KR20140032813A - Paste for sealing organic light emitting diode and device manufactured by using the same - Google Patents

Abstract

The present invention relates to a paste for sealing an organic light emitting diode and a device manufactured by using the same. An improved organic light emitting diode sealing material can be manufactured by using the paste for sealing an organic light emitting diode comprising: 50-70 parts by weight of glass powder which includes a glass composition containing 30-60 weight% of V2O5, 5-10 weight% of ZnO, 1-15 weight% of P2O5, 5-15 weight% of BaO, 20-50 weight% of TeO2, 1-5 weight% of Fe2O3 and 0-10 weight% of WO3; 30-50 parts by weight of a binder and an organic solvent; and 0.1-5 parts by weight of a metal additive.

Description

TECHNICAL FIELD [0001] The present invention relates to a paste for an organic light emitting diode (OLED) and a device using the same,

And a device manufactured using the paste.

A conventional sealing glass composition uses a glass mixture material containing a lead component composed of a glass powder containing a lead component and a filler such as a refractory ceramic powder.

However, recently, it is required to develop a composition which can be sealed at low temperature without containing harmful components such as lead components for environmental reasons.

As the glass composition which does not contain the lead component in the currently used glass composition, there are phosphorus glass, borosilicate glass, alkali glass and bismuth glass. Among them, the bismuth glass can be fired at low temperature, I have a lot of interest because of it.

The bismuth glass developed so far has been used by mixing a low expansion refractory ceramic powder with a filler in a bismuth glass in order to satisfy thermal expansion characteristics for sealing various kinds of display devices.

However, in order to satisfy the thermal expansion characteristics suitable for sealing the organic light emitting device, a larger amount of low expansion ceramic powder is required than when sealing a display device in general.

For this reason, the flow characteristics of the glass composition are lowered, the sealing problem occurs when the device is sealed using this glass composition, and a high temperature for sealing is also required.

An organic light emitting device sealing paste and a device manufactured using the paste are provided.

In one embodiment of the present invention, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 50% by weight, 50 to 70 parts by weight of a glass powder comprising; glass composition comprising 1 to 5% by weight of Fe ₂ O ₃ and 0 to 10% by weight of WO ₃ ; 30 to 50 parts by weight of the binder and the organic solvent; And 0.1 to 5 parts by weight of a metal additive; provides an organic light emitting device sealing paste comprising a.

The glass composition, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ 1 to 5% by weight and WO ₃ 1 to 10% by weight.

The organic light emitting device sealing paste may include 0.1 to 2.5 parts by weight of a metal additive.

The metal additive may include silver (Ag), aluminum (Al), tin (Sn), or a combination thereof.

The composition of glass, V ₂ O ₅ 30 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 - 10 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ may comprise 1 to 5% by weight of WO ₃ and 1 to 10% by weight.

The composition of glass, V ₂ O ₅ 35 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 to 5 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ may comprise 1 to 5% by weight and 1 to 10% by weight of WO _3.

The glass composition comprises silica (SiO ₂ ), alumina (Al ₂ O ₃ ), cordierite, willemite, zirconium tungsten phosphate, aluminum titanium titanate, β- It may further include spodumene (β-spodumene), β-eucryptite (β-eucryptite) or a combination thereof.

The binder may be ethyl cellulose, nitro cellulose, acryl-based binder or a combination thereof.

The organic solvent may be butyl cabitol acetate, butyl cabitol, terpineol, or a combination thereof.

In another embodiment of the present invention, an upper substrate; A lower substrate; An organic light emitting diode (OLED) disposed at a lower portion of the upper substrate or an upper portion of the lower substrate; And an encapsulation part encapsulating the organic light emitting device, wherein the encapsulation part includes V ₂ O ₅ 30 to 60 wt%, ZnO 5 to 10 wt%, P ₂ O ₅ 1 to 15 wt%, BaO 5 to 15 wt%, 50 to 70 parts by weight of a glass powder comprising a glass composition comprising 20 to 50% by weight of TeO ₂ , 1 to 5% by weight of Fe ₂ O _3, and 0 to 10% by weight of WO ₃ ; 30 to 50 parts by weight of the binder and the organic solvent; And 0.1 to 5 parts by weight of a metal additive; provides a device consisting of an organic light emitting device sealing paste comprising a.

The glass composition may include 0.1 to 2.5 parts by weight of a metal additive.

The metal additive may include silver (Ag), aluminum (Al), tin (Sn), or a combination thereof.

The glass composition, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ 1 to 5% by weight and WO ₃ 1 to 10% by weight.

The composition of glass, V ₂ O ₅ 30 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 - 10 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ may comprise 1 to 5% by weight and 1 to 10% by weight of WO _3.

The composition of glass, V ₂ O ₅ 35 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 to 5 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ may comprise 1 to 5% by weight and 1 to 10% by weight of WO _3.

The glass composition comprises silica (SiO ₂ ), alumina (Al ₂ O ₃ ), cordierite, willemite, zirconium tungsten phosphate, aluminum titanium titanate, β- It may further include spodumene (β-spodumene), β-eucryptite (β-eucryptite) or a combination thereof.

In the paste for an organic light emitting diode according to an embodiment of the present invention, crystals are not precipitated when the organic light emitting device is sealed and then fired, thereby improving adhesion to the substrate and airtightness.

In addition, the paste for sealing an organic light emitting diode according to an embodiment of the present invention has a high laser absorption rate, so that the flow characteristics of the composition due to the laser during the secondary firing can be improved. As a result, Can be improved.

In addition, when the organic light emitting diode sealing paste according to an embodiment of the present invention is used, a sealing material having a high water resistance can be manufactured.

Hereinafter, embodiments of the present invention will be described in detail. However, it should be understood that the present invention is not limited thereto, and the present invention is only defined by the scope of the following claims.

In one embodiment of the present invention, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 50% by weight, 50 to 70 parts by weight of a glass powder comprising; glass composition comprising 1 to 5% by weight of Fe ₂ O ₃ and 0 to 10% by weight of WO ₃ ; 30 to 50 parts by weight of the binder and the organic solvent; And 0.1 to 5 parts by weight of a metal additive; provides an organic light emitting device sealing paste comprising a.

The glass composition in the paste for sealing the organic light emitting diode according to an embodiment of the present invention may not contain PbO and Bi ₂ O ₃ . Pb and other Pb components may cause environmental problems. When Bi components such as Bi ₂ O ₃ are included, they may be susceptible to crystallization at low temperatures.

The composition ratio of the glass composition is specifically V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 50% by weight, Fe ₂ O _{3 It may be} 1 to 5% by weight and WO ₃ 0 to 10% by weight, more specifically, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15 Wt%, BaO 5-15 wt%, TeO ₂ 20-40 wt%, Fe ₂ O ₃ 1-5 wt% and WO ₃ 1-10 wt%, more specifically, V ₂ O ₅ 30 50% by weight, 5 to 10% by weight ZnO, 1 to 10% by weight P ₂ O ₅ , 5 to 15% by weight BaO, 20 to 40% by weight TeO ₂ , 1 to 5% by weight Fe ₂ O ₃ and WO ₃ 1 to It may be 10% by weight, more specifically V ₂ O ₅ 35-50% by weight, ZnO 5-10% by weight, P ₂ O ₅ 1-5% by weight, BaO 5-15% by weight, TeO ₂ 20-40 Weight percent, Fe ₂ O ₃ 1-5 weight percent and WO ₃ 1-10 weight percent.

When the above range is satisfied, it is possible to manufacture an organic light-emitting element sealing material which satisfactorily satisfies flow characteristics and sealing property as a sealing material. Each component of the glass composition will be described in the following order.

The organic light emitting device sealing paste according to the embodiment of the present invention may include a glass powder, a binder, an organic solvent and a metal additive prepared using the glass composition.

The glass powder can be prepared by mixing the glass composition and firing. At this time, the firing temperature may be 1,000 to 1,200 ° C.

The obtained glass powder may have a particle diameter of 1.0 to 2.5 占 퐉 on the basis of D50.

The content of the glass powder, the binder, the organic solvent and the metal additive is 50 to 70 parts by weight of the glass powder; 30 to 50 parts by weight of the binder and the organic solvent and 0.1 to 5 parts by weight of the metal additive.

More specifically, the metal additive may be included 0.1 to 2.5 parts by weight.

In the case of including the metal additive in the above range, the absorption rate of the laser is increased to improve the firing efficiency using the laser. The laser may be, for example, a wavelength of about 800 to 1000 nm. That is, when the laser absorption rate in the above range is low, the amount absorbed by the sealing material is less, which may be disadvantageous for baking.

Specific examples of the metal additive may be silver (Ag), aluminum (Al), tin (Sn), or a combination thereof. However, it is not limited thereto.

The binder may be ethyl cellulose, nitro cellulose, acryl-based binder or a combination thereof.

The organic solvent may be butyl citalol acetate, butyl cabitol, terpineol, or a combination thereof.

The content of the binder and the organic solvent may be 30 to 50 parts by weight based on 50 to 70 parts by weight of the glass powder. However, the ratio of the binder to the organic solvent may be appropriately adjusted. For example, the weight ratio of the binder and the organic solvent may be 2:98 to 20:80. However, it is not limited thereto.

More specifically, the paste may be prepared by mixing the glass powder, the binder, and the metal additive. The paste may be applied on a substrate in the form of a film, and then the paste may be baked using heat and / or laser to produce a sealing portion of the organic light emitting device.

The laser may have a wavelength of 800 to 1,000 nm.

Firing by the heat can be carried out at from 300 to 500 ℃, a reducing atmosphere (e.g., N ₂₎ or an air atmosphere. In general, if firing in a reducing atmosphere and firing using a laser after firing is continuously performed, the absorption rate of the laser can be increased.

However, since the paste as the embodiment of the present invention includes a metal additive, the absorption rate of the laser may be increased even when laser firing is performed after firing in an atmospheric atmosphere. Therefore, it can be economical since it is not necessary to thermosize the reducing atmosphere.

Hereinafter, each configuration will be described.

V ₂ O ₅

As a component that reduces the surface tension of the glass and improves the flow characteristics, when the content is added to 60% by weight or more, the glass composition may become unstable and may be devitrified upon melting. Specifically 30 to 60% by weight, 30 to 50% by weight, 35 to 50% by weight or 35 to 48% by weight, based on the total weight of the composition.

ZnO

It is used for the purpose of improving the water resistance of the glass composition, lowering the coefficient of thermal expansion, and improving the flow characteristics of the glass composition, and when the content is added in an amount of 5% by weight or less, the above-described effect is not seen. If added by more than 10% by weight there is a fear that the fluidity is sharply lowered by crystallization.

P ₂ O ₅

As the material forming the glass, the coefficient of thermal expansion of the glass composition is lowered. If the content is added in an amount of 1 wt% or less, vitrification may not occur. If the content is added in an amount of 15 wt% or more, the water resistance of the glass composition after sealing There is a risk of sharply falling. Specifically 1 to 10% by weight or 1 to 5% by weight, based on the total weight of the composition.

BaO

Alkaline earth metal oxides such as BaO are used to stabilize the glass and prevent devitrification, and when the content is added more than 15% by weight, it is difficult to obtain a stable glass composition. Specifically 5 to 15% by weight, based on the total weight of the composition.

TeO ₂

TeO ₂ is used for the purpose of reducing the softening point of the glass, when the content is added more than 50% by weight significantly increases the coefficient of thermal expansion, it is difficult to obtain a stable glass composition. Thus, 20 to 50% by weight or 20 to 40% by weight can be included in the base glass composition.

Fe ₂ O ₃

Fe ₂ O ₃ is used for the purpose of stabilizing the glass, and when the content is 5 wt% or more, there is a fear that the softening point of the glass composition is increased and the sealing is not performed. Thus, 1 to 5% by weight can be included in the base glass composition.

WO ₃

WO ₃ is used for the purpose of stabilizing the glass, and when the content is 10% by weight or more, there is a fear that the softening point of the glass composition is increased and the sealing is not performed. Thus, 0 to 10% by weight or 1 to 10% by weight can be included in the base glass composition.

When the content of Fe ₂ O ₃ and / or WO ₃ satisfies the above-mentioned content, the absorption rate at 800-1000 nm wavelength can be improved during laser firing, which can be advantageous in secondary firing using light.

In addition, the glass composition for sealing the organic light emitting device is silica (SiO ₂ ), alumina (Al ₂ O ₃ ), cordierite (willierite), willemite, zirconium tungsten phosphate (zirconium tungsten phosphate), aluminum titaniumite (aluminum titanate), β-spodumene (β-spodumene), β-eucryptite, or a combination thereof.

The Al ₂ O ₃ , SiO ₂ And / or B ₂ O ₃ is used for the purpose of improving the water resistance while stabilizing the glass, each content may be added within 5 parts by weight based on 100 parts by weight of the glass composition for sealing the organic light emitting device.

Li ₂ O, Na ₂ O and / or K ₂ O is a component that not only lowers the softening point of the glass but also decreases the surface tension of the glass and improves the flow characteristics, each content is 100 parts by weight of the glass composition for sealing the organic light emitting device It can be added within 5 parts by weight.

The glass composition has crystallization stability at about 450 DEG C, thereby improving the fluidity of the composition and improving the hermetic characteristics when sealing the organic light emitting device using such a glass composition.

In addition, the glass composition exhibits a high absorption ratio at 800 to 900 nm when the transmittance is analyzed in a near infra red (NIR) wavelength, which is suitable for laser firing.

In addition, since the glass composition has low reactivity with water, it is advantageous to protect the sealed organic light emitting device from moisture when sealing the organic light emitting device.

In another embodiment of the present invention, an upper substrate; A lower substrate; An organic light emitting diode (OLED) disposed at a lower portion of the upper substrate or an upper portion of the lower substrate; And an encapsulation part encapsulating the organic light emitting device, wherein the encapsulation part includes V ₂ O ₅ 30 to 60 wt%, ZnO 5 to 10 wt%, P ₂ O ₅ 1 to 15 wt%, BaO 5 to 15 wt%, 60 to 80 weight percent of a glass powder comprising a glass composition comprising 20 to 50 weight percent of TeO ₂ , 1 to 5 weight percent of Fe ₂ O _3, and 0 to 10 weight percent of WO ₃ ; 10 to 40 wt% binder; And 0.1 to 5% by weight of a metal additive; provides a device consisting of an organic light emitting device sealing paste comprising a.

The sealing portion may be in the form of a barrier rib, a film, a frit, or the like, and is not limited to the form of sealing the organic light emitting element.

The description of the glass composition is omitted because it is the same as the glass composition for sealing an organic light emitting diode according to the embodiment of the present invention described above.

Hereinafter, specific embodiments of the present invention will be described. However, the embodiments described below are only intended to illustrate or explain the present invention, and thus the present invention should not be limited thereto.

Example

A glass composition was prepared according to the composition ratios (% by weight) described in Tables 1 and 2 below.

Constituent Example 1 Example 2 Example 3 Comparative Example 1 V ₂ O ₅ 43 48 36 36 ZnO 6 6 6 6 P ₂ O ₅ 4 4 One 4 BaO 13 9 15 15 TeO ₂ 30 28 39 39 Fe ₂ O ₃ 3 4 2 WO ₃ One One One Total (glass composition) 100 wt% 100 wt% 100 wt% 100 wt%

The composition ratio shown in Table 1 is in weight%

The manufacturing process is as follows.

The composition included in the range of the glass composition was designed as shown in Table 1, and the composition raw material was accurately weighed.

The glass compositions listed in Table 1 were mixed in a zero-gravity mixer for a sufficient time to allow all the compositions to be thoroughly mixed.

The mixed glass composition was put into a platinum crucible, and then melted at a temperature of 1,000 to 1,200 ° C. The melting time was 30 minutes (min).

The molten glass composition in the melting step was quenched through dry and wet quenching.

The quenched glass melt was pulverized to a powder state using a jet mill, thereby producing a glass powder in the range of 1.0 to 2.5 占 퐉 on the basis of D50.

Thereafter, as shown in Table 2, a glass powder, a binder, and a metal additive were prepared and mixed for a sufficient time through a mixer.

The organic solvent used was butyl cabitol acetate (SK chemicals) and terpineol (Nippon terpin), and the binder used was ethyl cellulose (DOW chmical company).

The weight ratio of the organic solvent and the binder used was butyl carbitol acetate: terpol: ethyl cellulose = 45:45:10.

Constituent Example 4 Example 5 Example 6 Comparative Example 2 Glass powder 60 parts by weight of glass powder according to Example 1 60 parts by weight of glass powder according to Example 2 60 parts by weight of glass powder according to Example 3 60 parts by weight of glass powder according to Comparative Example 1 Binders and organic solvents 40 parts by weight 40 parts by weight 40 parts by weight 40 parts by weight Metal additives Ag 2 parts by weight Al 2 parts by weight Sn 2 parts by weight -

Thereafter, the paste prepared in the above ratio was dispersed in 3-rolls and then applied in a film form on a glass substrate using a screen printer to apply a thick film.

After drying at 130 ° C. for 10 minutes in an air atmosphere, firing was performed at 400 ° C. for 20 minutes in an N ₂ atmosphere and an air atmosphere.

By using Examples 1 to 3 and Comparative Example 1 prepared as described above to the transition point (Tg), softening point (Tdsp), crystallization start temperature (Tx), crystallization peak temperature (Tp), thermal expansion coefficient (CTE) and water The elution characteristics were evaluated, and physical properties such as transmittance were measured in Near Infrared Spectroscopy (NIR) using Examples 4 to 6 and Comparative Example 2, respectively.

Experimental Example

Property evaluation results of the Examples and Comparative Examples are shown in Table 3 below.

How to measure

1) Tg: glass transition temperature (unit: ° C)

The glass powders prepared in Examples 1 to 3 and Comparative Example 1 were obtained using a TA (Different Scanning Calorimeter) of TA, and increasing the temperature at a temperature rising rate of 10 ° C./min to obtain a tangent of a section in which the first slope was changed. The temperature was measured.

2) Tdsp: Softening point at which shrinkage begins (unit ℃)

The glass powders prepared in Examples 1 to 3 and Comparative Example 1 were measured in an aluminum pan while increasing the temperature to 580 ° C. at a temperature rising rate of 10 ° C./min using DSC (Different Scanning Calorimeter) of TA. , Tdsp temperature was analyzed by analyzing the end point of the endothermic reaction.

3) Tx: Starting point of crystallization (unit C)

The glass powders prepared in Examples 1 to 3 and Comparative Example 1 were measured while increasing the temperature to 580 ° C. at a temperature rising rate of 10 ° C./min using DSC (Different Scanning Calorimeter) of TA, and the exothermic peak appeared. The temperature was measured by obtaining the tangent of the section where the slope changed from the starting point of.

4) Tp: crystallization peak point (unit C)

The glass powders prepared in Examples 1 to 3 and Comparative Example 1 were measured while increasing the temperature to 580 ° C. at a temperature rising rate of 10 ° C./min using DSC (Different Scanning Calorimeter) of TA, and the exothermic reaction was the highest. The peak point was analyzed to analyze the Tp temperature.

5) CTE: Coefficient of Thermal Expansion (x 10 ^-7 / ° C)

The glass powders prepared in Examples 1 to 3 and Comparative Example 1 were pelleted and fired to form a bulk, and both surfaces were polished with a polishing machine to obtain bulk mechanical analysis (TMA) of bulk TA. Analyzed using. The measurement conditions were measured by increasing the temperature up to 300 ° C at a heating rate of 5 ° C / min, and analyzing the length expansion rate according to the temperature of 50 ° C to 250 ° C.

6) Elution by water

Using the glass powder prepared in Examples 1 to 3 and Comparative Example 1 to prepare a bulk (bulk) of the pellet (pellet) form after filling a 75ml pure water in a 100ml beaker and then put the specimen for 5 hours After that, the specimens were taken out, washed with ultrasonic waves for 1 minute, and dried to evaluate the dissolution by water.

The elution rate to water was determined to be less than 0.01%, less than 0.01%, and less than 0.01%, based on 0.01% weight reduction ratio.

7) Light transmittance (wavelength range: 800 to 1000 nm)

In the Examples 4 to 6 and Comparative Example 2, the NIR analysis was performed using a spectrometer (Varian). After baseline correction, the light transmittance in the 800-1000 nm wavelength region was analyzed by measuring 200-2000 nm at 600 scan rate (nm / min).

Example 1 Example 2 Example 3 Comparative Example 1 Tg 300 290 296 296 Tdsp 327 316 313 316 Tx 500 or more 467 455 421 Tp none 550 or more 550 or more 470 Tx-Tdsp 173 151 187 105 CTE 122 127 157 146 Dissolution by water Little Little Little Little Example 4 Example 5 Example 6 Comparative Example 2 Transmittance (reducing atmosphere)
(800 to 1000 nm) Transmittance (%, at 808 nm) 0.77 0.47 0.72 2.5 Thickness (㎛) 7.08 7.11 7.45 6.5 Transmittance per unit thickness (% / 탆) 0.11 0.07 0.10 0.38 Transmittance (atmosphere)
(800 to 1000 nm) Transmittance (%, at 808 nm) 2.62 1.43 2.71 4 Thickness (㎛) 6.95 6.94 6.8 6.15 Transmittance per unit thickness (% / 탆) 0.38 0.21 0.37 0.65

Tg : Glass transition temperature (unit ℃)

Tdsp : Contraction begins Yield point (Unit ℃)

Tx : Starting point of crystallization (unit C)

Tp : Crystallization Peak point  (Unit ℃)

CTE : Thermal Expansion Coefficient ( Coefficient of Thermal Expansion , x10 ^-7 / ° C)

As can be seen from the experimental example, the glass compositions of Examples 1 to 3 can be baked at about 450 ° C. or less.

In addition, the glass composition of Examples 1 to 3 has a crystallization starting point (Tx) of 450 ° C. or more, and a difference between the crystallization temperature (Tx) and the yield point (Tdsp) at which shrinkage starts (Tx-Tdsp) of at least 130 ° C. Since it has a difference value, it can be seen that it has sufficient fluidity at the firing temperature. Accordingly, the airtightness required by the sealing material can be satisfied, and the adhesion between the upper substrate and the lower substrate can be improved.

In addition, the pastes of Examples 4 to 6 may have advantageous properties for firing using a laser because the light transmittance of 800 to 1000 nm wavelength is 0.38 or less per unit thickness of the fired film in air. Able to know. Since the metal additive plays a role of a reducing agent in the glass powder, the transmittance in the atmosphere may have a value similar to that in the N ₂ atmosphere.

The present invention is not limited to the above embodiments, but may be manufactured in various forms, and a person skilled in the art to which the present invention pertains has another specific form without changing the technical spirit or essential features of the present invention. It will be appreciated that the present invention may be practiced as. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive.

Claims (16)

V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 50% by weight, Fe ₂ O ₃ 1 to 5% by weight 50 to 70 parts by weight of a glass powder comprising; glass composition comprising% and WO ₃ 0 to 10% by weight;
30 to 50 parts by weight of the binder and the organic solvent; And
0.1 to 5 parts by weight of the metal additive; organic light emitting device sealing paste comprising a.
The method of claim 1,
The glass composition, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ 1 to 5% by weight and WO ₃ 1 to 10% by weight comprising an organic light emitting device sealing paste.
The method of claim 1,
The organic light emitting device sealing paste is an organic light emitting device sealing paste containing 0.1 to 2.5 parts by weight of a metal additive.
The method of claim 1,
The metal additive is a paste for sealing an organic light emitting device containing silver (Ag), aluminum (Al), tin (Sn) or a combination thereof.
The method of claim 1,
The composition of glass, V ₂ O ₅ 30 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 - 10 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃₁ to 5% by weight of WO ₃ and the organic light-emitting element bar wear paste comprises 1 to 10% by weight.
The method of claim 1,
The composition of glass, V ₂ O ₅ 35 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 to 5 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃₁ to 5. the organic light-emitting element bar wear paste comprises a% by weight and 1 to 10% by weight of WO _3.
The method of claim 1,
The glass composition comprises silica (SiO ₂ ), alumina (Al ₂ O ₃ ), cordierite, willemite, zirconium tungsten phosphate, aluminum titanium titanate, β- Paste for sealing organic light-emitting device further comprises spodumene (β-spodumene), β-eucryptite (β-eucryptite) or a combination thereof.
The method of claim 1,
Wherein the binder is ethyl cellulose, nitro cellulose, acryl-based binder, or a combination thereof.
The method of claim 1,
Wherein the organic solvent is butyl cabitol acetate, butyl cabitol, terpineol, or a combination thereof.
An upper substrate; A lower substrate; An organic light emitting diode (OLED) disposed at a lower portion of the upper substrate or an upper portion of the lower substrate; And a sealing portion sealing the organic light emitting element,
The sealing portion is V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 50% by weight, Fe ₂ O ₃ 1 50 to 70 parts by weight of a glass powder comprising a glass composition comprising 5 to 5% by weight and WO ₃ 0 to 10% by weight; 30 to 50 parts by weight of the binder and the organic solvent; And 0.1 to 5 parts by weight of a metal additive; comprising an organic light emitting device sealing paste.
11. The method of claim 10,
Wherein the glass composition comprises 0.1 to 2.5 parts by weight of a metal additive.
11. The method of claim 10,
The metal additive comprises silver (Ag), aluminum (Al), tin (Sn) or a combination thereof.
11. The method of claim 10,
The glass composition, V ₂ O ₅ 30 to 60% by weight, ZnO 5 to 10% by weight, P ₂ O ₅ 1 to 15% by weight, BaO 5 to 15% by weight, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ 1 to 5% by weight and WO ₃ 1 to 10% by weight.
11. The method of claim 10,
The composition of glass, V ₂ O ₅ 30 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 - 10 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ the element comprises 1 to 5% by weight and 1 to 10% by weight of WO _3.
11. The method of claim 10,
The composition of glass, V ₂ O ₅ 35 to 50 wt%, ZnO 5 - 10 wt%, P ₂ O ₅ 1 to 5 wt%, BaO 5 to 15 weight%, TeO ₂ 20 to 40% by weight, Fe ₂ O ₃ the element comprises 1 to 5% by weight and 1 to 10% by weight of WO _3.
11. The method of claim 10,
The glass composition comprises silica (SiO ₂ ), alumina (Al ₂ O ₃ ), cordierite, willemite, zirconium tungsten phosphate, aluminum titanium titanate, β- A device that further comprises spodumene (β-spodumene), β-eucryptite or a combination thereof.