KR20130132203A - Photosensitive resin composition, pattern formed by using the same and display panel comprising the same - Google Patents

Abstract

The present application relates to a photosensitive resin composition including a mordant composition. The photosensitive resin composition according to the present application improves heat resistance resistance by minimizing resistance value degradation at a high temperature process. Patterns can be formed, the development of a display panel for cover glass is possible, and the quality improvement of a display for a mobile terminal is expected using the composition.

Description

Photosensitive resin composition, a pattern formed using the same and a display panel including the same {PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMED BY USING THE SAME AND DISPLAY PANEL COMPRISING THE SAME}

The present application relates to a photosensitive resin composition, a pattern formed using the same, and a display panel including the pattern.

Recently, touch screens have been the mainstream of the mobile display market. The touch screen has a method of inputting by touching a human hand or an object directly on the screen without using an input device such as a keyboard and a mouse. Therefore, most operations on the screen, that is, utilizing the Internet, moving pictures, multi-touch, etc. are easily performed, making it one of the most convenient user interfaces.

Examples of the implementation of the touch screen include a resistive film type, a capacitive type, an ultrasonic type, an optical type, and an infrared type. The resistive film method has a problem in that durability is low, light transmittance is low, and multi-touch is almost impossible.

A capacitive method is mentioned as a method for solving the problem of the resistive film method. The capacitive type senses and drives the microcurrent generated in the human body, and uses a constant current, so the touch sensitivity is excellent, and in particular, the multi-touch function is possible. In addition, since the glass is used as a cover, the durability is good, the light transmittance is 90% or more, and there is an advantage of giving an advanced sensitivity. However, there are limitations in the input method and high manufacturing costs.

The present inventors have completed the present invention in the need to develop a composition suitable for pattern formation in a panel during touch screen development to solve the above problems.

Korean Patent Publication No. 10-2008-0107846

The present specification provides a photosensitive resin composition having a thin thickness, a soft taper, sufficient light shielding force, and excellent heat resistance when forming a bezel pattern of a display panel.

One embodiment of the present application is a photosensitive resin composition comprising a colorant composition, the colorant composition is a colorant; And it provides a photosensitive resin composition comprising a cardo-based binder.

In addition, one embodiment of the present application provides a pattern formed using the photosensitive resin composition.

In addition, one embodiment of the present application provides a pattern formed using the photosensitive resin composition.

In addition, an embodiment of the present application is a step of applying a photosensitive resin composition to the substrate; And it provides a pattern manufacturing method comprising the step of exposing and developing the coated photosensitive resin composition.

In addition, an embodiment of the present application provides a display panel including the pattern.

The photosensitive resin composition according to the exemplary embodiment of the present application has an effect of excellent heat resistance by minimizing a decrease in resistance value in a high temperature process. Patterns can be formed using the composition of the present invention, development of a cover glass-integrated display panel can be made possible, and in particular, an improvement in the quality of a mobile display can be expected.

Hereinafter, the present application will be described in detail.

Unless otherwise defined in the technical and scientific terms used in the present application, those having ordinary skill in the art to which this invention belongs have the meanings that are commonly understood.

In order to reduce the cost, which has been a problem in the capacitive method, the present inventors have reduced the number of ITO (Indium Tin Oxide) film sensor layers that apply multiple sheets or directly attaching the touch sensor to the top layer of tempered glass. A method of developing an integrated touch screen panel has been developed. In this case, the transmittance may be improved and the cost may be reduced. Such an integrated touch panel was manufactured by coating a shielding bezel film on a cover glass and forming a touch sensor layer thereon. At this time, the bezel film was printed in a screen manner using a conventional bezel film coating ink, and the thickness of the bezel film was mostly 6 microns or more, on average, 10 microns. However, when the sensor layer is applied on the bezel film at such a thickness, there is a problem that a short circuit occurs due to a step difference between the bezel layer and the substrate, thereby making it difficult to properly drive. Therefore, there is a need for a material that replaces the conventional bezel film coating ink having a thin thickness and a soft taper, but having sufficient light shielding properties. In particular, in the high temperature process of forming the touch sensor, since the resistance value is lowered, it is necessary to solve the problem of lowering the product characteristics of the bezel material of the touch screen panel requiring high resistance. Therefore, the inventors of the present application have developed a photosensitive resin composition which can be used as a bezel material of a touch screen panel having excellent heat resistance by minimizing a decrease in resistance value in a high temperature process.

One embodiment of the present application is a colorant; It provides a photosensitive resin composition comprising a colorant composition comprising a; and a cardo binder.

The colorant composition may include a cardo-based binder in the colorant composition, so that the photosensitive resin composition including the colorant composition may minimize a decrease in resistance value at a high temperature process, thereby providing excellent heat resistance.

A cardo system is resin which has skeletal structure which two cyclic structures couple | bonded with the quaternary carbon atom which comprises a cyclic structure.

In one embodiment of the present application, the cardo-based binder may include a repeating unit represented by Formula 1 below.

[Formula 1]

Hereinafter, the substituents of Chemical Formula 1 will be described in more detail.

The Rx may be a structure formed by the reaction of the following 5-membered ring carboxylic anhydride or diisocyanate, but is not limited thereto.

The 5-membered ring carboxylic anhydride is, for example, succinic anhydride, methyl succinic anhydride, 2,2-dimethyl succinic anhydride, isobutenyl succinic anhydride, 1,2-cyclohexanedicarboxylic anhydride, hexahydro-4 Methyl phthalic anhydride, itaconic anhydride, tetrahydro phthalic anhydride, 5-norbornene-2,3-dicarboxylic acid anhydride, metel-5-norbornene-2,3-dicarboxylic acid anhydride, 1,2,3, 4-cyclobutanetetracarboxylic acid dianhydride, maleic anhydride, citraconic anhydride, 2,3, -dimethylmaleic anhydride, 1-cyclopentene-1,2-dicarboxylic acid anhydride, 3,4,5,6- Tetrahydrophthalic anhydride, phthalic anhydride, bisphthalic anhydride, 4-methylphthalic anhydride, 3,6-dichlorophthalic anhydride, 3-hydrophthalic anhydride, 1,2,4-benzenetricarboxylic anhydride, 4-nitrophthalic anhydride and Selected from the group consisting of diethylene glycol-1,2-bistrimelic anhydride Be, but is not limited to these.

Alternatively, the diisocyanate is, for example, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, pentamethylene diisocyanate, 1,2-propylene diisocyanate, 2,3-butylene diisocyanate, 1,3- Butylenediisocyanate, dodecamethylene diisocyanate, 2,4,4-trimethyl hexamethylene diisocyanate, w, w'-diisocyanate-1,3-dimethylbenzene, w, w'-diisocyanate-1,4-dimethyl Benzene, w, w'-diisocyanate-1,3-diethylbenzene, 1,4-tetramethyl xylene diisocyanate, 1,3-tetramethyl xylene diisocyanate, isophorone diisocyanate, 1,3-cyclopentanedi Isocyanate, 1,3-cyclohexanediisocyanate, 1,4-cyclohexanediisocyanate, methyl-2,4-cyclohexanediisocyanate, methyl-2,6-cyclohexane diisocyanate, 4,4'- But may be selected from the group consisting of styrene bis isocyanate methylcyclohexane, 2,5-isocyanatemethyl bicyclo [2,2,2] heptane and 2,6-isocyanatemethyl bicyclo [2,2,1] heptane It is not limited only to.

The Ry may be selected from the group consisting of hydrogen, acryloyl and methacryloyl, but is not limited thereto.

R ₁ to R ₃ are each independently hydrogen; A halogen group; A substituted or unsubstituted alkyl group having 1 to 5 carbon atoms; A substituted or unsubstituted C1-C5 alkoxy group; And a substituted or unsubstituted alkenyl group having 2 to 5 carbon atoms; ≪ / RTI >

R ₄ to R ₇ are each independently a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms; A substituted or unsubstituted alkoxylene group having 1 to 5 carbon atoms; and a substituted or unsubstituted alkenylene group having 2 to 5 carbon atoms; ≪ / RTI >

The halogen group may be fluorine, chlorine, bromine or iodine.

The alkyl group may be straight or branched chain, may be substituted or unsubstituted, carbon number is not particularly limited, but may be 1 to 5. Specific examples of the ilky group include methyl, ethyl, propyl, isopropyl, butyl, t-butyl and the like, but is not limited thereto.

The alkylene group may be linear or branched, may be substituted or unsubstituted, carbon number is not particularly limited, but may be 1 to 5. Specific examples of the alkylene group include methylene, ethylene, propylene, isopropylene, butylene, t-butylene, but are not limited thereto.

The alkoxy group may be linear or branched, may be substituted or unsubstituted, carbon number is not particularly limited, but may be 1 to 5. Specific examples of the alkoxy group include methoxy, ethoxy, isopropyloxy, and the like, but are not limited thereto.

The alkoxylene group may be linear or branched, substituted or unsubstituted, and may have 1 to 5 carbon atoms. Specific examples of the alkoxylene group include, but are not limited to, methoxyxylene, ethoxylene, isopropyl oxylene.

The alkenyl group may be linear or branched, may be substituted or unsubstituted, carbon number is not particularly limited, but may be 1 to 5. Specific examples of the alkenyl group may include ethenyl, propenyl, butenyl, pentenyl, and the like, but are not limited thereto.

The alkenylene group may be linear or branched, may be substituted or unsubstituted, carbon number is not particularly limited, but may be 1 to 5. Specific examples of the alkenylene group may include ethenylene, propenylene, butenylene, pentenylene, and the like, but are not limited thereto.

The substituent may be a halogen group, an alkyl group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, an alkenyl group having 2 to 5 carbon atoms.

Wherein l is an integer of 1 to 4, m is an integer of 1 to 8, and n represents a repeating unit represented by Formula 1.

The cardo-based binder may be prepared using an epoxy acrylate-based resin.

In one embodiment of the present application, the cardo-based binder may be specifically, an acid value may be 10 ~ 200 KOH mg / g, more specifically, an acid value may be 30 ~ 150 KOH mg / g.

In addition, the weight average molecular weight (value measured by gel permeation chromatography, ie, GPC) of the cardo-based binder resin may be specifically, 1,000 to 30,000, more specifically, 1,500 to 10,000. When the molecular weight is 1,000 to 30,000, the milling function is good, and physical properties such as heat resistance and chemical resistance can be satisfied.

In one embodiment of the present application, the content of the cardo-based binder may be 0.1 to 10 parts by weight based on 100 parts by weight of the colorant composition. When it is 0.1 to 10 parts by weight, the milling effect is good. If it is less than 0.1 part by weight, the milling effect is insignificant, and if it is more than 10 parts by weight, there is little increase in milling effect compared to the amount of increase in the binder.

In one embodiment of the present application, the content of the cardo-based binder may be 50 to 100 parts by weight based on 100 parts by weight of the binder in the colorant composition. The binder may further include an acrylic binder. The mixing ratio of the cardo-based binder: acrylic binder in the colorant composition may be 50-100: 0-50.

The cardo-based binder and the acrylic binder may have a milling function in the colorant composition. Milling refers to covering one component particle surface with another component. By including the cardo-based binder in the binder in the colorant composition, the function of milling the carbon black is further improved, and there is an effect of minimizing the decrease in the resistance value in the high temperature process.

The colorant composition may further include one or more of a solvent and a dispersant.

In one embodiment of the present application, the colorant composition may include a colorant including a black pigment. The colorant may use only a black pigment, or may mix and use a black pigment and a color coloring pigment.

The black pigment may be carbon black having a high resistance treatment of carbon black and having a surface resistance of 10 ¹¹ Ωcm or more, or a mixture of the carbon black and the organic black pigment. When the organic black pigment is mixed, the average optical density is not only increased, but the average optical density (OD) is uniformly adjusted for each unit wavelength to have a high light shielding property.

As the carbon black, Sisto 5HIISAF-HS, Sisto KH, Sisto 3HHAF-HS, Sisto NH, Sisto 3M, Sisto 300HAF-LS, Sisto 116HMMAF-HS, Sisto 116MAF of Donghae Carbon Co., Ltd. Cysto FMFEF-HS, cysto SOFEF, cysto VGPF, cysto SVHSRF-HS, and cysto SSRF; Tokushikisa BK_8132; Diagram Black II, Diagram Black N339, Diagram Black SH, Diagram Black H, Diagram LH, Diagram HA, Diagram SF, Diagram N550M, Diagram M, Diagram E, Diagram G, Diagram R, Diagram N760M, Diagram LR, # 2700, # 2600, # 2400, # 2350, # 2300, # 2200, # 1000, # 980, # 900, MCF88, # 52, # 50, # 47, # 45, # 45L, CF9, # 95, # 3030, # 3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B, and OIL31B; PRINTEX-55, PRINTEX-55, PRINTEX-45, PRINTEX-35, PRINTEX-55, PRINTEX-85, PRINTEX-75, PRINTEX- SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100, and LAMP BLACK-101; PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A; SPECIAL BLACK-550; RAVEN-1100ULTRA, RAVEN-1080ULTRA, RAVEN-1060ULTRA, RAVEN-1040, RAVEN-1035, RAVEN-1020, RAVEN-1000, RAVEN-890H, RAVEN-890, RAVEN-880ULTRA, RAVEN-860ULTRA, RAVEN-850, RAVEN-820, RAVEN-790ULTRA, RAVEN-780ULTRA, RAVEN-760ULTRA, RAVEN-520, RAVEN-500, RAVEN-460, RAVEN-450, RAVEN-430ULTRA, RAVEN-420, RAVEN-410, RAVEN- 2500ULTRA, RAVEN-2000, RAVEN-1500, RAVEN-1255, RAVEN-1250, RAVEN-1200, RAVEN-1190ULTRA, RAVEN-1170 and the like are used alone or in combination.

As the organic black pigment, a surface resistance value of 10 ¹¹ Ωcm or more is effective. For example, lactam black, aniline black, perylene black, or the like may be used.

The carbon black may be included in an amount of 5 to 30 parts by weight based on 100 parts by weight of the total colorant composition.

If the content of carbon black is less than 5 parts by weight, the optical density of the formed film may be low and may not have sufficient light shielding properties. If the content is more than 30 parts by weight, there may be a problem in developability or residue may occur.

Color pigments that can be mixed with the carbon black can be used as carmine 6B (CI12490), phthalocyanine green (CI 74260), phthalocyanine blue (CI 74160), linol yellow (CI21090), linol yellow GRO (CI 21090), benzidine Yellow 4T-564D, Victoria Pure Blue (CI42595), CI PIGMENT RED97, 122, 149, 168, 177, 180, 192, 215, C.I. PIGMENT GREEN 7, 36, C.I. PIGMENT 15: 1, 15: 4, 15: 6, 22, 60, 64, C.I. PIGMENT 83, 139 C.I. PIGMENT VIOLET 23, etc. In addition, white pigments, fluorescent pigments, etc. may be used.

In one embodiment of the present application, the photosensitive resin composition is an alkali-soluble binder resin in addition to the colorant composition; Crosslinkable compounds; Photopolymerization initiator; Adhesion promoters; And it may further comprise one or two or more selected from the group consisting of a solvent.

In one embodiment of the present application, the photosensitive resin composition is a colorant composition; Alkali soluble binders; Crosslinkable compounds; Photopolymerization initiator; And solvents.

In one embodiment of the present application, the content of the colorant composition may be 30 to 60 parts by weight based on 100 parts by weight of the photosensitive resin composition.

In one embodiment of the present application, the alkali-soluble binder may include at least one of an acrylic binder and a cardo-based binder. When used in combination, the mixing ratio of the acrylic binder: cardo-based binder may be specifically 1 to 99: 99 to 1, and more specifically 50:50.

Acrylic binders or cardo-based binders used as binders in the photosensitive resin composition exhibit excellent effects on substrate adhesion.

The cardo-based binder which may be included in the alkali-soluble binder may include a repeating unit represented by Chemical Formula 1.

Specifically, the cardo-based binder may have an acid value of 10 to 200 KOH mg / g, and more specifically, an acid value of 30 to 150 KOH mg / g. When the acid value is 10 KOH mg / g or more, the solubility in alkaline developer is good to shorten the development time, and the residue is not left on the substrate. When 200 KOH mg / g or less, the pattern is prevented from desorption and the pattern goes straight. To ensure that

In addition, the weight average molecular weight (value measured by gel permeation chromatography, ie, GPC) of the cardo-based binder may be specifically, 1,000 to 30,000, more specifically, 1,500 to 10,000. When the molecular weight is 1,000 or more, the binding function is good, the physical strength at the time of development can be endured, the pattern is not lost, and the physical properties such as basic heat resistance and chemical resistance can be satisfied. In addition, when the molecular weight is 30,000 or less, it is possible to prevent the problem that development is impossible due to less developability with respect to the alkaline developer, and that the flow may be deteriorated, thereby preventing the problem of difficulty in controlling the coating thickness or securing the uniformity of the thickness.

The acrylic binder may be one composed of a monomer imparting mechanical strength of the film and a monomer imparting alkali solubility, and at the same time, it is preferable to use one capable of forming a low taper angle of the pattern.

 Monomers usable for controlling the mechanical strength and taper angle of the membrane include, for example, benzyl (meth) acrylate, methyl (meth) acrylate, ethyl (meth) acrylate, butyl (meth) acrylate, dimethylaminoethyl ( Meta) acrylate, isobutyl (meth) acrylate, t-butyl (meth) acrylate, cyclohexyl (meth) acrylate, isobonyl (meth) acrylate, ethylhexyl (meth) acrylate, 2-phenoxy Ethyl (meth) acrylate, tetrahydroperpril (meth) acrylate, hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 2-hydroxy-3-chloropropyl (meth) acrylic Rate, 4-hydroxybutyl (meth) acrylate, glycerol (meth) acrylate, 2-methoxyethyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, ethoxydiethylene glycol (meth) acrylic Late, methock Triethylene glycol (meth) acrylate, methoxy tripropylene glycol (meth) acrylate, poly (ethylene glycol) methyl ether (meth) acrylate, phenoxydiethylene glycol (meth) acrylate, p-nonyl phenoxy polyethylene glycol (Meth) acrylate, p-nonylphenoxypolypropylene glycol (meth) acrylate, glycidyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylate, dicyclo Pentenyloxyethyl (meth) acrylate, isobornyl (meth) acrylate, adamantyl (meth) acrylate, stearyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, oxyl ( Meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl methacrylate, methyl α-hydroxymethyl acrylate, ethyl α-hydroxymethyl arc Unsaturated carboxylic acid esters such as acrylate, propyl α- hydroxymethyl acrylate, butyl α- hydroxymethyl acrylate; Aromatic vinyls such as styrene, α-methylstyrene, (o, m, p) -vinyl toluene, (o, m, p) -methoxy styrene, (o, m, p) -chloro styrene; Unsaturated ethers such as vinyl methyl ether, vinyl ethyl ether, allyl glycidyl ether; Unsaturated imides such as N-phenyl maleimide, N- (4-chlorophenyl) maleimide, N- (4-hydroxyphenyl) maleimide, and N-cyclohexyl maleimide; And maleic anhydrides such as maleic anhydride and methyl maleic anhydride can be used, and it is effective to use two or more kinds. In particular, it is preferable to use 1 to 30 molar equivalents of a monomer having a substituted chain length of 6 to 18, but it is not limited thereto.

As a monomer which gives alkali solubility, it is (meth) acrylic acid, crotonic acid, itaconic acid, maleic acid, fumaric acid, monomethyl maleic acid, 5-norbornene-2-carboxylic acid, mono-2-((meth) acrylo, for example. It is effective to use at least one selected from the group consisting of yloxy) ethyl phthalate, mono-2-((meth) acryloyloxy) ethyl succinate, and ω-carboxy polycaprolactone mono (meth) acrylate. It is good, but it is not limited to these.

In one embodiment of the present application, the acrylic binder may be specifically, an acid value of 10 to 200 KOH mg / g, more specifically, an acid value of 30 to 150 KOH mg / g may be. When the acid value is 10 KOH mg / g or more, the solubility in alkaline developer is good to shorten the development time, and the residue is not left on the substrate. When 200 KOH mg / g or less, the pattern is prevented from desorption and the pattern goes straight. It is possible to ensure that the taper angle of the pattern does not produce reverse papers with more than 90 °.

In addition, the weight average molecular weight (the value measured by gel permeation chromatography, ie, GPC) of the acrylic binder may be specifically, 1,000 to 50,000, more specifically, 2,000 to 30,000. When the molecular weight is 1,000 or more, the binding function is good, the physical force at the time of development can be endured, the pattern is not lost, and the physical properties such as basic heat resistance and chemical resistance can be satisfied. In addition, the molecular weight of 50,000 or less prevents the problem that development may not be possible due to the low developability of the alkaline developer, and prevents the problem that the control of the coating thickness or the uniformity of the thickness may be difficult due to poor flowability.

The photosensitive resin composition may be effective to include 1 to 20 parts by weight, specifically 1 to 10 parts by weight of an alkali-soluble binder, based on 100 parts by weight of the total composition. If the content of the alkali-soluble binder is less than 1 part by weight, the adhesion of the formed pattern may be degraded, or patterning using an aqueous alkali solution may be difficult. If the content of the alkali-soluble binder is greater than 20 parts by weight, the strength and sensitivity of the formed image may be reduced or the pattern may be reduced. This may be lost.

In one embodiment of the present application, the crosslinkable compound may specifically be a multifunctional monomer having an ethylenically unsaturated double bond, more specifically, a compound having a boiling point of 100 ° C. or more having one or more addition polymerizable unsaturated groups in a molecule and It may be one or more of the polyfunctional monomers in which caprolactone is introduced.

Examples of the compound having a boiling point of 100 ° C. or more having at least one or more addition-polymerizable unsaturated groups in the molecule include polyethylene glycol mono (meth) acrylate, polypropylene glycol mono (meth) acrylate, phenoxyethyl (meth) acrylate, and the like. Monofunctional monomers; Polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, trimethylol ethane triacrylate, trimethylol propane triacrylate, neopentyl glycol (meth) acrylate, pentaerythritol tetraacrylate, pentaerythritol One or more types selected from the group consisting of polyfunctional monomers such as triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and the like can be used, but are not limited thereto.

As the polyfunctional monomer incorporating caprolactone, KAYARAD DPCA-20,30,60,120 introduced in dipentaerythritol, KAYARAD TC-110S introduced in tetrahydrofuryl acrylate, and neopentyl glycol hydroxy pivalate were introduced. KAYARAD HX-220, KAYARAD HK-620, and the like; Epoxy Ester 200PA, Epoxy Ester 3002M, Epoxy Ester 3002A, Epoxy Ester 3000M; And UA306H, UA306T, UA306I, UA510H, UF8001, and U-324A, U15HA, U-4HA as the urethane acrylate series may be used, but is not limited thereto.

The crosslinkable compound is preferably included in an amount of 1 to 10 parts by weight based on 100 parts by weight of the entire photosensitive resin composition. If the content is 1 part by weight or more, the photosensitivity or the strength of the coating film has an effect of preventing the lowering. If the content is 10 parts by weight or less, the adhesiveness of the photosensitive layer is prevented from excessive development, and the film strength is sufficient. It is effective to prevent loss.

In one embodiment of the present application, the photopolymerization initiator may be one or more selected from the group consisting of acetophenone-based compounds, biimidazole-based compounds, triazine-based compounds and oxime-based compounds.

As said acetophenone type compound, for example, 2-hydroxy-2-methyl-1-phenylpropan-1-one and 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropane-1 -One, 4- (2-hydroxyethoxy) -phenyl- (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenylketone, benzoinmethyl ether, benzoinethyl ether, benzoin iso Butyl ether, benzoin butyl ether, 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- (4-methylthio) phenyl-2-morpholino-1-propan-1-one, 2-benzyl 2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 2- (4-bromo-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane It may be one or more selected from the group consisting of -1-one and 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropane-1-one, but is not limited thereto.

Examples of the biimidazole-based compound include 2,2-bis (2-chlorophenyl) -4,4 ', 5,5'-tetraphenyl biimidazole and 2,2'-bis (o-chloro Phenyl) -4,4 ', 5,5'-tetrakis (3,4,5-trimethoxyphenyl) -1,2'-biimidazole, 2,2'-bis (2,3-dichlorophenyl ) -4,4 ', 5,5'-tetraphenyl biimidazole and 2,2'-bis (o-chlorophenyl) -4,4', 5,5'-tetraphenyl-1,2'-ratio It may be one or more selected from the group consisting of imidazole, but is not limited thereto.

 Examples of the triazine-based compound include 3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionic acid, 1,1,1,3 , 3,3-hexafluoroisopropyl-3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionate, ethyl-2- {4 -[2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, 2-epoxyethyl-2- {4- [2,4-bis (trichloromethyl) -s -Triazin-6-yl] phenylthio} acetate, cyclohexyl-2- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, benzyl-2 -{4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} acetate, 3- {chloro-4- [2,4-bis (trichloromethyl) -s -Triazin-6-yl] phenylthio} propionic acid, 3- {4- [2,4-bis (trichloromethyl) -s-triazin-6-yl] phenylthio} propionamide, 2,4 -Bis (trichloromethyl) -6-p-methoxystyryl-s-triazine, 2,4-bis (trichloro Methyl) -6- (1-p-dimethylaminophenyl) -1,3, -butadienyl-s-triazine and 2-trichloromethyl-4-amino-6-p-methoxystyryl-s- Triazine may be one or more selected from the group consisting of, but is not limited thereto.

Examples of the oxime-based compound include 1,2-octadione, -1- (4-phenylthio) phenyl, -2- (o-benzoyloxime) (Shibagai Co., Shijiai 124), ethanone, -1- (9-ethyl) -6- (2-methylbenzoyl-3-yl)-, 1- (O-acetyloxime) (SCI) 242 and N-1919 (adecasa) It may be one or more, but is not limited thereto.

In one embodiment of the present application, the photopolymerization initiator may be included in an amount of 0.1 to 10 parts by weight based on 100 parts by weight of the entire photosensitive resin composition. If it is less than 0.1 part by weight, the effect of addition is insignificant, and if it is more than 10 parts by weight, there is no difference in effect compared to the increase amount.

The photopolymerization initiator may be used in an amount of 1 to 300 parts by weight based on a total of 100 parts by weight of the polyfunctional monomer having the ethylenically unsaturated double bond and the binder resin in the photosensitive resin composition. Specifically, 1 type, or 2 or more types can be mixed and used in an acetophenone type compound, a biimidazole type compound, a triazine type compound, and an oxime type compound. The acetophenone-based compound is particularly effective when using 1 to 300 parts by weight, more specifically, 1 to 200 parts by weight, and the biimidazole-based compound is specifically used by 1 to 300 parts by weight, more specifically, 1 to 100 parts by weight. When the effect is good, the triazine-based compound is particularly effective when using 1 to 300 parts by weight, more specifically 1 to 100 parts by weight, the oxime compound is specifically 1 to 300 parts by weight, more specifically 1 to 50 parts by weight Using wealth works well.

In one embodiment of the present application, the photopolymerization initiator may include a photocrosslinking sensitizer to promote the generation of radicals as a secondary component or a curing accelerator to promote cure, and may include both a crosslinking sensitizer and a curing accelerator. have. The content of the photocrosslinking sensitizer or curing accelerator may be included in an amount of 0.01 to 10 parts by weight based on 100 parts by weight of the photopolymerization initiator. If it is less than 0.01 weight part, the effect of addition is insignificant, and if it is more than 10 weight part, there is no difference in an effect compared with the increase amount.

The photocrosslinking sensitizer is, for example, benzophenone, 4,4-bis (dimethylamino) benzophenone, 4,4-bis (diethylamino) benzophenone, 2,4,6-trimethylaminobenzophenone, methyl benzophenone compounds such as -o-benzoylbenzoate, 3,3-dimethyl-4-methoxybenzophenone, 3,3,4,4-tetra (t-butylperoxycarbonyl) benzophenone; Fluorene-based compounds such as 9-fluorenone, 2-chloro-9-proprenone and 2-methyl-9-fluorenone; Thioxanthone systems such as thioxanthone, 2,4-diethylthioxanthone, 2-chlorothioxanthone, 1-chloro-4-propyloxytioxanthone, isopropylthioxanthone and diisopropylthioxanthone compound; Xanthone compounds such as xanthone and 2-methylxanthone; Anthraquinone compounds such as anthraquinone, 2-methyl anthraquinone, 2-ethyl anthraquinone, t-butyl anthraquinone and 2,6-dichloro-9,10-anthraquinone; (9-acridinylpentane), 1,3-bis (9-acridinyl) propane, and the like Acridine-based compounds; Dicarbonyl compounds such as benzyl, 1,7,7-trimethyl-bicyclo [2,2,1] heptane-2,3-dione, and 9,10-phenanthrenequinone; Phosphine oxide-based compounds such as 2,4,6-trimethylbenzoyldiphenylphosphine oxide and bis (2,6-dimethoxybenzoyl) -2,4,4-trimethylpentylphosphine oxide; Benzoate compounds such as methyl-4- (dimethylamino) benzoate, ethyl-4- (dimethylamino) benzoate and 2-n-butoxyethyl-4- (dimethylamino) benzoate; (4-diethylaminobenzal) cyclopentanone, 2,6-bis (4-diethylaminobenzal) cyclohexanone, 2,6-bis Amino-synergists such as methyl-cyclopentanone; 3,3-carbonylvinyl-7- (diethylamino) coumarin, 3- (2-benzothiazolyl) -7- (diethylamino) coumarin, 3-benzoyl-7- (diethylamino) coumarin, 3 -Benzoyl-7-methoxy-coumarin, 10,10-carbonylbis [1,1,7,7-tetramethyl-2,3,6,7-tetrahydro-1H, 5H, 11H-C1] -benzo Coumarin-based compounds such as pyrano [6,7,8-ij] -quinolizine-11-one; Chalcone compounds such as 4-diethylaminokalone and 4-azidobenzalacetophenone; 2-benzoylmethylene, 3-methyl-b-naphthothiazoline; one or more selected from the group consisting of may be used, but is not limited thereto.

Examples of the curing accelerator include 2-mercaptobenzoimidazole, 2-mercaptobenzothiazole, 2-mercaptobenzooxazole, 2,5-dimercapto-1,3,4-thiadiazole, 2-mercapto-4,6-dimethylaminopyridine, pentaerythritol-tetrakis (3-mercaptopropionate), pentaerythritol-tris (3-mercaptopropionate), pentaerythritol-tetrakis (2- Mercaptoacetate), pentaerythritol-tris (2-mercaptoacetate), trimethylolpropane-tris (2-mercaptoacetate), and trimethylolpropane-tris (3-mercaptopropionate) One or more may be used, but is not limited thereto.

In one embodiment of the present application, the photosensitive resin composition may further include an adhesion promoter.

In one embodiment of the present application, the adhesion promoter may use acryloyl silane coupling agent or alkyl trimethoxy silane. The acryloyl silane coupling agent is, for example, methacryloyloxy propyltrimethoxy silane, methacryloyloxy propyldimethoxy silane, methacryloyloxy propyltriethoxy silane and methacryloyloxy propyl. It may be at least one selected from the group consisting of dimethoxy silane, the alkyl trimethoxy silane is selected from the group consisting of, for example, octyltrimethoxy silane, dodecyltrimethoxy silane, octadecyltrimethoxy silane It may be one or more kinds.

In one embodiment of the present application, the content of the adhesion promoter may be used in 0.01 to 1 parts by weight based on 100 parts by weight of the total composition. If the content is less than 0.01 part by weight, the effect of the addition is insignificant, and if it is more than 1 part by weight, there is no difference in effect compared to the increase amount.

In one embodiment of the present application, the solvent may be used in consideration of solubility, pigment dispersibility, coating properties and the like. For example, methyl-3-methoxy propionate (144 ° C), ethylene glycol methyl ether (125 ° C), ethylene glycol ethyl ether (135 ° C), ethylene glycol diethyl ether (121 ° C), dibutyl ether ( 140 ° C.), ethylpyruvate (144 ° C.) propylene glycol methyl ether (121 ° C.), propylene glycol methyl ether acetate (146 ° C.), n-butyl acetate (125 ° C.), isobutyl acetate (116 ° C.), amyl acetate ( 149 ° C), isoamyl acetate (143 ° C), butyl propionate (146 ° C), isoamylpropionate (156 ° C), ethyl butyrate (120 ° C), propyl butyrate (143 ° C), methyl-3-me Oxyisobutyrate (148 ° C), methyl glycolate (150 ° C), methyl lactate (145 ° C), ethyl lactate (154 ° C), methyl-2-hydroxyisobutylate (137 ° C), ethyl ethoxyacetate (156 ° C), 2-methoxyethyl acetate (145 ° C), ethylene glycol methyl ether acetate (145 ° C), 2-ethoxy Tilacetate (156 ° C), dibutyl ether (140 ° C), cyclopentanone (131 ° C), cyclohexanone (155 ° C), 2-hexanone (127 ° C), 3-hexanone (123 ° C), 5 -Methyl-2-hexanone (145 ° C), 2-heptanone (150 ° C), 3-heptanone (148 ° C), 4-heptanone (145 ° C), 2-methyl-3-heptanone (159 ° C) ), 1-methoxy-2-propanol (118 ° C.), ethyl-2-hydroxy-propionate (154 ° C.), and ethyl-3-methoxypropionate (158 ° C.), 2-methoxy ethyl Ether (162 ° C.), 3-methoxybutyl acetate (170 ° C.), 2-ethoxyethyl ether (185 ° C.), 2-butoxyethanol (171 ° C.), 3-ethoxy-propanol (161 ° C.), di Ethylene glycol dodecyl ether (169 ° C), dipropylene glycol methyl ether (188 ° C), 2,6-dimethyl-4-heptanone (169 ° C), 2-octanone (173 ° C), 3-octanone (168 ° C), 3-nonanone (188 ° C), 5-nonanone (187 ° C), 4-hydroxy-4-methyl-2-pentanone (166 ° C), 2-methylcyclohexanone (163 ° C), 3-methylcyclohexanone (170 ° C), 4-methylcyclohexanone (170 ° C), 2,6-dimethylcyclohexa (175 ° C), 2,2,6-trimethylcyclohexanone (179 ° C), cyclohaptanone (179 ° C), hexyl acetate (169 ° C), amylbutyrate (185 ° C), isopropyl lactate (167 ° C) , Butyl lactate (186 ° C.), ethyl-3-hydroxybutyrate (170 ° C.), ethyl-3-ethoxypropionate (170 ° C.), ethyl-3-hydroxy butyrate (180 ° C.), propyl-2 Hydroxy-propionate (169 ° C), propylene glycol diacetate (186 ° C), propylene glycol butyl ether (170 ° C), propylene glycol methyl ether propionate (160 ° C), diethylene glycol dimethyl ether (162 ° C) ), Diethylene glycol dimethyl ether acetate (165 ° C), dipropylene glycol methyl ether (188 ° C), dipropylene glycol dimethyl ether (171 ° C), ethylene glycol butyl ether (171 ° C), diethylene glycol methyl ethyl ether (176 ℃, diethylene glycol methyl isopropyl ether (179 ℃), diethylene glycol diethyl ether (189 ℃), Butylbutyrate (165 ° C), ethyl-3-ethoxypropionate (170 ° C), diethylene glycol monomethyl ether (194 ° C), 4-ethylcyclohexanone (193 ° C), and 2-butoxyethylacetate (192 ° C), diethylene glycol monoethyl ether (202 ° C), butyrolactone (204 ° C), hexyl butyrate (205 ° C), diethylene glycol methyl ether acetate (209 ° C), diethylene glycol butyl methyl ether ( 212 ° C.), tripropyl glycol dimethyl ether (215 ° C.), triethylene glycol dimethyl ether (216 ° C.), diethylene glycol ethyl ether acetate (217 ° C.), diethylene glycol butyl ether acetate (245 ° C.), 3-epoxy- 1,2-propanediol (222 ° C), ethyl-4-acetylbutyrate (222 ° C), diethylene glycol monobutyl ether (231 ° C), tripropylglycolmethyl ether (242 ° C), diethylene glycol (245 ° C) , 2- (2-butoxyethoxy) ethyl acetate (245 ° C), catechol (245 ° C), triethylene glycol methyl ether (2 49 ° C.), diethylene glycol dibutyl ether (256 ° C.), triethylene glycol ethyl ether (256 ° C.), diethylene glycol monohexyl ether (260 ° C.), triethylene glycol butyl methyl ether (261 ° C.), triethylene glycol It may be one kind or two or more kinds selected from the group consisting of butyl ether (271 ° C.), tripropyl glycol (273 ° C.) and tetraethylene glycol dimethyl ether (276 ° C.), and two or more kinds are more effective.

In one embodiment of the present application, the content of the solvent is effective to include 40 to 90 parts by weight based on 100 parts by weight of the total composition.

In one embodiment of the present application, the photosensitive resin composition may further include one or more primary additives selected from the group consisting of surfactants, dispersants, antioxidants, ultraviolet absorbers, thermal polymerization inhibitors, and leveling agents. These may be used as long as they are known in the art.

The surfactant may include MCF 350SF, F-475, F-488, F-552 (hereinafter referred to as DIC Corporation), but is not limited thereto.

The dispersant may be used as a method of internally adding to the pigment in the form of surface treatment of the pigment in advance or externally adding to the pigment.

The dispersant may be a polymeric, nonionic, anionic, or cationic dispersant. Non-limiting examples of such dispersants include polyalkylene glycols and esters thereof, polyoxyalkylene polyhydric alcohols, esteralkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylic acid esters, carboxes Acid salts, alkylamide alkylene oxide adducts, alkylamines, and the like, and one or a mixture of two or more selected from these may be used, but is not limited thereto.

Non-limiting examples of the antioxidant may include one or more selected from 2,2-thiobis (4-methyl-6-t-butylphenol), 2,6-g, t-butylphenol, It is not limited only to these.

Non-limiting examples of the ultraviolet absorbent may include one or more selected from 2- (3-t-butyl-5-methyl-2-hydroxyphenyl) -5-chloro-benzotriazole, alkoxy benzophenone and the like. However, the present invention is not limited thereto.

Non-limiting examples of the thermal polymerization inhibitors include hydroquinone, p-methoxyphenol, di-t-butyl-p-cresol, pyrogarol, t-butylcatechol, benzoquinone, 4,4-thiobis (3- Methyl-6-t-butylphenol), 2,2-methylenebis (4-methyl-6-t-butylphenol), 2-mercaptoimidazole, and the like, and one or two selected from these. The above mixture may be included, but is not limited thereto.

In addition, the photosensitive resin composition may further include at least one secondary additive selected from the group consisting of carbon black dispersions, resin binders having functionalities, monomers, radiation-sensitive compounds, and other additives.

In one embodiment of the present application, the amount of the additive may be included in more than 0 to 5 parts by weight based on 100 parts by weight of the total composition, but is not limited thereto.

One embodiment of the present application provides a pattern formed using the photosensitive resin composition. In detail, the pattern may be a bezel pattern, more specifically, a bezel pattern formed on the display panel, and more specifically, a bezel pattern formed on the touch panel.

The pattern preferably has a layer thickness of 0.3 to 5 µm, and more preferably 0.8 to 3 µm. If it is 0.3 micrometer-5 micrometers, there exists an effect of preventing the short circuit of a metal wiring.

The pattern formed using the photosensitive resin composition may have a good optical density (OD) of 3 or more, more specifically 3.5 or more, and even more specifically 4 or more at a visible wavelength (380 to 780 nm). It has the effect of going straight.

One embodiment of the present application includes the steps of applying the photosensitive resin composition to a substrate; And it provides a pattern formed by a method comprising the step of exposing and developing the applied photosensitive resin composition.

One embodiment of the present application includes the steps of applying the photosensitive resin composition to a substrate; And it provides a pattern manufacturing method formed by a method comprising the step of exposing and developing the coated photosensitive resin composition.

In the coating step, the coating may be performed by spraying, roll coating, spin coating, bar coating, spin coating or slit coating. Method can be used.

The film can be formed by removing the solvent by pre-bake after the applying step. Prebaking conditions can be performed, for example for 0.5 to 30 minutes at 70-150 degreeC.

After the prebaking, the exposure is performed by a method such as a photomask having a desired pattern on the applied photosensitive layer, and then a pattern is prepared by developing the exposed photosensitive layer with an appropriate developer.

As a developing method, a dipping method, a shower method, a spray method, a paddle method, or the like can be applied without limitation. The developing time may be, for example, about 30 to 180 seconds.

As said developing solution, Inorganic alkalis, such as sodium hydroxide, potassium hydroxide, sodium silicate, sodium methsilicate, ammonia, as aqueous alkali solution; Primary amines such as ethylamine and N-propylamine; Secondary amines such as diethylamine and di-n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine and dimethylethylamine; Tertiary alcohol amines such as dimethylethanolamine, methyldiethanolamine and triethanolamine; Pyrrole, piperidine, n-methylpiperidine, n-methylpyrrolidine, 1,8-diazabicyclo [5.4.0] -7-undecene, 1,5-diazabicyclo [4.3.0] Cyclic tertiary amines such as -5-nonene; Aromatic tertiary amines such as pyridine, corridin, lutidine, and quroline; Or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide.

After development, flowing water is washed for about 30 to 90 seconds and dried in air or nitrogen to form a pattern. This pattern can be obtained by post-bake using a heating device such as a hot plate or an oven to obtain a finished bezel layer.

One embodiment of the present application provides a display panel including the pattern. The display panel may specifically be a display panel including the bezel pattern, and more specifically, may be a touch panel including the bezel pattern.

Hereinafter, the present application will be described in more detail with reference to the following Examples, Comparative Examples, and Test Examples. However, the following examples, comparative examples and test examples are provided only for the purpose of illustration in order to facilitate understanding of the present application, the scope and scope of the present application is not limited thereto.

< Example 1>

600 parts by weight of a carbon dispersion (Tacomasa K_1064 content 25%) as a colorant composition, 8 parts by weight of cardo-based binder resin (B1) as a binder for milling in the carbon dispersion, and benzyl methacrylate / N-phenyl as an alkali-soluble acrylic binder 1 Methacrylic acid / methacrylic acid with maleimide / styrene / glycidyl methacrylate {(molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g), solid content 30%} 70 weight Part, benzyl methacrylate / N-phenylmaleimide / styrene / lauryl methacrylate / methacrylic acid {(molar ratio 40/7/8/14/31, Mw = 19000, 124 KOH mg / g) , Solid content 30%} 130 parts by weight, 35 parts by weight of dipentaerythritol hexa acrylate as a polyfunctional monomer, 20 parts by weight of N-1919 (adecasa) as a photopolymerization initiator, 3-methacryloxypropyltrimeth as an adhesion promoter 5 parts by weight of oxysilane and 1 part by weight of F-475 (dic) as a leveling agent, Propylene glycol monomethyl ether acetate were mixed with 530 parts by weight of 3-methoxybutyl acetate to 100 parts by weight.

Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.

The photosensitive resin composition solution prepared as described above was coated on glass using spin coating, followed by electrothermal treatment at about 100 ° C. for 2 minutes to form a coating film having a thickness of about 1.44 μm. Then, after cooling at room temperature, it was exposed with an energy of 100 mJ / cm 2 under a high pressure mercury lamp using a photomask. The exposed substrate was developed by spraying in a 0.04% KOH aqueous solution at a temperature of 25 ° C., washed with pure water, dried, and post-baked for 20 minutes in a convection oven at 230 ° C.

The film obtained as described above was obtained as a clean coating film having no surface defects according to each step, and a bezel pattern film having good straightness was obtained with a film thickness of 1.31 µm and an OD of 5.0.

&Lt; Example 2 >

600 parts by weight of a carbon dispersion (20% of Tokushikisa BK_8132), 3 parts by weight of a cardo-based binder resin (X-15) as a binder for milling in the carbon dispersion, and a benzyl methacrylate / N-phenyl as an alkali-soluble acrylic binder 1 Methacrylic acid / methacrylic acid with maleimide / styrene / glycidyl methacrylate {(molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g), solid content 30%} 70 weight Part, benzyl methacrylate / N-phenylmaleimide / styrene / lauryl methacrylate / methacrylic acid {with an acrylic binder 2 ((molar ratio 40/7/8/14/31, Mw = 19000, 124 KOH mg / g)) , Solid content 30%} 130 parts by weight, 35 parts by weight of dipentaerythritol hexa acrylate as a polyfunctional monomer, 20 parts by weight of N-1919 (adecasa) as a photopolymerization initiator, 3-methacryloxypropyltrimeth as an adhesion promoter 5 parts by weight of oxysilane and 1 part by weight of F-475 (dic) as a leveling agent, propylene glycol as a solvent Ether acetate were mixed with 530 parts by weight of 3-methoxybutyl acetate to 100 parts by weight.

Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.

The photosensitive resin composition solution prepared as described above was coated on glass using spin coating, followed by electrothermal treatment at about 100 ° C. for 2 minutes to form a coating film having a thickness of about 1.44 μm. Then, after cooling at room temperature, it was exposed with an energy of 100 mJ / cm 2 under a high pressure mercury lamp using a photomask. The exposed substrate was developed by spraying in a 0.04% KOH aqueous solution at a temperature of 25 ° C., washed with pure water, dried, and post-baked for 20 minutes in a convection oven at 230 ° C.

The film obtained as described above was obtained as a clean coating film having no surface defects according to each step, and a bezel pattern film having a good straightness was obtained with a film thickness of 1.31 µm and an OD of 5.0.

< Example 3>

600 parts by weight of a carbon dispersion (Tokushikisa BK_4622, carbon content 20%), 1.5 parts by weight of cardo-based binder resin (X-15) and 1.5 parts by weight of acrylic binder resin (T-4) are mixed with the milling binder in the carbon dispersion. Methacrylic acid / methacrylic acid to which benzyl methacrylate / N-phenylmaleimide / styrene / glycidyl methacrylate was added as alkali-soluble acrylic binder 1 {(molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g), solid content 30%} 70 parts by weight, benzyl methacrylate / N-phenylmaleimide / styrene / lauryl methacrylate / methacrylic acid {(molar ratio 40/7 / 8/14/31, Mw = 19000, 124 KOH mg / g), solids content 30%} 130 parts by weight, 35 parts by weight of dipentaerythritol hexaacrylate as a polyfunctional monomer, N-1919 (adecasa as a photopolymerization initiator ) 20 parts by weight, 5 parts by weight of 3-methacryloxypropyltrimethoxysilane as adhesion promoter And 1 part by weight of F-475 (dic) as a leveling agent, 530 parts by weight of propylene glycol monomethyl ether acetate, and 100 parts by weight of 3-methoxybutyl acetate as a solvent.

Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.

The photosensitive resin composition solution prepared as described above was spin-coated to glass, and then subjected to electrothermal treatment at about 100 ° C. for 2 minutes to form a coating film having a thickness of about 1.44 μm. Then, after cooling at room temperature, it was exposed with an energy of 100 mJ / cm 2 under a high pressure mercury lamp using a photomask. The exposed substrate was developed by spraying in a 0.04% KOH aqueous solution at a temperature of 25 ° C., washed with pure water, dried, and post-baked in a convection oven at 230 ° C. for 20 minutes.

The film obtained as described above was obtained as a clean coating film having no surface defects according to each step, and a bezel pattern film having good straightness was obtained with a film thickness of 1.31 µm and an OD of 5.0.

< Comparative Example 1>

600 parts by weight of a carbon dispersion (Tokushikisa BK_8115, carbon content 20%), 3 parts by weight of an acrylic binder resin as a milling binder in the carbon dispersion, and benzyl methacrylate / N-phenylmaleimide / styrene / as an alkali-soluble acrylic binder. Methacrylic acid / methacrylic acid with glycidyl methacrylate added {(molar ratio 38/7/7/21/27, Mw = 9000, 105 KOH mg / g), solid content 30%} 200 parts by weight, polyfunctional monomer 35 parts by weight of low dipentaerythritol hexa acrylate, 20 parts by weight of N-1919 (adekasa) as a photopolymerization initiator, 5 parts by weight of 3-methacryloxypropyltrimethoxysilane as an adhesion promoter and F-475 (dic as a leveling agent G) 530 parts by weight of propylene glycol monomethyl ether acetate and 100 parts by weight of 3-methoxybutyl acetate were mixed with 1 part by weight of a solvent.

Then, the mixture was stirred for 5 hours to prepare a photosensitive resin composition.

The photosensitive resin composition solution prepared as described above was subjected to the same process as in Example 1. At this time, the obtained film was able to obtain a clean film having a film thickness of 1.3 μm without any surface defects according to each process. However, the taper of the inverse taper (T-shape), which has a low development margin and causes a metal wiring short circuit in the subsequent process, is obtained. It was obtained and could not be used as a bezel pattern film.

Therefore, when the bezel pattern is formed by directly applying the photosensitive resin composition of the present application to the cover glass of the touch panel, an excellent touch panel can be manufactured. In addition, when the bezel pattern is formed using the photosensitive resin composition of the present application in which the constituent components and the composition ratio are optimized, it is possible to manufacture a more excellent touch panel by minimizing the change in resistance value at a high temperature process.

< Experimental Example > Heat Resistance Reduction Experiment

The substrate having the bezel pattern obtained in Examples 1 to 3 and Comparative Example 1 was further subjected to heat resistance at 250 ° C. for 1 hour and 300 ° C. for 1 hour, and the resistance value change was measured and shown in Table 1 below.

Binder for Milling Sheet resistance (Ω / sq) Kinds Content (parts by weight) Early 250 ℃ 1 hour 300 ℃ 1 hour Example 1 B1 8.0 > 10 ¹⁴ > 10 ¹⁴ 4.0 × 10 ¹¹ Example 2 X-15
T-4 3.0
0 > 10 ¹⁴ > 10 ¹⁴ 5.4 × 10 ⁸ Example 3 X-15
T-4 1.5
1.5 > 10 ¹⁴ > 10 ¹⁴ 2.0 × 10 ⁷ Comparative Example 1 X-15
T-4 0
3.0 > 10 ¹⁴ > 10 ¹⁴ 1.5 × 10 ⁶

When the pattern is formed using the photosensitive resin composition of the present application, when heat-treated at a high temperature of 300 ° C. or higher, the sheet resistance may exceed 1.0 × 10 ⁶ (Ω / sq), and specifically 1.0 × 10 ⁷ (Ω / sq). ) Or more. The higher the sheet resistance after heat treatment at high temperature, the lower the resistance value in the high temperature process is, so the heat resistance is excellent.

From the results in Table 1, it can be seen that by using the photosensitive resin composition according to the present application can be prepared a composition in which the resistance value reduction is minimized in the high temperature process. This effect depends on the kind and composition of the binder having a milling function used in the colorant composition.

In particular, cardo-based binders such as B1 and X-15 binders of Examples 1 and 2 in the present application can minimize the decrease in resistance value, and the acrylic binder resin such as T-4 in Comparative Example 1 has a lower resistance value. It has been proved that it does not stop.

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Having described specific portions of the present application in detail, those skilled in the art will appreciate that these specific embodiments are merely preferred embodiments and that the scope of the present application is not limited thereto. Accordingly, the actual scope of the present application will be defined by the appended claims and their equivalents.

Claims (29)

coloring agent; And cardo binders
Photosensitive resin composition comprising a colorant composition comprising a. The method according to claim 1,
The cardo-based binder is a photosensitive resin composition comprising a repeating unit represented by the following formula (1):
[Chemical Formula 1]

Rx is a structure formed by reaction of a 5-membered ring carboxylic anhydride or diisocyanate,
Ry is selected from the group consisting of hydrogen, acryloyl and methacryloyl,
R ₁ to R ₃ are each independently hydrogen; A halogen group; A substituted or unsubstituted alkyl group having 1 to 5 carbon atoms; A substituted or unsubstituted C1-C5 alkoxy group; And a substituted or unsubstituted alkenyl group having 2 to 5 carbon atoms; , &Lt; / RTI &gt;
R ₄ to R ₇ are each independently a substituted or unsubstituted alkylene group having 1 to 5 carbon atoms; A substituted or unsubstituted alkoxylene group having 1 to 5 carbon atoms; And a substituted or unsubstituted alkenylene group having 2 to 5 carbon atoms; Is selected from the group consisting of
l is an integer from 1 to 4,
m is an integer from 1 to 8,
n represents that the repeating unit represented by the formula (1). The method according to claim 1,
The cardo-based binder has an acid value of 10 to 200 KOH mg / g, and a weight average molecular weight of 1,000 to 30,000, the photosensitive resin composition. The method according to claim 1,
The content of the cardo-based binder is a photosensitive resin composition, characterized in that 0.1 to 10 parts by weight based on 100 parts by weight of the colorant composition. The method according to claim 1,
The content of the cardo-based binder is 50 to 100 parts by weight based on 100 parts by weight of the binder in the colorant composition. The method according to claim 1,
The colorant is carbon black; Or a black pigment which is a mixture of the carbon black and the organic black pigment. The method of claim 6,
The carbon black has a surface resistance value of 10 ¹¹ Ωcm or more. The method of claim 6,
The content of the carbon black is a photosensitive resin composition, characterized in that 5 to 30 parts by weight based on 100 parts by weight of the colorant composition. The method according to claim 1,
The content of the colorant composition is a photosensitive resin composition, characterized in that 30 to 60 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method according to claim 1,
The photosensitive resin composition is an alkali-soluble binder; Crosslinkable compounds; A photopolymerization initiator; And a photosensitive resin composition, characterized in that it further comprises one or two or more from the group consisting of a solvent. The method of claim 10,
The content of the alkali-soluble binder is 1 to 20 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method of claim 10,
The content of the crosslinkable compound is 1 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method of claim 10,
The photopolymerization initiator content is a photosensitive resin composition, characterized in that 0.1 to 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method of claim 10,
The content of the solvent is a photosensitive resin composition, characterized in that 40 to 90 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method of claim 10,
The alkali-soluble binder is at least one of an acrylic binder and a cardo-based binder photosensitive resin composition, characterized in that. The method of claim 10,
The photosensitive resin composition further comprises a photocrosslinking sensitizer or a curing accelerator. 18. The method of claim 16,
The content of the photocrosslinking sensitizer or curing accelerator is 0.01 to 10 parts by weight based on 100 parts by weight of the photopolymerization initiator. The method of claim 10,
The photosensitive resin composition further comprises an adhesion promoter. 19. The method of claim 18,
The content of the adhesion promoter is a photosensitive resin composition, characterized in that 0.1 to 1 parts by weight based on 100 parts by weight of the photosensitive resin composition. The method according to claim 1,
The photosensitive resin composition is at least one selected from the group consisting of surfactants, dispersants, antioxidants, ultraviolet absorbers, thermal polymerization inhibitors, leveling agents, carbon black dispersions, resin binders having functionalities, monomers and radiation-sensitive compounds. The photosensitive resin composition characterized by further including an additive. The method according to claim 1,
The photosensitive resin composition has a sheet resistance of 1.0 × 10 ⁷ (Ω / sq) when heat-treated at a high temperature of 300 ° C. or higher at the time of pattern formation. The photosensitive resin composition characterized by the above. The pattern formed using the photosensitive resin composition of any one of Claims 1-21. 23. The method of claim 22,
The pattern may include applying a photosensitive resin composition to a substrate; And
The pattern is formed by a method comprising the step of exposing and developing the applied photosensitive resin composition. 23. The method of claim 22,
The pattern is a pattern, characterized in that the bezel pattern. 23. The method of claim 22,
The pattern has a sheet resistance of 1.0 × 10 ⁷ (Ω / sq) when heat treated at a high temperature of 300 ° C. or higher. The pattern characterized by the above. 23. The method of claim 22,
The pattern has a layer thickness of 0.3 to 5 μm, and the optical density (OD) is at least three. Applying the photosensitive resin composition of any one of claims 1 to 20 to a substrate; And
Pattern manufacturing method comprising the step of exposing and developing the coated photosensitive resin composition. A display panel comprising the pattern of claim 22. 29. The method of claim 28,
And the display panel is a touch panel.