KR20130084374A

KR20130084374A - Method and structure of led lead flame and mold

Info

Publication number: KR20130084374A
Application number: KR1020120005090A
Authority: KR
Inventors: 김육중
Original assignee: 주식회사 에이치와이티씨
Priority date: 2012-01-17
Filing date: 2012-01-17
Publication date: 2013-07-25

Abstract

PURPOSE: A structure of a lead frame and a mold for an LED package and a manufacturing process thereof are provided to minimize a failure rate due to a burr by making the lead frame and a lower mold in the same size. CONSTITUTION: A mold is divided into an upper mold and a lower mold (11). A lead frame is inserted between the upper mold and the lower mold for packaging. Cores of a packaged part of the lead frame and the mold are of the same size. An empty space of the lead frame is used for an inlet of an extruded product.

Description

Structure and Manufacturing Process of Lead Frame and Mold Mold for LED Package {METHOD AND STRUCTURE OF LED LEAD FLAME AND MOLD}

The present invention relates to a structure of a lead frame and a mold mold for an LED package.

The present invention relates to an EMC MOLD mold structure. The manufacturing process of general semiconductor chip package is largely divided into wafer manufacturing process, package assembly process and test process.

do. Among these, package assembly processes include wafer cutting, die attach, wire bonding, semiconductor forming and cutting / bending processes.

The semiconductor molding process refers to a process of packaging a semi-finished product in which electrical connection between a semiconductor chip and a lead frame is completed with a protective material such as an epoxy molding compound (EMC). In general, the lead frame is placed in a mold and packaged by injecting EMC.

Republic of Korea Patent Publication No. 10-2011-007886 'lead frame and mold mold, and semiconductor package method for a semiconductor package' proposes such a packaging method by the lead frame, mold mold.

Figure 1 shows the structure of a mold for performing such a lead frame and a packaging process used in the prior art. However, in the prior art, the lead frame is placed between the lower mold and the upper mold, and EMC is injected to package the injection molding from the lead frame. In order to prevent this leak, a water bump 13 for blocking the injection molding is formed to form the core in the empty space between the lower mold and the lead frame. 1 is a portion formed in red.

However, since the protrusions 13 are additionally formed on the lower core, a separate process for forming is required, thereby increasing the unit cost of the product and reducing the precision of the product.

An object of the present invention is to provide a structure of a lead frame and a mold capable of eliminating protrusions and increasing the degree of integration of a product.

In order to achieve the above object to provide a lead frame and mold mold structure for the LED package,

The mold mold is divided into an upper mold and a lower mold, and the lead frame is sandwiched between the upper mold and the lower mold to package the core. It may be used as the inlet of water.

The lead frame includes a post-cutting part, which is cut after injection of the product and may serve to fill an empty space of the lead frame to prevent the extrudate from moving.

A second gate may be formed between the product and the product in which the packaging is formed in the lead frame, so that the extrudate is supplied without using a runner to which the extrudate is supplied to enable product formation.

The lead frame may be formed with a release hole for releasing through punching from top to bottom.

The gate of the runner for supplying the extrudate to the product is formed at the bottom of the lead frame and the direction of the release may be downward.

In addition, a first step of assembling and providing a lead frame and a mold mold; A second step of injecting an extrudate into the mold mold; After the second step through a punch through the release hole formed in the lead frame from top to bottom And a third step of releasing the mold; and a fourth step of removing the post-cutting part from the lead frame.

The present invention has the effect of providing the structure of the lead frame and the mold to minimize the defective rate by the burr and to increase the degree of integration of the product.

1 is a view showing a conventional leadframe structure
2 to 8 show the structure of a lead frame according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. 2 shows a structure of a mold according to the present invention. FIG. 2 shows the lower mold 11 and FIG. 3 shows the configuration of the lead frame 12. As shown in FIG. The lower mold is for forming a package on the lead frame and the lead frame is for connecting the LED mounted on the lead frame 12 to the outside.

Conventionally, since the lower mold 11 and the lead frame 12 have different sizes, a space for extruded material to leak out between the lower mold and the lead frame is formed, thereby forming protrusions to join the lead frame and the mold. To prevent the space that can occur in the poetry 13 was necessary for this.

This is because the formation of the projections 13 was recognized as a natural process because the conventional manufacturing process that was inevitably different from the size of the packaging and the size of the lead frame has been followed.

However, unlike FIG. 1, in FIG. 2, the projections are deleted. For this purpose, the size of the lead frame and the lower mold is almost 1: 1, and the injection frame is injected into the empty space of the lead frame, where the injection frame may flow out. In order to prevent unnecessary parts from the lead frame after blocking in advance, the cutting process was performed.

That is, in the present invention, by making the lead frame and the lower mold almost the same size, the projections are not generated and the injection molding is injected into the space originally made in the lead frame. Figure 4 illustrates this situation, in which the part marked in red corresponds to the empty space of the lead frame, and the injection molding is injected there.

Comparing the size of the lead frame and the lower mold 11 and inserting the cutting process to put the process of making the projection 13, the latter can reduce the time taken to proceed the process and increase the precision.

Fig. 5 shows an example in which the post-cutting portion 14 is formed so that it can be removed after cutting. Depending on the shape of the core and the shape of the lead frame, the position of the post-cutting portion 14 may vary.

6 shows another embodiment. In general, in the case of manufacturing a mold for LED mold, a runner is formed between two products to inject an injection product through the runner. The number is bound to increase.

In the present invention, a separate second gate 15 is formed between the product and the product in order to apply the runner every two rows. As shown in FIG. 6, the injection molded through the runner reaches the side product through the gate by forming the second gate 15, so that the gate formed for every two products is used for every four products. Since the number of runners to be used can be reduced, the number of products injected per unit area can be increased.

In addition, in the related art, when an additional gate such as the second gate 15 is to be added, it is difficult to block the progress path of the extrudate by using the protrusion, and the precision of the product is inevitably decreased as the protrusion is used. Since the lead frame is cut, the number of runners can be reduced while maintaining the accuracy of the product.

In addition, the second gate was formed at the far side from the inlet of the runner so that the injection molding material could be evenly entered.

Figure 7 shows the operation of the release hole formed in the lead frame. Conventionally, the manual work was performed to remove the runner from the lead frame after finishing injection, but in the present invention, a release hole 16 was formed in the lead frame in order to be automatically released, and the punch moved through the hole. The runner and lead frame can be separated naturally.

8 shows a conventional release method and a release method according to the present invention. The gate refers to a passage through which the injection molded product enters through the lead frame. When the product and the runner are released, the gate is conventionally applied from the bottom to the top, so that a burr is generated at the top of the product when the product falls. However, if a burr is formed on the top of the product and protrudes upward, or a piece is peeled off the surface of the product at all, it may be a defective product.

According to the present invention, if the gate of the runner is placed under the lead frame and falls from the top to the bottom through the release hole at the time of release, at least the burr does not occur on the surface of the product and the thickness of the lead frame is lower than the thickness of the lead frame. Since the burrs are formed, no burrs are formed on the surface of the product, and the burrs can be pressed in a later process. This has the effect of drastically lowering the defective rate of the product.

11: lower mold 12: leadframe
13: protrusion 14: hooking part
15: Second Gate 16: Release Hole

Claims

As the structure of lead frame and mold mold for LED package,
The mold mold is divided into upper mold and lower mold, and the lead frame is sandwiched between the upper mold and the lower mold to make the packaging.
The core of the packaged portion of the lead frame and the mold mold is the same size and the empty space of the lead frame is used as the inlet of the extrudate,
Lead frame and mold mold structure for LED package

According to claim 1, wherein the lead frame includes a post-cutting portion which is cut after the injection of the product serves to fill the empty space of the lead frame to prevent the extrudate from moving,
Lead frame and mold mold structure for LED package

The method of claim 2, wherein the second frame is formed between the product and the product is formed in the lead frame is characterized in that the extrudate is supplied to enable product formation without using a runner to supply the extrudate , Lead frame and mold mold structure for LED package

The lead frame and mold mold structure of claim 3, wherein the lead frame has a release hole for releasing through punching from top to bottom.

5. The structure of a lead frame and mold mold for an LED package according to claim 4, wherein the gate of the runner for supplying the extrudate to the product is formed under the lead frame and the release direction is downward.

As a manufacturing process of lead frame and mold mold for LED package,
A first step of assembling and providing a lead frame and a mold mold;
Injecting an extrudate into the mold mold;
A third step of releasing from top to bottom through a punch in the release hole formed in the lead frame after the second step;
And a fourth step of removing the post-cutting part from the lead frame.
Manufacturing process of lead frame and mold mold for LED package