KR20130057279A - Transcripting device in using thermal transfer process and method for thermal transfering thereby - Google Patents

Abstract

PURPOSE: An apparatus and method for transferring an organic thin film are provided to prevent the short of a heat radiation pattern due to overheat by reducing the resistance of the heat radiation pattern formed on a transfer substrate. CONSTITUTION: A first common electrode(120a) is formed in one end of a transfer substrate. A second common electrode(120b) is formed in the other end of the transfer substrate to face the first common electrode. A heat radiation pattern(130) connects the first common electrode to the second common electrode. The heat radiation pattern includes a transfer pattern(132) corresponding to a transfer region of a target transfer substrate and a non-transfer pattern(134) with a lower resistance than the resistance of the transfer pattern. An organic thin film is formed on the heat radiation pattern.

Description

Transcripting device in using thermal transfer process and Method for thermal transfering}

The present invention relates to an organic thin film transfer device for manufacturing an organic light emitting diode display device and an organic thin film transfer method using the same.

2. Description of the Related Art Recently, various flat panel display devices capable of reducing weight and volume, which are disadvantages of cathode ray tubes (CRTs), have been developed. Such flat panel displays include liquid crystal displays (LCDs), field emission displays (FEDs), plasma display panels (PDPs), and electroluminescence devices (Electroluminescence Devices). .

PDP is attracting attention as a display device that is thin and advantageous for large size due to its simple structure and manufacturing process, but has a disadvantage of low luminous efficiency, low luminance and high power consumption. Thin Film Transistor LCD (TFT LCD) is the most widely used flat panel display device, but has a narrow viewing angle and low response speed. Electroluminescent devices are classified into inorganic light emitting diode display devices and organic light emitting diode display devices according to the material of the light emitting layer. Among them, organic light emitting diode display devices are light emitting devices that emit light by themselves and have fast response speed, high luminous efficiency, high luminance, and high viewing angle. There is an advantage.

The organic light emitting diode display has an organic light emitting diode (OLED) as shown in FIG. 1.

The OLED 10 includes an electroluminescent organic compound layer and a cathode electrode 90 and an anode electrode 30 which face each other with the organic compound layer interposed therebetween. The organic compound layer is an electron injection layer (EIL) 80, an electron transport layer (ETL) 70, an emission layer (EML) 60, a hole transport layer (HTL) 50 and a hole injection layer (HIL) 40, the multilayered structure is included.

When a driving voltage is applied to the anode electrode 30 and the cathode electrode 90, holes passing through the hole transport layer 50 and electrons passing through the electron transport layer 70 are moved to the emission layer 60 to form excitons. As a result, the light emitting layer 60 emits visible light.

The organic light emitting diode display device forms a light emitting layer 60 at a position where an OLED is to be disposed in each of R (red), G (green), and B (blue) pixels in order to realize full color.

The light emitting layer 60 is patterned for each pixel. As a method of forming the light emitting layer 60, a fine metal mask (FMM) method, a laser thermal transfer method, an ink jet method, and the like are known. However, these methods are not suitable for large area substrates that require high precision pattern formation in a short time.

In recent years, in order to form a high-precision pattern within a short time, an organic thin film transfer apparatus using a thermal transfer method using Joule heating (or "Joule thermal transfer method") has emerged.

FIG. 2A is a cross-sectional view showing an outline of an organic thin film transfer device by the joule thermal transfer method, and FIG. 2B is an exploded perspective view showing a schematic structure of the organic thin film transfer device.

As can be seen in FIGS. 2A and 2B, the organic thin film transfer apparatus includes a transfer substrate 1, a transfer substrate 11, a heating pattern 5, common electrodes 3a and 3b, device electrodes 7a and 7b, And a power source 15.

In the Joule thermal transfer method, the transfer substrate 1 on which the organic light emitting material 13 is formed is arranged so as to face each other at a predetermined interval with the transfer substrate 11 and the spacer 9 interposed therebetween, and then the transfer substrate ( Electrical energy is applied to 1) to transfer the organic light emitting material 13 to the transfer substrate 11.

A plurality of metal heating patterns 5 are formed on the transfer substrate 1 so as to correspond to the pixel areas of the transfer substrate 11 on which the organic light emitting material 13 is to be transferred. First and second common electrodes 3a and 3b connecting the metal heating patterns 5 are formed at one end and the other end of the metal heating pattern 5, respectively. On the metal heating patterns 5, an organic light emitting material 13 to be transferred to the transfer substrate 11 is formed in a thin film form. The transfer substrate 11 may be positioned on the organic light emitting material 13.

The first device electrode 7a and the second device electrode 7b are aligned on the first and second common electrodes 3a and 3b, respectively, so that the common electrodes 3a and 3b and the device electrodes 7a and 7b are aligned. It is configured to be connected and separated from each other. The power source 15 can generate a direct current power source or an alternating current power source, depending on the transfer device configured.

After the transfer substrate 11 is mounted on the metal heating pattern 5 on which the organic light emitting material 13 is formed at a predetermined interval, the common electrodes 3a, which face the device electrodes 7a and 7b, respectively, After contacting with 3b), the power source 15 connected between the first device electrode 7a and the second device electrode 7b is operated to apply a predetermined voltage. Joule heat generated in the metal heating pattern 5 is transferred to the organic light emitting material 13 positioned on the metal heating pattern 5, and as a result, the organic light emitting material 13 is evaporated and transferred to the transfer substrate 11. Transferred to form an organic light emitting layer in the pixel region.

In order to sufficiently heat the organic light emitting material 13, considerably high heat energy is required, and in order to supply sufficient heat energy, the electric energy applied to the metal heating pattern 5 should be large. In order to obtain a large electric energy, the power applied between the first device electrode 7a and the second device electrode 7b should be a power source 15 for generating a high voltage and a high current.

3 is a view illustrating a conventional metal heating pattern formed on a transfer substrate.

As can be seen in FIG. 3, a plurality of metal heating patterns 5 are formed on the transfer substrate 1 so as to correspond to the pixel region of the transfer substrate on which the organic light emitting material is to be transferred. First and second common electrodes 3a and 3b connecting the metal heating patterns 5 are formed at one end and the other end of the metal heating pattern 5, respectively.

The metal heating patterns 5 are formed to be spaced apart at predetermined intervals and are made of a thin line width metal connecting the first common electrode 3a and the second common electrode 3b. In this case, the metal heating pattern 5 is formed with the same line width.

Therefore, the organic thin film transfer apparatus described above has the following problems.

First, in order to realize a high-resolution light emitting device, as the line width of the heating pattern is thinned, the resistance of the heating pattern increases, and a high current flows through the high-resistance heating pattern, resulting in excessive heat and short circuit of the heating pattern. do.

Second, if the heat generation pattern is shorted due to excessive heat generation, process defects occur and productivity is reduced.

The present invention has been devised to solve the above problems, the present invention is to reduce the resistance of the heating pattern to prevent the short circuit of the heating pattern, the organic thin film transfer device using the same and reduce the process defects due to the heating pattern short circuit An object of the present invention is to provide an organic thin film transfer method.

The present invention to achieve the above object, a transfer substrate; A first common electrode formed at one end of the transfer substrate; A second common electrode formed at the other end of the transfer substrate to face the first common electrode; A heating pattern formed between the first common electrode and the second common electrode; And an organic thin film formed on the heat generating pattern, wherein the heat generating pattern corresponds to a transfer pattern corresponding to a transfer region on the transfer substrate on which the organic thin film is transferred and a non-transfer region on the transfer substrate on which the organic thin film is not transferred. It provides an organic thin film transfer apparatus comprising a non-transfer pattern corresponding to and formed to have a resistance lower than the resistance of the transfer pattern.

In addition, the present invention comprises the steps of forming a heating pattern on the transfer substrate to achieve the above object; Forming an organic thin film on the heating pattern; Bonding the transfer substrate to face the organic thin film; Depositing the organic thin film from the transfer substrate to the transfer substrate by applying power to the heat generation pattern, wherein the heat generation pattern corresponds to a transfer pattern corresponding to a transfer region on the transfer substrate to which the organic thin film is transferred. And a non-transfer pattern corresponding to the non-transfer region on the transfer substrate on which the organic thin film is not transferred, wherein the non-transfer pattern is formed to have a resistance lower than that of the transfer pattern. Provide a method.

According to the present invention as described above, the following effects can be obtained.

First, there is an effect of reducing the resistance of the heating pattern formed on the transfer substrate to prevent the short circuit of the heating pattern due to overheating.

In addition, there is an effect that the productivity is improved by reducing the process defect by preventing the short circuit of the heating pattern.

FIG. 1 is a diagram illustrating an organic light emitting diode (OLED) used in an organic light emitting diode display.
2A is a cross-sectional view illustrating an outline of an organic thin film transfer apparatus by the joule thermal transfer method.
2B is an exploded perspective view showing the schematic structure of the organic thin film transfer device.
3 is a view illustrating a conventional metal heating pattern formed on a transfer substrate.
4 is a schematic cross-sectional view of an organic thin film transfer apparatus according to the present invention.
5 is a view showing a heating pattern of the organic thin film transfer apparatus according to the present invention.
6 is a view showing another embodiment of a heat generation pattern of the organic thin film transfer apparatus according to the present invention.
7 is a view showing another embodiment of a heat generation pattern of the organic thin film transfer apparatus according to the present invention.

Hereinafter, with reference to the accompanying drawings, a preferred embodiment of an organic thin film transfer device and an organic thin film transfer method using the same according to the present invention will be described in detail.

In describing embodiments of the present invention, when a structure is described as being formed "on" or "below" another structure, such a description may be made between these structures, as well as when the structures are in contact with each other. It is to be interpreted as covering up to three intervening structures.

4 is a schematic cross-sectional view of an organic thin film transfer apparatus according to the present invention.

As can be seen in Figure 4, the organic thin film transfer apparatus 100 according to the present invention is a transfer substrate 110, the first common electrode 120a, the second common electrode 120b, the heating pattern 130, the organic thin film ( 140, a first device electrode 150a, a second device electrode 150b, a spacer 160, a transfer substrate 170, and a power supply unit 180.

In the organic thin film transfer apparatus 100 according to the present invention, the transfer substrate 170 is mounted on the metal heating pattern 130 on which the organic thin film 140 is formed at a predetermined interval, and then, the device electrodes 150a and 150b. ) Is brought into contact with the common electrodes 120a and 120b facing each other, and then a predetermined power is applied by operating the power supply unit 180 connected between the first device electrode 150a and the second device electrode 150b.

Joule heat generated from the metal heating pattern 130 to which power is applied is transferred to the organic thin film 140 positioned on the metal heating pattern 130. As a result, the organic thin film 140 evaporates, and the substrate to be transferred 170 is transferred. ) To form an organic light emitting layer in the pixel region.

The transfer substrate 110 is used as a substrate on which the heating pattern 130 and the organic thin film 140 are deposited, and at one end of the first common electrode 120a and the second common electrode 120b connected to the heating pattern 130. Is deposited.

The first common electrode 120a is formed at one end of the transfer substrate 110 to transfer power supplied from the power supply unit 180 to the heating pattern 130, and the second common electrode 120b is transferred to the transfer substrate 110. On the other side on the) is formed facing the first common electrode (120a).

The first common electrode 120a and the second common electrode 120b may be made of a metal material having excellent electrical conductivity and low resistance, and may include molybdenum (Mo), copper (Cu), aluminum (Al), or an aluminum alloy. It may be made of any one or more selected from the group consisting of.

In addition, the first common electrode 120a and the second common electrode 120b may be any one of a chemical vapor deposition (CVD) process, a sputtering process, an electron beam (E-Beam) process, and an electrolytic / electroless plating process. After the entire surface deposition of the metal or alloy by a method, and then patterning the entire surface-deposited bimetallic or alloy through a photolithography process and wet etching process or dry etching. Can be.

The heating pattern 130 connects the first common electrode 120a and the second common electrode 120b on the transfer substrate 110, and forms the first common electrode 120a and the second common electrode 120b. Can be formed simultaneously.

The heating pattern 130 converts the electrical energy supplied through the first common electrode 120a and the second common electrode 120b into thermal energy to form an organic thin film 140 formed on the heating pattern 130. Sublimation 170 allows for deposition.

The transfer method of the organic thin film 140 is called a Joule heat transfer method, which is arranged by arranging the transfer substrate 110 on which the organic thin film 140 is formed with the transfer substrate 170 and the spacer 160 interposed therebetween. After arranging to face at intervals, the organic thin film 140 is transferred to the transfer substrate 170 by applying electrical energy to the heating pattern 130.

The heating pattern 130 may be patterned in various forms according to the pixel arrangement of the transfer substrate 170. In the organic thin film transfer apparatus according to the present invention, the heating pattern 130 may be formed on the transfer substrate 170. The transfer pattern corresponding to the transfer region for transferring the organic thin film 140 and the non-transfer region for not transferring the organic thin film 140 to the transfer substrate 170 have lower resistance than the resistance of the transfer pattern. It includes a formed non-transfer pattern.

That is, the transfer substrate 170 has a pixel area, and the organic thin film 140 should be transferred to the pixel area. The area where the organic thin film 140 is to be transferred is called a transfer area. In addition, a part of the heating pattern 130 on the transfer substrate 110 corresponding to the transfer region is called a transfer pattern. Reference will be made to the drawings in order to describe this in detail.

5 is a view showing a heating pattern of the organic thin film transfer apparatus according to the present invention.

As can be seen in FIG. 5, in the heating pattern 130, a transfer pattern 132 corresponding to a transfer region T on the transfer substrate 170, which is an area where the organic thin film 140 is to be transferred, is formed. The non-transfer pattern 134 corresponding to the non-transfer region N on the transfer substrate 170, which is an area where the organic thin film 140 is not transferred, is formed between the patterns 132.

In addition, the first common electrode 120a and the second common electrode 120b are connected to both ends of the heating pattern 130 to supply power to the heating pattern 130. In this case, the first common electrode 120a, the second common electrode 120b, and the heating pattern 130 may be formed of any one of Mo, Cu, Al, or Al alloy having excellent electrical conductivity and low resistance. .

The non-transfer pattern 134 has a resistance lower than that of the transfer pattern 132, and there may be various variations in the method having the low resistance. As an example of the non-transfer pattern 134, the line width of the non-transfer pattern 134 and the line width of the transfer pattern 132 may be different from each other.

In addition, the line width of the non-transfer pattern 134 may be wider than the line width of the transfer pattern 132. This is because the resistance of the non-transfer pattern 134 can be reduced by forming a wide line width because the resistance is inversely proportional to the cross-sectional area of the conductive wire.

In this case, the line width of the non-transfer pattern 134 may be formed 1.5 times or more and 3 times or less than the line width of the transfer pattern.

This is because if the line width of the non-transfer pattern 134 is not more than 1.5 times the line width of the transfer pattern 132, the difference in resistance may be insignificant. If the line width is more than 3 times, the distance between the transfer patterns 132 may increase. Because there is. However, in some cases, these values may be changed.

In addition, the thickness of the non-transfer pattern 134 may be formed thicker than the thickness of the transfer pattern 132. This is because the resistance of the non-transfer pattern 134 can be reduced by forming a thick bar having a property inversely proportional to the cross-sectional area of the conductor.

6 is a view showing another embodiment of a heat generation pattern of the organic thin film transfer apparatus according to the present invention.

As can be seen in Figure 6, the line width of the non-transfer pattern 134 at the boundary between the transfer pattern 132 and the non-transfer pattern 134 is characterized in that it is increased by a predetermined angle. Similarly, even when the line width of the non-transfer pattern 134 decreases, it decreases at a predetermined angle.

That is, the line width of the non-transfer pattern 134 gradually increases at a predetermined angle. This is to prevent a failure in which the heat generation pattern 130 is opened due to a severe difference in resistance due to a sudden change in line width.

In this case, the angle at which the line width of the non-transfer pattern 134 increases at the boundary between the line width of the transfer pattern 132 and the non-transfer pattern 134 may be 20 degrees or more and 50 degrees or less, and preferably 45 degrees. have. However, this value is an experimental value and may be changed in some cases.

For the same reason, the line width of the non-transfer pattern 134 at the boundary between the transfer pattern 132 and the non-transfer pattern 134 may increase or decrease in an S shape. That is, the boundary between the transfer pattern 132 and the non-transfer pattern 134 may be a curved shape instead of an angled shape.

7 is a view showing another embodiment of a heat generation pattern of the organic thin film transfer apparatus according to the present invention.

As can be seen in FIG. 7, in the heating pattern 130, a transfer pattern 132 corresponding to a transfer region T, which is an area where the organic thin film 140 is to be transferred, is formed on the transfer substrate 170. Between the patterns 132, a non-transfer pattern 134 corresponding to the non-transfer region N is formed in a region in which the organic thin film 140 is not transferred among the transfer substrates 170.

At this time, only a portion of the line width of the non-transfer pattern 134 is formed thick, and it can be seen that the line widths formed thick among the successive non-transfer patterns 134 are shifted from each other. As a result, the distance between the plurality of transfer patterns 132 may be reduced.

Referring back to FIG. 4, the organic thin film 140 is formed on the transfer substrate 110 and transferred to the transfer substrate 170 by thermal energy supplied through the transfer substrate 110 to emit light layers in the target pixels. To form.

The organic thin film 140 may include any one of red (R), green (G), and blue (B) organic light emitting materials, but the present invention is not limited thereto. It may be formed.

In addition, in the present embodiment, the transfer material layer 140 may be formed entirely on one surface of the transfer substrate 110 through a thermal evaporation process, or may be formed only on the heat generating pattern 130. It may be formed only on the transfer pattern, if necessary.

The first device electrode 150a and the second device electrode 150b are formed on the first common electrode 120a and the second common electrode 120b, respectively, to supply power supplied from the power supply unit 180 to the first common electrode ( The heat supply pattern 130 is supplied to the heating pattern 130 through the 120a) and the second common electrode 120b.

The spacer 160 is formed between the transfer substrate 110 and the transfer substrate 170 to space the transfer substrate 110 and the transfer substrate 170 at regular intervals.

The transfer substrate 170 is formed to face the transfer substrate 110, and the organic thin film 140 is transferred to a region of the transfer substrate 170 corresponding to the pixel area to form a light emitting layer.

The power supply unit 180 is connected to the first device electrode 150a and the second device electrode 150b to supply electrical energy to the heating pattern 130.

According to the organic thin film transfer apparatus according to the present invention as described above has the following effects.

First, the resistance of the non-transfer pattern of the heating pattern 130 formed on the transfer substrate is reduced, thereby preventing the short circuit of the heating pattern 130 due to heat generation.

In addition, there is an effect that the productivity is improved by reducing the process defect by preventing the short circuit of the heating pattern 130.

Hereinafter, a method of transferring an organic thin film using the organic thin film transfer device according to the present invention will be described.

First, a heating pattern is formed on the transfer substrate. The heating pattern includes a transfer pattern corresponding to a transfer region on the transfer substrate on which the organic thin film is transferred and a non-transfer pattern corresponding to a non-transfer region on the transfer substrate on which the organic thin film is not transferred.

At this time, the non-transfer pattern has a lower resistance than the resistance of the transfer pattern, there may be various variations in the method having a low resistance. In one embodiment of the non-transfer pattern, the line width of the non-transfer pattern may be characterized in that it is wider than the line width of the transfer pattern. This is because the resistance has a property that is inversely proportional to the cross-sectional area of the wire, so that the resistance of the non-transfer pattern can be reduced by forming a wide line width.

In this case, the line width of the non-transfer pattern may be formed 1.5 times or more and 3 times or less than the line width of the transfer pattern. This is because the difference in resistance may be insignificant if the line width of the non-transfer pattern is not more than 1.5 times greater than the line width of the transfer pattern. However, in some cases, these values may be changed.

Next, an organic thin film is formed on the heating pattern. The organic thin film may be formed on the entire surface of the heat generating pattern, or may be formed only in a portion corresponding to the transfer region where the organic thin film is transferred to the transfer substrate.

Next, the transfer substrate is bonded to the organic thin film. At this time, the transfer substrate and the transfer substrate can be maintained at a constant interval by a spacer formed between the transfer substrate and the transfer substrate. In addition, device electrodes connected to an external power supply unit are connected to a common electrode connected to the heating pattern at both ends of the transfer substrate.

Next, power is applied to the heating pattern to deposit the organic thin film from the transfer substrate to the transfer substrate. When a predetermined power is supplied from an external power supply unit, power flows from the device electrode to the common electrode and the common electrode in the heating pattern, and Joule heat is generated in the heating pattern with the thin line width. Accordingly, the organic thin film formed on the transfer pattern among the heating patterns is heated and deposited on the transfer substrate.

On the other hand, when the line width of the non-transfer pattern is widened to have a resistance lower than the resistance of the transfer pattern, the heat generation pattern is prevented from shorting due to heat generation, and also the process defect is reduced by preventing the short circuit of the heat generation pattern. Productivity is improved.

It will be understood by those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or essential characteristics thereof.

Therefore, it should be understood that the above-described embodiments are illustrative in all aspects and not restrictive. The scope of the present invention is defined by the appended claims rather than the detailed description and all changes or modifications derived from the meaning and scope of the claims and from the equivalent concept are to be construed as being included in the scope of the present invention .

100-Organic Thin Film Transfer Device
110-Transfer Board
120a-first common electrode
120b-second common electrode
130-heating pattern
132-Transfer Pattern
134-Non-Transfer Pattern
140-Organic Thin Films
150a-first device electrode
150b-second device electrode
160-spacer
170-Transfer Board
180-power supply

Claims (10)

Transfer substrate;
A first common electrode formed at one end of the transfer substrate;
A second common electrode formed at the other end of the transfer substrate to face the first common electrode;
A heating pattern formed between the first common electrode and the second common electrode; And
An organic thin film formed on the heating pattern;
The heating pattern is formed to correspond to a transfer pattern on a transfer substrate on the transfer substrate on which the organic thin film is transferred and a non-transfer region on a transfer substrate on which the organic thin film is not transferred, and has a resistance lower than that of the transfer pattern. Organic thin film transfer apparatus comprising a non-transfer pattern. The method of claim 1,
The line width of the non-transfer pattern is an organic thin film transfer device, characterized in that having a line width or more of the line width of the transfer pattern. The method of claim 1,
The line width of the non-transfer pattern is an organic thin film transfer device, characterized in that formed to 1.5 times or more than 3 times the line width of the transfer pattern. The method of claim 1,
The thickness of the non-transfer pattern is an organic thin film transfer device, characterized in that having a thickness greater than the thickness of the transfer pattern. The method of claim 1,
And the line width of the non-transfer pattern is increased in an S-shape at the boundary between the transfer pattern and the non-transfer pattern. The method of claim 1,
And the line width of the non-transfer pattern at the boundary between the transfer pattern and the non-transfer pattern increases at a predetermined angle. The method according to claim 6,
And an angle at which the line width of the non-transfer pattern increases at a boundary between the line width of the transfer pattern and the non-transfer pattern. The method of claim 1,
The heating pattern is an organic thin film transfer device, characterized in that formed of any one of Mo, Cu, Al, or Al alloy. Forming a heating pattern on the transfer substrate;
Forming an organic thin film on the heating pattern;
Bonding the transfer substrate to face the organic thin film;
Depositing the organic thin film from the transfer substrate to the transfer substrate by applying power to the heating pattern;
The heating pattern includes a transfer pattern corresponding to a transfer region on the transfer substrate on which the organic thin film is transferred, and a non-transfer pattern corresponding to a non-transfer region on the transfer substrate on which the organic thin film is not transferred. The four patterns are formed to have a resistance lower than the resistance of the transfer pattern organic thin film transfer method. The method of claim 9,
And the line width of the non-transfer pattern is formed to have a line width equal to or greater than the line width of the transfer pattern.

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