KR20130141171A - Oxynitride phosphor, and light emitting device package comprising the same - Google Patents

Abstract

The oxynitride phosphor in accordance with an embodiment of the present invention includes a material represented by the following chemical formula: Mx-yAlaObNc:Rey3+(1<=x<=4, 3<=a<=7, 6<=b<=15, 1<=c<=7, 0.001<=y<=0.4 )

Description

Oxynitride phosphor and light emitting device package including same {Oxynitride Phosphor, and Light Emitting device package comprising the same}

An embodiment relates to an oxynitride phosphor and a light emitting device package including the same.

Recently, along with import restrictions on materials containing heavy metals such as mercury, the need for a light source that does not contain heavy metals is increasing. Accordingly, a light emitting diode (hereinafter referred to as LED) is attracting attention.

Among these, there are three ways to implement white LED. The first one is manufactured by combining three chips of RGB (Red, Green, Blue) in a multi-chip form. The second method is to obtain white including UV LEDs and phosphors, and the third is to include blue LEDs and phosphors, and to include yellow phosphors in blue LEDs and green and red phosphors in blue LEDs. have.

When implementing a white LED in a multi-chip form, there is a problem that the operating voltage is uneven for each chip, and the output of the chip changes according to the ambient temperature, and thus the color coordinates change. When implementing white LEDs with UV LEDs and phosphors, light efficiency may decrease and color coordinates may change due to deterioration of phosphors generated due to high power.

When a white LED is implemented using a blue LED and a phosphor, a method including a Y ₃ Al ₅ O ₁₂ : Ce ³⁺ (YAG: Ce) phosphor that emits yellow color is widely known. However, this method has disadvantages in that efficiency is reduced due to quantum deficits and re-radiation efficiency generated by using secondary light, and color rendering is not easy.

The embodiment provides an oxynitride phosphor for white LED having excellent light efficiency, and a light emitting device and a light emitting device package using the same.

The oxynitride phosphor according to the embodiment includes a material represented by the following formula.

[Chemical Formula]

M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4)

The oxynitride phosphor according to the embodiment emits light at a longer wavelength than conventional phosphors, and thus, a white LED having a lower color temperature can be manufactured using the phosphor.

When the oxynitride phosphor according to the embodiment is used in a diffusion plate, a light emitting device package having high light efficiency can be obtained.

Figure 1a shows a light emission spectrum showing the excitation wavelength band of the oxynitride phosphor according to the embodiment.
Figure 1b shows a light emission spectrum showing the light emission wavelength band of the oxynitride phosphor according to the embodiment.
Figure 2 shows the change in PL intensity according to the ratio of cesium of the oxynitride phosphor according to the embodiment.
3 is a flowchart illustrating a method of synthesizing an oxynitride phosphor according to an embodiment.
Figure 4 shows a photograph of the particles of the oxynitride phosphor according to the embodiment observed with a surface scanning electron microscope.
Figure 5 shows a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphor according to the embodiment.
Figure 6 shows a photograph of the particles of the oxynitride phosphor according to the embodiment observed with a surface scanning electron microscope.
Figure 7 shows a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphor according to the embodiment.
8 shows photographs of the particles of the oxynitride phosphor according to the embodiment observed with a surface scanning electron microscope.
9 shows a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphors according to the example.
10A illustrates a perspective view of a light emitting device package including an oxynitride phosphor according to an embodiment.
10B illustrates a cross-sectional view of a light emitting device package including an oxynitride phosphor according to an embodiment.
11A shows a perspective view of an illumination system including an oxynitride phosphor according to an embodiment.
FIG. 11B shows a cross sectional view taken along the line CC ′ of the lighting system of FIG. 11A.
12 is an exploded perspective view of a liquid crystal display including an oxynitride phosphor according to an embodiment.
13 is an exploded perspective view of a liquid crystal display including an oxynitride phosphor according to an embodiment.
FIG. 14 shows emission spectra according to wavelengths when an oxynitride phosphor according to an embodiment is applied to a diffusion plate and used in a blue LED. FIG.
15 illustrates a diffusion plate including an oxynitride phosphor according to an embodiment.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. To fully disclose the scope of the invention to those skilled in the art, and the invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

The terms spatially relative to "on", "below", "beneath", "lower", "above", "upper" And can be used to easily describe one element or elements as well as other elements or components as shown. Spatially relative terms should be understood to include, in addition to the orientation shown in the drawings, terms that include different orientations of the device during use or operation. For example, when flipping a device shown in the figure, a device described as "below" or "beneath" of another device may be placed "above" of another device. Also, elements described as " on "of other elements may be placed" below "or" beneath "of other elements when inverted in the figures. Thus, the exemplary term "below" may include both the up and down directions, and "up" may include both the up and down directions. The device can also be oriented in other directions, so that spatially relative terms can be interpreted according to orientation.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. In the present specification, the singular form includes plural forms unless otherwise specified in the specification. It is noted that the terms "comprises" and / or "comprising" used in the specification are intended to be inclusive in a manner similar to the components, steps, operations, and / Or additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in the present specification may be used in a sense that can be commonly understood by those skilled in the art. Also, commonly used predefined terms are not ideally or excessively interpreted unless explicitly defined otherwise.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. Also, the size and area of each component do not entirely reflect actual size or area.

Further, the angle and direction mentioned in the description of the structure of the light emitting device in the embodiment are based on those shown in the drawings. In the description of the structure of the light emitting device in the specification, reference points and positional relationship with respect to angles are not explicitly referred to, refer to the related drawings.

Hereinafter, embodiments will be described in detail with reference to the drawings.

1A is a view showing an emission spectrum showing the excitation wavelength band of the oxynitride phosphor according to the embodiment, Figure 1B is a view showing an emission spectrum showing the emission wavelength band of the oxynitride phosphor according to the embodiment.

The oxynitride phosphor according to the embodiment includes a material represented by the following formula.

[Formula 1]

M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4)

In the formula, Al may be aluminum, O is oxygen, N is nitrogen, Re may be an activator. M in the formula may include at least one of yttrium (Y), scandium (Sc), gadolium (Gd), lutetium (Lu), or a combination thereof. In the chemical formula, aluminum (Al) may include at least one of boron (B) and gallium (Ga), or may be selected and replaced from a group consisting of a combination thereof.

In the formula, the activator (Re) is cesium (Ce), europium (Eu), samarium (Sm), ytterbium (Yb), dysprosium (Dy), gadolium (Gd), thulium (Tm), lutetium (Lu), etc. It may be selected from the group consisting of at least one of the lanthanum group elements, or a combination thereof. The active agent is a trivalent lanthanide-based ions, the light emission transition can occur in the 4f electron orbital function hidden by the outermost electron.

The activator may have luminescent properties only when it is substituted in the cation site of the parent. If the lattice constants of the ions of the activator and the cation to be substituted are significantly different, the luminescence properties may be lowered. Thus, the cations of the parent and the elements of the activator can be determined to be materials with similar lattice constants.

The matrix of the oxynitride phosphors can be made to satisfy stoichiometric. The oxynitride phosphor may be covalently bonded, and may be made while satisfying stoichiometry when covalently bonded. The elements of the parent of the oxynitride phosphor can freely bind within a range satisfying the stoichiometry.

The oxynitride phosphor may change the emission main peak according to the change in the molar concentration of the active agent. For example, the oxynitride phosphor may have a longer emission main peak wavelength as the molar concentration of the activator is increased, and the wavelength may be shorter as the molar concentration is smaller, but is not limited thereto.

The oxynitride phosphor may be a yellow phosphor. 1A and 1B, the oxynitride phosphor may emit blue light by absorbing blue light. The oxynitride phosphor converts blue light emitted from a blue LED into yellow and thus may be used as a light source of a white LED.

Since the oxynitride phosphor according to the embodiment has the formula as described above, the intermolecular bond may be a covalent bond. As the intermolecular bonds are made of covalent bonds, the oxynitride phosphors according to the embodiment may have a strong durability against thermal vibration. Therefore, it has a strong durability against the heat generated in the light emitting device, it may be suitable for application to high-power illumination.

1a, 1b and 2 show the efficiency of the excitation wavelength, emission wavelength, emission wavelength of each oxynitride phosphor sample according to the embodiment. Each sample is a change in the proportion of yttrium in cesium and M in the possible active agents. Sample 1 contains cesium at a rate of 0.1, sample 2 shows cesium at a rate of 0.2, and sample 3 shows cesium at a rate of 0.3. At this time, each sample may be represented by the following formula (2).

(2)

Y _xy Al ₅ O ₉ N ₃ : Ce _y ³⁺ (1≤x≤4, 0.001≤y≤0.4)

When the oxynitride phosphor deviates from the molar ratio, the oxynitride phosphor may not emit light having a yellow wavelength. For example, when the oxynitride phosphors are fired out of the molar ratio, they may emit light of different wavelengths, which may make it difficult to apply them to light emitting devices.

In the oxynitride phosphor, the crystal structure of the phosphor generated according to the molar ratio of oxygen may be changed. In the oxynitride phosphors, the emission main peak may change depending on the molar ratio of each element.

Each sample represents when the y value is 0.1, 0.2, 0.3. Referring to the drawings, it can be seen that Sample 2 having the y value of 0.2 has the best light efficiency characteristic. In the case of Sample 2, it can be seen that the light emission wavelength is more biased to longer wavelengths. Sample 2 is a long wavelength wavelength of light emission can be produced a white LED having a lower color temperature than other samples.

Referring to FIG. 1A, it can be seen that the oxynitride phosphor has an excitation wavelength band of 420 nm to 500 nm. Therefore, when used in a blue LED it can be seen that it can efficiently absorb the light of the blue wavelength generated from the LED. Referring to FIG. 1B, when the excitation wavelength is 450 nm, the oxynitride phosphor emits light having a yellow wavelength of 530 nm to 630 nm. Therefore, it can be seen that when used in a blue LED can emit light of a yellow wavelength efficiently.

Referring to Figure 2, in the case of adjusting the rate of cesium in each of the samples, it can be confirmed that the most efficient when the mole fraction of cesium is 0.2, but is not limited to this, the efficiency of the case of having the chemical formula and the mole fraction is the most Larger results can be seen.

3 is a flowchart illustrating a method of synthesizing an oxynitride phosphor according to an embodiment.

Referring to FIG. 3, the method for preparing an oxynitride phosphor includes preparing a raw material (a), mixing the raw material (b), forming a phosphor synthesis atmosphere (c), a ball mill process, and the like. (D) performing a drying operation, and (e) analyzing the components of the phosphor.

The phosphor may be prepared by a general solid phase reaction method using a stable starting material. The phosphor may be prepared by the solid phase reaction method because the metal ion has low solubility in water.

Step (a) of preparing a raw material is prepared by preparing Y ₂ O ₃ , Al ₂ O ₃ , CeO ₂ , BaF _2, etc., which are the raw materials of the oxynitride phosphors, in accordance with the composition ratio of Y _xy Al _a O _b N _c : Ce _y ^{3 +} Can be synthesized. In the case of replacing iridium and cesium with other materials, the above formula may be prepared using raw materials corresponding to the respective materials.

In step (b) of mixing the raw materials, the raw materials of the oxynitride phosphors may be improved according to the composition ratio, and then the raw materials may be mixed with the agate induction using a solvent. The solvent may be ethanol or acetone.

The step (c) of forming the phosphor synthesis atmosphere may be performed at a temperature of about 1100 ° C to 1500 ° C. The oxynitride phosphor may be calcined under a gas flow of hydrogen / nitrogen gas. In this case, the hydrogen: nitrogen ratio of the hydrogen / nitrogen gas may be changed from 5:95 to 20:80. The oxynitride phosphor may be calcined under a gas flow of 400 cc to 2000 cc. The oxynitride phosphors according to each example may be synthesized by a low temperature atmospheric pressure method.

The oxynitride phosphor according to the embodiment was fired for 6 hours in a hydrogen / nitrogen gas hydrogen: nitrogen ratio 20:80 atmosphere, 1450 ° C., and 1000 cc of gas flow (Gas flow), and Y _xy Al _a O _b N _c : Ce _y ^An oxynitride phosphor of ³⁺ was obtained.

Step (d) of the ball mill process and the drying operation may be finely pulverized the phosphor synthesized in the previous step (c). The phosphor powder obtained by pulverizing the phosphor may be mixed with water. The mixture of the phosphor powder and water may be subjected to a ball mill process and a cleaning process using zirconia and glass balls. The phosphor powder subjected to the ball mill process and the cleaning process may be dried in an oven at 80 ° C. for about 12 hours.

The step (e) of analyzing the components of the phosphor may confirm the PL emission of the oxynitride phosphor, and perform surface scanning electron microscopy (SEM) and energy injection X-ray analysis (EDX). On the other hand, the results of confirming the light emission characteristics (PL emission) is shown in the graph of Figures 1a to 1b.

Figure 4 is a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphor according to Sample 1. Referring to FIG. 4, the results of observing the particles of the oxynitride phosphor according to Sample 1 with a surface scanning electron microscope. By observing the oxynitride phosphors fired according to the above-described manufacturing method with a surface scanning electron microscope, it is possible to determine whether the fired. Referring to FIG. 4, in the case of the oxynitride phosphor of Y _xy Al _a O _b N _c : Ce _y ³⁺ , fine particles are evenly distributed.

5 is a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphors according to Sample 1. FIG. Energy injection X-ray analysis (EDX) shows the Wt% and At% of the components contained in the oxynitride phosphors. Quantitative analysis of oxynitride phosphors by fluorescence X-ray analysis confirmed that Al, Y, O, N and Ce were detected. Therefore, it can be confirmed that the phosphor of Y _xy Al _a O _b N _c : Ce _y ³⁺ was manufactured by the above-mentioned oxynitride phosphor manufacturing method.

Table 1 below shows the Wt% and At% of the components included in the oxynitride phosphor of Sample 1. Fluorescence X-ray analysis may confirm that essential elements are detected in the oxynitride phosphor.

6 is a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphors according to Sample 2. FIG. Referring to FIG. 6, the results of observing the particles of the oxynitride phosphor according to Sample 2 with a surface scanning electron microscope. By observing the oxynitride phosphors fired according to the above-described manufacturing method with a surface scanning electron microscope, it is possible to determine whether the fired. Referring to FIG. 6, in the case of the oxynitride phosphor of Y _xy Al _a O _b N _c : Ce _y ^3+, the fine particles are uniformly distributed.

7 is a component distribution graph showing the results of fluorescence X-ray analysis of oxynitride phosphors according to Sample 2. FIG. Energy injection X-ray analysis (EDX) shows the Wt% and At% of the components contained in the oxynitride phosphors. Quantitative analysis of oxynitride phosphors by fluorescence X-ray analysis confirmed that Al, Y, O, N and Ce were detected. Therefore, it can be confirmed that the phosphor of Y _xy Al _a O _b N _c : Ce _y ³⁺ was manufactured by the above-mentioned oxynitride phosphor manufacturing method.

Table 2 below shows the Wt% and At% of the components included in the oxynitride phosphor of Sample 2. Fluorescence X-ray analysis may confirm that essential elements are detected in the oxynitride phosphor.

8 is a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphors according to Sample 3. FIG. Referring to FIG. 8, the results of observing the particles of the oxynitride phosphor according to Sample 3 with a surface scanning electron microscope. By observing the oxynitride phosphors fired according to the above-described manufacturing method with a surface scanning electron microscope, it is possible to determine whether the fired. Referring to FIG. 8, in the case of the oxynitride phosphor of Y _xy Al _a O _b N _c : Ce _y ³⁺ , fine particles are evenly distributed.

9 is a component distribution graph showing the results of fluorescence X-ray analysis of the oxynitride phosphors according to Sample 3. FIG. Energy injection X-ray analysis (EDX) shows the Wt% and At% of the components contained in the oxynitride phosphors. Quantitative analysis of oxynitride phosphors by fluorescence X-ray analysis confirmed that Al, Y, O, N and Ce were detected. Therefore, it can be confirmed that the phosphor of Y _xy Al _a O _b N _c : Ce _y ³⁺ was manufactured by the above-mentioned oxynitride phosphor manufacturing method.

Table 3 below shows the Wt% and At% of the components included in the oxynitride phosphor of Sample 3. Fluorescence X-ray analysis may confirm that essential elements are detected in the oxynitride phosphor.

10A and 10B are a perspective view and a cross-sectional view of a light emitting device package 100 according to an embodiment.

10A and 10B, the light emitting device package 100 includes a body 110 having an upper surface recessed therein, a cavity 120 formed therein, a light emitting device 130 disposed in the cavity 120, and emitting light. An encapsulant (not shown) disposed in the 110 and filled in the cavity 120 to cover the first and second lead frames 140 and 150 and the light emitting device 130, which are electrically connected to the light emitting device 130. It may include.

The body 110 is made of a resin material such as polyphthalamide (PPA), silicon (Si), aluminum (Al), aluminum nitride (AlN), photosensitive glass (PSG), polyamide 9T (PA9T) ), Neo geotactic polystyrene (SPS), a metal material, sapphire (Al ₂ O ₃ ), beryllium oxide (BeO), may be formed of at least one of a printed circuit board (PCB, Printed Circuit Board). The body 110 may be formed by injection molding, etching, or the like, but is not limited thereto.

The inner surface of the body 110 may be formed with an inclined surface. The angle of reflection of the light emitted from the light emitting device 130 may vary according to the angle of the inclined surface, thereby adjusting the directivity of the light emitted to the outside.

As the directivity of the light decreases, the concentration of light emitted from the light emitting device 130 to the outside increases. On the contrary, the greater the directivity of the light, the less the concentration of light emitted from the light emitting device 130 to the outside.

On the other hand, the shape of the cavity 120 formed on the body 110 as viewed from above may be circular, rectangular, polygonal, elliptical, or the like, and may have a curved shape, but is not limited thereto.

The light emitting device 130 is disposed on the first lead frame 140 and may be, for example, a light emitting device emitting light of red, green, blue, white, or UV (ultra violet) light emitting device emitting ultraviolet light. But it is not limited thereto. In addition, one or more light emitting devices 130 may be disposed.

The light emitting device 130 may generate light of a specific wavelength. For example, the light emitting device 130 may generate light in a wavelength region of 300 to 480 nm. That is, the light emitting device 130 may be a UV-LED or a Blue LED.

The light emitting device 130 may be applied to either a horizontal type, a vertical type, or a flip chip.

The encapsulant (not shown) may be located in the cavity 120 to cover the light emitting device 130. The encapsulant (not shown) may include one or a plurality of light transmitting epoxy resins, polyimide resins, urea resins, acrylic resins, or light transmitting silicone resins. The encapsulant (not shown) may be formed by filling the cavity 120 and then UV or heat curing the encapsulant.

The encapsulant (not shown) may include an oxynitride phosphor, and the oxynitride phosphor may include M _xy Al _a O _b N _c : Re _y ³⁺ (1 ≦ _x ≦ 4, 3 ≦ a ≦ 7, 6 ≦ _b ≦ 15, 1 ≦ c ≦ 7, and 0.001 ≦ y ≦ 0.4). The oxynitride phosphor of the embodiment may allow the light emitting device package 100 to realize clear white light.

When the light generated by the light emitting device 130 is in the ultraviolet wavelength range, the encapsulant (not shown) may implement the white light emitting device package 100 including phosphors of yellow, green, and blue.

When the light generated by the light emitting device 130 is in the blue visible light wavelength band, the encapsulant (not shown) may allow the light emitting device package 100 to emit white light by using yellow, red, and green phosphors. .

The oxynitride phosphor may change the wavelength by exciting light generated by the light emitting device 130. For example, the light emitting device package 100 may include M _xy Al _a O _b N _c : Re _y ³⁺ (1 ≦ _x ≦ 4, 3 ≦ a ≦ 7, 6 ≦ _b ≦ 15, 1 ≦ _c ≦ 7, 0.001 By controlling the molar ratio of the oxynitride phosphor of ≦ y ≦ 0.4), light of a desired wavelength can be produced.

The oxynitride phosphor may be excited by light having the first light emitted from the light emitting device 130 to generate the second light. For example, as the light generated by the light emitting device 130 is mixed with the color of the oxynitride phosphor, the light emitting device package 100 may provide white light.

The first and second lead frames 140 and 150 may be formed of a metal material, for example, titanium (Ti), copper (Cu), nickel (Ni), gold (Au), chromium (Cr), and tantalum (Ta). , Platinum (Pt), tin (Sn), silver (Ag), phosphorus (P), aluminum (Al), indium (In), palladium (Pd), cobalt (Co), silicon (Si), germanium (Ge) It may include one or more materials or alloys of hafnium (Hf), ruthenium (Ru), iron (Fe). In addition, the first and second lead frames 140 and 150 may be formed to have a single layer or a multilayer structure, but the embodiment is not limited thereto.

The first and second lead frames 140 and 150 are separated from each other and electrically separated from each other. The light emitting device 130 may be disposed on the first and second lead frames 140 and 150, and the first and second lead frames 140 and 150 may be in direct contact with the light emitting device 130 or a soldering member. It may be electrically connected through a conductive material such as (not shown).

The light emitting device 130 may be electrically connected to the first and second lead frames 140 and 150 through wire bonding, but is not limited thereto. Therefore, when power is connected to the first and second lead frames 140 and 150, power may be applied to the light emitting device 130. Meanwhile, several lead frames (not shown) may be mounted in the body 110, and each lead frame (not shown) may be electrically connected to the light emitting device 130, but is not limited thereto.

FIG. 11A is a perspective view illustrating a lighting device including a light emitting device package according to an embodiment, and FIG. 11B is a cross-sectional view illustrating a C-C 'cross section of the lighting device of FIG. 11A.

11A and 11B, the lighting apparatus 200 may include a body 210, a cover 230 coupled to the body 210, and a closing cap 250 positioned at both ends of the body 210. have.

The lower surface of the body 210 is fastened to the light emitting device module 240, the body 210 is conductive so that the heat generated from the light emitting device package 244 can be discharged to the outside through the upper surface of the body 210 And it may be formed of a metal material having an excellent heat dissipation effect.

The light emitting device package 244 may be mounted on the printed circuit board 242 in a multi-colored, multi-row array to form an array. The light emitting device package 244 may be mounted at the same interval or may be mounted with various separation distances as necessary to adjust brightness. have. As the printed circuit board 242, a metal core PCB (MPPCB) or a PCB made of FR4 may be used.

The light emitting device package 244 may include an encapsulant having a high color rendering index, thereby improving the implementation of white light, so that the resolution of the lighting device 200 including the light emitting device package 244 and the light emitting device package 244 may be improved. Can be improved.

The oxynitride phosphor is represented by the chemical formula of M _xy Al _a O _b N _c : Re _y ³⁺ (1 ≦ _x ≦ 4, 3 ≦ a ≦ 7, 6 ≦ _b ≦ 15, 1 ≦ _c ≦ 7, 0.001 ≦ _y ≦ 0.4). It may include a material having a. The oxynitride phosphor may allow the light emitting device package 244 to implement white light.

In the oxynitride phosphor of the embodiment, the wavelength region of 420 nm to 500 nm may be an excitation wavelength band, and the wavelength region of 530 nm to 630 nm may be an emission wavelength band.

The cover 230 may be formed in a circular shape to surround the lower surface of the body 210, but is not limited thereto.

The cover 230 protects the light emitting device module 240 from the outside and the like. In addition, the cover 230 may include diffusing particles to prevent the glare of the light generated from the light emitting device package 244, and to uniformly emit light to the outside, and at least of the inner and outer surfaces of the cover 230 A prism pattern or the like may be formed on either side. In addition, a phosphor may be applied to at least one of an inner surface and an outer surface of the cover 230.

On the other hand, since the light generated from the light emitting device package 244 is emitted to the outside through the cover 230, the cover 230 should have excellent light transmittance, and has sufficient heat resistance to withstand the heat generated from the light emitting device package 244 The cover 230 may be formed of a material including polyethylene terephthalate (PET), polycarbonate (PC), polymethyl methacrylate (PMMA), or the like.

Closing cap 250 is located at both ends of the body 210 may be used for sealing the power supply (not shown). In addition, the closing cap 250 has a power pin 252 is formed, the lighting device 200 according to the embodiment can be used immediately without a separate device in the terminal from which the existing fluorescent light is removed.

12 is an exploded perspective view of a liquid crystal display including the light emitting device according to the embodiment.

The backlight unit 370 illustrated in FIG. 12 is an edge-light method, and the liquid crystal display 300 includes a liquid crystal display panel 310 and a backlight unit 370 for providing light to the liquid crystal display panel 310. can do.

The liquid crystal display panel 310 may display an image by using light provided from the backlight unit 370. The liquid crystal display panel 310 may include a color filter substrate 312 and a thin film transistor substrate 314 facing each other with the liquid crystal interposed therebetween.

The color filter substrate 312 may implement colors of the image displayed through the liquid crystal display panel 310.

The thin film transistor substrate 314 is electrically connected to the printed circuit board 318 on which a plurality of circuit components are mounted through the driving film 317. The thin film transistor substrate 314 may apply a driving voltage provided from the printed circuit board 318 to the liquid crystal in response to a driving signal provided from the printed circuit board 318.

The thin film transistor substrate 314 may include a thin film transistor and a pixel electrode formed of a thin film on another transparent substrate such as glass or plastic.

The backlight unit 370 may convert the light provided from the light emitting device module 320, the light emitting device module 320 into a surface light source, and provide the light guide plate 330 and the light guide plate to the liquid crystal display panel 310. Reflective sheet for reflecting the light emitted from the rear of the light guide plate 330 to the plurality of films 352, 366, 364 and the light incident plate 330 to uniform the luminance distribution of the light provided from the 330 and improve the vertical incidence ( 347).

The light emitting device module 320 may include a printed circuit board 322 such that a plurality of light emitting device packages 324 and a plurality of light emitting device packages 324 are mounted to form an array.

In the light emitting device package 324, the encapsulant may include an oxynitride phosphor to improve white light, and thus, the resolution of the backlight unit 370 including the light emitting device package 324 and the light emitting device package 324 may be improved. Can be.

The oxynitride phosphor is represented by the formula of M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4) It may include a crystal having a. The oxynitride phosphor may allow the light emitting device package 324 to implement white light. The oxynitride phosphor may function as an essential phosphor that realizes a white wavelength, thereby improving the quality of the light emitting device package 324.

In the oxynitride phosphor of the embodiment, the wavelength region of 420 nm to 500 nm may be an excitation wavelength band, and the wavelength region of 530 nm to 630 nm may be an emission wavelength band.

The backlight unit 370 may include a diffusion film 366 for diffusing light incident from the light guide plate 330 toward the liquid crystal display panel 310, and a prism film 352 for condensing the diffused light to improve vertical incidence. ), And may include a protective film 364 for protecting the prism film 352.

13 is an exploded perspective view of a liquid crystal display including the light emitting device according to the embodiment. However, the parts shown and described in Fig. 12 are not repeatedly described in detail.

The backlight unit 470 illustrated in FIG. 13 is a direct method, and the liquid crystal display device 400 may include a liquid crystal display panel 410 and a backlight unit 470 for providing light to the liquid crystal display panel 410. have.

Since the liquid crystal display panel 410 is the same as that described with reference to FIG. 12, a detailed description thereof will be omitted.

The backlight unit 470 includes a plurality of light emitting device modules 423, a reflective sheet 424, a lower chassis 430 in which the light emitting device modules 423 and the reflective sheet 424 are accommodated, and an upper portion of the light emitting device modules 423. It may include a diffusion plate 440 and a plurality of optical film 460 disposed in the.

LED Module 423 A plurality of light emitting device packages 422 and a plurality of light emitting device packages 422 may be disposed to include a printed circuit board 421 to form an array.

The light emitting device package 422 may include an oxynitride phosphor having a high color rendering index of an encapsulant, thereby improving the implementation of white light, thereby providing a light emitting device package 422 and a light emitting device package 422 of the backlight unit 470. Resolution can be improved.

The oxynitride phosphor is represented by the formula of M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4) It may include a material having a. The oxynitride phosphor may allow the light emitting device package 422 to implement white light.

In the oxynitride phosphor of the embodiment, the wavelength region of 420 nm to 500 nm may be an excitation wavelength band, and the wavelength region of 530 nm to 630 nm may be an emission wavelength band.

The reflective sheet 424 reflects the light generated from the light emitting device package 422 in the direction in which the liquid crystal display panel 410 is located to improve light utilization efficiency.

On the other hand, the light generated from the light emitting device module 423 is incident on the diffusion plate 440, the optical film 460 is disposed on the diffusion plate 440. The optical film 460 may include a diffusion film 466, a prism film 450, and a protective film 464.

Hereinafter, an embodiment in which the oxynitride phosphor according to the embodiment is applied to a diffusion plate will be described.

The oxynitride phosphor according to the embodiment may be mixed with silicon (Si). The oxynitride phosphor and silicon may be mixed in a ratio of 5: 100, but are not limited thereto. The oxynitride phosphors and silicon may be uniformly mixed using an electric mixer. The mixed phosphor may be applied onto a diffusion plate. The diffusion plate may be a glass material, a plastic material, a silicon material excellent in light transmittance. The diffusion plate coated with the oxynitride phosphor may be dried and cured in an oven in order to increase adhesion. The diffusion plate may be dried at an oven temperature of 150 ° C. for 12 hours, but is not limited thereto.

The blue LED according to the embodiment may implement a white light source capable of surface emitting light through a diffusion plate when manufacturing the diffusion plate. The blue LED may convert the point light source generated therefrom into a surface light source by a diffusion plate. Therefore, the light emitting device manufactured using the same may have excellent luminous efficiency and characteristics.

14 shows emission spectra when a diffusion plate coated with the oxynitride phosphors on a blue LED is manufactured. Referring to FIG. 14, it can be seen that emission intensity is the highest in the blue wavelength region of 420 nm to 500 nm and the yellow wavelength region of 520 nm to 630 nm. Thus, the oxynitride phosphors can be used in blue LEDs to produce white light.

FIG. 15 shows a method of preparing a diffusion plate by applying the oxynitride phosphor. FIG. The diffusion plate converts the point light source of the LED into a surface light source, and thus the LED may have excellent luminous efficiency and characteristics.

Table 4 shows the color index, color temperature, etc. according to the composition of the oxynitride phosphor. Through this, the oxynitride phosphor may be used in a blue LED to emit white light.

In Table 4, Im represents a lumen, C _x and C _y represent color coordinates, CCT represents a color temperature, and CRI represents a color rendering index.

14 and Table 4, the oxynitride phosphor according to the embodiment can be used in a blue LED can emit light in the blue wavelength region of 420nm to 500nm and yellow wavelength region of 520nm to 630nm. Thus, this combination can be used for white LEDs.

Meanwhile, the light emitting device according to the embodiment is not limited to the configuration and method of the embodiments described above, but the embodiments may be modified so that all or some of the embodiments may be selectively And may be configured in combination.

In addition, although various embodiments have been illustrated and described above, the present invention is not limited to the above-described specific embodiments, and the present invention is not limited to the specific scope of the present invention as claimed in the claims. Various modifications can be made by those skilled in the art, and these modifications should not be individually understood from the technical spirit or the prospect of the present invention.

100: Light emitting device package
110: Body
120: cavity
130: Light emitting element
140: first lead frame
150: second lead frame

Claims (16)

An oxynitride phosphor comprising a substance represented by the following formula.
[Chemical Formula]
M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4) The method of claim 1,
X is 2 ≦ x ≦ 2.5. The method of claim 1,
Y is 0.1 ≦ y ≦ 0.3. The method of claim 1,
M is an oxynitride phosphor comprising at least one of yttrium (Y), scandium (Sc), gadolium (Gd), and lutetium (Lu). The method of claim 1,
Re includes at least one of cesium (Ce), europium (Eu), samarium (Sm), ytterbium (Yb), dysprosium (Dy), gadolium (Gd), thulium (Tm), and lutetium (Lu) Oxynitride phosphors. The method of claim 1,
The oxynitride phosphor is excited by light having a main peak of 420 nm to 500 nm. The method of claim 1,
The oxynitride phosphor has an emission main peak at 530 nm to 630 nm. A body formed with a cavity;
A light emitting element disposed in the cavity and emitting light; And
It includes; encapsulation material is filled in the cavity,
The encapsulant has a chemical formula of M _xy Al _a O _b N _c : Re _y ³⁺ (1≤x≤4, 3≤a≤7, 6≤b≤15, 1≤c≤7, 0.001≤y≤0.4) A light emitting device package comprising an oxynitride phosphor having. The method of claim 8,
The x is a light emitting device package comprising an oxynitride phosphor of 2≤x≤2.5. The method of claim 8,
Wherein y is 0.1 ≦ y ≦ 0.3 and comprises an oxynitride phosphor. The method of claim 8,
Wherein M is a light emitting device package including an oxynitride phosphor containing at least one of yttrium (Y), scandium (Sc), gadolium (Gd) and lutetium (Lu). The method of claim 8,
Re includes at least one of cesium (Ce), europium (Eu), samarium (Sm), ytterbium (Yb), dysprosium (Dy), gadolium (Gd), thulium (Tm), and lutetium (Lu) A light emitting device package comprising an oxynitride phosphor. The method of claim 8,
The oxynitride phosphor includes an oxynitride phosphor excited by light having a main peak of 420 nm to 500 nm. The method of claim 8,
The oxynitride phosphor includes a oxynitride phosphor having a light emission main peak at 530 nm to 630 nm. The method of claim 8,
A light emitting device package comprising a diffusion plate coated with the oxynitride phosphor. The method of claim 15,
The diffusion plate is a light emitting device package containing a material of any one of plastic, glass, or silicon.

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