KR20130074789A - Semiconductor package and method for manufacturing the same - Google Patents

Abstract

PURPOSE: A micro electro mechanical system (MEMS) device and a manufacturing method thereof are provided to implement the excellent performance of the MEMS device with a simple structure and to remarkably reduce manufacturing costs. CONSTITUTION: An MEMS device includes a substrate, a logic chip, a first conductive member, a lid (30), an MEMS chip, and a second conductive member. A logic chip attaching surface is formed in the central portion of the substrate. First and second conductive patterns are formed in a peripheral area and an upper edge area of the logic chip attaching surface. The logic chip is attached to the logic chip attaching surface of the substrate. The first conductive member is connected between the first conductive pattern of the substrate and a bonding pad of the logic chip. An insulating unit (31) is formed on the entire top surface and a partial portion of the bottom surface of the lid. A plurality of conductive paths (32) is formed on the insulating unit of the bottom surface of the lid, and a sound wave receiving hole (33) is vertically penetrate-formed at a predetermined spot of the insulating layer of the bottom surface of the lid.

Description

MEMS device and its manufacturing method {Semiconductor package and method for manufacturing the same}

The present invention relates to a MEMS device and a method of manufacturing the same, and more particularly, to a MEMS device having a novel structure in which anodized lead (Lid) is electrically connected directly to a substrate, and a method of manufacturing the same.

Typically, micro-electro-mechanical system (MEMS) devices are known that convert physical phenomena such as pressure, acceleration, sound or light into electrical signals, including MEMS chips and ASIC chips. It is.

A micro-electromechanical system device, which is a kind of semiconductor package, is manufactured in a structure in which MEMS chips and AICS chips are stacked on top of each other (printed circuit boards, lead frames, LCCs, etc.) or arranged laterally.

Herein, referring to FIG. 9, which is an example of a conventional MEMS device, it is as follows.

The MEMS chip 102 and AICS chip 104, which is a signal processing element for the MEMS chip 102, are side by side attached to the upper surface of the printed circuit board 100, and the MEMS chip 102 and AICS chip 104 are attached to each other. The conductive wires 106 are connected to the conductive wires 106 so that the electrical signals can be transferred, and the conductive wires 106 can be exchanged between the AI chip 104 and the substrate 100.

In this case, the MEMS chip 102 is a chip that can be used for a microphone, a portable microphone, and the like, and a membrane 108 for detecting sound waves is attached to a hole formed in the center thereof.

A back volume space 110, which is a vibration ringing space in which the membrane 108 vibrates due to sound waves, is formed on the substrate 100, and the MEMS chip 102 and AIZ are formed on the substrate 100. An outer cap 112 is attached to protect the wire 106 from the outside, including the chip 104.

Therefore, when sound waves are introduced through the sound wave inlet 114 formed in the outer cap 112, the membrane 108 vibrates based on the back volume space 110, which is a vibration ringing space, by the introduced sound waves. In addition, the vibration signal of the membrane 108 is transferred from the MEMS chip 102 to the AIPS chip 104 to be electrically processed, and then output through the substrate 100 and the input / output terminal 116.

However, the MEMS device according to an example of the prior art has a disadvantage in that the membrane of the MEMS chip does not ring properly due to the small volume of the back volume formed on the substrate, and the wires including the MEMS chip and AIZ chip are simply covered by a cap. Since there is no fixing means, there is a problem that a ball off phenomenon occurs in which both ends of the wire are dropped by external vibration transmission.

Referring to Figure 10 attached to another example of a conventional MEMS device as follows.

The MEMS device according to another example of the related art is characterized in that the back volume space 16 is largely secured.

That is, the MEMS device and its configuration according to the above example are the same, and the inner cap attached to the substrate 200 without attaching the MEMS chip 202 and AIZ chip 204 to the substrate 200 only. There is a difference in the point of attachment to the 206, in particular the inner volume of the inner cap 206 (the interspace with the substrate) is the back volume space 210, which is a vibration ringing space for the membrane 208 of the MEMS chip 202. )

Accordingly, when sound waves are introduced through the sound wave inlet 214 formed in the outer cap 212, the membrane 208 vibrates based on the back volume space 210 of the inner cap 206 by the introduced sound waves. The vibration signal of the membrane 208 is transferred from the MEMS chip 202 to the AIPS chip 204 and processed by an electrical signal, and then output through the substrate 200 and the input / output terminal 216.

However, the MEMS device according to another example of the prior art has an advantage that the back volume space formed on the substrate is increased so that the membrane of the MEMS chip is vibrated properly, but still the wires including the MEMS chip and AIZ chip are simply covered by the cap. Since there is no separate fixing means, there is a problem that a ball off phenomenon occurs in that both ends of the wire are dropped by external vibration transmission.

Referring to Figure 11 attached to another example of a conventional MEMS device as follows.

The MEMS device according to another example of the related art is characterized in that the cavity substrate 300 and the lower substrate 302 are laminated in a conductive manner.

That is, the lower substrate 302 having the semiconductor chip attaching region 304 formed on the upper surface central region and the conductive pattern 306 exposed on the outer circumferential portion of the semiconductor chip attaching region 304;

A horizontal substrate 310 in which a plurality of input / output pads 308 are formed along the entire surface of the upper surface in the horizontal and vertical directions, and integrally formed on the bottom of the horizontal substrate 310 so as to be electrically conductive and conducting electricity to the input / output pad 308. A cavity substrate 300 formed of a vertical substrate 314 having a conductive pattern 312 formed thereon; Conductive bonding means 314 connecting the conductive pattern 306 exposed on the upper surface of the lower substrate 302 and the conductive pattern 312 exposed on the bottom of the vertical substrate 314; A first semiconductor chip 320 attached to the semiconductor chip attachment region 304 of the lower substrate 302 and having a membrane 318 attached to a position where a through hole 316 is formed; A second semiconductor chip 322 attached to a central area of the bottom surface of the horizontal substrate 310 of the cavity substrate 300, or directly adjacent to the first semiconductor chip 320 of the lower substrate 302. ; Conductive connection means 324 for connecting the lower substrate 302 and the first semiconductor chip 320 so as to be capable of electrical signal exchange and at the same time connecting the horizontal substrate 310 and the second semiconductor chip 322 so as to be capable of electrical signal exchange. )and; A solder ball 326 attached to the input / output pad 308 of the cavity substrate 300; It is characterized in that it is configured to include.

However, the device according to another conventional example has a difficulty in fabricating and manufacturing a cavity space capable of accommodating the first and second semiconductor chips, which are MEMS chips and logic chips, on the cavity substrate, and also separately fabricating the cavity substrate and the lower substrate. There was a disadvantage that the cost is very high.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems of the conventional MEMS device, and includes an anodized lid on the entire upper surface and a part of the bottom surface of the lead, and an electrically conductive center portion that is not anodized on the bottom of the lead. By mounting the MEMS chip conductively at the same time and electrically connecting the non-anodized conductive edge portion directly to the conductive pattern of the substrate, it is possible to obtain the smooth performance of MEMS devices as well as the simple manufacturing cost. An object of the present invention is to provide a MEMS device having a new structure and a method of manufacturing the same, which can greatly reduce the cost.

MEMS device according to an embodiment of the present invention for achieving the above object: a logic chip mounting seat surface is formed in the upper surface central region, the first and first in the peripheral region and the upper border region of the logic chip mounting surface, respectively A substrate on which two conductive patterns are exposed; A logic chip attached to the logic chip attachment seat; First conductive means connected between the first conductive pattern of the substrate and the bonding pad of the logic chip; A lead having an insulating portion formed on the entire upper surface and a part of the lower surface thereof, and a conductive path being formed between the insulating portions of the bottom surface, and the sound wave receiving pens penetrating up and down at a predetermined position; A MEMS chip having a membrane attached to a position corresponding to the sound wave receiver at the bottom of the lid; Second conductive means connected between the conductive path of the lead and the bonding pad of the MEMS chip; It is configured to include, but provides a MEMS device characterized in that the edge of the conductive path section of the lead is attached to the second conductive pattern of the substrate by a conductive adhesive means.

In the configuration of the MEMS device according to the embodiment of the present invention, the lead is made of an aluminum material, and upper and lower insulating portions are formed by anodizing, and conductive paths formed between the insulating portions on the bottom surface of the aluminum material are intact. Characterized in that it is formed exposed.

MEMS device according to another embodiment of the present invention for achieving the above object is: a logic chip mounting surface is formed in the upper surface center region, the first and first in the peripheral region and the upper border region of the logic chip mounting surface, respectively A substrate having a second conductive pattern exposed and having a third conductive pattern exposed at a top edge end region thereof; A logic chip attached to the logic chip attachment seat; First conductive means connected between the first conductive pattern of the substrate and the bonding pad of the logic chip; The edge is formed of a conductive end, and an insulating portion is formed on the entire upper surface and a part of the bottom except for the edge, and a conductive path is formed between the insulating portions of the bottom surface. ; A MEMS chip having a membrane attached to a position corresponding to the sound wave receiver at the bottom of the lid; Second conductive means connected between the conductive path of the lead and the bonding pad of the MEMS chip; The edges of the conductive path section of the lead are attached to the second conductive pattern of the substrate by conductive adhesive means, and the conductive ends of the lead are attached to the third conductive pattern of the substrate by conductive adhesive means. It provides a MEMS device characterized in that.

In the configuration of the MEMS device according to another embodiment of the present invention, an insulating layer is further formed between the conductive end of the lead and the conductive path in the thickness direction.

In addition, the lead is made of aluminum, the insulating portion and the insulating layer is formed by anodizing, the conductive path formed between the conductive end and the insulating portion of the bottom is characterized in that the surface of the aluminum material is formed as it is exposed.

The method may further include a conformal shield layer coated over the outer surface of the insulating layer and the conductive end, including the insulating part formed on the upper surface of the lead, and conductively coated on the conductive end.

In the configuration of the MEMS device according to one embodiment of the present invention and the other embodiment, the conductive path of the lead is characterized in that formed in four or more of the cross-shaped cross-section to the edge of the center of the sound receiving device, and the first conductive The means and the second conductive means are any one selected from conductive wires, flip chips, and bumps.

MEMS device manufacturing method according to an embodiment of the present invention for achieving the above object: an insulating portion is formed in the entire upper surface and a portion of the bottom surface and a conductive path is formed between the insulating portion of the bottom surface, the sound wave number at a predetermined position Manufacturing a lead having a structure in which the tool penetrates up and down; Providing a substrate having a logic chip attachment surface formed in an upper surface central region, and having first and second conductive patterns exposed in a peripheral region and an upper edge region of the logic chip attachment surface, respectively; Attaching a logic chip to a logic chip attachment seat of the substrate; Connecting the first conductive pattern of the substrate and the bonding pad of the logic chip to the first conductive means; Attaching a MEMS chip having a membrane at a position corresponding to an acoustic wave receiver at a bottom of the lid; Connecting a conductive path between the lead and a bonding pad of a MEMS chip to a second conductive means; Attaching edges of the conductive path sections of the leads to the second conductive patterns of the substrate by conductive adhesive means; Characterized in that it comprises a.

In the method of manufacturing a MEMS device according to an embodiment of the present invention, the manufacturing of the lead may include: forming a sound wave receiver through an aluminum plate; Attaching a photoresist to the bottom surface of the aluminum plate, and attaching the photoresist in various ways to the edge of the sound wave receiver; Bending the edge of the aluminum plate downward; Performing anodizing over the entire upper surface of the aluminum plate and the region to which the photoresist on the bottom is not attached to form an insulating portion; Removing the photoresist attached to the bottom surface of the aluminum plate while forming the removed portion as a conductive path; Characterized in that consists of.

MEMS device manufacturing method according to another embodiment of the present invention for achieving the above object: the edge is formed of a conductive end, the insulating portion is formed on the entire upper surface and a portion of the bottom surface except the edge end and at the same time A conductive path is formed therebetween, an insulating layer is formed between the conductive end and the conductive path in a thickness direction, and manufacturing a lead having a sound wave container penetrating up and down at a predetermined position; A logic chip attachment seat surface is formed in the upper center region, and first and second conductive patterns are exposed in the peripheral region and the upper edge region of the logic chip attachment surface, respectively, and the third conductive pattern is exposed in the edge region of the upper edge. Providing a formed substrate; Attaching a logic chip to the logic chip attachment seat; Connecting the first conductive pattern of the substrate and the bonding pad of the logic chip to the first conductive means; Attaching a MEMS chip having a membrane at a position corresponding to an acoustic wave receiver at a bottom of the lid; Connecting the conductive path of the lead and the bonding pad of the MEMS chip to the second conductive means; Attaching the edge of the lead to the second conductive pattern of the substrate by conductive adhesive means, and attaching the lead of the lead to the third conductive pattern of the substrate by conductive adhesive means; Characterized in that it comprises a.

MEMS device manufacturing method according to another embodiment of the present invention is characterized in that it further comprises the step of forming a conformal shield layer over the outer surface of the insulating layer and the conductive layer, including the insulating portion of the lead.

In the method of manufacturing a MEMS device according to another embodiment of the present invention, the manufacturing of the lead may include: providing an aluminum plate; Attaching the first photoresist in several ways from the central bottom area of the aluminum plate toward the edge end, attaching the second photoresist spaced apart from the bottom edge area, and attaching the third photoresist to the top edge area; Bending the edge of the aluminum plate downward; Performing anodizing over regions where the photoresist on the top and bottom surfaces of the aluminum plate are not attached to form an insulating portion, and forming an insulating layer in the thickness direction between the first and second photoresists; Removing the second and third photoresist attached to the aluminum plate while forming the removed site as a conductive end; Removing the first photoresist attached to the aluminum plate while simultaneously forming the removed site as a conductive path; .

Through the above-mentioned means for solving the problems, the present invention provides the following effects.

According to the present invention, an anodized lead (Lid) is provided over the remaining surface except for a part capable of transmitting an electrical signal to the substrate, and the MEMS chip can be electrically conductive in the center of the anodized non-anodized surface of the lead. By mounting the lead, the electrically anodized edge of the lead is electrically connected directly to the conductive pattern of the logic chip-mounted substrate, so that the smooth performance of the MEMS device can be obtained, and the existing MEMS device can be obtained. Compared with this, the manufacturing cost can be greatly reduced.

1 and 2 illustrate a MEMS device and a method of manufacturing the same according to a first embodiment of the present invention;
3 and 4 are cross-sectional views showing a MEMS device according to a first embodiment of the present invention,
5 and 6 are views illustrating a MEMS device and a manufacturing method thereof according to a second embodiment of the present invention;
7 and 8 are schematic cross-sectional views illustrating that the lids for manufacturing MEMS devices of the present invention can be applied to various kinds of packages;
9 to 11 illustrate a conventional MEMS device.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

First Embodiment

As shown in FIG. 1 and FIG. 2, the MEMS device according to the first embodiment of the present invention includes a lead (Lid) in which the MEMS chip 22 is mounted on the substrate 10 on which the logic chip 20 is mounted. 30) is made of a structure that is electrically attached.

In the lead 30 according to the first embodiment, the insulating portion 31 is formed on the entire upper surface and a part of the lower surface by a normal anodizing process, and a plurality of conductive layers are formed by the photoresist between the insulating portions 31 on the bottom surface. The path 32 is formed, and the sound wave receiver 33 is provided in a predetermined position at a predetermined position.

Looking at the manufacturing method of the lead according to the first embodiment provided with such a structure as follows.

First, a conductive metal plate body having a predetermined area, preferably an aluminum plate body 37 having excellent conductivity, is formed so as to penetrate the acoustic wave receiver 33 up and down at a predetermined position.

Next, a band-shaped photoresist 38 is attached to the bottom surface of the aluminum plate 37, and attached to the edge of the sound wave receiver 33 to the edge thereof, as an example. The photoresist 38 is attached in a crosswise arrangement around the cross-section.

Subsequently, the edge of the aluminum plate 37 is bent downward so that the aluminum plate 37 with the photoresist 38 has a cap shape.

Next, a normal anodizing treatment is performed over the entire upper surface of the aluminum plate body 37 to which the photoresist is not attached, and the region where the photoresist is not attached to the bottom region of the aluminum plate body 37, whereby the photoresist is attached. The surface except the region is formed of the insulating portion 31.

That is, the entire upper surface of the aluminum plate body 37 to which the photoresist is not attached, and the region where the photoresist is attached to the lower surface area of the aluminum plate body 37 are formed as the insulating portion 31 by anodizing.

For reference, anodizing is a surface post-treatment method for improving the durability of the aluminum surface, and refers to coating an insulating oxide film on the aluminum surface by using an artificial electro-chemical reaction in the natural oxidation process that occurs when aluminum and oxygen meet. .

Finally, by removing the photoresist 38 attached to the bottom surface of the aluminum plate 37, the removed position is formed as the conductive path 32.

That is, by removing the photoresist 38 attached to the bottom surface of the aluminum plate 37, the surface of the aluminum material is exposed as it is to form as a conductive path 32, the conductive path 32 Is formed by forming a cross-shaped path to the edge of the edge around the sound receiving device 33, the lead according to the first embodiment of the present invention is completed.

Herein, a MEMS device using the lead according to the first embodiment manufactured as described above and a method of manufacturing the same will be described.

First, a substrate 10 for manufacturing a MEMS device according to the first embodiment of the present invention is provided.

The substrate 10 is a printed circuit board, and a logic chip attaching surface 14 is formed in a central region of an upper surface thereof, and first and second portions are respectively formed in a peripheral region and an upper edge region of the logic chip attaching surface 14. The conductive patterns 11 and 12 are formed to have an exposed structure, and bottoms of the conductive patterns 11 and 12 are formed to be conductive through the conductive patterns 11 and 12 and via holes (not shown).

Subsequently, the logic chip 20 is attached to the logic chip attachment seat 14 of the substrate 10, and the bonding pad of the logic chip 20 and the first conductive pattern 11 of the substrate 10 are formed. The first conductive means 26 may be connected to each other so as to exchange electrical signals, and the first conductive means 26 may be used as a conductive wire as shown in FIG. 3, or as shown in FIG. 4. In addition, conductive bumps may be used.

Next, the MEMS chip 22 having the membrane 24 is attached to the position corresponding to the acoustic wave receiver 33 at the bottom of the lead 30 manufactured as described above, and the bonding pad of the MEMS chip 22 is attached thereto. The conductive paths 32 between the lead and the lead 30 are connected to each other by the second conductive means 28. The second conductive means 28 may also use any one selected from conductive wires, flip chips, and bumps.

Finally, the edge of the conductive path 32 section of the lead 30 is attached to the second conductive pattern 12 of the substrate 10 by the conductive adhesive means 16, thereby providing a first embodiment of the present invention. MEMS chip device according to the present invention is completed.

Second Embodiment

As shown in FIG. 5 and FIG. 6, the MEMS device according to the second embodiment of the present invention includes a lead (Lid) in which the MEMS chip 22 is mounted on the substrate 10 on which the logic chip 20 is mounted. 30 is conductively attached to the lead 30, but a conformal shield layer 36 is further formed on the lead 30 to shield the electromagnetic wave and remove the ground.

In the lead 30 according to the second embodiment, the edge end is formed of the conductive end 34, and the insulation part 31 is formed on the entire upper surface and a part of the bottom surface except the edge end, and the insulation part 31 on the bottom surface is formed. A conductive path 32 is formed therebetween, and the sound wave receiver 33 is manufactured to penetrate up and down at a predetermined position.

Looking at the manufacturing method of the lead according to the second embodiment provided with such a structure as follows.

First, a conductive metal plate body having a predetermined area, preferably an aluminum plate body 37 excellent in conductivity, is provided.

Subsequently, a photoresist is attached to a portion of the aluminum plate 37 to be a conductive path, and the first photoresist 38a is attached in several directions from the center of the bottom surface of the aluminum plate 37 toward the edge end thereof. The second photoresist 38b is spaced apart and attached to the region, and the third photoresist 38c is attached to the upper edge region corresponding to the bottom edge region.

Next, the edges of the aluminum plate 37 are bent downward, so that the aluminum plate 37 with the first to third photoresists 38a, 38b, and 38c attached thereto becomes a cap shape. .

Subsequently, the entire upper surface of the aluminum plate body 37 to which the photoresist is not attached, and the surface between the first and second photoresist 38a and 38b which are the regions of the bottom surface area of the aluminum plate body 37 to which the photoresist is not attached are then attached. By performing the normal anodizing process, the insulating portion 31 is formed on the upper surface where the third photoresist 38c of the aluminum plate 37 is not attached, and the first and second photoresists 38a and 38b are formed. The insulating layer 35 is formed in the thickness direction between them.

Subsequently, when the second and third photoresists 38b and 38c attached to the aluminum plate 37 are removed, the removed portion is formed of a conductive end 34 in which the surface of the aluminum material is exposed as it is. When the first photoresist 38a attached to the 37 is removed, the removed portion is formed as a cross-shaped conductive path 32 exposing the surface of the aluminum material, whereby the lead according to the second embodiment of the present invention. 30 is completed.

At this time, the acoustic wave receiver 33 is formed to penetrate up and down at a predetermined position of the lead 30.

In particular, the conformal shield layer 36 is coated by spraying a silver material over the outer surface of the insulating layer 35 and the conductive end 34 including the insulating portion 31 of the lead 30 manufactured as described above. As the forming step proceeds further, the conformal shield layer 36 is in a state of being in electrical contact with the conductive end 34 of the lead 30.

Herein, a MEMS device using the lead according to the second embodiment manufactured as described above and a method of manufacturing the same will be described.

First, a substrate 10 for manufacturing a MEMS device according to a second embodiment of the present invention is provided.

The substrate 10 is a printed circuit board, and a logic chip attaching surface 14 is formed in an upper surface central region, and first and second conductive portions are formed in the peripheral region and the upper edge region of the logic chip attaching surface 14, respectively. The patterns 11 and 12 are exposed, and the third conductive pattern 13 is exposed in the upper edge portion of the top surface, and the conductive patterns 11, 12 and 13 and the via holes are not shown in the bottom surface. Borland (not shown) that is conductive through is formed.

Subsequently, the logic chip 20 is attached to the logic chip attachment seat 14 of the substrate 10, and the bonding pad of the logic chip 20 and the first conductive pattern 11 of the substrate 10 are formed. The first conductive means 26 is connected by the first conductive means 26 so as to be exchangeable with electrical signals, and as in the first embodiment, the first conductive means 26 can be used as a conductive wire as shown in FIG. As described above, flip chips may be used, and conductive bumps may be used.

Next, the MEMS chip 22 having the membrane 24 is attached to a position corresponding to the sound wave receiver 33 on the bottom of the lid 30, and the conductive path 32 and the MEMS chip of the lid 30 are attached. The bonding pads (22) are connected to each other by the second conductive means 28. The second conductive means 28 may also use any one selected from conductive wires, flip chips, and bumps.

Finally, the edge of the conductive path 32 section of the lead 30 is attached to the second conductive pattern 12 of the substrate 10 by the conductive bonding means 16 and at the same time the conductive end of the lead 30 By attaching 34 to the third conductive pattern 13 of the substrate 10 with conductive bonding means 16, the MEMS device according to the second embodiment of the present invention is completed.

Meanwhile, as shown in FIG. 7, the lead 30 of the present invention can be applied to a POP-type package, and the lead 30 includes an anodized insulation portion 31 and a conductive end 34. And a semiconductor chip 40 is attached to the chip mounting region 14 of the substrate 10 and mounted to the conductive pattern 11 of the substrate 10 by conductive means 26 such as a wire. In this state, the conductive end of the lead 30 may be directly attached to the conductive pattern 12 of the substrate using the conductive adhesive means 16.

In addition, as shown in FIG. 8, the lead 30 of the present invention can be applied to a multichip package, and includes a lead divided into an anodized insulating portion 31 and a conductive end 34. 30, a plurality of semiconductor chips 40 are mounted on the conductive end 34 portion of the lead 30, and then the semiconductor chip 40 conducts the lower end of the conductive end 34 of the lead 30. The edges of the substrate 10 mounted by the means 26 can be attached directly using the conductive bonding means 16.

10 substrate 11 first conductive pattern
12: second conductive pattern 13: third conductive pattern
14: logic chip mounting seat 16: conductive bonding means
20: logic chip 22: MEMS chip
24: membrane 26: first conductive means
28: second conductive means 30: lead
31: insulation part 32: conductive path
33: sound wave receptor 34: challenge
35 insulation layer 36 conformal shield layer
37: aluminum plate 38: photoresist
38a: first photoresist 38b: second photoresist
38c: third photoresist

Claims (13)

The substrate having the logic chip attachment surface 14 formed in the upper center region and the first and second conductive patterns 11 and 12 exposed in the peripheral region and the upper edge region of the logic chip attachment surface 14, respectively. 10);
A logic chip 20 attached to the logic chip attachment seat 14 of the substrate 10;
First conductive means (26) connected between the first conductive pattern (11) of the substrate (10) and the bonding pad of the logic chip (20);
The insulating part 31 is formed on the entire upper surface and a part of the lower surface, and a plurality of conductive paths 32 are formed between the insulating part 31 on the bottom, and the acoustic wave receiver 33 is formed to penetrate up and down at a predetermined position. Leads 30 and Lid;
A MEMS chip 22 having a membrane 24 attached to a position corresponding to the sound wave receiver 33 at the bottom of the lid 30;
Second conductive means 28 connected between the conductive path 32 of the lead 30 and the bonding pad of the MEMS chip 22;
Including but not limited to
MEMS device, characterized in that the edge of the conductive path (32) of the lead (30) is attached to the second conductive pattern (12) of the substrate (10) by conductive bonding means (16).
The method of claim 1, wherein the lead 30 is made of aluminum, the upper and lower insulating portion 31 is formed by anodizing, the conductive path 32 formed between the insulating portion 31 of the bottom is made of aluminum MEMS device, characterized in that the surface of the formed as it is exposed.
The logic chip mounting seat 14 is formed in the upper center area, and the first and second conductive patterns 11 and 12 are exposed in the peripheral area and the upper edge area of the logic chip mounting seat 14, respectively. A substrate 10 having the third conductive pattern 13 exposed at an upper edge portion of the upper surface;
A logic chip 20 attached to the logic chip attachment seat 14;
First conductive means 26 connected between the first conductive pattern 11 of the substrate 10 and the bonding pad of the logic chip 20;
The edge end is formed of the conductive end 34, the insulating portion 31 is formed on the entire upper surface and a portion of the bottom surface except the edge end, and the conductive path 32 is formed between the insulating portion 31 of the bottom, A lead 30 having a sound wave receiver 33 penetrating up and down at a predetermined position;
A MEMS chip 22 having a membrane 24 attached to a position corresponding to the sound wave receiver 33 at the bottom of the lid 30;
Second conductive means 28 connected between the conductive path 32 of the lead 30 and the bonding pad of the MEMS chip 22;
Including but not limited to
The edge of the conductive path 32 section of the lead 30 is attached to the second conductive pattern 12 of the substrate 10 by conductive bonding means 16 and at the same time, the conductive end 34 of the lead 30 is formed. Is attached to the third conductive pattern (13) of the substrate (10) by conductive bonding means (16).
The method according to claim 3,
MEMS device, characterized in that an insulating layer (35) is further formed in the thickness direction between the conductive end (34) and the conductive path (32) of the lead (30).
The method of claim 4,
The lead 30 is made of aluminum, and the insulating part 31 and the insulating layer 35 are formed by anodizing, and the conductive path 32 is formed between the conductive end 34 and the insulating part 31 on the bottom surface. MEMS device characterized in that the surface of the aluminum material is formed as it is exposed.
The method of claim 4,
The conformal shield layer 36 is coated on the outer surface of the insulating layer 35 and the conductive end 34 including the insulating part 31 formed on the upper surface of the lead 30, and the conductive end 34 is electrically conductive. MEMS device, characterized in that the coating possible.
The method according to claim 1 or 3,
MEMS device, characterized in that the conductive path 32 of the lead 30 is formed of four or more cross-shaped to the rim end around the sound receiving vessel (33).
The method according to claim 1 or 3,
The first conductive means (26) and the second conductive means (28) is a MEMS device, characterized in that any one selected from conductive wire, flip chip, bump.
The insulating portion 31 is formed on the entire upper surface and a part of the lower surface, and a conductive path 32 is formed between the insulating portions 31 on the bottom surface, and the acoustic wave receiver 33 penetrates up and down at a predetermined position. Manufacturing a lead 30;
The substrate having the logic chip attachment surface 14 formed in the upper center region and the first and second conductive patterns 11 and 12 exposed in the peripheral region and the upper edge region of the logic chip attachment surface 14, respectively. Providing 10);
Attaching a logic chip (20) to a logic chip attachment seat (14) of the substrate (10);
Connecting the first conductive pattern 11 of the substrate 10 and the bonding pads of the logic chip 20 with the first conductive means 26;
Attaching a MEMS chip (22) having a membrane (24) at a position corresponding to an acoustic wave receiver (33) at the bottom of the lid (30);
Connecting the conductive path 32 of the lead 30 and the bonding pad of the MEMS chip 22 to the second conductive means 28;
Attaching the edge of the conductive path 32 section of the lead 30 to the second conductive pattern 12 of the substrate 10 by conductive bonding means 16;
MEMS device manufacturing method comprising a.
The method according to claim 9,
Producing the lead 30 is:
Penetrating the sound wave receiver 33 on the aluminum plate 37;
Attaching the photoresist 38 to the bottom surface of the aluminum plate 37, and attaching the photoresist 38 to the edge of the sound wave receiver 33 to its edge;
Bending the edge of the aluminum plate 37 downward;
Forming an insulating portion 31 by anodizing the entire upper surface of the aluminum plate 37 and the area where the photoresist on the bottom surface is not attached;
Removing the photoresist 38 attached to the bottom surface of the aluminum plate while simultaneously forming the removed portion as the conductive path 32;
MEMS device manufacturing method characterized in that consisting of.
The edge end is formed of the conductive end 34, the insulating portion 31 is formed on the entire upper surface and a portion of the bottom surface except the edge end, and the conductive path 32 is formed between the insulating portion 31 of the bottom, An insulating layer 35 is formed between the conductive end 34 and the conductive path 32 in a thickness direction, and manufacturing a lead 30 having a sound wave receiver 33 penetrating up and down at a predetermined position;
The logic chip mounting seat 14 is formed in the upper center area, and the first and second conductive patterns 11 and 12 are exposed in the peripheral area and the upper edge area of the logic chip mounting seat 14, respectively. Providing a substrate 10 having a third conductive pattern 13 exposed at an upper edge portion thereof;
Attaching a logic chip (20) to the logic chip attachment seat (14);
Connecting the first conductive pattern 11 of the substrate 10 and the bonding pads of the logic chip 20 with the first conductive means 26;
Attaching a MEMS chip (22) having a membrane (24) at a position corresponding to an acoustic wave receiver (33) at the bottom of the lid (30);
Connecting the conductive path 32 of the lead 30 and the bonding pad of the MEMS chip 22 to the second conductive means 28;
The edge of the conductive path 32 section of the lead 30 is attached to the second conductive pattern 12 of the substrate 10 by conductive bonding means 16 and at the same time, the conductive end 34 of the lead 30 is formed. Attaching to the third conductive pattern 13 of the substrate 10 by conductive bonding means 16;
MEMS device manufacturing method comprising a.
The method of claim 11,
And forming a conformal shield layer 36 over the outer surface of the insulating layer 35 and the conductive end 34 including the insulating portion 31 of the lead 30. Manufacturing method.
The method of claim 11,
Producing the lead 30 is:
Providing an aluminum plate body 37;
The first photoresist 38a is attached in multiple directions from the center area of the bottom surface of the aluminum plate 37 toward the edge end, and the second photoresist 38b is spaced apart from the bottom edge area. Attaching the three photoresist 38c;
Bending the edge of the aluminum plate 37 downward;
Anodizing is applied to the upper and lower portions of the aluminum plate 37 to which the photoresist is not attached to form an insulating portion 31, and the thickness direction between the first and second photoresists 38a and 38b. Forming an insulating layer 35;
Removing the second and third photoresist 38b, 38c attached to the aluminum plate 37, and at the same time, the removed site is formed by the conductive end 34;
Removing the first photoresist 38a attached to the aluminum plate 37 and forming the removed portion as the conductive path 32;
MEMS device manufacturing method characterized in that consisting of.

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