KR20130068822A - Apparatus for coating a substrate and coating method - Google Patents

Apparatus for coating a substrate and coating method Download PDF

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Publication number
KR20130068822A
KR20130068822A KR1020110136216A KR20110136216A KR20130068822A KR 20130068822 A KR20130068822 A KR 20130068822A KR 1020110136216 A KR1020110136216 A KR 1020110136216A KR 20110136216 A KR20110136216 A KR 20110136216A KR 20130068822 A KR20130068822 A KR 20130068822A
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KR
South Korea
Prior art keywords
substrate
stage
coating
hole processing
vacuum
Prior art date
Application number
KR1020110136216A
Other languages
Korean (ko)
Inventor
서진석
Original Assignee
서진석
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서진석 filed Critical 서진석
Priority to KR1020110136216A priority Critical patent/KR20130068822A/en
Publication of KR20130068822A publication Critical patent/KR20130068822A/en

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70933—Purge, e.g. exchanging fluid or gas to remove pollutants
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Abstract

According to the present invention, a plate-shaped substrate having a hole processing surface is mounted on the stage, and the coating liquid is applied to the surface of the substrate through a spray means, and at the bottom of the stage, the edge beads of the outer surface and the hole processing surface of the substrate are removed by vacuum adsorption. By doing so, the edge bead of the substrate can be cleanly removed at the same time as the coating operation to improve the quality of the product, as well as to reduce the separate process and time according to the edge bead removal operation.

Description

Apparatus for coating a substrate and coating method

The present invention relates to a substrate coating apparatus, and more particularly, a plate-shaped substrate having a hole processing surface is mounted on an upper stage, and the outer surface of the substrate and the lower surface of the substrate at the same time while applying a coating liquid to the surface of the substrate through a spray means; By removing the edge beads of the hole processing surface by vacuum adsorption, the edge beads of the substrate can be removed cleanly at the same time as the coating work, thereby improving the quality of the product and reducing the separate process and time according to the edge bead removal work. It relates to a substrate coating apparatus and a substrate coating method to enable.

Recently, semiconductor manufacturing technology has been developed in the direction of improving integration, reliability, and processing speed according to the rapid development of information and communication technology.

The semiconductor is manufactured by fabricating a silicon wafer used as a semiconductor substrate from a silicon single crystal, forming a film on the semiconductor substrate, and forming the film in a pattern having electrical properties.

Among the unit processes for forming a pattern on a semiconductor substrate as described above, a photolithography process includes coating a photoresist film on a semiconductor wafer and curing the photoresist film, and a photoresist film coated on the semiconductor wafer. An exposure process and a development process for forming into a photoresist pattern are included.

In general, the photoresist film coating process first places a semiconductor wafer on a rotary chuck, then supplies a photoresist solution to a central portion on the semiconductor wafer, and rotates the semiconductor wafer.

The photoresist solution supplied to the center portion on the semiconductor wafer is dispersed in the outer circumferential direction by centrifugal force and uniformly applied on the semiconductor wafer, and the photoresist film is coated on the semiconductor wafer by curing through a subsequent soft bake process. .

In this case, the photoresist film formed on the edge portion of the semiconductor wafer may be peeled off in a subsequent process, and contamination of the wafer or contamination of the manufacturing process equipment may be caused by contaminants such as particles generated by the peeling of the photoresist film on the edge portion. Can be generated.

In order to solve such a problem, an EBR (edge bead removal) process of removing a photoresist film on the edge portion is performed by spraying thinner onto the edge portion of the semiconductor wafer while rotating the semiconductor wafer on which the photoresist layer is formed. .

Here, looking at the apparatus for performing the photoresist film formation and EBR process, a rotation chuck for supporting and rotating the semiconductor wafer, a coating solution supply for providing a photoresist solution to the wafer, and is provided surrounding the rotary chuck And a bowl for blocking the photoresist solution scattered by the rotation of the rotary chuck, and a thinner supply nozzle disposed on the rotary chuck and providing thinner to the edge of the wafer.

However, the prior art as described above has a problem that it is almost impossible to remove edge beads using thinner when the shape of the semiconductor substrate forms a hole processing surface rather than a single plane or when the outer surface has a curved surface.

Particularly, in the case of a panel used in a touch pad type mobile terminal, a processing surface such as a camera hole is essential. As edge bead is generated on the hole processing surface, the thickness of the assembly module of the terminal is increased or a defect in the assembly portion is caused. There was a problem that occurred.

An object of the present invention devised to solve the problems of the prior art is that the plate-shaped substrate having a hole processing surface is mounted on the upper stage, the coating surface is applied to the surface of the substrate through the spray means while at the same time the outer surface of the substrate at the lower stage And by removing the edge bead of the hole machining surface by vacuum adsorption, it is possible to remove the edge bead of the substrate clean at the same time as the coating work to improve the quality of the product, as well as separate process and time according to the edge bead removal work It is to provide a substrate coating apparatus and a substrate coating method that can be reduced.

According to one aspect of the invention, the plate-shaped substrate formed with a hole processing surface; A stage on which the substrate is mounted; Spray means for applying a coating solution to the surface of the substrate on the stage; And a vacuum means for vacuum-adsorbing and removing edge beads of the outer surface and the hole processing surface of the substrate under the stage. The substrate coating apparatus may be provided.

In addition, the stage may be formed with an intake flow passage centering on the boundary between the outer surface and the hole processing surface.

In addition, cleaning means for applying a cleaning liquid for cleaning the surface of the stage may be further provided.

In addition, the stage may be surface treated to have hydrophobicity with respect to the coating liquid.

In addition, the vacuum means includes a vacuum pump, a suction pipe connecting the intake passage of the stage from the vacuum pump, and a coating liquid processing unit for collecting the coating liquid sucked through the suction pipe.

In addition, the vacuum means may be operated together with the cleaning means so that the cleaning liquid is collected into the coating liquid treatment part through the intake passage and the suction pipe.

According to another aspect of the present invention, a plate-shaped substrate having a hole processing surface is mounted on the upper stage, the coating liquid is applied to the surface of the substrate by the spraying means at the upper stage, the outer surface of the substrate using the cutting means at the lower stage And it can be provided a substrate coating method characterized in that the vacuum removal of the edge bead of the hole processing surface.

According to the present invention, a plate-shaped substrate having a hole processing surface is mounted on the stage, and the coating liquid is applied to the surface of the substrate through a spray means, and at the bottom of the stage, the edge beads of the outer surface and the hole processing surface of the substrate are removed by vacuum adsorption. By doing so, the edge bead of the substrate can be cleanly removed at the same time as the coating operation to improve the quality of the product, as well as to reduce the separate process and time according to the edge bead removal operation.

1 is a schematic view showing the overall structure of a substrate coating apparatus according to the present invention.
2 is a plan view showing a stage and a substrate according to the present invention.
3 is a schematic view showing a stage cleaning structure according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic view showing the overall structure of a substrate coating apparatus according to the present invention, Figure 2 is a plan view showing a stage and a substrate according to the present invention.

1 and 2, the substrate coating apparatus according to the present invention includes a stage 120 on which a plate-shaped substrate 110 having a hole processing surface 113 is mounted, and a substrate 110 on the stage 120. Spraying means 130 for applying a coating solution to the surface, and vacuum means 140 for removing the edge beads of the outer surface 111 and the hole processing surface 113 of the substrate 110 from the lower portion of the stage 120 by vacuum adsorption. ) Is included.

Here, the substrate 110 is used to include various forms such as a substrate for coating as well as a photoresist coating substrate, such as a semiconductor substrate. For example, a touch panel of a mobile communication terminal may be used.

The touch panel of the mobile communication terminal forms a hole processing surface 113 for installing a camera and a microphone on the front surface.

The stage 120 mounts the substrate 110 to allow the coating operation to proceed stably, and an alignment device (not shown) may be installed to align the position when the substrate 110 is mounted.

Although not shown in the drawings, such a stage of the present invention may be provided with a lifting and lowering drive means, a conveying means, a rotating means and the like to help the coating work and the mounting and transporting of the substrate.

In addition, the spray means 130 is installed on the stage 120. The spray means 130 forms a spray nozzle for uniformly applying a coating liquid (including a photoresist, paint, etc.) to the surface of the substrate 110, the spray nozzle is formed of a single nozzle or a plurality of nozzles in one assembly It can be formed as.

In addition, a vacuum means 140 is formed below the stage 120, and the coating liquid is removed by vacuum adsorption of the edge beads gathered on the outer surface 111 and the hole processing surface 113 of the substrate 110.

In this case, the stage 120 may be formed with an intake passage 121 centering on the boundary between the outer surface 111 and the hole processing surface 113 of the substrate 110.

For example, referring to FIG. 2, the intake flow passage 121 is formed in accordance with the outer shape of the substrate 110, and the width center of the intake flow passage 121 coincides with the boundary of the outer surface 111 and the hole processing surface 113. It may be formed to.

The vacuum means 140 includes a vacuum pump 141 for forming a vacuum pressure, an intake pipe 143 connecting the intake flow passage 121 of the stage 120 from the vacuum pump 141, and the intake pipe 143. It includes a coating liquid processing unit 145 to collect the coating liquid sucked through).

3 is a schematic view showing a stage cleaning structure according to the present invention.

Referring to FIG. 3, after the substrate 110 coated with the coating liquid is transferred to the next process, the stage 120 and the vacuum means 140 may be cleaned. At this time, the cleaning means 150 for applying a cleaning liquid for cleaning the surface of the stage 120 may be further formed on the stage 120.

Thinner and the like may be used as the cleaning liquid.

In this case, in order to perform the cleaning operation smoothly, the stage 120 may be surface treated to have hydrophobicity with respect to the coating liquid.

That is, the coating liquid on the surface of the stage having hydrophobicity can be easily removed by applying the cleaning liquid.

In this case, there exists an advantage that it can wash | clean by using water, without using cleaning liquids, such as a thinner.

In this case, the vacuum cleaner 140 may be operated together with the cleaning means 150 to collect the cleaning solution through the intake passage 121 and the intake pipe 143 to the coating liquid treatment unit 145.

In addition, a method of removing the mask after the coating operation by installing the replaceable mask 160 on the surface of the stage 120 may be used.

The mask 160 covers the surface of the stage 120 to prevent the coating liquid from getting on and may be replaced after one or several uses.

Hereinafter, a substrate coating method using the coating apparatus as described above will be described.

First, the plate-shaped substrate 110 on which the hole processing surface 113 is formed is mounted on the stage 120.

At this time, the base 110 may be aligned to position through an alignment device (not shown), by branching the vacuum pressure of the vacuum means 140 by suction, it is possible to fix the alignment position.

Thereafter, the coating solution is applied to the surface of the substrate 110 using the spray means 130 on the surface of the stage 120 to form a coating layer having a predetermined thickness.

At the same time, the edge beads of the outer surface 111 and the hole processing surface 113 of the substrate 110 are removed by vacuum adsorption at the same time as the coating operation using the lowering means 140 under the stage 120.

Subsequently, the coated substrate 110 is transferred to a subsequent process (such as a dry and an exposure process), and the cleaning process of the stage 120 and the vacuum means 140 is performed.

Cleaning means 150 for the cleaning operation may be provided in the form of a spray nozzle, the cleaning liquid may be used thinner or water.

As described above, in the present invention, the plate-shaped substrate having the hole processing surface is mounted on the stage, and the edge bead of the outer surface and the hole processing surface of the substrate is applied at the bottom of the stage while the coating liquid is applied to the surface of the substrate through spraying means. By removing by vacuum adsorption, it is possible to remove the edge bead of the substrate clean at the same time as the coating operation to improve the quality of the product, it is possible to save a separate process and time according to the edge bead removal operation.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, You will understand. For example, a person skilled in the art can change the material, size and the like of each constituent element depending on the application field or can combine or substitute the embodiments in a form not clearly disclosed in the embodiment of the present invention, Of the range. Therefore, it should be understood that the above-described embodiments are to be considered in all respects as illustrative and not restrictive, and that such modified embodiments are included in the technical idea described in the claims of the present invention.

110: substrate
111: External surface
113: hole processing surface
120: stage
121: intake flow path
130: spray means
140: Benin means
141: vacuum pump
143: intake pipe
145: coating liquid treatment unit
150: cleaning means
160: mask

Claims (7)

A stage 120 on which the plate-shaped substrate 110 on which the hole processing surface 113 is formed is mounted;
Spray means 130 for applying a coating solution to the surface of the substrate 110 on the stage 120; And
Vacuum means (140) for removing the edge beads of the outer surface (111) and the hole processing surface (113) of the substrate (110) by vacuum suction under the stage (120);
Substrate coating apparatus comprising a.
The method of claim 1,
The stage 120 is a substrate coating apparatus, characterized in that the intake passage 121 is formed around the boundary of the outer surface (111) and the hole processing surface (113).
The method of claim 1,
Substrate coating apparatus, characterized in that the cleaning means for applying a cleaning solution for cleaning the surface of the stage 120 is further installed (150).
The method of claim 1,
Substrate coating apparatus, characterized in that the stage 120 to the surface treatment to have a hydrophobic with respect to the coating liquid.
The method of claim 1,
The vacuum means 140 is sucked through the vacuum pump 141 and the intake pipe 143 and the intake pipe 143 connecting the intake flow passage 121 of the stage 120 from the vacuum pump 141. Substrate coating apparatus characterized in that it comprises a coating liquid processing unit 145 to collect the coating liquid.
The method of claim 3,
Substrate coating apparatus characterized in that the cleaning means is operated together with the cleaning means 150, the cleaning solution is collected by the coating liquid processing unit 145 through the intake passage 121 and the intake pipe 143.
The plate-shaped substrate 110 having the hole processing surface 113 is mounted on the stage 120, the coating liquid is applied to the surface of the substrate 110 using the spray means 130 on the stage 120, and the stage (120) The substrate coating method, characterized in that by vacuum suction the edge bead of the outer surface 111 and the hole processing surface 113 of the substrate 110 using a vacuum means (140).
KR1020110136216A 2011-12-16 2011-12-16 Apparatus for coating a substrate and coating method KR20130068822A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110136216A KR20130068822A (en) 2011-12-16 2011-12-16 Apparatus for coating a substrate and coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110136216A KR20130068822A (en) 2011-12-16 2011-12-16 Apparatus for coating a substrate and coating method

Publications (1)

Publication Number Publication Date
KR20130068822A true KR20130068822A (en) 2013-06-26

Family

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Family Applications (1)

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KR1020110136216A KR20130068822A (en) 2011-12-16 2011-12-16 Apparatus for coating a substrate and coating method

Country Status (1)

Country Link
KR (1) KR20130068822A (en)

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