KR20130126152A - Oxynitride-based phosphor compositions and method for manufacturing the same - Google Patents

Abstract

The embodiment of the present invention relates to an oxynitride-based phosphor composition, a manufacturing method thereof, a light emitting device package including the same and a lighting system. The oxynitride phosphor composition according to the embodiment of the present invention is represented by a chemical formula of AwBxOyNz:RE2+ (2≤w≤4, 4≤x≤6, 2≤y≤4, 4≤z≤6), wherein A includes at least one element among Li, Mg, Ca, Sr, Ba and La, B includes at least one element among Boron (B), Al, Ga and In, and RE includes at least one element among Ce, Sm, Eu, Yb, Dy, Gd, Tm and Lu.

Description

Oxide nitride-based phosphor composition and method for manufacturing the same {OXYNITRIDE-BASED PHOSPHOR COMPOSITIONS AND METHOD FOR MANUFACTURING THE SAME}

Embodiments relate to an oxynitride-based phosphor composition and a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

A light emitting device is a device in which electrical energy is converted into light energy. For example, LEDs can realize various colors by adjusting the composition ratio of compound semiconductors.

For example, nitride semiconductors have received great interest in the development of optical devices and high power electronic devices due to their high thermal stability and wide bandgap energy. In particular, blue light emitting devices, green light emitting devices, and ultraviolet light emitting devices using nitride semiconductors are commercially used and widely used.

LED emitting white light is a method of using a secondary light source that emits light from the phosphor by applying a phosphor, a method of obtaining a white light by applying a YAG: Ce phosphor emitting a yellow to a blue LED.

However, the above method has disadvantages in that efficiency is reduced due to quantum deficits and re-radiation efficiency occurring while using secondary light, and color rendering is not easy.

Therefore, the conventional white LED backlight is a combination of a blue LED chip and a yellow phosphor, and the green and red components are lacking to express an unnatural color, and thus, the white LED backlight has been applied to a mobile phone or a notebook PC. Nevertheless, it is widely commercialized because of the advantages of easy driving and significantly lower price.

In general, it is widely known that phosphors use silicates, phosphates, aluminates, or sulfides in a mother material, and transition metals or rare earth metals are used as emission centers.

On the other hand, the silicate (Silicate) phosphor is being used for BLU, lighting, Silicate phosphor is vulnerable to moisture has a problem of poor reliability characteristics compared to other phosphors.

Recently, development of phosphors excited by high energy excitation sources such as ultraviolet light or blue light to emit visible light has been mainstream with respect to white LEDs.

However, the conventional phosphor has a problem that the luminance of the phosphor decreases when it is exposed to an excitation source. In recent years, as a phosphor having a low luminance decrease, studies on phosphors made of silicon nitride-related ceramics as host crystals have shown that the crystal structure is poor. Nitride or oxynitride phosphors are attracting attention as a material that is stable and can shift excitation light or light emission to the long wavelength side.

However, the nitride phosphor according to the prior art has a low color purity, which makes it difficult to use for BLU and lighting.

1 is a light emission spectrum R of an oxynitride phosphor according to the prior art.

Currently, the commercially available green oxynitride phosphors have a limited kind, and emit light in a wavelength range of about 540 nm, and have difficulty in shifting wavelengths to short wavelengths.

For example, in the LED industry, green phosphors require less than 530 nm of green oxynitride phosphors in order to increase the color rendering index, but the commercially available oxynitride phosphors have weak center wavelengths. Since it is near 543nm, it is difficult to move to short wavelength below 530nm.

In addition, according to the prior art, the silicate phosphor can sufficiently shift wavelengths to less than 530 nm, but in the case of the silicate phosphor, the luminance of the phosphor is greatly reduced at high temperatures, and thus the efficiency of the phosphor is greatly reduced, making it difficult to use for high power. there is a problem.

In addition, in general, nitride and oxynitride phosphors can be synthesized at high temperature and high pressure, but there is a problem that synthesis is difficult at low temperature and atmospheric pressure.

Embodiments provide an oxynitride-based phosphor composition having a high color rendering index, a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

The present invention also provides an oxynitride-based phosphor composition having a light emission central wavelength of less than 530 nm, a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

In addition, an embodiment is to provide an oxynitride-based phosphor composition and a method for manufacturing the same, and a light emitting device package and an illumination system including the same that can be synthesized at low temperature and atmospheric pressure.

Oxynitride-based fluorescent material composition according to the embodiment _{A w B x O y N z} : RE 2 + general formula (where, 2≤w≤4, 4≤x≤6, 2≤y≤4, 4≤z≤6 of A is at least one element of Li, Mg, Ca, Sr, Ba and La, B is at least one element of B (Boron), Al, Ga and In, RE is It may comprise at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm and Lu.

In addition, the method for producing an oxynitride-based phosphor composition according to the embodiment is a composition comprising A _w B _x O _y N _z : RE ^{2 +} 2≤w≤4, 4≤x≤6, 2≤y≤4, Preparing a raw material by mixing after weighing in a range of 4 ≦ z ≦ 6; Heat treating the mixed raw materials in a reducing atmosphere at a temperature of 300 ° C. to 1600 ° C. and atmospheric pressure to synthesize a phosphor composition; Ball milling and washing and then drying the synthesized phosphor composition; wherein A includes at least one element of Li, Mg, Ca, Sr, Ba, and La, and B is B (Boron). At least one element of Al, Ga, and In, and the RE includes at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm, and Lu.

Embodiments can provide an oxynitride-based phosphor composition having a high color rendering index and a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

In addition, the embodiment can provide an oxynitride-based phosphor composition having a light emission central wavelength of less than 530nm and a method for manufacturing the same, and a light emitting device package and an illumination system including the same.

In addition, the embodiment can provide an oxynitride-based phosphor composition and a method for manufacturing the same, and a light emitting device package and lighting system including the same.

1 is a light emission spectrum of an oxynitride phosphor according to the prior art.
2 is a cross-sectional view of a light emitting device package according to an embodiment.
Figure 3 is a light emitting device package according to the embodiment and the emission spectrum of the prior art.
4 is a spectrum of excitation light in a light emitting device package according to an embodiment;
Figures 5 to 7 show a lighting device according to an embodiment.
Figs. 8 and 9 are views showing another example of the lighting apparatus according to the embodiment; Fig.
10 is a perspective view of a backlight unit according to an embodiment.

In the description of the embodiments, it is to be understood that each layer (film), area, pattern or structure may be referred to as being "on" or "under" the substrate, each layer Quot; on "and" under "are intended to include both" directly "or" indirectly " do. Also, the criteria for top, bottom, or bottom of each layer will be described with reference to the drawings.

The thickness and size of each layer in the drawings are exaggerated, omitted, or schematically shown for convenience and clarity of explanation. In addition, the size of each component does not necessarily reflect the actual size.

(Example)

2 is a cross-sectional view of a light emitting device package 200 including a phosphor composition according to an embodiment, and the package structure is not limited thereto, and the embodiment may be applied to a two cup package form.

The light emitting device package 200 according to the embodiment includes a package body 205, a light emitting device chip 100 on the package body 205, and a phosphor composition 232 on the light emitting device chip 100 (Not shown).

The phosphor composition 232 _{A w B x O y N z} : formula of RE ^{2 +} (However, 2≤w≤4, 4≤x≤6, 2≤y≤4, 4≤z≤6 ) expressed in A includes at least one element of Li, Mg, Ca, Sr, Ba and La,

B may include at least one element of B (Boron), Al, Ga, and In, and RE may include at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm, and Lu.

The light emitting device package 200 according to the embodiment may include a package body 205, a first electrode layer 213 and a second electrode layer 214 disposed on the package body 205, and the package body 205. The light emitting device chip 100 is disposed on the first electrode layer 213 and the second electrode layer 214 and electrically connected to the first electrode layer 213 and the second electrode layer 214, and a molding member 230 surrounding the light emitting device chip 100. have.

The package body 205 may be formed of a silicon material, a synthetic resin material, or a metal material, and the inclined surface may be formed around the light emitting device chip 100.

The first electrode layer 213 and the second electrode layer 214 are electrically isolated from each other and provide power to the light emitting device chip 100. The first electrode layer 213 and the second electrode layer 214 may reflect the light generated from the light emitting device chip 100 to increase the light efficiency. And may also serve to discharge generated heat to the outside.

The light emitting device chip 100 may be a horizontal type light emitting device, but is not limited thereto. Vertical light emitting devices and flip chip type light emitting devices may also be used.

The light emitting device chip 100 may be formed of a nitride semiconductor. For example, the light emitting device chip 100 may be formed of a material such as GaN, GaAs, GaAsP, or GaP.

The light emitting device chip 100 may include a light emitting structure including a first conductive semiconductor layer (not shown), an active layer (not shown), and a second conductive semiconductor layer (not shown).

In an embodiment, the first conductivity type semiconductor layer may be an N type semiconductor layer, and the second conductivity type semiconductor layer may be a P type semiconductor layer, but is not limited thereto. In addition, a semiconductor, for example, an N-type semiconductor layer (not shown) having a polarity opposite to that of the second conductive type may be formed on the second conductive type semiconductor layer. Accordingly, the light emitting structure may be implemented as any one of an N-P junction structure, a P-N junction structure, an N-P-N junction structure, and a P-N-P junction structure.

The light emitting device 100 may be disposed on the package body 205 or on the first electrode layer 213 or the second electrode layer 214.

The light emitting device chip 100 may be electrically connected to the first electrode layer 213 and / or the second electrode layer 214 by any one of wire, flip chip, and die bonding methods.

Although the light emitting device chip 100 is electrically connected to the first electrode layer 213 through the first wire and the second electrode layer 214 is electrically connected to the second electrode layer 214 through the second wire, It is not.

The molding member 230 surrounds the light emitting device chip 100 to protect the light emitting device chip 100. In addition, the molding member 230 may include a phosphor composition 232 to change the wavelength of light emitted from the light emitting device chip 100.

In the case of the phosphor of the embodiment has a light emitting area in the green region it can be applied to the purpose of implementing a white LED.

For example, when implementing a white LED using a UV LED, a UV LED chip and red, green, and blue phosphors are generally required. The phosphor of the embodiment emits green light, and thus, an essential phosphor for UV-LEDs. to be.

In addition, a method of implementing a white LED using a blue LED chip is generally a method of applying green and red phosphors on a blue LED chip, a yellow phosphor, and a blue LED chip, and applying green, red, and yellow on a blue LED chip. This phosphor is a green light emitting phosphor that is used to produce white LEDs.

By implementing the white LED using the phosphor of the embodiment, it is possible to use the white LED in the fields of mobile, automotive, lighting, BLU, medical.

Hereinafter, the manufacturing process of the phosphor composition according to the embodiment will be described and the characteristics of the embodiments will be described in more detail.

In the manufacturing process of the phosphor composition according to the embodiment, the composition comprising A _w B _x O _y N _z : RE ²⁺ is ² ≦ _w ≦ 4, 4 ≦ x ≦ 6, 2 ≦ _y ≦ 4, and 4 ≦ _z ≦ 6. Preparing a raw material by mixing and measuring the range of the mixture; and heat-treating the mixed raw materials in a reducing atmosphere at a temperature and a pressure of 300 ° C. to 1600 ° C. to synthesize a phosphor composition, and the synthesized phosphor composition Ball mill and drying after washing, wherein A comprises at least one element of Li, Mg, Ca, Sr, Ba, and La,

The B may include at least one element of B (Boron), Al, Ga, and In, and the RE may include at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm, and Lu. .

Hereinafter, a method of manufacturing an oxynitride-based phosphor composition in which a chemical formula of the oxynitride-based phosphor composition is a composition of Li ₃ Al ₅ O ₃ N ₅ : Eu ²⁺ is described, but the embodiment is not limited thereto.

First, the raw materials of Li ₂ CO ₃ , Al ₂ O ₃ , AlN, Eu ₂ O ₃ are weighed according to the composition ratio of Li ₃ Al ₅ O ₃ N ₅ : Eu ^{2 +} , and the raw materials are used to induce agate with a solvent. Mix. In the case of the phosphor according to the embodiment, the solid phase reaction method using a stable starting material has the advantage of easy manufacturing.

Synthetic atmosphere is a gas flow rate of 1000cc ~ 2000cc per minute at a synthesis temperature of 300 ℃ to 1600 ℃, for example, 1400 ℃ ~ 1600 ℃, H ₂ , N ₂ , NH ₃ etc. can be used as reducing gas have. For example, the H ₂ / N ₂ mixed gas ratio may be changed from 5% / 95% to 20% / 80% to synthesize phosphors.

For example, the phosphor of the embodiment can be synthesized for 6 hours at a synthesis temperature of about 1400 ℃ H ₂ / N ₂ at a flow rate of about 1000cc / min at 20% / 80% conditions, but is not limited thereto. .

The general nitride and oxynitride phosphors can be synthesized at high temperature and high pressure, but the phosphors of the embodiment can be synthesized at low temperature and atmospheric pressure.

For example, in a general phosphor manufacturing process, for the purpose of high performance of the phosphor, it is carried out at 1600 ° C or more and 2000 ° C or less. On the other hand, for the purpose of mass production is carried out at 1600 ℃ 1700 ℃.

On the other hand, the embodiment controls the firing temperature to a low temperature (300 ℃ to 1600 ℃ temperature), for example, a synthesis temperature of 1400 ℃ to 1600 ℃, the flow rate of the reducing gas is 5% H ₂ / N ₂ mixed gas ratio / 95% 20% / 80% by controlling, according to the example embodiment a _w B _x O _y N _z: it is possible to manufacture the phosphor composition comprising a RE ^{2 +.}

At this time, if the calcination temperature and the flow rate of the reducing gas deviate from the above, the reaction or reduction is insufficient, the color purity is lowered, and a high quality phosphor cannot be obtained.

In the embodiment, the mixed raw material may be calcined under a reducing atmosphere, but synthesis may be performed under a reducing gas atmosphere and an atmospheric pressure condition formed by a mixed gas of nitrogen and hydrogen. In particular, the color development and efficiency of the phosphor can be controlled according to the firing temperature and the supply speed of the mixed gas.

Thereafter, the calcined phosphor may proceed with a ball mill using zirconia balls, may proceed with rinsing with ethanol, and may proceed with drying for a predetermined time after washing.

The dried phosphor may analyze the light emission characteristics of the phosphor through PL analysis as shown in FIGS. 3 and 4.

3 is a light emitting device package according to the embodiment and the light emission spectrum of the prior art, Figure 4 is a spectrum of the excitation light in the light emitting device package according to the embodiment.

Specifically, as shown in FIG. 4, the oxynitride-based phosphor composition of the embodiment may be an oxynitride-based phosphor composition having an excitation wavelength of 300 nm to 460 nm.

In particular, the oxynitride-based phosphor composition of the embodiment has an intensity of 0.2 a.u. relative to the excitation light source in the wavelength range of 300 nm to 460 nm. By providing the above there is an advantage that can be widely used for UV-LED and Blue-LED.

In addition, according to the embodiment, as shown in FIG. 4, the intensity of the excitation light source may have a maximum value in the ultraviolet region UV of the 300 nm to 460 nm wavelength region.

Advantages Also, as one of the distinguishing features of the prior art, the oxynitride-based phosphor composition according to the present embodiment is characterized in that the excitation wavelength of the oxynitride-based phosphor exhibits the maximum intensity in the visible region. Intensity has a maximum value that can be utilized for UV-LED.

In addition, the oxynitride-based phosphor composition according to the embodiment may be an oxynitride-based phosphor composition having a light emission center wavelength of 530 nm or less as shown in FIG. 3.

For example, the oxynitride-based phosphor composition may be an oxynitride-based phosphor composition that emits green light having a center wavelength of 525 nm and a half width of 92 nm with respect to an excitation wavelength of 450 nm.

3 is a light emission spectrum E and a light emission spectrum R of the prior art of the light emitting device package according to the embodiment.

As described above, the commercially available green oxynitride phosphors have a limited type, and emit light in a wavelength range of about 540 nm, and have difficulty in shifting wavelengths to short wavelengths.

In particular, in the case of commercially used oxynitride phosphors, since the center wavelength is about 543 nm, it is difficult to move it to short wavelength below 530 nm. Accordingly, in the LED industry, green phosphors require green oxynitride phosphors of less than 530 nm in the direction of increasing the color rendering index, but do not satisfy them.

On the other hand, according to the prior art, even though the wavelength can be shifted to less than 530nm as the silicate phosphor, the silicate phosphor has a large decrease in the luminance of the phosphor at high temperature, so that the efficiency of the phosphor is greatly reduced, making it difficult to use for high power. There is.

Accordingly, an embodiment provides an oxynitride-based phosphor composition having a high color rendering index, a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

Specifically, an embodiment provides an oxynitride-based phosphor composition having a light emission central wavelength of less than 530 nm, a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

To this end, in the case of the oxynitride-based phosphor composition according to the embodiment, for example, the phosphor of Li ₃ Al ₅ O ₃ N ₅ : Eu ²⁺ as shown in Figure 3 the emission wavelength is 480nm ~ 570nm region, in particular the emission center wavelength Green phosphors can be provided that are less than 530 nm (eg 525 nm) and have a half width of about 92 nm.

The light emission spectrum of the light emitting device package according to the embodiment has a high color rendering index and a light emission center wavelength of less than 530 nm compared with the light emission spectrum of the prior art, a method of manufacturing the same, and a method of manufacturing the same; Can provide lighting system.

In addition, the embodiment may provide an oxynitride-based phosphor composition and a method for manufacturing the same, and a light emitting device package and a lighting system including the same.

5 to 7 are views showing a lighting apparatus according to an embodiment.

FIG. 5 is a perspective view of the illumination device according to the embodiment viewed from above, FIG. 6 is a perspective view of the illumination device shown in FIG. 5, and FIG. 7 is an exploded perspective view of the illumination device shown in FIG.

5 to 7, the lighting apparatus according to the embodiment includes a cover 2100, a light source module 2200, a heat discharger 2400, a power supply unit 2600, an inner case 2700, a socket 2800, . ≪ / RTI > Further, the illumination device according to the embodiment may further include at least one of the member 2300 and the holder 2500. The light source module 2200 may include a light emitting device or a light emitting device package according to the embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape in which the hollow is hollow and a part is opened. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the heat discharging body 2400. The cover 2100 may have an engaging portion that engages with the heat discharging body 2400.

The inner surface of the cover 2100 may be coated with a milky white paint. Milky white paints may contain a diffusing agent to diffuse light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is for sufficiently diffusing and diffusing the light from the light source module 2200 and emitting it to the outside.

The cover 2100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 2100 may be transparent so that the light source module 2200 is visible from the outside, and may be opaque. The cover 2100 may be formed by blow molding.

The light source module 2200 may be disposed on one side of the heat discharging body 2400. Accordingly, heat from the light source module 2200 is conducted to the heat discharger 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on the upper surface of the heat discharging body 2400 and has guide grooves 2310 through which the plurality of light source portions 2210 and the connector 2250 are inserted. The guide groove 2310 corresponds to the substrate of the light source unit 2210 and the connector 2250.

The surface of the member 2300 may be coated or coated with a light reflecting material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 is reflected on the inner surface of the cover 2100 to reflect the light returned to the light source module 2200 side again toward the cover 2100. Therefore, the light efficiency of the illumination device according to the embodiment can be improved.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Therefore, electrical contact can be made between the heat discharging body 2400 and the connecting plate 2230. The member 2300 may be formed of an insulating material to prevent an electrical short circuit between the connection plate 2230 and the heat discharging body 2400. The heat discharger 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to dissipate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating portion 2710 of the inner case 2700. Therefore, the power supply unit 2600 housed in the insulating portion 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside to provide the light source module 2200. The power supply unit 2600 is housed in the receiving groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide portion 2630 may be inserted into the holder 2500. A plurality of components may be disposed on one side of the base 2650. The plurality of components include, for example, a DC converter for converting AC power supplied from an external power source into DC power, a driving chip for controlling driving of the light source module 2200, an ESD (ElectroStatic discharge) protective device, and the like, but the present invention is not limited thereto.

The extension portion 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension portion 2670 may be provided to be equal to or smaller than the width of the connection portion 2750 of the inner case 2700. One end of each of the positive wire and the negative wire is electrically connected to the extension portion 2670 and the other end of the positive wire and the negative wire are electrically connected to the socket 2800 .

The inner case 2700 may include a molding part together with the power supply part 2600. The molding part is a hardened portion of the molding liquid so that the power supply unit 2600 can be fixed inside the inner case 2700.

8 and 9 are views showing another example of the lighting apparatus according to the embodiment.

Fig. 8 is a perspective view of a lighting apparatus according to an embodiment, and Fig. 9 is an exploded perspective view of the lighting apparatus shown in Fig.

8 and 9, the illumination device according to the embodiment includes a cover 3100, a light source portion 3200, a heat sink 3300, a circuit portion 3400, an inner case 3500, and a socket 3600 . The light source unit 3200 may include a light emitting device or a light emitting device package according to the embodiment.

The cover 3100 has a bulb shape and is hollow. The cover 3100 has an opening 3110. The light source unit 3200 and the member 3350 can be inserted through the opening 3110. [

The cover 3100 may be coupled to the heat discharging body 3300 and surround the light source unit 3200 and the member 3350. The light source part 3200 and the member 3350 may be shielded from the outside by the combination of the cover 3100 and the heat discharging body 3300. The coupling between the cover 3100 and the heat discharging body 3300 may be combined through an adhesive, or may be combined by various methods such as a rotational coupling method and a hook coupling method. The rotation coupling method is a method in which the cover 3100 is coupled with the heat discharging body 3300 by the rotation of the cover 3100 in such a manner that the thread of the cover 3100 is engaged with the thread groove of the heat discharging body 3300 In the hook coupling method, the protrusion of the cover 3100 is inserted into the groove of the heat discharging body 3300, and the cover 3100 and the heat discharging body 3300 are coupled.

The cover 3100 is optically coupled to the light source unit 3200. Specifically, the cover 3100 may diffuse, scatter, or excite light from the light emitting device 3230 of the light source unit 3200. The cover 3100 may be a kind of optical member. Here, the cover 3100 may have a phosphor on the inside / outside or inside to excite the light from the light source unit 3200.

The inner surface of the cover 3100 may be coated with a milky white paint. Here, the milky white paint may include a diffusing agent for diffusing light. The surface roughness of the inner surface of the cover 3100 may be larger than the surface roughness of the outer surface of the cover 3100. This is for sufficiently scattering and diffusing light from the light source part 3200.

The cover 3100 may be made of glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance and strength. The cover 3100 may be a transparent material that can be seen from the outside of the light source unit 3200 and the member 3350, and may be an invisible and opaque material. The cover 3100 may be formed, for example, by blow molding.

The light source unit 3200 is disposed on the member 3350 of the heat sink 3300 and may be disposed in a plurality of units. Specifically, the light source portion 3200 may be disposed on at least one of the plurality of side surfaces of the member 3350. In addition, the light source 3200 may be disposed at an upper end of the side of the member 3350.

In Figure 9, the light source 3200 may be disposed on three of the six sides of the member 3350. However, the present invention is not limited thereto, and the light source portion 3200 may be disposed on all the sides of the member 3350. The light source unit 3200 may include a substrate 3210 and a light emitting device 3230. The light emitting device 3230 may be disposed on one side of the substrate 3210.

The substrate 3210 has a rectangular plate shape, but is not limited thereto and may have various shapes. For example, the substrate 3210 may have a circular or polygonal plate shape. The substrate 3210 may be a printed circuit pattern on an insulator. For example, the substrate 3210 may be a printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB . ≪ / RTI > In addition, it is possible to use a Chips On Board (COB) type that can directly bond the LED chip unpacked on the printed circuit board. In addition, the substrate 3210 may be formed of a material that efficiently reflects light, or may be formed of a color whose surface efficiently reflects light, for example, white, silver, or the like. The substrate 3210 may be electrically connected to the circuit unit 3400 housed in the heat discharging body 3300. The substrate 3210 and the circuit portion 3400 may be connected, for example, via a wire. The wire may pass through the heat discharging body 3300 to connect the substrate 3210 and the circuit unit 3400.

The light emitting device 3230 may be a light emitting diode chip that emits red, green, or blue light, or a light emitting diode chip that emits UV light. Here, the light emitting diode chip may be a lateral type or a vertical type, and the light emitting diode chip may emit blue, red, yellow, or green light. .

The light emitting device 3230 may have a phosphor. The phosphor may be at least one of a garnet system (YAG, TAG), a silicate system, a nitride system, and an oxynitride system. Alternatively, the fluorescent material may be at least one of a yellow fluorescent material, a green fluorescent material, and a red fluorescent material.

The heat discharging body 3300 may be coupled to the cover 3100 to dissipate heat from the light source unit 3200. The heat discharging body 3300 has a predetermined volume and includes an upper surface 3310 and a side surface 3330. A member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. An upper surface 3310 of the heat discharging body 3300 can be engaged with the cover 3100. The upper surface 3310 of the heat discharging body 3300 may have a shape corresponding to the opening 3110 of the cover 3100.

A plurality of radiating fins 3370 may be disposed on the side surface 3330 of the heat discharging body 3300. The radiating fin 3370 may extend outward from the side surface 3330 of the heat discharging body 3300 or may be connected to the side surface 3330. The heat dissipation fin 3370 may increase the heat dissipation area of the heat dissipator 3300 to improve heat dissipation efficiency. Here, the side surface 3330 may not include the radiating fin 3370.

The member 3350 may be disposed on the upper surface 3310 of the heat discharging body 3300. The member 3350 may be integral with the top surface 3310 or may be coupled to the top surface 3310. The member 3350 may be a polygonal pillar. Specifically, the member 3350 may be a hexagonal column. The hexagonal column member 3350 has an upper surface, a lower surface, and six sides. Here, the member 3350 may be a circular column or an elliptic column as well as a polygonal column. When the member 3350 is a circular column or an elliptic column, the substrate 3210 of the light source portion 3200 may be a flexible substrate.

The light source unit 3200 may be disposed on six sides of the member 3350. The light source unit 3200 may be disposed on all six side surfaces, or the light source unit 3200 may be disposed on some of the six side surfaces. In FIG. 15, the light source unit 3200 is disposed on three side surfaces of the six side surfaces.

The substrate 3210 is disposed on a side surface of the member 3350. The side surface of the member 3350 may be substantially perpendicular to the upper surface 3310 of the heat discharging body 3300. Accordingly, the upper surface 3310 of the substrate 3210 and the heat discharging body 3300 may be substantially perpendicular to each other.

The material of the member 3350 may be a material having thermal conductivity. This is to receive the heat generated from the light source 3200 quickly. The material of the member 3350 may be, for example, aluminum (Al), nickel (Ni), copper (Cu), magnesium (Mg), silver (Ag), tin (Sn)

Or the member 3350 may be formed of a thermally conductive plastic having thermal conductivity. Thermally conductive plastics are lighter than metals and have the advantage of having unidirectional thermal conductivity.

The circuit unit 3400 receives power from the outside and converts the supplied power to the light source unit 3200. The circuit unit 3400 supplies the converted power to the light source unit 3200. The circuit unit 3400 may be disposed on the heat discharging body 3300. Specifically, the circuit unit 3400 may be housed in the inner case 3500 and stored in the heat discharging body 3300 together with the inner case 3500. The circuit unit 3400 may include a circuit board 3410 and a plurality of components 3430 mounted on the circuit board 3410.

The circuit board 3410 has a circular plate shape, but is not limited thereto and may have various shapes.

For example, the circuit board 3410 may be in the shape of an oval or polygonal plate. Such a circuit board 3410 may be one in which a circuit pattern is printed on an insulator. The circuit board 3410 is electrically connected to the substrate 3210 of the light source unit 3200. The electrical connection between the circuit board 3410 and the substrate 3210 may be connected by wire, for example.

The wires may be disposed inside the heat discharging body 3300 to connect the circuit board 3410 and the substrate 3210. The plurality of components 3430 include, for example, a DC converter for converting AC power supplied from an external power source to DC power, a driving chip for controlling the driving of the light source 3200, An electrostatic discharge (ESD) protection device, and the like.

The inner case 3500 houses the circuit portion 3400 therein. The inner case 3500 may have a receiving portion 3510 for receiving the circuit portion 3400. The receiving portion 3510 may have a cylindrical shape as an example.

The shape of the accommodating portion 3510 may vary depending on the shape of the heat discharging body 3300. The inner case 3500 may be housed in the heat discharging body 3300. The receiving portion 3510 of the inner case 3500 may be received in a receiving portion formed on the lower surface of the heat discharging body 3300.

The inner case 3500 may be coupled to the socket 3600. The inner case 3500 may have a connection portion 3530 that engages with the socket 3600.

The connection portion 3530 may have a threaded structure corresponding to the thread groove structure of the socket 3600. The inner case 3500 is an insulator. Therefore, electrical short circuit between the circuit portion 3400 and the heat discharging body 3300 is prevented. For example, the inner case 3500 may be formed of plastic or resin.

The socket 3600 may be coupled to the inner case 3500. Specifically, the socket 3600 may be engaged with the connection portion 3530 of the inner case 3500. The socket 3600 may have a structure such as a conventional conventional incandescent bulb.

The circuit portion 3400 and the socket 3600 are electrically connected. The electrical connection between the circuit part 3400 and the socket 3600 may be connected via a wire. Accordingly, when external power is applied to the socket 3600, the external power may be transmitted to the circuit unit 3400. The socket 3600 may have a screw groove structure corresponding to the threaded structure of the connection portion 3550.

10 is an exploded perspective view 1200 of a backlight unit according to an embodiment. However, the backlight unit 1200 of FIG. 10 is an example of the illumination system and is not limited thereto.

The backlight unit 1200 according to the embodiment includes a light guide plate 1210, a light emitting module unit 1240 that provides light to the light guide plate 1210, a reflective member 1220 under the light guide plate 1210, and the light guide plate. 1210, a bottom cover 1230 for accommodating the light emitting module unit 1240 and the reflective member 1220, but is not limited thereto.

The light guide plate 1210 serves to diffuse light into a surface light source. The light guide plate 1210 may be made of a transparent material such as acrylic resin such as PMMA (polymethyl methacrylate), polyethylene terephthalate (PET), polycarbonate (PC), cycloolefin copolymer (COC), and polyethylene naphthalate Resin. ≪ / RTI >

The light emitting module unit 1240 provides light to at least one side of the light guide plate 1210 and ultimately serves as a light source of a display device in which the backlight unit is installed.

The light emitting module 1240 may be in contact with the light guide plate 1210, but is not limited thereto. Specifically, the light emitting module 1240 includes a substrate 1242 and a plurality of light emitting device packages 200 mounted on the substrate 1242. The substrate 1242 is mounted on the light guide plate 1210, But is not limited to.

The substrate 1242 may be a printed circuit board (PCB) including a circuit pattern (not shown). However, the substrate 1242 may include not only a general PCB, but also a metal core PCB (MCPCB), a flexible PCB (FPCB), and the like.

The plurality of light emitting device packages 200 may be mounted on the substrate 1242 such that a light emitting surface on which the light is emitted is spaced apart from the light guiding plate 1210 by a predetermined distance.

The reflective member 1220 may be formed under the light guide plate 1210. The reflection member 1220 reflects the light incident on the lower surface of the light guide plate 1210 so as to face upward, thereby improving the brightness of the backlight unit. The reflective member 1220 may be formed of, for example, PET, PC, or PVC resin, but is not limited thereto.

The bottom cover 1230 may receive the light guide plate 1210, the light emitting module 1240, and the reflective member 1220. For this purpose, the bottom cover 1230 may be formed in a box shape having an opened upper surface, but the present invention is not limited thereto.

The bottom cover 1230 may be formed of a metal material or a resin material, and may be manufactured using a process such as press molding or extrusion molding.

Embodiments can provide an oxynitride-based phosphor composition having a high color rendering index and a method of manufacturing the same, and a light emitting device package and an illumination system including the same.

In addition, the embodiment can provide an oxynitride-based phosphor composition having a light emitting center wavelength of less than 530nm and a method for manufacturing the same, and a light emitting device package and an illumination system including the same.

In addition, the embodiment may provide an oxynitride-based phosphor composition and a method for manufacturing the same, and a light emitting device package and a lighting system including the same.

The features, structures, effects and the like described in the embodiments are included in at least one embodiment and are not necessarily limited to only one embodiment. Furthermore, the features, structures, effects, and the like illustrated in the embodiments may be combined or modified with respect to other embodiments by those skilled in the art to which the embodiments belong.

Accordingly, the contents of such combinations and modifications should be construed as being included in the scope of the embodiments.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. It can be seen that the modification and application of branches are possible.

For example, each component specifically shown in the embodiments can be modified and implemented. It is to be understood that the present invention may be embodied in many other specific forms without departing from the spirit or essential characteristics thereof.

Light emitting device package 200, package body portion 205
Light Emitting Diode Chip 100, Phosphor Composition 232
Molding member 230

Claims (16)

A _w B _x O _y N _z : Represented by the chemical formula of RE ^{2 +} (2≤w≤4, 4≤x≤6, 2≤y≤4, 4≤z≤6),
A comprises at least one element of Li, Mg, Ca, Sr, Ba and La,
B includes at least one element of B (Boron), Al, Ga, and In,
RE is an oxynitride-based phosphor composition comprising at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm and Lu. The method according to claim 1,
The oxynitride-based phosphor composition
An oxynitride-based phosphor composition having a wavelength range of 300 nm to 460 nm as an excitation wavelength. The method of claim 2,
The oxynitride-based phosphor composition
An oxynitride-based phosphor composition having an intensity of an excitation light source in a UV region of the 300 nm to 460 nm wavelength region having a maximum value. The method of claim 2,
The oxynitride-based phosphor composition
An oxynitride-based phosphor composition having an intensity of an excitation light source of 0.2 au or more with respect to an excitation light source in the wavelength range of 300 nm to 460 nm. 3. The method according to claim 1 or 2,
The oxynitride-based phosphor composition
An oxynitride-based phosphor composition having a light emitting center wavelength of 530 nm or less in green. 6. The method of claim 5,
The oxynitride-based phosphor composition
An oxynitride-based phosphor composition that emits green light with an emission center wavelength of 525 nm with respect to an excitation wavelength of 450 nm. The method of claim 6,
The oxynitride-based phosphor composition,
An oxynitride-based phosphor composition having a emission center wavelength of 525 nm and a half width of 92 nm with respect to an excitation wavelength of 450 nm. 5. The method according to any one of claims 1 to 4,
Chemical formula of the oxynitride-based phosphor composition is
_{Li 3 Al 5 O 3 N 5} : Eu 2 + composition of the oxynitride-based fluorescent material of the composition. 6. The method of claim 5,
Chemical formula of the oxynitride-based phosphor composition is
_{Li 3 Al 5 O 3 N 5} : Eu 2 + composition of the oxynitride-based fluorescent material of the composition. A _w B _x O _y N _z : The composition containing RE ^{2 +} is weighed in the range of 2≤w≤4, 4≤x≤6, 2≤y≤4, and 4≤z≤6, and then mixed. Preparing to;
Heat treating the mixed raw materials in a reducing atmosphere at a temperature of 300 ° C. to 1600 ° C. and atmospheric pressure to synthesize a phosphor composition;
And a ball mill and drying the synthesized phosphor composition after washing.
A includes at least one element of Li, Mg, Ca, Sr, Ba, and La,
B includes at least one element of B (Boron), Al, Ga and In,
The RE is a method for producing an oxynitride-based phosphor composition comprising at least one element of Ce, Sm, Eu, Yb, Dy, Gd, Tm and Lu. The method of claim 10,
The oxynitride-based phosphor composition
_{Li 3 Al 5 O 3 N 5} : Eu ^{2 +} of the method of producing the composition of oxynitride-based fluorescent material of the composition. The method according to claim 10 or 11,
The oxynitride-based phosphor composition
A method for producing an oxynitride-based phosphor composition having a wavelength range of 300 nm to 460 nm as an excitation wavelength. 13. The method of claim 12,
The oxynitride-based phosphor composition
The method of manufacturing an oxynitride-based fluorescent composition having an intensity of the excitation light source in the ultraviolet region (UV) of the 300nm ~ 460nm wavelength region having a maximum value. 13. The method of claim 12,
The oxynitride-based phosphor composition
About the excitation light source in the wavelength range of 300 nm to 460 nm
A method for producing an oxynitride-based phosphor composition having an intensity of an excitation light source of 0.2 au or more. 13. The method of claim 12,
The oxynitride-based phosphor composition
A method for producing an oxynitride-based phosphor composition having a light emission center wavelength of 530 nm or less. 16. The method of claim 15,
The oxynitride-based phosphor composition
A method for producing an oxynitride-based phosphor composition which emits green light with a central emission wavelength of 525 nm with respect to an excitation wavelength of 450 nm.

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