KR20140010227A

KR20140010227A - Light emitting element cooling and heat dissipation unit

Info

Publication number: KR20140010227A
Application number: KR1020120077046A
Authority: KR
Inventors: 김현수
Original assignee: 김현수
Priority date: 2012-07-16
Filing date: 2012-07-16
Publication date: 2014-01-24

Abstract

Provided is a unit for cooling and heat radiating a light emitting diode. The unit for cooling and heat radiating a light emitting diode of the present invention, which has a three dimensional shape making it suitable for using as a liquid crystal device BLU or a light source of a lighting device, etc., comprises: an openable metal substrate case made of aluminum, aluminum alloy, magnesium or magnesium alloy, where the shape of the cross section adopts a square, rectangle, multisided and dome shape, etc., to have an opening in at least one side surface thereof; or a closable metal substrate pipe which includes a cover in the opening of the metal substrate case, wherein the metal substrate case or the metal substrate pipe has an electric insulating layer based on an oxidation coating caused by the anodizing; and a certain electric pattern circuit in the roof surface thereof to mount the light emitting diode such as a semiconductor laser, etc. Furthermore, the closable metal substrate pipe has a thermal medium sealed inside to be used; at least one of a heat radiating pin, a heat pipe and a cooling pipe installed in the cover; and a valve or a nozzle, as needed, so that the thermal medium can to be easily injected into the metal substrate pipe.

Description

Light emitting device cooling and heat dissipation unit

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a cooling / heating unit in which high heat generating light emitting elements such as LEDs and semiconductor lasers are mounted, and a liquid crystal display lighting device using the same.

Since the LED has a long service life and low power consumption, the LED is used as a light source for a lighting device or as a back light unit for LCDs such as smartphones, tablet PCs, and televisions, in competition with AMMOLEDs. It is used a lot.

However, in a structural situation in which about 80% of the electrical energy put into the LED is converted into heat, the fundamental countermeasure against the high temperature heat generated in the LED is comparable to the LED life for the LED sealing material and the reflective material. In addition to the development of new anti-degradation materials, the entire system equipped with these materials is also capable of performance even if ultra-high brightness LEDs appear, without addressing the fundamental problem of cooling and heat dissipation that may easily lead from high temperatures to low temperatures. Cannot be guaranteed.

As a representative representative prior art of cooling and heat dissipation in relation to LEDs, Japanese Patent Laid-Open No. 2006-302581 and Japanese Patent No. 2010-113845 refer to LEDs of liquid crystal display devices, and Japanese Patent No. 2011-2011 for lighting devices. 54529 and Japanese Utility Model Registration No. 3133586 are disclosed.

<Patent Document 1> Japanese Patent Laid-Open No. 2006-302581 <Patent Document 2> Japanese Patent Application Laid-Open No. 2010-113845 <Patent Document 3> Japanese Patent Application Laid-Open No. 2011-54529 <Patent Document 4> Japanese Utility Model Registration No. 3133586

Among these prior arts, Patent Document 1 relates to a light emitting unit heat dissipation device, a backlight device, and an image display device. As shown in FIG. 7, in order to more effectively dissipate heat generated from the LED 31, a high-heat device ( The heat pipe 28 is connected to the lower portion of the metal substrate by forming a support portion on the concave portion.

In addition, Patent Document 2 relates to a "cooling and heat dissipation unit," comprising a first heat pipe on one surface of a metal thin-walled L-shaped outer side formed of an L-shape, and further extending the second heat pipe to a metal case of an L-shaped thin-lined thin line extension line. The 4th heat pipe is further comprised and the temperature rise of LED is suppressed.

However, these patent documents 1 and 2 are a technique in which one to several heat pipes are additionally configured as needed directly or indirectly on a flat metal substrate on which LEDs are mounted. The high temperature heat generated by the LEDs 31 While being blocked by the resin insulating layer 34 having a thermal conductivity of about 1 to 2 kW / m · Ｋ, it is transmitted to the metal substrate 32, and the heat pipe 28 connected to the heat dissipation is performed together with cooling. It is. Therefore, a high temperature gradient is formed between the high temperature LED 31 and the low temperature metal substrate 32, so that the effect may be limited no matter how much the heat is cooled on the metal substrate 32 where the temperature is low. There will be no choice but to.

In addition, Patent Document 3 relates to an LED lighting device and a method of manufacturing the same, wherein the LED light emitting unit and the aluminum cooling panel part having a hollow part structure separately formed thereon are fixed with a screw or the like, and the hollow part is It is a technology that dissipates the heat of the metal substrate by inserting a water pipe of) into the cooling water. This technique can be said to increase the cooling effect of the substrate to some extent in that the cooling water is used as compared to Patent Documents 1 and 2 described above, but it is applied to the resin insulating layer on the same substrate structure as Patent Documents 1 and 2. The temperature difference gradient due to the high heat of the LED light emitting element formed by the low heat of the panel and the low heat of the panel still cannot be solved, and the device such as the configuration of the water pipe together with the cooling panel is complicated and the cost problem due to the large size is large. do.

In addition, Patent Document 4 relates to a 'LED lamp heat dissipation structure', and is a typical method using natural convection of air by forming a plurality of heat dissipation fins on a metal board mounted with LEDs. The structure of the metal substrate is also the same as that of Patent Documents 1 to 3 described above, and it cannot be pointed out that the structure is fundamentally impossible to apply to a high current density (ultra) high brightness light emitting device that is expected to be developed in the future.

On the other hand, including the above-described prior art, the common matter in general liquid crystal display devices, lighting devices, and the like in which LEDs are mounted in the prior art includes aluminum and aluminum alloys having good thermal conductivity and inexpensive cost. As a shape, it becomes the flat plate which rolled. After laminating an insulating resin layer prepreg in which a thermally conductive inorganic filler is dispersed and a copper plate through an adhesive layer on such a flat plate, heat pressing is performed and predetermined etching is performed on the copper plate. It is implemented. In other words, when using a metal having good electrical conductivity and thermal conductivity such as aluminum as a substrate material from the viewpoint of heat dissipation, it is necessary to form an electrical insulating layer between the metal substrate and the LED light emitting element, and as a method, a heat-resistant resin is used. The resin insulation layer which has a main component is developed and used. However, the thermal conductivity of the resin insulating layer currently generally used is only about 1-2 mV / m *. Therefore, the high temperature heat generated from the LEDs cannot be transmitted to the metal substrate sufficiently and quickly, and even though the heat pipe is formed on the metal substrate having the low temperature, the high heat of the LEDs is bound to be limited in cooling and heat dissipation. will be.

In the present invention, in consideration of the above-described problems, if the conventional metal substrate is a planar two-dimensional substrate, the present invention is to provide a three-dimensional three-dimensional metal substrate, to solve the problem of cooling and heat dissipation more effectively. By using this, it is possible to maintain the performance even when mounting an ultra-high brightness light emitting device (hereinafter referred to as an ultra high brightness light emitting device), which is more than the light emitting brightness of a conventional light emitting device, and thus it is a liquid crystal display panel. When applied to a light emitting device that realizes a low-cost, long-life, ultra-high resolution (ultra-high definition) liquid crystal display that exceeds the use of AMOLED, and can be used to illuminate the surroundings with an increase in the illumination angle even when applied to a lighting device. Is a technical task.

The light emitting element cooling / heat radiating unit of this invention for solving the said subject is comprised in three dimensions as a form suitable for use as a liquid crystal display panel LED, a light source of an illuminating device, etc. As a material, aluminum, aluminum alloy, magnesium, or magnesium alloy, which is excellent in thermal conductivity and can be anodized to form an oxidizing film, is used, and a square, a rectangular, a polyhedral, a domed, or the like is introduced as the cross-section, and at least one side thereof. An open-type metal substrate case with an opening in the structure, or by sealing an opening of an open-type metal substrate case to enclose a heat medium therein. Consists of. In this case, when the dome shape is introduced as the cross-sectional shape of the metal substrate case, the place where the light emitting element is mounted on the roof surface is not flat. Therefore, the yaw shape or the iron shape can be removed while eliminating the step with the periphery of the curved surface. It consists of one flat surface.

On the roof surface of the metal substrate case or the metal substrate tube, an anodizing process is performed to sequentially form an electrical insulation layer and an electrical pattern circuit based on the porous layer of the oxide film, and mount light emitting elements such as LEDs and semiconductor lasers. In order to protect an electric pattern circuit, a protective film, a reflecting film, etc. are also apply | coated and formed as needed.

In the sealed metal substrate tube, a valve or a nozzle may be configured to inject a heat medium, and the cover may be provided with at least one of a heat dissipation fin, a heat sink fin, and a heat pipe or a cooling pipe.

As described above, the following effects are expected in the present invention.

(1) Since the light emitting element cooling / heating unit of the present invention is based on an anodized oxide film as an electrical insulating layer formed between the light emitting element and the metal substrate case, the thermal conductivity is higher than that of the conventional resin insulating layer. Great heat dissipation effect

(2) When enclosing and using a heat medium in a hermetic metal substrate tube, the metal substrate case can be directly and uniformly cooled, and thus requires a higher current density (hundreds of thousands to several thousand mA) than in the prior art, for example, for automobile headlights. In addition, it is possible to mount and use an ultra high-brightness light emitting element and the like, and to contribute to the long life by stably maintaining the luminous efficiency of these ultra high-brightness light emitting elements.

(3) As the shape of the three-dimensional metal substrate case of the present invention, a dome type, a polyhedron, or the like is introduced, and when applied to a lighting device, light (lumen) can be diffused widely, so that the linearity of the light emitted by the conventional flat substrate Beyond the limits, you can brighten the surroundings like incandescent lamps.

(4) When the ultra-luminescent light emitting element cooling / heating unit of the present invention is applied to the LCD of a liquid crystal display device, it is possible to realize the ultra high resolution (ultra high definition) and the long life that exceeds the use of AMOLED.

(5) Since the ultra-high brightness light emitting device cooling / heat dissipation unit of the present invention provides cooling and heat dissipation more effectively than any of the related arts, it is possible to realize economic efficiency by reducing the lifespan of the light emitting devices as well as their usage (number). have.

1 is a partial front view and a cross-sectional view showing an example of a domed metal substrate case.
Figure 2 is a cross-sectional view showing an example of the cover of the dome-shaped metal substrate case of Figure 1, (a) is a state in which the heat pipe or cooling pipe is configured on the cover, (b) is a state in which the heat sink fin and the heat radiation fins on the cover Indicates.
3 is a partial cross-sectional view and a front view showing an example of the dome-type heat dissipation element cooling / heat dissipation unit using FIG.
Fig. 4 is a partial inclination showing an example of a rectangular light emitting element cooling / heat radiating unit configured for use in a liquid crystal display device XL, wherein (a) shows a non-covered state, and (b) shows a covered state.
Fig. 5 is a partial inclination diagram showing an example of a multi-sided light emitting element cooling / heating unit configured for use as a fluorescent lamp-type luminaire, where (a) shows a non-covered state and (b) shows a covered state.
FIG. 6 is an example in which the dome type cooling / heat radiating unit shown in FIG. 2 is applied to a light bulb type lighting fixture, where (a) shows a non-covered state and (b) shows a cover-applied state.
Fig. 7 is a front view showing an example of a heat sink of a heat pipe structure used in a conventional liquid crystal display device.
FIG. 8 is an example of an electron microscope photograph of a fracture surface obtained by sequentially performing an electroless nickel plating, an electroless copper plating, and an electrolytic copper plating on an aluminum alloy on which an oxide film was formed by introducing an anodizing process.

The present invention will be described in detail with reference to the accompanying drawings.

1 illustrates an example of an open metal substrate case having a dome shape in a cross-sectional shape of the metal substrate case 2, and FIG. 2 illustrates a lid 7 capable of sealing the opening 40 of the open metal substrate case of FIG. 1. An example of the configuration is shown.

In the light emitting element cooling / heat radiating unit of the present invention, in the metal substrate case 2 having such a three-dimensional shape, the light insulating element 1 is formed by forming an electrical insulation layer 3 and an electric pattern circuit 4 on the roof surface thereof. And 11, 21) to be completed, and the completed example is illustrated in FIGS. 3 to 6.

As the material of the metal substrate case 2 and the lids 7, 17, 27, 37 of the present invention, it is economical and relatively excellent in thermal conductivity, and anodized to form an insulating layer of an oxide film on the metal surface. Use metal that can. Representative metals include aluminum (150-230 kPa / m), aluminum alloys, magnesium (150 kPa / m) and magnesium alloys. Among these metals, aluminum and aluminum alloys are particularly suitable for workability, oxide film formability, It is a very advantageous metal in terms of thermal conductivity, heat radiation and cost.

By using such a metal, as the cross-sectional shape of the metal substrate case, for example, a shape capable of increasing the illumination angle is preferable when using it as a lighting device. In the case where the polyhedral shape shown in Fig. 1 is introduced and the liquid crystal display device is to be used as the LCD, the shape that can use the straightness of light is preferable. Therefore, it is preferable to introduce the rectangle, the square, etc. shown in Fig. 4. However, it is not necessarily limited to these shapes. Similar shapes based on these may be described as techniques within the scope of the present invention.

By introducing such shapes, a predetermined three-dimensional metal substrate case is completed by performing plastic processing such as drawing, extrusion or deep drawing, heat treatment required according to machining and materials, and the like. At this time, in completing the three-dimensional metal substrate case, an open metal substrate is formed by forming openings 40 to 43 on at least one surface of the case on which the light emitting devices 1, 11 and 21 are mounted, that is, at least one surface except the roof surface. 3 (a), 4 (a), 5 (a) and 6 (a), or the openings 40 to 43 of the open metal substrate casing are sealed and the thermal medium therein. As a shape capable of encapsulating (20), a hermetically sealed metal substrate tube having a set of metal substrate cases and covers (7, 17, 27, 37) (Figs. 3 (b), 4 (b), and 5 ( b) and FIG. 6 (b)). At this time, when the dome shape (Figs. 1, 3, 6) is introduced as the cross-sectional shape of the metal substrate case, since the roof surface on which the light emitting element is mounted is an uneven curved surface, it is necessary to eliminate the step with the surroundings. The flat surface 6 having a) or iron type can be used to expand the contact area with the light emitting element.

Here, the open metal substrate case (Fig. 3 (a), Fig. 4 (a), Fig. 5 (a), Fig. 6 (a)) is a heat dissipation mechanism that can use cooling (heat convection) and heat radiation by nature. To be, when fastened to the metal housing and the like will conduct heat to the housing. The sealed metal substrate tube (Fig. 3 (b), Fig. 4 (b), Fig. 5 (b), Fig. 6 (b)) can be used by encapsulating a heat medium in a tube made of a container. In addition to the heat dissipation characteristics of the open metal substrate case, the metal substrate case can be used as a hybrid cooling and heat dissipation mechanism capable of cooling under even more uniform conditions. 3 (b), 4 (b), 5 (b) and 6 (b) have a structure capable of separating the metal board case and the cover, such as bolts and screws. A fastener may be used to insert the O-ring 24 or sealing material to prevent leakage of the thermal medium 20, or when the fastener is not available, they may be welded or soldered to form a completely sealed type. .

The heat medium 20 is preferably selected from water, oils or alcohols, and may be supplied to such an extent that it does not freeze in cold regions if possible.

In the case of the cover 7, 17, 27, 37 in the hermetic metal substrate tube, an example in which the heat receiving area is increased while being integrally formed with the cover in order to easily conduct the heat of the heat medium 20 to the outside is shown. For example, as shown in Fig. 2 (b), the heat receiving fin 13 can be configured, and in order to easily radiate and dissipate heat from the outside to the air, the heat dissipation area is enlarged while being integrated with the cover. For example, as shown in FIG. 2 (b), the heat dissipation fin 23 may be further configured, and the working fluid may be sealed in the metal pipe to evaporate the working fluid, move the steam, condense the steam, and capillary tubes in the pipe. A heat pipe that transfers heat by returning fluid by force, or a cooling pipe that circulates and cools the heat medium in the three-dimensional metal substrate case by a micro pump. (E.g., 8 and 18), for example, if the temperature of the three-dimensional metal substrate case is predicted and calculated at 80 ° C or higher, it can be said that it is a preferable method to install even for maintaining the performance of the light emitting element.

In the hermetic metal substrate tube, a nozzle or a valve for injecting the thermal medium 20 may be separately configured (not shown).

The electrical insulation layer 3 is formed on the roof surface of the three-dimensional metal substrate case configured as described above before configuring the electrical pattern circuit 4. The conventional electrically insulating layer 34 is a thermosetting resin composition prepreg obtained by dispersing a nitride, alumina or magnesium (water) magnesium as a thermally conductive filler by applying a predetermined acid treatment on a flat metal substrate 32. It was common to construct. However, since the thermal conductivity of the electrical insulation layer 3 comprised in this way is only about 1-2 mV / m *, it has a lot of trouble in heat dissipation. In the present invention, in order to completely exclude or reduce such a low thermal conductive heat resistant resin insulating layer, a metal oxide film formed by introducing a known anodizing technique is used as the basis of the insulating layer. For example, when the aluminum oxide anodizes, the thermal conductivity of the porous metal oxide layer is 50 Pa / m · Pa or more, so that a high heat dissipation effect that can not be compared with the conventional one can be expected. Further, when the nanodiamonds are dispersed and impregnated therewith, higher thermal conductivity can be expected.

Therefore, in order to use the film of the metal oxide formed by the (first) anodizing process as an electrical insulation layer as it is, the electrical insulation layer in this invention has a thickness of 20 the porous layer containing a barrier layer. A heat-resistant resin such as polyimide or the like is applied to the porous layer of the metal oxide film insulating layer, and (ii) the metal oxide obtained in the first step, which realizes a withstand voltage of 2 kV or more, preferably 3 kV or more while forming at least 40 m, preferably at least 40 m. Heat-resistant resin-impregnated metal oxide film insulation layer, which slightly satisfies thermal conductivity by applying a predetermined heat treatment after coating or depositing, but further strengthens the withstand voltage and insulation effect, and (third) the conventional general described above in the porous layer of metal oxide obtained Using a prepreg in which the thickness of the thermally conductive filler-containing heat-resistant resin layer is reduced to 1/2 or less; Heat-resistant resin-decreased metal oxide film insulating layer which further reduces the thermal conductivity to some extent but further strengthens the withstand voltage; and (fourth) diamond powder having a size of µm or less having a thermal conductivity of 1000 Pa / m 占Ｋ or more as a heat conductive filler. The dispersion is further composed of a diamond-dispersed heat-resistant resin metal oxide film insulating layer in which the average thermal conductivity of the electrical insulating layer is increased to at least 10 kPa / m · Ｋ or more, and the withstand voltage is further strengthened.

For reference, sequencing the properties for these electrically insulating layers is as follows.

* Thermal Conductivity: Metal Oxide Film Insulation Layer (50Ｗ / mＫ or more)> Heat Resistant Impregnated Metal Oxide Film Insulation Layer≥Diamond Dispersion Heat Resistant Metal Oxide Film Insulation Layer> Heat Resistant Reduction Metal Oxide Film Insulation Layer> Conventional Common Resin Insulation Floor (1 ~ 2Ｗ / mＫ)

* Withstand voltage: Conventional general resin insulation layer (more than 5 kV) ≥ diamond dispersion heat resistant resin metal oxide film insulation layer ≥ heat resistant resin reduced metal oxide film insulation layer ≥ heat resistant resin impregnated metal oxide film insulation layer> metal oxide film insulation layer (2 to 3.5 ｋＶ)

Since the electrical insulation layer in this invention utilizes the metal oxide film formed by the anodizing process in this way, compared with the conventional general method, the resin insulation layer is excluded or in some cases the thickness is 1/2. It can also be reduced to Therefore, by minimizing the high temperature difference gradient formed between the light emitting element and the metal substrate as in the prior art, it is possible to achieve heat radiation and cooling more effectively.

In addition, the anodizing process may use various known techniques, such as sulfuric acid method, phosphoric acid method, fishery method, and other mixed acid methods, for example, when aluminum or an aluminum alloy is selected, but the pore size control associated with the electric insulation layer is controlled. In this regard, detailed experiences and know-how are required for the improvement of the breakdown voltage and the heat crack resistance. Therefore, detailed description thereof is omitted.

In this way, the required electrical insulation layer 3 is formed on the roof surface of the three-dimensional metal substrate case or the three-dimensional metal substrate tube, and the electrical pattern circuit 4 for mounting the light emitting element is formed on the insulation layer.

The electric pattern circuit 4 is provided by two methods described below.

First, when the heat-resistant resin-reduced metal oxide film insulation layer (third) and the diamond-dispersed heat-resistant resin metal oxide film insulation layer (fourth) described above as electrical insulation layers, a heat-resistant resin prepreg formed according to these characteristics ), Which is the same shape as that of the three-dimensional metal substrate case, so that it can be covered flatly without wrinkles, the first molded product is first placed on the anodized metal substrate case loop, and then pressed into the same shape. A copper plate having a thickness of is placed on it to obtain a three-dimensional metal substrate case in which an electrical insulating layer and a copper plate are laminated at the same time through a predetermined heating and pressing process. With respect to the copper plate attached to the three-dimensional metal substrate case thus obtained, unnecessary portions are removed through an etching process to complete a predetermined electric pattern circuit (Subtractive-Process).

The second time is when the metal oxide film insulating layer (first) and the heat-resistant resin-impregnated metal oxide film insulating layer (second) described above are configured as the electric insulating layer. At this time, it is good to form on the electrical insulation layer comprised in this way using well-known wet-plating technique, or to form a predetermined electrical pattern circuit using a silver fest. Of course, dry plating using Cdd or Pdd may also be partially introduced, but it is not necessary to recognize problems such as expensive equipment and a large amount of time required for direct plating to a predetermined thickness. You must not.

An example of the wet plating method will be described.

In order to increase the adhesion between the anodized porous film and the plating layer film, first, the pore size of the anodized oxide film, which is formed as an electrically insulating layer on the three-dimensional metal substrate case loop, is expanded to increase the pore size using alkali or acid. Do The pore size depends on the electrolytic conditions of the anodizing and the electrolytic solution. However, the pore expansion treatment is a necessary means even in the sense of removing the weakened surface layer portion that is eroded by an acid or an alkaline liquid during anodizing. It is good to ensure the pore diameter of at least 50 nm or more.

Here, a hydrophilic treatment or a coupling treatment is carried out as necessary to carry out a catalytic treatment using a metal such as palladium. In order to increase the plating density, electroless nickel plating is preferable. After this, electrolytic copper plating or electroless copper plating is added to the electroless nickel plating layer, followed by electrolytic copper plating to obtain a predetermined copper plating film. For the copper plated film, an unnecessary portion is removed through an etching process to complete a predetermined electric pattern circuit (Subtractive-Process).

In such a copper etching method, use of an acid or an alkali is inevitable. Since the anodized porous membrane is eroded when exposed to such an acid or alkali for a long time, the following plating method may be adopted.

That is, before or after the anodizing electrical insulation layer is formed on the three-dimensional metal substrate case, or before or after electroless nickel plating, a resist film is formed in advance on the portion of the electrical pattern circuit, thereby eliminating the electrical pattern. The circuit is formed directly by a plating process or by removing only a nickel plating layer by depositing it in an acid in a short time (Fully-, Semi-, Partly-Aditive Process).

In Fig. 8, electroless electrolysis after coupling treatment and neutral palladium catalysis (not released) is performed on an aluminum alloy (Al6061) in which an oxide film having a thickness of about 50 µm is formed by using an electrolyte solution (not released) mainly containing oxalic acid. Electron microscope was used to sequentially perform neutral nickel plating (off-the-shelf, 10 minutes), electroless neutral copper plating (not released, 20 minutes), and electrolytic neutral copper plating (unreleased, 3.0 A / dm ² , 10 minutes). An example of the photograph which observed the fracture surface is shown. Nickel plating was also deeply formed in the porous layer of the oxide film, thus serving as an anchor, and exhibited strong adhesion between the oxide film layer and the plating layer. If a resist is formed and etched on the plating layer thus formed, a predetermined electric pattern circuit can be obtained.

After the electric pattern circuit is formed, a predetermined protective resist film is used to protect the circuit after mounting the light emitting elements 1, 11 and 21, such as LEDs and semiconductor lasers, and to increase the reflection of light generated by the light emitting element. It is also good to form (5).

On the other hand, the inner and outer surfaces other than the electrically insulating layer formed on the loop of the three-dimensional metal substrate case, for example, as a means that can prevent the corrosion caused by the heat medium 20, while also increasing the thermal emissivity, It is preferable to perform a predetermined anodizing surface treatment. It may be better to form a resin layer only to prevent corrosion, but the resin layer has a problem of reducing heat conduction and heat radiation. And since the emissivity of aluminum itself is only about 0.1, it is not suitable as a heat radiating mechanism of its own. Therefore, in view of corrosion and corrosion resistance, heat conduction and heat radiation, it is a good way to introduce an anodizing process into aluminum to form an oxide film layer of about 10 mu m. At this time, the thermal emissivity of the aluminum oxide film layer can also be improved to 0.7 or more, and can be further increased when the black body is treated.

The heat medium 20, such as water, oil, alcohol, or the like, is injected into the light emitting device cooling / heat dissipation unit thus completed, assembled into a predetermined housing 30, and completed.

In order to prevent condensation of the light emitting element cooling / heating unit, the housing 30 may be provided with an open type or vent hole 26. When the housing 30 is made of metal such as aluminum, the housing 30 may be used as an external heat dissipation fin. Of course, it is preferable to anodize the housing for the reasons described above.

In the three-dimensional light emitting element cooling / heating unit of the present invention, the high-temperature heat generated in the light emitting element is quickly conducted to the metal substrate by the insulating layer having high thermal conductivity, or the three-dimensional metal substrate portion on which the light emitting element is mounted is heated by the heat medium. Since it can be directly and uniformly cooled, the maximum temperature of heat generated even when a high current density ultra high brightness light emitting element is mounted can be built up to, for example, 80 ° C. or lower, more preferably 60 ° C. or lower. It is expected to become one of the indispensable cooling / heating devices in the application and utilization of light emitting devices.

In particular, when the light emitting element cooling / heating unit of the present invention is introduced as a LCD of a liquid crystal display device (LCD) such as a television, a computer or a smartphone, the contrast ratio can be further increased, thereby achieving ultra high resolution and ultra high resolution. It is a three-dimensional lighting device that can diffuse light (lumen) even when introduced into various lighting devices, and it can contribute to an increase in the lighting angle. Therefore, the range of its use in the IT industry, the lighting industry, and the automobile industry that uses light in the future Can be said to be extensive.

1, 11, 21, 31: LED 2: (Three-dimensional) metal substrate case
3, 34: insulation layer 4: pattern circuit layer
5: protective resist film 6: flat surface
7, 17, 27, 37: cover
8, 18, 28: heat pipe or cooling pipe
9: electrode 10: socket
13: sequence fin 15, 16: anodized
19, 25, 29: fastener 20: thermal medium
22: LED light emission (lumen) 23, 33: heat radiation fin
24: O-ring 26: vent
30: housing 32: (conventionally flat) metal substrate
40,41,42,43: opening

Claims

A three-dimensional metal substrate case using aluminum, an aluminum alloy, magnesium or magnesium alloy and having an opening formed in at least one side by adopting a square, rectangular, or multi-faced or domed shape as its cross-sectional shape,
An electrical insulation layer is formed on the three-dimensional metal substrate case roof surface,
A light emitting element is mounted on the electrically insulating layer by forming an electrical pattern circuit layer mainly composed of copper or silver.
Light emitting element cooling and heat dissipation unit.

The location of mounting the light emitting element on the roof surface of the metal substrate case of which the cross-sectional shape is a domed shape is a flat surface having a concave or iron shape while eliminating a step with a perimeter of a curved surface. A light emitting element cooling and heat dissipation unit, comprising:

The said electrically insulating layer is a metal oxide film insulation layer formed by the anodizing process, the heat resistant resin impregnation metal oxide film insulation layer which impregnated the said metal oxide film with the heat resistant resin, and the said metal oxide film is a thermally conductive inorganic Heat-resistant resin metal oxide film insulation layer which further comprised the heat-resistant resin layer prepreg which disperse | distributed the filler, and diamond dispersion heat-resistant resin metal oxide film insulation layer which further comprised the heat-resistant resin layer prepreg which disperse | distributed the thermally conductive diamond powder to the said metal oxide film. A light emitting element cooling and heat dissipation unit configured by any of the above.

The light emitting device cooling according to claim 1, wherein a cover is formed in an opening of the metal substrate case, and a metal substrate tube is formed by pairing the metal substrate case and the lid, and a heat medium is sealed in the tube. Heat dissipation unit.

The light emitting element cooling and heat dissipation unit according to claim 4, wherein the cover is provided with at least one of a heat dissipation fin, a heat sink fin, a heat transport heat pipe, and a cooling pipe.