KR20140038663A - Encapsulation composition, cured products and organic light emitting device - Google Patents

Abstract

The present invention relates to an encapsulation composition, a cured product of the same, and an organic light emitting device, and more specifically, to an encapsulation composition which can be easily cured at low temperatures or by ultraviolet rays, and satisfies low contractibility, thermal resistance and solventless properties, thereby easily sealing an organic light emitting device without damaging the organic light emitting device; a cured product which can minimize the transfer of physical impacts, moisture, and oxygen from the outside to an organic light emitting layer using the encapsulation composition; and the organic light emitting device including the same.

Description

Encapsulation Composition, Cured Products and Organic Light Emitting Device

The present invention relates to a composition for an encapsulant, a cured product thereof, and an organic light emitting device, and more particularly, an encapsulation that improves the lifespan of an organic light emitting device and minimizes a physical shock applied to the organic light emitting layer. It relates to a composition for reuse, its cured product and organic light emitting device.

Following the liquid crystal display (LCD) and plasma display panel (PDP), the organic light emitting diode (OLED) is a display device attracting attention of the next generation.

The organic light emitting diode is a method of forming a positive electrode, an organic light emitting layer and a negative electrode in order on a substrate, and applying a voltage between the positive electrode and the negative electrode to move the electrons and holes to the organic light emitting layer, respectively, and then recombine to generate light. .

On the other hand, the organic light emitting layer is very vulnerable to moisture and oxygen may be a factor in reducing the lifetime if moisture and oxygen penetrates into the organic light emitting device. Therefore, the encapsulation technology for protecting the organic light emitting layer from the external environment is very important.

Currently, the most commonly used encapsulation technology is a method of covering an encapsulation portion such as an encapsulating glass or a metal can on the top surface of the manufactured organic light emitting device. At this time, the sealant is applied to any one of the substrate region and the encapsulation portion where the organic light emitting layer is not formed, and the encapsulation portion is disposed on the upper surface of the organic light emitting layer to cure the sealant, thereby bonding the substrate and the encapsulation portion.

However, such a sealing method is impossible to complete passivation (passivation), when the device is left for a long time, the external moisture and oxygen flows in the problem of damaging the device. In addition, when the organic light emitting layer is encapsulated with a metal can or glass, an external physical shock is transmitted to the lower layer as it is, so that the organic light emitting device is easily damaged.

The main object of the present invention is to provide a composition for encapsulation material that can be easily cured by low temperature or ultraviolet light, and satisfies low shrinkage, heat resistance, and solvent-free type characteristics, and thus can be easily sealed without damaging the organic light emitting device. have.

The present invention also provides a cured product and an organic light emitting device including the same, which can minimize physical shock, moisture, and oxygen transmitted from the outside to the organic light emitting layer.

In order to achieve the above object, the present invention provides a composition for an encapsulant comprising a compound represented by the following formula (1), a compound represented by the formula (2), a thermal initiator and a photoinitiator.

≪ Formula 1 >

R ¹ Si (OR ² )

In Formula 1, R ¹ is a hydrocarbon group having 1 to 8 carbon atoms having at least one thiol group or an aromatic hydrocarbon group having at least one thiol group, and R ² is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms Or an aromatic hydrocarbon group having 1 to 8 carbon atoms,

(2)

또는

or

In Formula 2, X is A or Am-, A is an epoxy group, a urethane group, an acryl group or a vinyl group, m is a linker connecting the A and the silicon atom, an alkyl group having 1 to 8 carbon atoms, An aryl group or a phenyl group, R ₁ to R ₆ are the same or different, and each independently a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, an alkenyl group, an alkynyl group, a glycidyl group, a halogen group or a phenyl group, and R ₁ to R At least one of ₃ is a phenyl group, R ₁ to R _{3 which} is not a phenyl group One or more of Is a hydroxyl group or an alkoxy group, R ₄ At least one of R ₆ is a phenyl group, and R _{4 which} is not a phenyl group At least one of R ₆ is a hydroxy group or an alkoxy group, and a is an integer of 1 to 5.

In a more preferred embodiment of the present invention, in view of high refractive index and hardening density, the hydrocarbon groups of R ¹ and R ² in Formula 1 may be independently selected from the group consisting of alkyl, allyl and phenyl groups.

In a more preferred embodiment of the present invention, in view of high refractive index and hardening density, the alkyl group or alkoxy group of R ₁ to R ₆ in Formula 2 may each independently have 1 to 6 carbon atoms, and the alke of R ₁ to R ₆ in Formula 2 The alkyl group or alkynyl group may be independently characterized as having 2 to 6 carbon atoms. have.

The present invention in a more preferred form can be easily cured by low temperature or ultraviolet light, in order to satisfy the low shrinkage, heat resistance and solvent-free type characteristics, the composition for encapsulant 10 to 50% by weight of the compound represented by the formula (1), It may be characterized in that it comprises 50 to 85% by weight of the compound represented by the formula (2), 1 to 10% by weight of the thermal initiator and 1 to 5% by weight of the photoinitiator.

This invention also provides the hardened | cured material manufactured from the said composition for sealing materials.

The present invention in a more preferred form in terms of preventing the damage of the cured product, the cured product may be characterized in that it is prepared by photocuring at a condition of 500 ~ 3000Mj curing energy at 300 to 400nm.

The present invention in a more preferred form in terms of preventing damage to the cured product, the cured product may be characterized in that it is prepared by thermal curing under conditions at 80 to 100 ℃.

The present invention also provides an organic light emitting device comprising the cured product.

The composition for encapsulation according to the present invention is easily cured by low temperature or ultraviolet rays, and satisfies low shrinkage, heat resistance, and solvent-free type characteristics, thereby allowing moisture and oxygen to flow into the organic light emitting device as it can be sealed without damaging the organic light emitting device. It effectively blocks the life and at the same time improves the life of the organic light emitting device, absorbing and mitigating physical impact applied from the outside can minimize the transmission of the impact to the organic light emitting layer.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. In general, the nomenclature used herein is well known and commonly used in the art.

Throughout this specification, when an element is referred to as "including " an element, it is understood that the element may include other elements as well, without departing from the other elements unless specifically stated otherwise.

The present invention relates to a composition for an encapsulant comprising, in one aspect, a compound represented by Formula 1, a compound represented by Formula 2, a thermal initiator, and a photoinitiator.

≪ Formula 1 >

R ¹ Si (OR ² )

In Formula 1, R ¹ is a hydrocarbon group having 1 to 8 carbon atoms having at least one thiol group or an aromatic hydrocarbon group having at least one thiol group, and R ² is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms Or an aromatic hydrocarbon group having 1 to 8 carbon atoms,

(2)

또는

or

In Formula 2, X is A or Am-, A is an epoxy group, a urethane group, an acryl group or a vinyl group, m is a linker connecting the A and the silicon atom, an alkyl group having 1 to 8 carbon atoms, An aryl group or a phenyl group, R ₁ to R ₆ are the same or different, and each independently a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, an alkenyl group, an alkynyl group, a glycidyl group, a halogen group or a phenyl group, and R ₁ to R At least one of ₃ is a phenyl group, at least one of R ₁ to R ₃ which is not a phenyl group A hydroxy group or an alkoxy group, R ₄ to R ₆ is not less than at least one of a phenyl group, a phenyl group non-R ₄ At least one of R ₆ is a hydroxy group or an alkoxy group, and a is an integer of 1 to 5.

More specifically, the encapsulant composition of the present invention contains a compound having a siloxane structure in the molecular chain and having a thiol group as a reactive end group and a compound having a phenyl siloxane structure in the molecular chain, thereby being easily cured by low temperature or ultraviolet rays. It is possible to seal the organic light emitting device without damaging the organic light emitting device by satisfying the low shrinkage, heat resistance and solvent-free type characteristics, thereby minimizing the transmission of physical impact, moisture and oxygen applied to the organic light emitting layer.

Compound represented by Formula 1 serves to increase the degree of cure and curing density in the composition for the encapsulant, having a siloxane structure in the molecular chain, having a thiol group as a reactive end group, to accelerate the curing rate at ultraviolet or low temperature Hardening degree can be raised.

In the compound represented by Formula 1, the hydrocarbon group of R ¹ and R ² may be selected from the group consisting of an alkyl group, an aryl group and a phenyl group in terms of increasing the degree of curing and degree of curing, more preferably methyl, ethyl and phenyl groups It may be selected from the group consisting of.

The compound represented by Formula 1 includes 10 to 50% by weight, based on the total weight% of the composition for encapsulant, when included in less than 10% by weight, the effect is negligible, when it exceeds 50% by weight cured Reliability may be lowered because the curing density and degree of curing of water are low.

In addition, the compound represented by the formula (2) serves as a cross linker (cross linker) in the composition for the sealing material, by having a phenyl siloxane structure in the molecular chain, it is possible to improve the brightness of the cured product with a high refractive index.

In Formula 2, the alkyl group or alkoxy group of R ₁ to R ₆ may have 1 to 6 carbon atoms in terms of bonding rate and bonding degree, preferably an alkyl group is a methyl group or an ethyl group, and the alkoxy group may be a methoxy group or an ethoxy group. .

In Formula 2, the alkenyl group or alkynyl group of R ₁ to R ₆ has 2 to 6 carbon atoms in terms of refractive index, chemical resistance, and shrinkage resistance, and may be preferably ethenyl or ethynyl.

The compound represented by Formula 2 includes 50 to 85% by weight, based on the total weight% of the composition for encapsulant, when included in less than 50% by weight, the effect is minimal, and hardening when it exceeds 85% by weight. Due to the high speed and curing energy, problems of low temperature curing and long wavelength irradiation energy may not occur.

In the present invention, the thermal initiator serves as a curing agent to form a silicone rubber or resin by curing the composition for encapsulant, the radical produced by generating a radical by heat reacts with the compound represented by the formula (2) composition for encapsulant Harden.

The thermal initiator may be used alone or in combination of two or more compounds of the organic peroxide compound or azo compound. Specific examples of the organic peroxide compound include benzoyl peroxide, t-butyl perbenzoate, o-methylbenzoyl peroxide, p-methylbenzoyl peroxide, di-t-butyl peroxide, dicumyl peroxide, 1, 1-bis (t-butylperoxy) -3,3,5-trimethylcyclohexane, 1,1-di (t-butylperoxy) cyclohexane, 2,5-dimethyl-2,5-di (t- Butylperoxy) hexane, 2,5-dimethyl-2,5-di (t-butylperoxy) hexyne, 1,6-bis (p-toluoylperoxycarbonyloxy) hexane and di (4-methylbenzoyl Peroxy) hexamethylene biscarbonate etc. are mentioned.

In addition, specific examples of the azo compound include 2'-azobis (4-methoxy-2,4-dimethylvaleronitrile, 2,2'-azobis (2,4-dimethyl) valeronitrile, azobis Isobutyronitrile, 2,2'- azobis (2-methylbutyronitrile), etc. are mentioned.

The thermal initiator contains 1 to 10% by weight based on the total weight of the composition for encapsulant, when included in less than 1% by weight, the effect is insignificant, and when the content exceeds 10% by weight, the residue remains. It may occur as an outgasing component.

In the present invention, the photoinitiator serves as a curing agent to form a silicone rubber or resin by curing the composition for encapsulant, the radical produced by generating radicals by ultraviolet light reacts with the compound represented by the formula (2) composition for encapsulant Harden.

The photoinitiator may be a benzophenone compound, an oxime compound, a phosphine oxide compound, or the like, but is not limited thereto. More specifically, the benzophenone-based compound is 2-hydroxy-2-methyl-1-phenyl-1-propanone (2-hydroxy-2-methyl-1-phenyl-1-propanone), 2-hydroxy -1- [4- (2-hydroxyethoxy) phenyl] -2-methyl-1-propanone (2-hydroxy-1- [4- (2-hydroxyethoxy) phenyl] -2-methyl-1-propanone ), Alpha-dimethoxy-alpha-phenylacetophenone, 2-benzyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1-butanone (2-benzyl-2- (dimethylamino) -1- [4- (4-morpholinyl) phenyl] -1-butanone), 2-methyl-1- [4- (methylthio) phenyl] -2- (4- Morpholinyl) -1-propanone (2-methyl-1- [4- (methylthio) phenyl] -2- (4-morpholinyl) -1-propanone) and the like.

Examples of the oxime compound include (hydroxyimino) cyclohexane, 1- [4- (phenylthio) phenyl] -octane-1,2-dione-2- (O-benzoyloxime (1- [4- (phenylthio) phenyl] -octane-1,2-dione-2- (O-benzoyloxime)), 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl ] -Ethanone-1- (O-acetylroxime) (1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazol-3-yl] -ethanone-1- (O-acetyloxime)), Triclo Trichloromethyl-triazine derivatives, 4- (4-methoxystyryl) -2,6-trichloromethyl-1,3,5-triazine (4- (4-methoxystyryl) -2 , 6-trichloromethyl-1,3,5-triazine), 4- (4-methoxyphenyl) -2,6-trichloromethyl-1,3,5-triazine (4- (4-methoxyphenyl) -2 , 6-trichloromethyl-1,3,5-triazine), ∝-aminoketone (1- (4-morpholinophenyl) -2-dimethylamino-2-benzyl-butane-1-one (∝-aminoketone (1 -(4-morpholinophenyl) -2-dimethylamino-2-benzyl-butan-1-one) etc. are mentioned.

The phosphine oxide compound may be diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide (diphenyl (2,4,6-trimethylbenzoyl) -phosphine oxide), phenyl bis (2,4,6-trimethyl Benzoyl (phenyl bis (2,4,6-trimethyl benzoyl)) and the like.

Such photoinitiator contains 1 to 5% by weight based on the total weight of the composition for encapsulant, when less than 1% by weight, the effect is negligible, and when the content exceeds 5% by weight, the residue remains out. Guessing components may be generated.

Meanwhile, the composition for encapsulant according to the present invention may include a diluent, a plasticizer, an adhesion promoter, an inorganic filler, and an antioxidant.

The diluent serves to lower the viscosity, and may be used in an amount of 30 wt% or less, preferably 0.01 to 30 wt%, and more preferably 0.05 to 10 wt%, based on the total weight% of the composition for encapsulant. Can be. When the content of the diluent is within the above range, the viscosity can be effectively lowered and the degree of curing can be increased.

Examples of the diluent include silicone oil or a (meth) acrylate-based compound, preferably a methyldisiloxane-based compound having a siloxane group in the molecular chain and not reactive to the sock group. Specific examples thereof include octamethylcyclotetrasiloxane (octamethylcyclotetrasiloxan), dimethylsiloxane (dimethylsiloxane), metatetrasiloxane (methatetrasiloxan) and the like.

Specific examples of the (meth) acrylate-based compound include polyethylene glycol di (meth) acrylate, bisphenol-A di (meth) acrylate, such as ethoxylated bisphenol-A (meth) acrylate, tetrahydrofuran (meth) acrylic Late and di (meth) acrylates, citronelyl acrylate and citronelyl methacrylate, hydroxypropyl (meth) acrylate, hexanediol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, Tetrahydrodicyclopentadienyl (meth) acrylate, ethoxylated trimethylolpropane triacrylate, triethylene glycol diacrylate and triethylene glycol dimethacrylate, isobornyl acrylate, isobornyl methacrylate, etc. Can be mentioned.

In addition, the adhesion promoter is for modifying the curing or non-curing properties according to the requirements of the specific application, and specific examples thereof include (meth) acryloxypropyltrimethoxysilane, trialkyl or triallyl isocyanurate, glycidoxy Propyl trimethoxysilane, etc. are mentioned.

The modifier may include 20% by weight or less, preferably 1 to 10% by weight based on the total weight of the composition for the encapsulant.

In addition, the non- (meth) acrylic silicone diluent or plasticizer may comprise 30% by weight or less, preferably 1 to 10% by weight, based on the total weight of the composition for the encapsulant.

Examples of such non- (meth) acrylic silicones include trimethylsilyl-terminated oils having a viscosity in the range of 100 to 500 mPa · s at 25 ° C., and silicone rubber. The non- (meth) acryl silicone may also include copolymerizable groups such as vinyl groups.

The inorganic filler serves to prevent shrinkage of the sheet coated with the composition during the process of preparing the composition for encapsulant into a sheet, and to improve scratchability and hardness. It can be adjusted and added to the composition. The inorganic filler may be a reinforced silica product, such as smoked silica, and these silica products may be in an untreated hydrophilic form or a treated hydrophobic form.

Antioxidants serve to maintain transparency and can be added to the composition in any amount. Examples of the antioxidant include butylhydroxytoluene, p-methoxyphenol and the like.

From another viewpoint of this invention, it is related with the hardened | cured material obtained from the composition for sealing materials mentioned above.

The cured product may be a photocured product prepared by photocuring under a condition that the curing energy is 500 to 3000 Mj at a wavelength of 300 to 400 nm, preferably 360 nm to 400 nm. When manufactured under the above conditions, it is possible to prevent damage to dark spots or light emitting areas.

In addition, the cured product may be a thermoset prepared by thermal curing under the conditions of 80 to 200 ℃, preferably 80 to 100 ℃.

In case of a general organic light emitting device, the organic light emitting device is liable to be damaged if the temperature of the normal temperature of the manufacturing process is more than 100 ° C due to the characteristic of being vulnerable to heat. However, if the temperature is lowered to prevent such damage, the curing time takes too long, so it is important to cure at an appropriate level because the problem of deterioration in productivity and work efficiency occurs.

In the present invention, the cured product can be manufactured within the temperature range to prevent damages that the optical element can receive by heat, thus preventing the problems of mass productivity and lowering of working efficiency.

When using the above-mentioned photocured and thermoset together, the degree of curing can be further improved compared to the case of using the photocured or the thermoset alone.

The cured product according to the present invention prepared under the above-described conditions can be easily cured by heating or ultraviolet rays, can be cured with a thick film due to low shrinkage, and can satisfy the properties required as heat resistance and solvent-free.

In another aspect, the present invention relates to an organic light emitting device comprising the cured product described above. The organic light emitting device can be manufactured by a well-known manufacturing method in the field of the present invention, and a detailed description thereof will be omitted.

The organic light emitting device according to the present invention is easily cured by low temperature or ultraviolet light, and can be easily sealed without damage by using an encapsulant composition that satisfies low shrinkage, heat resistance, and solvent-free type characteristics, thereby preventing moisture in the organic light emitting device. And it can effectively block the inflow of oxygen to improve the life, and to absorb and mitigate the physical impact applied from the outside can minimize the transmission of the impact to the organic light emitting layer.

Hereinafter, the present invention will be described in detail with reference to Examples, but the present invention is not limited by these Examples.

Manufacturing example  1: Preparation of the compound represented by the formula (2)

200 g of silane-modified epoxy resin (KSR-177, Kukdo Chemical Co., Ltd.) and 125 g of phenoxy resin (YP-55, Kukdo Chemical Co., Ltd.) were added to the reactor, and 400 g of methyl ethyl ketone was added as a solvent. Subsequently, the mixture was replaced with nitrogen, stirred for 2 hours, and then synthesized to obtain a compound represented by the following Chemical Formula 2 having a weight average molecular weight of 800 g / mol.

(2)

In Formula 2, X is an epoxy group, R ₄ is a methyl group, R ₅ is a hydroxy group, R ₆ is a phenyl group, a is 4.

[ Example  1 to 3]

Compound represented by formula 1 according to the present invention (hereinafter referred to as 'compound (A)'), compound represented by formula 2 prepared in Preparation Example 1 (hereinafter referred to as 'compound (B)'), thermal initiator , The photoinitiator and diluent components were mixed to the content shown in Table 1 to prepare a composition for the encapsulant. At this time, the unit described in Table 1 is weight%.

The composition for encapsulation materials prepared in Examples 1 to 3 was molded into a sheet on a 0.7 mm glass substrate by spin coating, and then cured by heating at 90 ° C. for 30 minutes to form a cured sheet having a thickness of 20 μm.

division Example 1
(weight%) Example 2
(weight%) Example 3
(weight%) Compound (A) ⓐ 20 30 10 Compound (B) 64 54 74 Ten initiatorsⓑ 3 3 3 Photo Initiationⓒ 3 3 3 Thinner 10 10 10 Ⓐ: Arakawasa, SQ 202-1
Ⓑ: Shikoku Mars, 2PZ-CNS
Ⓒ: BASF, IRAGURE 819
Ⓓ: Shin-Etsu Company, KF-96

[ Comparative Example  One]

_{(C 6 H 5) SiO 3} /2 _{units, (CH 2 = CH) (} CH 3) SiO 2/2 units and (CH _3), it contains ₂ SiO _2/2 units (CH _{3) 0.6} 5 (C ₆ H ₅ ) _0.55 (CH ₂ = CH) _0.25 SiO _1.28 To 100 parts by weight of the organopolysiloxane resin copolymer (Dow Corning) having the average composition shown, it contains 20 mol% of phenyl groups relative to all silicon atom-bonded methyl groups, phenyl groups and hydrogen atoms (SiH groups), and yields hydrogen gas. 20 ppm of platinum atoms (Dow Corning) were added to a mixture (Dow Corning) containing 20 parts by weight of phenylmethylhydroxysiloxane and 0.2 parts by weight of ethynylcyclohexane having a viscosity of 10 mPa · s at 25 ° C. Sufficient amount of platinum catalyst was added to provide the preparation of the composition.

The composition for encapsulation material thus prepared was formed into a sheet on a 0.7 mm glass substrate by spin coating, and then cured by heating at 90 ° C. for 30 minutes to form a cured sheet having a thickness of 20 μm.

The adhesive strength, light transmittance, heat resistance, and compression recovery of the cured sheets prepared in Examples 1 to 3 and Comparative Example 1 were measured by the following methods, and the results are shown in Table 2.

(1) Adhesive strength: The adhesive strength was measured based on ASTM D1002 using the universal testing machine of INSTRON.

(2) Light transmittance: The transmittance was measured in the visible light region from 400nm to 800nm using a UV-Visible Spectrophotometer.

(3) Heat resistance: Using a thermogravimetric analyzer (TGA, Perkin Elmer Co., pyris-1), the temperature was measured whenever the weight of 1g was reduced while increasing the temperature from 50 ℃ to 400 ℃ at a rate of 10 ℃ / min , Table 2 shows the temperature at the point where the weight loss ratio is 95% compared to the sample weight before measurement.

(4) Compression recovery rate: The degree of elasticity was evaluated by the recovery rate following compression using an ultra-compression hardness tester (SHIMADZU Co.:Model[DUH-W201S]). At this time, the force applied during compression is 80mN.

* Recovery ratio B (recovery ratio) = (T-D) / T × 100%

(In the above formula, T is the pattern thickness before compression, and D is the thickness of the pattern recovered after compression.)

division Adhesive strength (MPa) Transmittance (%) (550nm) Heat resistance (℃) Compression Recovery Rate (%) Example 1 5.4 98 363 94.2% Example 2 6.1 97 389 91.4% Example 3 4.9 95 436 93.4% Comparative Example 1 2.6 94 314 90.8%

As shown in Table 2, Examples 1 to 3 were found to be excellent in all of the adhesive strength, permeability, heat resistance and compressive strength compared to Comparative Example 1.

When the composition for the encapsulant of the present invention and the cured product prepared therefrom are included therefrom, it can be advantageously used for protecting, bonding, changing or adjusting the wavelength of an organic light emitting device, or as a lens material of a light emitting diode device. It can be seen.

Having described specific portions of the invention in detail, those skilled in the art will appreciate that these specific embodiments are merely preferred embodiments and that the scope of the invention is not limited thereby will be. It is therefore intended that the scope of the invention be defined by the claims appended hereto and their equivalents.

Claims (8)

A composition for an encapsulant comprising a compound represented by Formula 1, a compound represented by Formula 2, a thermal initiator, and a photoinitiator:
≪ Formula 1 >
R ¹ Si (OR ² )
In Formula 1, R ¹ is a hydrocarbon group having 1 to 8 carbon atoms having at least one thiol group or an aromatic hydrocarbon group having at least one thiol group, and R ² is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms Or an aromatic hydrocarbon group having 1 to 8 carbon atoms,
(2)

or

In Formula 2, X is A or Am-, A is an epoxy group, a urethane group, an acryl group or a vinyl group, m is a linker connecting the A and the silicon atom, an alkyl group having 1 to 8 carbon atoms, An aryl group or a phenyl group, R ₁ to R ₆ are the same or different, and each independently a hydrogen atom, a hydroxy group, an alkyl group, an alkoxy group, an alkenyl group, an alkynyl group, a glycidyl group, a halogen group or a phenyl group, and R ₁ to R At least one of ₃ is a phenyl group, at least one of R ₁ to R ₃ which is not a phenyl group A hydroxy group or an alkoxy group, R ₄ to R ₆ is not less than at least one of a phenyl group, a phenyl group non-R ₄ At least one of R ₆ is a hydroxy group or an alkoxy group and a is an integer from 1 to 5.
The method of claim 1, wherein the hydrocarbon group of R ¹ and R ² in Formula 1 is independently selected from the group consisting of an alkyl group, an aryl group and a phenyl group composition for the encapsulant.
The method according to claim 1, wherein the alkyl group or alkoxy group of R ₁ to R ₆ in Formula 2 are each independently 1 to 6 carbon atoms, the alkenyl group or alkynyl group of R ₁ to R ₆ in Formula 2 are each independently a carbon source The composition for encapsulant, characterized in that the embroidery 2 to 6.
According to claim 1, wherein the encapsulant composition is 10 to 50% by weight of the compound represented by Formula 1, 50 to 85% by weight of the compound represented by Formula 2, 1 to 10% by weight of the thermal initiator and 1 to 5% by weight of the photoinitiator Composition for encapsulation material comprising a%.
Hardened | cured material manufactured from the composition for sealing materials of any one of Claims 1-4.
The cured product of claim 5, wherein the cured product is manufactured by photocuring under a condition of 500 to 3,000 Mj of curing energy at 300 to 400 nm.
The cured product of claim 5, wherein the cured product is prepared by thermal curing at 80 to 100 ° C under conditions.
An organic light emitting device comprising the cured product of claim 5.