KR20140027783A - Inertial sensor - Google Patents

Inertial sensor Download PDF

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Publication number
KR20140027783A
KR20140027783A KR1020120093808A KR20120093808A KR20140027783A KR 20140027783 A KR20140027783 A KR 20140027783A KR 1020120093808 A KR1020120093808 A KR 1020120093808A KR 20120093808 A KR20120093808 A KR 20120093808A KR 20140027783 A KR20140027783 A KR 20140027783A
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KR
South Korea
Prior art keywords
mass
inertial sensor
cap
post
membrane
Prior art date
Application number
KR1020120093808A
Other languages
Korean (ko)
Inventor
박흥우
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020120093808A priority Critical patent/KR20140027783A/en
Publication of KR20140027783A publication Critical patent/KR20140027783A/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/135—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by making use of contacts which are actuated by a movable inertial mass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)

Abstract

The present invention relates to an inertial sensor. The inertial sensor (100) includes a membrane (110), a mass (120) provided to a lower portion of the membrane (110), a post (130) provided to the lower portion of the membrane (110) to surround the mass (120), and a cap (140) provided to cover a low side of the post (130) and having a hole (145) communicating with an outside. Since the hole (145) is formed in the cap (140) so that an internal pressure of the inertial sensor (100) is maintained to be equal to an external pressure of the inertial sensor (100), even if temperature is varied, a stress applied to the membrane (110) according to the temperature variation can be reduced.

Description

Inertial Sensor

The present invention relates to an inertial sensor.

Recently, sensors have been used for military applications such as satellites, missiles, and unmanned aerial vehicles, for vehicles such as air bags, electronic stability controls, and black boxes for vehicles, for camera shake prevention, for motion sensing of mobile phones and game machines, It is used for various purposes such as navigation.

In order to measure acceleration, angular velocity or force, such a sensor generally adopts a configuration in which a mass body is bonded to an elastic substrate such as a diaphragm. According to the above configuration, the sensor calculates the acceleration by measuring the inertial force applied to the mass, or calculates the angular velocity by measuring the Coriolis force applied to the mass, and measures the external force directly applied to the mass to calculate the force.

Specifically, a method of measuring acceleration and angular velocity using a sensor will be described below. First, the acceleration can be obtained by Newton's law of motion "F = ma", where "F" is the inertia force acting on the mass, "m" is the mass of the mass, and "a" is the acceleration to be measured. Among them, the acceleration (a) can be obtained by detecting the inertial force (F) acting on the mass and dividing it by the mass (m) of the mass. In addition, the angular velocity can be obtained by the Coriolis Force "F = 2mΩ × v" formula, where "F" is the Coriolis force acting on the mass, "m" is the mass of the mass, and "Ω" is to be measured. The angular velocity, "v", is the velocity of the mass. Since the velocity (v) of the mass and the mass (m) of the mass are already known, the angular velocity (Ω) can be obtained by sensing the Coriolis force (F) acting on the mass.

On the other hand, the sensor according to the prior art is provided with a diaphragm and a fixing portion for supporting the diaphragm, as disclosed in the patent document of the following prior art document. Finally, a cap is attached to the lower part of the fixing part to seal the lower side of the fixing part. As such, when the cap is adhered to the lower part of the fixing part, a high temperature of about 200 ° C. is applied and the inside of the closed inertial sensor becomes a relatively low pressure environment. As a result, the thin diaphragm sags downward, thereby making it difficult to proceed with subsequent processes, and the stress of the diaphragm is changed to change the characteristics of the inertial sensor. In addition, the inertial sensor undergoes various temperature environments during use, and there is another problem in that a pressure difference occurs between the inside and the outside of the inertial sensor, and the stress of the diaphragm is changed to change characteristics.

US 20110146404 A1

The present invention is to solve the above-mentioned problems of the prior art, an aspect of the present invention is to provide an inertial sensor that can communicate with the outside by forming a hole in the cap (Cap).

Inertial sensor according to an embodiment of the present invention is provided to cover the membrane (Membrane), the mass provided in the lower portion of the membrane, the post provided in the lower portion of the membrane to surround the mass and the lower side of the post , Cap is formed to communicate with the outside (Cap).

In the inertial sensor according to the embodiment of the present invention, the mass includes a first mass and a second mass.

In addition, in the inertial sensor according to the embodiment of the present invention, the post is provided to surround the first mass and the second mass, respectively, the first mass is a first surrounded by the membrane, the post and the cap The second mass is disposed in a second space surrounded by the membrane, the post, and the cap.

In addition, in the inertial sensor according to an embodiment of the present invention, the cap is adhered to the post and the adhesive layer, and a slit is formed in the adhesive layer so that the first space and the second space communicate with each other.

In addition, in the inertial sensor according to an embodiment of the present invention, the hole is formed so that any one of the first space or the second space communicates with the outside.

In addition, in the inertial sensor according to an embodiment of the present invention, further comprising a control member provided on the lower portion of the cap.

In addition, in the inertial sensor according to the embodiment of the present invention, the control member is provided in the lower portion of the cap so that a predetermined portion of the lower surface of the cap is exposed.

Further, in the inertial sensor according to the embodiment of the present invention, the hole is formed in the predetermined portion.

In addition, in the inertial sensor according to the embodiment of the present invention, the control member is an ASIC (Application Specific Integrated Circuit).

In addition, in the inertial sensor according to an embodiment of the present invention, the upper surface of the cap is formed with a recess recessed in the thickness direction.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

According to the present invention, a hole is formed in the cap so that the inside of the inertial sensor is not completely sealed. Therefore, even if the temperature changes, since the internal pressure of the inertial sensor is kept the same as the external pressure of the inertial sensor, there is an effect to prevent the membrane from deforming according to the temperature change during the manufacturing process or the user. In particular, since a hole is formed in the cap so that the inside and the outside of the inertial sensor can communicate with each other, when the cap is adhered, a high temperature of about 200 ° C. or more is applied, and the out-gassing materials generated inside the inertial sensor are applied to the inside. It is possible to prevent the trapped deformation of the stress of the inertial sensor. In addition, even if the temperature changes during use of the inertial sensor, the internal pressure of the inertial sensor is maintained to be the same as the external pressure of the inertial sensor due to the hole formed in the cap, thereby reducing the stress applied to the membrane.

1 to 2 are cross-sectional views of the inertial sensor according to an embodiment of the present invention,
3 is a plan view of the adhesive layer shown in FIG.
4 is a cross-sectional view of an inertial sensor according to another embodiment of the present invention, and
5 is a plan view of the inertial sensor shown in FIG. 4.

BRIEF DESCRIPTION OF THE DRAWINGS The objectives, specific advantages and novel features of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, in which: FIG. It should be noted that, in the present specification, the reference numerals are added to the constituent elements of the drawings, and the same constituent elements are assigned the same number as much as possible even if they are displayed on different drawings. Also, the terms "first "," second ", and the like are used to distinguish one element from another element, and the element is not limited thereto. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the following description of the present invention, detailed description of related arts which may unnecessarily obscure the gist of the present invention will be omitted.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 to 2 are cross-sectional views of an inertial sensor according to an embodiment of the present invention, Figure 3 is a plan view of the adhesive layer shown in FIG.

As shown in FIGS. 1 and 2, the inertial sensor 100 according to the present exemplary embodiment may surround the mass 110 and the mass 120 provided at the bottom of the membrane 110 and the membrane 110. It includes a post (130, Post) provided on the lower portion of the membrane 110 and a cap (140) formed to cover the lower side of the post 130, the hole (145, Hole) is formed to communicate with the outside.

The membrane 110 is formed in a plate shape and is elastic so that the mass body 120 may cause displacement. Here, the mass body 120 is provided below the membrane 110, and the post 130 is provided to surround the mass body 120. Accordingly, the membrane 110 is fixed by the support of the post 130, and based on the support 113 of the membrane 110 supported by the post 130, the membrane 110 having no post 130 formed therein is formed. The flexible part 115 has a displacement corresponding to the movement of the mass body 120. In addition, since the flexible part 115 of the membrane 110 is elastically deformed, the driving unit 117 may be disposed to vibrate the mass 120, or the sensing unit 119 may be disposed to detect the displacement of the mass 120. Can be. However, the driving means 117 and the sensing means 119 are not necessarily disposed on the flexible portion 115 of the membrane 110, and a part thereof may be disposed on the support portion 113 of the membrane 110. to be. On the other hand, the sensing means 119 can be implemented using a piezoelectric method, a piezoresistive method or a capacitive method, and the above-mentioned driving means 119 can be implemented using a piezoelectric method or a capacitive method.

The mass 120 is a displacement generated by an inertial force or a Coriolis force, is provided in the lower portion of the membrane 110. In addition, the post 130 is formed in a hollow (hollow) shape to support the support portion 113 of the membrane 110 serves to secure a space for the mass body 120 to cause displacement, the mass body 120 ) Is provided in the lower portion of the membrane 110 to surround. Here, the mass body 120 may be formed, for example, in a cylindrical shape, and the post 130 may be formed in a square pillar shape in which a cylindrical cavity is formed at the center thereof. That is, when viewed in the cross section, the mass body 120 is formed in a circular shape, and the post 130 is formed in a quadrangle having a circular opening in the center. However, the shapes of the mass body 120 and the post 130 are not limited thereto, and the mass body 120 and the post 130 may be formed in all shapes known in the art.

Meanwhile, the mass 120 may be configured as one (see FIG. 1), but is not limited thereto, and may be two (see FIG. 2). That is, the mass body 120 may include a first mass body 123 and a second mass body 125. In this case, the post 130 may be provided to surround the first mass 123 and the second mass 125, respectively. That is, the post 130 may be provided not only under the edge of the membrane 110 but also under the central portion of the membrane 110 between the first mass 123 and the second mass 125. As such, since the post 130 is provided between the first mass 123 and the second mass 125, the interior of the inertial sensor 100 is moved into the membrane 110, the post 130, and the cap 140. It may be partitioned into an enclosed first space 150 and a second space 155. In this case, the first mass body 123 may be disposed in the first space 150, and the second mass body 125 may be disposed in the second space 155.

The cap 140 is provided to cover the lower side of the post 130, and serves to protect the mass body 120. Here, the cap 140 may be bonded to the lower surface of the post 130 and the adhesive layer 160. In addition, a concave portion 147 recessed in the thickness direction is formed on the upper surface of the cap 140, thereby reducing dynamic damping force of the air acting on the mass body 120, thereby improving dynamic characteristics. . On the other hand, the cap 140 is formed with a hole 145 in the thickness direction to communicate with the outside, the interior of the inertial sensor 100 is not sealed. Therefore, since the internal pressure of the inertial sensor 100 remains the same as the external pressure of the inertial sensor 100 even when the temperature is changed, the membrane 110 is prevented from deforming according to the temperature change, thereby preventing the inertial sensor 100 from changing. Maintain performance. In particular, since the hole 145 is formed in the cap 140 so that the inside and the outside of the inertial sensor 100 can communicate, a high temperature of about 200 ° C. or more is applied when the cap 140 is bonded to the inside of the inertial sensor 100. Out-gassing materials generated in the trapped inside can prevent the stress of the inertial sensor 100 from being deformed. In addition, even when the temperature of the inertial sensor 100 changes during use, the internal pressure of the inertial sensor 100 is maintained to be the same as the external pressure of the inertial sensor 100 due to the hole 145 formed in the cap 140. There is an effect of reducing the stress applied to (110).

In addition, the position and number of the hole 145 are not specifically limited. However, as shown in FIG. 2, when the inside of the inertial sensor 100 is partitioned into the first space 150 and the second space 155, the hole 145 is the first space 150 or the second space. Only one of the spaces 155 may be formed to communicate with the outside. For example, the hole 145 may be formed only in a portion of the cap 140 provided under the second space 155 to allow the second space 155 to communicate with the outside (see FIG. 2). In this case, the first space 150 may not have a hole 145 is formed there is a problem that can not communicate with the outside may occur. However, as shown in FIG. 3, slits 165 and slit are formed in the adhesive layer 160 for adhering the cap 140 and the post 130 to form the first space 150 and the second space 155. Can communicate. Specifically, the slit 165 is formed in the adhesive layer 160 adhered to the post 130 provided between the first mass 123 and the second mass 125, and thus, the first space 150 and the second space. Communicate (155). As a result, the second space 155 may directly communicate with the outside through the hole 145, and the first space 150 may communicate with the second space 155 through the slit 165 of the adhesive layer 160. By doing so, the second space 155 may communicate with the outside indirectly. As such, although the hole 145 is formed only in the second space 155 and the hole 145 is not formed in the first space 150, the slit 165 is formed in the adhesive layer 160 to form the first space 150. ) And the second space 155 may communicate with each other, so that both the first space 150 and the second space 155 may finally communicate with the outside.

4 is a cross-sectional view of an inertial sensor according to another exemplary embodiment of the present invention, and FIG. 5 is a plan view of the inertial sensor illustrated in FIG. 4.

As shown in FIGS. 4 to 5, a control member 170 such as an application specific integrated circuit (ASIC) for controlling the inertial sensor 200 may be provided under the cap 140. When the control member 170 is provided under the cap 140 to block the bottom surface of the cap 140, the inertial sensor 200 may be formed due to the control member 170 even when the hole 145 is formed in the cap 140. There is a fear that the inside of the inside cannot communicate with the outside. However, the inertial sensor 200 according to the present embodiment may be provided such that the control member 170 exposes a predetermined portion 149 of the lower surface of the cap 140. That is, based on the top view as shown in FIG. 5, the predetermined portion 149 of the cap 140 is disposed to protrude from the control member 170. Therefore, when the hole 145 is formed in the predetermined portion 149 exposed from the control member 170, the inside of the inertial sensor 200 may freely communicate with the outside regardless of the control member 170.

Meanwhile, a lead frame or a printed circuit board 180 electrically connected to the control member 170 may be further provided below the control member 170.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the same is by way of illustration and example only and is not to be construed as limiting the present invention. It is obvious that the modification or improvement is possible.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

100: inertial sensor 110: membrane
113: support part 115: flexible part
117: drive means 119: detection means
120: mass 123: first mass
125: second mass 130: post
140: cap 145: hole
147: recess 149: predetermined portion
150: first space 155: second space
160: adhesive layer 165: slit
170: control member 180: lead frame or printed circuit board

Claims (10)

Membranes;
A mass provided under the membrane;
A post provided in the lower portion of the membrane to surround the mass; And
A cap provided to cover the lower side of the post and having a hole formed to communicate with the outside;
Inertial sensor comprising a.
The method according to claim 1,
The mass is an inertial sensor comprising a first mass and a second mass.
The method according to claim 2,
The post is provided to surround each of the first mass and the second mass,
And the first mass is disposed in a first space surrounded by the membrane, the post and the cap, and the second mass is disposed in a second space surrounded by the membrane, the post and the cap.
The method of claim 3,
The cap is adhered to the post with an adhesive layer,
An inertial sensor having a slit formed in the adhesive layer so that the first space and the second space communicate with each other.
The method of claim 3,
The hole is an inertial sensor formed so that any one of the first space or the second space communicates with the outside.
The method according to claim 1,
A control member provided below the cap;
Inertial sensor further comprising.
The method of claim 6,
The control member is provided in the lower portion of the cap so that a predetermined portion of the lower surface of the cap is exposed.
The method of claim 7,
The hole is an inertial sensor formed in the predetermined portion.
The method of claim 6,
The control member is an inertial sensor that is an ASIC (Application Specific Integrated Circuit).
The method according to claim 1,
An inertial sensor having a recess recessed in a thickness direction on an upper surface of the cap.
KR1020120093808A 2012-08-27 2012-08-27 Inertial sensor KR20140027783A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120093808A KR20140027783A (en) 2012-08-27 2012-08-27 Inertial sensor

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Application Number Priority Date Filing Date Title
KR1020120093808A KR20140027783A (en) 2012-08-27 2012-08-27 Inertial sensor

Publications (1)

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KR20140027783A true KR20140027783A (en) 2014-03-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107643424A (en) * 2017-09-21 2018-01-30 中国电子科技集团公司第四十九研究所 A kind of pressure resistance type MEMS acceleration chips and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107643424A (en) * 2017-09-21 2018-01-30 中国电子科技集团公司第四十九研究所 A kind of pressure resistance type MEMS acceleration chips and preparation method thereof
CN107643424B (en) * 2017-09-21 2020-03-17 中国电子科技集团公司第四十九研究所 Piezoresistive MEMS acceleration chip and manufacturing method thereof

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