KR20130077645A - Method for resin case of card type smart key using vehicle - Google Patents

Abstract

PURPOSE: A method for correcting a resin case of a card-typed wireless transceiver is provided to mold the upper and lower sides of a circuit board with resin and support the circuit board by using a support pin, thereby preventing a resin case from being bent due to the heat generated on the circuit board. CONSTITUTION: A method for correcting a resin case of a card-typed wireless transceiver is as follows: a member for storing an emergency key is formed; the member for storing an emergency key comprises a member for storing a battery and a reinforcement member; the member for storing a battery is installed at one side of a circuit board and the circuit board (11) where parts are inserted; the member for storing a battery includes battery terminals (13a, 13b) which are connected to the circuit board. The reinforcement member is installed at the other side of the circuit board and connected to the circuit board by soldering process; inserting blocks (17, 19) are respectively inserted into a battery storage groove of the member for storing a battery and a battery storage groove of the member for storing an emergency key; a cavity (25), which is a space layer of forming dies (21, 23), is formed on the top and bottom surfaces of the circuit board respectively; the cavity is filled with an epoxy resin by using a high temperature and high pressure pressing process and is firstly solidified by using a high pressure and high temperature; a resin case for completely sealing up top/bottom and right/left sides of the wireless transceiver is formed; and the inserting blocks are removed from the forming dies.

Description

Resin case correction method of card type wireless transceiver {METHOD FOR RESIN CASE OF CARD TYPE SMART KEY USING VEHICLE}

The present invention relates to a resin case method of a vehicular wireless transceiver, and more particularly, to a method for removing noise formed on the surface of the primary cured resin case in a vehicular card type wireless transceiver.

A general wireless transceiver is a portable terminal, which performs authentication of a driver and a vehicle through near field communication with an immobilizer installed inside the vehicle, and locks the vehicle door when the authorized driver exists within a predetermined distance based on the authentication result. The driving of a plurality of electric appliances including is interrupted.

However, when the driver is out of the proper distance from the vehicle, the immobilizer to control the driving of a plurality of electrical appliances, such as automatic unlocking to prevent theft or damage of the vehicle.

In addition, the wireless transceiver starts the engine when the authenticated driver selects a separate engine start button installed in the vehicle after being located in the vehicle.

Such wireless transceivers typically include a circuit board and a battery that supplies power, an emergency key for starting the engine in an emergency situation, and a circuit board in which electronic components are embedded.

That is, the conventional wireless transmitter for a vehicle is placed in the molding die, the circuit board on which the electronic component is mounted, and molded by epoxy-based thermosetting resin material to seal the mounted circuit board. At this time, when the circuit board is attached to the floor and molded, one side of the circuit board is exposed to the exterior, so that the exterior with proper decoration cannot be expressed. Therefore, after sealing the circuit board such as surface coating or plating, etc. Since a post-treatment process is required for a beautiful appearance, and the post-treatment process has a high defective rate for the entire process, and thus the entire molded product has to be disposed of, resulting in a decisive factor in raising the price of the overall product.

In addition, inside the thickness direction of the circuit board, there are very small holes made of a conductive material for electrical connection between the circuit board layers, and the surface of the conductive material is easily corroded due to exposure to such an appearance, thereby causing a malfunction of the circuit board. do.

In addition, when the opposite side of the mounting surface of the circuit board is exposed to the outside, the mounting surface is exposed to the outside, thereby causing the circuit board to be exposed to static electricity, thereby damaging the circuit components, and the external exposure of one side of the circuit board is caused. The difference between the coefficient of thermal expansion and the coefficient of thermal expansion of the resin sealant is the main source of warpage of the main body. In addition, when the circuit board is exposed as it is, it is difficult to machine the circuit board with a grind and grind it and perform an additional process such as painting on the surface thereof.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a battery accommodating member including a circuit board on which parts are embedded and a battery terminal installed on one surface of the circuit board and connected to the circuit board. And a first step of forming an emergency key accommodating member provided on the other surface of the circuit board and having a reinforcement part connected to the circuit board in a soldering process, and a battery accommodating groove of the battery accommodating member and a battery accommodating groove of the emergency key accommodating member. A second step of inserting an inserting block into each of the plurality of battery cells; and a molding die pre-patterned on the upper and lower surfaces of the battery accommodating member, the emergency key accommodating member, and the circuit board. The third process of forming a cavity as a layer, and the epoxy-based resin in a cavity at a high temperature and high pressure press process A fourth step of forming a resin case sealing the wireless handset by first curing after filling into the mold, and a fifth step of removing the inserting block from the molding die and performing second curing. After removing the noise formed on the surface of the cured resin case, and further comprising the step of removing the noise proceeding to the fifth step of providing a card-type wireless transceiver manufacturing method, the upper and lower surfaces of the circuit board is molded with resin and the circuit board The support pin can be used to prevent warpage of the resin case due to the heat generated from the circuit board, and the positive and negative noise generated on the surface of the first hardened resin case is completely removed to provide the appearance of a card type wireless transceiver. Improves satisfaction with the product and prevents oxidation of metal parts. In addition, the manufacturing process and manufacturing cost can be fundamentally reduced, and the reliability of the product can be fundamentally improved.

According to an aspect of the present invention for achieving the above object, there is provided a resin case correction method of a wireless transceiver for a vehicle, such a method,

A battery housing member including a circuit board in which components are embedded, a battery receiving member installed on one surface of the circuit board and connected to the circuit board, and a reinforcing part provided on the other surface of the circuit board and connected to the circuit board by a soldering process; A first step of forming a key receiving member;

A second step of inserting an inserting block into each of the battery accommodating groove of the bettler accommodating member and the battery accommodating groove of the emergency key accommodating member;

A third step of forming a cavity, which is a space layer with a molding die, on each of an upper surface and a rear surface of the circuit board by installing molding dies pre-patterned on upper and lower surfaces of the battery accommodating member, the emergency key accommodating member, and the circuit board;

A fourth step of forming a resin case for completely sealing the upper and lower sides of the wireless handset by filling the epoxy-based resin into the cavity by a high-temperature and high-pressure press process and first curing the resin at a high pressure and a high temperature;

And a fifth process of removing the inserting block from the forming die and then fully curing.

The card type wireless transceiver manufacturing method,

And removing a noise component generated on the surface of the resin case primarily cured in the fourth process, and then proceeding to the fifth process.

Here, the noise removing step,

A positive noise removing step of removing noise, which is a resin component present on the surface of the first cured resin case and protruding to the outside;

And a negative noise removing step of removing noise generated by not filling a resin component on the surface of the first cured resin case.

Here, the positive noise is

And at least one of a flash of a resin component protruding to the outside of the resin case and a burr of a positive component of the resin component to protrude to the outside of the primary cured resin case.

The positive noise is,

After detecting the positive noise shape using the sensor, it will be preferable to be provided to remove the flash or the positive stability based on the rotational force of the motor set based on the shape of the positive noise.

The positive noise shape is,

It would be desirable to have a positive noise size that includes the projected thickness and magnitude of the positive noise.

Rotational force of the motor,

It is preferable to set the calibration data value for the motor rotational force relative to the positive noise size, based on a proportional relation defined with respect to the positive noise size.

The negative noise is,

It is characterized in that the burr of the negative component inserted into the interior of the primary cured resin case and one of the grooves not filled with the resin of the primary cured resin case.

Here, the negative noise removing step,

After detecting a negative noise shape using a sensor, it may be desirable to be provided to remove burrs or grooves of a negative component by sealing based on the amount of resin set based on the negative noise shape.

The amount of resin is,

Based on the negative noise shape is derived based on a pre-defined proportional relationship, the amount of the resin relative to the negative noise shape is set to a calibration data value.

The noise removal process,

And removing the spot-shaped noise inserted between the resins of the primary cured resin case by scanning a predetermined amount of laser.

The noise removal process,

The method may further include determining a failure of the card type wireless transceiver based on the sealing state after removing the negative noise.

As described above, in the resin case correction method of the vehicle wireless transceiver according to the present invention, the front and rear surfaces of the circuit board are sealed with a resin material and the pins supporting the circuit board are installed while the mounted circuit board is floated in the air in the cavity. By fixing the decoration plate member with double-sided tape on the opposite side of the resin case where the pin is installed, it is possible to prevent the resin case from bending due to the heat generated from the circuit board. The satisfaction of the appearance of the product can be improved by removing the flash or positive component of the derived burr, and the foreign material is removed from the outside by removing the grooves and negative bur which are not filled with the resin inside the primary cured resin case. It can prevent the card type wireless transceiver from entering the inside and the circuit board to the outside It can prevent oxidation of metal reinforcement part and battery accommodating terminal generated by exposure, and can also compensate for the weakness of electrostatic discharge (ESD), and one side of the circuit board is exposed to the exterior as it is. Since the existing post-treatment process for preventing the damage is removed, the manufacturing process can be reduced, thereby reducing the manufacturing process and manufacturing cost.

The following drawings attached in this specification are illustrative of the preferred embodiments of the present invention, and together with the detailed description of the invention to serve to further understand the technical spirit of the present invention, the present invention is a matter described in such drawings It should not be construed as limited to.
1 is a flowchart illustrating a manufacturing process of a card type wireless transceiver according to an exemplary embodiment of the present invention.
2 is a cross-sectional view showing the configuration of a card-type wireless transmission and reception manufactured by the manufacturing process shown in FIG.
3 is a cross-sectional view illustrating a configuration after a manufacturing process of the wireless transceiver illustrated in FIG. 2.
4 is a diagram illustrating noise of the card type wireless transceiver illustrated in FIG. 1.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the practice of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention.

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. Like reference symbols in the drawings denote like elements.

1 is a flowchart illustrating a manufacturing process of a vehicle wireless transceiver according to an exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view of a vehicle wireless transceiver manufactured according to the manufacturing process of the vehicle wireless transceiver illustrated in FIG. 1, and FIG. Figure 1 shows the configuration of the vehicle wireless transceiver after the manufacturing process of the vehicle wireless transceiver shown in Figure 1 and Figure 4 is a view showing the positive noise of the card type wireless transceiver shown in FIG.

Referring to FIGS. 1 to 4, a manufacturing process of a vehicle wireless transceiver according to the present invention will be described with reference to FIGS. 1 to 4. First, in a first process 101, a circuit board 11 in which components are embedded and the A battery accommodating member which is provided on one surface of the circuit board 11 and includes battery terminals 13a and 13b connected to the circuit board 11 and the other surface of the circuit board 11 and is soldered to the circuit board. An emergency key accommodating member having a reinforcing portion 15a connected to the 11 and an emergency key accommodating groove 15b for accommodating the emergency key are formed.

Here, the battery accommodating member is provided such that a current flows between the battery terminals 13a and 13b when the battery is accommodated in the battery accommodating groove 13c, and the current flows to the circuit board 11. do.

The emergency key accommodating member is provided to fix the reinforcement part 15a having the emergency key accommodating groove 15b to a predetermined position of the circuit board 11 by soldering.

Subsequently, after forming the circuit board 11, the battery accommodating member, and the emergency key accommodating member through the first process 101, the process proceeds to the second process 103. In the process 103, the battery accommodating groove is formed. After inserting the inserting blocks 17 and 19 into the respective 13c and the battery accommodating grooves 15b, the process proceeds to the third process 105.

In the third process 105, the battery housing member, the emergency key storage member, and upper and lower surfaces of the circuit board 11 are formed with preformed molding dies 21 and 23, respectively, and the upper surface of the circuit board 11 is formed. On each of the back surfaces, a cavity 25 is formed which is a space layer with the forming dies 17 and 19.

In the third process 105, the surface of the molding dies 21 and 23 is used with nitrogen, argon, and hydrogen gas before the molding die is installed on the inserting block and the circuit board 11. The method may further include removing the organic material by activating the interface.

Further, in the third process 105, injector pins 27 and 29 for removing the inserting blocks 17 and 19 from the forming dies 21 and 23 are respectively inserted into the inserting blocks 17. And a predetermined number of predetermined positions are installed at predetermined positions on the upper and lower surfaces of the c) and the injector pins 31 and 33 for removing the inserting blocks 17 and 19 from the forming dies 21 and 23. The method may further include installing a predetermined number in a predetermined position on a lower surface of the circuit board 11.

On the other hand, in the third process 105, after the forming dies 21 and 23 are provided, a support pin 37 for supporting the circuit board 11 is provided at a predetermined position on the upper surface of the circuit board 11. It further includes the step of installing in, and further comprising the step of installing a position pin 39 for each circuit board for indicating the installation position of the circuit board 11.

Then, the process proceeds to the fourth process 107 after the third process 105 proceeds. Here, in the fourth step 107, the epoxy-based resin is filled into the cavity 25 by a press process of high temperature and high pressure, and then cured at high pressure and high temperature to seal the upper and lower sides of the wireless transmitter. ).

That is, the fourth process 107 includes maintaining the inside of the cavity in a vacuum state and filling the inside of the cavity by performing a high pressure and a high temperature press method through a flanger through the thermosetting resin.

In addition, the fourth process 107 may be performed by a transfer mold (transfer molding) method with a thermosetting resin to form the resin case. Since the process is well known in the art, a detailed description thereof will be omitted.

Meanwhile, the fourth process 107 may further include maintaining a vacuum in the cavity and performing plasma cleaning to remove foreign substances before filling the resin into the cavity.

Here, the thermosetting resin may include an epoxy resin and a wax component.

In this case, as illustrated in FIG. 4, positive noise protruding to the outside of the resin case of the unnecessary resin component and negative noise not filled with the resin are generated outside the resin case 41, and noise for removing such noise is generated. The removal process 108 is executed.

Here, the noise removing process 108 includes a positive noise removing step 108a for removing noise, which is a resin component present on the surface of the primary cured resin case and protruding to the outside, and the surface of the primary cured resin case. And a negative noise removing step 108b for removing noise generated by not filling the resin component.

Here, the positive noise is a flash component that protrudes to the outside of the resin case and a positive resin component which protrudes to the outside of the primary cured resin case, as shown in a) of FIG. 4. It is one of the components of the Burr.

The positive noise removing step 108a is provided to detect a positive noise shape by using a sensor, and then remove the flash or the positive stability burr based on the rotational force of the motor set based on the shape of the positive noise.

Here, the positive noise shape refers to a positive noise size including the protruding thickness and magnitude of the positive noise, wherein the rotational force of the motor is set based on a proportional relation defined with respect to the positive noise size. It is set to the calibration data value for the motor torque compared to the positive noise size.

Meanwhile, as shown in b) of FIG. 4, the negative noise is filled with a burr of a negative component inserted into the first cured resin case and a resin of the first cured resin case. The negative noise removing step 108b may be performed by detecting a negative noise shape using a sensor and sealing the based on the amount of resin set based on the negative noise shape. bur) or grooves.

The noise removing process 108 may further include removing a spot-shaped noise inserted between the resin of the primary cured resin case by scanning a predetermined amount of laser. Here, the predetermined amount is a result obtained through a number of experiments, it will be apparent to those skilled in the art that it can vary depending on the size of the noise of the spot shape inserted into the resin case.

Here, although the magnitude of the spot-shaped noise has not been described in more detail, a series of processes for detecting the magnitude of the noise inserted into the resin case are well known techniques, and thus a detailed description thereof will be omitted.

In addition, the noise removing process 108 may further include a step of determining a failure of the card-type wireless transceiver based on the sealing state after sealing the negative noise to remove the negative noise.

The amount of resin is derived from a proportional relation that is defined based on the negative noise shape, and the amount of resin relative to the negative noise shape is set as a calibration data value.

After execution of the noise removing step 108, the process proceeds to a fifth step 109 of removing the inserting blocks 17 and 19 from the forming dies 21 and 23.

In the fifth step 109, a temperature difference between the temperature of the inserting blocks 17 and 19 and the resin case 41 is formed, and the inserting blocks 17 and 19 are removed from the resin case 41 by thermal contraction. And removing the resin case 41 and maintaining the resin case 41 at a predetermined high temperature for a predetermined time, thereby completely curing the resin case 41.

In addition, the method further includes a step 111 of fixing the log and the decoration sheet by using the double-sided tape after the fifth step 109.

According to this structure, the circuit board 11 in which components are embedded in the first process 101, the battery terminals 13a and 13b and the battery receiving groove 13c which are provided on one surface of the circuit board and connected to the circuit board. An emergency key accommodating member having a battery accommodating member including a battery accommodating member and a reinforcing part 15a and an emergency key accommodating groove 15b installed on the other surface of the circuit board 11 and connected to the circuit board 11 by a soldering process. Form each.

Subsequently, in the second process 103, the inserting blocks 17 and 19 are inserted into each of the battery accommodating groove 13c and the emergency key accommodating groove 15b, and then the process proceeds to the third process 105.

After the cleaning process for the circuit board 11 is completed through the series of steps, the process proceeds to the third process 105. In the third process 105, the surfaces of the forming dies 21 and 23 are formed. After removing the organic material by activating the interface using nitrogen, argon and hydrogen gas, the injector pins 31 and 35 are respectively formed on the insert blocks 17 and 19 and the bottom of the circuit board, and then the cavity. After the inside of the vacuum chamber 25 is maintained in a vacuum state, the battery housing member, the emergency key storage member, and molding dies 21 and 23 which are pre-patterned on the upper and lower surfaces of the circuit board are respectively provided to form an upper surface of the circuit board 11. In each of the rear surfaces, a cavity 25 which is a space layer with the forming dies 21 and 23 is formed.

Subsequently, after the forming dies 21 and 23 are installed, the third process 105 may display the installation pins 37 and the installation positions of the circuit board 11 for supporting the circuit board 11_. Position pins 39 are provided for each circuit board 11.

In the fourth step 107, the epoxy resin is filled into the cavity 25 by a high-temperature and high-pressure press process and first cured to form a resin case 41 for sealing the upper and lower sides of the wireless water transmitter. After that, a noise removing step 108 of removing noise generated on the surface of the resin case 41 is performed.

Here, the positive noise shape is detected using a sensor through a positive noise removal step 108a of removing noise, which is a resin component protruding to the outside existing in the first cured resin case during the noise removal process 108. The flash or positive burr is then removed based on the torque set by the motor based on the shape of the positive noise.

Thereafter, the noise removing process 108 removes burrs of grooves and negative components in which the resin component existing in the primary cured resin case is not filled through the negative noise removing step 108b.

That is, the negative noise removing step 108b removes burrs or grooves of negative components by detecting a negative noise shape using a sensor and then sealing the based on the amount of resin set based on the negative noise shape.

In addition, the noise removing process 108 may determine the failure of the card-type wireless transceiver based on the resin case sealed to remove the negative noise.

The execution of the noise removing step 108 proceeds to the fifth step 109.

In the fifth step 109, a temperature difference between the temperature of the inserting blocks 17 and 19 and the resin case 41 is formed to remove the inserting block from the resin case by thermal contraction, and then the resin case 41 is removed. The resin case is completely cured by maintaining at a predetermined high temperature for a predetermined time.

Thereafter, after the execution of the fifth step 109, the log and the decoration sheet are fixed using the double-sided tape (step 111).

According to an embodiment of the present invention, while the mounted circuit board is floated in the air in the cavity, both front and rear surfaces of the circuit board are sealed with resin material, and pins for supporting the circuit board are installed on the opposite side of the resin case in which the pin is installed. By fixing the decoration plate member with double-sided tape, it is possible to prevent the resin case from bending due to the heat generated from the circuit board, and to remove unnecessary burrs of the flash or positive component drawn out of the primary cured resin case. Satisfaction with the appearance of the product can be improved and foreign matters from the outside can be prevented from entering the card-type wireless transceiver from the outside by removing grooves and negative burrs that are not filled with resin into the inside of the primary cured resin case. And battery reinforcements and battery receptacles generated when the circuit board is exposed to the outside It can prevent the oxidation of metal, and can compensate for the weakness of electrostatic discharge (ESD), and eliminates the existing post-processing process to prevent damage to the circuit board by exposing one side of the circuit board to the exterior. Therefore, the manufacturing process can be reduced, thereby reducing the manufacturing process and manufacturing cost.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

With the mounted circuit board floating in the air in the cavity, the front and rear surfaces of the circuit board are sealed with resin material, and pins for supporting the circuit board are installed, and the decoration plate member is fixed with double-sided tape on the opposite side of the resin case where the pin is installed. As a result, the resin case can be prevented from being bent due to heat generated from the circuit board, and the burrs of the externally flashed or positive components drawn out of the primary cured resin case are removed to improve the satisfaction of the appearance of the product. It is possible to prevent the foreign substances from entering the inside of the card type wireless transceiver from the outside by removing grooves and negative burrs that are not filled with resin into the inside of the first cured resin case, and the circuit board is exposed to the outside. To prevent oxidation of metal parts that occur along the way, The existing post-processing process for preventing damage to the circuit board by preventing one side of the circuit board from being exposed to the external appearance of the circuit board is eliminated, thus reducing the manufacturing process and reducing the manufacturing process cost. It can bring great advances in terms of accuracy and reliability of operation to the vehicle radio transceiver manufacturing method, and furthermore, in terms of performance efficiency, and it is not only sufficient to be commercially available or commercially available, but also realistically implemented. It is an invention with industrial applicability as it exists.

Claims (11)

A battery housing member including a circuit board in which components are embedded, a battery receiving member installed on one surface of the circuit board and connected to the circuit board, and a reinforcing part provided on the other surface of the circuit board and connected to the circuit board by a soldering process; A first step of forming a key receiving member;
A second step of inserting an inserting block into each of the battery accommodating groove of the bettler accommodating member and the battery accommodating groove of the emergency key accommodating member;
A third step of forming a cavity, which is a space layer with a molding die, on each of an upper surface and a rear surface of the circuit board by installing molding dies pre-patterned on upper and lower surfaces of the battery accommodating member, the emergency key accommodating member, and the circuit board;
A fourth step of forming a resin case for completely sealing the upper and lower sides of the wireless handset by filling the epoxy-based resin into the cavity by a high-temperature and high-pressure press process and first curing the resin at a high pressure and a high temperature;
And a fifth process of removing said inserting block from said forming die.
The card type wireless transceiver manufacturing method,
And removing a noise component generated on the surface of the resin case first cured in the fourth process, and then proceeding to the fifth process. The method of claim 1, wherein the noise removing process is performed.
A positive noise removing step of removing noise, which is a resin component present on the surface of the first cured resin case and protruding to the outside;
And a negative noise removing step of removing noise generated by not filling a resin component on the surface of the first cured resin case. The method of claim 2, wherein the positive noise,
A card comprising at least one of a flash component of a resin component projecting out of the resin case and a burr of a positive component of a resin component projecting out of the primary cured resin case Resin case correction method of the wireless type transceiver. The method of claim 3, wherein the positive noise removing step,
After detecting the positive noise shape using the sensor, the resin case correction method of the card type wireless transceiver, characterized in that it is provided to remove the flash or the positive stability based on the rotational force of the motor set based on the shape of the positive noise. The method of claim 4, wherein the positive noise shape,
Resin case correction method of the card-type wireless transceiver, characterized in that provided with a positive noise size including the projected thickness and size of the positive noise. The rotational force of the motor according to claim 5,
And a calibration data value for the motor rotational force relative to the positive noise size, which is set based on a predetermined proportional relation formula for the positive noise size. The method of claim 2, wherein the negative noise,
Resin case correction of card type wireless transceiver, characterized in that the burr of the negative component inserted into the inside of the primary cured resin case and one of the grooves not filled with the resin of the primary cured resin case Way. The method of claim 7, wherein the negative noise removing step,
Resin of the card type wireless transceiver characterized in that it is provided to remove the bur or groove of the negative component by detecting the negative noise shape using a sensor and sealing based on the amount of resin set based on the negative noise shape. Case correction method. The method of claim 8, wherein the amount of resin,
The resin case correction method of the card type wireless transceiver, wherein the proportional relation is derived based on the negative noise shape, and the amount of the resin relative to the negative noise shape is set to a calibration data value. The method of claim 1, wherein the noise removing process is performed.
And removing a spot-shaped noise inserted between the resins of the primary cured resin case by scanning a predetermined amount of laser beams. The method of claim 1, wherein the noise removing process is performed.
And determining a failure of the card type wireless transceiver based on the sealing state after removing the negative noise.

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