KR20130053115A - Method and apparatus for manufacturing metal foil - Google Patents

Abstract

PURPOSE: A high speed metal foil manufacturing method and an apparatus thereof are provided to supply an electrolyte at a high speed, and to form electro-deposition layers on both the upper and the lower side of a base plate at the same time, thereby increasing productivity and reducing manufacturing costs. CONSTITUTION: A high speed metal foil manufacturing method comprises the following steps. An electrolyte that contains metal ions is supplied onto the surface of a base plate(11) which is provided as a cathode electrode, which is horizontally supplied in the one-way direction, and which is flexible and conductive. The electro-deposition layer is formed on the base plate by an anode electrode which is installed with a space from one side or both sides of the base plate and by metal ions of the electrolyte which are extracted from one side or both side of the base plate. The electro-deposition layer is split off from the base plate. An oxide film is formed on one side or both sides of the base plate.

Description

High speed metal foil manufacturing method and apparatus {Method and Apparatus for Manufacturing Metal Foil}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a manufacturing method and apparatus for producing a metal foil at high speed, and more particularly, to a manufacturing method capable of continuously producing a metal foil by using electorforming and a manufacturing apparatus used for producing the metal foil.

In general, as a method of manufacturing a metal foil, copper foil is manufactured by a rolling method for producing a thin film by rolling using a slab manufactured through steelmaking, steelmaking, and continuous casting, or a rolling method using a drum cell. This method is mainly used.

In the production of thin plates using the rolling method, which is the most popular method, a metal foil having a thickness of several mm is produced by reheating a slab and performing a hot rolling, and a thin sheet produced by such hot rolling is formed by additional cold rolling. Ultra-thin thickness of 100 micrometers or less can be manufactured. A method of manufacturing a metal thin plate by such a method is disclosed in US Pat. No. 4,948,434. According to the above patent document, in order to manufacture ultra-thin, it has to go through several cold rolling and annealing processes. In this method, the manufacturing process is complicated, which causes a lot of energy and time in the process. Difficult to maintain, thickness variation occurs, surface roughness is not constant, and problems such as edge cracks are generated, resulting in high production cost and difficulty in producing a wide metal foil. There was this.

In recent years, many researches have been conducted on a method and apparatus for producing a metal foil using an electroforming method to manufacture a copper foil. For example, Korean Patent Laid-Open Publication No. 1999-0064747 and Korean Patent Laid-Open Publication No. 2004-0099972 propose a method for manufacturing a metal sheet using the electroforming method and an apparatus for manufacturing a metal sheet using the electroforming method. As such, the method of manufacturing the metal foil by the electroforming method has an advantage of simplifying the process since the metal foil can be produced through a simple process.

The patent documents propose a metal foil production method using a drum cell. When the metal foil is manufactured by the electroforming method using such a drum cell, it is important to manage the surface of the drum in order to produce a thin film having a uniform thickness and a constant surface roughness. There is a problem and it is difficult to continuously manage the drum surface.

In addition, with respect to thin film production, the area of the drum surface immersed in the electrolyte determines the electrodeposition rate, so the production speed is limited according to the size of the drum used in the pole, and the cost of providing a huge drum is expensive. Has the disadvantage of following the limitation of replacement. In addition, in order to increase the production rate, the electrolyte flow rate must be increased between the positive electrode and the negative electrode, but since the shape between the positive electrode and the negative electrode has a curvature, the electrolyte flow rate gradually decreases.

The present invention is to provide a method and apparatus that can improve the productivity of the metal foil by applying a horizontal cell to produce the metal foil by the electroforming method.

In one embodiment of the present invention, a metal foil manufacturing method and apparatus using an electroforming method which can improve the productivity and reduce the manufacturing cost by forming an electrodeposition layer on the upper and lower surfaces of the mother plate at the same time supplying the electrolyte solution at high speed To provide.

In one embodiment of the present invention, to provide a metal foil manufacturing method and apparatus using an electroforming method capable of producing a metal foil by a continuous process of all electrodepositable metal materials.

In one embodiment of the present invention, it provides a metal foil manufacturing method and apparatus using an electroforming method that can transfer the surface of the base material having a surface roughness of 1nm ~ 10㎛ to produce the surface roughness of the metal foil to the same level as the base plate I would like to.

In one embodiment of the present invention, it is an object of the present invention to provide a metal foil manufacturing method and apparatus capable of producing a metal foil of 1 ㎛ ~ 100 ㎛ by easily adjusting the thickness of the metal foil.

In one embodiment of the present invention, an object of the present invention is to provide a metal foil manufacturing method and apparatus capable of producing a metal foil having a multilayer structure having different components.

One aspect of the present invention provides a method for manufacturing a metal foil, the method is a conductive base plate in contact with the conductor roll acts as a cathode electrode, supplying an electrolyte solution containing a metal ion to the surface of the conductive base plate horizontally supplied in a constant direction An electrolytic solution supplying step, an electrodeposition step in which metal ions of the electrolytic solution are electrodeposited by the action of the anode electrode and the mother plate, which are spaced on both sides of the mother plate, and a metal layer is formed on the mother plate, and the peeling of the metal layer is separated from the mother plate. Steps.

According to one embodiment of the present disclosure, the method may further include washing the surface of the peeled metal foil.

In addition, according to one embodiment of the present disclosure, the peeled metal foil may further comprise the step of heat treatment at 300-600 ℃.

In addition, according to one embodiment of the present disclosure, the method may further include winding the peeled metal foil, for example, may further include winding the metal foil after the heat treatment of the metal foil.

According to still another embodiment of the present disclosure, the method may further include imparting surface roughness to the surface of the conductive mother plate by mechanical polishing, chemical polishing, or a combination thereof, and optionally washing the mother plate.

Furthermore, according to one embodiment of the present disclosure, the method may further include washing and winding the mother plate from which the metal layer has been peeled off.

According to the exemplary embodiment of the present disclosure, the conductive mother plate may be a metal mother plate having an oxide film formed on the surface thereof, for example, stainless steel or titanium, and an oxide film formed on the surface thereof.

According to another embodiment of the present aspect, the peeling may be performed by the shear stress difference or the moving speed difference between the base plate and the metal foil.

Furthermore, according to another embodiment of the present disclosure, the electrolyte may move in the same direction, in the opposite direction, or in the same and opposite directions through the horizontal passage formed by the mother plate and the anode electrode.

In addition, in another embodiment of the present disclosure, the electrolyte may be different from each other for the upper and lower sides of the mother plate.

In still another embodiment of the present disclosure, a second electrolyte supply step and a second electrodeposition step may be further included before the peeling step.

In addition, in another embodiment of the present aspect, the electrolyte supplied in the second electrolyte supply step may be different from the electrolyte solution in the electrolyte supply step, the metal foil may be obtained a metal foil of a two-layer structure.

On the other hand, in another aspect of the present invention, there is provided a horizontal pole device for producing a metal foil, the horizontal pole device is a base plate supply means for continuously supplying a horizontal horizontal continuous conductive substrate provided in the cathode electrode; Conductor for supplying current to the conductive mother board while transferring the conductive mother board in contact with the edge portion in the width direction of the conductive mother board, an anode electrode spaced apart above and below the horizontally supplied conductive mother board, the conductive substrate supplied horizontally and the An electrolyte supply nozzle for supplying an electrolyte solution containing metal ions to a horizontal passage formed by an anode electrode, and a current supplying the conductive mother plate and the anode electrode so that metal ions in the electrolyte are electrodeposited onto the conductive mother plate to form a metal foil A horizontal cell including a current supply device; And peeling means for separating the metal foil electrodeposited on the conductive mother plate from the conductive mother plate, and the electrolyte may be supplied to both sides of the conductive mother plate so that metal ions are electrodeposited on both sides of the conductive mother plate.

In another embodiment of the present disclosure, the plurality of horizontal cells may be arranged in series, and in another embodiment of the present disclosure, the plurality of horizontal cells may have the same or different metal ions in the electrolyte. It may be.

In addition, in another embodiment of the present disclosure, it may further include a heat treatment apparatus for heat-treating the metal foil electrodeposited on the conductive mother plate by induction heating, atmosphere heating or direct heating means.

Furthermore, as another embodiment of the present aspect, it may further include a polishing device for imparting the surface roughness by mechanical polishing, chemical polishing or a combination thereof on both sides of the conductive base plate and optionally a cleaning device for washing the base plate. .

Furthermore, in another embodiment of the present aspect, the peeling means may be a plurality of rollers for imparting the shear stress difference between the conductive mother plate and the metal foil.

According to one embodiment of the present invention, a metal foil can be manufactured at high speed.

In addition, according to one embodiment of the present invention, it is possible to produce a metal foil having excellent surface roughness on the upper and lower surfaces and having a uniform composition and thickness at high speed.

In addition, according to one embodiment of the present invention, it is possible to control the thickness of the metal foil through a continuous process, or to produce a metal foil of a multi-layer structure.

In addition, according to one embodiment of the present invention, it is possible to produce different kinds of metal foil at the same time.

1 is a view schematically showing the configuration of a metal foil manufacturing apparatus according to an embodiment of the present invention.
2 is a view schematically showing the configuration of a metal foil manufacturing apparatus according to another embodiment of the present invention.
3 is a diagram illustrating an example of a horizontal pole apparatus in which a plurality of horizontal cells are disposed according to an embodiment of the present invention.
4 is a schematic flowchart illustrating a manufacturing process of a metal foil according to an embodiment of the present invention.

The present invention provides a horizontal cell pole apparatus and a method of obtaining a metal foil by electrodepositing a metal on a base plate supplied horizontally to the pole apparatus. Hereinafter, each embodiment of the present invention will be described in detail with reference to the drawings.

Method for manufacturing a metal foil by a pole according to an embodiment of the present invention relates to a method for producing a metal foil by supplying an electrolyte solution to the surface of the mother plate horizontally supplied, supplying an electrolyte solution on the mother plate; Electrodepositing a metal layer on the mother plate and peeling the electrodeposited metal layer.

In forming the metal foil by electroforming, the base plate that can be used for forming the metal foil can be used without particular limitation as long as it is flexible and has conductivity. For example, stainless steel, titanium, or the like can be applied. It is preferable that an oxide film is formed in the surface of such a mother board. The present invention seeks to obtain a metal foil. When the metal foil formed by electrodeposition on the mother plate has a strong bond with the mother plate, it is not easy to separate the metal foil from the mother plate, and therefore, an oxide film is preferably formed on the mother plate. . By the oxide film on the mother board, even if the metal foil is electrodeposited on the mother board, since the adhesion to the surface of the mother board is weak, the metal foil can be easily peeled from the mother board.

If necessary, the surface of the mother plate may have a constant surface roughness. The surface of the mother plate may be polished to impart such constant surface roughness. Thus, when providing surface roughness to the surface of a mother board, the metal foil obtained by electrodeposition can provide a constant surface roughness with respect to the metal foil obtained by transferring the surface roughness formed in the mother board as it is. Since the polishing of the mother plate can be performed on both sides of the mother plate, surface roughness can be imparted through polishing on both sides of the mother plate.

In order to impart surface roughness to the surface of the mother plate is not particularly limited, any suitable mechanical, chemical or mechanical chemical polishing means known in the art can be applied. For example, mechanical polishing, such as polishing, chemical polishing, such as etching, mechanical chemical polishing, such as the CMP method mainly used in a semiconductor process, etc. are mentioned. In the production of metal foil using electric poles, the quality of the metal foil tends to be largely influenced by the surface roughness. For example, the electrodeposition layer electrodeposited on the mother plate transfers the surface roughness of the mother plate, and at the site of the poor surface roughness of the obtained metal foil, an electrical short occurs, damaging the surface roughness of the mother plate, and preventing the deposition and surface defects of the electrodeposited layer. It may cause. At this time, the surface roughness of the base plate can be appropriately adjusted according to the use of the metal foil obtained, and is not particularly limited, but, for example, when used as a substrate material of the display device, usually 4 nm or less, When using for the use of the solar cell substrate material, the surface of a mother board can be grind | polished so that it may have surface roughness of 40 nm or less.

As described above, when polishing the surface of the mother plate, in order to obtain a uniform metal foil, it is sometimes necessary to remove the abrasives, polishing liquids or abrasive residues remaining on the surface of the mother plate from the surface of the mother plate. It may include. The washing of the surface of the mother plate is not particularly limited and can be removed using an acidic solution and water. Thereafter, the mother board can be dried by blowing high pressure air, hot gas, or heating the mother board.

The base plate is continuously supplied into the pole cell, and is supplied in a constant direction. Here, the "electrode cell" may be defined as a unit cell in which an electrolyte solution is supplied on a mother plate, and metal ions are electrodeposited onto the mother plate surface by an electrolytic precipitation reaction to form a metal layer. In addition, the term “constant direction” means that the mother plate proceeds in one direction without changing the advancing direction of the mother plate until the mother cell is supplied into the pole cell and at least exits the horizontal cell. In this specification, the advancing direction of the mother plate may be referred to as 'horizontal direction' or simply 'horizontal' in some cases. Furthermore, the mother plate may advance the pole cell in the horizontal direction so that metal ions in the electrolyte are electrolytically deposited on the mother plate. In order to indicate that the pole cell is also referred to as a 'horizontal cell'.

For the continuous supply of the mother board, the mother board is not necessarily limited thereto, but the mother board wound in the coil form can be supplied into the horizontal cell. Furthermore, when all of the mother boards are supplied, the mother board is wound in the other coil form. Subsequent feeding can be followed by continuous feeding. At this time, if necessary, the rear end of the preceding base plate and the leading end of the following base plate can be joined by a predetermined joining means such as welding and continuously supplied. Furthermore, in order to easily join, each terminal joined can also be processed to a suitable shape.

The base plate is supplied horizontally into the horizontal cell by a pair of conductor rolls which contact the width edge of the base plate to transfer the base plate into the horizontal cell. At this time, the electrolytic solution may be supplied to any one side of the mother plate supplied into the horizontal cell to perform one side electric pole, and the electrolyte may be deposited on both sides of the mother plate by supplying the electrolyte solution on both sides to increase the production speed of the metal foil. You can.

When the mother plate is supplied into the horizontal cell as described above, the electrolyte is supplied to one side or both sides of the mother plate through an electrolyte supply nozzle, and the mother plate acts as a cathode electrode while the electrolyte moves through the horizontal flow path formed by the mother plate and the anode electrode. By electrolytic precipitation by the anode electrode, metal ions are deposited on the surface of the mother plate to form a metal layer. The metal ion contained in the electrolyte is not particularly limited as long as it can be poled, and examples thereof include Cu, Fe, Ni, Zn, Cr, Co, Ag, Pd, Al, Sn, or an alloy thereof.

In the case of the conventional drum type pole cell, the mother plate shape provided as the cathode has a curvature in a drum shape, and thus the flow path of the electrolyte also forms a curvature, which causes a decrease in the electrodeposition speed due to the gradually slowing of the flow rate of the electrolyte. Moreover, it has a problem that the thickness of the metal foil obtained becomes nonuniform. Furthermore, in the case of forming the oxide film on the surface of the drum or giving the surface roughness to the drum surface, impurities are introduced into the electrolyte in this process, and thus there is a problem in that the management of the electrolyte is not easy.

However, in the case of using the horizontal cell as in the present invention, the horizontal cell has a flow path formed horizontally, so that the electrolyte can be supplied at high speed without the flow rate of the electrolyte being reduced, thereby increasing the electrodeposition rate of the metal ions. . The supply rate of electrolyte (Re, Reynolds number) can be supplied up to 5,000, and the relative speed can be appropriately increased or decreased depending on the progress of the mother plate. In addition, depending on the state of the electrodeposition reaction, the electrolyte may be supplied at a flow rate of laminar flow (the flow of fluid supplied in a straight line without shaking the water, having straightness), and a high speed turbulence (water stem) after a stable electrodeposition reaction is formed. Can be supplied at a flow rate). If the flow rate of the electrolyte is increased during initial electrodeposition, the electrodeposition layer may come off and electrodeposition may fail.If the electrodeposition layer grows to several micro levels, the adhesion may be improved by the stress generated in the electrodeposition layer, thereby enabling the use of a high speed flow field. It is. On the other hand, when using a high speed flow field, the fluid supply speed region is preferably supplied at a flow rate below the surface tension between the electrodeposition layer and the mother plate, and the electrolyte is supplied at a flow rate beyond the surface tension between the electrodeposition layer and the mother plate. When supplied, the shear stress between the flow field and the electrodeposited layer due to the supply of the electrolyte exceeds the surface tension between the electrodeposited layer and the mother plate, thereby causing peeling of the electrodeposited layer.

The electrolyte is supplied to the surface of the mother plate through the nozzle from the electrolytic cell containing the electrolyte, such electrolyte may be supplied in the same direction and in the opposite direction with respect to the traveling direction of the mother plate. By doing in this way, the electrodeposition rate of the metal component to a mother board surface can be raised further.

On the other hand, the electrolyte used for electrodeposition can be recovered by electrolyte storage tank again as needed. At this time, the recovered electrolyte solution will be lowered than the concentration required for electrodeposition because the metal ion is consumed for electrodeposition, it can be adjusted to a predetermined concentration by replenishing the metal ion as appropriate.

The electrodeposition process through the horizontal cell as described above may be performed a plurality of times in succession. As described above, when the electrodeposition process through the horizontal cell is performed a plurality of times, the thickness of the metal foil obtained by the electrodeposition in each horizontal cell can be increased, so that the thickness of the metal foil can be controlled as needed, and the mother plate can be faster. Even if supplied as a metal foil having a desired thickness can be obtained can improve the productivity. Further, different electrolytes may be supplied and deposited for each horizontal cell. For this reason, the metal foil which has a some layer can also be obtained, and various functions can be provided to metal foil.

On the other hand, since the electrolytic solution may remain on the surface of the metal foil electrodeposited on the mother plate, it is preferable to wash the surface of the metal foil. Such washing may be performed using an acid solution and water, and furthermore, a flexible brush or the like may be used to effectively remove the residual electrolyte. Such washing may be performed in a state in which an electrodeposition layer is formed by electrodepositing metal on the mother plate, but may be washed after separating the metal foil from the mother plate. Thereafter, the metal foil may be dried on the surface of the metal foil by a method such as high pressure air or hot gas, or heating.

Obtaining the metal foil by separating the electrodeposited metal layer from the mother plate. The metal layer can be separated from the base plate by using the difference in shear stress between the base plate and the metal layer. Since the metal layer electrodeposited and formed on the mother board is bonded by surface tension with respect to the mother board which has an oxide film, it can isolate easily by this. Separation of the metal layer by such a shear stress difference can be carried out by passing through a plurality of rollers. Furthermore, the difference in the moving speed of the metal foil and the moving speed of the mother plate may be generated to separate the shear force. On the other hand, when electrodeposition is performed on both sides of the mother plate, the upper and lower metal foils may be separated at the same time or may be separated by giving a time difference.

The metal foil formed by the electric pole has a nanostructure, and may be appropriately heat-treated to secure a target microstructure with respect to the obtained metal foil. The metal foil formed by the electric pole has various working process temperatures depending on the intended use. For example, in the case of metal foil such as Fe, abnormal grain growth occurs at 300 to 600 ° C., so that the nanostructured microstructure of the metal foil becomes a microstructured structure. It causes a change. The change in the microstructure due to the growth of the abnormal crystal grains may cause a defect in the product during the process of manufacturing the target product by applying the metal foil. For example, when an electronic circuit etc. are formed in a metal foil, it may cause peeling or disconnection of the circuit during a high temperature process. Therefore, when the metal foil obtained in the temperature range which causes abnormal grain growth is used, it is preferable to prevent the change of the microstructure in the process by heat-treating the metal foil in advance and changing it into the microstructure of the microstructure beforehand.

The heat treatment conditions as described above may vary depending on the target microstructure, but are not particularly limited, but heat treatment is preferably performed at a temperature of 300 to 600 ° C. In this case, in order to prevent oxidation of the surface during the heat treatment, it is preferable to use an inert gas atmosphere such as nitrogen and argon, and the heat treatment method may be induction heating, direct heating, or contact heating.

Although the metal foil obtained in this way can be wound up and obtained, it can cut suitably according to the winding amount. Furthermore, the base plate from which the metal layer is separated can also be wound up and reused as the base plate. However, the separated mother plate may have an electrolyte solution or other impurities in the electrodeposition process, it is preferable to keep the surface of the mother plate clean by drying after washing. Furthermore, when the mother plate is bonded for continuous supply of the mother plate, the mother plate may be cut to an appropriate length according to the amount of winding of the mother plate, and in this case, it is preferable to cut based on the bonding portion.

Hereinafter, a horizontal pole apparatus according to an aspect of the present invention will be described with reference to FIG. 1 or FIG. 2. 1 and 2 are schematic device diagrams each showing an example of a horizontal pole apparatus according to an embodiment of the present invention.

The horizontal pole device 100 includes a mother plate supply device 10, a horizontal cell 30, an electrolyte supply device and a metal foil separator 51.

The mother plate feeding device 10 may include a winding machine to supply the mother plate 11. In order to continuously supply the base plate 11, a plurality of the winding machines may be installed, and when the base plate 11 is exhausted in one winding machine, a new base plate 11 may be supplied from another winding machine. This base plate 11 may comprise joining means 12, such as welding, for joining the ends of the previously provided base plate 11 and the tip of the next base plate 11 to be provided for continuous feeding.

Furthermore, since the electrodeposition layer electrodeposited on the mother board 11 transfers the surface roughness of the mother board 11, it is represented in substantially the same way to the metal foil from which the surface roughness of the mother board 11 is obtained. Therefore, it may include polishing means 13 for imparting a suitable surface roughness to the base plate (11). Such polishing means 13 is not particularly limited, and may include mechanical polishing such as polishing, chemical polishing such as etching, and mechanical chemical polishing such as a CMP method mainly used in semiconductor processes. The chemical polishing, mechanical polishing and chemical mechanical polishing means may be used alone or in combination thereof.

As such, when the base plate 11 is polished, impurities such as abrasives or base material residues may be present on the base plate 11 surface for polishing, and thus cleaning may be necessary for removing the base plate 11, and thus, the pre-cleaning device 14 It may include. The cleaning of the surface of the base plate 11 may use an acid solution such as diluted hydrochloric acid or sulfuric acid and water. Furthermore, a drying apparatus (not shown) for drying the base plate 11 may be further included. Drying may be carried out by adding air to a high pressure or by applying a hot gas, or by heating the mother plate.

Horizontal pole apparatus 100 according to an embodiment of the present invention includes a horizontal cell 30 that is separated from the mother plate feeding device (10). In the case of a conventional electroforming apparatus using a drum, there is a problem that foreign matters generated during polishing are contaminated into the electrolyte solution to contaminate the electrolyte solution in order to give surface roughness to the drum surface, but as described above, the horizontal cell 30 has the mother plate feeding device 10. ), It is possible to prevent such a problem.

The horizontal cell 30 is a conductor roll 31 which serves to transfer the mother plate 11 and connect the cathode power source, and is spaced apart from the mother plate 11 at regular intervals. A current supply device 33 and an electrolysis device for supplying an anode electrode 32 disposed on one side or both sides, a current having a negative (+) charge and a positive (+) charge to the conductor roll 31 and the anode electrode 32, respectively. It includes an electrolyte supply device for receiving an electrolyte solution for the reaction.

The conductor roll 31 serves as a transfer means for transferring the mother plate into the horizontal cell 30 and discharging it from the horizontal cell 30, while supplying the cathode power of the mother plate 11 and the current supply device 33. The electrolytic precipitation reaction is performed such that metal ions are deposited on the mother plate by an electrolytic reaction between the anode electrode 32 and the mother plate 11 by connecting. This conductor roll 31 contacts the both edges in the width direction of the base plate 11 to transfer the base plate 11 into the horizontal cell 30, and discharges it from the horizontal cell 30.

In one embodiment of the present invention, since the base plate 11 uses a flexible conductive base plate, the phenomena may sag due to its own weight when passing through the horizontal cell 30. In this case, the base plate 31 and the anode electrode Since the distance from (32) may change to cause a difference in current density, a metal foil of uniform thickness may not be obtained. Therefore, in order to prevent the base plate 11 from sagging, the rotational speeds of the inlet conductor roll and the outlet conductor roll are different from each other, that is, the rotational speed of the outlet conductor roll is made larger than that of the inlet conductor roll. It is preferable to speed up and prevent the drooping phenomenon by the weight of a mother plate.

On the other hand, the conductor roll 31 transfers the current supplied from the current supply device 33 to the mother plate 11, so that the mother plate 11 can function as a cathode electrode, thereby acting as the anode electrode 32 It is possible to cause the electrolytic precipitation reaction to occur.

The anode electrode 32 is spaced apart from the base plate 11 passing through the horizontal cell 30 by a predetermined interval. The anode electrode 32 and the mother plate 11 are spaced apart and provided as a flow path through which the electrolyte is supplied and distributed therebetween. As described above, metal ions in the electrolyte are applied to the mother plate by the action of the mother plate 11 as the cathode electrode. Electrolytic reactions that cause electrolytic precipitation may occur. When the electrolyte is supplied at a high speed, the electrodeposition speed of the metal ions to the surface of the base plate 11 can be increased. In the case of a conventional pole cell using a pole cell, the flow path forms a curvature so that the flow rate of the electrolyte is gradually reduced. There was a problem that caused a slowdown. However, since the flow path of the electrolyte is formed in the plane as described above, it is possible to minimize the decrease in the speed of the flow field with respect to the supply of the electrolyte, and thus increase the electrodeposition rate.

The anode electrode 32 may be installed on both top and bottom surfaces of the base plate 11 so that an electrolytic precipitation reaction of metal occurs on both sides of the base plate 11. By doing in this way, the yield of metal foil can be raised.

On the other hand, the current supply device 33 is to supply a (-) current and a (+) current to the conductor roll 31 and the anode electrode 32, respectively, as long as it can be applied generally in the present invention without particular limitation As applicable, the detailed description is omitted here.

The electrolyte supply device includes an electrolyte storage tank 34 for storing and accommodating an electrolyte solution and an electrolyte supply nozzle 38 for supplying an electrolyte solution to the surface of the base plate 11, and supplying an electrolyte solution from the electrolyte storage tank 34 through an electrolyte supply pipe. It is moved to the nozzle 38. The electrolyte supply nozzle 38 may be installed to be supplied only to one surface of the mother plate 11, or may be installed on both sides of the electrolyte supply to both surfaces of the mother plate 11.

Meanwhile, the electrolyte storage tank 34 includes an electrolyte heater 35 for heating the electrolyte, an electrolyte filter 36 for removing impurities such as sludge included in the electrolyte, and an electrolyte pump 37 for supplying the electrolyte to the horizontal cell. And the like.

Furthermore, the current density of the electrolyte supplied to the base plate 11 may be relatively low at both edges in the width direction as compared with the central portion of the base plate 11. In this case, the electrolyte is deposited on the base plate 11. The electrodeposition amount decreases so that the thickness of the metal foil becomes relatively thin, so that a metal foil having a uniform thickness as a whole may not be obtained. In this case, when the obtained metal foil is separated from the base plate 11, there is a possibility that the metal foil is torn at the edges and a defect may occur, and the edge having a thin thickness in order to have a uniform thickness of the metal foil separated from the base plate 11. There is a need for a post-treatment process to cut off. Therefore, it is necessary to prevent the precipitation of the metal in the edge portion in advance to suppress the thickness variation, for this purpose it can be provided with an edge mask (not shown) so that the electrolyte is not supplied to the edge of the mother plate. By providing such an edge mask, not only the formation of a thin metal foil at the edge of the base plate 11 can be suppressed, but also the electrode roll 31 can continuously supply current to the base plate 11 by preventing electrodeposition at the edge. have.

The electrolyte supply nozzle 38 supplies the electrolyte at a high speed through the horizontal passage formed by the mother plate 11 and the anode electrode 32. In this case, the electrolyte may be installed such that the electrolyte is supplied in the same direction and in the opposite direction to the traveling direction of the base plate 11 with respect to the electrolyte supply nozzle 38. By doing in this way, the effect of electrodeposition substantially can be acquired. That is, the electrolyte supplied in the opposite direction can obtain the effect of primary electrodeposition, in which a relatively small amount of short time for the electrolyte to contact the mother plate 11 is electrodeposited due to the difference in relative speed with the mother plate 11, and in the same direction. By supplying to the electrode, it is possible to obtain the effect of the secondary electrodeposition, in which the electrolyte solution contacts the base plate 11 for a longer time and is electrodeposited in a larger amount than the primary electrodeposition.

As shown in FIG. 3, a plurality of horizontal cells 30 as described above may be provided in series in the advancing direction of the base plate 11. Even if a plurality of horizontal cells 30 are installed, the electrodeposited layer is peeled from the mother plate 11 during movement by being disposed in series in the mother plate 11 traveling direction.

For example, the first horizontal cell 30 and the second horizontal cell 130 are installed, the metal is electrodeposited on the base plate 11 in the first horizontal cell 30, and in the second horizontal cell 130. The electrodeposition layer may be further electrodeposited on the electrodeposition layer electrodeposited on the mother plate 11 by supplying the same electrolyte solution as the first horizontal cell 30. By providing a plurality of horizontal cells as described above, even if the substrate is advanced at a higher speed while reducing the amount of electrodeposition through one cell, an electrodeposition layer having a desired thickness can be formed on the substrate 11, thereby improving the productivity of the metal foil. Can be.

As another example, the first horizontal cell 30 and the second horizontal cell 130 are installed, the first electrolyte is supplied from the first horizontal cell 30 to electrodeposit the first electrodeposition layer on the mother plate, and the second The second electrodeposition layer may be electrodeposited on the first electrodeposition layer by supplying a second electrolyte solution different from the first horizontal cell 30 to the horizontal cell 130. By providing a plurality of horizontal cells in this manner, a metal foil in which different metals are formed in a plurality of layers can be obtained, and various functions can be provided to the metal foil.

The base plate 11 in which the electrodeposition layer is formed as described above is discharged through the outlet-side conductor roll, and after discharge, the metal foil 50 is separated from the base plate 11 by the metal foil separator 51. Since the metal foil 50 is bonded by the surface tension on the base plate 11 having the oxide film formed on the surface thereof, the metal foil 50 may be separated by the shear force difference between the metal foil 50 and the base plate 11. Therefore, the metal foil separating device 51 is preferably capable of imparting a shear stress for separating the metal foil 50 from the mother plate 11, for example, may be provided with a plurality of rollers. It is also preferable to separate by the generated shear force. In addition, it is preferable to generate the moving speed difference between the metal foil 50 and the mother plate 11 to separate the upper and lower metal foil 50 at the same time or give a time difference.

After the metal foil 50 is separated from the mother plate 11, the metal foil 50 and the mother foil winding device 55 and the mother plate winding device 72 may be included. For example, it can be wound up to a cylindrical winder. It can be wound up in a suitable amount according to the winding amount to the said winding machine, it can cut and wind up another winding machine. For the cutting may include a metal foil cutting device 54 and the mother plate cutting device 71 as needed, it is more preferable to cut at the bonding portion of the mother plate (11).

In addition, the horizontal pole apparatus 100 according to an embodiment of the present invention, after the discharge from the horizontal cell 30 as necessary before or after separating the metal foil 50 or after the separation of the metal foil post-processing device as needed Can be installed. Examples of such a post-treatment apparatus include a post-cleaning apparatus 52, a drying apparatus (not shown), a heat treatment apparatus 53, and the like.

The cleaning device 52 is a device for removing the electrolyte and foreign matter that may be present on the surface of the metal foil 50 using an acid solution and water, it may be used a conventional device such as a high pressure spray. Furthermore, after such washing, it may be injection means for injecting air at high pressure or hot gas for removing moisture present on the surface of the metal foil 50, or heating means for drying by heating.

Furthermore, the metal foil 50 formed by electrodeposition has a nanostructure of microstructure, and includes the heat treatment means 53 to secure a target microstructure. The heat treatment of the metal foil 50 uses a temperature of 350 ~ 600 ℃, it is preferable to use a nitrogen, argon gas atmosphere to prevent the oxidation of the surface during the heat treatment, as a heat treatment method induction heating, direct heating, contact heating Can be used.

As described above, the metal foil manufacturing method and the horizontal pole apparatus according to the electrophoresis method according to each embodiment of the present invention has been described, but such a method and apparatus are not limited to those by the embodiments, it can be changed appropriately It will be understood by those skilled in the art to which the present invention pertains.

10: Bedplate Feeder 11: Bedplate
12: bonding means 13: polishing means
14: pre-washing device 30: horizontal cell
31: Conductor roll 32: Anode electrode
33: current supply device 34: electrolyte reservoir
35: electrolyte heater 36: electrolyte filter
37: electrolyte pump 38: electrolyte nozzle
50: metal foil 51: peeling roll
52: post-cleaning apparatus 53: heat treatment apparatus
54: metal foil cutting device 55: metal foil winding device
71: bed cutting device 72: bed sheet winding device
100: horizontal pole

Claims (21)

An electrolyte solution supplying step of supplying an electrolyte solution including metal ions to a surface of a flexible and conductive mother plate provided as a cathode electrode and horizontally supplied in one direction;
An electrodeposition step in which metal ions of the electrolyte are electrolytically deposited on one side or both sides of the mother plate by the action of an anode electrode disposed on one side or both sides of the mother plate and the mother plate to form an electrodeposition layer on the mother plate; and
Metal foil manufacturing method comprising a peeling step of peeling the electrodeposition layer from the mother plate. The method of claim 1, wherein the base plate has an oxide film formed on one surface or both surfaces. The method of claim 1, wherein the mother plate is made of stainless steel and titanium, and an oxide film is formed on one surface or both surfaces. The method of claim 1, further comprising washing the surface of the peeled metal foil. The method of claim 1, further comprising the step of heat-treating the peeled metal foil at 300 ~ 600 ℃. The metal foil of claim 1, further comprising imparting surface roughness to one or both surfaces of the mother plate by mechanical polishing, chemical polishing, or a combination thereof and optionally washing the polished mother plate. Manufacturing method. The method of claim 1, wherein the electrolyte is supplied in the same direction and in the opposite direction to the moving direction of the mother plate through a horizontal passage formed by the mother plate and the anode electrode. The metal foil manufacturing method according to any one of claims 1 to 7, further comprising winding up the peeled metal foil. The method of any one of claims 1 to 7, further comprising the step of washing and winding the mother plate from which the metal foil has been peeled off. The method of any one of claims 1 to 7, further comprising a second electrolyte supply step and a second electrodeposition step before the peeling step. The method of claim 10, wherein the electrolyte supplied in the second electrolyte supply step is different from the electrolyte in the electrolyte supply step. 12. The method of claim 11, wherein the metal foil is a metal foil having a two-layer structure. A mother plate feeding means for continuously supplying a flexible and conductive mother plate provided as a cathode electrode in one direction continuously;
Conductor for supplying current to the mother plate while transferring the mother plate in contact with the widthwise edge portion of the mother plate, an anode electrode spaced apart from one side or both sides of the mother plate, a horizontal passage formed by the mother plate and the anode electrode A horizontal cell including an electrolyte supply device supplying an electrolyte solution containing ions, and a current supply device supplying current to the conductor roll and the anode electrode for electrolytic deposition of metal ions on one or both surfaces of the mother plate; And
And a peeling means for separating the metal foil electrodeposited on one or both surfaces of the mother plate from the conductive mother plate. 14. The horizontal pole apparatus as claimed in claim 13, wherein the mother plate feeding means further comprises chemical, mechanical, or chemical mechanical polishing means for imparting surface roughness to one or both surfaces of the mother plate. 14. The horizontal pole apparatus as claimed in claim 13, wherein the mother plate feeding means further comprises bonding means for continuous feeding of the mother plate. The horizontal pole device according to claim 13, wherein said horizontal cell is provided with an edge mask for preventing electrolytic deposition of metal ions at the edge in the width direction of said base plate. The method of claim 13, wherein the electrolyte supply device comprises an electrolyte supply nozzle for supplying an electrolyte solution to one side or both sides of the mother plate, wherein the electrolyte supply nozzle is supplied in the same direction and the opposite direction to the traveling direction of the mother plate Level poles. 18. The horizontal pole apparatus according to any one of claims 13 to 17, wherein the horizontal cell includes a plurality of horizontal cells in series along the mother plate traveling direction. 19. The horizontal pole device according to claim 18, wherein the plurality of horizontal cells have the same or different metal ions in the electrolyte. The horizontal pole apparatus according to any one of claims 13 to 17, further comprising heat treatment means for heat-treating the metal foil electrodeposited on the mother plate by induction heating, atmosphere heating, or direct heating. 18. The horizontal pole apparatus according to any one of claims 13 to 17, wherein the peeling means is a plurality of rollers for imparting a shear stress difference between the conductive mother plate and the metal foil.

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