KR20130099793A - Heterostructure and method of fabricating the same - Google Patents

Abstract

PURPOSE: A heterojunction structure is provided to control the generation of particles, to reduce the manufacturing costs, to conduct fine cutting process, and to offer excellent heat transfer rate and minimized thermal stress. CONSTITUTION: A heterojunction structure includes a first unit (410) and a second unit (201). The first unit contains ceramics. The second unit contains carbon, and is brazing-combined to the first unit. The second unit includes a hybrid complex containing carbon. The hybrid complex includes a body unit (112) and a canning unit. The body unit contains carbon. The canning unit contains aluminum, and surrounds the outer surface of the body unit. A manufacturing method of the heterojunction structure comprises the following steps: preparing the first unit containing ceramics; forming a second unit containing carbon; and brazing-combining the first and second units.

Description

TECHNICAL FIELD The present invention relates to a hetero-junction structure and a method of fabricating the hetero-

The present invention relates to a heterogeneous bonded structure and a method of manufacturing the same, and more particularly, to a heterogeneous bonded structure of a low thermal expansion composite including a ceramic and carbon and a method of manufacturing the same.

Basically, ceramic materials have corrosion resistance, insulation and dielectric properties unlike metallic materials. In particular, aluminum nitride is an excellent ceramic material and has superior heat conduction properties equivalent to or higher than aluminum metal. Due to this characteristic, the ceramic material can be used, for example, on an insulating substrate on which circuits for LED, power semiconductor packages are formed. Such a ceramic material may also be used for temperature control of these substrates while mounting the wafer and the glass substrate in, for example, chemical vapor deposition (CVD), physical vapor deposition (PVD) and plasma etching processes for producing semiconductors and display devices A heater or a susceptor in which a complicated flow path of a cooling medium is embedded. As materials applicable to these parts, in addition to ceramic materials, aluminum coated with an oxide coating layer by an anodizing and spraying process of a ceramic material can be used. However, due to the difference in the thermal expansion coefficient between the oxide and the aluminum material, the oxide film layer breaks down and the use thereof is very limited in a rapid temperature cycle in order to realize a wide temperature range or a high processing speed.

As an example, in a cooling plate part used in a plasma etching or gap fill process, when a ceramic substrate material having an electrostatic chucking function is bonded and assembled on an aluminum body having a complicated flow path, a gap between a different material such as a metal material and a ceramic material Considering the warpage caused by the difference in thermal expansion coefficient and the generation of cracks in the thermal stress, parts in the form of bonding with a polymer adhesive near room temperature are used. However, the use of such an adhesive has a problem of not effectively controlling the temperature rise of the substrate due to the low thermal conductivity of the adhesive and also deteriorating the large-area deposition and the temperature uniformity of the etched substrate. In particular, Problems such as low heat resistance of the joint portion and contamination of the process chamber due to the polymer adhesive material are pointed out under the temperature atmosphere raised by the collision.

As another example, a heating plate made of aluminum nitride (AlN) in which a coil of a metal heating element such as molybdenum or tungsten having a coefficient of thermal expansion close to that of ceramic is incorporated is used as a high-temperature heating component used in a chemical vapor deposition process, The use of ceramics increases the manufacturing cost of the component.

Accordingly, it is an object of the present invention to provide a hetero-junction structure that can withstand high temperature and wide temperature cycling environments, and is capable of performing precision cutting such as metal, In order to minimize the thermal stress of heterogeneous joints, it is necessary to apply a new low thermal expansion material close to the thermal expansion coefficient of ceramics and to form and maintain a good interface with ceramics in a wide and rapid temperature cycle. . This problem of the present invention has been presented by way of example, and therefore, the present invention is not limited to this problem.

A heterogeneous junction structure according to one aspect of the present invention is provided. The heterojunction structure includes a first portion including a ceramic and a second portion including carbon and brazed to the first portion.

In the heterogeneous bonded structure, the second portion may include a hybrid composite containing carbon.

In the heterojunction structure, the hybrid composite may include a body including carbon and aluminum, and a canning surrounding the outer surface of the body.

In the heterojunction structure, the hybrid composite includes a plurality of carbon layers spaced apart from each other, a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers, and aluminum, and the plurality of carbon layers And a canning portion surrounding the outer surface of the sintered composite layer.

Wherein the hybrid composite comprises a plurality of carbon layers spaced apart from one another, a thermally conductive layer interposed between the plurality of carbon layers and aluminum, and the plurality of carbon layers and the carbon layer And a canning portion surrounding the outer surface of the heat conduction layer.

In the heterogeneous bonded structure, the thermal expansion coefficient? ₂ of the hybrid composite can satisfy the relationship between the thermal expansion coefficient? ₁ of the ceramic and (? ₁ x 0.9) <? ₂ <(? ₁ x 1.1).

In the heterojunction structure, the second part may be a body part composed only of carbon.

In the heterojunction structure, the carbon may include at least one of isotropic carbon and anisotropic carbon.

In the heterogeneous bonded structure, the ceramic includes aluminum nitride (AlN), and the first portion may be directly brazed to the second portion.

In the heterogeneous bonded structure, the ceramic comprises alumina (Al ₂ O ₃ ), and the first part is bonded to the second part via a molybdenum-manganese metallizing layer formed on a surface facing the second part, Can be bonded.

A method of manufacturing a heteroj unction structure according to another aspect of the present invention is provided. The method for producing a heterojunction structure includes preparing a first portion including a ceramic, forming a second portion including carbon, and brazing the first portion and the second portion.

In the method of manufacturing a heterojunction structure, the step of forming the second portion including carbon may include forming a first structure including carbon and a canning portion including aluminum so as to surround the outer surface of the first structure And a step of forming a metal layer.

In the method of manufacturing a hetero-junction structure, the first structure may include a body including carbon.

In the method of manufacturing a hetero-junction structure, the first structure may include a plurality of carbon layers spaced apart from each other and a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers.

In the method of manufacturing a hetero-junction structure, the first structure may include a plurality of carbon layers spaced apart from each other, and aluminum, and a heat conduction layer interposed between the plurality of carbon layers.

The method may further include forming a metalizing layer surrounding the outer surface of the first structure between the step of forming the first structure and the step of forming the canning portion in the method of manufacturing a heterojunction structure . Further, the forming of the metalizing layer may include disposing a metal foil on the outer surface of the first structure through a first filler, and disposing the first structure, the first filler, The method comprising the steps of:

In the method of manufacturing a hetero-junction structure, the step of forming the canning portion may include the steps of disposing an aluminum plate on an outer surface of the first structure via a second filler, and a step of disposing the first structure, And a second heat treatment of the plate material. Further, the brazing step may include a third heat treatment of the first part, the second part and the third filler via the third pillar between the first part and the second part . Here, the second filler and the third filler are made of the same material, and the second heat treatment step and the third heat treatment step may be performed simultaneously under the same heat treatment condition.

According to one embodiment of the present invention as described above, it is possible to realize a heterogeneous bonded structure having excellent heat transfer performance while suppressing generation of particles and reducing manufacturing cost, and a manufacturing method thereof.

1 is a cross-sectional view illustrating a heterojunction structure according to an embodiment of the present invention.
Fig. 2 is a photograph showing the appearance of the brazing-after-bonded structure of an aluminum nitride / carbon material.
FIG. 3A is a photograph showing the appearance of a brazed-in-multiple-junction structure of aluminum nitride (AlN) / carbonaceous material (ET-10) according to an embodiment of the present invention, AlN) / Al6061 series alloy after brazing.
Figures 4a and 4b are plan and cross-sectional micrographs of a sintered composite of aluminum powder and 50 vol% carbon fibers, respectively.
5 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention.
6 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention.
7 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention.
8A to 8F are views illustrating a method of forming a heterojunction structure according to another embodiment of the present invention.
9A and 9B are views illustrating a modified method of forming a heterojunction structure according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the present embodiments are intended to complete the disclosure of the present invention and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. In the drawings, the components may be exaggerated or reduced in size for convenience of explanation.

Terms such as "top" or "bottom" referred to in the process of describing the present embodiment may be used to describe the relative relationship of certain elements to other elements, as illustrated in the figures. That is, relative terms may be understood to include different directions of the structure apart from the directions depicted in the figures. For example, if the top and bottom of the structure are inverted in the figures, the elements depicted as being on the top surface of the other elements may be on the bottom surface of the other elements. Thus, by way of example, the term "tops" may include both "top" and "bottom" directions, relative to a particular direction in the figures.

Further, in the course of describing the present embodiment, when it is mentioned that an element is located on another element, or "connected" to another element, the element is positioned directly on the other element Or directly connected to the other component, but may also mean that one or more intervening components may be present therebetween. However, when an element is referred to as being "directly on" another element, "directly connected" to another element, or "directly in contact" with another element, Which means that there are no intervening components.

In the following embodiments, the x-axis, the y-axis, and the z-axis are not limited to three axes on the orthogonal coordinate system, and can be interpreted in a broad sense including the three axes. For example, the x-axis, y-axis, and z-axis may be orthogonal to each other, but may refer to different directions that are not orthogonal to each other.

The present application claims priority to U.S. Patent Application No. 10-2012-0021442, filed on February 29, 2012 by the applicant, the contents of which are incorporated herein by reference in their entirety.

1 is a cross-sectional view illustrating a heterojunction structure according to an embodiment of the present invention. Referring to FIG. 1, a heterojunction structure according to an embodiment of the present invention includes a first portion 410 including ceramics and a second portion 201 including carbon. Since the first part 410 and the second part 201 are brazed, the brazed joint 310 is interposed between the first part 410 and the second part 201. The brazing joint 310 may be understood as a heterojunction in which at least a portion of the filler and the bonding base material used for the brazing joint are melt-diffused. 410 and / or second portion 201 may not be clearly distinguished.

The first part 410 includes a ceramic material, and may be formed of, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second part 201 may be a body part 112 composed only of carbon. For example, the second portion 201 may comprise isotropic carbon or anisotropic carbon. Meanwhile, in a modified embodiment, the second portion 201 may be composed of a sintered composite of aluminum and carbon. The first portion 410 and the second portion 201 may be directly brazed when the first portion 410 comprises aluminum nitride (AlN) ₂ O ₃ ), the first portion 410 is brazed to the second portion 201 via the molybdenum-manganese metallization layer formed on the surface facing the second portion 201 .

The degree of the difference in the thermal expansion coefficient between the first portion 410 and the second portion 201 is an important factor affecting the thermal stress of the hetero-junction structure. The ceramic material composing the first portion 410 and the second portion 201 may be minimized by minimizing the difference in thermal expansion coefficient of the carbon material constituting the carbon material. Table 1 shows thermal expansion coefficients and thermal conductivities for carbon materials, sintered composites and ceramics materials applicable to the present invention.

[Table 1]

In the present invention, by way of example, a carbon material having a coefficient of thermal expansion equal to or lower than that of aluminum nitride (AlN) ceramics is directly bonded to aluminum nitride (AlN) ceramics using an active filler metal. And a manufacturing method thereof. Ag-Cu-Ti-based filler metal and Au-Ni-Ti filler metal may be used as the active filler metal. In addition, a Ti-Zr-based active filler metal containing a large amount of titanium (Ti) and zirconium (Zr) which are active metals can be used.

2 is a photograph showing the appearance of a heterogeneous bonded structure of aluminum nitride (AlN) / carbonaceous material (ET-10) bonded by brazing. 2, the bonding conditions in this embodiment were used as the active filler metal of the Ti-43.5Zr-6.5Ni-8.1Cu (wt%) having a liquidus temperature of 855 ℃, 1 x 10 ^-5 Torr A high-vacuum graphite furnace having a degree of vacuum of less than &lt; RTI ID = 0.0 &gt; 900 C &lt; / RTI &gt; At this time, the size of the aluminum nitride (AlN) ceramic substrate was 125 mm × 62 mm × 0.2 mmt and the carbon material was 125 mm × 62 mm × 10 mmt graphite material (ET-10). The coefficient of thermal expansion of aluminum nitride (AlN) is 4.5 x 10 ^-6 / K, and the coefficient of thermal expansion of the inde ET-10 type of carbonaceous material is 3.8 x 10 ^-6 / K, a good bonding interface, and thermal stress to said joint conditional A stable heterogeneous junction structure can be realized. For comparison, a heterogeneous bonded structure was formed by joining the base material of aluminum nitride (AlN) and Al6061 series alloy by brazing.

FIG. 3A is a photograph showing the appearance of a brazed-in-multiple-junction structure of aluminum nitride (AlN) / carbonaceous material (ET-10) according to an embodiment of the present invention, AlN) / Al6061 series alloy after brazing. 3A, a Ti-43.5Zr-6.5Ni-8.1Cu alloy was used as a filler, and a high-vacuum graphite furnace having a vacuum degree of 1 x 10 ^-5 Torr or less was used as a bonding agent. Lt; 0 &gt; C. On the other hand, Al-12Si alloy was used as a bonding condition of the heterojunction structure shown in FIG. 3B, and a temperature of 600 ° C for 30 minutes was measured using a high vacuum graphite furnace having a degree of vacuum of 1 x 10 ^-5 Torr or less Respectively. It can be seen that the heterogeneous bonding structure according to the embodiment of the present invention (FIG. 3A) has less deformation of the structure due to thermal stress than the heterogeneous bonding structure according to the related art (FIG. 3B) despite the high brazing temperature .

Meanwhile, as described above, in the modified embodiment of the present invention, the second portion 201 may be composed of a sintered composite of aluminum and carbon. Carbon is a reinforcing material of a sintered composite material. For example, carbon fibers can be applied. Chopped carbon fibers having a length of 100 microns or less can be used. In addition to carbon fiber, alternate applications such as graphite carbon or carbon powder having low thermal expansion and high thermal conductivity properties are also possible.

The mixing ratio of aluminum powder and carbon may be 20 to 60 vol%, but it is preferably 30 to 50 vol% in consideration of the thermal expansion coefficient and sinterability. After the aluminum powder and the carbon fiber are mixed by a dry method and a wet method, they can be sintered and sintered by a general sintering method such as hot press method, electrification-pressure sintering method or HIP method, for bulking. A good sintered body can be obtained through vacuum sintering at a temperature of 500 to 650 DEG C which is lower than the melting point of the aluminum powder and a pressing force of 20 to 100 MPa. Figures 4a and 4b show the top and cross-section views of the sintered composite material of aluminum powder and 50 vol% carbon fiber, respectively.

5 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention. Referring to FIG. 5, the heterojunction structure according to another embodiment of the present invention includes a first portion 410 including ceramics and a second portion 202 including carbon. Since the first part 410 and the second part 202 are brazed, the brazed joint 310 is interposed between the first part 410 and the second part 202. The brazing joint 310 may be understood as a heterogeneous joint in which at least a part of the filler and the joint base used in the brazing joint is melted and diffused and is shown explicitly in FIG. And / or the second portion 202 of the second portion 202. [

The first part 410 includes a ceramic material, and may be formed of, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second portion 202 is a hybrid composite containing carbon and includes a body portion 112 including carbon and a canning portion 144 including aluminum and surrounding the outer surface of the body portion 112. The body portion 112 is comprised of carbon, and may be composed, for example, of isotropic carbon or anisotropic carbon disclosed in Table 1. Meanwhile, in a modified embodiment, the body portion 112 may be composed of a sintered composite of aluminum and carbon. The first portion 410 and the second portion 202 may be directly brazed when the first portion 410 comprises aluminum nitride (AlN) ₂ O ₃ ), the first portion 410 is brazed to the second portion 202 via the molybdenum-manganese metallization layer formed on the surface opposite to the second portion 202 .

The canning portion 144 may be realized by performing a canning process so as to surround the upper surface, the lower surface, and the side surfaces of the body portion 112, and may include, for example, aluminum. For example, the canning portion 144 can be realized by arranging an aluminum plate material containing an Al 6061 series alloy on the outer surface of the body portion 112 via a filler including an Al 4047 series alloy, and then performing heat treatment . Alternatively, the metalizing process for forming the metal layer on the body portion 112 may be performed before the caning process is performed on the body portion 112.

The thermal expansion coefficient alpha ₂ of the hybrid composite 202 constituted by the body portion 112 and the canning portion 144 can be expressed by the following equation (1): thermal expansion coefficient alpha _Al of the canning portion 144 and volume fraction t _Al ) And the thermal expansion coefficient (? _G ) of the body part (112) and the volume fraction (t _g ). Here, the volume fraction of each component corresponds to the ratio of the total thickness of the respective components to the total thickness of the hybrid composite 202, and the thickness direction corresponds to the direction along the line A-A ' Direction).

[Equation 1]

α ₂ = α _Al t _Al + α _g t _g

Table 2 shows the coefficient of thermal expansion of the hybrid composite 202 according to various embodiments consisting of the body portion 112 and the canning portion 144. The thermal expansion coefficient of the hybrid composite 202 can be appropriately designed by adjusting the volume fraction of the canning portion 144 and the body portion 112 and appropriately selecting the type of the carbon material constituting the body portion 112 have.

[Table 2]

The thermal expansion coefficient? ₂ of the hybrid composite 202 implemented in the heterojunction structure according to the embodiments of the present invention can be controlled to be within a certain range of the thermal expansion coefficient? ₁ of the ceramic 410. For example, Can be satisfied. &Quot; (2) &quot;

&Quot; (2) &quot;

(? ₁ x 0.9) <? ₂ <(? ₁ x 1.1)

Specifically, in the case where the ceramic constituting the first section 410 is aluminum nitride having a thermal expansion coefficient of about 4.5, the thermal expansion of the hybrid composite constituting the second section 202, which is embodied in cases 1 and 2 of Table 2 The coefficient (4.428 or 4.42) satisfies the above formula (2). When the ceramic constituting the first portion 410 is alumina having a coefficient of thermal expansion of about 7.8, the thermal expansion coefficient of the hybrid composite constituting the second portion 202, which is implemented in the cases 3 to 5 of Table 2, &Quot; (2) &quot; The smaller the relative difference between the thermal expansion coefficient of the ceramic material constituting the first part 410 and the thermal expansion coefficient of the hybrid composite 202 constituting the second part 202, the lower the thermal stress generated in the hetero-junction structure, Can be stabilized.

6 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention. Referring to FIG. 6, a heterojunction structure according to another embodiment of the present invention includes a first portion 410 including ceramics and a second portion 203 including carbon. Since the first part 410 and the second part 203 are brazed, the brazed joint 310 is interposed between the first part 410 and the second part 203. The brazing joint 310 may be understood as a heterogeneous joint in which at least a part of the filler and the joint preform used for brazing are melted and diffused and is shown explicitly in FIG. And / or the second part 203 of the first embodiment.

The first part 410 includes a ceramic material, and may be formed of, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second portion 203 is a hybrid composite containing carbon and includes a plurality of carbon layers 113 disposed apart from each other and a sintered composite layer 114 of aluminum and carbon interposed between the plurality of carbon layers 113 ). Further, the second portion 203 includes aluminum and includes a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the sintered composite layer 114. The sintered composite layer 114 has already been described above with reference to FIGS. 4A and 4B, and therefore, description thereof is omitted here. On the other hand, the carbon constituting the plurality of carbon layers 113 and the sintered composite layer 114 may be composed of, for example, isotropic carbon or anisotropic carbon described in Table 1.

The first portion 410 and the second portion 203 may be directly brazed when the first portion 410 comprises aluminum nitride (AlN) ₂ O ₃ ), the first portion 410 is brazed to the second portion 203 via the molybdenum-manganese metallization layer formed on the surface facing the second portion 203 .

The canning portion 144 may be implemented by performing a canning process so as to surround the upper surface, the lower surface and the side surfaces except for the mutual contact surfaces in the plurality of carbon layers 113 and the sintered composite layer 114. For example, And the like. For example, the canning portion 144 is formed by laminating an aluminum plate material containing an Al 6061 series alloy on the outer surfaces of the plurality of carbon layers 113 and the sintered composite layer 114 with a filler containing Al 4047 series alloy interposed therebetween And then heat-treated. On the other hand, before performing the canning process on the laminated structure composed of the plurality of carbon layers 113 and the sintered composite layer 114, the metalizing process for forming the metal layer on the laminated structure may be performed first It is possible.

The thermal expansion coefficient? ₂ of the hybrid composite 203 composed of the plurality of carbon layers 113, the sintered composite layer 114 and the canning portion 144 is expressed by the following equation (3) the coefficient of thermal expansion of (α _Al) and the volume fraction of a product of a (t _Al) to the product of the coefficient of thermal expansion (α _g) and the volume fraction (t _g) of the plurality of carbon layers 113 and the sintered composite layer (114) (α _cf ) and the volume fraction (t _cf ). Here, the volume fraction of each component corresponds to the ratio of the total thickness of the respective components to the total thickness of the hybrid composite 203, and the thickness direction corresponds to the direction along the line A-A ' Direction).

&Quot; (3) &quot;

α ₂ = α _Al t _Al + α _g t _g + α _cf t _cf

Table 3 shows the coefficient of thermal expansion of the hybrid composite 203 according to various embodiments comprised of a plurality of carbon layers 113, a sintered composite layer 114 and a canned portion 144. The volume fraction of the plurality of carbon layers 113, the sintered composite layer 114 and the canned portion 144 is controlled so that the types of carbon materials constituting the plurality of carbon layers 113 and the sintered composite layer 114 The thermal expansion coefficient of the hybrid composite 203 can be appropriately designed.

[Table 3]

The thermal expansion coefficient? ₂ of the hybrid composite 203 implemented in the heterojunction structure according to the embodiments of the present invention can be controlled to be within a certain range of the thermal expansion coefficient? ₁ of the ceramic 410. For example, The relationship of Equation (2) can be satisfied.

Specifically, in the case where the ceramic constituting the first part 410 is aluminum nitride having a thermal expansion coefficient of about 4.5, the thermal expansion of the hybrid composite constituting the second part 203, which is embodied in cases 1 and 2 in Table 3 The coefficient (4.654 or 4.177) satisfies the above formula (2). As the relative difference between the thermal expansion coefficient of the ceramic material constituting the first part 410 and the thermal expansion coefficient of the hybrid composite 203 is smaller, the thermal stress generated in the hetero-junction structure is lowered and structurally stabilized.

7 is a cross-sectional view illustrating a heterojunction structure according to another embodiment of the present invention. Referring to FIG. 7, a heterojunction structure according to another embodiment of the present invention includes a first portion 410 including ceramics and a second portion 204 including carbon. Since the first part 410 and the second part 204 are brazed, the brazed joint 310 is interposed between the first part 410 and the second part 204. The brazing joint 310 can be understood as a heterogeneous joint in which at least a part of the filler and the joint base used in the brazing joint is melted and diffused and is shown explicitly in Figure 7. In the actual structure, And / or the second portion 204 of the apparatus.

The first part 410 includes a ceramic material, and may be formed of, for example, aluminum nitride (AlN) or alumina (Al ₂ O ₃ ). The second portion 204 is a hybrid composite containing carbon and includes a plurality of carbon layers 113 disposed apart from each other and a heat conduction layer 146 interposed between the plurality of carbon layers 113, Respectively. Since the heat conduction layer 146 includes, for example, aluminum having a relatively high thermal conductivity, the heat conduction characteristics of the second portion 204 can be increased. Further, the second portion 204 includes, for example, aluminum and has a plurality of carbon layers 113 and a canning portion 144 surrounding the outer surface of the thermally conductive layer 146. The carbon constituting the plurality of carbon layers 113 may be composed of isotropic carbon or anisotropic carbon, for example, as shown in Table 1. Further, in a modified embodiment, the plurality of carbon layers 113 may be comprised of a sintered composite of aluminum and carbon.

The first portion 410 and the second portion 204 may be directly brazed when the first portion 410 comprises aluminum nitride (AlN) ₂ O ₃ ), the first portion 410 is brazed to the second portion 204 via the molybdenum-manganese metallization layer formed on the surface opposite to the second portion 204 .

The canning portion 144 may be implemented by performing a canning process so as to surround upper surfaces, lower surfaces and side surfaces of the plurality of carbon layers 113 and the heat conduction layer 146 excluding mutual contact surfaces, have. For example, the canning portion 144 is formed by laminating an aluminum plate material including an Al 6061 series alloy on the outer surface of the plurality of carbon layers 113 and the heat conduction layer 146 via a filler containing an Al 4047 series alloy And then heat-treated. On the other hand, before performing the canning process on the laminated structure composed of the plurality of carbon layers 113 and the thermal conductive layer 146, the metalizing process for forming the metal layer on the laminated structure may be performed first have.

The thermal expansion coefficient? ₂ of the hybrid composite 204 composed of the plurality of carbon layers 113, the heat conduction layer 146 and the canning portion 144 can be calculated by the following equation (4) the sum of the product of the coefficient of thermal expansion (α _Al) and the volume fraction _(Al t) multiplied by the coefficient of thermal expansion (α _g) and the volume fraction (t _g of the plurality of carbon layers 113) of 146) below. Here, the volume fraction of each component corresponds to the ratio of the total thickness of each component to the total thickness of the hybrid composite, and the thickness direction is the direction along the line A-A '(y direction) it means.

&Quot; (4) &quot;

α ₂ = α _Al t _Al + α _g t _g

Table 4 shows the coefficient of thermal expansion of the hybrid composite 204 according to various embodiments comprised of a plurality of carbon layers 113, a thermally conductive layer 146, and a canned portion 144. The volume fraction of the plurality of carbon layers 113, the heat conduction layer 146 and the canning portion 144 is controlled and the type of carbon material constituting the plurality of carbon layers 113 is appropriately selected, It is possible to appropriately design the coefficient of thermal expansion of the heat sink 204.

[Table 4]

The thermal expansion coefficient? ₂ of the hybrid composite 204 implemented in the heterojunction structure according to the embodiments of the present invention can be controlled within a certain range of the thermal expansion coefficient? ₁ of the ceramic 410. For example, The relationship of Equation (2) can be satisfied.

Specifically, when the ceramic constituting the first portion 410 is alumina having a coefficient of thermal expansion of 7.8, the thermal expansion coefficient of the hybrid composite constituting the second portion 204, embodied in the cases 1 to 3 of Table 4 7.69, 7.72, or 7.84) satisfies the above formula (2). As the relative difference between the thermal expansion coefficient of the ceramic material constituting the first portion 410 and the thermal expansion coefficient of the hybrid composite 204 is smaller, the thermal stress generated in the hetero-junction structure is lowered and structurally stabilized.

In the heterogeneous bonded structure described so far, the structure 201 including the carbon shown in Fig. 1 and the hybrid composites 202, 203 and 204 shown in Figs. 5 to 7 have excellent cutting workability with respect to a complicated shape, Not only has a high thermal conductivity, but also has a thermal expansion coefficient close to that of alumina ceramics (7.8 x 10 ^-6 / k) and aluminum nitride ceramics (4.5 x 10 ^-6 / k), thereby reducing the thermal stress of the heterojunction structure. In other words, according to the embodiments of the present invention, a carbon material and hybrid composite material are used instead of a conventional aluminum material or a copper material, which is a counter material to be bonded to a ceramic, and a hybrid bonding structure having a good bonding interface can be realized by brazing Therefore, it is possible to provide a structure that can be used with durability even in a wide and rapid temperature cycle.

Hereinafter, a method of manufacturing a hetero-junction structure according to embodiments of the present invention will be described. FIGS. 8A to 8F illustrate a method of manufacturing a heterojunction structure according to another embodiment of the present invention. Illustratively, a method of manufacturing the heterojunction structure shown in FIG. 5 is illustrated.

First, referring to FIG. 8A, a structure composed of a body portion 112 including carbon is prepared. The description of the structure composed of the body portion 112 including carbon is the same as that described above with reference to FIG. 5, and will not be described here. Meanwhile, in the modified embodiment of the present invention, the structure composed of the body portion 112 including carbon includes a plurality of carbon layers 113 disposed apart from each other and a plurality of carbon layers And a sintered composite layer 114 of aluminum and carbon interposed between the upper and lower substrates 113 and 113. Further, in another modified embodiment of the present invention, the structure composed of the body portion 112 including carbon may include a plurality of carbon layers 113 disposed apart from each other and a plurality of carbon And a thermally conductive layer 146 sandwiched between the layers 113. In this case,

8B and 8C, a stainless foil 124 is formed on the outer surface (upper surface, lower surface, and side surface excluding the mutual contact surfaces) of the structure 112 with the first filler 122 interposed therebetween. The first pillar 122 and the stainless foil 124 are subjected to a first heat treatment at a temperature of, for example, 1050 占 폚 for 30 minutes to form the outer surface of the structure 112 The surrounding metallization layer 126 can be formed. The first filler 122 may comprise, for example, BNi ₂ .

8D and 8E, the aluminum plate 142 is disposed on the structure 112 having the metalizing layer 126 formed on the outer surface thereof with the second filler 141 interposed therebetween. The aluminum plate member 142 may be understood as a case including aluminum. The structure 112, the second filler 141 and the aluminum plate 142 are then subjected to a second heat treatment, for example, at a temperature of 600 占 폚 for 30 minutes to form the canning portion 144 on the structure 112 Thereby forming a second portion 202 comprising carbon. The second filler 141 may include, for example, an alloy of Al 4047 series which is an aluminum alloy containing 12% of silicon. The aluminum plate 142 may include, for example, an Al 6061 series alloy.

8E and 8F, a first portion 410 including ceramics is prepared, and the first portion 410 and the second portion 202 are brazed to each other. The brazing joint can be achieved by interposing a third pillar 312 between the first part 410 and the second part 202, including, for example, an Al 4047 series alloy, and then, at a temperature of 600 ° C for 30 minutes, And the third heat treatment.

The brazing joint 310 is interposed between the first portion 410 and the second portion 201 by the brazing jointing process. The brazing joint 310 can be understood as a heterogeneous joint in which at least a part of the filler and the joint base used in the brazing joint is melt-diffused and is shown explicitly in the drawing, / RTI &gt; and / or &lt; / RTI &gt;

Meanwhile, the third heat treatment performed for the second heat treatment and brazing bonding performed to form the canning portion 144 may be a heat treatment performed simultaneously under the same heat treatment conditions. This is because the second pillar 141 required for the second heat treatment and the third pillar 312 necessary for the third heat treatment may be made of the same Al 4047 series alloy and the heat treatment temperature and time may be the same Do. Therefore, according to the method for manufacturing a heterojunction structure according to an embodiment of the present invention, the third heat treatment performed for the second heat treatment and brazing bonding performed to form the canning portion 144 can be performed simultaneously The thermal load applied to the hetero-junction structure is lowered, and further, the effect of lowering the production cost can be expected.

8E and 8F, when the first portion 410 includes aluminum nitride (AlN), the first portion 410 and the second portion 202 may be directly brazed to each other, 9A and 9B, when the first portion 410 includes alumina (Al ₂ O ₃ ), the first portion 410 is formed of molybdenum (Al ₂ O ₃ ) formed on the surface facing the second portion 202, -Manganese metallizing layer 320 to the second portion 202. The second portion 202 may be formed by brazing.

Up to now, heterogeneous junction structures and their fabrication methods according to various embodiments of the present invention have been described. Particularly, the ceramic material constituting the first portion 410, the first filler 122, the second filler 141, the third filler 312, the metalizing layer 144, the heat conduction layer 146, The metal foil 124, the metal foil 124, and the like are exemplified, and it is apparent that the technical idea of the present invention is not limited thereto.

The foregoing description of specific embodiments of the invention has been presented for purposes of illustration and description. It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. Do.

112: body portion containing carbon
113: a plurality of carbon layers
114: sintered composite layer of aluminum and carbon
126: Metallized layer
144:
146: heat conduction layer
201, 202, 203, 204: a second part comprising carbon
310: Brazing joint
410: a first part comprising ceramic

Claims (20)

A first portion comprising a ceramic; And
A second portion comprising carbon and brazed to the first portion;
Heterojunction structure having a. The heterojunction structure of claim 1, wherein the second part comprises a hybrid composite including carbon. The method of claim 2, wherein the hybrid complex
A body part containing carbon; And
A canning portion comprising aluminum and surrounding an outer surface of the body portion;
And a second substrate. The method of claim 2, wherein the hybrid complex
A plurality of carbon layers spaced apart from each other;
A sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers; And
A canning comprising aluminum and surrounding the plurality of carbon layers and an outer surface of the sintered composite layer;
And a second substrate. The method of claim 2, wherein the hybrid complex
A plurality of carbon layers spaced apart from each other;
A thermally conductive layer comprising aluminum and interposed between the plurality of carbon layers; And
A canning comprising aluminum and surrounding the plurality of carbon layers and the outer surface of the thermally conductive layer;
And a second substrate. The heterojunction structure according to claim 2, wherein the thermal expansion coefficient α ₂ of the hybrid composite satisfies the relationship between the thermal expansion coefficient α ₁ of the ceramic and (α ₁ x 0.9) <α ₂ <(α ₁ x 1.1). The heterojunction structure of claim 1, wherein the second portion is a body portion composed only of carbon. The heterojunction structure of claim 1, wherein the carbon comprises at least one of isotropic carbon and anisotropic carbon. 2. The heterojunction structure of claim 1, wherein the ceramic comprises aluminum nitride (AlN), the first portion being directly brazed to the second portion. The ceramic of claim 1, wherein the ceramic comprises alumina (Al ₂ O ₃ ), and the first part is brazed with the second part via a molybdenum-manganese metallization layer formed on a surface facing the second part. Bonded, heterojunction structure. Preparing a first portion comprising a ceramic;
Forming a second portion comprising carbon; And
Brazing the first portion and the second portion;
Method for producing a heterojunction structure having a. 12. The method of claim 11, wherein forming a second portion comprising carbon
Forming a first structure comprising carbon; And
Forming a canning portion including aluminum to surround the outer surface of the first structure;
Method for producing a heterojunction structure comprising a. 13. The method of claim 12, wherein the first structure comprises a body portion comprising carbon. The method of claim 12, wherein the first structure comprises: a plurality of carbon layers spaced apart from each other; And a sintered composite layer of aluminum and carbon interposed between the plurality of carbon layers. The method of claim 12, wherein the first structure comprises: a plurality of carbon layers spaced apart from each other; And a heat conduction layer including aluminum and interposed between the plurality of carbon layers. 13. The heterojunction structure of claim 12, further comprising forming a metallization layer surrounding an outer surface of the first structure between forming the first structure and forming the canning portion. Manufacturing method. The method of claim 16, wherein forming the metallizing layer
Disposing a metal foil on an outer surface of the first structure via a first filler; And
First heat treating the first structure, the first filler, and the metal foil;
Method for producing a heterojunction structure comprising a. The method of claim 12, wherein the forming of the canning unit
Disposing an aluminum plate on an outer surface of the first structure via a second filler; And
Subjecting the first structure, the second pillar, and the aluminum plate to a second heat treatment;
Method for producing a heterojunction structure comprising a. 19. The method of claim 18, wherein the step of brazing
And a third heat treatment of the first portion, the second portion and the third filler via a third pillar between the first portion and the second portion. The method of manufacturing a heterogeneous bonded structure according to claim 19, wherein the second filler and the third filler are made of the same material, and the second heat treatment step and the third heat treatment step are simultaneously performed under the same heat treatment condition .

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