KR20140044110A - Apparatus for organic layer deposition, method for manufacturing of organic light emitting display apparatus using the same, and organic light emitting display apparatus manufactured by the method - Google Patents

Abstract

The present invention relates to an organic layer deposition apparatus, a method for manufacturing an organic light emitting display device by using the same, and an organic light emitting display device manufactured using the method and, more specifically, to an organic layer deposition apparatus that is suitable for mass production of a large substrate and enables high-definition patterning, a method of manufacturing an organic light-emitting display device by using the same, and an organic light-emitting display device manufactured using the method.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic layer deposition apparatus, an organic light emitting display apparatus using the same, and an organic light emitting display apparatus manufactured by the method. the method}

The present invention relates to an organic layer deposition apparatus, a method for manufacturing an organic light emitting display device using the same, and an organic light emitting display device manufactured according to the present invention, and more particularly, to be more suitable for a mass production process of a large substrate, and to enable high definition patterning. An organic layer deposition apparatus, a method of manufacturing an organic light emitting display apparatus using the same, and an organic light emitting display apparatus manufactured according to the same.

Of the display devices, the organic light emitting display device has a wide viewing angle, excellent contrast, and fast response speed, and is receiving attention as a next generation display device.

The organic light emitting display device includes a light emitting layer and an intermediate layer including the light emitting layer between the first electrode and the second electrode facing each other. At this time, the electrodes and the intermediate layer can be formed by various methods, one of which is the independent deposition method. In order to manufacture an organic light emitting display device using a deposition method, a fine metal mask (FMM) having the same pattern as that of an organic layer to be formed is closely contacted to a substrate surface on which an organic layer or the like is to be formed, A material is deposited to form an organic layer of a predetermined pattern.

However, the method using such a fine metal mask has a limitation that it is not suitable for large-sized organic light emitting display device using a large mother-glass. This is because, when a large area mask is used, the mask is warped due to its own weight, and distortion of the pattern due to the warping phenomenon may occur. This is also arranged with the current tendency to require fixed tax on the pattern.

Further, there is a problem that it takes a considerable time to separate the substrate and the fine metal mask from each other, and then takes a long time to manufacture and lowers the production efficiency .

The above-described background technology is technical information that the inventor holds for the derivation of the present invention or acquired in the process of deriving the present invention, and can not necessarily be a known technology disclosed to the general public prior to the filing of the present invention.

The present invention is to solve the various problems including the above problems, and more suitable for the mass production process of a large substrate, an organic layer deposition apparatus to enable high-definition patterning, a method of manufacturing an organic light emitting display device using the same and It is an object to provide an organic light emitting display device manufactured accordingly.

According to an aspect of the present invention, a moving part is fixed to a substrate and is formed to be movable together with the fixed substrate; A transfer part including a second transfer part for moving a moving part in a direction opposite to the first direction; And a deposition unit including a chamber maintained in a vacuum and at least one organic layer deposition assembly for depositing an organic layer on the substrate fixed to the moving unit, wherein the organic layer deposition assembly comprises: a deposition source for emitting a deposition material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles; A patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits arranged along any one direction; And a first tooling shutter disposed between the deposition source and the patterning slit sheet so as to cover at least a portion of the substrate, and having at least one tooling slit formed along the first direction. The substrate is formed to be circulated between the first transfer unit and the second transfer unit, wherein the substrate fixed to the moving unit is formed to be spaced apart from the organic layer deposition assembly by a predetermined degree while being moved by the first transfer unit. Provide a device.

In the present invention, a plurality of the organic layer deposition assembly may be provided with the first tooling shutter, and the tooling slits formed in each of the first tooling shutters may be formed to be offset to each other by a predetermined degree.

Here, the first tooling shutter may be provided in an organic layer deposition assembly for depositing a common layer among a plurality of organic layer deposition assemblies.

In the present invention, the first tooling shutter may be disposed to cover at least a part of the substrate only when the tooling substrate is transferred in the deposition unit.

In the present invention, an organic layer deposition assembly for depositing a pattern layer of the plurality of organic layer deposition assembly, disposed between the deposition source and the patterning slit sheet is formed so as to cover at least a portion of the substrate, Second tooling shutters in which tooling slits are formed at both ends may be further formed along one direction.

Here, the width of the tooling slit of the second tooling shutter may be formed to be larger than the width of the patterning slit of the patterning slit sheet.

In the present invention, the first transfer unit and the second transfer unit may be provided to penetrate the vapor deposition unit when passing through the vapor deposition unit.

In the present invention, the first transfer unit and the second transfer unit may be arranged vertically side by side.

In the present invention, the organic layer deposition apparatus may further include a loading part for fixing the substrate to the moving part, and an unloading part for separating the substrate from which the deposition is completed while passing through the deposition part from the moving part.

Here, the first transfer unit may sequentially move the moving unit to the loading unit, the deposition unit and the unloading unit.

Here, the second transfer unit may sequentially move the moving unit to the unloading unit, the deposition unit and the loading unit.

In the present invention, the organic layer deposition assembly, the deposition material radiated from the deposition source may be deposited while passing through the patterning slit sheet to form a pattern on the substrate.

In the present invention, the patterning slit sheet of the thin film deposition assembly may be formed smaller than the substrate in at least one of the first direction and the second direction.

Here, a magnetic rail is formed on one surface of the carrier, and a plurality of coils are formed on each of the first transfer part and the second transfer part, and a driving force is provided to move the moving part by coupling the magnetic rail and the coil. The driving part which generate | occur | produces can be formed.

In the present invention, a plurality of deposition source nozzles are formed in a first direction in the deposition source nozzle unit, a plurality of patterning slits are formed in the patterning slit sheet in the first direction, the thin film deposition apparatus, A plurality of blocking plates disposed in the first direction between the deposition source nozzle part and the patterning slit sheet and partitioning a space between the deposition source nozzle part and the patterning slit sheet into a plurality of deposition spaces; The blocking plate assembly may further include.

Here, each of the plurality of blocking plates may be formed to extend in a second direction substantially perpendicular to the first direction.

Here, the blocking plate assembly may include a first blocking plate assembly having a plurality of first blocking plates, and a second blocking plate assembly having a plurality of second blocking plates.

Here, each of the plurality of first blocking plates and the plurality of second blocking plates may be formed in a second direction substantially perpendicular to the first direction, thereby providing a space between the deposition source nozzle unit and the patterning slit sheet. May be partitioned into a plurality of deposition spaces.

In the present disclosure, a plurality of deposition source nozzles may be formed in the deposition source nozzle part along a first direction, and the patterning slit sheet may include a plurality of patterning slits along a second direction perpendicular to the first direction. Can be.

The deposition source, the deposition source nozzle unit, and the patterning slit sheet may be integrally formed by being coupled by a connection member.

Here, the connection member may guide the movement path of the deposition material.

Here, the connection member may be formed to seal the space between the deposition source and the deposition source nozzle unit and the patterning slit sheet from the outside.

According to another aspect of the present invention, there is provided a method of manufacturing an organic light emitting display apparatus using an organic layer deposition apparatus for forming an organic layer on a substrate. Transferring the moving part into the chamber; In a state where the substrate is separated from the plurality of organic layer deposition assemblies disposed in the chamber by a predetermined distance, the deposition material emitted from the organic layer deposition assemblies is deposited on the substrate while the substrate is moved relative to the organic layer deposition assemblies. Forming an organic layer; And returning the moving part separated from the substrate by a second transfer part installed to penetrate the chamber, wherein the forming of the organic layer includes transferring a tooling substrate in the organic layer deposition assemblies. In the meantime, the deposition material is patterned on the tooling substrate by a first tooling shutter having at least one tooling slit formed thereon.

In the present invention, a plurality of the organic layer deposition assembly may be provided with the first tooling shutter, and the tooling slits formed in each of the first tooling shutters may be formed to be offset to each other by a predetermined degree.

Here, the first tooling shutter may be provided in an organic layer deposition assembly for depositing a common layer among a plurality of organic layer deposition assemblies.

In the present invention, the first tooling shutter may be arranged to cover at least a portion of the substrate only when the tooling substrate is transferred in the organic layer deposition assembly.

In the present invention, before the step of moving the moving unit by the first transfer unit, further comprising the step of fixing the substrate to the moving unit in the loading unit, before the step of moving the moving unit by the second transfer unit The method may further include separating the substrate from which the deposition is completed in the unloading unit from the moving unit.

In the present invention, the moving unit may circulate between the first transfer unit and the second transfer unit.

In the present invention, the first transfer unit and the second transfer unit may be arranged vertically side by side.

In the present invention, the thin film deposition assembly, a deposition source for emitting a deposition material; An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles; And a patterning slit sheet disposed to face the deposition source nozzle unit and having a plurality of patterning slits disposed along a second direction perpendicular to the first direction. The deposition material emitted from the deposition source includes: It may be deposited while passing through the patterned slit sheet to form a pattern on the substrate.

Here, the patterning slit sheet of the thin film deposition assembly may be formed to be smaller than the substrate in at least one of the first direction and the second direction.

Here, in the organic layer deposition assembly for depositing a pattern layer of the plurality of organic layer deposition assembly, is disposed between the deposition source and the patterning slit sheet to cover at least a portion of the substrate, the tooling slit at both ends The formed second tooling shutter may be further formed.

Here, the width of the tooling slit of the second tooling shutter may be formed to be larger than the width of the patterning slit of the patterning slit sheet.

The present invention according to another aspect, the substrate; At least one thin film transistor formed on the substrate, the thin film transistor having a semiconductor active layer, a gate electrode insulated from the semiconductor active layer, and source and drain electrodes respectively contacting the semiconductor active layer; A plurality of pixel electrodes formed on the thin film transistor; A plurality of organic layers formed on the pixel electrodes; And an opposite electrode formed on the organic layers, wherein at least one organic layer on the substrate has a length of a hypotenuse far from the center of the deposition region longer than a length of a hypotenuse near the center of the deposition region; And at least one organic layer on the substrate is a linear pattern formed using the organic layer deposition apparatus of claim 1.

In the present invention, the substrate may have a size of 40 inches or more.

In the present invention, the organic layer may include at least a light emitting layer.

In the present invention, the organic layer may have a non-uniform thickness.

In the present invention, the longer the organic side formed from the center of the deposition region, the longer the length of the hypotenuse farther from the center of the deposition region.

In the present invention, the plurality of organic layers disposed in the deposition region may have a narrow width of the overlapping region of two sides extending in the first direction as the distance from the center of the deposition region increases.

In the present invention, the organic layer disposed at the center of the deposition region may be formed such that the lengths of both hypotenuses are substantially the same.

In the present invention, the organic layer disposed in the deposition region may be symmetrically disposed with respect to the center of the deposition region.

According to the present invention, an organic layer deposition apparatus, a method of manufacturing an organic light emitting display apparatus using the same, and an organic light emitting display apparatus manufactured according to the same may be implemented. have.

1 is a plan view of a system configuration schematically showing an organic layer deposition apparatus according to an embodiment of the present invention.
2 is a side view of a system configuration schematically showing a deposition unit of the organic layer deposition apparatus of FIG.
3 is a perspective view schematically showing the deposition unit of FIG.
Figure 4 is a schematic cross-sectional view of the deposition section of Figure 3;
5 is a perspective view showing an embodiment of an evaporation source of the evaporation unit of FIG.
FIG. 6 is a perspective view showing another embodiment of the evaporation source of the evaporation unit of FIG. 3; FIG.
7 is a cross-sectional view illustrating in detail the first transfer part and the moving part of the deposition part of FIG. 3.
FIG. 8 is a view illustrating a tooling shutter during deposition of an organic layer in the deposition unit of FIG. 3.
9 is a view illustrating a tooling shutter during tooling in the deposition unit of FIG. 3.
FIG. 10 is a view illustrating a substrate in which an organic layer is formed while the substrate passes through the first organic layer deposition assembly 100-1 during the tooling of FIG. 9.
FIG. 11 is a view illustrating a substrate in which an organic layer is formed while the substrate passes through the second organic layer deposition assembly 100-2 during the tooling of FIG. 9.
FIG. 12 is a view illustrating a substrate in which an organic layer is formed while the substrate passes through the third organic layer deposition assembly 100-3 during the tooling of FIG. 9.
13 illustrates an organic layer deposition assembly according to another embodiment of the present invention.
FIG. 14 is a schematic side cross-sectional view of the organic layer deposition assembly of FIG. 13.
FIG. 15 is a schematic plan view of the organic layer deposition assembly of FIG. 13.
16 illustrates an organic layer deposition assembly according to another embodiment of the present invention.
17 is a view showing an organic layer deposition assembly according to another embodiment of the present invention.
FIG. 18 is a view illustrating patterning slits formed at equal intervals on a patterning slit sheet in the organic layer deposition apparatus of FIG. 3.
FIG. 19 is a diagram illustrating an organic layer formed on a substrate using the patterning slit sheet of FIG. 18.
20 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus of the present invention.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will be readily apparent to those skilled in the art to which the present invention pertains. The present invention may be embodied in many different forms and is not limited to the embodiments described herein.

FIG. 1 is a plan view of a system configuration schematically showing an organic layer deposition apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a system configuration schematically showing a deposition unit of the organic layer deposition apparatus of FIG.

1 and 2, an organic layer deposition apparatus 1 according to an embodiment of the present invention includes a deposition unit 100, a loading unit 200, an unloading unit 300, and a transferring unit 400 .

The loading unit 200 may include a first rack 212, an introduction chamber 214, a first inverting chamber 218, and a buffer chamber 219.

A plurality of substrates 2 before deposition are deposited in the first rack 212 and an introduction robot provided in the introduction chamber 214 holds the substrate 2 from the first rack 212 to form a second transfer part The transfer unit 430 to which the substrate 2 is attached is transferred to the first inverting chamber 218 after the substrate 2 is placed on the transfer unit 430 transferred from the transfer unit 420.

A first inverting chamber 218 is provided adjacent to the introducing chamber 214 and a first inverting robot located in the first inverting chamber 218 inverts the moving unit 430 to move the moving unit 430 (410) of the first conveyance unit (100).

1, the introduction robot of the introduction chamber 214 places the substrate 2 on the upper surface of the moving part 430. In this state, the moving part 430 is transferred to the reversing chamber 218, The substrate 2 is positioned downward in the deposition unit 100 as the first inversion robot of the chamber 218 reverses the inversion chamber 218. [

The configuration of the unloading unit 300 is configured in reverse to the configuration of the loading unit 200 described above. That is, the substrate 2 and the moving unit 430 which have passed through the deposition unit 100 are reversed by the second inverting robot in the second inverting chamber 328 and transferred to the unloading chamber 324, The substrate 2 is removed from the moving part 430 and loaded on the second rack 322 after the substrate 2 and the moving part 430 are taken out from the moving parts 430 and 324. The moving part 430 separated from the substrate 2 is returned to the loading part 200 through the second conveying part 420.

However, the present invention is not limited thereto. The substrate 2 is fixed to the lower surface of the moving part 430 from the time when the substrate 2 is initially fixed to the moving part 430, . In this case, for example, the first inverting robot of the first inverting chamber 218 and the second inverting robot of the second inverting chamber 328 are unnecessary.

The deposition unit 100 has at least one vapor deposition chamber 101. 1 and 2, the deposition unit 100 includes a chamber 101, and a plurality of organic layer deposition assemblies 100-1, 100-2, 100-3, -2) ... 100-n. 1, the first organic layer deposition assembly 100-1, the second organic layer deposition assembly 100-2 to the eleventh organic layer deposition assembly 100-1, 11) are installed, but the number is variable depending on the deposition material and deposition conditions. The chamber 101 is kept in vacuum during deposition.

1, the moving unit 430, to which the substrate 2 is fixed, is moved by the first transfer unit 410 to at least the deposition unit 100, And the moving unit 430 separated from the substrate 2 in the unloading unit 300 is moved to the second transferring unit 420 To the loading unit (200).

The first transfer part 410 is provided to penetrate the chamber 101 when passing through the deposition part 100 and the second transfer part 420 is provided with a moving part 430 in which the substrate 2 is separated Respectively.

The organic layer deposition apparatus 1 according to an embodiment of the present invention includes a first transfer unit 410 and a second transfer unit 420 which are vertically formed, After the substrate 430 is separated from the substrate 2 at the unloading portion 300 and then transferred to the loading portion 200 through the second transfer portion 420 formed at the lower portion thereof, Effect can be obtained.

The deposition unit 100 of FIG. 1 may further include an evaporation source replacement unit 190 on one side of each organic layer deposition assembly 100-1. Although not shown in detail in the drawings, the evaporation source replacement portion 190 may be formed in a cassette type and formed to be drawn out from each of the organic layer deposition assemblies 100-1. Therefore, replacement of the evaporation source (see 110 in Fig. 3) of the organic layer deposition assembly 100-1 can be facilitated.

FIG. 3 is a perspective view schematically showing the deposition unit of FIG. 1, and FIG. 4 is a schematic cross-sectional view of the deposition unit of FIG. 5 is a perspective view illustrating an embodiment of a deposition source of the deposition unit of FIG. 3, and FIG. 6 is a perspective view illustrating another embodiment of a deposition source of the deposition unit of FIG. 3. 7 is a cross-sectional view illustrating in detail the first transfer part and the moving part of the deposition part of FIG. 3.

3 and 4, the deposition unit 100 of the organic layer deposition apparatus 1 according to an embodiment of the present invention includes at least one organic layer deposition assembly 100-1 and a transfer unit 400 do.

Hereinafter, the configuration of the entire vapor deposition unit 100 will be described.

The chamber 101 is formed in a hollow box shape, and one or more organic layer deposition assemblies 100-1 and a transfer unit 400 are accommodated therein. In another aspect, a foot 102 is formed to be fixed to the ground, a lower housing 103 is formed on a foot 102, and a lower housing 103 is formed on an upper portion of the lower housing 103, (104) are formed. The chamber 101 is formed so as to house both the lower housing 103 and the upper housing 104 therein. At this time, the connection between the lower housing 103 and the chamber 101 may be sealed to completely block the inside of the chamber 101 from the outside. The lower housing 103 and the upper housing 104 are formed on the foot 102 fixed to the ground so that the lower housing 103 and the upper housing 102 can be separated from each other even if the chamber 101 repeats shrinkage / The lower housing 103 and the upper housing 104 can serve as a kind of reference frame in the deposition unit 100. [

The organic layer deposition assembly 100-1 and the first transfer part 410 of the transfer part 400 are formed in the upper housing 104 and the second transfer part 410 of the transfer part 400 is formed in the lower part of the lower housing 103. [ (420) is formed. The moving part 430 is continuously deposited while circulating between the first transfer part 410 and the second transfer part 420.

Hereinafter, the detailed structure of the organic layer deposition assembly 100-1 will be described.

Each organic layer deposition assembly 100-1 includes an evaporation source 110, an evaporation source nozzle unit 120, a patterning slit sheet 130, a blocking member 140, a first stage 150, a second stage 160 A photographing member 170, a sensor 180, and the like. Here, it is preferable that all the configurations of Figs. 3 and 4 are disposed in the chamber 101 in which an appropriate degree of vacuum is maintained. This is to ensure the straightness of the deposition material.

In detail, in order for the deposition material 115 emitted from the deposition source 110 to pass through the deposition source nozzle part 120 and the patterning slit sheet 130 to be deposited in a desired pattern on the substrate 2, The inside of the chamber should be kept at the same high vacuum as the FMM deposition method. Further, the temperature of the patterning slit sheet 130 should be sufficiently lower than the temperature of the evaporation source 110 (about 100 degrees or less). This is because the problem of thermal expansion of the patterning slit sheet 130 due to temperature can be minimized only when the temperature of the patterning slit sheet 130 is sufficiently low.

In this chamber 101, the substrate 2 to be evaporated is disposed. The substrate 2 may be a substrate for a flat panel display device, and a large area substrate such as a mother glass capable of forming a plurality of flat panel display devices may be used.

Here, in one embodiment of the present invention, the deposition proceeds as the substrate 2 moves relative to the organic layer deposition assembly 100-1.

Specifically, in the conventional FMM deposition method, the FMM size must be formed equal to the substrate size. Therefore, as the substrate size increases, the FMM must be made larger, which makes it difficult to fabricate the FMM, and it is not easy to align the FMM with a precise pattern by pulling the FMM.

In order to solve such problems, the organic layer deposition assembly 100-1 according to an embodiment of the present invention is configured such that deposition is performed while the organic layer deposition assembly 100-1 and the substrate 2 are moved relative to each other . In other words, the substrate 2 disposed to face the organic layer deposition assembly 100-1 is continuously deposited while moving along the Y-axis direction. That is, the deposition is performed in a scanning manner while the substrate 2 moves in the direction of arrow A in FIG. Although the substrate 2 is illustrated as being deposited in the chamber (not shown) while moving in the Y-axis direction, the idea of the present invention is not limited thereto. The substrate 2 may be fixed, It is also possible that the assembly 100-1 itself is moved in the Y-axis direction to perform deposition.

Accordingly, the patterning slit sheet 130 can be made much smaller than the conventional FMM in the organic layer deposition assembly 100-1 of the present invention. That is, in the case of the organic layer deposition assembly 100-1 of the present invention, since the substrate 2 performs deposition in a scanning manner continuously while moving along the Y-axis direction, the patterning slit sheet 130, The length in at least one direction of the X-axis direction and the Y-axis direction of the substrate 2 can be formed to be much smaller than the length of the substrate 2. As described above, since the patterning slit sheet 130 can be made much smaller than the conventional FMM, the patterning slit sheet 130 of the present invention can be easily manufactured. That is, a small-sized patterning slit sheet 130 is advantageous over the FMM deposition method in all processes, such as etching of the patterning slit sheet 130, and subsequent precision tensioning and welding operations, movement and cleaning operations. Further, this becomes more advantageous as the display device becomes larger.

It is preferable that the organic layer deposition assembly 100-1 and the substrate 2 are spaced apart from each other in order to deposit the organic layer deposition assembly 100-1 and the substrate 2 relative to each other. This will be described later in detail.

On the other hand, on the side facing the substrate 2 in the chamber, an evaporation source 110 in which the evaporation material 115 is stored and heated is disposed. As the evaporation material 115 stored in the evaporation source 110 is vaporized, the evaporation is performed on the substrate 2.

In detail, the evaporation source 110 includes a crucible 111 in which an evaporation material 115 is filled, a evaporation material 115 filled in the crucible 111 by heating the crucible 111, And a heater 112 for evaporating the evaporation source toward the evaporation source nozzle unit 120 side.

The evaporation source nozzle unit 120 is disposed on one side of the evaporation source 110, specifically, on the evaporation source 110 side toward the substrate 2. Here, in the organic layer deposition assembly according to the present invention, the evaporation source nozzles may be formed to be different from each other in depositing the common layer and the pattern layer, which will be described in more detail below.

5 is a perspective view illustrating a deposition source nozzle for forming a pattern layer, and FIG. 6 is a perspective view illustrating a deposition source nozzle for forming a common layer.

Referring to FIG. 5, three deposition sources 110 and three deposition source nozzle units 120 are disposed in one organic layer deposition assembly 100-1, and each of the deposition source nozzle units 120 And one evaporation source nozzle 121 is formed at the center thereof. The evaporation material 115 vaporized in the evaporation source 110 passes through the evaporation source nozzle unit 120 and is directed toward the substrate 2 as the evaporation source. In this manner, one evaporation source nozzle 121 is formed on the evaporation source nozzle unit 120 and three evaporation sources 110 are formed in one organic layer deposition assembly 100-1 to cover the substrate 2 A plurality of evaporation source nozzles 121 are formed along the scanning direction of the substrate 2 in one organic layer deposition assembly 100-1. In this case, if a plurality of evaporation source nozzles 121 are provided in the X-axis direction, the distances between the evaporation source nozzles 121 and the patterning slits 151 are different from each other. At this time, A shadow is generated by the evaporation material emitted from the evaporation source nozzle 121 farther away. Therefore, by forming the evaporation source nozzle 121 so that only one evaporation source nozzle 121 exists in the X-axis direction as in the present invention, generation of shadows can be greatly reduced. In addition, since a plurality of evaporation source nozzles 121 exist in the scanning direction, even if a flux difference between the individual evaporation source nozzles occurs, the difference is canceled, and the uniformity of deposition is maintained constant.

Referring to FIG. 6, an evaporation source nozzle unit 120 'is disposed on one side of the evaporation source 110', specifically, on a side of the evaporation source 110 'that faces the substrate 2. A plurality of evaporation source nozzles 121 'are formed in the evaporation source nozzle portion 120' along the X-axis direction (that is, the direction perpendicular to the scanning direction of the substrate 2). Here, the plurality of evaporation source nozzles 121 'may be formed at regular intervals or may be formed so as to be narrower toward both ends. The evaporated material evaporated in the evaporation source 110 'passes through the evaporation source nozzles 121' of the evaporation source nozzle unit 120 'and is directed toward the substrate 2 as the evaporation source. As described above, in the deposition of the common layer, a plurality of evaporation source nozzles 121 'are formed along the X-axis direction (that is, the direction perpendicular to the scanning direction of the substrate 2) will be.

A patterning slit sheet 130 is further provided between the evaporation source 110 and the substrate 2. The patterning slit sheet 130 further includes a frame 135 formed in a shape of a window frame, and the patterning slit sheet 130 is formed with a plurality of patterning slits 131 along the X-axis direction. The evaporated material 115 vaporized in the evaporation source 110 is directed to the substrate 2 as the evaporation source through the evaporation source nozzle unit 120 and the patterning slit sheet 130. At this time, the patterning slit sheet 130 can be manufactured through etching, which is the same method as that of a conventional fine metal mask (FMM), particularly, a stripe type mask. At this time, the total number of the patterning slits 131 may be larger than the total number of the evaporation source nozzles 121.

Here, the deposition source 110 (and the deposition source nozzle unit 120 coupled thereto) and the patterning slit sheet 130 may be spaced apart from each other by a predetermined distance.

As described above, the organic layer deposition assembly 100-1 according to one embodiment of the present invention performs deposition while moving relative to the substrate 2, and thus the organic layer deposition assembly 100-1 is mounted on the substrate 2, the patterning slit sheet 130 is formed to be spaced apart from the substrate 2 by a certain distance.

In detail, in the conventional FMM deposition method, a mask is closely adhered to a substrate to prevent a shadow from being formed on the substrate, and a deposition process is performed. However, when the mask is brought into close contact with the substrate in this manner, there is a problem that a problem of defective due to contact between the substrate and the mask occurs. Further, since the mask can not be moved relative to the substrate, the mask must be formed to have the same size as the substrate. Therefore, as the size of the display device is increased, the size of the mask must be increased. Thus, there is a problem that it is not easy to form such a large mask.

In order to solve such a problem, in the organic layer deposition assembly 100-1 according to an embodiment of the present invention, the patterning slit sheet 130 is arranged so as to be spaced apart from the substrate 2 as a deposition target by a predetermined distance.

According to the present invention, after the mask is formed smaller than the substrate, the deposition can be performed while moving the mask relative to the substrate, so that it is possible to obtain an effect of facilitating the production of the mask. In addition, it is possible to obtain an effect of preventing defects due to contact between the substrate and the mask. Further, since the time required for the substrate and the mask to adhere to each other in the process becomes unnecessary, an effect of improving the manufacturing speed can be obtained.

Next, the specific arrangement of each component in the upper housing 104 is as follows.

First, the evaporation source 110 and the evaporation source nozzle 120 are disposed at the bottom of the upper housing 104. A seating part 104-1 is formed on both sides of the evaporation source 110 and the evaporation source nozzle 120 and a first stage 150 and a second stage 160 are formed on the seating part 104-1. And the above-described patterning slit sheet 130 are sequentially formed.

Here, the first stage 150 is formed to be movable in the X-axis direction and the Y-axis direction, and functions to align the patterning slit sheet 130 in the X-axis direction and the Y-axis direction. That is, the first stage 150 includes a plurality of actuators, and the first stage 150 is formed to move in the X-axis direction and the Y-axis direction with respect to the upper housing 104.

Meanwhile, the second stage 160 is formed to be movable in the Z-axis direction, and functions to align the patterning slit sheet 130 in the Z-axis direction. That is, the second stage 160 includes a plurality of actuators, and the second stage 160 is formed to move in the Z-axis direction with respect to the first stage 150.

On the other hand, a patterning slit sheet 130 is formed on the second stage 160. The patterning slit sheet 130 is formed on the first stage 150 and the second stage 160 so that the patterning slit sheet 130 is formed to be movable in the X axis direction, the Y axis direction, and the Z axis direction Thereby realizing alignment, particularly real-time alignment, between the substrate 2 and the patterning slit sheet 130.

Further, the upper housing 104, the first stage 150, and the second stage 160 may simultaneously guide the movement path of the evaporation material so that the evaporation material discharged through the evaporation source nozzle 121 is not dispersed . That is, the path of the evaporation material may be sealed by the upper housing 104, the first stage 150, and the second stage 160 to simultaneously guide the movement of the evaporation material in the X axis direction and the Y axis direction.

Although not shown in the drawings, a blocking member (not shown) may be further provided between the patterning slit sheet 130 and the deposition source 110 to prevent organic material from being deposited in the non-film formation region of the substrate 2. have. The blocking member (not shown) may be composed of two plates adjacent to each other. By blocking the non-film forming region of the substrate 2 by such a blocking member (not shown), it is possible to obtain an effect that the organic material is easily deposited on the non-forming region of the substrate 2 without a separate structure.

Hereinafter, the transfer unit 400 for transferring the substrate 2, which is a deposition target, will be described in detail. 3 and 4, the transfer unit 400 includes a first transfer unit 410, a second transfer unit 420, and a moving unit 430.

The first transfer part 410 includes a moving part 430 including a carrier 431 and an electrostatic chuck 432 coupled thereto so that an organic layer can be deposited on the substrate 2 by the organic layer deposition assembly 100-1. And the substrate 2 attached to the moving unit 430 in a line-by-line manner. The first transfer portion 410 includes a coil 411, a guide portion 412, an upper magnetic levitation bearing 413, a side magnetic levitation bearing 414, and a gap sensor 415 and 416.

The second transfer part 420 transfers the moving part 430 separated from the substrate 2 to the loading part 200 by the unloading part 300 after one deposition is completed while passing through the deposition part 100 . The second conveyance unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

The moving unit 430 includes a carrier 431 transported along the first transporting unit 410 and the second transporting unit 420 and an electrostatic chuck 432 coupled to one side of the carrier 431 and to which the substrate 2 is attached ).

Hereinafter, each component of the transfer unit 400 will be described in more detail.

First, the carrier 431 of the moving unit 430 will be described in detail.

The carrier 431 includes a main body 431a, a linear motor system magnet 431b, a contactless power supply module 431c, a power source 431d and a guide groove 431e. On the other hand, the carrier 431 may further include a cam follower 431f.

The body portion 431a forms the base of the carrier 431 and may be formed of a magnetic material such as iron. The carrier 431 can be maintained at a certain distance from the guide portion 412 by the repulsive force between the main body portion 431a of the carrier 431 and the magnetic levitation bearings 413 and 414 described later .

Guide grooves 431e may be formed on both side surfaces of the body portion 431a. The guide protrusion 412e of the guide portion 412 can be received in the guide groove 431e.

A magnetic rail 431b may be formed along the center line of the moving direction of the body portion 431a. The magnetic rail 431b of the main body 431a and the coil 411 to be described later are combined to constitute a linear motor and the carrier 431 can be transported in the direction A by the linear motor.

A CPS module 431c and a power source unit 431d may be formed on one side of the magnetic rail 431b in the main body 431a. The power supply unit 431d is a kind of rechargeable battery for providing power to allow the electrostatic chuck 432 to chuck and hold the substrate 2 and the CPS module 431c is used to charge the power supply unit 431d Wireless charging module. In detail, a charging track 423 formed in the second transporting unit 420 to be described later is connected to an inverter (not shown) so that when the carrier 431 is transported in the second transporting unit 420 A magnetic field is formed between the charging track 423 and the CPS module 431c to supply power to the CPS module 431c. The power supplied to the CPS module 431c charges the power source unit 431d.

The electrostatic chuck 432 has an electrode to which power is applied, and a high voltage is applied to the inside of the body to attach the substrate 2 to the surface of the body.

Next, the driving of the moving part 430 will be described in detail.

The magnetic rail 431b of the main body 431a and the coil 411 are coupled to each other to constitute a driving unit. Here, the driving unit may be a linear motor. The linear motor is a device with a very low degree of positioning because the friction coefficient is small and the position error is hardly generated as compared with the conventional sliding guidance system. As described above, the linear motor can be composed of the coil 411 and the magnetic rail 431b, and the magnetic rail 431b is arranged in a line on the carrier 431. The coil 411 is arranged on the magnetic rail 431b, A plurality of chambers may be disposed at one side of the chamber 101 at regular intervals. Since the magnetic rail 431b is disposed on the carrier 431 as a moving object instead of the coil 411, the carrier 431 can be driven without applying power to the carrier 431. Here, the coil 411 is formed in the ATM box (atmosphere box) is installed in the standby state, the magnetic rail 431b is attached to the carrier 431 to the carrier 431 in the vacuum chamber 101 is running It will be possible.

Next, the first transfer unit 410 and the moving unit 430 will be described in detail.

4 and 7, the first transfer unit 410 moves the electrostatic chuck 432 holding the substrate 2 and the carrier 431 transferring the same. Here, the first transfer part 410 includes a coil 411, a guide part 412, an upper magnetic levitation bearing 413, a side magnetic levitation bearing 414, and a gap sensor 415, 416.

The coil 411 and the guide portion 412 are formed on the inner surface of the upper housing 104. The coil 411 is formed on the upper inner surface of the upper housing 104, And is formed on both inner side surfaces of the housing 104.

The guide portion 412 serves to guide the carrier 431 to be moved in one direction. At this time, the guide part 412 is formed to penetrate through the deposition part 100.

In detail, the guide portion 412 receives both sides of the carrier 431 and guides the carrier 431 to move along the direction A in FIG. Here, the guide part 412 may include a first accommodating part 412a disposed below the carrier 431, a second accommodating part 412b disposed above the carrier 431, and a first accommodating part 412a. The connection part 412c connecting the second receiving part 412b may be provided. The receiving recess 412d is formed by the first receiving portion 412a, the second receiving portion 412b, and the connecting portion 412c. Both sides of the carrier 431 are received in the receiving groove 412d and the carrier 431 is moved along the receiving groove 412d.

The side magnetic levitation bearings 414 are respectively disposed in the connection portions 412c of the guide portion 412 so as to correspond to both sides of the carrier 431. [ The side magnetic levitation bearing 414 generates a gap between the carrier 431 and the guide portion 412 so that the guide portion 412 is not brought into contact with the guide portion 412 when the carrier 431 moves, To move along. The repulsive force R1 generated between the left side side magnetic levitation bearing 414 and the magnetic substance carrier 431 and the repulsive force generated between the right side side side magnetic levitation bearing 414 and the carrier 431 which is a magnetic body R2 are balanced with each other so that the gap between the carrier 431 and the guide portion 412 is generated and the gap is kept constant.

On the other hand, the upper magnetic levitation bearing 413 may be disposed in the second accommodating portion 412b so as to be positioned on the upper side of the carrier 431. [ The upper magnetic levitation bearing 413 allows the carrier 431 to move along the guide portion 412 without being in contact with the first accommodating portion 412a and the second accommodating portion 412b and maintaining a constant distance therebetween. Do it. That is, the repulsive force R3 and the gravitational force G generated between the upper magnetic levitation bearing 413 and the carrier 431, which is a magnetic body, are parallel to each other and generate a gap between the carrier 431 and the guide portion 412 At the same time, the interval is kept constant.

The guide portion 412 may further include a gap sensor 415. The gap sensor 415 can measure the distance between the carrier 431 and the guide portion 412. [ Referring to FIG. 16, the gap sensor 415 may be disposed in the first accommodating portion 412a to correspond to the lower portion of the carrier 431. The gap sensor 415 disposed in the first accommodating portion 412a can measure the distance between the first accommodating portion 412a and the carrier 431. [ Also, a gap sensor 416 may be disposed on one side of the side magnetic levitation bearing 414. The gap sensor 416 disposed on the side magnetic levitation bearing 414 can measure the distance between the side surface of the carrier 431 and the side surface magnetic levitation bearing 414. [ The present invention is not limited thereto, and the gap sensor 416 may be disposed at the connection portion 412c.

The magnetic force of the magnetic levitation bearings 413 and 414 is changed in accordance with the value measured by the gap sensors 415 and 416 so that the interval between the carrier 431 and the guide portion 412 can be adjusted in real time. That is, the carrier 431 can be precisely moved by feedback control using the magnetic levitation bearings 413 and 414 and the gap sensors 415 and 416.

Next, the second transfer unit 420 and the moving unit 430 will be described in detail.

Referring to FIG. 4 again, the second transfer unit 420 moves the electrostatic chuck 432 and the carrier 431 transferring the substrate to the loading unit 200 after the substrate is separated from the unloading unit 300. Play a role of Here, the second conveying unit 420 includes a coil 421, a roller guide 422, and a charging track 423.

In detail, the coil 421, the roller guide 422 and the charging track 423 are formed on the inner surface of the lower housing 103, respectively, and the double coil 421 and the charging track 423 are formed on the inner surface of the lower housing 103 And the roller guides 422 are formed on the inner surfaces on both sides of the lower housing 103. Here, although not shown in the drawing, the coil 421 may be formed in an atmosphere box like the coil 411 of the first transfer unit 410.

Similarly to the first transfer part 410, the second transfer part 420 also includes a coil 421. The magnetic rail 431b of the main body 431a of the carrier 431 and the coil 421 are coupled with each other, And the driving unit may be a linear motor. By this linear motor, the carrier 431 can move along the direction opposite to the direction A in Fig.

Meanwhile, the roller guide 422 serves to guide the carrier 431 to move in one direction. At this time, the roller guide 422 is formed to penetrate the vapor deposition unit 100. In detail, the roller guide 422 supports the cam followers 431f formed on both sides of the carrier 431, and guides the carrier 431 to move along the direction opposite to the direction A in Fig. That is, the carrier 431 moves while the cam followers 431f formed on both sides of the carrier 431 rotate along the roller guide 422. [ Here, the cam follower 431f is used as a type of bearing to accurately repeat a specific operation. A plurality of such cam followers 431f are formed on the side surface of the carrier 431 and serve as wheels when the carrier 431 is conveyed in the second conveyance unit 420. [ A detailed description of such a cam follower 431f will be omitted in this specification.

As a result, the position of the second carrier 420 is not required to be higher than that of the first carrier 410 because it is a step of transferring the empty carrier 431, not the step of depositing the organic material on the substrate. Therefore, the second conveying unit 420, which requires a relatively high positional accuracy, is applied to the first conveying unit 410, which is required to have a high positional accuracy, And to simplify the structure of the organic layer deposition apparatus. Of course, although not shown in the drawings, it is also possible to apply a magnetic levitation to the second conveying unit 420 as well as the first conveying unit 410.

Meanwhile, the organic layer deposition assembly 100-1 of the thin film deposition apparatus 1 according to the exemplary embodiment may further include a camera 170 and a sensor 180 for alignment. In detail, the camera 170 may align the first mark (not shown) formed on the frame 155 of the patterning slit sheet 150 with the second mark (not shown) formed on the substrate 2 in real time. The sensor 180 may be a confocal sensor. The distance between the substrate 2 and the patterning slit sheet 130 can be measured in real time by providing the camera 170 and the sensor 180 so that the substrate 2 and the patterning slit sheet 130 can be measured in real time. It is possible to obtain an effect that the positional accuracy of the pattern is further improved.

Meanwhile, the organic layer deposition assembly 100-1 of the thin film deposition apparatus 1 according to an embodiment of the present invention may further include a tooling shutter 140 to control the thickness of the deposition material deposited on the substrate 2. Can be. Hereinafter, this will be described in more detail.

In detail, the characteristics of the organic light emitting device are largely dependent on the thickness of the organic material to be formed. Therefore, in order to fabricate an organic light emitting display device of high quality, a tooling operation for correcting thickness of all organic materials formed before deposition is required. Here, tooling refers to deposition of a substrate on which an element (for example, a TFT) is not deposited on a substrate on which organic material is to be deposited at a constant rate, and the substrate thus deposited has the same thickness as an ellipsometer. After measuring the thickness of the organic material deposited using an analyzer capable of measuring, and using the measured thickness to change the tooling factor (T / F) of the organic material or to adjust the deposition rate to the desired target thickness It means the process of vapor deposition. Here, the tooling factor (T / F) means a control parameter in the tooling process based on the ratio of the thickness of the organic film measured by the actual sensor to the thickness of the target organic film.

However, when the tooling (tooling) for the organic material deposited on the substrate in the conventional manner, the tooling for each type of organic material, each deposition source, or each assembly to be deposited, respectively, therefore, one organic material is tooled. This requires a very long tooling time. For example, in the case of the organic layer deposition apparatus 1 shown in FIG. 1, there are 11 organic layer deposition assemblies in total, and each organic layer deposition assembly has three deposition sources, thus performing tooling for each deposition source. In order to do this, a total of 33 toolings have to be performed. Furthermore, organic materials are deposited on a glass substrate to analyze the materials, and therefore investment in substrate materials, materials consumed during deposition, and analytical instruments must be made. For this reason, the conventional method has been a factor in reducing production efficiency and raising material costs and investment costs.

In order to solve such a problem, the organic layer deposition apparatus 1 according to an embodiment of the present invention further includes a tooling shutter 140 to control the thickness of the deposition material deposited on the substrate 2. Forming a plurality of deposition materials on the substrate is characterized in that the tooling for a plurality of deposition sources at the same time.

FIG. 8 is a view illustrating a tooling shutter during deposition of an organic layer in the deposition unit of FIG. 3, and FIG. 9 is a view illustrating a tooling shutter during tooling in the deposition unit of FIG. 3.

8 and 9 show three organic layer deposition assemblies, wherein the first organic layer deposition assembly 100-1 and the third organic layer deposition assembly 100-3 are used to deposit a common layer. It is assumed that the second organic layer deposition assembly 100-2 is an organic layer deposition assembly used to deposit the pattern layer.

In this case, the first organic layer deposition assembly 100-1 and the third organic layer deposition assembly 100-3 used to deposit the common layer have a first tooling shutter 141. In the first tooling shutter 141, a plurality of tooling slits 141a may be formed to be long in the moving direction of the substrate. An average of the thicknesses of the plurality of organic layers deposited on the substrate is obtained through the plurality of tooling slits 141a formed as described above, and a tooling operation of correcting the thickness of the organic material is performed based on the average.

Meanwhile, the first tooling shutter 141 is formed to be movable in the organic layer deposition assembly, so that the first tooling shutter 141 may be disposed on the front surface of the deposition source 110 only when a tooling operation is performed. have. That is, when the organic layer is deposited, as illustrated in FIG. 8, the first tooling shutter 141 is spaced to one side from the deposition source 110 to one side, so that the movement path of the deposition material 115 is opened, and thus the deposition source 110 is formed. A deposition material 115 emanated from) is deposited on the substrate 2. Meanwhile, when a tooling operation is performed, as shown in FIG. 9, the first tooling shutter 141 is disposed in front of the deposition source 110, so that the organic material evaporated from the deposition source 110 is removed. 1 passes through the tooling shutter 141 to form a predetermined pattern layer on the substrate (2).

In this case, the tooling slits 141a of the first tooling shutter 141 disposed in each organic layer deposition assembly may be formed to be offset to each other by a predetermined degree. In other words, the tooling slit 141a of the first organic layer deposition assembly 100-1 and the tooling slit 141a of the third organic layer deposition assembly 100-3 are disposed not to be in the same line with each other, thereby being disposed on the substrate. The organic material evaporated in the first organic layer deposition assembly 100-1 and the organic material evaporated in the third organic layer deposition assembly 100-3 may be formed in different regions, respectively.

Meanwhile, the second organic layer deposition assembly 100-2 used to deposit the pattern layer includes a second tooling shutter 142. Tooling slits 142a for measuring the film thickness may be formed long at both edges of the second tooling shutter 142 in the moving direction of the substrate. As described above, a tooling operation of obtaining an average of the thicknesses of the plurality of pattern layers formed on the substrate through the tooling slits 142a formed at both edges of the second tooling shutter 142 and correcting the thickness of the organic material based on the average Will be done.

Meanwhile, the second tooling shutter 142 is formed to be movable in the organic layer deposition assembly, such that the second tooling shutter 142 may be disposed in front of the deposition source 110 only when a tooling operation is performed. have. That is, when the organic layer is deposited, as illustrated in FIG. 8, the second tooling shutter 142 is spaced to one side from the deposition source 110 to one side, so that the movement path of the deposition material 115 is opened, and thus the deposition source 110 is formed. A deposition material 115 emanated from) is deposited on the substrate 2. Meanwhile, when a tooling operation is performed, as shown in FIG. 9, the second tooling shutter 142 is disposed on the front surface of the deposition source 110, and thus the organic material evaporated from the deposition source 110 is removed. Through the two tooling shutters 142, a predetermined pattern layer is formed on the substrate 2.

In this case, the width of the tooling slit 142a of the second tooling shutter 142 may be formed to be larger than the width of the patterning slit 131 of the patterning slit sheet 130. Because the width of the patterning slit 131 of the patterning slit sheet 130 is hundreds of micrometers similar to the thickness of the pattern layer, but the thickness of the pattern layer that can measure the thickness is at least 2 mm, the second tooling shutter 142 for tooling The width of the tooling slit 142a of () is to be larger than the width of the patterning slit 131 of the patterning slit sheet 130.

As described above, by forming a plurality of linear pattern layers on one substrate, a plurality of organic materials are formed on one substrate and tooling for a plurality of deposition sources is performed at the same time.

Hereinafter, the thickness correction method in the organic layer deposition apparatus 1 will be described in detail.

FIG. 10 is a view illustrating a substrate in which an organic layer is formed while the substrate passes through the first organic layer deposition assembly 100-1 during tooling of FIG. 9, and FIG. 11 illustrates a second organic layer deposition assembly in the tooling of FIG. 9. FIG. 12 is a view illustrating a film in which an organic layer is formed while passing through (100-2), and FIG. 12 is a view showing a film in which an organic layer is formed while passing through a third organic layer deposition assembly (100-3) during the tooling of FIG. 9. to be.

The conventional thickness correction method is as follows. First, film formation is performed by using an arbitrary tooling factor (T / F) and a deposition rate for each of the organic materials to be deposited using a glass substrate for deposition. After that, the thickness of the formed glass substrate is measured by using an analyzer that analyzes the thickness such as ellipsometer. The thickness measurement is then used to adjust the tooling factor to match the target thickness. In addition, in order to confirm that the corrected tooling factor value is correct, each organic material should be checked once again, and the tooling process should be performed once after deposition of about 100 to 120 sheets even after the deposition of the device. .

On the other hand, if the thickness correction method according to the present invention is used, the film formation can be performed using only one substrate without the need to perform the film formation for each deposition source. That is, when the substrate 2 moves in the direction of the arrow A for the tooling operation in the state where the tooling shutters 140 are arranged as shown in FIG. 9, first, the substrate 2 is the first organic layer deposition assembly 100-1. As a result, the deposition material contained in the first organic layer deposition assembly 100-1 is patterned on the substrate 2 to form a first tooling pattern layer 2a on the substrate 2 as shown in FIG. 10. In this case, the first tooling pattern layer 2a is patterned and formed by the tooling shutter 140 of the first organic layer deposition assembly 100-1.

In this state, the substrate 2 continues to move, passes the second organic layer deposition assembly 100-2, and the deposition material contained in the second organic layer deposition assembly 100-2 is patterned on the substrate 2, as shown in FIG. 11. The second tooling pattern layer 2b is formed on the substrate 2. In this case, the second tooling pattern layer 2b is patterned and formed by the tooling slit 131b of the patterning slit sheet 130 of the second organic layer deposition assembly 100-2.

In this state, the substrate 2 continues to move, passes through the third organic layer deposition assembly 100-3, and the deposition material contained in the third organic layer deposition assembly 100-3 is patterned on the substrate 2, as shown in FIG. 12. The third tooling pattern layer 2c is formed on the substrate 2. In this case, the third tooling pattern layer 2c is patterned and formed by the tooling shutter 140 of the third organic layer deposition assembly 100-3.

According to the present invention, since the tooling operation can be performed on a single substrate without depositing on a separate substrate for each deposition source, time is saved compared to when checking the film thickness on a separate substrate to improve productivity. In addition, the cost of the product can be lowered due to the reduced investment cost due to the reduction of the board cost and the number of analysis equipment. Therefore, the mass productivity can be greatly improved.

13 is a perspective view schematically showing an organic layer deposition assembly according to another embodiment of the present invention, FIG. 14 is a schematic side cross-sectional view of the organic layer deposition assembly of FIG. 13, and FIG. 15 is a schematic view of the organic layer deposition assembly of FIG. 13. It is a plan cross-sectional view.

13 to 15, an organic layer deposition assembly 700 according to an embodiment of the present invention includes a deposition source 710, a deposition source nozzle unit 720, a blocking plate assembly 730, and a patterning slit sheet 750. ).

The evaporation source 710 includes a crucible 711 filled with an evaporation material 715 and an evaporation material 715 filled in the crucible 711 by heating the crucible 711 to the evaporation source nozzle portion And a heater 712 for evaporating the refrigerant to the evaporator 720 side. An evaporation source nozzle unit 720 is disposed on one side of the evaporation source 710 and a plurality of evaporation source nozzles 721 are formed on the evaporation source nozzle unit 720 along the X axis direction.

Meanwhile, a blocking plate assembly 730 is provided on one side of the evaporation source nozzle unit 720. The blocking plate assembly 730 includes a plurality of blocking plates 731 and a blocking plate frame 732 provided outside the blocking plates 731. The plurality of blocking plates 731 may be arranged in parallel with each other along the X-axis direction. Here, the plurality of blocking plates 731 may be formed at regular intervals. In addition, each of the blocking plates 731 extends along the YZ plane as viewed in the drawing, and may preferably be provided in a rectangular shape. The plurality of blocking plates 731 arranged as described above divides the space between the evaporation source nozzle unit 720 and the patterning slit 750 into a plurality of evaporation spaces S. That is, in the organic layer deposition assembly 700 according to the exemplary embodiment of the present invention, as shown in FIG. 13, the barrier layer 731 has a deposition space for each deposition source nozzle 721 to which deposition material is sprayed. (S) is separated. The blocking plate 731 separates the space between the evaporation source nozzle unit 720 and the patterning slit sheet 750 into a plurality of evaporation spaces S so that the evaporation from the evaporation source nozzles 721 The material is not mixed with the evaporation materials discharged from the other evaporation source nozzles 721 but is deposited on the substrate 2 through the patterning slit 751. That is, the blocking plates 731 guide the movement path of the evaporation material so that the evaporation material discharged through each evaporation source nozzle 721 is not dispersed but goes straight in the Z-axis direction.

Thus, the size of the shadow formed on the substrate can be greatly reduced by providing the blocking plate 731 to secure the linearity of the evaporation material. Therefore, the organic layer deposition assembly 700 and the substrate 2 can be kept constant It is possible to make the distance between them.

A patterning slit sheet 750 is further provided between the evaporation source 710 and the substrate 2. The patterning slit sheet 750 further includes a frame 755 which is formed in the shape of a window frame. A plurality of patterning slits 751 are formed in the patterning slit sheet 750 along the X-axis direction. The vaporized evaporation material 715 in the evaporation source 710 is directed toward the substrate 2 as the evaporation source through the evaporation source nozzle unit 720 and the patterning slit sheet 750.

16 is a perspective view schematically showing an organic layer deposition assembly according to another embodiment of the present invention.

The organic layer deposition assembly 800 according to the embodiment illustrated in FIG. 16 includes a deposition source 810, a deposition source nozzle unit 820, a first blocking plate assembly 830, a second blocking plate assembly 840, and a patterning slit. Sheet 850. Here, detailed configurations of the deposition source 810, the first blocking plate assembly 830, and the patterning slit sheet 850 are the same as those of the exemplary embodiment of FIG. 13 described above, and thus a detailed description thereof will be omitted. In this embodiment, the first blocking plate assembly 830 is distinguished from the above-described embodiment in that a second blocking plate assembly 840 is provided on one side of the first blocking plate assembly 830.

In detail, the second blocking plate assembly 840 includes a plurality of second blocking plates 841 and a second blocking plate frame 842 provided outside the second blocking plates 841. The plurality of second blocking plates 841 may be provided in parallel with each other along the X-axis direction. The plurality of second blocking plates 841 may be formed at regular intervals. Each second blocking plate 841 is formed so as to be parallel to the YZ plane as viewed in the drawing, that is, perpendicular to the X axis direction.

The plurality of first blocking plates 831 and the second blocking plates 841 arranged in this way serve to partition the space between the evaporation source nozzle unit 820 and the patterning slit sheet 850. That is, the deposition space is separated by each of the evaporation source nozzles 821 through which the evaporation material is injected by the first blocking plate 831 and the second blocking plate 841.

Here, each of the second blocking plates 841 may be disposed so as to correspond one-to-one with the respective first blocking plates 831. In other words, each of the second blocking plates 841 may be aligned with the respective first blocking plates 831 and disposed in parallel with each other. That is, the first blocking plate 831 and the second blocking plate 841 corresponding to each other are located on the same plane. Although the figure shows that the length of the first blocking plate 831 and the width of the second blocking plate 841 in the X-axis direction are the same, the spirit of the present invention is not limited thereto. That is, the second blocking plate 841, which requires precise alignment with the patterning slit 851, is relatively thin, while the first blocking plate 831, which does not require precise alignment, It is also possible to make it thick and easy to manufacture.

17 is a perspective view schematically illustrating an organic layer deposition assembly according to another embodiment of the present invention.

Referring to FIG. 17, an organic layer deposition assembly 900 according to another embodiment of the present invention includes an evaporation source 910, an evaporation source nozzle unit 920, and a patterning slit sheet 950.

The evaporation source 910 includes a crucible 911 filled with an evaporation material 915 and an evaporation material 915 filled in the crucible 911 by heating the crucible 911 to the evaporation source nozzle portion 920). An evaporation source nozzle unit 920 is disposed on one side of the evaporation source 910 and a plurality of evaporation source nozzles 921 are formed on the evaporation source nozzle unit 920 along the Y axis direction. A patterning slit sheet 950 and a frame 955 are further provided between the evaporation source 910 and the substrate 2. A plurality of patterning slits 951 are formed in the patterning slit sheet 950 along the X- And spacers 952 are formed. The deposition source 910, the evaporation source nozzle unit 920, and the patterning slit sheet 950 are coupled by a connecting member 935.

The present embodiment differs from the above-described embodiments in the arrangement of the plurality of evaporation source nozzles 921 provided in the evaporation source nozzle unit 920, which will be described in detail.

An evaporation source nozzle unit 920 is disposed on one side of the evaporation source 910, specifically, on the side of the evaporation source 910 that faces the substrate 2. A plurality of evaporation source nozzles 921 are formed in the evaporation source nozzle portion 920 along the Y axis direction, that is, the scanning direction of the substrate 2. [ Here, the plurality of evaporation source nozzles 921 may be formed at regular intervals. The evaporated material 915 vaporized in the evaporation source 910 passes through the evaporation source nozzle unit 920 and is directed toward the substrate 2 as the evaporation source. As a result, a plurality of evaporation source nozzles 921 are formed along the scanning direction of the substrate 2 in one organic layer deposition assembly 900-1. In this case, if a plurality of evaporation source nozzles 921 are provided in the X axis direction, the distances between the evaporation source nozzles 921 and the patterning slits 951 are different from each other. At this time, the distance between the patterning slits 951 and the distance A shadow is generated by the evaporation material emitted from the evaporation source nozzle 921 farther away. Therefore, by forming the evaporation source nozzle 921 such that there is only one evaporation source nozzle 921 in the X-axis direction as in the present invention, generation of shadows can be greatly reduced. In addition, since a plurality of evaporation source nozzles 921 exist in the scanning direction, even if a flux difference occurs between the individual evaporation source nozzles, the difference is canceled, and the uniformity of deposition is maintained constant.

Hereinafter, the structure of the organic layer formed by the organic layer deposition apparatus according to one embodiment of the present invention will be described in detail.

FIG. 18 is a view illustrating patterning slits formed at equal intervals in a patterning slit sheet in an organic layer deposition apparatus, and FIG. 19 is a view illustrating an organic layer formed on a substrate using the patterning slit sheet of FIG. 18.

18 and 19 illustrate the patterning slit sheet 150 with the patterning slits 131 disposed at equal intervals. That is, in FIG. 18, the relationship of l ₁ = l ₂ = l ₃ = l ₄ is established.

In this case, the angle of incidence of the deposition material passing through the center line C of the deposition space S is almost perpendicular to the substrate 2. [ Accordingly, the shadow of the organic layer P ₁ formed by the deposition material having passed through the patterning slit 131a has a minimum size, and the right shade SR ₁ and the left shadow SL ₁ are symmetric Respectively.

However, the critical incident angle [theta] of the deposition material passing through the patterning slit disposed away from the center line C of the deposition space S gradually becomes larger so that the critical value of the deposition material passing through the endmost patterning slit 131e The incident angle [theta] becomes about 55 [deg.]. Accordingly, the deposition material is inclined with respect to the patterning slit 131e, and the organic layer P ₅ formed by the deposition material passing through the patterning slit 131e has a maximum shadow size, The left shadow SR ₅ is formed longer than the right shadow SR ₅ .

That is, as the critical incident angle? Of the evaporation material increases, the size of the shadow increases. Particularly, the size of the shadow far from the center line C of the deposition space S is increased do. The critical incidence angle? Of the evaporation material increases as the distance from the central portion of the deposition space S to the patterning slit increases. Therefore, the shadow of the organic layer becomes larger as the distance from the center line C of the deposition space S to the patterning slit increases. Particularly, the shadow of both ends of the organic layer increases, The size of the shadow farther from the point C becomes larger.

That is, as shown in FIG. 19, the organic layers formed on the left side with respect to the center line C of the deposition space S are formed such that the left hypotenuse is longer than the right hypotenuse, and based on the centerline C of the deposition space S The organic layers formed on the right side are formed such that the right hypotenuse is longer than the left hypotenuse.

The organic layers formed on the left side with respect to the center line C of the deposition space S are formed such that the length of the left hypotenuse is longer as the organic layer formed on the left side is longer, The longer the right hypotenuse is formed in the organic layer formed on the right side. As a result, the organic layers formed in the deposition space S may be formed to be symmetrical with respect to the center line of the deposition space S.

This will be described in more detail as follows.

Deposition material passing through the patterning slit (131b) are to pass through the patterning slit (131b) into the critical angle of incidence of θ _b, the left shade in this case the organic layer (P ₂₎ formed by the deposited material that has passed through the patterning slit (131b) the shadow is formed in the size of SL ₂ . Similarly, the deposition material passing through the patterning slits (131c) are to pass through the patterning slit (131c) to the threshold angle of incidence of θ _c, in this case the organic layer (P ₃₎ formed by the deposited material that has passed through the patterning slits (131c) The left shadow is formed with the size of SL ₃ . Similarly, the deposition material passing through the patterning slit (131d) are to pass through the patterning slit (131d) to the threshold angle of incidence of θ _d, the case of the organic layer (P ₄₎ formed by the deposited material that has passed through the patterning slit (131d) The left shadow is formed with a size of SL ₄ . Finally, the deposition material passing through the patterning slit (131e) are to pass through the patterning slit (131e) the critical angle of incidence of θ _e, in this case the organic layer formed by the vapor deposition material that has passed through the patterning slit (131e) (P ₅₎ The left shadow of the pixel is formed with the size of SL ₅ .

Here, θ _b <θ _c <Between θ _d <θ _e is, each of the shades of the organic layer was passed through the patterning slit (shadow), so establishing the size _{relationship, SL 1 <SL 2 <SL} 3 <SL 4 <SL 5 .

20 is a cross-sectional view of an active matrix organic light emitting display device manufactured using the organic layer deposition apparatus of the present invention.

Referring to FIG. 20, the active mattress organic light emitting display device 10 is formed on a substrate 2. The substrate 2 may be formed of a transparent material such as a glass material, a plastic material, or a metal material. On the substrate 2, an insulating film 31 such as a buffer layer is formed as a whole.

On the insulating film 31, a TFT 40, a capacitor 50, and an organic light emitting element 60 as shown in FIG. 20 are formed.

On the upper surface of the insulating film 31, a semiconductor active layer 41 arranged in a predetermined pattern is formed. The semiconductor active layer 41 is buried in the gate insulating film 32. The active layer 41 may be formed of a p-type or n-type semiconductor.

A gate electrode 42 of the TFT 40 is formed on the upper surface of the gate insulating film 32 to correspond to the active layer 41. An interlayer insulating film 33 is formed so as to cover the gate electrode 42. After the interlayer insulating film 33 is formed, a contact hole is formed by etching the gate insulating film 32 and the interlayer insulating film 33 by an etching process such as dry etching so that a part of the active layer 41 is exposed.

Next, a source / drain electrode 43 is formed on the interlayer insulating film 33 and is formed to contact the active layer 41 exposed through the contact hole. A protective layer 34 is formed to cover the source / drain electrode 43 and a portion of the drain electrode 43 is exposed through an etching process. A separate insulating layer may be further formed on the passivation layer 34 to planarize the passivation layer 34.

The organic light emitting diode 60 may emit red, green, or blue light according to the current flow to display predetermined image information. The organic light emitting diode 60 may include a first electrode 61 formed on the protection layer 34 do. The first electrode 61 is electrically connected to the drain electrode 43 of the TFT 40.

A pixel defining layer 35 is formed to cover the first electrode 61. After forming a predetermined opening in the pixel defining layer 35, an organic layer 63 including a light emitting layer is formed in the region defined by the opening. A second electrode 62 is formed on the organic layer 63.

The pixel defining layer 35 divides each pixel and is formed of an organic material to flatten the surface of the substrate on which the first electrode 61 is formed, particularly, the surface of the protective layer 34.

The first electrode 61 and the second electrode 62 are insulated from each other and a voltage of different polarity is applied to the organic layer 63 including the light emitting layer to emit light.

When a low-molecular organic material is used, a hole injection layer (HIL), a hole transport layer (HTL), a light emitting layer (EML), a light emitting layer An electron transport layer (ETL), and an electron injection layer (EIL) may be stacked in a single or a composite structure. The usable organic material may include copper phthalocyanine (CuPc) phthalocyanine, N, N'-di (naphthalen-1-yl) -N, N'-diphenyl-benzidine ), Tris-8-hydroxyquinoline aluminum (Alq3), and the like.

Here, the organic layer 63 including the emission layer may be deposited by the organic layer deposition apparatus (see 1 of FIG. 1) illustrated in FIGS. 1 to 18. That is, an evaporation source that emits evaporation material, an evaporation source nozzle unit which is disposed on one side of the evaporation source and in which a plurality of evaporation source nozzles are formed, and a patterning slit sheet which is arranged to face the evaporation source nozzle unit and in which a plurality of patterning slits are formed (See 1 in Fig. 1) and the substrate (see 2 in Fig. 1) are arranged relative to the other side with respect to the other side While moving, a deposition material which is emitted from an organic layer deposition apparatus (see 1 in Fig. 1) is deposited on a substrate (see 2 in Fig. 1).

After the organic light emitting layer is formed, the second electrode 62 may be formed by the same deposition process.

The first electrode 61 and the second electrode 62 may function as an anode and a cathode, respectively. Of course, the first electrode 61 and the second electrode 62 ) May be reversed. The first electrode 61 may be patterned to correspond to a region of each pixel, and the second electrode 62 may be formed to cover all the pixels.

The first electrode 61 may be a transparent electrode or a reflective electrode. When the first electrode 61 is used as a transparent electrode, the first electrode 61 may be formed of ITO, IZO, ZnO, or In 2 O 3. A transparent electrode layer may be formed of ITO, IZO, ZnO, or In 2 O 3 on the reflective layer formed of Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, The first electrode 61 is formed by a sputtering method or the like, and then patterned by a photolithography method or the like.

Meanwhile, the second electrode 62 may also be provided as a transparent electrode or a reflective electrode. When the second electrode 62 is used as a transparent electrode, since the second electrode 62 is used as a cathode, a metal having a small work function, namely, Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and compounds thereof are deposited to face the organic layer 63 including the light emitting layer, and thereafter, ITO, IZO, ZnO, or In2O3. The auxiliary electrode layer and the bus electrode line can be formed by, for example. Li, Ca, LiF / Ca, LiF / Al, Al, Ag, Mg, and a compound thereof are deposited on the entire surface when the electrode is used as a reflective electrode. At this time, the deposition can be performed in the same manner as in the case of the organic layer 63 including the above-described light emitting layer.

In addition, the present invention can be used for deposition of an organic layer or an inorganic film of an organic TFT, and the present invention is applicable to other various film forming processes.

Although the present invention has been described with reference to the limited embodiments, various embodiments are possible within the scope of the present invention. It will also be understood that, although not described, equivalent means are also incorporated into the present invention. Therefore, the true scope of protection of the present invention should be defined by the following claims.

1: Organic layer deposition apparatus
100:
200: loading section
300: Unloading section
400:

Claims (40)

A moving part formed to be movable with the fixed substrate fixed to the substrate; a first conveying part for moving the moving part in which the substrate is fixed in a first direction; and a second conveying part for moving the moving part, A conveying part including a second conveying part for moving the conveying part in a direction opposite to the first direction; And
And a deposition unit including a chamber maintained in a vacuum and at least one organic layer deposition assembly for depositing an organic layer on the substrate fixed to the moving unit.
The organic layer deposition assembly includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles;
A patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits arranged along any one direction; And
And a first tooling shutter disposed between the deposition source and the patterned slit sheet so as to cover at least a portion of the substrate, and having at least one tooling slit formed along the first direction.
Wherein the moving unit is configured to be circuable between the first transfer unit and the second transfer unit,
And the substrate fixed to the moving part is formed to be spaced apart from the organic layer deposition assembly by a predetermined degree while being moved by the first transfer part. The method according to claim 1,
The first tooling shutter is provided in each of the organic layer deposition assembly,
And the tooling slits formed in the first tooling shutters are offset to each other by a predetermined degree. 3. The method of claim 2,
And the first tooling shutter is provided in an organic layer deposition assembly for depositing a common layer among a plurality of organic layer deposition assemblies. The method according to claim 1,
And the first tooling shutter is disposed to cover at least a part of the substrate only when the tooling substrate is transferred in the deposition unit. The method according to claim 1,
An organic layer deposition assembly for depositing a pattern layer among a plurality of organic layer deposition assemblies may be disposed between the deposition source and the patterning slit sheet to cover at least a portion of the substrate, and may be disposed at both ends in the first direction. And a second tooling shutter having a tooling slit formed thereon. 6. The method of claim 5,
And the width of the tooling slit of the second tooling shutter is greater than the width of the patterning slit of the patterning slit sheet. The method according to claim 1,
Wherein the first transfer unit and the second transfer unit are configured to pass through the deposition unit when passing through the deposition unit. The method according to claim 1,
Wherein the first transfer unit and the second transfer unit are arranged vertically in parallel. The method according to claim 1,
The organic layer deposition apparatus includes:
A loading part for fixing the substrate to the moving part;
And an unloading part separating the substrate from which the deposition is completed while passing through the deposition part from the moving part. The method of claim 9,
Wherein the first transfer unit sequentially moves the moving unit to the loading unit, the deposition unit, and the unloading unit. The method of claim 9,
Wherein the second transfer unit sequentially moves the moving unit to the unloading unit, the deposition unit, and the loading unit. The method according to claim 1,
The organic layer deposition assembly includes:
Wherein the deposition material emitted from the deposition source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate. 13. The method of claim 12,
Wherein the patterning slit sheet of the organic layer deposition assembly is formed to be smaller than the substrate in at least one of the first direction and the second direction. The method according to claim 1,
A magnetic rail is formed on one side of the carrier,
A plurality of coils are formed in each of the first and second conveyance units,
And a driving unit generating a driving force to couple the magnetic rail and the coil to move the moving unit. The method according to claim 1,
A plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along a first direction,
The patterning slit sheet is formed with a plurality of patterning slits in the first direction,
The organic layer deposition apparatus may be arranged along the first direction between the deposition source nozzle unit and the patterning slit sheet to divide a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of deposition spaces. And a blocking plate assembly having two blocking plates. 16. The method of claim 15,
And each of the plurality of blocking plates is formed to extend in a second direction substantially perpendicular to the first direction. 16. The method of claim 15,
And the blocking plate assembly comprises a first blocking plate assembly having a plurality of first blocking plates and a second blocking plate assembly having a plurality of second blocking plates. The method according to claim 1,
A plurality of evaporation source nozzles are formed in the evaporation source nozzle portion along a first direction,
Wherein the patterning slit sheet is formed with a plurality of patterning slits along a second direction perpendicular to the first direction. 19. The method of claim 18,
And the deposition source, the deposition source nozzle unit, and the patterning slit sheet are integrally formed by a coupling member. 20. The method of claim 19,
And the connection member guides a movement path of the deposition material. 21. The method of claim 20,
And the connection member is formed to seal a space between the deposition source and the deposition source nozzle unit and the patterning slit sheet from the outside. A method of manufacturing an organic light emitting display device using an organic layer deposition apparatus for forming an organic layer on a substrate,
Moving the moving part into the chamber by a first transfer part installed to penetrate the chamber while the substrate is fixed to the moving part;
In a state where the substrate is separated from the plurality of organic layer deposition assemblies disposed in the chamber by a predetermined distance, the deposition material emitted from the organic layer deposition assemblies is deposited on the substrate while the substrate is moved relative to the organic layer deposition assemblies. Forming an organic layer; And
And the moving unit separated from the substrate is returned by a second transfer unit installed to penetrate the chamber.
The step of forming the organic layer includes:
Patterning the deposition material on the tooling substrate by a first tooling shutter having one or more tooling slits formed thereon while the tooling substrate is transported in the organic layer deposition assemblies. . 23. The method of claim 22,
The first tooling shutter is provided in each of the organic layer deposition assembly,
And the tooling slits formed in the first tooling shutters are offset to each other by a predetermined degree. 24. The method of claim 23,
And the first tooling shutter is provided in an organic layer deposition assembly for depositing a common layer among a plurality of organic layer deposition assemblies. 23. The method of claim 22,
And the first tooling shutter is disposed so as to cover at least a portion of the substrate only when the tooling substrate is transferred in the organic layer deposition assembly. 23. The method of claim 22,
Fixing the substrate to the moving part in the loading part before the moving part is transferred by the first transfer part;
And separating the substrate from which the deposition is completed in the unloading unit from the moving unit before the moving unit is returned by the second transfer unit. 23. The method of claim 22,
Wherein the moving part circulates between the first transfer part and the second transfer part. 23. The method of claim 22,
Wherein the first transfer part and the second transfer part are vertically arranged. 29. The method according to any one of claims 22 to 28,
The thin film deposition assembly includes:
An evaporation source for emitting a deposition material;
An evaporation source nozzle unit disposed at one side of the evaporation source and having a plurality of evaporation source nozzles; And
And a patterning slit sheet disposed opposite to the evaporation source nozzle portion and having a plurality of patterning slits arranged therein,
Wherein the deposition material emitted from the evaporation source passes through the patterning slit sheet and is deposited while forming a pattern on the substrate. 30. The method of claim 29,
In the organic layer deposition assembly for depositing a pattern layer of the plurality of organic layer deposition assembly, is formed between the deposition source and the patterning slit sheet to cover at least a portion of the substrate, the tooling slit formed on both ends And a tooling shutter is further formed. 31. The method of claim 30,
And the width of the tooling slit of the second tooling shutter is greater than the width of the patterning slit of the patterning slit sheet. 30. The method of claim 29,
Wherein the patterning slit sheet of the thin film deposition assembly is formed to be smaller than the substrate in at least one of the first direction and the second direction. Board;
At least one thin film transistor formed on the substrate, the thin film transistor having a semiconductor active layer, a gate electrode insulated from the semiconductor active layer, and source and drain electrodes respectively contacting the semiconductor active layer;
A plurality of pixel electrodes formed on the thin film transistor;
A plurality of organic layers formed on the pixel electrodes; And
And an opposing electrode formed on the organic layers,
The at least one organic layer on the substrate is formed so that the length of the hypotenuse farther from the center of the deposition region is longer than the length of the hypotenuse near the center of the deposition region,
Wherein at least one of the organic layers on the substrate is a linear pattern formed using the organic layer deposition apparatus of claim 1. 34. The method of claim 33,
Wherein the substrate has a size of 40 inches or more. 34. The method of claim 33,
Wherein the organic layer comprises at least a light emitting layer. 34. The method of claim 33,
Wherein the organic layer has a non-uniform thickness. 34. The method of claim 33,
Wherein an organic layer formed far from the center of the deposition region has a longer side of a hypotenuse farther from the center of the deposition region. 34. The method of claim 33,
Wherein the plurality of organic layers disposed in the deposition region are formed to have narrower widths of the overlapping regions of the two sides extending in the first direction as the distance from the center of the deposition region increases. 34. The method of claim 33,
Wherein the organic layer disposed at the center of the deposition region is formed such that the lengths of the oblique sides are substantially equal to each other. 34. The method of claim 33,
Wherein the organic layers disposed in the deposition region are symmetrically disposed with respect to a center of the deposition region.

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