KR20130113099A - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

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Publication number
KR20130113099A
KR20130113099A KR1020120035416A KR20120035416A KR20130113099A KR 20130113099 A KR20130113099 A KR 20130113099A KR 1020120035416 A KR1020120035416 A KR 1020120035416A KR 20120035416 A KR20120035416 A KR 20120035416A KR 20130113099 A KR20130113099 A KR 20130113099A
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KR
South Korea
Prior art keywords
laser
laser source
stage
source
scanner
Prior art date
Application number
KR1020120035416A
Other languages
Korean (ko)
Inventor
유홍준
이무찬
고훈
유태식
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(주)제이티
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to KR1020120035416A priority Critical patent/KR20130113099A/en
Publication of KR20130113099A publication Critical patent/KR20130113099A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B23K26/103—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam the laser beam rotating around the fixed workpiece

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention relates to a laser processing apparatus, and more particularly, to a laser processing apparatus for performing drilling, marking, sawing, cutting, etc. on a sample using a laser.
The present invention comprises a first laser source and a second laser source for generating a laser beam; A stage on which a sample to be laser processed is seated; At least one scanner unit receiving a laser beam of at least one of the first laser source and the second laser source and laser processing a sample mounted on the stage by using a scanner; At least one focusing unit configured to receive a laser beam of at least one of the first laser source and the second laser source, condense it into a focusing lens, and laser process a sample mounted on the stage; And a first selective mover and a second selective mover for selectively transferring a laser beam generated from each of the first and second laser sources to the scanner unit or the focusing unit. To start.

Description

Laser processing apparatus

The present invention relates to a laser processing apparatus, and more particularly, to a laser processing apparatus for performing drilling, marking, sawing, cutting, etc. on a sample using a laser.

More specifically, the laser processing apparatus refers to a device that performs laser drilling, marking, sawing, and cutting with respect to a sample.

As described in Korean Patent Laid-Open Publication No. 10-2011-0119086, the laser processing machine processes the desired shape by driving only the XY axis stage while scanning the laser at a certain point and condensing with a focusing lens according to the construction method and the purpose of use. Method to process the shape with the scanner attached with mirror to the 2-axis or 3-axis galvano motor while the workpiece is stopped, welding technology with the laser scanner while moving the articulated robot, low speed xy stage controller and high speed It is configured to perform any one of a method of separately manufacturing and processing a multi-speed positioning system for analyzing and processing data of the scanner controller.

On the other hand, in the laser processing apparatus, the kind, strength, processing method, and the like of the laser beam are determined depending on the physical properties of the sample to be processed and the type of processing.

However, in the case of a conventional laser processing apparatus, since a processing method using a single laser source, a focusing lens, a processing method using a scanner, and the like are already determined, it is impossible to process more various kinds of samples. There is a problem that the utilization rate is lowered by performing the processing method.

An object of the present invention is to perform a variety of laser processing by selectively performing the laser processing using at least one of two or more laser sources, each processing method using a focusing lens and a processing method using a scanner. The laser is there to provide factory value.

The present invention has been made to achieve the object of the present invention as described above, the present invention comprises: a first laser source and a second laser source for generating a laser beam; A stage on which a sample to be laser processed is seated; At least one scanner unit receiving a laser beam of at least one of the first laser source and the second laser source and laser processing a sample mounted on the stage by using a scanner; At least one focusing unit configured to receive a laser beam of at least one of the first laser source and the second laser source, condense it into a focusing lens, and laser process a sample mounted on the stage; And a first selective mover and a second selective mover for selectively transferring a laser beam generated from each of the first and second laser sources to the scanner unit or the focusing unit. To start.

The first laser source and the second laser source may be arranged so that the laser beams scan in parallel with each other, and the scanning directions thereof may be opposite to each other.

The first selective shifter and the second selective shifter are disposed on an optical path through which the laser beams of the first laser source and the second laser source are scanned, respectively, the first laser source and the second laser source. By switching the path of the laser beam generated in the can be selectively delivered to the scanner unit or the focusing unit.

The first laser source and the second laser source are disposed on the same XY plane with the scanning direction of the laser beam as the X axis, and the stage is arranged such that the surface of the specimen is parallel to the XY plane, and the scanner unit Alternatively, the focusing unit may be disposed between the XY plane and the stage in a Z axis direction perpendicular to the XY plane.

The first selective shifting unit and the second selective shifting unit convert the laser beams generated by the first laser source and the second laser source in a first switching direction and a Y-axis direction, respectively; It can be selectively transmitted to the scanner section or the focusing section in two switching directions.

The focusing unit and the scanner unit are installed to be movable in a first axis direction parallel to the scanning direction of the laser beams of the first laser source and the second laser source, and the stage is perpendicular to the first axis direction. It may be installed to be movable.

The invention also includes at least one laser source for generating a laser beam; A stage on which a sample to be laser processed is seated; At least one scanner unit receiving the laser beam from the laser source and laser processing a sample mounted on the stage using a scanner; At least one focusing unit receiving the laser beam from the laser source and condensing the light into a focusing lens to laser process a sample mounted on the stage; The laser is factory-set characterized in that it comprises one or more selection moving parts for selectively transferring the laser beam generated from the laser source to the scanner unit or the focusing unit corresponding to the laser source.

The laser source and the selection moving unit may be installed to correspond to each other and may be installed in one or a plurality.

The laser processing device according to the present invention selectively delivers a laser beam generated from two or more laser sources and a plurality of laser sources to a scanner unit having a scanner and a focusing unit having a focusing lens. The laser processing using the laser processing and the focusing lens can be used to perform a variety of laser processing.

In particular, the laser processing factory according to the present invention is capable of performing any one or all of laser processing using a scanner and laser processing using a focusing lens, and thus, there is an advantage that laser processing in various combinations is possible.

In addition, according to the present invention, the type of laser, the wavelength, the pulse width, and the output of the laser are determined according to the type of the sample, and thus, a plurality of laser sources may be used to deal with more various samples.

In addition, since the laser processing plant according to the present invention has a plurality of laser sources, it is possible to perform performance testing of laser processing under various conditions, and thus, there is an advantage in that various tests can be performed before systemization of the device.

In addition, the laser processing device according to the present invention further includes a scanner unit having a scanner corresponding to one or more laser sources and a selective moving unit for selectively transferring a laser beam of the laser source to a focusing unit having a focusing lens. There is an advantage to this.

1 is a side view of a laser according to the present invention showing a factory value.
FIG. 2 is a plan view of the laser processing apparatus of FIG. 1. FIG.
3 is a plan view illustrating a stage, a focusing unit, and a scanner unit of the laser processing apparatus of FIG. 1.
4A and 4B are conceptual views illustrating the operation of each of the first selective mover and the second selective mover.

Hereinafter, a laser processing apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

As shown in Figs. 1 to 3, the first laser source 110 and the second laser source 120 for generating laser beams L1 and L2 according to the present invention; A stage 210 on which the sample 10 to be laser processed is seated; At least one scanner unit 310 that receives the laser beam of at least one of the first laser source 110 and the second laser source 120 to laser process the sample 10 seated on the stage 210 by using a scanner. )Wow; The laser beams L1 and L2 of at least one of the first laser source 110 and the second laser source 120 are received and focused by a focusing lens to laser process the sample 10 seated on the stage 210. At least one focusing unit 320; First selection moving unit 410 for selectively transmitting the laser beam (L1, L2) generated in each of the first laser source 110 and the second laser source 120 to the scanner unit 310 or the focusing unit 320 ) And a second selective movement unit 420.

Here, the sample 10 to be subjected to laser processing is any object that requires laser processing such as marking, sawing, scribing, cutting, drilling, groove forming, heat treatment, and the like. It is also possible.

The object of laser processing may be a wafer for manufacturing a semiconductor, a semiconductor substrate, a solar cell substrate, an LCD substrate, an OLED substrate, etc., which have undergone a semiconductor process.

The first laser source 110 and the second laser source 120 is a configuration for generating a laser beam for laser processing, according to the type of laser processing, the type and material of the specimen 10, CO laser, IR laser, Green laser, UV laser, etc. can be used, and the wavelength, pulse width, output, etc. are determined according to the processing conditions.

The first laser source 110 and the second laser source 120 are fixed to the support frame 130 so that the optical paths of the laser beams L1 and L2 can be precisely formed. In this case, the first laser source 110 and the second laser source 120 is preferably detachably fixed to the support frame 130 so that replacement is possible.

The support frame 130 may have any configuration as long as it can stably support the first laser source 110 and the second laser source 120, and may be separately configured or integrally installed on the base frame 190. Can be.

Here, the base frame 190 may be configured in various ways as a structure for supporting the support frame 130, the stage 210, and the like.

Meanwhile, as shown in FIGS. 1 and 2, the first laser source 110 and the second laser source 120 are disposed on the same XY plane with the X-axis scanning directions of the laser beams L1 and L2. This is preferred.

The first laser source 110 and the second laser source 120 may be arranged to scan the laser beams L1 and L2 in parallel with each other, and the scanning directions thereof may be opposite to each other.

Meanwhile, the first laser source 110 and the second laser source 120 may be configured in the same kind, or may have various combinations such as different wavelengths, pulse widths, and outputs.

In addition, the first laser source 110 and the second laser source 120 is preferably disposed on the same XY plane with the scanning direction of the laser beam (L1, L2) as the X axis, the stage 210 to be described later The surface of the sample 10 may be arranged to be parallel to the XY plane. The scanner unit 310 and the focusing unit 320 to be described later may be disposed between the X-Y plane and the stage 210 in the Z-axis direction perpendicular to the X-Y plane.

The stage 210 is configured to support the sample 10 to be subjected to laser processing, and various configurations are possible according to the type and the seating state of the sample 10.

As an example, the different stage 210 may be configured in the form of a plate that forms a seating surface on which the sample 10 is seated, as shown in FIGS. 1 and 3.

In addition, since the sample 10 requires relative movement with respect to the focusing unit 310 and the scanner unit 320 in order to perform laser processing, the stage 210 on which the sample 10 is seated has a first axial direction ( It can be installed to enable one-dimensional movement in the X-axis direction, Y-axis direction, Z-axis direction), two-dimensional movement such as XY axis direction, three-dimensional movement such as XYZ direction, XY-θ direction.

For example, the stage 210 is a second axis perpendicular to the first axis direction (X axis direction) with respect to the focusing unit 310 and the scanner unit 320 moving in the eleventh axis direction (X axis direction). It can be installed to enable one-dimensional movement in the direction (Y-axis direction).

In this case, as shown in FIGS. 1 and 3, the stage 210 may be supported and installed on the guide rail 220 to allow linear movement by a one-dimensional movement and a linear driving unit (not shown) of the stage 210. Can be.

The guide rail 220 may be any configuration as long as it is installed in the base frame 190 to guide linear movement of the stage 210.

Meanwhile, the mounting of the sample 10 on the stage 210 may be performed by various methods, such as by hand or by a lift pin or a robot.

The scanner 310 receives a laser beam (L1, L2) of at least one of the first laser source 110 and the second laser source 120, the sample is mounted on the stage 210 using a scanner ( Various configurations are possible as the configuration for laser processing 10).

The scanner unit 210 is configured to be processed in a predetermined pattern on the sample 10 by using a laser beam, and can be configured in various ways, such as having a galvano mirror.

In addition, the scanner unit 210 may use the first selective mover 410 and the second selective mover 420 to generate the laser beams L1 and L2 generated by the first laser source 110 and the second laser source 120. Equipped with a suitable optical system (not shown), such as a mirror, a lens so as to be selectively delivered by.

Here, the scanner unit 210 is composed of two to correspond to each of the laser beam (L1, L2) of the first laser source 110 and the second laser source 120, or the first laser source 110 and the second Various configurations are possible, such as being configured to selectively receive the laser beams L1 and L2 of the laser source 120 or both of them.

The focusing unit 320 receives the laser beams L1 and L2 of at least one of the first laser source 110 and the second laser source S20 and condenses them with a focusing lens to be seated on the stage 210. Various configurations are possible as the configuration for laser processing the sample 10.

The focusing unit 320 is similar to the scanner unit 310 to the first selective movement unit 410 for the laser beams L1 and L2 generated by the first laser source 110 and the second laser source 120. And a suitable optical system such as a mirror and a lens so as to be selectively transmitted by the second selective movement unit 420.

In addition, similar to the scanner unit 310, the focusing unit 320 may be configured in two to correspond to each of the laser beams L1 and L2 of the first laser source 110 and the second laser source 120, or may include a first laser beam. Various configurations are possible, such as being configured to selectively receive the laser beams L1 and L2 of the laser source 110 and the second laser source 120 or both of them.

Meanwhile, the scanner unit 310 and the focusing unit 320 are installed in a fixed state on the support frame 130, or at least one of the scanner unit 310 and the focusing unit 320 is installed in the support frame 130. It may be installed to be movable along the guide rail 140.

In particular, the focusing unit 310 and the scanner 320 may have a first axis direction (X-axis direction) parallel to the scanning directions of the laser beams L1 and L2 of the first laser source 110 and the second laser source 120. When installed in a movable manner, the stage 210 may be perpendicular to the first axial direction (X-axis direction), that is, movably installed in the Y-axis direction.

In addition, the focusing unit 310 and the scanner 320 may be installed in various ways, such as being fixedly installed, installed independently of each other to be movable, or installed to be movable together with each other.

As shown in FIGS. 1, 4A, and 4B, the first selective mover 410 and the second selective mover 420 may be formed at the first laser source 110 and the second laser source 120, respectively. Various configurations are possible as a configuration for selectively transferring the generated laser beams L1 and L2 to the scanner 310 or the focusing section 320.

That is, the first selective mover 410 and the second selective mover 420 respectively scan the laser beams L1 and L2 generated by the first laser source 110 and the second laser source 120. As a configuration for selectively transmitting to the 310 or the focusing unit 320, any configuration can be used as long as it can switch the paths of the laser beams L1 and L2, as shown in FIGS. 4A and 4B, It may be composed of one or more mirrors to switch the optical path of the laser beam (L1, L2) by rotation.

More specifically, the first selective mover 410 and the second selective mover 420 are disposed on an optical path through which the first laser source 110 and the second laser source 120 are scanned, respectively. In the same manner, the paths of the laser beams L1 and L2 may be switched to selectively transfer the laser beams L1 and L2 to the scanner 310 or the focusing unit 320.

As shown in FIG. 4A, the laser beams L1 and L2 of the first laser source 110 and the second laser source 120 are switched from the X-axis direction to the Z-axis direction (first switching direction). And may be passed to 310.

In addition, as shown in FIG. 4B, the laser beams L1 and L2 of the first laser source 110 and the second laser source 120 are focused by switching (second switching direction) from the X-axis direction to the Y-axis direction. It may be delivered to the unit 320.

Here, the light path may be variously set according to the position and configuration of the scanner 310 and the focusing unit 320.

Meanwhile, in order to reach the laser beams L1 and L2 from the first laser source 110 and the second laser source 120 to the scanner 310 and the focusing unit 320 (see the example shown in FIG. 3), It requires the conversion and amplification of the optical path, which is composed of a combination of a mirror, a lens, etc., and can be variously configured according to the specific configuration of the scanner unit 310 and the focusing unit 320, and thus detailed description thereof will be omitted.

In the embodiment of the present invention, the configuration of two laser sources, that is, the first laser source and the second laser source, has been described. However, one or three or more laser sources are installed, and each laser source is provided. Correspondingly, a plurality of selective moving units for switching the optical path of the laser beam may be provided.

That is, the selective moving unit having the above configuration is installed in correspondence with the laser source in the laser processing apparatus so as to selectively perform the laser processing using the scanner and the laser processing using the focusing lens corresponding to each laser source.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention as defined in the appended claims. It is to be understood that both the technical idea and the technical spirit of the invention are included in the scope of the present invention.

10: sample
110: first laser source 120: second laser source
210: stage
310: scanner portion 320: focusing portion
410: the first selective mover 420: the second selective mover

Claims (8)

A first laser source and a second laser source for generating a laser beam;
A stage on which a sample to be laser processed is seated;
At least one scanner unit receiving a laser beam of at least one of the first laser source and the second laser source and laser processing a sample mounted on the stage by using a scanner;
At least one focusing unit configured to receive a laser beam of at least one of the first laser source and the second laser source, condense it into a focusing lens, and laser process a sample mounted on the stage;
And a first selective mover and a second selective mover for selectively transferring a laser beam generated from each of the first and second laser sources to the scanner unit or the focusing unit. . The method according to claim 1,
And the first laser source and the second laser source are arranged so that the laser beams scan in parallel with each other, and their scanning directions are opposite to each other. The method according to claim 1,
The first selective shifter and the second selective shifter are disposed on an optical path through which the laser beams of the first laser source and the second laser source are scanned, respectively.
And a path of the laser beam generated by the first laser source and the second laser source to be selectively transmitted to the scanner unit or the focusing unit. The method according to claim 1,
The first laser source and the second laser source are disposed on the same XY plane with the scanning direction of the laser beam as the X axis,
The stage is disposed so that the surface of the sample is parallel to the XY plane,
And the scanner portion or the focusing portion is disposed between the XY plane and the stage in a Z-axis direction perpendicular to the XY plane. The method according to any one of claims 1 to 4,
The first selective shifting unit and the second selective shifting unit convert the laser beams generated by the first laser source and the second laser source in a first switching direction and a Y-axis direction, respectively; The laser processing apparatus, characterized in that for selectively transferring to the scanner portion or the focusing portion in the two switching directions. The method according to claim 5,
The focusing unit and the scanner unit are installed to be movable in a first axial direction parallel to the scanning direction of the laser beams of the first laser source and the second laser source,
And said stage is installed to be movable in a direction perpendicular to said first axial direction. At least one laser source for generating a laser beam;
A stage on which a sample to be laser processed is seated;
At least one scanner unit receiving the laser beam from the laser source and laser processing a sample mounted on the stage using a scanner;
At least one focusing unit receiving the laser beam from the laser source and condensing the light into a focusing lens to laser process a sample mounted on the stage;
And at least one selective moving unit for selectively transmitting a laser beam generated from the laser source to the scanner unit or the focusing unit corresponding to the laser source. The method of claim 7,
The laser processing device, characterized in that the laser source and the selection moving portion is installed corresponding to each other and installed in one or a plurality.
KR1020120035416A 2012-04-05 2012-04-05 Laser processing apparatus KR20130113099A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190036872A (en) * 2017-09-28 2019-04-05 (주)제이티 Planarization module for laser processing apparatus, and Planarization method for the same
CN110877455A (en) * 2019-11-22 2020-03-13 沈阳建筑大学 Multi-light-source multi-degree-of-freedom variable platform liquid 3D printer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190036872A (en) * 2017-09-28 2019-04-05 (주)제이티 Planarization module for laser processing apparatus, and Planarization method for the same
CN110877455A (en) * 2019-11-22 2020-03-13 沈阳建筑大学 Multi-light-source multi-degree-of-freedom variable platform liquid 3D printer

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