KR20130123122A - Flux composition for solder - Google Patents
Flux composition for solder Download PDFInfo
- Publication number
- KR20130123122A KR20130123122A KR1020120046295A KR20120046295A KR20130123122A KR 20130123122 A KR20130123122 A KR 20130123122A KR 1020120046295 A KR1020120046295 A KR 1020120046295A KR 20120046295 A KR20120046295 A KR 20120046295A KR 20130123122 A KR20130123122 A KR 20130123122A
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- South Korea
- Prior art keywords
- acid
- flux composition
- group
- activator
- compounds
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0255—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in welding
- B23K35/0261—Rods, electrodes, wires
- B23K35/0266—Rods, electrodes, wires flux-cored
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63488—Polyethers, e.g. alkylphenol polyglycolether, polyethylene glycol [PEG], polyethylene oxide [PEO]
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/34—Esters of acyclic saturated polycarboxylic acids having an esterified carboxyl group bound to an acyclic carbon atom
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention (a) a resin comprising a gum rosin and rosin ester; (b) an activator comprising a carboxylic acid group; (c) corrosion inhibitors including sugar alcohol compounds; And (d) a solvent selected from the group consisting of glycol ether compounds, ester compounds and ketone compounds.
Description
The present invention relates to a flux composition for soldering.
Generally, in soldering of printed circuit boards, diffusion of solder into metals to be soldered by removing contaminants on metals to be soldered or materials that interfere with soldering operations, such as oxides, and reducing surface tension during soldering. This is done and the substrate is pretreated with flux to improve wetting.
There are a variety of known fluxes used for the pretreatment. For example, Korean Patent Publication No. 10-2008-0022058 discloses a flux composition for soldering comprising an activator comprising a base resin and an oxygen-containing heterocyclic compound. However, the composition has a disadvantage in that the base resin content is low and the coating property and wettability of the substrate are poor. In addition, Korean Patent Publication No. 10-2007-0043869 discloses a solder bonding flux comprising a resin, an activator, a solvent, tetrazole or a derivative thereof. However, the flux has a disadvantage in that the reflow profile is not good because of poor activity.
An object of the present invention is to provide a flux composition excellent in coating property and wettability of a substrate to enable excellent reflow profile formation and excellent corrosion protection against metal wiring such as copper and aluminum.
An object of the present invention is to provide a flux composition having excellent solubility, removal property, solderability, and solderability of various oxides and contaminants adhering to a substrate.
The present invention
(a) resins comprising gumozin and rosin esters;
(b) an activator comprising a carboxylic acid group;
(c) corrosion inhibitors including sugar alcohol compounds; And
(d) Provided is a braze flux composition comprising a solvent selected from the group consisting of glycol ether compounds, ester compounds and ketone compounds.
The flux composition of the present invention is excellent in coating property and wettability on the substrate to provide an excellent reflow profile.
In addition, the flux composition of the present invention includes an anticorrosive agent containing a sugar alcohol compound, thereby providing an excellent anticorrosion effect on metal wiring such as copper and aluminum. In addition, the flux composition of the present invention is excellent in the ability to remove various oxides and contaminants adhering to the substrate, has a low incidence of defects such as bridges during soldering, and the solvent in the flux composition evaporates quickly and most fluxes during soldering Since it is washed off after the reduction, it provides an effect of minimizing the flux residue remaining on the substrate.
In addition, the flux composition of the present invention is excellent in insulation because it does not undergo chemical reaction with metal, and provides excellent soldering reliability.
1 is a Hitachi scanning micrograph showing a reflow profile when the flux composition of Example 1 is used.
2 is a Hitachi scanning micrograph showing a reflow profile when the flux composition of Comparative Example 3 is used.
Hereinafter, the present invention will be described in detail.
The braze flux composition of the present invention comprises (a) resin, (b) activator (c) corrosion inhibitor and (d) solvent.
The resin (a) included in the braze flux composition of the present invention is a base of the braze flux composition, which removes an oxide film from the metal surface to be soldered, reduces surface tension to the solder and lowers the melting point, while the property of the metal surface. It acts to prevent anger.
The resin (a) includes gum rosin and rosin ester. In particular, it consists of gum rosin and rosin ester. The gumozin has a high acid value and good activity, which is effective for removing an oxide of a metal, and the rosin ester provides an excellent effect on improving a reflow profile.
The gum rosin and rosin esters contained in the resin (a) are preferably included in a weight ratio of 6: 4 to 9: 1. If the content of gum rosin and rosin ester is out of the above range or the content of gum rosin is excessive or insufficient, a problem occurs that causes a bad profile of the bump ball, and if the content of rosin ester is excessive or insufficient, the profile of the bump ball is poor. And problems of flux solubility may occur.
It is preferable that the said (a) resin is contained in 0.5 to 70 weight% with respect to the total weight of a soldering flux composition, and it is more preferable to be contained in 10 to 60 weight%. If the above range is satisfied, the oxide film can be removed from the metal surface to be soldered. In addition, it is possible to reduce the surface tension to the solder, lower the melting point, and prevent reoxidation of the metal surface. In addition, the bump ball (Bump ball) can be sufficiently covered, the coating is good, and no bump ball profile defects.
The (b) activator included in the braze flux composition of the present invention is used to compensate for the characteristics of the resin, which has weak chemical activity and is somewhat poor in wettability or fluidity during the actual brazing operation. In addition, the (b) activator allows the flux to remove oxides from the metal surface to be soldered. In addition, the (b) activator is weakly acidic compared to halide-containing activators such as amine hydrohalides such as amine hydrochloride and amine hydrobromide, which are commonly used in the conventional electronics industry, and thus do not contain Cl or Br. It does not cause corrosion reactions to the underlying substrate and the solder metal.
The (b) activator includes a carboxylic acid group, specifically, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid (adipic acid, pimeric acid, suberic acid, azelaic acid, sebacic acid, sebic acid, acetic acid, propionic acid, ka Capric acid, heptanoic acid, lauric acid, myritic acid, myristic acid, palmitic acid, stearic acid, arachinic acid, It is preferably selected from the group consisting of behenic acid, glycolic acid, glycolic acid, lactic acid, malic aicd, citric acid and tartaric acid. Of these, succinic acid, glutaric acid, adipic acid, capric acid and heptanoic acid are more preferred, and glutaric acid, adipic acid and heptanoic acid are most preferred. This is because the above-mentioned activators can impart excellent soldering performance, minimum ionic impurity residual characteristics, high surface insulation resistance characteristics, and the like to the soldering flux composition.
The activator (b) is preferably contained in 1 to 10% by weight, more preferably in 1 to 5% by weight based on the total weight of the flux composition. If included below the above-mentioned range, it may not provide sufficient flux activation. Inclusion in excess of the above-described ranges may cause gloss deterioration and excess residue, and may increase corrosiveness and adversely affect the soldered final assembly.
The (b) activator may further comprise a nonionic covalent organic halide activator. The nonionic covalent organic halogenated activator helps to reflow at lower temperatures by reducing the temperature at which interaction between the activating component and the base component is initiated. The organic halide activator is preferably a bromide activator. The bromide activator preferably comprises one selected from the group consisting of trans-2,3-dibromo-2-butene-1,4-diol (DBD), styrene bromide and the like.
The (c) corrosion inhibitor included in the braze flux composition of the present invention contains a sugar alcohol compound. The (c) corrosion inhibitor serves to prevent corrosion of copper and aluminum. That is, the flux composition and copper ions and / or aluminum ions, which may occur when an acidic functional group included in the activator (b), such as a carboxylic acid, are dissociated by the solvent (d) so that the flux composition is acidic, In the reaction, the sugar alcohol compound interferes.
The sugar alcohol compound is preferably one or two or more selected from the group consisting of xylitol, mannitol, sorbitol, erythritol, pentitol, arabitol and talitol.
It is preferable that it is 0.01-5 weight% with respect to the total weight of a flux composition, and, as for said (c) corrosion inhibitor, it is more preferable that it is 0.1-3 weight%. If included below the above range, corrosion of copper and / or aluminum does not occur. If it exceeds the above-mentioned range, it is not preferable in terms of cost.
The solvent (d) contained in the braze flux composition of the present invention is selected from the group consisting of glycol ether compounds, ester compounds and ketone compounds.
The solvent (d) can solve the problems such as air pollution problems of volatile organic compounds (VOC), such as isopropyl alcohol, which is used as a solvent for flux composition, and investment cost of a separate pollution prevention facility, and a safety aspect. Non-flammable, non-explosive, low toxicity and competitive in price. In addition, the (d) solvent not only has no risk of flammability and explosion but also improves the wettability of the solder and the like.
The glycol ether compound includes propylene glycol monomethyl ether and the like, and is preferably propylene glycol monomethyl ether.
The ester compound is preferably selected from the group consisting of, for example, glycol ether ester compounds, cyclic ester compounds, ethyl lactate, butyl acetate, amyl acetate, and ethyl pyruvate, wherein the glycol ether ester compounds Ethylcellosolve acetate, methylcellosolve acetate and propylene glycol monomethyl ether acetate.
The ketone compound is preferably selected from the group consisting of acetone, methyl isobutyl ketone, 2-heptanone, clohexanone, and γ-butyrolactone, for example.
Among these, propylene glycol monomethyl ether acetate and propylene glycol monomethyl ether are more preferable.
The solvent (d) is preferably contained in the remaining amount so that the total weight of the flux composition is 100% by weight.
In addition, the flux composition of the present invention may further include various additives such as corrosion inhibitors, dyes, blowing agents and / or defoamers, biocides, sensitizers, other resins, surfactants, stabilizers, and the like, which are commonly used in the art. .
Hereinafter, the present invention will be described in more detail by way of examples. However, the following examples are intended to further illustrate the present invention, and the scope of the present invention is not limited by the following examples. The following examples can be appropriately modified and changed by those skilled in the art within the scope of the present invention.
Example 1 To 6, Comparative Example 1 To 6: soldering Flux Preparation of the composition
The components shown in Table 1 were each weighed in the amounts shown in the blender and stirred at 60 ° C. for 2 hours to completely dissolve the rosin and the additives to prepare a braze flux composition.
(weight%)
week)
A-1: gum rosin (trade name: DX-100; product from Latontoria)
A-2: Rosin ester (KE-311: Arakawa Chemical, Japan)
A-3: Dehydrogenated rosin (DX-800H: product from Latontoria)
B-1: Glutaric acid (Aldrich)
B-2: Ethylamine hydrochloride (Aldrich)
C-1: Mannitol (manufactured by Aldrich)
C-2: Sorbitol (Aldrich)
Test Example One: Flux Evaluation of the properties of the composition
1) Evaluate Bump Ball Reflow Profile
The flux solutions of Examples 1 to 6 and Comparative Examples 1 to 6 were applied onto a solder substrate on which the baffle ball process was performed. Thereafter, after reflowing the solder while undergoing a heat treatment at 250 ° C., the substrate in which the flux residue remaining on the substrate remained was immersed in the flux residue removal cleaning solution for 5 minutes. Thereafter, the deposited substrate was taken out and the spray cleaning process was performed for 3 minutes by the spray equipment. At this time, the temperature of the cleaning liquid was 70 ℃ and the spray pressure was 0.3PMa. After washing with water, the leaf profile of the bump balls on the substrate was observed by scanning electron microscopy (SEM). The results are shown in Table 2. In Table 2, when the profile is excellent: ◎, excellent: ○, normal: Δ, and bad: X.
2) Copper Corrosion Evaluation of Flux
First, a silicon substrate on which a copper single layer was formed was deposited on the flux composition of Examples 1 to 6 and Comparative Examples 1 to 6 for 10 minutes. At this time, the temperature of the flux composition was 70 ℃ and the thickness of the copper film was measured before and after deposition, and the degree of corrosion of the copper film was calculated from the change in the thickness of the copper film. The results are shown in Table 2.
When copper is not corroded in Table 2 below: ◎, when copper is less than 10%: ○, when copper is 10 to 50%: Δ, and when copper is more than 50%: Marked by X.
3) Evaluation of flux corrosive aluminum
First, a silicon substrate on which an aluminum single layer was formed was deposited on the flux composition of Examples 1 to 6 and Comparative Examples 1 to 6 for 10 minutes. At this time, the temperature of the flux composition was 70 ℃ and the thickness of the aluminum film was measured before and after deposition, and the degree of corrosion of the aluminum film was calculated by calculating from the thickness change of the aluminum film. The results are shown in Table 2.
In Table 2 below, when aluminum is not corroded: ◎, when aluminum is corroded to less than 10%: ○, when aluminum is corroded by 10 to 50%: Δ, and when aluminum is corroded by more than 50% Marked by X.
Referring to Table 2, it can be seen that Examples 1 to 6 according to the present invention are excellent in both flux reflow profile and copper and aluminum corrosion. On the other hand, Comparative Examples 1 to 6 can be seen that the flux reflow profile and / or the corrosion of copper and aluminum is not excellent.
On the other hand, Figure 1 is a Hitachi scanning micrograph showing a reflow profile when using the flux composition of Example 1, Figure 2 is a Hitachi scanning micrograph showing a reflow profile when using the flux composition of Comparative Example 3, According to these drawings, in the case of the flux composition of Example 1, the flux is round spherical shape, and when the flux composition of Comparative Example 3 is used, it is confirmed that the flux is not round spherical and is crushed.
Claims (7)
(b) an activator comprising a carboxylic acid group;
(c) corrosion inhibitors including sugar alcohol compounds; And
(d) A soldering flux composition comprising a solvent selected from the group consisting of glycol ether compounds, ester compounds and ketone compounds.
The rosin and rosin esters included in the resin (a) are contained in a weight ratio of 6: 4 to 9: 1.
The activator including the carboxylic acid group, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimeric acid, pimeric acid), suberic acid, azelaic acid, sebacic acid, acetic acid, propionic acid, capric acid, heptanoic acid ( heptanoic acid, lauric acid, myristic acid, palmitic acid, stearic acid, arachiic acid, arachic acid, behenic acid, glycolic acid ( Soldering plus composition, characterized in that selected from the group consisting of glycolic acid, lactic acid (lactic acid), malic acid (malic aicd), citric acid (citric acid) and tartaric acid (tartaric acid).
And (b) the activator further comprises a nonionic covalent organic halide activator.
The sugar alcohol compound is brazing flux composition, characterized in that one or two or more selected from the group consisting of xylitol, mannitol, sorbitol, erythritol, pentitol, arabitol and talitol.
The glycol ether compound is propylene glycol monomethyl ether;
The ester compound is selected from the group consisting of glycol ether ester compounds, cyclic ester compounds, ethyl lactate, butyl acetate, amyl acetate and ethyl pyruvate, wherein the glycol ether ester compound is ethyl cellosolve acetate , Methylcellosolve acetate and propylene glycol monomethyl ether acetate;
The ketone compound is a solder flux composition, characterized in that selected from the group consisting of acetone, methyl isobutyl ketone, 2-heptanone, clohexanone, and γ-butyrolactone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120046295A KR20130123122A (en) | 2012-05-02 | 2012-05-02 | Flux composition for solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020120046295A KR20130123122A (en) | 2012-05-02 | 2012-05-02 | Flux composition for solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130123122A true KR20130123122A (en) | 2013-11-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120046295A KR20130123122A (en) | 2012-05-02 | 2012-05-02 | Flux composition for solder |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20130123122A (en) |
-
2012
- 2012-05-02 KR KR1020120046295A patent/KR20130123122A/en not_active Application Discontinuation
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