KR20130115492A - Method of calculating position data of a working plate and method of transferring a package using the method - Google Patents

Method of calculating position data of a working plate and method of transferring a package using the method Download PDF

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Publication number
KR20130115492A
KR20130115492A KR1020120037815A KR20120037815A KR20130115492A KR 20130115492 A KR20130115492 A KR 20130115492A KR 1020120037815 A KR1020120037815 A KR 1020120037815A KR 20120037815 A KR20120037815 A KR 20120037815A KR 20130115492 A KR20130115492 A KR 20130115492A
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KR
South Korea
Prior art keywords
working plate
packages
calculating
package
tray
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KR1020120037815A
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Korean (ko)
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KR101422334B1 (en
Inventor
한광훈
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세메스 주식회사
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Priority to KR1020120037815A priority Critical patent/KR101422334B1/en
Publication of KR20130115492A publication Critical patent/KR20130115492A/en
Application granted granted Critical
Publication of KR101422334B1 publication Critical patent/KR101422334B1/en

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G01R31/2603—Apparatus or methods therefor for curve tracing of semiconductor characteristics, e.g. on oscilloscope
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

PURPOSE: A method for calculating the position data of a working plate and a method for transferring a package using the method are provided to accurately calculate the position of the package by using the position detection member of a peaker head. CONSTITUTION: Two points on one surface of a working plate is detected. The working plate supports semiconductor packages at regular intervals. The tilt angle of the working plate is calculated (S110). Each point of adjacent two surfaces of the working plate is detected. The reference position of one edge of the working plate is calculated (S120). [Reference numerals] (AA) Start; (BB) End; (S110) Calculate a working plate's tilt angle; (S120) Calculate the working plate's reference position; (S130) Calculate location data for each package; (S140) Calculate the working plate's center position; (S150) Calculate location data for each package; (S160) Compare the locations of the packages

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of calculating position data of a working plate and a method of transferring a package using the same,

The present invention relates to a method of calculating position data of a working plate and a package transfer method using the same, and more particularly to a position data calculation method of a working plate for calculating data relating to a position of a working plate on which semiconductor packages are placed And a package transfer method using the same.

Generally, in order to transfer packages from a pallet to a tray in a sorter apparatus, accurate positioning data of the packages in the pallet as the working plate and in the tray is required.

In the prior art, the position of the packages on the working plate is calculated by using a vision. Specifically, a package model jig is disposed at a specific position of the working plate, and the position of the jig is calculated through a vision. The package position must be calculated again every time the package is changed. Further, since the worker manually places the jig on the working plate, the work is difficult and the arrangement of the jig may not be accurate.

The present invention provides a position data calculation method of a working plate capable of accurately calculating the position of a working plate and the position of a package on the working plate.

The present invention provides a package transfer method using the position data calculation method of the working plate.

The position data calculation method of a working plate according to the present invention is characterized in that the position detection means of a picker head having a plurality of pickers and position detection means detects two points on one side in a working plate which supports semiconductor packages in a constant arrangement, Calculating a tilted angle of the working plate, and detecting, by the position detecting means, a point on two adjacent sides of the working plate, respectively, detecting a tilted angle of the working plate and an angle And a step of calculating a reference position of the reference point.

According to one embodiment of the present invention, the method of calculating the position data of the working plate may include calculating a distance between the reference position and the reference semiconductor package using the angle of rotation and the reference position of the working plate, And calculating the position of each package by calculating the distance between the packages and the distance between the packages.

According to an embodiment of the present invention, the method of calculating the position data of the working plate includes the steps of calculating the center position of the working plate using the reference position and size information of the working plate, Calculating a position of each package by calculating a distance between the center position and the reference semiconductor package, a distance between the position detecting means and the reference picker, and a distance between the packages using the center position, have.

According to an embodiment of the present invention, the method of calculating the position data of the working plate may further include the step of comparing the position of each package calculated using the reference position and the position of each package calculated using the center position .

According to one embodiment of the present invention, the working plate may be a pallet supporting the soaked packages.

According to one embodiment of the present invention, the working plate may be a tray supporting sorted packages.

Another package transfer method according to the present invention includes the steps of: calculating position data of a pallet supporting packages sown using position detecting means of a picker head having a plurality of pickers and position detecting means; Calculating position data of a tray for supporting the classified packages, picking up the packages of the pallet with pickers of the picker head and transferring them to the tray,

Wherein the step of calculating the position data of the pallet and the step of calculating the position data of the tray detect the two points of one side of the pallet and the tray by the position detecting means to calculate the angle of inclination of the pallet and the tray And detecting a position of two adjacent sides of the pallet and the tray, respectively, by the position detecting means, and detecting an angle of the one side of the pallet and the tray using the two angles of the pallet and the tray, Calculating a reference position, calculating a distance between the reference position and the reference semiconductor package, a distance between the position detecting means and the reference picker, and a distance between the packages using the angle and reference position of the pallet and the tray, To calculate the position of each package Step < / RTI >

The position data calculation method of the working plate according to the present invention can accurately calculate the position of the packages on the working plate by using the position detection means of the picker head. In addition, according to the method of calculating the position data of the working plate, the position data of the packages can be accurately calculated even if the sizes and intervals of the packages on the working plate are changed.

Further, according to the package transfer method using the method of calculating the position data of the working plate, the picker head can accurately transfer the packages of the pallet to the tray using the package position data on the pallet and the package position data on the tray .

FIG. 1 is a flowchart for explaining a position data calculation method of a working plate according to an embodiment of the present invention.
FIGS. 2 and 3 are views for explaining position data calculation of the working plate shown in FIG. 1. FIG.
4 is a flowchart illustrating a method of transporting a package according to an embodiment of the present invention.

Hereinafter, a position data calculation method and a package transfer method using the working plate according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are enlarged to illustrate the present invention in order to clarify the present invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprises", "having", and the like are used to specify that a feature, a number, a step, an operation, an element, a part or a combination thereof is described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the contextual meaning of the related art and are to be interpreted as either ideal or overly formal in the sense of the present application Do not.

FIG. 1 is a flowchart for explaining a position data calculation method of a working plate according to an embodiment of the present invention, and FIGS. 2 and 3 are views for explaining position data calculation of the working plate shown in FIG.

Referring to FIGS. 1 to 3, according to the method of calculating the position data of the working plate, first, the angle of rotation of the working plate 120 is calculated (S110).

The working plate 120 supports the packages 130. At this time, the packages 130 have a constant arrangement such as a matrix shape. For example, the working plate 120 may be a pallet that supports the packages 130 sown in the sawing apparatus. As another example, the working plate 120 may be a tray that supports the packages 120 inspected and classified using vision.

A picker head 110 for transferring the packages 130 is disposed on the working plate 120 and has a plurality of pickers 112 and position detecting means 114. The pickers 112 fix the packages 130 using a vacuum. The position detecting means 114 detects a specific position. For example, the position detecting means 114 may be a laser sensor. The laser sensor detects the specific position of the working plate 120 by checking the amount of light reflected by the working plate 120 and received by the light receiving unit. As another example, the position detecting means 114 may be a camera. A specific position of the working plate 120 may be detected using an image of the camera.

The position detecting means 114 of the picker head 110 is moved in a direction perpendicular to one side of the working plate 120 to detect two points A and B on one side. Since the line connecting the two points A and B is the same as the one side, the slope of the line connecting the two points A and B with respect to the predetermined reference axis is checked, Can be calculated.

Next, the reference position of the working plate 120 is calculated (S120).

The position detecting means 114 of the picker head 110 is moved in a direction perpendicular to two adjacent side surfaces of the working plate 120 to detect one point A 'and B' on the two sides, respectively . Since the two adjacent side surfaces on which the points A 'and B' are located are orthogonal to each other, each of the points A 'and B' is parallel to the two sides by using the angled angle of the calculated working plate 120, , B ') can be calculated. Then, the intersection point of the two straight lines is confirmed, and the reference position O of one corner defined by the two sides is calculated at the working plate 120.

The position of each package 130 on the working plate 120 is calculated using the angle of the working plate 120 and the reference position O at step S130.

Specifically, the position of the reference package and the interval (pitch) between the packages 130 are checked among the packages 130 on the working plate 120 using the apparatus information of the working plate 120. The reference package may be one of the packages 130, for example, a package closest to the reference position (O). The position of the reference package may be detected using the position detection means 114. [

When the position of the reference package and the distance between the packages 130 are confirmed, the distance between the reference position and the reference package and the distance between the reference package and each package 130 can be calculated. Therefore, the distance from the reference position O to each of the packages 130 can be calculated based on the angle of the working plate 120.

The distance between the reference position and the packages 130 is a distance based on the position detecting means 114. Since the transfer of the packages 130 is performed by the pickers 112, the distance between the position detecting means 114 and the picker 112 must be compensated. When the reference axis of the working plate 120 and the reference axis of the picker head 120 do not coincide with each other due to the angle of the working plate 120, do.

The distance between the position detector 114 and the reference picker among the pickers 112 can be confirmed. At this time, the reference picker is a picker 112 closest to the position detecting means 114 among the pickers 112. The distance between the position detecting means 114 and the reference picker can be obtained using the mechanism information of the picker head 110.

The distance from the reference position O to each of the packages 130 is compensated by the distance between the position detecting means 114 and the picker 112 so that the reference position O The position of each of the packages 130 is calculated.

The position of the picker head 110 with respect to the working plate 120 is fixed so that even if the size and spacing of the packages 130 are changed, The position of each of the packages 130 can be easily calculated at the reference position O. FIG.

For example, when an axis parallel to an edge including the point A 'on the working plate 120 is referred to as an X axis and an axis parallel to an edge including a point B' is referred to as a Y axis, x (X, y) is calculated as follows.

X axis position of package A = X1 + x * X2 + X3

Y-axis position of package A = Y1 + y * Y2 + Y3

Here, X1 is the X axis distance from the reference position O to the reference package, Y1 is the Y axis distance from the reference position (O) to the reference package, X2 is the X axis direction spacing (pitch) Axis distance between the position detecting means and the reference picker, and Y3 denotes the Y-axis distance between the position detecting means and the reference picker.

Next, the center position of the working plate 120 is calculated (S140).

The reference position O of the working plate 120 and the mechanism information of the working plate 120, that is, the length and the length of the longitudinal direction of the working plate 120, (C) can be calculated.

The position of each package 130 on the working plate 120 is calculated using the angle of the working plate 120 and the center position C in operation S150.

The calculation of the position of each package 130 using the center position C may be performed using the center position C of the working plate 120, ). ≪ / RTI >

Specifically, the position of the reference package and the gap between the packages 130 are checked using the mechanism information of the working plate 120. When the position of the reference package and the distance between the packages 130 are confirmed, the distance between the center position C and the reference package and the distance between the reference package and each package 130 can be calculated have. Therefore, the distance from the center position C to each of the packages 130 can be calculated.

The distance from the center position C to each of the packages 130 is compensated for by the distance between the position detecting means 114 and the picker 112 so that the distance from the center position C The position of each of the packages 130 is calculated.

Then, the positions of the packages 130 are compared (S160).

The position of each package 130 calculated using the reference position O and the position of each package 130 calculated using the center position C are compared. If the positions of the packages 130 match, it is determined that the positions of the packages 130 are accurately calculated. When the positions of the packages 130 do not coincide with each other, the position of each package 130 calculated using the reference position O and the center position C calculated using the center position C, And recalculates the positions of the packages 130 until the positions match. Therefore, the positions of the packages 130 can be accurately calculated.

According to the method of calculating the position data of the working plate, the positions of the packages 130 placed on the working plate 120 can be accurately calculated by using the position detecting means 114 of the picker head 110. According to the method of calculating the position data of the working plate, the position data of the packages 130 can be accurately calculated even if the sizes and intervals of the packages 130 placed on the working plate 120 are changed .

4 is a flowchart illustrating a method of transporting a package according to an embodiment of the present invention.

Referring to FIG. 4, in step S210, the position data of the pallet supporting the sown packages is calculated using the position detecting means of the picker head having a plurality of pickers and position detecting means according to the package transferring method.

A detailed description of the method of calculating the position data of the pallet is substantially the same as the method of calculating the position data of the working plate using Figs. 1 to 3, and thus a detailed description thereof will be omitted. Therefore, the position data of the packages placed on the pallet can be confirmed based on the reference picker of the picker head.

Next, the position data of the tray for supporting the packages classified using the position detecting means is calculated (S220).

A detailed description of the method for calculating the position data of the tray is substantially the same as the method of calculating the position data of the working plate using Figs. 1 to 3, and thus a detailed description thereof will be omitted. Accordingly, position data on which the packages classified on the tray are to be placed can be confirmed based on the reference picker of the picker head.

Thereafter, the packages of the pallet are picked up by the pickers of the picker head and transferred to the tray (S230).

Specifically, using the position data of the packages placed on the pallet, the picker head can accurately pick up the packages of the pallet. The picker head transports picked-up packages to the tray. The packages are inspected for defects by vision or the like during transportation. Thereafter, using the location data of the packages to be placed on the tray, the picker head can accurately load the packages that have been inspected on the tray.

According to the package transfer method, the picker head can accurately transfer the packages of the pallet to the tray using the package position data on the pallet and the package position data on the tray.

As described above, the method of calculating the position data of the working plate can accurately calculate the position of the packages on the working plate, and accurately calculate the position data of the packages even if the sizes and intervals of the packages on the working plate are changed. have.

Further, according to the package transfer method using the method of calculating the position data of the working plate, the picker head can accurately transfer the packages of the pallet to the tray using the package position data on the pallet and the package position data on the tray .

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the following claims. It can be understood that it is possible.

110: Picker head 112: Picker
114: position detecting means 120:
130; package

Claims (7)

Calculating a misaligned angle of the working plate by detecting two points on one side of the working plate which supports the semiconductor packages in a constant arrangement with the position detecting means of the picker head having a plurality of pickers and position detecting means; And
Detecting each point of two adjacent sides of the working plate by the position detecting means, and calculating a reference position of one corner of the working plate using the twisted angle of the working plate and the two detection points. Position data calculation method of the working plate, characterized in that. The method of claim 1, wherein the distance between the reference position and the reference semiconductor package, the distance between the position detecting means and the reference picker, and the distance between the packages are calculated using the twisted angle and the reference position of the working plate. Computing the position of the package further comprising the step of calculating the position data of the working plate. The method of claim 2, further comprising: calculating a center position of the walking plate using the reference position and the size information of the working plate; And
The position of each package is calculated by calculating the distance between the center position and the reference semiconductor package, the distance between the position detecting means and the reference picker and the distance between the packages using the twisted angle and the center position of the working plate. Position data calculation method of the working plate further comprising the step of. 4. The method according to claim 3, further comprising the step of comparing positions of the packages calculated using the positions of the respective packages calculated using the reference position and the center position, . The method of claim 1, wherein the working plate is a pallet supporting the sawed packages. The method of claim 1, wherein the working plate is a tray that supports sorted packages. Calculating position data of a pallet supporting the packages sown using position detecting means of a picker head having a plurality of pickers and position detecting means;
Calculating position data of the tray for supporting the packages classified using the position detection means;
Picking up the packages of the pallet with pickers of the picker head and transferring them to the tray,
The step of calculating the position data of the pallet and the step of calculating the position data of the tray,
Calculating a misaligned angle between the pallet and the tray by detecting two points on one side of the pallet and the tray by the position detecting means;
The position detecting means detects one point of two adjacent sides on the pallet and the tray, respectively, and uses the twisted angles of the pallet and the tray and the two detection points to determine a reference position of one corner on the pallet and the tray. Calculating; And
The position of each package is calculated by calculating the distance between the reference position and the reference semiconductor package, the distance between the position detecting means and the reference picker, and the distance between the packages using the skewed angle and the reference position of the pallet and the tray. Package transfer method comprising the step of calculating each.
KR1020120037815A 2012-04-12 2012-04-12 Method of calculating position data of a working plate and method of transferring a package using the method KR101422334B1 (en)

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KR1020120037815A KR101422334B1 (en) 2012-04-12 2012-04-12 Method of calculating position data of a working plate and method of transferring a package using the method

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Cited By (1)

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Publication number Priority date Publication date Assignee Title
KR20200122853A (en) * 2019-04-19 2020-10-28 씨티에스(주) Apparatus for adjusting clearance between adjacent pickers configured to convey optical element

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Publication number Priority date Publication date Assignee Title
KR102304256B1 (en) * 2015-06-10 2021-09-23 세메스 주식회사 Method of testing customer tray

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KR100436656B1 (en) * 2001-12-17 2004-06-22 미래산업 주식회사 method for teaching working position in semiconductor test handler
KR20090053127A (en) * 2007-11-22 2009-05-27 세크론 주식회사 Aligning and transferring apparatus of semiconductor device for saw and sorting system and aligning and transferring method using the same
KR20100068697A (en) * 2008-12-15 2010-06-24 세크론 주식회사 Pickup and transferring apparatus for semiconductor device and aligned direction correcting method using the same
KR101195827B1 (en) * 2009-04-23 2012-11-05 세크론 주식회사 Edge detecting method of semiconductor chip package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200122853A (en) * 2019-04-19 2020-10-28 씨티에스(주) Apparatus for adjusting clearance between adjacent pickers configured to convey optical element

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