific terms) used herein may be used in a sense commonly understood by one of ordinary skill in the art to which this invention belongs. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The terms spatially relative, "below", "beneath", "lower", "above", "upper" And can be used to easily describe a correlation between an element and other elements. Spatially relative terms should be understood in terms of the directions shown in the drawings, including the different directions of components at the time of use or operation. For example, when inverting an element shown in the figures, an element described as "below" or "beneath" of another element may be placed "above" another element . Thus, the exemplary term "below" can include both downward and upward directions. The components can also be oriented in different directions, so that spatially relative terms can be interpreted according to orientation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a sectional view showing a general heat sink.

Referring to FIG. 1, a general heat sink includes a plate-like heat sink 20 attached to a heat-generating element 10 so as to absorb heat generated by the heat-generating element 10 and rapidly dissipate heat, And a plurality of radiating fins (50) formed on the upper surface of the heat dissipating plate to radiate more heat by enlarging the area.

At this time, the heat sink may be made of a material having a high thermal conductivity such as aluminum so as to rapidly dissipate the heat generated from the heat dissipation element 10.

Heat generated in the heat generating element during operation of the electronic product is conducted to the plurality of heat dissipating fins (50) through the heat sink (20) of the heat sink attached to the heat generating element, and then is discharged to the surrounding air.

That is, the heat radiating fin 50 of the heat sink widens the heat radiating area of the heat generated in the heat generating element, and the heat is released more quickly and smoothly.

However, as described above, since the heat capacity of the general heat sink is small, the temperature of the heat generating element immediately reaches the saturation temperature corresponding to the temperature of the heat generating element, that is, the steady state temperature in which the temperature no longer changes over time do.

Therefore, the heat generated by the heating element is not sufficiently generated by heat conduction from the heating element to the heat sink, so that the heat generated by the heating element is not sufficiently discharged, thereby damaging the heating element. To solve this problem, The heat dissipation area should be increased.

However, increasing the size of the heat sink is ultimately associated with increasing the size of the product, and therefore, may cause the price of the electronic device equipped with the heat generating element and the heat sink to increase.

FIG. 2A is a cross-sectional view illustrating a heat sink according to a first embodiment of the present invention, and FIG. 2B is a cross-sectional view illustrating a heat sink according to a second embodiment of the present invention.

First, referring to FIG. 2A, a heat sink 100 according to a first embodiment of the present invention includes a base substrate 110.

The base substrate 110 has a structure for absorbing heat generated in a heat generating element and may be formed of a metal such as carbon, nickel or the like on the surface of stainless steel, nickel, copper, iron, aluminum, titanium or an alloy thereof, aluminum, , Titanium, or silver can be used. Of these, aluminum or an aluminum alloy is preferable.

2A, a heat sink 100 according to the first embodiment of the present invention includes a first metal mesh layer 130a located on a first surface of the base substrate 110, And a second metal mesh layer 130b positioned on a second side of the first metal mesh layer 110. [

The first metal mesh layer 130a or the second metal mesh layer 130b receives heat from the base substrate serving as a heat dissipating plate and serves as a heat dissipating fin for discharging heat. The metal mesh may be made of at least one of silver (Ag), chrome (Cr), nickel (Ni), iron (Fe), cobalt (Co), aluminum (Al) The material of the layer is not limited, but aluminum or an aluminum alloy is preferable among them.

At this time, the first metal mesh layer 130a includes a first hole 132a located between the first metal mesh patterns 131a, and the second metal mesh layer 130b includes a plurality of And a second hole 132b located between the two metal mesh patterns 131b.

2A, a heat sink 100 according to the first embodiment of the present invention includes a first metal mesh layer 130a disposed between a first surface of the base substrate 110 and the first metal mesh layer 130a, 1 adhesive layer 120a and a second adhesive layer 120b positioned between the second surface of the base substrate 110 and the second metal mesh layer 130b.

More specifically, the first adhesive layer is located between the first surface of the base substrate 110 and the first metal mesh pattern 131a, and the second adhesive layer is located between the second surface of the base substrate 110 And is located between the second metal mesh patterns 131b.

The first adhesive layer 120a and the second adhesive layer 120b are for attaching the metal mesh layer on the base substrate 110. The first adhesive layer and the second adhesive layer may be solder layers, May be made of lead (Pb), tin (Sn), zinc (Zn), indium (In), cadmium (Cd), bismuth (Bi)

That is, the heat sink 100 according to the first embodiment of the present invention includes the metal mesh layers 130a and 130b formed on the first and second surfaces of the base substrate 110, respectively, Includes holes 132a and 132b positioned between the metal mesh patterns 131a and 131b and metal mesh patterns 131a and 131b, respectively, and at this time, The adhesive layers 120a and 120b.

At this time, the holes located between the metal mesh patterns may enlarge the heat dissipation area, so that more heat can be emitted.

That is, the heat sink according to the present invention absorbs heat generated in the heat generating element through the base substrate, and the metal mesh pattern receives heat from the base substrate to emit heat. At this time, The holes located between the heat dissipation areas can widen the heat dissipation area to allow more heat to be emitted.

At this time, as described later, the thickness of the base substrate may be 1 to 100 mu m.

The metal mesh layer 130 may have a width of 1 to 500 μm and the metal mesh layer may have a thickness of 1 to 500 μm. The distance between the metal mesh pattern and the metal mesh pattern, ie, The size of the hole located between the adjacent holes may be 1 mu m to 3 mm.

The thickness of the first adhesive layer or the second adhesive layer may be 1 to 20 占 퐉.

As described above, the heat sink of a general heat sink has a small heat capacity, so that a heat sink must be made large and the heat dissipating area thereof must be increased. In order to increase the size of the product, .

However, since the thickness of the base substrate, the metal mesh layer, and the adhesive layer is extremely thin as compared with the heat sink having the general structure, as can be seen from the manufacturing method of the heat sink as described later, The sink itself is not made large, and therefore, the heat sink does not have a large influence in determining the size of the product.

Further, since the heat sink according to the present invention can be manufactured with a very thin thickness, it is possible to apply the heat sink to a component of an electronic device which is getting smaller and smaller.

Further, since the heat sink according to the present invention can be easily manufactured in a large area, as can be seen from a manufacturing method of a heat sink to be described later, the heat sink can be applied to a component of a large-sized electronic product.

2B, the heat sink 200 according to the second embodiment of the present invention includes a base substrate 210 and a metal mesh layer 230 disposed on the base substrate 210, The metal mesh layer 230 includes a plurality of metal mesh patterns 231 and holes 232 located between the metal mesh patterns 231.

The heat sink 200 according to the second embodiment of the present invention includes an adhesive layer 220 positioned between the base substrate 210 and the metal mesh pattern 231.

That is, in the heat sink 200 according to the second embodiment of the present invention, the metal mesh layer 230 is formed on only one side of the base substrate 210, On the first and / or second surface of the substrate.

Since the heat sink according to the second embodiment can be the same as the heat sink according to the first embodiment except for the above, a detailed description will be omitted below.

FIG. 2C is a sectional view showing an application example of the heat sink according to the first embodiment of the present invention, and FIG. 2D is a sectional view showing an application example of the heat sink according to the second embodiment of the present invention.

Referring to FIG. 2C, the heat sink 100 according to the first embodiment of the present invention includes:

A base substrate 110, a metal mesh layer 130 located on the base substrate; And an adhesive layer (120) positioned between the base substrate and the metal mesh layer. The metal mesh layer includes a plurality of metal mesh patterns (131) and holes (132) positioned between the metal mesh patterns ).

Any one surface of the heat sink 100 is installed in a certain region of the heat generating element 10.

At this time, one surface of the heat sink 100 facing the heat generating element 10 may function as a heat sink, and the other surface of the heat sink 100, which is the surface opposite to the surface facing the heat generating element 10, .

That is, in FIG. 2C, the second metal mesh layer 130b and the base substrate 110 serve as a heat sink to absorb heat generated in the heat generating element, and the first metal mesh layer 130a receives heat from the heat sink Heat may be released. At this time, the holes 132a positioned between the metal mesh patterns may enlarge the heat dissipation area to allow more heat to be emitted.

Although the surface on which the second metal mesh layer 130b is disposed faces the heating element, the surface on which the first metal mesh layer 130a is located may face the heating element. It is natural.

Next, referring to FIG. 2D, the heat sink 200 according to the second embodiment of the present invention

And a metal mesh layer 230 positioned on the base substrate 210. The metal mesh layer 230 includes a plurality of metal mesh patterns 231 and a plurality of metal mesh patterns 231, And an adhesive layer 220 interposed between the base substrate 210 and the metal mesh pattern 231. The hole 232 is formed on the base substrate 210,

The surface of the base substrate of the heat sink 200 is installed in a certain region of the heat generating element 10.

At this time, the base substrate 210 acts as a heat sink to absorb heat generated in the heat generating element, and the metal mesh layer 230 can receive heat from the heat sink to emit heat. At this time, The holes 232 located between the heat dissipation plates 224 and 226 may widen the heat dissipation area to allow more heat to be emitted.

In this case, in the present invention, the thickness of the base substrate may be 1 to 100 μm, the thickness of the metal mesh layer may be 1 to 500 μm, and the thickness of the adhesive layer may be 1 to 20 μm, Since the thickness of the base substrate, the metal mesh layer, and the adhesive layer is extremely thin compared with the heat sink having a general structure, the heat sink according to the invention is not made large, and therefore, It does not have a big influence.

Hereinafter, a method of manufacturing the heat sink according to the present invention will be described.

FIG. 3A is a schematic perspective view showing a mesh type cathode drum of the apparatus for manufacturing a metal mesh according to the present invention, FIG. 3B is a sectional view showing a part of the mesh cathode drum, FIG. 3C is a cross- FIG. 3D is a process flow chart showing a method of manufacturing a metal mesh according to the present invention. FIG.

3A and 3B, the mesh-type cathode drum 40 of the apparatus for manufacturing a metal mesh according to the present invention includes a rotating shaft 41b which is centered for rotation and a cylindrical shaft 41b which surrounds the rotating shaft 41b and has a constant width The branch includes a cylindrical drum 41a.

At this time, a chain connected to a motor that provides a rotational force to rotate the drum 41a may be coupled to one end of the rotation shaft 41b.

On the other hand, a mesh 42 having a shape to be manufactured is formed on the surface of the drum 40. At this time, the mesh 42 may be formed in a net shape having a plurality of hexagons connected to each other, and may be formed in a honeycomb shape, but the shape of the mesh may be a square, a triangle, a pentagon, But the shape of the mesh is not limited in the present invention.

The mesh 42 may be formed of a single metal or an alloy depending on the component of the electrolytic solution to be plated and may be integrally formed with the cylindrical drum 41a by directly processing the surface of the cylindrical drum 41a, Or by attaching to the surface of the cylindrical drum 41a a mesh 50 which is formed into a weaving type or a batch type which is formed by weaving a thread with a metal wire.

3A and 3B, an insulating layer 43 is disposed in a space between the mesh 42 and the mesh 42, and the insulating layer is made of a plastic such as an epoxy resin, a Teflon-based resin, Resin.

In this case, the insulating layer 43 may be formed in the space between the mesh and the mesh by forming a mesh 42 having a desired shape on the surface of the cylindrical drum 41a as described above, The insulating material may be applied by a vapor deposition method and planarized by a known chemical mechanical polishing (CMP) process.

Thereafter, a metal mesh layer (not shown) is formed on the mesh 42 on the surface of the mesh-type cathode drum through the mesh-type cathode drum 40 by the electroplating process, and the metal mesh layer (not shown) So that the metal mesh can be formed by the electrolytic process.

The mesh type negative electrode drum corresponds to a pole master. In the present invention, the pole master includes a mesh having a shape corresponding to the shape of the metal mesh layer to be fabricated so that the metal mesh layer can be formed by the electrolytic process. And may be of a drum type as shown in FIG. 3A, or may be of a flat plate type. Accordingly, in the present invention, the pole master for the electrolytic process may be a drum type or a flat type.

That is, the electric pole master according to the present invention includes a base plate and a mesh formed on the base plate and having a shape corresponding to the shape of the metal mesh layer to be manufactured. When the shape of the base plate is a drum shape, The pole master according to the present invention may be a drum type, and when the shape of the base plate is a flat type, the pole master according to the present invention may be a flat type.

Hereinafter, formation of the metal mesh layer through the mesh type negative electrode drum as described above will be described.

Referring to FIG. 3C, the continuous electric apparatus for manufacturing a metal mesh according to the present invention includes an electrolytic bath 34 for containing an electrolytic solution to be plated, and an electrolytic bath 34 for electrolytically supplying a part of electrolytic solution to the electrolytic bath 34 An anode basket (31) formed so as to be completely immersed in the electrolytic solution of the electrolytic bath (34) and formed in a shape corresponding to the mesh type cathode drum (40) ).

The electrolyte may be at least one selected from the group consisting of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe), cobalt (Co) And alloys thereof. However, the kind of the electrolytic solution is not limited in the present invention.

3C, the electrolytic bath 34 has a semicylindrical shape which is drilled downward at the central lower surface. In the electrolytic bath 34, an electrolytic solution to be plated is formed on the surface of the mesh-type cathode drum 40 Lt; / RTI >

A structure in which the auxiliary tank 30 containing the electrolytic solution overflowing from the electrolytic bath 34 is formed in the lower part of the electrolytic bath 34 and the electrolytic solution is accommodated is constructed by a dual structure of the electrolytic bath 34 and the auxiliary tank 30 .

Therefore, about half of the rotating, mesh-like cathode drum 40 is immersed in the electrolytic bath 34, and the electrolytic solution injected from the electrolytic solution spraying channel 32, which will be described later, The electrolytic solution is stirred and the electrolytic solution overflowing the electrolytic bath 34 is received in the auxiliary tank 30 while the electrolytic solution is stirred by injecting the electrolytic solution in the electrolytic solution injection path 32.

The electrolytic bath 34 is provided with a mesh-type cathode drum 40 which is immersed in the electrolytic solution by about half of the electrolytic solution.

The mesh type negative electrode drum 40 is connected to a cathode of an applied power source and includes a rotating shaft 41b which is centered for rotation and a cylindrical drum 41a which surrounds the rotating shaft 41b and has a constant width .

Although not shown in the drawing, a power supply device for supplying a negative (-) voltage from the rectifier is provided at one end of the rotary shaft 41b, and a rotating force is applied to the other end of the cylindrical drum 41a to rotate the cylindrical drum 41a The motor can be coupled.

Accordingly, when power is applied to the motor to generate rotational power, the rotational power is transmitted to the rotating shaft 41b to rotate the cylindrical drum 41a.

3A, on the surface of the cylindrical drum 41a, a mesh 42 having a shape corresponding to a plurality of holes (132a and 132b in FIG. 2A) included in a metal mesh to be manufactured is formed In the embodiment of the present invention, the mesh 42 may be formed in a net shape in which a plurality of hexagons are connected to each other so as to have a honeycomb shape.

This will refer to the bar described with reference to FIG. 3A, and therefore, a detailed description of the mesh type cathode drum will be omitted.

A cathode basket 31 formed of an insoluble anode (+) or titanium (Ti) is provided under the mesh cathode drum 40.

The anode basket 31 is formed so as to have an arc shape in which the anode basket 31 is completely immersed in the electrolytic solution of the electrolytic cell 34 and is half-cut so as to correspond to the mesh-type cathode drum 40,

A metal cluster (33) having the same composition as the electrolytic solution of the electrolytic bath (34) can be accommodated inside the anode basket (31).

The metal clusters 33 are enclosed in a detachment prevention net that prevents the metal clusters 33 from being released into the electrolytic bath 34 from the inside of the anode basket 31.

The metal clusters 33 are melted in the electrolytic solution of the electrolytic bath 34 with the same mass of metal as the electrolytic solution of the electrolytic bath 34 to thereby adjust the amount and concentration of the electrolytic solution plated on the surface of the cylindrical drum 41a Can be performed.

Therefore, when a current is applied to the anode basket 31, positive ions dissolved from the metal clusters 33 move to the surface of the cylindrical drum 41a and are electrodeposited to be plated.

An electrolyte injection path 32 for injecting an electrolyte to stir the electrolytic solution of the electrolytic bath 34 may be formed at the lower end of the electrolytic bath 34 and more specifically at the center of the lower end of the anode basket 31, The injection path 32 may be formed of a cylindrical plastic pipe having a long inside and communicating with the inside of the electrolytic bath 34.

Therefore, when the electrolytic solution is injected into the electrolytic bath 34 through the electrolytic solution injecting channel 32, the electrolytic solution in the electrolytic bath 34 is agitated and the hydrogen generated from the mesh type negative electrode drum 40 H ₂ ) gas can be smoothly removed.

Although not shown in the drawing, the continuous electrophotographic apparatus may further include a circulation-filtering means. The circulation-filtering means circulates the electrolytic solution in the auxiliary tank 30 to the electrolytic bath 34, However, since this is a general configuration, a detailed description will be omitted below.

3C, a guide roller 51 for peeling the metal mesh 50 to be plated on the outer circumferential surface of the cylindrical drum 41a is provided at the upper right portion of the mesh type cathode drum 40 And a washing tub 60 for washing the surface of the metal mesh 50 may be provided.

A winding roller 70 may be provided on the right side of the washing tub 60 and the winding roller 70 may continuously wind the washed metal mesh 50 while passing through the washing tub 60.

Hereinafter, a method of manufacturing the metal mesh using the continuous electric pole apparatus will be described with reference to FIG. 3D.

First, the electrolytic solution in the electrolytic bath 34 is energized by an applied power source to cause electrolysis to occur, and the electrolytic solution is injected into the electrolytic bath 34 by the electrolytic solution injection channel 32, The electrolytic solution stirring step (S10) is carried out. However, in the present invention, the electrolytic solution stirring step is optional and may be omitted in some cases.

After the electrolytic solution stirring step S10 is performed, a drum rotating step S20 is performed to rotate the mesh-type cathode drum 40 installed in the electrolytic bath 34. At this time, in the case of the drum rotation step, it corresponds to a case where the pole master is a drum type, and may be omitted when the pole master is a flat plate type.

At least any one or more of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe), cobalt (Co), aluminum (Al) For example, an electrodepositing step (S30) for forming a metal mesh layer by electrodeposition of copper (Cu) on the upper surface of the mesh is performed.

The current density in the electrodeposition step S30 may be 0.1 to 30 mA / cm < 2 >. However, the present invention does not limit the current density range. Depending on the substance to be electrodeposited, .

 For example, a range of 0.1 to 1 mA / cm < 2 > may be in a range where the electrodeposition of copper (Cu) is actively generated, and a range of 3 to 15 mA / May be a range in which electrodeposition is actively generated.

It is also preferable to perform the electrodeposition of the metal mesh layer within a certain temperature range of the electrolyte solution so that the electrodeposition of the metal mesh layer can be more actively deposited in the current density range.

For example, the copper (Cu) or nickel (Ni) may actively perform electrodeposition when the temperature of the electrolytic solution is 10 to 50 ° C. However, the temperature of the electrolytic solution is not limited in the present invention.

After the electrodepositing step S30 is completed according to the above conditions, a metal mesh layer is formed on the outer surface of the mesh-type cathode drum 40, more specifically, on the mesh (42 of FIG. 3B).

After the electrodepositing step S30, an electrodeposited layer peeling step (S40) for peeling the metal mesh layer from the outer surface of the mesh-type cathode drum 40, specifically, the mesh, is continued.

The electrodeposited layer peeling step (S40) advances while the metal mesh layer attached to the outer surface of the mesh type cathode drum (40) is guided to the upper right by the rotation of the guide roller (51).

More specifically, an adhesive is applied to a protective film (not shown) such as PET, PC, PMMA and the like, laminated on the metal mesh layer formed on the mesh of the mesh type negative electrode drum, And the metal mesh layer are peeled at the same time, and the metal mesh 50 can be formed by the electrolytic process.

After the electrodeposition layer peeling step S40, three steps of electrodeposition layer S50 are performed in which the metal mesh 50 separated from the mesh cathode drum 40 is dipped in the washing tank 60 and washed with water, The metal mesh 50 washed three times by the number of electrodeposited layers (S50) is wound on the take-up roller 70, and the metal mesh winding step S60 is performed.

When all the above steps are completed, the metal mesh 50 can be stored in the wound state on the take-up roller 70, and it can be applied to various fields by cutting the metal mesh 50 according to the required length and shape.

On the other hand, in the step of peeling the electrodeposition layer, an adhesive is applied to a protective film (not shown) and laminated on the metal mesh layer formed on the mesh of the mesh type negative electrode drum, It is also possible to separate only the metal mesh layer from the mesh of the mesh type negative electrode drum without a separate protective film. However, it is also possible to separate the metal mesh layer from the mesh of the mesh type negative electrode drum In this case, since the thickness of the metal mesh layer is thin, it is difficult to handle in the process. Therefore, the metal mesh 50 washed by the three electrodeposition step (S50) may be attached to a separate protective film.

As described above, in the present invention, the metal mesh layer can be formed through the continuous electric pole for metal mesh production, and the formed metal mesh layer can be used as the metal mesh layer of the heat sink as described above.

4A to 4D are cross-sectional views illustrating a method of manufacturing the heat sink according to the present invention. Hereinafter, a method of manufacturing the heat sink according to the present invention will be described with reference to a method of manufacturing the heat sink according to the first embodiment of the present invention shown in FIG. 2A.

First, referring to FIG. 4A, the metal mesh layer 130 is manufactured through the metal mesh manufacturing apparatus as described above.

Meanwhile, in the above description, the metal mesh layer is manufactured by the electroforming method through the continuous electrodeposition device. Alternatively, the metal mesh layer may be manufactured by weaving or machining, But not limited to,

In this case, the width d1 of the metal mesh layer 130 may be 1 to 500 μm, the thickness d2 of the metal mesh layer may be 1 to 500 μm, and the distance between the metal mesh pattern 130 and the metal mesh pattern That is, the size of the hole 132 located between the metal mesh patterns 131 may be 1 μm to 3 mm, but these numerical values are not limited in the present invention.

Referring to FIG. 4A, an adhesive layer 120 is formed on one surface of the metal mesh layer 130.

The adhesive layer 120 may be a solder layer, and the solder layer may be formed by a known electrolytic plating method or electroless plating method. However, the method of forming the solder layer in the present invention is not limited thereto.

For example, the solder layer can be formed by a known printing method. More specifically, the solder layer can be formed by printing a conductive paste containing Sn, such as PbSn or CuAgSn.

At this time, the thickness d3 of the adhesive layer may be 1 to 20 占 퐉, but the numerical values are not limited thereto.

Next, referring to FIG. 4B, a base substrate 110 is prepared.

At this time, the thickness d4 of the base substrate 110 may be 1 to 100 탆, but the numerical values are not limited thereto.

Next, referring to FIG. 4C, a metal mesh layer having an adhesive layer formed on one surface thereof is placed on the base substrate, and then the metal mesh layer is pressed on the base substrate through a pressing roller.

More specifically, a first metal mesh layer 130a having a first adhesive layer 120a formed on one surface thereof is placed on the first surface of the base substrate, and a second metal mesh layer 130b having a second adhesive layer 120b formed on one surface thereof 130b are positioned on the second surface of the base substrate and then the metal mesh layer is pressed through a pressing roller to form a first metal mesh layer on the first surface of the base substrate, A second metal mesh layer may be formed on two sides.

At this time, in order to improve adhesion characteristics between the adhesive layer and the base material, it is preferable to apply a certain temperature to the first metal mesh layer and the second metal mesh layer, have.

Thus, a heat sink including the metal mesh layer according to the present invention can be manufactured,

4d, the heat sink 100 according to the first embodiment of the present invention includes metal mesh layers 130a and 130b formed on the first and second surfaces of the base substrate 110, respectively, And the metal mesh layer includes a plurality of metal mesh patterns 131a and 131b and holes 132a and 132b located between the metal mesh patterns, And adhesive layers 120a and 120b for adhering.

Hereinafter, a method for manufacturing the heat sink according to the present invention will be described in more detail.

FIG. 5A is a schematic structural view for manufacturing a heat sink according to the first embodiment of the present invention, FIG. 5B is a process flowchart showing a method of manufacturing the heat sink according to the first embodiment of the present invention, 5c are schematic structural diagrams for manufacturing a heat sink according to a second embodiment of the present invention. However, the method of manufacturing the heat sink according to the second embodiment of the present invention may be the same as the method of manufacturing the first embodiment, except as described below. .

5A and 5B, a method of manufacturing the heat sink according to the first embodiment of the present invention includes: preparing a metal mesh layer 1021 through the metal mesh manufacturing apparatus as described above, (S100).

At this time, as described above, the metal mesh layer may include holes between the metal mesh pattern and the metal mesh pattern, which are as described above, and thus a detailed description thereof will be omitted.

On the other hand, as shown in Figure 5a, in the heat sink according to the first embodiment of the present invention, in order to supply the metal mesh layer to the first surface and the second surface of the base substrate, the supply portion 1020a of the metal mesh layer , 1020b) may be located on the first and second surfaces of the base substrate, respectively.

That is, a metal mesh layer first supply portion 1020a for providing a first metal mesh layer on the first surface of the base substrate and a metal mesh layer second supply portion 1020b for providing a second metal mesh layer on the second surface of the base substrate, Gt; 1020b. ≪ / RTI >

Since the processes of the first metal mesh layer and the second metal mesh layer are the same, the first metal mesh layer and the second metal mesh layer are not distinguished from each other and are referred to as a metal mesh layer do.

Next, the metal mesh layer is pretreated (S110).

The pretreatment may be a general chemical pretreatment. The chemical pretreatment may be performed by immersing the object material, that is, the metal mesh layer, into an acidic or alkaline solution, such as pickling and degreasing, , Contaminants, impurities, and the like.

In the present invention, the pretreatment may be a chemical pretreatment method by immersing the metal mesh layer in the pretreatment water tanks 1021a and 1021b containing the pretreatment solution. However, the method of pretreatment in the present invention is not limited thereto, , The pre-processing step may be omitted.

Next, the pretreated metal mesh layer is subjected to a first water washing step (S120).

The first water washing step is a step for removing the pretreatment solution used in the pretreatment step and may be performed by immersing the metal mesh layer in the first water storage tank 1022a or 1022b containing the water wash solution. However, the method of washing in the present invention is not limited, and if necessary, the first washing step may be omitted.

Next, an adhesive layer is formed on the metal mesh layer (S130).

The adhesive layer may be a solder layer, and the solder layer may be formed by a known electrolytic plating method or electroless plating method by immersing the metal mesh layer in a plating water tank 1023a, 1023b containing a plating liquid However, the method of forming the solder layer in the present invention is not limited thereto.

For example, the solder layer can be formed by a known printing method. More specifically, the solder layer can be formed by printing a conductive paste containing Sn, such as PbSn or CuAgSn.

At this time, a first adhesive layer may be formed on the first metal mesh layer, and a second adhesive layer may be formed on the second metal mesh layer.

On the other hand, at the time of forming the adhesive layer by the method of immersing the metal mesh layer in the plating water tanks 1023a and 1023b of the step S130 shown in FIG. 5A, both surfaces of the first metal mesh layer, that is, And an adhesive layer may be formed on both surfaces of the second metal mesh layer, that is, on the first and second surfaces.

Of course, in the present invention, the adhesive layer may be formed on both sides of the metal mesh layer, but in the present invention, since the adhesive layer is sufficient to be formed on at least one side, the following description will be based on the fact that the adhesive layer is formed only on one side of both sides. Shall be.

On the other hand, it is obvious that the adhesive layer can be selectively formed only on one side by known printing method, vapor deposition method or the like.

Next, a second water washing step of washing the metal mesh layer 1022 with the adhesive layer is performed (S140).

The second water rinsing step is a step of washing the plating solution or the like used in the adhesive layer forming step and may be performed by immersing the metal mesh layer in the second water storage tank 1024a or 1024b containing the rinsing solution , But the method of washing in the present invention is not limited, and if necessary, the second washing step may be omitted.

Next, the metal mesh layer on which the adhesive layer is formed is dried (S150).

The drying step may be hot air drying performed in the hot air drying furnaces 1025a and 1025b, but the present invention is not limited to the drying method, and the drying process may be omitted if necessary.

5A and 5B, a base substrate 1011 prepared from the base substrate supplying unit 1010 is provided (S160).

As described above, in the heat sink according to the first embodiment of the present invention, the supply portions 1020a and 1020b of the metal mesh layer to supply the metal mesh layer to the first surface and the second surface of the base substrate, May be located on the first and second surfaces of the base substrate, respectively.

That is, the metal mesh layer first supply unit 1020a for providing the first metal mesh layer on the first surface of the base substrate and the metal mesh layer second supply unit for providing the second metal mesh layer on the second surface of the base substrate A second metal mesh layer including 1010b, thereby providing a first metal mesh layer including a first adhesive layer on a first surface of the base substrate, and including a second adhesive layer on a second surface of the base substrate. Can be provided.

Next, the metal mesh layer 1022 including the adhesive layer is placed on the base substrate, and the metal mesh layer 1022 is pressed by the pressing rollers 1130a and 1130b (S170).

In the heat sink according to the first embodiment of the present invention, the first metal mesh layer including the first adhesive layer is placed on the first surface of the base substrate, and the second metal layer including the second adhesive layer on the second surface of the base substrate. After positioning the mesh layer, the first metal mesh layer and the second metal mesh layer are pressed through the first adhesive layer and the second adhesive layer, respectively, on the first and second surfaces of the base substrate It can be pressed.

At this time, in order to improve adhesion characteristics between the adhesive layer and the metal mesh layer, it is preferable to apply a certain temperature to the first metal mesh layer and the second metal mesh layer, .

As a result, a heat sink including the metal mesh layer according to the first embodiment of the present invention can be manufactured.

That is, as shown in FIG. 4D, the heat sink 1031 according to the first embodiment of the present invention includes a metal mesh layer formed on the first and second surfaces of the base substrate, respectively, Each of which includes a plurality of metal mesh patterns and holes positioned between the metal mesh patterns and includes an adhesive layer for attaching the base substrate and the metal mesh layer.

Next, referring to FIG. 5C, a method of manufacturing a heat sink according to a second embodiment of the present invention includes: preparing a metal mesh layer 2021 through a metal mesh manufacturing apparatus as described above, to provide.

At this time, as described above, the metal mesh layer may include holes between the metal mesh pattern and the metal mesh pattern, which are as described above, and thus a detailed description thereof will be omitted.

On the other hand, as shown in FIG. 5C, in the heat sink according to the second embodiment of the present invention, the metal mesh layer is formed on one of the first and second surfaces of the base substrate, for example, The supply portion 2020a of the metal mesh layer may be located only on the first surface of the base substrate.

That is, it includes a metal mesh layer supply portion 1020a for providing a metal mesh layer on the first surface of the base substrate.

That is, the method for manufacturing the heat sink according to the second embodiment of the present invention is an embodiment in which a metal mesh layer is formed on only one side of the base substrate. Therefore, in the present invention, Or on the second surface.

Next, the metal mesh layer is pretreated.

The pretreatment may be a chemical pretreatment method by immersing the metal mesh layer in a pretreatment water tank 2021a containing a pretreatment solution.

Next, a first washing step of washing the pretreated metal mesh layer is performed.

The first water rinsing step may be performed by immersing the metal mesh layer in the first water storage tank 2022a in which the water wash solution is stored.

Next, an adhesive layer is formed on the metal mesh layer.

The adhesive layer may be a solder layer, and the solder layer may be formed by a known electroplating method or an electroless plating method by a method of immersing the metal mesh layer in a plating bath 2023a including a plating solution.

On the other hand, the solder layer can be formed by a known printing method. More specifically, the solder layer can be formed by printing a conductive paste containing Sn, such as PbSn or CuAgSn.

Next, the metal mesh layer 2022 on which the adhesive layer is formed is subjected to a second water washing step.

The second water rinsing step may be performed by immersing the metal mesh layer in a second water storage tank 2024a containing a water wash solution.

Next, the metal mesh layer on which the adhesive layer is formed is dried.

The drying step may be hot air drying in the hot air drying furnace 2025a.

5C, a base material 2011 prepared from the base material supplying portion 2010 is provided.

On the other hand, as described above, in the heat sink according to the second embodiment of the present invention, in order to supply the metal mesh layer to the first surface of the base substrate, the supply portion 2020a of the metal mesh layer It can be located only on the surface.

Next, the metal mesh layer 2022 including the adhesive layer is placed on the base substrate, and the metal mesh layer 2022 is pressed by the pressing rollers 2130a and 2130b.

In the heat sink according to the second embodiment of the present invention, after the metal mesh layer including the adhesive layer is positioned on the first surface of the base substrate, the metal mesh layer is bonded to the base substrate through the adhesive layer, It can be pressed on one surface.

At this time, in order to improve adhesion characteristics between the adhesive layer and the metal mesh layer in the pressing of the metal mesh layer, it is preferable to apply a constant temperature, and the predetermined temperature may be 150 to 500 ° C.

Thus, the heat sink including the metal mesh layer according to the second embodiment of the present invention can be manufactured.

That is, as shown in FIG. 2B, the heat sink 2031 according to the second embodiment of the present invention includes a metal mesh layer formed on the first surface of the base substrate, and the metal mesh layer includes a plurality of metal mesh patterns And a hole located between the metal mesh patterns, wherein the adhesive layer for attaching the base metal and the metal mesh layer is included.

FIG. 6A is a schematic structural view for manufacturing a heat sink according to a modification of the first embodiment of the present invention, FIG. 6B is a view showing a process for manufacturing a heat sink according to a modification of the first embodiment of the present invention And FIG. 6C is a schematic configuration diagram for manufacturing a heat sink according to a modification of the second embodiment of the present invention. However, the method of manufacturing the heat sink according to the modified example of the first embodiment of the present invention may be the same as the method of manufacturing the above-described first embodiment. The method of manufacturing the heat sink according to the modification of the second embodiment of the present invention may be the same as the method of manufacturing the modification of the first embodiment described above except for the following, 6b will be referred to.

6A and 6B, a method of manufacturing a heat sink according to a modification of the first embodiment of the present invention includes a metal mesh layer 1121 including a protective film through a metal mesh manufacturing apparatus as described above To provide a metal mesh layer containing a protective film (S200).

As described above, in the step of peeling the electrodeposited layer for producing the metal mesh layer, an adhesive is applied to the protective film, laminated on the metal mesh layer formed on the mesh of the surface of the mesh type negative electrode drum, The film and the metal mesh layer can be simultaneously peeled off.

Alternatively, it is also possible to separate only the metal mesh layer from the mesh of the mesh cathode drum without a separate protective film. In this case, in order to facilitate handling in the process, the metal mesh, It may be used by being attached to a protective film.

The manufacturing method of the heat sink according to the modified example of the first embodiment of the present invention corresponds to the use of the metal mesh layer including the protective film.

6A and 6B, the metal mesh layer may include a hole between the metal mesh pattern and the metal mesh pattern, which is as described above, and thus a detailed description thereof will be omitted.

6A, in a heat sink according to a modification of the first embodiment of the present invention, in order to supply the metal mesh layer to the first surface and the second surface of the base substrate, (1120a, 1120b) may be located on the first and second surfaces of the base substrate, respectively.

That is, a metal mesh layer first supply portion 1120a for providing a first metal mesh layer on the first surface of the base substrate and a metal mesh layer second supply portion 1120b for providing a second metal mesh layer on the second surface of the base substrate, Gt; 1120b. ≪ / RTI >

Since the processes of the first metal mesh layer and the second metal mesh layer are the same, the first metal mesh layer and the second metal mesh layer are not distinguished from each other and are referred to as a metal mesh layer do.

Next, the metal mesh layer is pretreated (S210).

The pretreatment may be a chemical pretreatment method by immersing the metal mesh layer in a pretreatment water tank 1121a or 1121b containing a pretreatment solution.

Next, a first washing step of washing the pretreated metal mesh layer is performed (S220).

The first washing step may be a method of immersing the metal mesh layer in the first washing tanks 1122a and 1122b containing the washing solution.

Next, an adhesive layer is formed on the metal mesh layer (S230).

The adhesive layer may be a solder layer, and the solder layer may be formed by an electrolytic plating method or an electroless plating method known by a method of immersing the metal mesh layer in a plating water tank 1123a or 1123b containing a plating liquid .

On the other hand, the solder layer can be formed by a known printing method. More specifically, the solder layer can be formed by printing a conductive paste containing Sn, such as PbSn or CuAgSn.

At this time, a first adhesive layer may be formed on the first metal mesh layer, and a second adhesive layer may be formed on the second metal mesh layer.

Next, the metal mesh layer 1122 on which the adhesive layer is formed is subjected to a second water washing step (S240).

And the second water rinsing step may be performed by immersing the metal mesh layer in the second water storage tank 1124a or 1124b containing the water wash solution.

Next, the metal mesh layer on which the adhesive layer is formed is dried (S250).

The drying step may be hot air drying in the hot air drying furnaces 1125a and 1125b.

6A and 6B, a base substrate 1111 prepared from the base substrate supplying unit 1110 is provided (S260).

As described above, in the heat sink according to the modification of the first embodiment of the present invention, in order to supply the metal mesh layer to the first surface and the second surface of the base substrate, the supply portions 1120a, 1120b may be located on the first and second surfaces of the base substrate, respectively.

That is, it is possible to provide a first metal mesh layer comprising a first adhesive layer on a first side of a base substrate, and a second metal mesh layer on a second side of the base substrate comprising a second adhesive layer.

Next, the metal mesh layer 1122 including the adhesive layer is placed on the base substrate, and the metal mesh layer 1122 is pressed by the pressing rollers 1130a and 1130b (S270).

In positioning the metal mesh layer including the adhesive layer on the base substrate, an adhesive layer positioned on the opposite surface on which the protective film is placed is placed on the base substrate.

In the heat sink according to the modification of the first embodiment of the present invention, the first metal mesh layer including the first adhesive layer is placed on the first surface of the base substrate, and the second metal mesh layer including the second adhesive layer After the second metal mesh layer is positioned, the first metal mesh layer and the second metal mesh layer are pressed through the first adhesive layer and the second adhesive layer, respectively, on the first and second surfaces of the base substrate Respectively.

At this time, in order to improve adhesion characteristics between the adhesive layer and the metal mesh layer, it is preferable to apply a certain temperature to the first metal mesh layer and the second metal mesh layer, .

On the other hand, since the metal mesh layer includes the protective film, the heat sink 1131, which has proceeded to step S270, includes a protective film on the opposite side of the metal mesh layer that is not bonded to the base substrate.

Accordingly, in the method of manufacturing the heat sink according to the modification of the first embodiment of the present invention, at the time of final use, the protective film is removed from the metal mesh layer (S280).

On the other hand, in comparison with the first embodiment, the modification of the first embodiment includes the protection film on the upper portion of the metal mesh layer, more specifically, on the opposite side of the metal mesh layer not adhered to the base substrate , The protection characteristics and the storage characteristics of the heat sink can be facilitated.

Thus, a heat sink including a metal mesh layer according to a modification of the first embodiment of the present invention can be manufactured.

Next, referring to FIG. 6C, a method of manufacturing a heat sink according to a modification of the second embodiment of the present invention includes fabricating a metal mesh layer 2121 including a protective film, .

At this time, as described above, the metal mesh layer may include holes between the metal mesh pattern and the metal mesh pattern, which are as described above, and thus a detailed description thereof will be omitted.

On the other hand, as shown in FIG. 6C, in the heat sink according to the modification of the second embodiment of the present invention, the metal mesh layer is formed on one of the first and second surfaces of the base substrate, To supply the first surface, the supply portion 2120a of the metal mesh layer may be located only on the first surface of the base substrate.

That is, it includes a metal mesh layer supply part 2120a for providing a metal mesh layer on the first surface of the base substrate.

That is, the method of manufacturing the heat sink according to the modified example of the second embodiment of the present invention is an embodiment of forming a metal mesh layer on only one side of the base substrate. Accordingly, in the present invention, And / or on the second surface.

Next, the metal mesh layer is pretreated.

The pretreatment may be a chemical pretreatment method by immersing the metal mesh layer in a pretreatment bath 2121a containing a pretreatment solution.

Next, a first washing step of washing the pretreated metal mesh layer is performed.

The first water rinsing step may be performed by immersing the metal mesh layer in a first water storage tank 2122a containing a water-washing solution.

Next, an adhesive layer is formed on the metal mesh layer.

The adhesive layer may be a solder layer, and the solder layer may be formed by a known electrolytic plating method or electroless plating method by dipping the metal mesh layer in a plating water tank 2123a containing a plating liquid.

On the other hand, the solder layer can be formed by a known printing method. More specifically, the solder layer can be formed by printing a conductive paste containing Sn, such as PbSn or CuAgSn.

Next, the metal mesh layer 2122 on which the adhesive layer is formed is washed with water.

The second water rinsing step may be performed by immersing the metal mesh layer in a second water storage tank 2124a containing a water-washing solution.

Next, the metal mesh layer on which the adhesive layer is formed is dried.

The drying step may be hot air drying conducted in the hot air drying furnace 2125a.

Subsequently, referring to FIG. 6C, a base substrate 2111 prepared from the base substrate supplying portion 2110 is provided.

On the other hand, as described above, in the heat sink according to the modification of the second embodiment of the present invention, in order to supply the metal mesh layer to the first surface of the base substrate, the supply portion 2120a of the metal mesh layer And may be located only on the first side.

Next, the metal mesh layer 2122 including the adhesive layer is placed on the base substrate, and the metal mesh layer 2122 is pressed by the pressing rollers 2130a and 2130b.

In the heat sink according to the modification of the second embodiment of the present invention, after the metal mesh layer including the adhesive layer is placed on the first surface of the base substrate, the metal mesh layer is bonded to the base substrate On the first side of the base.

At this time, in order to improve adhesion characteristics between the adhesive layer and the metal mesh layer in the pressing of the metal mesh layer, it is preferable to apply a constant temperature, and the predetermined temperature may be 150 to 500 ° C.

On the other hand, as described above, since the metal mesh layer includes the protective film, the heat sink 2131 that has progressed to the above step includes a protective film on the opposite side of the metal mesh layer that is not bonded to the base substrate.

Therefore, in the method of manufacturing the heat sink according to the modification of the second embodiment of the present invention, the protective film is removed from the metal mesh layer at the time of final use.

On the other hand, as compared with the second embodiment, the modification of the second embodiment includes the protective film on the upper portion of the metal mesh layer, more specifically, on the opposite side of the metal mesh layer not adhered to the base substrate , The protection characteristics and the storage characteristics of the heat sink can be facilitated.

Thus, a heat sink including a metal mesh layer according to a modification of the second embodiment of the present invention can be manufactured.

FIG. 7A is a view showing an example of a metal mesh layer according to the present invention, and FIG. 7B is a view showing another example of a metal mesh layer according to the present invention.

As shown in FIG. 7A, the planar shape of the metal mesh layer according to the present invention may be a substantially rectangular shape. As shown in FIG. 7B, the planar shape of the metal mesh layer according to the present invention may be substantially hexagonal.

As described above, in the case where the metal mesh layer according to the present invention is manufactured through the continuous electric pole apparatus for manufacturing a metal mesh, the continuous electric pole apparatus includes a cylindrical drum, and depending on the shape of the mesh formed on the surface of the cylindrical drum, The shape of the metal mesh layer can be determined.

That is, the mesh of the shape to be manufactured is formed on the surface of the cylindrical drum of the continuous electric pole apparatus, and the mesh may be formed in a net shape in which a plurality of hexagons are connected to each other, When the shape of the mesh is a hexagon, the planar shape of the metal mesh layer is also a hexagon, and when the shape of the mesh is a quadrangle, the shape of the metal mesh layer may be a square, a triangle, The planar shape of the projection lens may be a rectangle. However, the shape of the metal mesh layer is not limited in the present invention.

8A is a cross-sectional view illustrating a heat sink according to a third embodiment of the present invention, FIG. 8B is a cross-sectional view illustrating a heat sink according to a fourth embodiment of the present invention, FIG. 8C is a cross- Sectional view showing the heat sink according to the second embodiment of the present invention.

In this case, the heat sink according to the third to fifth embodiments may be the same as the heat sink according to the first embodiment except for the following.

Referring to FIG. 8A, the heat sink 300 according to the third embodiment of the present invention includes metal mesh layers 330a and 330b formed on the first and second surfaces of the base substrate 110, respectively. And the metal mesh layer includes a plurality of metal mesh patterns 331a and 331b and holes 332a and 332b positioned between the metal mesh patterns. At this time, And adhesive layers 120a and 120b.

In this case, the shape of the metal mesh pattern may be different from that of the first embodiment in the heat sink according to the third embodiment of the present invention.

More specifically, the first metal mesh pattern 331a of the first metal mesh layer 330a includes the lower end portion 331a ₂ and the upper end portion 331a ₁ , and the second metal mesh layer 330b includes the second metal mesh pattern 331a, pattern that (331b) is larger than the width of the lower end (331b _2), and an upper end comprising a (331b _1), wherein, each of the upper end of (331a _1, 331b ₁₎ the lower end is the width of each (331a _2, 331b ₂₎ .

That is, in the present invention, by forming the widths of the upper ends 331a ₁ and 331b ₁ larger than the widths of the lower ends 331a ₂ and 331b ₂ , the surface area of the upper ends can be increased to improve the heat radiation characteristics.

In the present invention, the reference of the upper and lower ends is based on the surface of the base substrate to which the respective metal mesh layers are bonded, that is, the first metal mesh pattern is formed with the upper and lower ends And the second metal mesh pattern can be divided into an upper portion and a lower portion based on the second surface of the base substrate.

8B, the heat sink 400 according to the fourth embodiment of the present invention includes metal mesh layers 430a and 430b formed on the first and second surfaces of the base substrate 110, respectively, Wherein the metal mesh layer includes a plurality of metal mesh patterns 431a and 431b and holes 432a and 432b located between the metal mesh patterns, The adhesive layers 120a and 120b.

At this time, the shape of the metal mesh pattern may be different from that of the heat sink according to the fourth embodiment of the present invention, as compared with the first embodiment.

More specifically, the first metal mesh pattern 431a of the first metal mesh layer 430a includes a lower end portion 431a ₂ and an upper end portion 431a ₁ , and the second metal mesh layer 430b ' pattern that (431b) is larger than the width of the lower end (431b _2), and an upper end comprising a (431b _1), wherein, each of the upper end of (431a _1, 431b ₁₎ the lower end is the width of each (431a _2, 431b ₂₎ .

That is, in the present invention, the widths of the upper ends 431a ₁ and 431b ₁ may be greater than the widths of the lower ends 431a ₂ and 431b ₂ , and the width may be increased from the lower end to the upper end of the metal mesh pattern.

In the present invention, the reference of the upper and lower ends is based on the surface of the base substrate to which the respective metal mesh layers are bonded, that is, the first metal mesh pattern is formed with the upper and lower ends And the second metal mesh pattern can be divided into an upper portion and a lower portion based on the second surface of the base substrate.

Referring to FIG. 8C, the heat sink 500 according to the fifth embodiment of the present invention includes metal mesh layers 530a and 530b formed on the first and second surfaces of the base substrate 110, respectively, Wherein the metal mesh layer includes a plurality of metal mesh patterns 531a and 531b and holes 532a and 532b positioned between the metal mesh patterns, The adhesive layers 120a and 120b.

At this time, the shape of the metal mesh pattern may be different from that of the heat sink according to the fifth embodiment of the present invention, as compared with the first embodiment.

More specifically, the first metal mesh pattern 531a of the first metal mesh layer 530a includes the lower end portion 531a ₂ and the upper end portion 531a ₁ , and the second metal mesh layer 530b includes the second metal mesh pattern 531a, pattern (531b) is smaller than the width of the lower end (531b _2), and an upper end comprising a (531b _1), wherein, each of the upper end of (531a _1, 531b ₁₎ the lower end is the width of each (531a _2, 531b ₂₎ .

That is, in the present invention, the widths of the upper end portions 531a ₁ and 531b ₁ may be smaller than the widths of the lower end portions 531a ₂ and 531b ₂ , and the width of the upper end portion may be smaller than the width of the lower end portion.

In this case, although the sectional shapes of the upper ends 531a ₁ and 531b ₁ are shown in a semicircular shape in FIG. 8c, the sectional shapes of the upper ends are not limited within a range in which the width of the upper ends is smaller than the width of the lower ends .

In the present invention, the reference of the upper and lower ends is based on the surface of the base substrate to which the respective metal mesh layers are bonded, that is, the first metal mesh pattern is formed with the upper and lower ends And the second metal mesh pattern can be divided into an upper portion and a lower portion based on the second surface of the base substrate.

FIG. 9A is a photograph showing a cross section of a metal mesh pattern of a heat sink according to a third embodiment of the present invention, FIG. 9B is a photograph showing a cross section of a metal mesh pattern of a heat sink according to the fourth embodiment of the present invention And FIG. 9C is a photograph showing a cross section of the metal mesh pattern of the heat sink according to the fifth embodiment of the present invention.

As shown in Figs. 9A to 9C, the shape of the metal mesh pattern of the metal mesh layers 330a, 430a, and 530a can be manufactured as described in Figs. 8A to 8C.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

100, 200, 300, 400: Heat sink
110: base substrate 120a, 120b, 220: adhesive layer
130a, 130b, 230, 330a, 330b, 430a, 430b: metal mesh layer
131a, 131b, 231, 331a, 331b, 431a, 431b: metal mesh pattern
132a, 132b, 232, 332a, 332b, 332a, 332b: holes

Claims (16)

A base substrate;
A metal mesh layer positioned on the base substrate; And
And an adhesive layer positioned between the base substrate and the metal mesh layer,
The metal mesh layer may include a plurality of metal mesh patterns and holes disposed between the metal mesh patterns. The method according to claim 1,
The metal mesh layer may be formed of at least one material selected from the group consisting of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe), cobalt (Co), aluminum . The method according to claim 1,
Wherein the adhesive layer is a solder layer and the solder layer is formed of lead (Pb), tin (Sn), zinc (Zn), indium (In), cadmium (Cd), bismuth (Bi) Heatsink. The method according to claim 1,
Wherein the adhesive layer comprises a first adhesive layer and a second adhesive layer, the metal mesh layer comprising a first metal mesh layer and a second metal mesh layer,
The first adhesive layer is positioned between the first surface of the base substrate and the first metal mesh layer, and the second adhesive layer is positioned between the second surface of the base substrate and the second metal mesh layer. . The method according to claim 1,
Wherein the adhesive layer comprises a first adhesive layer and a second adhesive layer, the metal mesh layer comprising a first metal mesh layer and a second metal mesh layer,
Wherein the first metal mesh layer comprises a plurality of first metal mesh patterns and the second metal mesh layer comprises a plurality of second metal mesh patterns,
The first adhesive layer is positioned between the first surface of the base substrate and the first metal mesh pattern, and the second adhesive layer is positioned between the second surface of the base substrate and the second metal mesh pattern. . The method according to claim 1,
Wherein the base substrate is one of stainless steel, nickel, copper, iron, aluminum, titanium or an alloy thereof, or one obtained by surface-treating carbon, nickel, titanium or silver on the surface of aluminum, copper, iron or stainless steel . The method according to claim 6,
Wherein the base substrate and the metal mesh layer are made of aluminum or an aluminum alloy. The method according to claim 1,
Wherein the metal mesh pattern includes a lower end portion and an upper end portion,
Wherein a width of the upper end portion is larger than a width of the lower end portion. The method according to claim 1,
Wherein the metal mesh pattern includes a lower end portion and an upper end portion,
And the width of the metal mesh pattern increases from the lower end to the upper end. Providing a base substrate;
Providing a metal mesh layer comprising a plurality of metal mesh patterns and holes positioned between the metal mesh patterns;
Forming an adhesive layer on the metal mesh layer; And
Positioning the adhesive layer on the base substrate and compressing the heat sink. 11. The method of claim 10,
Wherein the metal mesh layer comprises a first metal mesh layer and a second metal mesh layer,
Wherein forming the adhesive layer on the metal mesh layer comprises forming a first adhesive layer on the first metal mesh layer and forming a second adhesive layer on the second metal mesh layer,
Wherein the first adhesive layer is located on a first side of the base substrate and the second adhesive layer is located on a second side of the base substrate. 11. The method of claim 10,
After providing the metal mesh layer,
Pretreating the metal mesh layer; And a first rinsing step of washing the pretreated metal mesh layer. 13. The method of claim 12,
After the step of forming the adhesive layer on the metal mesh layer,
And a second water-washing step of washing the metal mesh layer on which the adhesive layer is formed. 11. The method of claim 10,
Wherein providing the metal mesh layer comprises:
Providing a pole master comprising a mesh having a shape corresponding to a shape of a metal mesh layer to be manufactured;
At least any one of copper (Cu), silver (Ag), chromium (Cr), nickel (Ni), iron (Fe), cobalt (Co), and alloys thereof dissolved in an electrolytic solution is electrodeposited Electrodepositing the metal mesh by electrodeposition;
An electrodeposited layer peeling step of peeling the metal mesh from the mesh; And
And a number of electrodeposition layers for washing the peeled electrodeposited layer. 15. The method of claim 14,
Providing the metal mesh layer comprises providing a metal mesh layer comprising a protective film,
Further comprising the step of removing the protective film from the metal mesh layer after positioning and bonding the metal mesh layer on the adhesive layer. The method of claim 15,
Wherein the step of providing the metal mesh layer comprising the protective film comprises:
Wherein the step of peeling the electrodeposited layer comprises the step of applying an adhesive to the protective film, laminating the protective film on the metal mesh formed on the mesh, and peeling the protective film and the metal mesh at the same time,
Wherein the step of attaching to the protective film is carried out on the metal mesh cloth which has been washed through the three steps of the electrodeposition layer.

Images