KR20130120239A - Method for manufacturing fe-ni substrate for oled with improved lifetime - Google Patents

Abstract

The present invention relates to an Fe-Ni alloy substrate for a flexible OLED display, a manufacturing method thereof, and an OLED. Provided are a flexible OLED, a metal substrate for a flexible OLED, and a method for manufacturing the metal substrate for a flexible OLED which comprises the steps of: controlling surface roughness by electrolytically polishing a conductive mother substrate; forming a metal foil on the conductive mother substrate by horizontally supplying the conductive mother substrate in one direction, supplying an electrolyte between the conductive mother substrate and an anode which is separated from one side or both sides of the conductive mother substrate, and applying a current to the conductive mother substrate and the anode; and manufacturing the metal substrate by stripping the metal foil.

Description

FIELD OF THE INVENTION [0001] The present invention relates to an Fe-Ni substrate for OLED,

The present invention relates to a Fe-Ni alloy substrate for a flexible OLED display, a method of manufacturing the same, and an OLED, and more particularly, to a method of manufacturing a metal substrate for a flexible OLED having excellent flatness using electrolytic polishing.

In recent years, as society has entered into a full-fledged information age, a display field for processing and displaying a large amount of information has rapidly developed, and various flat panel displays have been developed in response to this.

Examples of such a flat panel display device include a liquid crystal display device (LCD), a plasma display panel device (PDP), a field emission display device (FED) An electroluminescence display device (ELD), and an organic light emitting diode (OLED). These flat panel display devices are used not only for home appliances such as televisions and videos but also for various applications such as computers such as notebook computers and industrial fields such as mobile phones.

Such a flat panel display device exhibits excellent performance in reducing thickness, weight, and power consumption, thereby quickly replacing a cathode ray tube (CRT) used in the past. In particular, since OLEDs emit light by themselves and can be driven at a low voltage, they are rapidly applied to small display devices such as portable devices. In addition, OLEDs are expected to be commercialized in large-sized displays such as large-sized TVs beyond small-sized displays.

On the other hand, such a flat panel display device uses a glass substrate as a supporting substrate of a device. However, such a glass substrate is limited in application, since it is lighter, thinner, and more flexible in display.

Therefore, in recent years, a flexible display device which is manufactured so as to maintain the display function even if it is bent like paper by using a flexible substrate such as a plastic or polymer material instead of a conventional glass substrate having no flexibility is emerging as a next generation flat panel display device It is.

However, when such a substrate such as a plastic or a polymer material is applied to an OLED, the life of the OLED is shortened due to permeated moisture because the plastic or polymer material has high moisture permeability. In addition, since the heat emission performance is generally low, there is a disadvantage that the heat generated inside the display device can not be effectively discharged, and improvement thereof is required.

However, in the case of a metal substrate, due to the nature of the material, it is highly resistant to moisture and has excellent heat dissipation properties, so that it can be provided as a substrate in a flexible display device. However, in the case of a metal substrate manufactured by conventional rolling, the surface roughness is difficult to control, and surface protrusions (spikes) or cavities exist, thereby deteriorating device characteristics. Further, when a thin substrate is formed by the rolling method, the manufacturing cost is increased sharply as the thickness of the substrate is reduced.

One aspect of the present invention relates to a substrate for a flexible OLED display having a very flat surface roughness (Ra < 2 nm) by electrodeposition of a metal foil on a base plate by electroforming, .

Another aspect of the present invention is to provide a substrate for a flexible OLED display capable of being manufactured at a low cost and having excellent heat dissipation properties that are easy to be thinned and mass-produced, and a manufacturing method thereof.

One aspect of the present invention relates to a substrate for a flexible OLED display having a very flat surface roughness (Ra < 2 nm) by electrodeposition of a metal foil on a base plate by electroforming, .

Another aspect of the present invention is to provide a substrate for a flexible OLED display capable of being manufactured at a low cost and having excellent heat dissipation properties that are easy to be thinned and mass-produced, and a manufacturing method thereof.

According to one embodiment of the present invention, a substrate for a flexible OLED display having excellent surface roughness and excellent heat dissipation can be obtained.

Further, according to another embodiment of the present invention, a substrate for a flexible OLED display having excellent heat dissipation and surface roughness at a low cost can be easily thinned, and it is economical because it is easy to mass-produce.

1 is a conceptual view schematically showing an example of a horizontal electrophotographic apparatus for manufacturing a metal substrate for an OLED according to the present invention.

The present inventors have found that when a metal substrate is used as a substrate for an OLED in manufacturing a flexible OLED display, it is possible to obtain excellent flexibility of an organic flexible substrate such as a plastic or polymer material, And the heat dissipation property can be improved, and the present invention has been completed.

A method of manufacturing a display substrate for obtaining a metal substrate having the characteristics of the present invention will be described in detail.

The present invention relates to a method of manufacturing a metal substrate for a flexible OLED having excellent flatness using electrolytic polishing, comprising the steps of electrolytically polishing a metal base plate, preparing a metal foil by electroforming, And obtaining a substrate.

The metal substrate is preferably an Fe alloy substrate. The Fe used as the substrate component of the present invention is advantageous in terms of productivity because it is light, flexible, low in production cost, and mass-producible. Furthermore, since Fe has a high thermal conductivity, secures a certain level of strength or hardness, and is flexible at the same time, cracks or fractures due to physical impact do not easily occur, which is advantageous in terms of ensuring heat dissipation and durability.

Furthermore, since it is easily changed into a roll-like shape, it is easy to store, and it is easy to control the size of the substrate to meet the needs of customers.

On the other hand, the display is required to have a similar coefficient of thermal expansion to the other components stacked on the substrate. When the thermal expansion coefficient fluctuates, stress may be applied to the substrate or the material stacked thereon as the temperature rises or falls, resulting in cracking or breakage due to shrinkage or expansion. Therefore, the substrate according to the present invention is preferably adjusted to have a thermal expansion coefficient of 4 x 10 ^-6 m / K or less.

In order to suppress such a problem, it is preferable that the substrate is an Fe-Ni alloy containing Fe and Ni. Thus, when a substrate is manufactured as an Fe-Ni alloy, the coefficient of thermal expansion can be optimized so that it can be applied to a display substrate by controlling the content of Ni. In addition, the Fe-Ni alloy is a material that is easy to ensure corrosion resistance, and at the same time has the advantage of easy formation of the Fe-Ni alloy when using the electroforming method for manufacturing.

The alloy substrate having the above-mentioned thermal expansion coefficient can be controlled by adjusting the content of Ni. The Fe-Ni alloy substrate contains 32 to 38% by weight of nickel, the balance is iron, and other unavoidable impurities . If the Ni content is out of the above range, the thermal expansion becomes large, and the thermal stress is liable to occur due to the occurrence of the thermal stress, so that it may be difficult to apply the Ni as the display substrate.

In the case of manufacturing such a wired ultra slim substrate by using the rolling method, the manufacturing cost increases sharply as the thickness of the metal substrate is reduced. In order to use it as a display substrate, it is necessary to control the surface roughness. It is difficult to control the surface roughness because the inclusions are distributed on the surface layer.

Therefore, the metal substrate according to the present invention is preferably produced through electroforming. In the case of manufacturing a metal substrate by the electroforming method, since the substrate can be manufactured by a simple process as compared with the conventional rolling process, the productivity is excellent, and the thinning of the substrate can be easily achieved.

As an electroforming method for producing such a metal substrate, a drum type electroforming apparatus conventionally used conventionally can be mentioned. However, when a metal electrodeposition layer is manufactured by the electroforming method using a drum cell, In order to manufacture the thin film, it is important to control the surface of the drum. In order to do so, there is a problem that the operation of the entire process must be stopped, so that it is difficult to continuously manage the surface of the drum. Further, regarding the thin film production, since the area of the surface of the drum immersed in the electrolyte determines the electrodeposition rate, the production speed is limited according to the size of the drum used in the electric pole, and the cost of providing a large drum is high. It has a disadvantage that replacement is limited. Further, in order to increase the production rate, the flow rate of the electrolyte between the anode and the cathode must be increased. However, since the shape between the anode and the cathode is curvature, there is a problem that the flow rate of the electrolyte gradually decreases.

Therefore, in the present invention, it is preferable to manufacture a metal substrate by using a horizontal electroforming apparatus. In the present invention, it is possible to simultaneously generate the electrodeposition layer on the upper and lower surfaces of the mother board using a horizontal cell type electroforming equipment in which a continuous supply of metal substrates other than the drum type is accommodated in the electrolyte and electrolytic reactions occur on the upper and lower surfaces of the mother board. In addition, since a high speed flow field through which the electrolyte is supplied at a high speed can be applied, the electrodeposition speed can be improved, and the productivity is improved.

A method of manufacturing a high-speed metal foil according to the present invention and a horizontal type electric pole apparatus used therefor are schematically shown in FIG. 1, and the present invention will be described in more detail with reference to FIG.

The base plate 11 is horizontally fed in one direction from the base plate feeding apparatus 10 including the winder. At this time, when the base plate 11 is exhausted in one winding machine, a plurality of winding machines are installed so that a new base plate 11 can be supplied from another winding machine for continuous supply of the base plate 11 Can be. Further, such a base plate 11 may include a joining means 12 such as a weld for joining the end of the provided base plate 11 with the tip of the base plate 11 to be provided next, for the continuous supply .

At this time, the base plate 11 to be used may be any one having flexibility and conductivity without any particular limitation, but it is preferable that an oxide film, specifically a metal oxide film, is formed on the surface thereof. As the metal oxide film, titanium oxide, chromium oxide, lithium oxide, iridium oxide, platinum oxide, or the like may be formed although not limited thereto. Specifically, for example, stainless steel, titanium or the like on which the metal oxide coating is formed may be used as a base plate.

Since the metal mosquito plate 50 obtained by electroforming transfers the surface state of the base plate 11 as it is, it is preferable to adjust the surface roughness of the surface of the base plate 11 if necessary. At this time, the surface roughness of the surface of the base plate 11 can be adjusted by electrolytic polishing. For this purpose, the electrolytic polishing apparatus 13 is included. The surface roughness of the base plate 11 can be made flat by the electrolytic polishing apparatus 13 as described above.

It is preferable that the surface roughness of the base plate 11 should have a surface roughness such as glass. By doing so, the surface roughness of the metal substrate obtained by electroforming is also advantageous to have a glass surface roughness.

The electrolytic polishing used in the present invention can be carried out according to a conventionally used method, and is not particularly limited in the present invention. For example, in the present invention, a contact type method in which a positive electrode is directly charged on a conductive base plate 11 for performing electrolytic polishing, a contact type method in which an anode and a cathode are provided in an electrolytic polishing apparatus 13, A non-contact method.

As the electrolytic polishing solution which can be used for electrolytic polishing, an aqueous solution of sulfuric acid or phosphoric acid may be used singly or in combination with consideration given to the components of the Fe-Ni alloy layer. At this time, the sulfuric acid aqueous solution preferably has a sulfuric acid concentration of 20 to 50%, and the aqueous phosphoric acid solution preferably has a concentration of 30 to 80% of phosphoric acid.

If necessary, the electrolytic polishing liquid may contain other additives such as a conductive auxiliary agent and a surfactant in a usual amount, if necessary. For example, the conductive auxiliary agent may include 10 to 20 wt%, and the surfactant may be included in the electrolytic polishing solution in an amount of 0.1 to 0.5 g / l.

Meanwhile, it is preferable that the electrolytic polishing is performed at an electrolytic polishing solution temperature of 30 ° C to 80 ° C. When the temperature of the electrolytic polishing liquid is less than 30 ° C, there is a problem that sufficient electrolytic reaction does not occur. When the temperature exceeds 80 ° C, a fusing may occur due to active dissolution reaction and bubble generation. More preferably at a temperature of 60 ° C to 70 ° C.

Furthermore, the electrolytic polishing can be performed at a current density of 0.5 to 1.5 A / cm ² , preferably 0.7 to 1.2 A / cm ² . When the current density is less than 0.5 A / cm ² , sufficient electrolytic polishing may not occur as an etching section. When the current density exceeds 1.5 A / cm ² , uneven polishing occurs as an electrolytic milling section, It becomes easier to do.

By performing such electrolytic polishing, the surface roughness Ra of the base plate 11 can be adjusted to 4 nm or less, more preferably 2 nm or less, which is similar to the surface roughness of the glass. Further, .

In addition to the electrolytic polishing apparatus 3, other polishing apparatuses, for example, a mechanical polishing apparatus, a chemical mechanical polishing apparatus, and the like may be further included to adjust the surface roughness of the surface of the base plate 11.

It is more preferable for the electrolytic polishing that the electrolytic polishing is performed by washing the base plate 11 before the electrolytic polishing. The washing may be carried out using a mixture of an appropriate amount of a washing solution well known in the art such as alkali, acid, and water.

Further, after electrolytic polishing, the substrate can be washed with water successively and then dried. The washing with water can be carried out by using a washing liquid such as water by the pre-washing device 14 so as to completely remove impurities such as residual electrolytic polishing liquid on the surface of the base plate 11, and can be washed with water several times. On the other hand, the drying is not particularly limited, and may be performed by spraying air or the like, and it is preferable to completely dry the washing liquid remaining on the surface.

It is preferable to remove the foreign substances on the surface by washing the base plate 11 in advance for the electrolytic polishing of the base plate 11 as described above and also to remove the separated base plate 11 for reuse of the base plate 11 after the electrodeposition, It is preferable that the surface of the base plate is kept clean by washing and drying the electrolytic solution and the residue remaining in the base plate by the post-cleaning device 52 or the like.

The metal in the electrolytic solution is electrodeposited on the conductive base plate 11 by flowing an electric current while supplying the electrolytic solution to the surface of the conductive base plate 11 as described above to form the metal base plate 50. At this time, the electrodeposition is preferably performed using the horizontal electrophotographic apparatus 100. The horizontal electric pole apparatus 100 includes a horizontal cell 30 which is separated from the base sheet supplying apparatus 10. [ In the case of a drum-type electric drilling apparatus using a conventional drum, there is a problem that when the surface of the drum is polished and cleaned in order to impart surface roughness to the surface of the drum, foreign substances generated during polishing are mixed into the electrolytic solution to contaminate the electrolytic solution. Since the horizontal cell 30 is separated from the base plate feeder 10, such a problem can be prevented.

The horizontal cell 30 includes conductive rolls 31 and 31 'that perform a function of connecting the base plate 11 and the cathode power supply, spaced apart from the base plate 11 at regular intervals, An anode electrode 32 disposed on one side or both sides of the conductive rolls 31 and 31 'and the anode electrode 32 and a current supply for supplying a negative electric charge and a positive electric charge to the conductive rolls 31 and 31' An apparatus 33 and an electrolyte supply device for containing an electrolyte solution for electrolytic reaction.

The conveyor rolls 31 and 31 'are connected to the base plate 11 and the current supply device (not shown) while functioning as feeding means for feeding the base plate horizontally into the horizontal cell 30 and discharging the base plate from the horizontal cell 30. [ 33 are connected to an electrolytic deposition reaction in which iron ions and nickel ions are precipitated on the base plate by an electrolytic reaction between the anode electrode 32 and the base plate 11. These contact rolls 31 and 31 'come into contact with both edges in the width direction of the base plate 11 to transfer the base plate 11 into the horizontal cell 30 and discharge it from the horizontal cell 30.

In this embodiment, since the base plate 11 is a conductive conductive base plate having flexibility, when the base plate 11 passes through the horizontal cell 30, the base plate 11 may be stuck due to its own weight. In this case, The spacing between the Fe-Ni alloy foil 32 and the Fe-Ni alloy foil 32 may vary, resulting in a difference in current density. As a result, a Fe-Ni alloy foil of uniform thickness may not be obtained. Therefore, in order to prevent stiction of the base plate 11, the rotational speeds of the inlet side conveying roll 31 and the outlet side conveying roll 31 'are different from each other, that is, rotation of the outlet side conveying roll 31' The speed of the inlet side conduit roll 31 can be made faster than the rotational speed of the inlet side conduit roll 31, thereby preventing the buckling due to the self weight of the base plate 11. [

The conductive rolls 31 and 31 'transmit the current supplied from the current supply unit 33 to the base plate 11 so that the base plate 11 can function as a cathode electrode, It is possible to cause the electrolytic deposition reaction to take place.

The anode electrodes 32 are spaced apart from the base plate 11 passing through the horizontal cells 30 at regular intervals. The anode electrode 32 and the base plate 11 are spaced apart from each other and are provided as a flow path through which an electrolyte is supplied and circulated. By the action of the base plate 11 as described above, the iron ions and the nickel ions An electrolytic reaction may occur which electrolytically precipitates out the electrolytic solution to the matrix. When the electrolytic solution is supplied at a high speed, the electrodeposition rate of iron and nickel ions to the surface of the base plate 11 can be increased. In the case of a conventional battery using a drum cell, the channel forms a curvature, Resulting in a decrease in the electrodeposition rate. However, since the flow path of the electrolytic solution is formed in a plane as described above, it is possible to minimize the velocity drop of the flow field with respect to the supply of the electrolytic solution, thereby increasing the electrodeposition rate.

The anode electrode 32 may be provided on both upper and lower surfaces of the base plate 11 in order to cause an electrolytic deposition reaction of metal on both surfaces of the base plate 11. [ By doing this, the production amount of the Fe-Ni alloy foil can be increased.

A metal mosquito plate 50 is obtained by electrodepositing a metal in the electrolytic solution on the conductive mat 11 by flowing an electric current while supplying the electrolytic solution to the conductive mat 11 as described above. The metal substrate of the present invention is obtained. The metal substrate to be obtained in the present invention is an Fe-Ni alloy containing 32 to 38% by weight of Ni, and therefore, an electrolyte solution capable of obtaining such an alloy should be used. In order to obtain an Fe-Ni alloy metal substrate having the Ni content as described above, it is preferable that the electrolytic solution contains 2 to 25 g / l of the iron precursor and 40 to 60 g / l of the nickel precursor.

The electrolytic solution is a supply source of iron and nickel which are the main components of the Fe-Ni alloy substrate. The iron precursor includes, but is not limited to, iron sulfate, iron chloride, iron nitrate, iron sulfamide or mixtures thereof. , Ni precursors include, but are not limited to, nickel sulfate, nickel chloride, nickel nitrate, nickel sulfamate, or mixtures thereof.

The electrolytic solution may also contain other additives, which are ordinarily added to the electrolytic solution, if necessary in a usual amount. Examples thereof include a conductive auxiliary agent, a surfactant, and a complexing agent. Furthermore, the electrolytic solution may include a stress relieving agent such as saccharin, which reduces the stress of the electrodeposited layer so that the electrodeposited layer is easily desorbed from the base plate, a pH buffer such as boron to adjust the pH of the electrolytic solution, and the like.

The temperature of the electrolytic solution is preferably 50 to 60 DEG C and the pH of the electrolytic solution is preferably 1.5 to 3.5.

In the present invention, the metal foil may be electrodeposited on the conductive base plate 11 by supplying an electrolytic solution containing the above-described components to the base plate 11 and electrolytic deposition. By separating the metal foil electrodeposited on the base plate 11, a metal base plate 50 which can be used as a metal substrate can be obtained. The conductive base plate 11 and the metal foil are bonded with a surface tension. Using the peeling roll 51 or the like, the difference between the moving speed of the metal foil and the moving speed of the base plate can be generated and separated by the generated shearing force. When a metal foil is deposited on the upper and lower surfaces of the conductive base plate 11, the upper and lower metal foils can be separated simultaneously or with a time difference.

Thereafter, the metal foil 50 produced by the electroforming method is peeled off from the conductive base plate 11, thereby obtaining the metal base plate 50. The metal mosquito plate 50 thus obtained transfers the surface roughness of the metal base plate 11 as it is by electroforming. As described above, in the present invention, since the conductive base plate 11 used for electroforming is adjusted to have a surface roughness of 4 nm or less, preferably 2 nm or less, by electrolytic polishing, the metal mosquito The plate 50 is obtained as a metal substrate for an OLED having a surface roughness (Ra) of 4 nm or less, preferably 2 nm or less.

Therefore, although the process of separately adjusting the surface roughness of the metal substrate is not necessarily required, it is also necessary to adjust the thickness of the metal substrate, and if necessary, electrolytically polishing the metal substrate obtained by the electroforming Whereby a metal substrate having a surface roughness of 4 nm or less, preferably 2 nm or less, can be controlled.

If the surface roughness exceeds 4 nm, the characteristics of the device using the surface roughness may be lowered. For example, since each layer constituting the OLED is a very thin thin film layer of nanoscale, if the surface roughness is large, there is a possibility that the device short-circuit occurs at the peak valley portion, the device brightness is uneven, .

Such electrolytic polishing can be applied to electrolytic polishing of the metal substrate as described above in connection with electrolytic polishing of the base plate, and a description thereof is omitted here.

The metal substrate obtained by the present invention preferably has a thickness of 30 to 100 mu m. If the thickness of the obtained metal substrate is less than 30 탆, sufficient heat radiation and moisture permeability can not be imparted to the substrate, and handling of the substrate may be difficult in the process. If the thickness exceeds 100 탆, There is a disadvantage in that the productivity is inferior to that of the technique of manufacturing the semiconductor device.

The metal substrate obtained by the present invention is thin and excellent in flexibility and is easy to be wound and expanded, and thus has excellent processability and workability. It is possible to improve the lifetime characteristics of the OLED by utilizing not only the mechanical characteristics such as the strength and the hardness which are inherent to the metal substrate but also the excellent moisture resistance property and the high thermal conductivity of the metal substrate, It is possible to manufacture a display substrate having excellent heat dissipation which can be easily released.

The metal substrate for a flexible OLED has a surface flatness adjusted to 4 nm or less by the method for manufacturing a flexible metal substrate for a flexible OLED as described above. A flexible OLED having excellent characteristics can be obtained when a metal substrate for a flexible OLED is used.

The metal substrate obtained by the present invention as described above can be recovered after being washed and dried, and cut to an appropriate length. Further, if necessary, the heat treatment can be performed by a heat treatment apparatus. On the other hand, the conductive base plate is not particularly limited as long as it can be cut and wound to an appropriate length for reuse after washing and drying to remove the electrolyte solution.

The present invention will be described in detail with reference to the accompanying drawings. However, it will be understood by those skilled in the art that the present invention will be readily understood from the accompanying drawings, and further modifications, You can do it.

Hereinafter, the present invention will be described in detail with reference to Examples. However, the following examples are provided to help the understanding of the present invention and thus do not limit the present invention.

Example

Electrolytic polishing was carried out using a STS 304 steel plate which was polished and mirror-polished to a surface roughness (Ra) of 20 nm by super-mirror processing as a base plate. The electrolytic polishing solution used was a mixed solution containing 30% by weight of sulfuric acid, 60% by weight of phosphoric acid and 10% by weight of water, and electrolytic polishing was carried out at a temperature of 60 to 70 ° C and a current density of 0.7 to 1.2 A / cm ² .

The surface roughness (Ra) obtained after electrolytic polishing was 1.0 nm, and a conductive metal base plate having a very excellent surface roughness was obtained.

The electrolytically polished conductive base plate was horizontally fed by a horizontal electric pole apparatus as shown in Fig. An electrolyte solution was supplied between both surfaces of the base plate and the anode electrode. An aqueous solution containing 10 g / l FeCl ₂ .4H ₂ O, 48 g / l NiCl ₂ .6H ₂ O and 25 g / l H ₃ BO ₃ and having a pH of 1.5 to 3.5 and a temperature of 50 to 60 ° C Were used.

An electrolytic reaction was performed at a current density of 5 A / dm ² by applying an electric current to the anode electrode and the base plate to form an Fe-Ni electrodeposited layer having a thickness of 40 탆 on the base plate.

The formed Fe-Ni electrodeposited layer was separated to obtain a Fe-Ni thin film. The prepared Fe-Ni thin film contained 34 wt% of Ni, the balance iron and other impurities, the coefficient of thermal expansion was 3.4 x 10 ^-6 m / K, and the surface roughness (Ra) was 1.0 nm which is the same as that of the conductive base plate.

The resultant Fe-Ni thin film was washed with water and washed to prepare a substrate. The electric wiring board had a thermal conductivity of 16 W / (m DEG C), and showed a remarkably high thermal conductivity value compared to a conventional glass substrate having a thermal conductivity of 1 W / (m DEG C).

A silver electrode, a CuO positive hole injection layer, a-NPD hole acceptance layer, an Alq3 light emitting layer, a BCP hole blocking layer, and an Alq3 electron accepting layer were sequentially formed on the Fe-Ni substrate, and a transparent electrode was formed thereon to form an OLED Respectively. On the other hand, an OLED having the same structure as above was prepared, except that a glass substrate for comparison was used. The lifetime characteristics (after 24 hours operation) of the prepared OLED were measured and compared.

OLED on the glass substrate in the initial luminance 162cd / m ^2, the end of the luminance 134cd / m ² in, whereas a luminance reduction in 17.3%, Fe-Ni OLED on the substrate is the initial luminance 156cd / m ^2, the end of the luminance 141cd / m ² , And 9.6%, respectively. As a result, it was found that the decrease in luminance of the Fe-Ni substrate according to the present invention was remarkably small.

As described above, the substrate according to the present invention shows superior performance to the conventional glass substrate.

10: Feeder 11: Feeder
12: bonding means 13: electrolytic polishing apparatus
14: electric cleaning device 30: horizontal cell
31, 31 'Conduction roll 32: anode electrode
33: current supply device 34: electrolyte storage tank
35: Electrolyte heater 36: Electrolyte filter
37: Electrolyte pump 38: Electrolyte nozzle
50: metal mortar plate 51: peeling roll
52: Post-cleaning device 53: Heat treatment device
54: Fe-Ni metal substrate cutting device 55: Fe-Ni metal substrate winding device
71: Cutting board cutting device 72: Flattening device
100: horizontal pole

Claims (14)

Electropolishing the conductive mother plate to adjust surface roughness;
The conductive mother plate is horizontally supplied in a predetermined direction, the electrolyte is supplied between the anode electrode disposed to be spaced apart from one surface or both sides of the conductive mother plate, and the current is applied to the conductive mother plate and the anode electrode to the conductive mother plate Forming a metal foil on the substrate; And
Peeling the metal foil to produce a metal substrate manufacturing method of a flexible OLED metal substrate.
The method of claim 1, further comprising electrolytically polishing the metal substrate.
The method of claim 1, wherein the electrolytic polishing is performed using an electrolytic polishing solution containing phosphoric acid, sulfuric acid, or a mixture thereof.
The method of manufacturing a metal substrate for flexible OLED according to claim 1, wherein the conductive mother plate is adjusted to a surface roughness of 4 nm or less.
The method of manufacturing a flexible metal substrate for flexible OLED according to claim 1, wherein the electrolytic polishing employs an electrolytic polishing solution selected from sulfuric acid, phosphoric acid, and mixtures thereof.
The method of claim 1, wherein the electrolyte comprises 6-12 g / L of iron precursor and 40-50 g / L of nickel precursor.
The method of claim 6, wherein the iron precursor is at least one selected from the group consisting of iron sulfate, iron chloride, iron nitrate, iron sulfamate or mixtures thereof, and the nickel precursor is at least one selected from the group consisting of thixel sulfate, nickel chloride, nickel nitrate, A method of manufacturing a metal substrate.
The method of claim 1, wherein the metal substrate is a Fe-Ni alloy substrate.
9. The method of claim 8, wherein the metal substrate has a Ni content of 32 to 38% by weight and the balance of Fe and inevitable impurities.
The method of claim 1, wherein the metal substrate has a surface roughness Ra of 4 nm or less.
The method of claim 1, wherein the metal substrate has a thickness of 30 to 100 탆.
The method of claim 1, wherein the electrolytic polishing is performed at a temperature of 30 to 80 캜.
The method of claim 1, wherein the electropolishing is performed at a current density of 0.5 to 1.5 A / cm &lt; ² &gt;.
A metal substrate for a flexible OLED obtained by the method of any one of claims 1 to 13 and having a coefficient of thermal expansion of 4 × 10 ⁻⁶ m / K or less.

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