KR20130142030A - Illuminating device - Google Patents

Abstract

The present invention relates to an illuminating device which includes: an optical source module which includes at least one optical source which is arranged on a printed circuit board and a resin layer which is arranged on the printed circuit board to bury the optical source; a light reflecting member which is formed on one side or the other side of the resin layer; and a diffusion plate which includes a top surface which is formed on the optical source module and a sidewall which is integrated with the top surface, is downwardly extended, and is closely attached to the light reflecting member. The flexibility of a product is secured by supplying the illuminating device with a structure with a first air gap between the optical source module and the top surface of the diffusion plate, and durability and reliability are improved.

Description

Lighting device {ILLUMINATING DEVICE}

The present invention relates to the field of lighting devices.

The LED (Light Emitted Diode) device is a device that converts electrical signals to infrared rays or light using the characteristics of compound semiconductors. Unlike fluorescent light, unlike harmful substances such as mercury, it does not cause environmental stigma. It has a long lifetime advantage. In addition, it consumes low power compared to conventional light sources, has high visibility due to high color temperature, and has a small glare.

Therefore, the current lighting apparatus has been developed from the conventional light source such as incandescent lamps or fluorescent lamps to the light source using the above-described LED element as a light source, in particular, as disclosed in Korean Patent Publication No. 10-2012-0009209 There is provided an illumination device that performs a surface emitting function.

In the above-described conventional lighting apparatus, a flat light guide plate is disposed on a substrate, and a side surface of the light guide plate has a structure in which a plurality of side type LEDs are arranged in an array form. The light guide plate is a kind of plastic molded lens that performs a function of supplying uniform light to the light emitted from the LED. Therefore, such a light guide plate is used as an essential component in a conventional lighting device. Due to the thickness of the light guide plate itself, there is a limit to reducing the thickness of the entire product, and because the material of the light guide plate itself is inflexible, it is difficult to apply to the bent portion, and thus, product design and design modification are not easy. Was implicated.

In addition, as the light is emitted to the side of the light guide plate, there is a problem that light loss occurs due to light loss, and the characteristics of the LED (for example, brightness and wavelength change) change as the temperature of the LED increases during light emission. There was also a problem.

Publication No. 10-2012-0009209

The present invention has been proposed to solve the above-described problems, and can provide a lighting device capable of thinning, improving the degree of freedom in product design, improving heat dissipation efficiency, and suppressing wavelength shift and brightness reduction. For that purpose.

The lighting apparatus of the present invention for solving the above problems, the light source module including at least one light source disposed on the printed circuit board and a resin layer disposed on the printed circuit board to embed the light source; A light reflection member formed on at least one of one side and the other side of the resin layer; And a diffuser plate formed on the light source module and having a sidewall integrally formed with the upper surface and extending in a downward direction to be in close contact with the light reflection member. The first air gap may be formed between the surfaces.

In the lighting apparatus of the present invention, the printed circuit board may be a flexible printed circuit board.

In the illuminating device of the present invention, the resin layer may be made of an ultraviolet curable resin containing an oligomer.

At this time, the oligomer is composed of 40 to 55 parts by weight, urethane acrylate (Urethane Acrylate), epoxy acrylate (Epoxy Acrylate), polyester acrylate (Polyester Acrylate), polyether acrylate (Polyether Acrylate), polybutadiene acrylate (Polybutadiene Acrylate), and may include at least one of silicon acrylate (Silicon Acrylate).

In the lighting apparatus of the present invention, the resin layer may further comprise 65 to 90 parts by weight of the monomer.

At this time, the monomer, IBOA (isobornyl Acrylate) 35 to 45 parts by weight, 2-HEMA (2-Hydroxyethyl methacrylate) 10-15 parts by weight, 2-HBA (2-Hydroxybutyl Acrylate) is composed of a mixture comprising 15 to 20 parts by weight Can be.

In the lighting apparatus of the present invention, the resin layer may further include 0.5 to 1 parts by weight of the photoinitiator.

Meanwhile, in the lighting apparatus of the present invention, the resin layer is made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, a hydrocarbon-based or ester-based solvent. Can be.

The content of the polyester polyol (Polyester Polyol) resin is 9 to 30% of the total weight of the thermosetting resin, the content of the acrylic polyol (Acryl Polyol) resin is 20 to 40% of the total weight of the thermosetting resin, the solvent The content of may be made of 30 to 70% relative to the total weight of the thermosetting resin.

In the lighting apparatus of the present invention, the thermosetting resin may further comprise a thermosetting agent, wherein the content of the thermosetting agent may be 1 to 10% of the total weight of the thermosetting resin.

In the lighting device of the present invention, the resin layer, silicon (silica), silica (silica), glass bubble (glass bubble), PMMA, urethane (urethane), Zn, Zr, Al ₂ O ₃ , acrylic (acryl) It may further include a diffusion material for diffusing light composed of at least one selected from among.

In the lighting apparatus of the present invention, the refractive index of the resin layer may be formed in the range of 1.4 to 1.8.

In the lighting apparatus of the present invention, the thickness of the diffusion plate may be formed in the range of 0.5 to 5mm.

In the lighting apparatus of the present invention, the thickness of the first air gap may be formed in the range of more than 0 and 30mm or less.

In the lighting apparatus of the present invention, the light reflecting member may include a white pigment or a metal.

In the lighting apparatus of the present invention, the light source module may further include a reflective sheet disposed between the printed circuit board and the resin layer, and a reflective pattern may be formed on the reflective sheet.

In the lighting apparatus of the present invention, the reflective pattern may include any one of TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and polystyrene (PS).

In the lighting apparatus of the present invention, the light source module may further include a first optical sheet formed on the resin layer and dispersing light emitted from the resin layer.

In the lighting apparatus of the present invention, the light source module may further include an optical pattern formed on the first optical sheet and blocking or reflecting the light emitted from the resin layer.

In the lighting apparatus of the present invention, the light source module may further include a second optical sheet disposed on the first optical sheet.

In the lighting apparatus of the present invention, the light source module may further include an adhesive layer formed between the first optical sheet and the second optical sheet, and a second air gap may be further formed on the adhesive layer.

In the lighting apparatus of the present invention, the light source may be formed of a side view type light emitting device package.

In the lighting apparatus of the present invention, the light source, the package body having a cavity; A first lead frame including one end exposed to the cavity and the other end penetrating through the package body and exposed to one surface of the package body; A second lead frame including an end exposed to one side of the one surface of the package body, the other end exposed to the other side of the one surface of the package body, and an intermediate portion exposed to the cavity; The light emitting device package may include a light emitting device package including a first semiconductor layer, an active layer, a second semiconductor layer, and at least one light emitting chip disposed on the first lead frame.

In the lighting apparatus of the present invention, the middle portion of the second lead frame may electrically connect the one end and the other end of the second lead frame to each other.

In the lighting apparatus of the present invention, the first lead frame, the first upper surface portion exposed to the cavity; It may include a first side portion that is bent from the first side of the first upper surface portion, and exposed to the one surface of the package body.

In the lighting apparatus of the present invention, one or more first through holes may be formed in at least one of the first upper surface portion or the first side surface portion.

In the lighting apparatus of the present invention, the first lead frame may include at least one first through hole formed adjacent to a boundary portion of the first upper surface portion and the first side surface portion.

In the lighting apparatus of the present invention, the at least one first through hole may be filled with a portion of the package body.

In the lighting apparatus of the present invention, the first lead frame includes connecting portions connecting the first upper surface portion and the first side portion to each other, wherein the first through hole is positioned between the connecting portions, and the connecting portion The length of at least one of these may be different from the others.

In the lighting apparatus of the present invention, the at least one light emitting chip may be disposed on the first upper surface portion.

In the lighting apparatus of the present invention, the length of the first direction of the first connection portion aligned with the light emitting chip among the connection portions is greater than the length of the first direction of the second connection portion unaligned with the light emitting chip, The first direction may be an x-axis direction in an xyz coordinate system.

In the lighting apparatus of the present invention, at least one of the connection portions may be formed with a second through hole having a diameter smaller than that of the first through hole.

In the lighting apparatus of the present invention, the second lead frame includes: a second upper surface portion disposed around at least one side of the first upper surface portion and exposed to the cavity of the package body; And a second side portion bent from the second upper surface portion and exposed to each of the one side and the other side of the one surface of the package body.

In the lighting apparatus of the present invention, the second side portion of the first upper surface portion may be provided with at least one groove portion, and the first side portion and the second side portion of the first upper surface portion may be sides facing each other.

In the lighting apparatus of the present invention, the second upper surface portion may be formed with at least one protrusion corresponding to the groove portion.

In the lighting apparatus of the present invention, the second upper surface portion may include first to third portions disposed corresponding to the remaining portions except for the first side portion of the first upper surface portion.

In the lighting apparatus of the present invention, the second side surface portion, the first portion bent from the first portion of the second upper surface portion; And a second portion that is bent from the third portion of the second upper surface portion, wherein the first portion and the second portion may be symmetrical with respect to the first side portion.

In the lighting apparatus of the present invention, the first side portion may be divided into an upper end including the connecting parts, and a lower end positioned below the upper end, and the lower end may protrude laterally from the upper end.

In the lighting apparatus of the present invention, the ratio of the length in the first direction of the second connection portion and the first connection portion may be 1: 1.2 to 1.8.

In the lighting apparatus of the present invention, the ratio of the length in the first direction of the first through hole and the length in the first direction of the upper end of the first side portion is 1: 3.8 to 6.3, and the first direction is in the xyz coordinate system. It may be in the x-axis direction.

In the lighting apparatus of the present invention, the length of the first through hole in the second direction may be 0.19 mm to 0.29 mm.

In the lighting apparatus of the present invention, the light emitting chip comprises: a first electrode layer disposed on the first semiconductor layer; A reflective layer disposed below the second semiconductor layer; And a second electrode layer disposed below the reflective layer.

In the lighting apparatus of the present invention, the light emitting chip may be a device for emitting red light having a wavelength range of 600nm to 690nm.

In the lighting apparatus of the present invention, the light source module is disposed on the flexible printed circuit board, and may further include at least one connector for electrical connection with the outside.

In the lighting apparatus of the present invention, the flexible printed circuit board may further include a fastening fixing part for fastening with the outside.

According to the present invention, by providing a light reflecting member it is possible to minimize the light loss generated in the side of the resin layer, it has the effect of improving the brightness and illuminance of the lighting device.

In addition, according to the present invention by removing the light guide plate to guide the light using the resin layer, it is possible to reduce the number of light emitting device packages, it is possible to reduce the overall thickness of the lighting device.

In addition, according to the present invention, the resin layer may be formed of a high heat resistant resin, and thus, an effect of realizing stable luminance and providing a reliable lighting device despite the heat generated in the light emitting device package may be provided.

In addition, according to the present invention, flexibility can be ensured by forming a lighting device using a flexible printed circuit board and a resin layer, thereby improving the degree of freedom in product design.

In addition, according to the present invention, by allowing the diffusion plate itself to surround the side of the light source module, the diffusion plate itself can perform the housing function at the same time, the effect of improving the manufacturing process efficiency and the product itself by not using a separate structure It has the effect of improving the durability and reliability. Further, according to the present invention, heat radiation efficiency can be improved, and wavelength shift and light intensity reduction can be suppressed.

1 shows a lighting apparatus according to an embodiment of the present invention.
2 to 17 illustrate first to sixteenth embodiments of the light source module illustrated in FIG. 1.
18 illustrates an embodiment of the reflective pattern illustrated in FIG. 4.
19 is a plan view illustrating a seventeenth embodiment of the light source module illustrated in FIG. 1.
20 is a sectional view taken along the AA ′ direction of the light source module shown in FIG. 19.
FIG. 21 is a sectional view taken along the BB ′ direction of the light source module shown in FIG. 19.
FIG. 22 is a cross-sectional view taken along the direction CC ′ of the light source module illustrated in FIG. 19.
23 shows a head lamp for a vehicle according to an embodiment of the present invention.
24 is a perspective view of a light emitting device package according to an embodiment of the present invention.
25 is a top view of a light emitting device package according to an embodiment of the present invention.
26 is a front view of a light emitting device package according to an embodiment of the present invention.
27 is a side view of a light emitting device package according to an embodiment of the present invention.
FIG. 28 is a perspective view of the first lead frame and the second lead frame shown in FIG. 24.
FIG. 29 is a diagram for describing dimensions of respective portions of the first lead frame and the second lead frame shown in FIG. 28.
30 shows an enlarged view of the connecting parts shown in FIG. 29.
31 to 36 illustrate modified embodiments of the first lead frame and the second lead frame.
37 is a perspective view of a light emitting device package according to another embodiment of the present invention.
FIG. 38 is a top view of the light emitting device package shown in FIG. 37.
39 is a front view of the light emitting device package illustrated in FIG. 37.
40 is a cross-sectional view of the cd direction of the light emitting device package illustrated in FIG. 37.
FIG. 41 illustrates a first lead frame and a second lead frame shown in FIG. 37.
42 illustrates a measurement temperature of a light emitting device package according to an embodiment of the present invention.
FIG. 43 illustrates an embodiment of the light emitting chip illustrated in FIG. 24.
44 illustrates a lighting apparatus according to another embodiment.
Fig. 45 shows a general vehicle head lamp which is a point light source.
46 is a view illustrating a tail light for a vehicle according to an embodiment of the present invention.
47 shows a typical vehicle tail light.
48A and 48B illustrate intervals of a light emitting device package of a light source module used in a tail light for a vehicle according to an exemplary embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. It should be understood, however, that the embodiments described herein and the configurations shown in the drawings are only a preferred embodiment of the present invention, and that various equivalents and modifications may be made thereto at the time of the present application. DETAILED DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following description, well-known functions or constructions are not described in detail to avoid obscuring the subject matter of the present invention. The following terms are defined in consideration of the functions of the present invention, and the meaning of each term should be interpreted based on the contents throughout this specification. The same reference numerals are used for portions having similar functions and functions throughout the drawings.

The present invention relates to a lighting apparatus, which removes the light guide plate and replaces it with a resin layer, while placing a light reflecting member on the side of the resin layer to improve brightness and illuminance, and innovatively reduce the overall thickness of the lighting apparatus. By processing the diffuser plate and using it as a support for the light reflection member, it is essential to ensure the integrity, durability and reliability of the product, and to secure the flexibility of the lighting device itself.

In addition, the lighting device according to the present invention is applicable to various lamp devices requiring illumination, such as a vehicle lamp, a domestic lighting device, and an industrial lighting device. For example, when it is applied to a vehicle lamp, it can be applied to a headlight, a vehicle interior light, a door scarf, a rear light, and the like. In addition, the illumination device of the present invention can be applied to a backlight unit field applied to a liquid crystal display device, and can be applied to all lighting-related fields that are currently developed, commercialized, or can be implemented according to future technology development.

Hereinafter, the light source module means collectively the components except for the diffusion plate and the light reflection member.

1 shows a lighting device 1 according to an embodiment of the present invention. Referring to FIG. 1, the lighting apparatus 1 may include a light source module 100 that is a surface light source, and further include a housing 150 that accommodates the light source module 100.

The light source module 100 includes at least one light emitting device 20 for generating light, and may implement a surface light source by diffusing and dispersing light generated from the light emitting device 20 as a point light source, and having flexibility. Can bend.

The housing 150 may protect the light source module 100 from impact and may be made of a material (eg, acrylic) through which light emitted from the light source module 100 may be transmitted. In addition, the housing 150 may include a curved portion in terms of design, and since the light source module 100 has flexibility, it may be easily accommodated in the curved housing 150. Of course, the housing 150 itself has a certain flexibility, it is also possible that the assembly structure itself of the entire lighting device 1 has a certain flexibility.

FIG. 2 illustrates a first embodiment 100-1 of the light source module illustrated in FIG. 1, and more specifically, illustrates a cross-sectional view in the AB direction of the lighting apparatus illustrated in FIG. 1. Referring to FIG. 2, the light source module 100-1 includes a printed circuit board 10, a light emitting device 20, and a resin layer 40 that performs a function of a light guide plate. do. The light reflection member 90 is formed on at least one of one side and the other side of the resin layer 40, and the diffusion plate 70 is formed on the light source module 100-1 described above.

The printed circuit board 10 may be a printed circuit board using a flexible insulating board, that is, a flexible printed circuit board 10.

For example, the printed circuit board 10 may include a base member (eg, 5) and a circuit pattern (eg, 6, 7) disposed on at least one surface of the base member (eg, 5), and the base member (eg, The material of 5) may be a film having flexibility and insulation, such as polyimide or epoxy (eg FR-4).

More specifically, the printed circuit board 10 may include an insulating film 5 (eg, polyimide or FR-4), a first copper foil pattern 6, a second copper foil pattern 7, and a via contact 8. It may include. The first copper foil pattern 6 is formed on one surface (for example, the upper surface) of the insulating film 5, the second copper foil pattern 7 is formed on the other surface (for example, the lower surface) of the insulating film 5, and is insulating The first copper foil pattern 6 and the second copper foil pattern 7 may be connected through the via contact 8 formed through the film 5.

Hereinafter, the case in which the printed circuit board 10 is made of the flexible printed circuit board as described above will be described as an example, and the terms are used interchangeably. This is just an example, and various types of substrates may be used as the printed circuit of the present invention. It can be said that it can be used as the substrate 10.

The light emitting device 20 is disposed on the flexible printed circuit board 10 in one or more numbers, and emits light. For example, the light emitting device 20 may be a side view type light emitting device package arranged so that the emitted light travels in the direction 3 toward the side of the resin layer 40. In this case, the light emitting chip mounted on the light emitting device package may be a vertical light emitting chip, for example, a red light emitting chip illustrated in FIG. 43, but embodiments are not limited thereto.

The resin layer 40 is disposed on the flexible printed circuit board 10 and the light emitting device 20 so as to fill the light emitting device 20, and the side surface 3 of the resin layer 40 from the light emitting device 20 is disposed. The light emitted by the light may be diffused and induced in a direction toward one surface (eg, the upper surface) of the resin layer 40.

The resin layer 40 may be made of a resin that can diffuse light, and the refractive index may be formed in the range of 1.4 to 1.8, but is not limited thereto.

For example, the resin layer 40 may be made of a high heat resistant ultraviolet curable resin including an oligomer. At this time, the content of the oligomer may be made of 40 to 50 parts by weight. Urethane acrylate may be used as the ultraviolet ray hardening resin. However, the ultraviolet ray hardening resin may be epoxy acrylate, polyester acrylate, polyether acrylate, At least one of polybutadiene acrylate and silicone acrylate may be used.

In particular, when using an urethane acrylate (Urethane Acrylate) as the oligomer, by using a mixture of two types of urethane acrylate (Urethane Acrylate) it is possible to implement different physical properties at the same time.

For example, isocyanate is used in the synthesis of Urethane Acrylate, and the physical properties (sulfur denaturation, weather resistance, chemical resistance, etc.) of Urethane Acrylate are determined by Isocyanate. At this time, any one type of urethane acrylate (Urethane Acrylate) is implemented with Urethane Acrylate type-Isocyanate, but the NCO% of isophorone diisocyanate (PDI) or isophorone diisocyanate (IPDI) is 37% (hereinafter referred to as 'first oligomer' Implement another type of urethane acrylate (Urethane Acrylate) as Urethane Acrylate type-Isocyanate, so that NCO% of PDI (isophorone diisocyanate) or IPDI (isophorone diisocyanate) is 30-50% or 25-35% (Hereinafter, 'second oligomer') to form an oligomer according to the embodiment. According to this, the first oligomer and the second oligomer having different physical properties can be obtained according to NCO% control, and the oligomer constituting the resin layer 40 can be obtained by mixing them. At this time, the weight ratio of the first oligomer in the oligomer is 15 to 20, the weight ratio of the second oligomer may be implemented in the range of 25 to 35.

Meanwhile, the resin layer 40 may further include at least one of a monomer and a photo initiator. More specifically, 35 to 45 parts by weight of isobornyl acrylate (IBOA), 10 to 15 parts by weight of 2-HEMA (2-hydroxyethyl methacrylate), 2 to 2 parts by weight of 2-hydroxybutyl Acrylate) in an amount of 15 to 20 parts by weight. In the case of a photoinitiator (for example, 1-hydroxycyclohexyl phenyl-ketone, diphenyl), or diphenyl (2,4,6-trimethylbenzoyl phosphine oxide), 0.5 to 1 part by weight may be used.

In addition, the resin layer 40 may be made of a thermosetting resin having high heat resistance. Specifically, the resin layer 40 may be made of a thermosetting resin including at least one of a polyester polyol resin, an acrylic polyol resin, a hydrocarbon-based and / or ester-based solvent. Such a thermosetting resin may further include a thermosetting agent for improving the film strength.

In the case of a polyester polyol resin, the content of the polyester polyol resin may be 9 to 30% of the total weight of the thermosetting resin. Also, in the case of an acrylic polyol resin, the content of the acrylic polyol may be 20 to 40% based on the total weight of the thermosetting resin.

In the case of hydrocarbon-based and / or ester-based solvents, the content of hydrocarbon-based and / or ester-based solvents may be 30 to 70% of the total weight of the thermosetting resin. In the case of the thermosetting agent, the content of the thermosetting resin may be 1 to 10% of the total weight. When the resin layer 40 is formed of the above-described material, the heat resistance is enhanced so that high temperature heat is emitted. Even when used in the device, it is possible to minimize the luminance deterioration due to heat, thereby providing a reliable lighting device.

In addition, according to the present invention, the thickness of the resin layer 40 can be innovatively reduced by using the material as described above for realizing the surface light source, thereby realizing thinning of the whole product. In addition, according to the present invention, the illumination device is formed by using a flexible printed circuit board and a resin layer made of a flexible material, and can be easily applied to a curved surface to improve the degree of freedom of design, and to other flexible displays. There are advantages that can be applied and applied.

The resin layer 40 may include a diffusion material 41 having a hollow (or void) formed therein, and the diffusion material 41 may be mixed or diffused with the resin forming the resin layer 40. It may serve to improve the reflection and diffusion characteristics of light.

For example, the light emitted from the light emitting element 20 to the resin layer 40 is reflected and transmitted by the hollow of the diffusing material 41 so that the light is diffused and collected in the resin layer 40, and the light is diffused and collected. The light may be emitted to one surface (eg, the upper surface) of the resin layer 40. In this case, the reflectance and the diffusion rate of the light are increased by the diffusion material 41 to improve the light quantity and uniformity of the emitted light supplied to the upper surface of the resin layer 40, and consequently to improve the brightness of the light source module 100-1. Can be.

The content of the diffusing material 41 may be appropriately adjusted to obtain the desired light diffusing effect. Specifically, it may be adjusted in the range of 0.01 to 0.3% by weight of the total resin layer 40, but is not limited thereto. The diffusion material 41 may be formed of any one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al 2 O 3, and acrylic. The particle diameter of the diffusion material 41 may be 1 μm to 20 μm, but is not limited thereto.

At least one of the one side and the other side of the resin layer 40 is formed with a light reflecting member 90, the light reflecting member 90 is the light emitted from the light source 20 to the upper of the resin layer 70 Induces to be emitted, and serves as a guide to prevent the light is emitted to the outside through the side of the resin layer (40). The light reflecting member 90 may be made of a material having excellent light reflectance, for example, a white resist, and may be made of a synthetic resin containing white pigment dispersed therein or a metal resin having excellent light reflecting properties. It may be. As the white pigment, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate and the like may be used, and in the case of including a metal powder, Ag powder excellent in reflectivity may be included. It is also possible that an additional fluorescent whitening agent is further included. That is, the light reflecting member 90 of the present invention may be formed using all materials that are excellent in light reflectance, which are currently developed or can be implemented according to future technology development. On the other hand, the light reflecting member 90 may be directly molded on the side of the resin layer 40 may be combined, or may be attached via a separate adhesive material (or adhesive tape).

In addition, as will be described later, the diffusion plate 70 may be directly molded into the side wall 73 of the diffusion plate 70, may be attached through a separate adhesive material, or may be directly printed inside the side wall 73. It can also be combined.

In addition, the light reflecting member 90 is shown as being formed over the entire inner surface of the side wall 73 of the diffusion plate 70, but this is only one example and may be formed only on the side of the resin layer 40 The resin layer 40 may be formed over the side surface of the resin printed circuit board 10 and the flexible printed circuit board 10. That is, as long as it includes the side surface of the resin layer 40, there will be no limitation in the forming range of the light reflection member 90.

According to this, as the light reflection member 90 is formed on the side of the resin layer 40, light leakage to the side of the resin layer 40 can be prevented, thereby reducing the light loss and increasing the light efficiency. The effect is to improve the brightness and illuminance of the lighting device.

The diffusion plate 70 may be disposed on the light source module 100-1, more specifically, on the resin layer 40, and uniformly diffuses the light emitted through the resin layer 40 over the entire surface. Play a role. The thickness of the diffusion plate 70 may be basically formed in the range of 0.5 to 5mm, but is not limited thereto and may be appropriately changed according to the specification of the lighting apparatus. In particular, the diffusion plate 70 of the present invention has a structure having a top surface 71 and a side wall 73 formed integrally with the top surface 71 as shown in FIG. 2, wherein the side wall 73 is The side surface of the light source module 100-1 is wrapped. The diffusion plate 70 may be generally formed of an acrylic resin, but is not limited thereto. In addition, polystyrene (PS), polymethyl methacrylate (PMMA), cyclic olefin copoly (COC), and polyethylene terephthalate (PET) may be used. ), And may be made of a material capable of performing a light diffusing function such as a high permeability plastic such as resin.

A first air gap 80 may exist between the upper surface 71 of the diffusion plate 70 and the resin layer 40. Due to the presence of the first air gap 80, it is possible to generate a difference in refractive index with the resin layer 40, thereby increasing the uniformity of the light supplied to the diffuser plate 70. It is possible to improve the uniformity (uniformity) of the light diffused and emitted through the 70). At this time, in order to minimize the deviation of the light transmitted through the resin layer 40, the thickness of the first air gap 80 may be in the range of more than 0 and less than 30mm, but is not limited to this and can be changed in design as necessary.

The side wall 73 of the diffusion plate 70 surrounds the side surface of the light source module 100-1. As described above, the side wall 73 serves as a support for supporting the light reflection member 90 and a housing for protecting the light source module 100-1. That is, the diffusion plate 70 according to the present invention can perform the role of the housing 150 shown in FIG. 1 as needed. According to this, by allowing the diffusion plate 70 itself to surround the side of the light source module 100-1, the diffusion plate 70 itself can perform the housing function at the same time, the manufacturing process according to not using a separate structure It will have the effect of improving efficiency and improving the durability and reliability of the product itself.

3 shows a second embodiment 100-2 of the light source module shown in FIG. 1. The same reference numerals as those in FIG. 2 denote the same components, and duplicate contents thereof will be omitted or briefly explained.

Referring to FIG. 3, in order to improve heat radiation efficiency, the second embodiment may further include a heat radiation member 110 in the first embodiment 100-1.

The heat dissipation member 110 is disposed on the bottom surface of the flexible printed circuit board 10 and serves to discharge heat generated from the light emitting device 20 to the outside. That is, the heat dissipation member 110 may improve the efficiency of dissipating heat generated from the light emitting device 20 as a heat source to the outside.

For example, the heat dissipation member 110 may be disposed on a portion of the bottom surface of the flexible printed circuit board 10. The heat dissipation member 110 may include a plurality of spaced apart heat dissipation layers (eg, 110-1 and 110-2). The heat dissipation layers 110-1 and 110-2 may overlap at least a portion of the heat dissipation layers 110-1 and 110-2 with the light emitting element 20 in a vertical direction. The vertical direction may be a direction from the flexible printed circuit board 10 to the resin layer 40.

The heat dissipation member 110 may be a material having high thermal conductivity, for example, aluminum, an aluminum alloy, copper, or a copper alloy. Alternatively, the heat dissipation member 110 may be a metal core printed circuit board (MCPCB). The heat dissipation member 110 may be attached to the bottom surface of the flexible printed circuit board 10 by an acrylic adhesive (not shown).

In general, when the temperature of the light emitting device increases due to heat generated from the light emitting device, the luminous intensity of the light emitting device may decrease, and a wavelength shift of the generated light may occur. In particular, when the light emitting device is a red light emitting diode, the degree of wavelength shift and intensity decrease is severe.

However, the light source module 100-2 has a heat dissipation member 110 on the bottom surface of the flexible printed circuit board 10 to efficiently discharge heat generated from the light emitting device 20 to the outside to suppress the temperature rise of the light emitting device. As a result, the luminance of the light source module 100-2 may be reduced or the wavelength shift of the light source module 100-2 may be suppressed.

FIG. 4 shows a third embodiment 100-3 of the light source module shown in FIG. The same reference numerals as in FIG. 3 denote the same components, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 4, the light source module 100-3 may have a structure in which the reflective sheet 30, the reflective pattern 31, and the first optical sheet 52 are added to the second embodiment.

The reflective sheet 30 may be disposed between the flexible printed circuit board 10 and the resin layer 40 and may have a structure in which the light emitting device 20 penetrates. For example, the reflective sheet 30 may be positioned on the remaining regions except for one region of the flexible printed circuit board 10 on which the light emitting device 20 is located.

The reflective sheet 30 may be made of a material having high reflection efficiency. The reflective sheet 30 reflects the light emitted from the light emitting device 20 to one surface (for example, the upper surface) of the resin layer 40, and light does not leak to the other surface (for example, the lower surface) of the resin layer 40. Light loss can be reduced. The reflective sheet 30 may be formed in the form of a film, and may be formed by including a synthetic resin dispersion-containing a white pigment in order to implement a property of promoting reflection and dispersion of light.

For example, titanium oxide, aluminum oxide, zinc oxide, lead carbonate, barium sulfate, calcium carbonate and the like can be used as the white pigment, and polyethylene terephthalate, polyethylene naphthalate, acrylic resin, colicarbonate, polystyrene, polyolefin as synthetic resin , Cellulose source acetate, weather resistant vinyl chloride, etc. may be used, but is not limited thereto.

The reflective pattern 31 is disposed on the surface of the reflective sheet 30 and may serve to scatter and scatter incident light. The reflective pattern 31 may be formed by printing a reflective ink including any one of TiO 2, CaCo 3, BaSo 4, Al 2 O 3, Silicon, and polystyrene (PS) on the reflective sheet 30, but is not limited thereto.

In addition, the structure of the reflective pattern 31 may be a plurality of protruding patterns, and may be regular or irregular. The reflection pattern 31 may be formed in a prism shape, a lenticular shape, a lens shape, or a combination thereof in order to increase the light scattering effect, but is not limited thereto. In addition, in FIG. 4, the cross-sectional shape of the reflective pattern 31 may have a structure having various shapes such as a triangle, a quadrangle polygon, a semicircle, a sinusoidal wave, and the like (eg, Hexagonal), circular, oval, semicircular, or the like.

18 illustrates an embodiment of the reflective pattern illustrated in FIG. 4. Referring to FIG. 18, the reflective patterns 31 may have different diameters depending on a distance from the light emitting device 20.

For example, the reflective pattern 31 may have a larger diameter as it is closer to the light emitting device 20. In detail, the diameter of the first reflective pattern 71, the second reflective pattern 72, the third reflective pattern 73, and the fourth reflective pattern 74 may be increased in order. However, the embodiment is not limited thereto.

The first optical sheet 52 is disposed on the resin layer 40 and transmits light emitted from one surface (eg, an upper surface) of the resin layer 40. The first optical sheet 52 may be formed using a material having excellent light transmittance. For example, polyethylene telephthalate (PET) may be used.

Meanwhile, when the first optical sheet 52 is formed, the first air gap 80 described above with reference to FIG. 2 has the upper surface 71 and the first optical sheet 52 of the diffusion plate 70. It can be formed between). Due to the presence of the first air gap 80, the uniformity of light supplied to the diffuser plate 70 may be increased, and as a result, the uniformity of light diffused and emitted through the diffuser plate 70 may be improved. Yes is as described above in the description of FIG.

In addition, although the light reflecting member 90 is shown as being formed over the entire inner side surface of the side wall 73 of the diffuser plate 70 in the drawing, this is only one example, and if the range including the side surface of the resin layer 40 There is no limitation to the forming range of the reflective member 90 as described above in the description of FIG.

FIG. 5 shows a fourth embodiment 100-4 of the light source module shown in FIG.

Referring to FIG. 5, the light source module 100-4 is a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54 in the third embodiment 100-3. ) May be added structure.

The second optical sheet 54 is disposed on the first optical sheet 52. The second optical sheet 54 may be formed using a material having excellent light transmittance, and PET may be used as an example.

The adhesive layer 56 is disposed between the first optical sheet 52 and the second optical sheet 54 to adhere the first optical sheet 52 and the second optical sheet 54.

The optical pattern 60 may be disposed on at least one of an upper surface of the first optical sheet 52 or a lower surface of the second optical sheet 54. The optical pattern 60 may be attached to at least one of the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 by the adhesive layer 56. Another embodiment may further include one or more optical sheets (not shown) on the second optical sheet 56. In this case, the structure including the first optical sheet 52, the second optical sheet 54, the adhesive layer 56, and the optical pattern 60 may be defined as the optical pattern layer 50-1.

The optical pattern 60 may be a light shielding pattern for preventing concentration of light emitted from the light emitting device 20. The optical pattern 60 may be aligned with the light emitting device 20, and may be attached to the first optical sheet 52 and the second optical sheet 54 by the adhesive layer 56.

The first optical sheet 52 and the second optical sheet 54 may be formed using a material having excellent light transmittance, and PET may be used as an example.

The optical pattern 60 basically functions to prevent the light emitted from the light emitting device 20 from being concentrated. That is, in addition to the reflective pattern 31 described above, the optical pattern 60 may implement uniform surface emission.

The optical pattern 60 may be a blocking pattern for shielding a part of the light emitted from the light emitting device 20, and the light may be excessively strong to prevent a phenomenon in which optical characteristics deteriorate or yellowish light is emitted. . For example, the optical pattern 60 may serve to prevent light from being concentrated in a region adjacent to the light emitting device 20 and to disperse the light.

The optical pattern 60 may be formed by performing a printing process on the upper surface of the first optical sheet 52 or the lower surface of the second optical sheet 54 using light blocking ink. The optical pattern 60 may not control the light blocking or diffusing degree of light by adjusting the density and / or the size of the optical pattern so as to perform a function of partially blocking and diffusing the light. For example, in order to improve the light efficiency, the optical pattern 60 may be adjusted to decrease the density of the optical pattern as it moves away from the light emitting device 20, but is not limited thereto.

Specifically, the optical pattern 60 may be implemented as a superimposed printing structure of a complex pattern. The superimposition printing structure refers to a structure that forms one pattern and prints another pattern shape thereon.

For example, the optical pattern 60 may include a diffusion pattern and a light shielding pattern, and may have a structure in which the diffusion pattern and the light shielding pattern overlap. For example, a diffusion pattern may be formed on a lower surface of the polymer film (eg, the second optical sheet 54) in the light emitting direction by using a light blocking ink including at least one selected from TiO 2, CaCO 3, BaSO 4, Al 2 O 3, and silicon. Can be. A light shielding pattern may be formed on the surface of the polymer film by using a light shielding ink including Al or a mixed material of Al and TiO 2.

That is, after the diffusion pattern is formed on the surface of the polymer film by white printing, a light shielding pattern may be formed thereon, or a double structure may be formed in the reverse order. Of course, it will be apparent that the patterned design of the pattern may be variously modified in consideration of light efficiency, intensity, and light blocking rate.

Alternatively, in another embodiment, the optical pattern 60 may have a triple structure including a first diffusion pattern, a second diffusion pattern, and a light shielding pattern disposed therebetween. In such a triple structure, it is possible to select and implement the above materials. As an example, the first diffusion pattern may include TiO ₂ having excellent refractive index, and the second diffusion pattern may have CaCO ₃ having excellent light stability and color. And TiO ₂ may be included together, and the light shielding pattern may include Al excellent in concealment. Through the optical pattern of the triple structure, the embodiment can secure the efficiency and uniformity of light. In particular, CaCO ₃ functions to realize white light through the function of subtracting the exposure of yellow light, thereby realizing more stable light. In addition to CaCO ₃ , BaSO ₄ and Al ₂ are used as diffusion materials for diffusion patterns. Inorganic materials having large particle sizes and similar structures, such as O ₃ and Silicon, may be utilized.

The adhesive layer 56 may surround the periphery of the optical pattern 60, and may fix the optical pattern 60 to at least one of the first optical sheet 52 and the second optical sheet 54. In this case, a material used for the adhesive layer 56 may be a thermosetting PSA, a thermosetting adhesive, or a UV curing PSA type material, but is not limited thereto.

On the other hand, when the second optical sheet 54 is formed on the first optical sheet 52, the first air gap 80 described above in the description of FIG. 2 is the upper surface of the diffusion plate 70 ( 71) and the first optical sheet 52. In this case, the thickness of the first air gap 80 and a description of its function are the same as described above in the description of FIG.

In addition, as long as the range including the side surface of the resin layer 40 is not limited to the range in which the light reflection member 90 is formed, as described above with reference to FIG. 2.

FIG. 6 shows a fifth embodiment 100-5 of the light source module shown in FIG.

Referring to FIG. 6, the light source module 100-5 may have a structure in which a second air gap 81 is added to the fourth embodiment 100-4. That is, the fifth embodiment 100-5 may include a second air gap 81 between the first optical sheet 52 and the second optical sheet 54.

For example, a second air gap 81 may be formed in the adhesive layer 56. The adhesive layer 56 forms a space (second air gap 81) spaced around the optical pattern 60, and an adhesive material is applied to the other parts of the adhesive layer 56 to form the first optical sheet 52 and the second optical sheet ( 54 may be implemented as a structure for adhering each other.

The adhesive layer 56 may have a structure in which the second air gap 81 is positioned at the periphery of the optical pattern 60. Alternatively, the adhesive layer 56 may have a structure surrounding the peripheral portion of the optical pattern 60, and the second air gap 81 is positioned at a portion other than the peripheral portion. The adhesive structure of the first optical sheet 52 and the second optical sheet 54 may be implemented together with the function of fixing the printed optical pattern 60. The structure including the first optical sheet 52, the second optical sheet 54, the second air gap 81, the adhesive layer 56, and the optical pattern 60 is defined as the optical pattern layer 50-2. can do.

Since the second air gap 81 and the adhesive layer 56 have different refractive indices, the second air layer 81 diffuses the light traveling from the first optical sheet 52 toward the second optical sheet 56. Dispersion can be improved. And because of this, the embodiment can implement a uniform surface light source.

FIG. 7 shows a sixth embodiment (100-6) of the light source module shown in FIG. Referring to FIG. 7, the light source module 100-6 may have a structure in which via holes 212 and 214 are provided in the flexible printed circuit board 10 to improve heat dissipation.

The via holes 212 and 214 may penetrate the flexible printed circuit board 110 and expose a part of the light emitting device 20 or a part of the resin layer 40. For example, the via holes 212 and 214 may include a first via hole 212 exposing a portion of the light emitting device 20 and a second via hole 214 exposing a portion of the bottom surface of the resin layer 40.

Heat generated from the light emitting device 20, which is a heat source, may be directly emitted to the outside through the first via hole 212, and heat conducted from the light emitting device 20 to the resin layer 40 may be transferred to the second via hole ( 214 may be emitted directly to the outside. In the sixth exemplary embodiment, since heat generated from the light emitting device 20 is discharged to the outside through the via holes 212 and 214, heat dissipation efficiency may be improved. The shape of the first via hole 212 and the second via hole 214 may be various shapes such as polygonal, circular, and elliptical.

FIG. 8 shows a seventh embodiment (100-7) of the light source module shown in FIG. Referring to FIG. 9, the light source module 100-7 may have a structure in which a reflective sheet 30, a reflective pattern 31, and a first optical sheet 52 are added to the sixth embodiment. In the seventh embodiment 100-7, heat dissipation efficiency may be improved by the first and second via holes 212 and 214. Descriptions of the components 30, 31, and 52 added in the present embodiment are the same as described above with reference to FIG. 4, and thus will be omitted.

FIG. 9 shows an eighth embodiment (100-8) of the light source module shown in FIG. 9, the light source module 100-8 has a structure in which a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54 are added to a seventh embodiment. It can have Configurations 52, 54, 56, and 60 added in the present embodiment are the same as described above in FIG. 5, and thus will be omitted.

FIG. 10 shows a ninth embodiment 100-9 of the light source module shown in FIG. 1. Referring to FIG. 10, the light source module 100-9 may include the second optical sheet 52, the adhesive layer 56, the light shielding pattern 60, the second optical sheet 54, and the second air in the seventh embodiment. The gap 81 may have an added structure. A second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the tenth embodiment 100-10, and the second air gap 81 may be formed in FIG. 6. It may be the same as described.

FIG. 11 illustrates a tenth embodiment (100-10) of the light source module shown in FIG. The same reference numerals as in FIG. 1 denote the same components, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 11, unlike the heat dissipation member 110 of the second embodiment 100-2, the heat dissipation member 310 of the light source module 100-10 is disposed on the bottom surface of the flexible printed circuit board 10. The lower heat dissipation layer 310-1 and a portion of the lower heat dissipation layer 310-1 may have a through part 310-1 penetrating the flexible printed circuit board 10 to contact the light emitting device 20. .

For example, the through part 310-1 may contact the first side part 714 of the first lead frames 620 and 620 ′ of the light emitting device packages 200-1 and 200-2, which will be described later.

According to the tenth embodiment, since heat generated from the light emitting device 20 is directly transmitted to the heat dissipation member 310 by the penetrating portion 310-1, the heat dissipation efficiency can be improved.

12 illustrates an eleventh embodiment 100-11 of the light source module illustrated in FIG. 1. Referring to FIG. 12, the light source module 100-11 may have a structure in which the reflective sheet 30, the reflective pattern 31, and the first optical sheet 52 are added to the tenth embodiment. The fields 30, 31, and 52 may be the same as described with reference to FIG. 4.

FIG. 13 shows a twelfth embodiment (100-12) of the light source module shown in FIG. Referring to FIG. 13, in the eleventh embodiment 100-11, the light source module 100-12 includes a second optical sheet 52, an adhesive layer 56, a light shielding pattern 60, and a second optical sheet 54. ) May be added structure. Additional configurations 52, 54, 56, and 60 may be the same as described in FIG. 5.

FIG. 14 shows a thirteenth embodiment (100-13) of the light source module shown in FIG. Referring to FIG. 14, the light source modules 100-13 may have a structure in which a second air gap 81 is added to the twelfth embodiment 100-12. That is, a second air gap 81 may exist between the first optical sheet 52 and the second optical sheet 54 of the thirteenth embodiment 100-13, and the second air gap 81 is illustrated in FIG. 6. It may be the same as described above.

FIG. 15 shows a fourteenth embodiment of the light source module shown in FIG. 1, FIG. 16 shows a fifteenth embodiment of the light source module shown in FIG. 1, and FIG. 17 shows a sixteenth embodiment of the light source module shown in FIG. 1. For example.

The reflective sheet 30-1, the second optical sheet 54-1, and the diffusion plate 70-1 shown in FIGS. 15 to 17 are formed by the reflective sheet shown in FIGS. 6, 10, and 14. 30), the second optical sheet 54, and the diffusion plate 70 may be modified.

Unevenness R1, R2, and R3 may be formed on one or both surfaces of at least one of the reflective sheet 30-1, the second optical sheet 54-1, and the diffusion plate 70-1. The unevenness R1, R2, and R3 serve to reflect and diffuse incident light so that light emitted to the outside forms a geometric pattern.

For example, a first unevenness R1 may be formed on one surface (eg, an upper surface) of the reflective sheet 30-1, and a second unevenness R2 may be formed on one surface (eg, an upper surface of the second optical sheet 54-1). ) May be formed, and a third unevenness R3 may be formed on one surface (eg, a lower surface) of the diffusion plate 70. The unevenness R1, R2, and R3 may have a plurality of regular or irregular patterns. In order to increase the reflection and diffusion effects of light, the structure may be formed in a prism shape, a lenticular shape, a concave lens shape, a convex lens shape, or a combination thereof, but is not limited thereto.

In addition, the cross-sectional shape of the uneven (R1, R2, R3) may be made of a structure having a variety of shapes, such as triangular, square, semicircular, sinusoidal. The size or density of each pattern may be changed according to the distance from the light emitting device 20.

The unevenness R1, R2, and R3 may be formed by directly processing the reflective sheet 54-1, the second optical sheet 54-1, and the diffuser plate 70, but the present invention is not limited thereto. It can be formed in any way that is currently developed and commercialized, such as a method of attaching a film, or can be implemented according to future technological developments.

According to the embodiment, the geometric light pattern may be easily implemented through the combination of the patterns of the first to third unevennesses R1, R2, and R3. In another embodiment, irregularities may be formed on one or both surfaces of the second optical sheet 52.

However, the embodiment in which the unevenness R1, R2, or R3 is formed is not limited to FIGS. 15 to 17, and the reflective sheet 54, the first optical sheet 52, and the second optical included in other embodiments are not limited thereto. At least one or both surfaces of the sheet 54 and the diffusion plate 70 may be formed with irregularities for increasing the reflection and diffusion effects of light.

FIG. 19 is a plan view of a seventeenth embodiment (100-17) of the light source module shown in FIG. 1, and FIG. 20 is a sectional view taken along the AA 'direction of the light source module 100-17 shown in FIG. 21 is a sectional view in the BB 'direction of the light source modules 100-17 shown in FIG. 19, and FIG. 22 is a sectional view in the CC' direction of the light source modules 100-17 shown in FIG.

19 to 22, the light source module 100-17 includes a plurality of sub-light source modules 101-1 to 101-n, and a natural number of n> 1. The sub light source modules 101-1 to 101-n may be separated from or combined with each other. In addition, the plurality of sub light source modules 101-1 to 101-n may be electrically connected to each other. In this case, the diffusion plate 70 and the light reflection member 90 are formed by coupling the sub light source modules 101-1 to 101-n with each other, and then the light reflection member 90 is formed on the entire coupling structure. 73) by combining the diffusion plate 70 formed inside.

Each of the sub light source modules 101-1 to 101-n includes at least one connector (eg, 510, 520, 530) that may be connected to the outside. For example, the first sub light source module 101-1 may include a first connector 510 including at least one terminal (eg, S1 and S2). The second sub light source module 101-2 includes a first connector 520 and a second connector 530, respectively, for connecting to the outside, and the first connector 520 includes at least one terminal (eg, P1, P2), and the second connector 530 may include at least one terminal (eg, Q1 and Q2). In this case, the first terminals S1, P1, and Q1 may be positive terminals, and the second terminals S2, P2 and Q2 may be negative terminals. In FIG. 21, each connector (eg, 510, 520, 530) includes two terminals, but the number of terminals is not limited thereto.

20 to 22 illustrate a structure in which a connector 510, 520, or 530 is added to the fifth embodiment 100-5, but is not limited thereto. The sub light source modules 101-1 to 101- n) a connector (eg, 510, 520, or 530) and a connection fixing part (eg, 410-1, 420-1) to the light source modules 100-1 to 100-20 according to any one of the above-described embodiments. , 410-2) may be added.

20 and 21, each of the sub light source modules 101-1 to 101-n includes a flexible printed circuit board 10, a light emitting device 20, a reflective sheet 30, a reflective pattern 31, Resin layer 40, first optical sheet 52, second optical sheet 54, adhesive layer 56, optical pattern 60, heat dissipation member 110, at least one connector 510, 520, Or 530, and at least one connection fixing portion 410, and 420. The same reference numerals as in FIG. 1 denote the same components, and the descriptions overlapping with the above description will be omitted or briefly described. Compared with other embodiments, each of the sub light source modules 101-1 to 101-n of the seventeenth embodiment may have a difference in size or the number of light emitting devices, except for a connector and a connection fixing part. This may be the same.

The first sub light source module 101-1 may include a first connector 510 electrically connected to the light emitting device 20 and provided on the flexible printed circuit board 10 for electrical connection with the outside. . For example, the first connector 510 may be implemented in a patterned form on the flexible printed circuit board 10.

In addition, the second sub light source module 101-2 may include a first connector 520 and a second connector 530 electrically connected to the light emitting device 20. The first connector 520 is provided at one side of the flexible printed circuit board 10 to electrically connect to the outside (eg, the first connector 510 of the first sub light source module 101-1). The second connector 530 may be provided at the other side of the flexible printed circuit board 10 to electrically connect with another external device (eg, a connector (not shown) of the third sub light source module 101-3).

The connection fixing part (eg, 410-1, 420-1, and 410-2) is coupled to other external sub light source modules, and serves to fix the combined two sub light source modules with each other. The connection fixing parts (eg, 410-1, 420-1, and 410-2) are protrusions in which part of the side of the resin layer 40 protrudes, or grooves in which part of the side of the resin layer 40 is recessed. It may be wealth.

Referring to FIG. 22, the first sub light source module 101-1 may include a first connection fixing part 410-1 having a structure in which a portion of the side of the resin layer 40 protrudes. In addition, the second sub light source module 101-2 has a structure in which a part of the side of the resin layer 40 is recessed and a first connection fixing part 420-1 and another part of the side of the resin layer 40 protrude. It may include a second connection fixing portion (410-2).

The first connection fixing part 410-1 of the first sub light source module 101-1 and the first connection fixing part 420-1 of the second sub light source module 101-2 may be fixedly coupled to each other. Can be.

Although the embodiment shows that the connection fixing parts (eg, 410-1, 420-1, and 410-2) are implemented as part of the resin layer 40, the present invention is not limited thereto, and a separate connection fixing part may be provided. The connection fixing part may be modified in another form in which it can be connected.

The shapes of the sub light source modules 101-1 to 101-n, and n> 1 may be in the form of protruding portions, but are not limited thereto and may be implemented in various forms. For example, the shapes of the sub light source modules 101-1 to 101-n, and natural numbers of n> 1, as viewed from above, may be circular, elliptical, or polygonal, and a part may protrude in a lateral direction.

For example, one end of the first sub light source module 101-1 may include a protrusion 540 in the center, and a first connector 510 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 540. The first connection fixing part 410-1 may be provided on the resin layer 40 of the remaining portion of one end of the first sub light source module 101-1 other than the protrusion 540.

In addition, one end of the second sub light source module 101-2 may have a groove portion 545 in the center thereof, and a first connector 520 may be provided on the flexible printed circuit board 10 corresponding to the groove portion 545. The first connection fixing part 420-1 may be provided on the resin layer 40 of the remaining portion of one end of the second sub light source module 101-2 other than 545. The other end of the second sub light source module 101-2 may include a protrusion 560 at the center thereof, and a second connector 530 may be provided on the flexible printed circuit board 10 corresponding to the protrusion 560. The second connection fixing part 410-2 may be provided on the resin layer 40 of the remaining portion of one end of the second sub light source module 101-2 other than the protrusion 560.

Each of the sub light source modules 101-1 to 101-n may be an independent light source itself, may be variously modified in shape, and two or more sub light source modules may be assembled to each other independently by a connection fixing part. The embodiment can improve the degree of freedom of product design because it can be used as a phosphorescent light source. In addition, in an embodiment, when some of the assembled sub light source modules are damaged or damaged, only the broken sub light source modules may be replaced.

The light source module described above may be used in a display device, an indicator device, and an illumination system requiring a surface light source. In particular, lighting is required, but the light source module according to the embodiment may be easily installed even in a place where lighting is not easily installed (for example, a ceiling or a floor having a bend) because the portion to which the light is to be mounted has a bend. There is an advantage. For example, the lighting system may include a lamp or a street lamp, and the lamp may be a head lamp for a vehicle, but is not limited thereto.

FIG. 23 illustrates a vehicle head lamp 900-1 according to an embodiment, and FIG. 45 illustrates a general vehicle head lamp that is a point light source. Referring to FIG. 23, the vehicle head lamp 900-1 includes a light source module 910 and a light housing 920.

The light source module 910 may be the embodiments 100-1 to 100-17 described above. The light housing 920 accommodates the light source module 910 and may be made of a light transmissive material. The vehicle light housing 920 may include bends depending on the vehicle location and the design being mounted. Meanwhile, as described above, the diffusion plate itself may serve as the vehicle light housing 920, and a separate vehicle light housing 920 may be provided in addition to the diffusion plate. Since the light source module 910 uses the flexible printed circuit board 10 and the resin layer 40, since the light source module 910 has flexibility, the light source module 910 may be easily mounted on the vehicle housing 920 having a bend. In addition, since the light source modules 100-1 to 100-21 have a structure that improves heat dissipation efficiency, the vehicle head lamp 900-1 according to the embodiment can prevent the wavelength shift and the brightness decrease. In addition, as described above, since a separate light reflection member is formed on the side of the resin layer, it is possible to reduce the light loss and to improve the luminance compared to the same power.

Since the general vehicle head lamp illustrated in FIG. 45 is a point light source, a partial spot 930 may appear on a light emitting surface when light is emitted, but the vehicle head lamp 900-1 according to the embodiment is a surface light source. It is possible to realize uniform luminance and illuminance in the entire light emitting surface without generating spots.

24 is a perspective view of the light emitting device package 200-1 according to the first embodiment, FIG. 25 is a top view of the light emitting device package 200-1 according to the first embodiment, and FIG. 26 is a first view. A front view of the light emitting device package 200-1 according to the embodiment is shown, and FIG. 27 is a side view of the light emitting device package 200-1 according to the first embodiment.

The light emitting device package 200-1 illustrated in FIG. 24 may be a light emitting device package included in the light source modules 100-1 to 100-17 according to the above embodiments, but is not limited thereto.

24 to 27, the light emitting device package 200-1 may include a package body 610, a first lead frame 620, a second lead frame 630, a light emitting chip 640, and a zener diode 645. ), And the wire 650-1.

The package body 610 may be formed of a substrate having good insulation or thermal conductivity, such as a silicon-based wafer level package, a silicon substrate, silicon carbide (SiC), aluminum nitride (AlN), or the like. It may have a structure in which a plurality of substrates are stacked. However, the embodiment is not limited to the material, structure, and shape of the body.

For example, the length X1 of the first direction (eg, X-axis direction) of the package body 610 is 5.95 mm to 6.05 mm, and the length Y1 of the second direction (eg, Y-axis direction) is 1.35 mm to It can be 1.45mm. The length Y2 of the third body (eg, Z-axis direction) of the package body 610 may be 1.6 mm to 1.7 mm. For example, the first direction may be a direction parallel to the long side of the package body 610.

The package body 610 may have a cavity 601 having an open top and consisting of a sidewall 602 and a bottom 603. The cavity 601 may be formed in a cup shape, a concave container shape, or the like, and the sidewalls 602 of the cavity 601 may be perpendicular to or inclined with respect to the bottom 603. The shape of the cavity 601 as viewed from above may be circular, elliptical, or polygonal (eg, rectangular). The corner portion of the cavity 601 that is polygonal may be curved. For example, the length X3 of the first direction (eg, X-axis direction) of the cavity 601 is 4.15 mm to 4.25 mm, and the length X4 of the second direction (eg, Y-axis direction) is 0.64 mm to 0.9. mm, and the depth of the cavity 601 (eg, length in the Z-axis direction, Y3) may be 0.33 mm to 0.53 mm.

The first lead frame 620 and the second lead frame 630 may be disposed on the surface of the package body 610 to be electrically separated from each other in consideration of heat dissipation or mounting of the light emitting chip 640. The light emitting chip 640 is electrically connected to the first lead frame 620 and the second lead frame 630. The number of light emitting chips 640 may be one or more.

A reflection member (not shown) may be provided on the sidewall of the cavity of the package body 610 to reflect the light emitted from the light emitting chip 640 in a predetermined direction.

The first lead frame 620 and the second lead frame 630 may be spaced apart from each other in the upper surface of the package body 610. A portion of the package body 610 (eg, the bottom 603 of the cavity 601) may be disposed between the first lead frame 620 and the second lead frame 630 to electrically isolate the two.

The first lead frame 620 may include one end (eg, 712) exposed to the cavity 601 and the other end (eg, 714) exposed through one surface of the package body 610 through the package body 610. have. In addition, the second lead frame 630 has one end (eg, 744-1) exposed to one side of one surface of the package body 610 and the other end (eg, 744-′) exposed to the other side of one surface of the package body 610. 2) and an intermediate portion (eg, 742-2) exposed to the cavity 601.

The separation distance X2 between the first lead frame 620 and the second lead frame 630 may be 0.1 mm to 0.2 mm. The top surface of the first lead frame 620 and the top surface of the second lead frame 630 may be coplanar with the bottom 603 of the cavity 601.

FIG. 28 is a perspective view of the first lead frame 620 and the second lead frame 630 shown in FIG. 24, and FIG. 29 is an angle of the first lead frame 620 and the second lead frame shown in FIG. 28. 30 is a view for explaining the dimensions of the portion, and FIG. 30 is a connection of the first lead frame 620 adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side portion 714 shown in FIG. 29. An enlarged view of portions 732, 734, and 736 is shown.

28 to 30, the first lead frame 620 includes a first upper surface portion 712 and a first side portion 714 that is bent from a first side portion of the first upper surface portion 712.

The first upper surface part 712 is positioned on the same plane as the bottom of the cavity 601, is exposed by the cavity 601, and the light emitting chips 642 and 644 may be disposed.

As illustrated in FIG. 29, both ends of the first upper surface portion 712 may have a portion S3 protruding in a first direction (x-axis direction) with respect to the first side surface portion 714. The protruding portion S3 of the first upper surface portion 712 may be a portion supporting the first lead frame in the lead frame array. The length of the protruding portion S3 of the first upper surface portion 712 in the first direction may be 0.4 mm to 0.5 mm. The length K of the first upper surface portion 712 in the first direction may be 3.45 mm to 3.55 mm, and the length J1 of the second direction may be 0.6 mm to 0.7 mm. The first direction may be the x-axis direction in the xyz coordinate system, and the second direction may be the y-axis direction.

The second side portion of the first upper surface portion 712 may have at least one groove portion 701. In this case, the second side portion of the first upper surface portion 712 may face the first side portion of the first upper surface portion 712. For example, the second side portion of the first upper surface portion 712 may have one groove portion 701 in the middle, but is not limited thereto. The number of the groove portions formed on the second side portion may be two or more. The groove 701 may have a shape corresponding to the protrusion 702 provided in the second lead frame 630 to be described later.

The groove 701 illustrated in FIG. 29 may be trapezoidal, but is not limited thereto. The groove 701 may be implemented in various forms such as a circle, a polygon, and an oval. The length S2 of the groove 701 in the first direction may be 1.15 mm to 1.25 mm, and the length S1 of the groove 701 in the second direction may be 0.4 mm to 0.5 mm.

In addition, the angle θ1 formed between the bottom 701-1 and the side surface 701-2 of the groove 701 may be greater than or equal to 90 ° and smaller than 180 °. The light emitting chips 642 and 644 may be disposed on the first upper surface 712 on both sides of the groove 701.

The first side portion 714 may be bent at a predetermined angle downward from the first side portion of the first upper surface portion 712, and the first side portion 714 may be exposed from one side surface of the package body 610. . For example, an angle formed by the first upper surface portion 712 and the first side surface portion 714 may be greater than or equal to 90 ° and smaller than 180 °.

The first lead frame 620 may have one or more through holes 720 in at least one of the first upper surface portion 712 and the first side portion 714. For example, the first lead frame 620 may have one or more through holes 720 adjacent to a boundary portion between the first upper surface portion 712 and the first side surface portion 714. In FIG. 26, two through holes 722 and 724 are spaced apart from each other adjacent to a boundary portion between the first upper surface portion 712 and the first side portion 714, but embodiments are not limited thereto.

One or more through holes 720 may be formed in one region of each of the first upper surface part 712 and the first side surface part 714 adjacent to the boundary between the first upper surface part 712 and the first side surface part 714. have. In this case, the through holes (eg, 722-1) formed in one region of the first upper surface portion 712 and the through holes (eg, 722-2) formed in one region of the first side surface portion 714 may be connected to each other. .

A portion of the package body 610 may be filled in the through hole 720 to serve to improve coupling between the first lead frame 620 and the package body. In addition, the through hole 720 serves to easily form a bend between the first upper surface portion 712 and the first side portion 714. However, if the size of the through hole 720 is too large or the number of the through holes 720 is too large, the first upper surface portion 712 and the first side portion 714 may be broken when the first lead frame 620 is bent. Since the size and number of the through-holes 720 must be properly adjusted. In addition, since the size of the through hole 720 is related to the size of the connection parts 732, 734, and 736 to be described later, it is also related to the heat dissipation of the light emitting device package.

Embodiments according to the sizes of each of the first lead frame 620 and the second lead frame 630 having the through holes to be described below may achieve an optimum heat dissipation efficiency in consideration of coupling and ease of bending.

In an embodiment, the first through hole 722 and the second through hole 724 are improved in order to improve engagement with the package body 610 and to facilitate bending of the first lead frame 620 and to prevent damage during bending. The length D11 of the first direction of the first through hole 722 and the length D12 of the first direction of the second through hole 724 may be 0.58 mm to 0.68 mm, The length D2 in the second direction may be 0.19 mm to 0.29 mm. The area of the first through hole 722 may be the same as the area of the second through hole 724, but is not limited thereto.

Referring to FIG. 30, the first lead frame 620 is positioned adjacent to the boundary portion 801 of the first upper surface portion 712 and the first side surface portion 714, and spaced apart from each other by the through hole 720. The first upper surface portion 712 and the first side portion 714 may have connecting portions 732, 734, and 736. For example, the connecting portions 732, 734, 736 of the first portion 732-1, 734-1, or 736-1 and the first side portion 714 each correspond to a portion of the first top surface 712. The second portion 732-2, 734-2, or 736-2 may correspond to a portion thereof. The through hole 720 may be positioned between the connection portions 732, 734, and 736.

The first lead frame 620 may have at least one connection portion corresponding to or aligned with the light emitting chip 642 or 644.

In detail, the first lead frame 620 may include first to third connection portions 732, 734, and 736. The first connecting portion 732 may be positioned corresponding to or aligned with the first light emitting chip 642, and the second connecting portion 734 may be positioned corresponding to or aligned with the second emitting chip 644. have. The third connection portion 736 may be positioned between the first connection portion 732 and the second connection portion 734, and may be misaligned with the first light emitting chip 642 or the second light emitting chip 644. It may be part. For example, the third connection portion 736 may be positioned corresponding to or aligned with the groove portion 701 of the first lead frame 620, but is not limited thereto.

The length C11 in the first direction of the first connecting portion 732 and the length C2 in the first direction of the second connecting portion 734 are the length E of the first direction of the third connecting portion 736. Can be greater than For example, the length C11 of the first direction of the first connection portion 732 and the length C2 of the first direction of the second connection portion 734 may be 0.45 mm to 0.55 mm, and the third connection portion ( The length E of the first direction 736 may be 0.3 mm to 0.4 mm. The reason for placing the third connecting portion 736 between the first through hole 722 and the second through hole 724 is to prevent breakage between the first upper surface portion 712 and the first side portion 714 during bending. For sake.

The ratio of the length E in the first direction of the third connection part 736 and the length C11 in the first direction of the first connection part 732 may be 1: 1.2 to 1.8. The ratio of the length D11 or D12 in the first direction of the through hole 722 and the length B1 in the first direction of the upper end portion 714-1 of the first side portion 714 may be 1: 3.8 to 3.8.

Since the first connection portion 732 is aligned with the first light emitting chip 642 and the second connection portion 734 is aligned with the second light emitting chip 644, the heat generated from the first light emitting chip 642 The heat may be mainly emitted to the outside through the first connection portion 732, and the heat generated from the second light emitting chip 644 may be discharged to the outside through the second connection portion 734.

According to the embodiment, since the lengths C11 and C2 of the first connecting portion 732 and the second connecting portion 734 in the first direction are larger than the length E of the first connecting portion 732 and the first connecting portion 736 in the first direction. The area of the first connecting portion 732 and the second connecting portion 734 is larger than that of the third connecting portion 736. Therefore, by increasing the area of the connection portions 732 and 734 disposed adjacent to the light emitting device 20, the embodiment emits heat generated from the first light emitting chip 642 and the second light emitting chip 644 to the outside. Can improve.

The first side portion 714 may be divided into an upper end portion 714-1 connected to the first upper surface portion 712 and a lower end portion 714-2 connected to the upper end portion 714-1. That is, the upper portion 714-1 may include some of the first to third connection portions 732, 734, and 736, and the lower portion 714-2 may be positioned below the upper portion 714-1.

The length F1 in the third direction of the upper end 714-1 may be 0.6 mm to 0.7 mm, and the length F2 in the third direction of the lower end 714-2 may be 0.4 mm to 0.5 mm. The third direction may be a z-axis direction in the xyz coordinate system.

Side surfaces of the upper and lower portions 714-1 and 714-2 may have a step in order to improve the coupling between the package body 620 and the airtightness to prevent moisture penetration. For example, both side ends of the lower end 714-2 may protrude laterally based on the side surface of the upper end 714-1. The length B1 in the first direction of the upper end 714-1 may be 2.56 mm to 2.66 mm, and the length B2 in the first direction of the lower end 714-2 may be 2.7 mm to 3.7 mm. The thickness t1 of the first lead frame 620 may be 0.1 mm to 0.2 mm.

The second lead frame 630 may be disposed to wrap around at least one side of the first lead frame 620. For example, the second lead frame 630 may be disposed around the other side portions except for the first side portion 714 of the first lead frame 630.

The second lead frame 630 may include a second upper surface portion 742 and a second side portion 744. The second upper surface portion 742 may be disposed to surround the other side portions except for the first side portion of the first upper surface portion 712. As illustrated in FIGS. 24 and 28, the second upper surface portion 742 may be coplanar with the bottom of the cavity 601 and the first upper surface portion 712, and may be exposed by the cavity 601. The thickness t2 of the second lead frame 630 may be 0.1 mm to 0.2 mm.

The second upper surface portion 742 includes the first portion 742-1, the second portion 742-2, and the third portion 742-3, depending on the position surrounding the first upper surface portion 712. It can be divided into. The second portion 742-2 of the second upper surface portion 742 may be a portion corresponding to or facing the second side portion of the first upper surface portion 712. The first portion 742-1 of the second upper surface portion 742 is connected to one end of the second portion 742-2, and corresponds to or faces one of the remaining sides of the first upper surface portion 712. Can be. The third portion 742-3 of the second upper surface portion 742 is connected to the other end of the second portion 742-2, and corresponds to or faces another one of the remaining sides of the first upper surface portion 712. can see.

The length H1 in the second direction of the first portion 742-1 and the third portion 742-3 may be 0.65 mm to 0.75 mm, and the length H2 in the first direction may be 0.78 mm to 0.88 mm. Can be. The length I of the second portion 742-2 in the first direction may be about 4.8 mm to about 4.9 mm.

The second portion 742-2 of the second upper surface portion 742 may have a protrusion 702 corresponding to the groove portion 701 of the first upper surface portion 712. For example, the shape of the protrusion 702 may match the shape of the groove 701, and the protrusion 702 may be positioned to align with the groove 701. The protrusion 702 may be located in the groove 701. The number of protrusions 702 may be equal to the number of grooves 701. The protrusion 702 and the groove 701 may be spaced apart from each other, and a portion of the package body 610 may be located therebetween. The protrusion 702 is an area for wire bonding between the first light emitting chip 642 and the second light emitting chip 644. The protrusion 702 is aligned between the first light emitting chip 642 and the second light emitting chip 644. Wire bonding can be facilitated.

The length S5 of the protrusion 702 in the first direction may be 0.85 mm to 0.95 mm, the length S4 in the second direction may be 0.3 mm to 0.4 mm, and the protrusion 702 may include the second portion ( An angle θ2 with 742-2 may be greater than or equal to 90 ° and smaller than 180 °.

The second side portion 744 may be bent from at least one side of the second upper surface portion 742. The second side portion 744 may be bent at a predetermined angle (eg, 90 °) downward from the second upper surface portion 742.

For example, the second side portion 744 may be bent at one side of the first portion 742-1 of the second upper surface portion 742 and the third portion of the second upper surface portion 742. The second portion 744-2 may be bent at one side of the portion 742-3.

The first portion 744-1 and the second portion 744-2 of the second side portion 744 may be bent to be positioned at the same side of the second lead frame 630. The first portion 744-1 of the second side portion 744 may be spaced apart from the first side portion 714 and positioned on one side (eg, the left side) of the first side portion 714. The second portion 744-2 of the second side portion 744 may be spaced apart from the first side portion 714 and positioned on the other side (eg, the right side) of the first side portion 714. The first side portion 714 and the second side portion 744 may be located on the same plane. As a result, as shown in FIG. 24, the first side portion 714 and the second side portion 744 may be exposed to the same side of the package body 610. The length A in the first direction of the second side portion 744 may be 0.4 mm to 0.5 mm, and the length G in the third direction may be 1.05 mm to 1.15 mm.

One side of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g1. For example, the bent step g1 is a portion where one side of the first portion 742-1 of the second upper surface portion 742 and one side of the first portion 744-1 of the second side portion 744 meet. It can be located adjacent to. Since the areas of the first upper surface portion 712 and the first side surface portion 714 that are correspondingly positioned by the curved step g1 can be designed to be wider, the embodiment can increase the heat generation area to improve the heat generation efficiency. . This is because the area of the first lead frame 620 is related to the heat dissipation of the light emitting chips 642 and 644.

The other side surfaces of the first portion 742-1 and the third portion 742-3 of the second upper surface portion 742 may have a bent step g2. The reason for forming the bent step g2 is to make it possible to easily observe the bonding material (eg, solder) when the light emitting device package 200-1 is bonded to the flexible printed circuit board 10. to be.

The first side part 714 of the first lead frame 620 and the second side part 744 of the second lead frame 630 are flexible printed circuits of the light source modules 100-1 to 100-21 according to the embodiment. The light emitting chip 640 may be irradiated with light in a direction 3 toward the side surface of the resin layer 40. That is, the light emitting device package 200-1 may have a side view type structure.

The zener diode 645 may be disposed on the second lead frame 630 to improve the breakdown voltage of the light emitting device package 200-1. For example, the zener diode 645 may be disposed on the second upper surface 742 of the second lead frame 630.

The first light emitting chip 642 may be electrically connected to the second lead frame 630 by the first wire 652, and the second light emitting chip 644 may be the second lead following the second wire 654. The zener diode 645 may be electrically connected to the frame 630, and the zener diode 645 may be electrically connected to the first lead frame 620 by a third wire 656.

For example, one end of the first wire 652 may be connected to the first light emitting chip 642, and the other end may be connected to the protrusion 702. In addition, one end of the second wire 654 may be connected to the second light emitting chip 644, and the other end thereof may be connected to the protrusion 702.

The light emitting device package 200-1 may further include a resin layer (not shown) filled in the cavity 601 to surround the light emitting chip. The resin layer may be made of a colorless transparent polymer resin material such as epoxy or silicone.

The light emitting device package 200-1 may implement red light using only a red light emitting chip without using a phosphor, but embodiments are not limited thereto. The resin layer may include a phosphor to change the wavelength of light emitted from the light emitting chip 640. For example, even if a light emitting chip of a color other than red is used, the light emitting device package may emit light of a desired color by changing the wavelength of light using a phosphor.

31 illustrates a first lead frame 620-1 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 31, the first lead frame 620-1 has a structure in which the third connector 736 is removed from the first lead frame 620 shown in FIG. 28. That is, the first lead frame 620-1 may have one through hole 720-1 adjacent to a boundary portion between the first upper surface portion 712 and the first side surface portion 714 ′. The first connection part 732 may be located at one side of the through hole 720-1, and the second connection part 734 may be located at the other side of the through hole 720-1.

32 illustrates a first lead frame 620-2 and a second lead frame 630-1 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 32, the first upper surface portion 712 ′ of the first lead frame 620-2 may have a groove portion 701 at the first upper surface portion 712 of the first lead frame 620 illustrated in FIG. 32. May be an omitted structure. The second portion 742-2 ′ of the second upper surface portion 742 ′ of the second lead frame 630-1 is the second upper surface portion 742 of the second lead frame 630 illustrated in FIG. 32. The protrusion 702 may be omitted from the second portion 742-2 of FIG. Other components may be the same as described with reference to FIG. 28.

33 illustrates a first lead frame 620-3 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 33, the first lead frame 620-3 passes through the first lead frame 620 in at least one of the connection portions 732, 734, and 736 of the first lead frame 620 shown in FIG. 28. The through holes h1, h2 and h3 may be formed.

At least one of the connection parts 732-1, 734-1, and 736-1 of the first lead frame 620-3 may be formed at a boundary between the first upper surface part 712 and the first side surface part 714. h1, h2, h3). In this case, the diameters of the fine through holes h1, h2 and h3 may be smaller than the lengths D11 and D12 in the first direction or the lengths D2 in the second direction of the through holes 722 and 724. In addition, the number of minute through holes h1 and h2 formed in the first connection part 732-1 and the second connection part 734-1 is equal to the number of fine through holes formed in the third connection part 736-1. It may be larger than the number of h3), but is not limited thereto. In addition, the shape of the fine through holes h1, h2, h3 may be circular, elliptical, or polygonal. The fine through holes h1, h2, and h3 may not only bend the first lead frame 620-3 but also improve the coupling force between the first lead frame 620-3 and the package body 610.

34 is a view illustrating a first lead frame 620-4 and a second lead frame 630 according to another embodiment. The same reference numerals as in FIG. 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 34, the first lead frame 620-4 includes a first upper surface portion 712 ″ and a first side portion 714 ″. The first upper surface portion 712 ″ and the first side surface portion 714 ″ are modified examples of the first upper surface portion 712 and the first side surface portion 714 illustrated in FIG. 32. That is, in the first lead frame 620-4, through holes 722 and 724 are omitted from the first upper surface part 712 and the first side surface part 714 of the first lead frame 620 shown in FIG. A plurality of fine through holes h4 spaced apart from each other are provided in one region Q2 of the boundary portion Q of the first upper surface portion 712 ″ and the first side surface portion 714 ″, from which the 722 and 724 are omitted. to be.

The boundary portion Q of the first upper surface portion 712 ″ and the first side portion 714 ″ may be divided into a first boundary region Q1, a second boundary region Q2, and a third boundary region Q3. Can be. The first boundary area Q1 may be an area corresponding to or aligned with the first light emitting chip 642, and the second boundary area Q2 may be an area corresponding to or aligned with the first light emitting chip 642. The third boundary area Q3 may be an area between the first boundary area Q1 and the second boundary area Q2. For example, the first boundary region Q1 may be an area corresponding to the first connecting portion 732 shown in FIG. 28, and the second boundary region Q2 is the second connecting portion 734 shown in FIG. 28. It may be an area corresponding to.

The first boundary area Q1 and the second boundary area Q2 serve as a path for transferring heat generated from the first light emitting chip 642 and the second light emitting chip 644 and include a plurality of fine through holes h4. ) May serve to facilitate bending between the first upper surface portion 712 ″ and the first side portion 714 ″. In FIG. 32, the diameters of the plurality of fine through holes h4 are the same and the separation distances are the same, but embodiments are not limited thereto. In another embodiment, at least one of the plurality of fine through holes h4 has a different diameter. Or the separation distance may be different.

35 is a view illustrating a first lead frame 620 and a second lead frame 630-2 according to another embodiment. The second lead frame 630-2 of FIG. 35 may be a modified example of the second lead frame 630 of FIG. 26. The same reference numerals as in FIG. 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

Referring to FIG. 35, unlike the second portion 742-2 of the second upper surface portion 742 shown in FIG. 28, the second portion 742-of the second upper surface portion 742 ″ shown in FIG. 2 ") has a broken structure and does not connect the first portion 742-1 and the third portion 742-3.

The second upper surface portion 742 ″ of the second lead frame 630-2 may include a first portion 742-1, a second portion 742-2 ″, and a third portion 742-3. Can be. Each of the first to third portions 742-1, 742-2 ″, 742-3 may be positioned around a corresponding one of the sides of the first top portion 712 of the first lead frame 620. Can be.

The second portion 742-2 ″ of the second upper surface portion 742 ″ is connected to the first region 704 and the third portion 742-3 connected to the first portion 742-1. The second region 705 may be spaced apart from the first region 704. Since the package body 610 is filled in the space 706 spaced between the first region 704 and the second region 705, the coupling force between the package body 610 and the second lead frame 630-2 is increased. Can be improved. The second lead frame 630-2 illustrated in FIG. 34 may be divided into first subframes 744-1, 742-1, and 704, and second subframes 744-2, 742-3, and 705. The two may be electrically separated from each other.

36 is a view illustrating a first lead frame 810 and a second lead frame 820 according to another embodiment.

Referring to FIG. 36, the first lead frame 810 may include a first side portion 814 and a second side portion 816 that are bent from a first side portion 812 and a first side portion of the first top portion 812. It may include. Light emitting chips 642 and 644 may be disposed on the first upper surface portion 812.

The second side of the first upper surface portion 812 may have one or more first grooves 803 and 804 and the first protrusion 805. In this case, the second side portion of the first upper surface portion 812 may be an opposite side portion of the first side portion of the first upper surface portion 812. For example, the second side portion of the first upper surface portion 812 may have two first grooves 803 and 804 and one first protrusion 805 positioned between the first grooves 803 and 804, but is not limited thereto. It doesn't happen. The first grooves 803 and 804 have a shape corresponding to the second protrusions 813 and 814 provided in the second lead frame 820, which will be described later, and the first protrusion 805 is provided in the second lead frame 820. It may have a shape corresponding to the second groove 815. The first grooves 803 and 804 and the first protrusion 805 illustrated in FIG. 34 may have a rectangular shape, but are not limited thereto. The light emitting chips 642 and 644 may be disposed on the first upper surface 812 on both sides of the first grooves 803 and 804.

The first side portion 814 is connected to one region of the first side of the first upper surface portion 712, the second side portion 816 is connected to another region of the first side of the first upper surface portion 712, The first side portion 814 and the second side portion 816 may be spaced apart from each other. The first side portion 814 and the second side portion 816 may be exposed from the same one side of the package body 610.

The first lead frame 610 may have one or more through holes 820 in at least one of the first upper surface portion 812 and the first side surface portion 814. For example, the first lead frame 810 may have one or more through holes 840 adjacent to a boundary portion between the first upper surface portion 812 and the first side surface portion 814. The through hole 820 may have the same structure as described with reference to FIGS. 28 and 30, and may have the same function.

The first lead frame 810 is positioned adjacent to the boundary portion 801 of the first upper surface portion 812 and the first side surface portion 814, spaced apart from each other by the through hole 720, and the first upper surface portion 712. ) And the first side portion 714 may have connecting portions 852, 854, and 856. The structure and function of the connecting portions 852, 854, 856 may be the same as described with reference to FIGS. 28 and 30. The first lead frame 810 may have at least one connection portion corresponding to or adjacent to the light emitting chip 642 or 644.

The length of the first direction of the connection portion (eg, 852, 854) corresponding to or adjacent to the light emitting chips 642 and 644 is the first length of the connection portion (eg, 856) that does not correspond to or is adjacent to the light emitting chip 642, 644. It may be greater than the length of the direction.

The lower side portion of the side surface of the second side surface portion 814 may be protruded in a lateral direction in order to improve the coupling with the package body 620 and the airtightness to prevent moisture penetration.

The second lead frame 820 may be disposed around at least one side of the first lead frame 810. The second lead frame 820 may include a second upper surface portion 822 and a third side portion 824. The second upper surface portion 822 may be divided into a first portion 832 and a second portion 834 according to a position disposed around the first upper surface portion 812.

The second portion 834 of the second top surface 822 may be a portion corresponding to or facing the second side of the first top surface 812. The first portion 832 of the second upper surface portion 822 is connected to one end of the second portion 834 and may correspond to or face the third side portion of the first upper surface portion 712. The third side may be a side perpendicular to the first side or the second side.

The second portion 834 of the second upper surface portion 822 may have second protrusions 813 and 814 corresponding to the first groove portions 803 and 804 of the first upper surface portion 812. The second protrusions 813 and 814 are areas for wire bonding between the first light emitting chip 642 and the second light emitting chip 644, and are disposed between the first light emitting chip 642 and the second light emitting chip 644. Positioning can facilitate wire bonding.

The third side portion 824 may be bent at a predetermined angle (eg, 90 °) downward from the second upper surface portion 822. For example, the third side portion 824 may be bent at one side of the first portion 832 of the second upper surface portion 822. The second side part 816 and the third side part 824 may have a symmetrical shape with respect to the first side part 814. The lower side portion of the side surface of the third side portion 824 may be protruded in a lateral direction in order to improve the coupling with the package body 620 and the airtightness to prevent moisture infiltration. The first side portion 814, the second side portion 816 and the third side portion 824 may be exposed to the same side of the package body 610.

37 is a perspective view of a light emitting device package 200-2 according to another embodiment, FIG. 38 is a top view of the light emitting device package 200-2 shown in FIG. 37, and FIG. 39 is shown in FIG. 37. FIG. 40 is a sectional view of the cd direction of the light emitting device package 200-2 shown in FIG. 37, and FIG. 41 is a first lead frame shown in FIG. 37. 620 'and the second lead frame 630'. The same reference numerals as in FIGS. 24 to 28 denote the same configuration, and the descriptions overlapping with the above description will be omitted or briefly described.

37 to 41, the first lead frame 620 ′ of the light emitting device package 200-2 may include a first upper surface portion 932 and a first side portion 934. Unlike the first upper surface portion 712 illustrated in FIG. 28, the first upper surface portion 932 illustrated in FIG. 41 does not have a groove portion. In addition, the second upper surface portion 942 of the second lead frame 630 ′ may be similar to a structure in which the second portion 742-2 of the second upper surface portion 742 of FIG. 32 is omitted.

The first side portion 934 may have the same structure as the first side portion 714 illustrated in FIG. 32. The length P1 of the first upper surface portion 932 in the first direction may be smaller than the length of the first upper surface portion 712 shown in FIG. 28, and the length of the first upper surface portion 932 in the second direction ( J2 may be greater than the length J1 of the first upper surface portion 712 in the second direction. For example, the length P1 of the first upper surface portion 932 in the first direction may be 4.8 mm to 4.9 mm, and the length J2 of the second direction may be 0.67 mm to 0.77 mm. Therefore, since the area of the first upper surface portion 932 shown in FIG. 37 is larger than that of the first upper surface portion 712 shown in FIG. 32, the embodiment of FIG. 37 may mount a larger sized light emitting chip. have. The size of the first side portion 944, the through holes 722 and 724, and the connection portions may be the same as described with reference to FIG. 29.

The second lead frame 630 ′ may include a second upper surface portion 942 and a second side portion 944. The second upper surface portion 942 may include a first portion 942-1 disposed around the third side portion of the first upper surface portion 932 and a second portion 942-2 disposed around the fourth side portion. Can be. The third side portion of the first upper surface portion 932 is a side portion perpendicular to the first side portion of the first upper surface portion 932, and the fourth side portion of the first upper surface portion 932 is formed of the first upper surface portion 932. It may be a side facing the three sides.

The first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 may be spaced apart from each other and electrically separated from each other.

The second side portion 944 has a first portion 944-1 connected to the first portion 942-1 of the second upper surface portion 942 and a second portion 942-2 of the second upper surface portion 942. ) May include a second portion 944-2. However, the length P2 of the first portion 942-1 and the second portion 942-2 in the first direction of the second upper surface portion 942 is formed by the second upper surface portion 742 of FIG. 32. The first portion 742-1 and the third portion 742-3 may be larger than the length H2 in the first direction.

For example, the length P2 in the first direction 942-1 and the second portion 942-2 of the second upper surface part 942 in the first direction is 1.04 mm to 1.14 mm, and the length in the second direction ( P3) may be 0.45 mm to 0.55 mm.

The length of the first direction of the protruding portion S22 of the first upper surface portion 932 protruding to support the first lead frame 620 ′ in the lead frame array may be 0.14 mm to 0.24 mm.

The first light emitting chip 642 may be electrically connected to the first portion 942-1 of the second upper surface portion 942 by the first wire 653, and the second light emitting chip 644 may be the second wire. 655 may be electrically connected to the first portion 942-2 of the second upper surface portion 942.

The first light emitting chip 642 and the second light emitting chip 644 may both emit light of the same wavelength. For example, the first light emitting chip 642 and the second light emitting chip 644 may be red light emitting chips that generate red light.

In addition, the first light emitting chip 642 may generate light having different wavelengths. For example, the first light emitting chip 642 may be a red light emitting chip, and the second light emitting chip 644 may be a yellow light emitting chip, and the first light emitting chip may be mounted on the light emitting device package 200-2 according to the second embodiment. The 642 and the second light emitting chip 644 may operate separately.

First power (eg, negative power) may be supplied to the first lead frame 620 ′, and second power (eg, positive power) may be supplied to the second lead frame 630 ′. have. Since the second lead frame 630 'is divided into two parts 942-1 and 944-1 and 942-2 and 944-2 that are electrically separated from each other, the first lead frame 620' is common. By using the electrode and supplying second power to the first portion 942-1 and the second portion 942-2 of the second upper surface portion 942 of the second lead frame 630 ′ separately, The light emitting chip 642 and the second light emitting chip 644 may be operated separately.

Therefore, when the light emitting device package 200-2 shown in FIG. 37 is mounted on the light source modules 100-1 to 100-21 according to the embodiment, the light source modules 100-1 to 100-21 are various colors. Can generate a light source. For example, the embodiment may generate a red surface light source when only the first light emitting chip 642 is operated, and the embodiment may generate a yellow surface light source when the second light emitting chip 644 is operated.

42 illustrates measurement temperatures of the light emitting device packages 200-1 and 200-2 according to the embodiment. The measurement temperature illustrated in FIG. 42 represents the temperature of the light emitting chip when the light emitting device package emits light.

Case 1 represents the measurement temperature of the light emitting chip when the length of the first part of the side part of the first lead frame and the second part in the first direction is the same as the length of the third part. ) Denotes a measurement temperature of the light emitting chip illustrated in FIG. 24, and case 3 represents a measured temperature of the light emitting chip illustrated in FIG. 35.

Referring to FIG. 42, the measurement temperature t1 of case 1 is 44.54 ° C, the measurement temperature t2 of case 2 is 43.66 ° C, and the measurement temperature t3 of case 3 represents 43.58 ° C.

Accordingly, by changing the design of the connection portions 732, 734, 736 of the first side surface portion 714 of the first lead frame 620, the embodiment can improve the heat dissipation effect, so that the light emitting device packages 200-1, 200 during light emission are provided. Since the temperature rise of the light emitting chip 640 mounted at -2) can be alleviated, it is possible to prevent the decrease of the brightness and the generation of the wavelength shift.

FIG. 43 illustrates an embodiment of the light emitting chip 640 shown in FIG. 24. The light emitting chip 640 illustrated in FIG. 43 may be, for example, a vertical chip emitting red light having a wavelength range of 600 nm to 690 nm.

Referring to FIG. 43, the light emitting chip 640 includes a second electrode layer 1801, a reflective layer 1825, a light emitting structure 1840, a passivation layer 1850, and a first electrode layer 1860.

The second electrode layer 1801 supplies power to the light emitting structure 1840 together with the first electrode layer 1860. The second electrode layer 1801 may include an electrode material layer 1810 for current injection, a support layer 1815 located on the electrode material layer 1810, and a bonding layer 1820 located on the support layer 1815. have. The second electrode layer 1801 may be bonded to the first lead frame 620 of the light emitting device package 200-1, for example, the first upper surface part 712.

The electrode material layer 1810 may be Ti / Au, and the support layer 1815 may be a metal or semiconductor material. In addition, the support layer 1815 may be a material having high electrical conductivity and thermal conductivity. For example, the support layer 1815 may include at least one of copper (Cu), copper alloy (Cu alloy), gold (Au), nickel (Ni), molybdenum (Mo), and copper-tungsten (Cu-W). It may be a material or a semiconductor including at least one of Si, Ge, GaAs, ZnO, and SiC.

The bonding layer 1820 is disposed between the support layer 1815 and the reflective layer 1825, and the bonding layer 1820 serves to bond the support layer 1815 to the reflective layer 1825. The bonding layer 1820 may include at least one of a bonding metal material, for example, In, Sn, Ag, Nb, Pd, Ni, Au, and Cu. Since the bonding layer 1820 is formed to bond the support layer 815 in a bonding manner, the bonding layer 1820 may be omitted when the support layer 1815 is formed by a plating or deposition method.

The reflective layer 1825 is disposed on the bonding layer 820. The reflective layer 1825 may reflect light incident from the light emitting structure 1840 to improve light extraction efficiency. The reflective layer 825 may be formed of a metal or alloy including a reflective metal material, for example, at least one of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf.

In addition, the reflective layer 1825 may include a conductive oxide layer, for example, indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), and indium gallium tin oxide (IGTO). , AZO (aluminum zinc oxide), ATO (antimony tin oxide) can be formed in a single layer or multiple layers. In addition, the reflective layer 825 may be formed by multilayering a metal and a conductive oxide such as IZO / Ni, AZO / Ag, IZO / Ag / Ni, AZO / Ag / Ni, and the like.

An ohmic region 1830 may be located between the reflective layer 1825 and the light emitting structure 1840. The ohmic region 1830 is an area in ohmic contact with the light emitting structure 1840 and serves to smoothly supply power to the light emitting structure 1840.

A material including ohmic contact with the light emitting structure 1840, for example, at least one of Be, Au, Ag, Ni, Cr, Ti, Pd, Ir, Sn, Ru, Pt, and Hf, may be formed of the light emitting structure 1840. The ohmic region 1830 may be formed by ohmic contact with the ohmic region. For example, the material forming the ohmic region 1830 may include AuBe and may have a dot shape.

The light emitting structure 1840 may include a window layer 1842, a second semiconductor layer 1844, an active layer 1846, and a first semiconductor layer 1848. The window layer 1842 is a semiconductor layer disposed on the reflective layer 1825, and its composition may be GaP.

The second semiconductor layer 1844 is disposed on the window layer 1842. The second semiconductor layer 1844 may be implemented with compound semiconductors such as Groups III-5, II-6, and the like, and may be doped with the second conductivity type dopant. For example, the first semiconductor layer 1844 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and dopant (eg, p-type dopant). Mg, Zn, Ca, Sr, Ba) may be doped.

The active layer 1846 is disposed between the second semiconductor layer 1844 and the first semiconductor layer 848, and has electrons and holes provided from the second semiconductor layer 1844 and the first semiconductor layer 1848. Light may be generated by energy generated during the recombination of holes.

The active layer 1846 may be a compound semiconductor of Groups 3-5 and 2-6, and may include a single well structure, a multi well structure, a quantum-wire structure, a quantum dot structure, or the like. Can be formed.

For example, the active layer 1846 may have a single or multiple quantum well structure having a well layer and a barrier layer. The well layer may be a material having a band gap lower than the energy band gap of the barrier layer. For example, the active layer 1846 may be AlGaInP or GaInP.

The first semiconductor layer 1848 may be formed of a semiconductor compound. The first semiconductor layer 1848 may be implemented with compound semiconductors such as Groups 3-5 and 2-6, and may be doped with the first conductivity type dopant. For example, the first semiconductor layer 1848 may include any one of AlGaInP, GaInP, GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and an n-type dopant (eg, Si, Ge, Sn, etc.) may be doped.

The light emitting structure 1840 may generate red light having a wavelength range of 600 nm to 690 nm, and the first semiconductor layer 1848, the active layer 1846, and the second semiconductor layer 1844 may have a composition capable of generating red light. have. In order to increase light extraction efficiency, a roughness 1870 may be formed on the top surface of the first semiconductor layer 848.

The passivation layer 1850 is disposed on the side of the light emitting structure 1840. The passivation layer 1850 serves to electrically protect the light emitting structure 1840. The passivation layer 1850 may be an insulating material, such as SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , or Al ₂ O ₃ Can be. The passivation layer 1850 may be disposed on at least a portion of the upper surface of the first semiconductor layer 1848.

The first electrode layer 1860 may be disposed on the first semiconductor layer 1848 and may have a predetermined pattern. The first electrode layer 1860 may be a single or a plurality of layers. For example, the first electrode layer 1860 may include a first layer 1862, a second layer 1864, and a third layer 1866 that are sequentially stacked. The first layer 1862 is in ohmic contact with the first semiconductor layer 1848 and may be formed of GaAs. The second layer 1864 may be formed of AuGe / Ni / Au alloy. The third layer 1866 may be formed of a Ti / Au alloy.

As shown in FIGS. 24 and 37, the first electrode layer 860 may be electrically bonded to the second lead frame 630, or 630 ′ by wires 652, 654, 653, or 655.

In general, when the temperature of the light emitting chip increases, wavelength shift occurs and the brightness decreases. However, the red light emitting chip (Red LED) that generates red light has a degree of wavelength shift and the brightness decrease with increasing temperature, compared to the blue light emitting chip (Blue LED) generating blue light and the light emitting chip (Amber LED) generating yellow light. Is worse. Therefore, in the light emitting device package and the light source module using the red light emitting chip, a heat dissipation measure for suppressing the temperature increase of the light emitting chip is very important.

However, the light source modules 100-1 to 100-21 and the light emitting device packages 200-1 to 200-2 included in the lighting apparatus 1 according to the embodiment may improve heat dissipation efficiency as described above. Therefore, even when the red light emitting chip is used, the temperature increase of the light emitting chip can be suppressed to suppress the wavelength shift and the brightness decrease.

44 shows a lighting device 2 according to another embodiment. Referring to FIG. 48, the lighting device 2 includes a housing 1310, a light source module 1320, a diffusion plate 1330, and a micro lens array 1340.

The housing 1310 accommodates the light source module 1320, the diffusion plate 1330, and the micro lens array 1340, and may be made of a light-transmissive material.

The light source module 1320 may be any one of the above-described embodiments 100-1 to 100-17.

The diffusion plate 1330 may serve to uniformly spread the light emitted through the light source module 1320 over the entire surface. The diffusion plate 1330 may be made of the same material as the diffusion plate 70, but is not limited thereto. In other embodiments, the diffusion plate 1330 may be omitted.

The micro lens array 1340 may have a structure in which a plurality of micro lenses 1344 are disposed on the base film 1342. Each micro lens 1344 may be spaced apart from each other by a predetermined interval. Between each micro lens 1344 may be planar, and each micro lens 1344 may be spaced apart from each other with a pitch of 50-500 micrometers.

In FIG. 44, the diffusion plate 1330 and the micro lens array 1340 are formed as separate components, but in another embodiment, the diffusion plate 1330 and the micro lens array 1340 may be integrally formed.

46 illustrates a tail light 900-2 for a vehicle according to an embodiment, and FIG. 47 illustrates a tail light for a general vehicle.

Referring to FIG. 46, the vehicle taillight 900-2 may include a first light source module 952, a second light source module 954, a third light source module 956, and a housing 970.

The first light source module 952 may be a light source for acting as a turn signal, the second light source module 954 may be a light source for acting as a traffic light, and the third light source module 956 may serve as a stop light. The light source may be, but is not limited thereto, and the roles may be interchanged.

The housing 970 accommodates the first to third light source modules 952, 954 and 956, and may be made of a light transmitting material. The housing 970 may have a curvature depending on the design of the vehicle body. At least one of the first to third light source modules 952, 954, and 956 may be implemented as one of the above-described embodiments 100-1 to 100-17.

In the case of taillights, the light intensity at the time of stopping should be 110 candela (cd) or more, so that visual recognition is possible from a long distance and usually requires 30% or more light intensity. For the light output of more than 30%, the number of light emitting device packages applied to the light source module (eg, 952,954 or 956) should be increased by 25% to 35% or more, or the output of the individual light emitting device packages should be increased by 25% to 35%. .

If the number of light emitting device packages is increased, it may be difficult to manufacture due to the limitation of the layout space. Therefore, by increasing the output power of the individual light emitting device packages mounted on the light source module, the desired light intensity may be reduced (eg, 110 candela or more). ) Can be obtained. In general, a value obtained by multiplying the output (W) of the light emitting device package by the number (N) is the total output of the light source module. Therefore, in order to obtain a desired light intensity, an appropriate output and number of light emitting device packages can be determined according to the area of the light source module. have.

For example, in the case of a light emitting device package having a power consumption of 0.2 watts and outputting 13 lumens (lm), light intensity of about 100 candelas may be generated by arranging 37 to 42 in a predetermined area. However, in the case of a light emitting device package having a power consumption of 0.5 watts and a luminous flux of 30 lumens (lm), light of similar intensity can be obtained by arranging only 13 to 15 in the same area. The number of light emitting device packages to be disposed in a light source module having a predetermined area in order to obtain a constant output may be determined according to the pitch, the content of the light diffusion material in the resin layer, the pattern shape of the reflective layer. The interval may be a distance from one intermediate point of two neighboring light emitting device packages to the other intermediate point.

When the light emitting device package is disposed in the light source module, the light emitting device package is disposed at regular intervals. In the case of the high power light emitting device package, the number of arrangements can be relatively reduced, and the light emitting device package can be disposed at a wide interval so that space can be efficiently used. In addition, when the high power light emitting device packages are arranged at narrow intervals, the light intensity may be higher than that at high intervals.

48A and 48B illustrate intervals of a light emitting device package of a light source module used in a tail light for a vehicle according to an embodiment. For example, FIG. 48A may be the first light source module 952 illustrated in FIG. 46, and FIG. 48B may be the second light source module 954 illustrated in FIG. 46.

48A and 48B, the light emitting device packages 99-1 to 99-n, or 98-1 to 98-m may be spaced apart from the substrate 10-1 or 10-2. have. It is a natural number of n> 1, it may be a natural number of m> 1.

The distance between two adjacent light emitting device packages (eg, ph1, ph2, ph3 or pc1, pc2, pc3) may be different from each other, but the interval is appropriately in the range of 8 to 30 mm.

Because there may be a change depending on the power consumption of the light emitting device package (99-1 to 99-n, or 98-1 to 98-m), the arrangement interval (for example, ph1, ph2, ph3 or pc1, pc2, pc3) This is because the light of neighboring light emitting device packages (for example, 99-3 to 99-4) may interfere with each other to generate a noticeable light in the case of 8 mm or less. In addition, when the arrangement interval (for example, ph1, ph2, ph3 or pc1, pc2, pc3) is 30mm or more, it is possible to generate a dark part due to the area where the light does not reach.

As described above, since the light source modules 100-1 to 100-17 themselves have flexibility, the light source modules 100-1 to 100-17 can be easily mounted on the curved housing 970, so that the tail light 900-2 for the vehicle according to the embodiment of the present disclosure Freedom can be improved.

In addition, since the light source modules 100-1 to 100-17 have a structure of improving heat dissipation efficiency, the tail light 900-2 for a vehicle according to the embodiment can prevent the wavelength shift and the brightness decrease.

47, since the general vehicle tail light illustrated in FIG. 47 is a point light source, partial spots 962 and 964 may appear on the light emitting surface when light is emitted. Uniform luminance and illuminance can be achieved throughout.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, Those skilled in the art will appreciate that many suitable modifications and variations are possible in light of the present invention. Accordingly, all such suitable modifications and variations and equivalents should be considered to be within the scope of the present invention.

10: printed circuit board 20: light source
30: reflection sheet 31: reflection pattern
40: resin layer 52: first optical sheet
54: second optical sheet 56: adhesive layer
60: optical pattern 70: diffuser plate
80: first air gap 90: light reflecting member
110: heat dissipation member 101-1 to 101-n: sub light source module
410-1, 420-1, 410-2: connection fixing part 510, 520, 530, 540: connector
610: package body 620: first lead frame
630: second lead frame 640: light emitting chip
645: Zener Diode 650: Wire
712: first upper surface portion 714: first side surface portion
722, 724: through hole 742: second upper surface portion
744: second side portion 801: second electrode layer
810: electrode material layer 815: support layer
820: bonding layer 825: reflective layer
830: ohmic region 840: light emitting structure
850: passivation layer 860: first electrode layer
900: vehicle light 910: light source module
920: light housing

Claims (46)

A light source module including at least one light source disposed on a printed circuit board and a resin layer disposed on the printed circuit board to fill the light source;
A light reflection member formed on at least one of one side and the other side of the resin layer;
A diffusion plate having an upper surface formed on the light source module and a sidewall formed integrally with the upper surface and extending in a downward direction to be in close contact with the light reflection member;
And a first air gap formed between the light source module and an upper surface of the diffusion plate.
The method according to claim 1,
Wherein the resin layer comprises:
Illuminator made of an ultraviolet curable resin comprising an oligomer.
The method according to claim 2,
The oligomer,
40 to 55 parts by weight,
Urethane Acrylate, Epoxy Acrylate, Polyester Acrylate, Polyether Acrylate, Polybutadiene Acrylate, Silicon Acrylate Lighting device comprising at least any one of.
The method according to claim 3,
Wherein the resin layer comprises:
Lighting apparatus further comprises 65 to 90 parts by weight of the monomer.
The method of claim 4,
The monomer,
IBOA (isobornyl Acrylate) 35 to 45 parts by weight, 2-HEMA (2-Hydroxyethyl methacrylate) 10-15 parts by weight, 2-HBA (2-Hydroxybutyl Acrylate) lighting device consisting of a mixture comprising 15 to 20 parts by weight.
The method according to claim 5,
Wherein the resin layer comprises:
Lighting apparatus further comprises 0.5 to 1 part by weight of the photoinitiator.
The method according to claim 1,
Wherein the resin layer comprises:
An illumination device comprising a thermosetting resin containing at least one of a polyester polyol resin, an acrylic polyol resin, a hydrocarbon-based or ester-based solvent.
The method of claim 7,
The content of the polyester polyol (Polyester Polyol) resin is 9 ~ 30% of the total weight of the thermosetting resin,
The content of the acrylic polyol (Acryl Polyol) resin is 20 to 40% of the total weight of the thermosetting resin,
The amount of the solvent is an illumination device consisting of 30 to 70% of the total weight of the thermosetting resin.
The method of claim 7,
The thermosetting resin further comprises a thermosetting agent.
The method of claim 9,
The amount of the thermosetting agent is 1 to 10% of the total weight of the thermosetting resin.
The method according to claim 1,
Wherein the resin layer comprises:
For diffusing light composed of at least one selected from silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al ₂ O ₃ , and acryl Lighting device further comprising a diffusion material.
The method according to claim 1,
The refractive index of the resin layer is,
Illumination device formed in the range of 1.4 to 1.8.
The method according to claim 1,
The thickness of the diffusion plate,
Lighting device formed in the range of 0.5 to 5mm.
The method according to claim 1,
The thickness of the first air gap,
Lighting arrangements formed in the range exceeding 0 and not exceeding 30 mm.
The method according to claim 1,
Wherein the light reflecting member comprises:
Lighting device formed of white pigment or metal.
The method according to claim 1,
The light source module,
And a reflective sheet disposed between the printed circuit board and the resin layer.
18. The method of claim 16,
The light source module,
Lighting device further comprising a reflective pattern formed on the reflective sheet.
18. The method of claim 17,
The reflection pattern
A lighting device comprising any one of TiO ₂ , CaCO ₃ , BaSO ₄ , Al ₂ O ₃ , Silicon, and polystyrene (PS).
The method according to claim 1,
The light source module,
And a first optical sheet formed on the resin layer and dispersing light emitted from the resin layer.
The method of claim 19,
The light source module,
And an optical pattern formed on the first optical sheet and blocking or reflecting the light emitted from the resin layer.
The method of claim 20,
The light source module,
Lighting device further comprises a second optical sheet disposed on the first optical sheet.
23. The method of claim 21,
The light source module,
And an adhesive layer formed between the first optical sheet and the second optical sheet.
23. The method of claim 22,
The light source module,
Lighting device further comprises a second air gap formed on the adhesive layer.
The method according to claim 1,
The light source includes:
Lighting device as a side view type light emitting device package.
The method according to claim 1,
The light source includes:
A package body having a cavity;
A first lead frame including one end exposed to the cavity and the other end penetrating through the package body and exposed to one surface of the package body;
A second lead frame including an end exposed to one side of the one surface of the package body, the other end exposed to the other side of the one surface of the package body, and an intermediate portion exposed to the cavity;
An illumination device comprising a light emitting device package comprising a first semiconductor layer, an active layer, a second semiconductor layer, and at least one light emitting chip disposed on the first lead frame.
26. The method of claim 25,
And the intermediate part of the second lead frame electrically connects the one end and the other end of the second lead frame to each other.
26. The method of claim 25,
The first lead frame includes:
A first upper surface portion exposed to the cavity;
And a first side portion bent from the first side of the first upper surface portion and exposed to the one surface of the package body.
28. The method of claim 27,
At least one of the first upper surface portion or the first side portion, at least one first through-hole is formed lighting apparatus.
28. The method of claim 27,
And the first lead frame has at least one first through hole formed adjacent to a boundary portion of the first upper surface portion and the first side surface portion.
29. The method of claim 29,
The at least one first through hole is a lighting device is filled with a portion of the package body.
29. The method of claim 29,
The first lead frame includes connecting portions connecting the first upper surface portion and the first side portion to each other, wherein the first through hole is positioned between the connecting portions, and at least one of the connecting portions has a length remaining. And different lighting fixtures.
32. The method of claim 31,
The at least one light emitting chip is disposed on the first upper surface portion.
33. The method of claim 32,
The length of the first direction of the first connection part aligned with the light emitting chip among the connection parts is greater than the length of the first direction of the second connection part unaligned with the light emitting chip, and the first direction is in an xyz coordinate system. Illumination in the x-axis.
34. The method of claim 33,
At least one of the connecting portions is provided with a second through hole having a diameter smaller than the first through hole.
28. The method of claim 27,
The second lead frame,
A second upper surface portion disposed around at least one side of the first upper surface portion and exposed to the cavity of the package body; And
And a second side portion bent from the second upper surface portion and exposed to each of the one side and the other side of the one surface of the package body.
36. The method of claim 35,
At least one groove portion is provided on the second side portion of the first upper surface portion, and the first side portion and the second side portion of the first upper surface portion are sides facing each other.
37. The method of claim 36,
The second upper surface portion is an illumination device formed with at least one protrusion corresponding to the groove portion.
36. The method of claim 35,
The second upper surface portion,
And first to third portions disposed corresponding to the remaining portions except for the first side portion of the first upper surface portion.
42. The method of claim 38,
The second side portion,
A first portion bent from the first portion of the second upper surface portion; And
A second portion that is bent from the third portion of the second upper surface portion,
And the first portion and the second portion are symmetrical with respect to the first side portion.
32. The method of claim 31,
The first side portion,
It is divided into an upper end including the connection parts, and a lower end located below the upper end,
The lower end protrudes laterally from the upper end.
34. The method of claim 33,
The ratio of the length in the first direction of the second connecting portion and the first connecting portion is 1: 1.2 to 1.8.
42. The method of claim 39,
The ratio of the length in the first direction of the first through-hole and the length in the first direction of the upper end of the first side portion is 1: 3.8 to 6.3, and the first direction is the x-axis direction in the xyz coordinate system.
43. The method of claim 42,
The length of the first through hole in the second direction is 0.19mm ~ 0.29mm.
33. The method of claim 32,
The light emitting chip,
A first electrode layer disposed on the first semiconductor layer;
A reflective layer disposed below the second semiconductor layer; And
Lighting device further comprises a second electrode layer disposed below the reflective layer.
26. The method of claim 25,
The light emitting chip is a lighting device for emitting red light having a wavelength range of 600nm ~ 690nm.
The method according to any one of claims 1 to 45,
The printed circuit board is a lighting device consisting of a flexible printed circuit board.

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