KR20130044467A - Cooling device - Google Patents
Cooling device Download PDFInfo
- Publication number
- KR20130044467A KR20130044467A KR1020110108549A KR20110108549A KR20130044467A KR 20130044467 A KR20130044467 A KR 20130044467A KR 1020110108549 A KR1020110108549 A KR 1020110108549A KR 20110108549 A KR20110108549 A KR 20110108549A KR 20130044467 A KR20130044467 A KR 20130044467A
- Authority
- KR
- South Korea
- Prior art keywords
- cooling
- cooling unit
- liquid nitrogen
- housing
- temperature
- Prior art date
Links
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B49/00—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D29/00—Arrangement or mounting of control or safety devices
- F25D29/001—Arrangement or mounting of control or safety devices for cryogenic fluid systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/025—Removal of heat
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2700/00—Sensing or detecting of parameters; Sensors therefor
- F25B2700/21—Temperatures
Abstract
A chiller capable of cryogenic cooling, low cost of manufacture and simple structure is disclosed. The cryogenic chiller includes a first cooling unit configured to flow liquid nitrogen to cool to a first temperature, and a second cooling unit mounted on one surface of the first cooling unit to operate at a temperature lower than the first temperature, and configured of a Peltier element. It is configured to include.
Description
The present invention relates to a chiller capable of cryogenic cooling using a Peltier device.
Cryogenic cooling is mainly performed by cooling a cryogenic fluid by flowing a cooling plate. As a cryogenic fluid, relatively low cost liquid nitrogen is mainly used.
On the other hand, since the liquid nitrogen has a boiling point of -196 ° C, in order to cool it below -196 ° C, it is necessary to use liquid helium or liquid hydrogen having a lower boiling point, or use a separate cryogenic freezer. However, cryogenic fluids, such as liquid helium and liquid hydrogen, have a problem that the cost increases because the price is tens of times of liquid nitrogen. In addition, liquid helium or liquid hydrogen is a rare component present in a very small amount in the air has the disadvantage that it is very difficult to manufacture. And when using a separate cryogenic freezer, there is a disadvantage in that the cryogenic freezer is a very expensive and complicated device.
According to the embodiments of the present invention, it is possible to provide cryogenic cooling at a temperature lower than −196 ° C., which is a boiling point of liquid nitrogen, and to provide a low cost manufacturing device.
The cooling apparatus for cryogenic cooling according to the embodiments of the present invention described above is mounted on one surface of the first cooling unit and the first cooling unit to cool the liquid to the first temperature by flowing the liquid nitrogen lower than the first temperature And a second cooling unit which consists of a Peltier element.
According to one side, the first cooling unit is cooled to -196 ℃, the boiling point of the liquid nitrogen, the second cooling unit is operated at a temperature of -196 ℃ or less.
According to one side, the first cooling unit, the housing and the inside of the housing is configured to include a circulation flow path for the liquid nitrogen flows. Here, the housing may be formed of a conductor material. The second cooling unit is configured to include a Peltier device mounted on one surface of the housing and mounted in a plate shape, and a power supply unit for applying power to the Peltier device. In addition, the Peltier device may be mounted so that the heating surface is mounted on the housing and the cooling surface faces outward.
As described above, according to the embodiments of the present invention, the cooling to -196 ℃ using liquid nitrogen, and cooling below -196 ℃ made of Peltier element, it can be cooled to cryogenic below -196 ℃ have.
In addition, since the use of relatively inexpensive liquid nitrogen and there is no need to use a separate cryogenic freezer can reduce the manufacturing cost of the cooling device.
In addition, the structure of the cooling device can be simplified.
1 is a perspective view showing an example of a cooling apparatus according to an embodiment of the present invention.
2 is a flow chart for explaining the operation of the cooling apparatus according to an embodiment of the present invention.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments. In describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.
1 and 2 will be described in detail with respect to the configuration and operation of the cooling apparatus according to an embodiment of the present invention.
Referring to the drawings, the cryogenic chiller includes a
The
Here, the
The
For reference, in FIG. 1,
The
The Peltier
In addition, when the power is applied, the Peltier
The operation of the cooling apparatus according to the present embodiment is as follows.
In the cooling apparatus according to the present embodiments, the
In detail, the temperature of the object to be cooled is measured (S1), and if it is -196 ° C or more, liquid nitrogen is supplied to the first cooling unit 10 (S11) to operate the first cooling unit 10 ( S12).
When the cooling is performed for a predetermined time and the temperature is -196 ° C, since the cooling effect is reduced only by the liquid nitrogen since the temperature is below the boiling point of the liquid nitrogen, power is supplied to the second cooling unit 20 (S21). 2
In the step not described in FIG. 2, the step S1 of measuring the temperature in the cooling apparatus and the step S3 of comparing the temperatures to selectively operate the
While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. In addition, the present invention is not limited to the above-described embodiments, and various modifications and variations are possible to those skilled in the art to which the present invention pertains. Therefore, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, are included in the scope of the present invention.
10: first cooling unit
11: Housing
13: liquid nitrogen circulation flow path
131: liquid nitrogen injection unit
132: liquid nitrogen discharge portion
20: second cooling unit
21: Peltier element
23: power supply
Claims (6)
A second cooling unit mounted on one surface of the first cooling unit to operate at a temperature lower than the first temperature, and configured of a Peltier element;
Chiller comprising a.
The first cooling unit is cooled to -196 ℃ the boiling point of the liquid nitrogen, the second cooling unit is operated at a temperature of -196 ℃ or less.
The first cooling unit,
housing; And
A circulation passage provided in the housing to flow the liquid nitrogen;
Chiller including
The housing is a cooling device formed of a conductive material.
The second cooling unit,
A Peltier device mounted on one surface of the housing and mounted in a plate shape; And
A power supply unit applying power to the Peltier device;
Chiller comprising a.
The Peltier device is a cooling device is mounted so that the heating surface is mounted on the housing and the cooling surface facing out.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110108549A KR20130044467A (en) | 2011-10-24 | 2011-10-24 | Cooling device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020110108549A KR20130044467A (en) | 2011-10-24 | 2011-10-24 | Cooling device |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20130044467A true KR20130044467A (en) | 2013-05-03 |
Family
ID=48656850
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020110108549A KR20130044467A (en) | 2011-10-24 | 2011-10-24 | Cooling device |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR20130044467A (en) |
-
2011
- 2011-10-24 KR KR1020110108549A patent/KR20130044467A/en not_active Application Discontinuation
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E902 | Notification of reason for refusal | ||
E601 | Decision to refuse application |