KR20130044467A - Cooling device - Google Patents

Cooling device Download PDF

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Publication number
KR20130044467A
KR20130044467A KR1020110108549A KR20110108549A KR20130044467A KR 20130044467 A KR20130044467 A KR 20130044467A KR 1020110108549 A KR1020110108549 A KR 1020110108549A KR 20110108549 A KR20110108549 A KR 20110108549A KR 20130044467 A KR20130044467 A KR 20130044467A
Authority
KR
South Korea
Prior art keywords
cooling
cooling unit
liquid nitrogen
housing
temperature
Prior art date
Application number
KR1020110108549A
Other languages
Korean (ko)
Inventor
조혁진
이상훈
서희준
문귀원
Original Assignee
한국항공우주연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국항공우주연구원 filed Critical 한국항공우주연구원
Priority to KR1020110108549A priority Critical patent/KR20130044467A/en
Publication of KR20130044467A publication Critical patent/KR20130044467A/en

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00Arrangement or mounting of control or safety devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/002Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25DREFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00Arrangement or mounting of control or safety devices
    • F25D29/001Arrangement or mounting of control or safety devices for cryogenic fluid systems
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2700/00Sensing or detecting of parameters; Sensors therefor
    • F25B2700/21Temperatures

Abstract

A chiller capable of cryogenic cooling, low cost of manufacture and simple structure is disclosed. The cryogenic chiller includes a first cooling unit configured to flow liquid nitrogen to cool to a first temperature, and a second cooling unit mounted on one surface of the first cooling unit to operate at a temperature lower than the first temperature, and configured of a Peltier element. It is configured to include.

Description

[0001] COOLING DEVICE [0002]

The present invention relates to a chiller capable of cryogenic cooling using a Peltier device.

Cryogenic cooling is mainly performed by cooling a cryogenic fluid by flowing a cooling plate. As a cryogenic fluid, relatively low cost liquid nitrogen is mainly used.

On the other hand, since the liquid nitrogen has a boiling point of -196 ° C, in order to cool it below -196 ° C, it is necessary to use liquid helium or liquid hydrogen having a lower boiling point, or use a separate cryogenic freezer. However, cryogenic fluids, such as liquid helium and liquid hydrogen, have a problem that the cost increases because the price is tens of times of liquid nitrogen. In addition, liquid helium or liquid hydrogen is a rare component present in a very small amount in the air has the disadvantage that it is very difficult to manufacture. And when using a separate cryogenic freezer, there is a disadvantage in that the cryogenic freezer is a very expensive and complicated device.

According to the embodiments of the present invention, it is possible to provide cryogenic cooling at a temperature lower than −196 ° C., which is a boiling point of liquid nitrogen, and to provide a low cost manufacturing device.

The cooling apparatus for cryogenic cooling according to the embodiments of the present invention described above is mounted on one surface of the first cooling unit and the first cooling unit to cool the liquid to the first temperature by flowing the liquid nitrogen lower than the first temperature And a second cooling unit which consists of a Peltier element.

According to one side, the first cooling unit is cooled to -196 ℃, the boiling point of the liquid nitrogen, the second cooling unit is operated at a temperature of -196 ℃ or less.

According to one side, the first cooling unit, the housing and the inside of the housing is configured to include a circulation flow path for the liquid nitrogen flows. Here, the housing may be formed of a conductor material. The second cooling unit is configured to include a Peltier device mounted on one surface of the housing and mounted in a plate shape, and a power supply unit for applying power to the Peltier device. In addition, the Peltier device may be mounted so that the heating surface is mounted on the housing and the cooling surface faces outward.

As described above, according to the embodiments of the present invention, the cooling to -196 ℃ using liquid nitrogen, and cooling below -196 ℃ made of Peltier element, it can be cooled to cryogenic below -196 ℃ have.

In addition, since the use of relatively inexpensive liquid nitrogen and there is no need to use a separate cryogenic freezer can reduce the manufacturing cost of the cooling device.

In addition, the structure of the cooling device can be simplified.

1 is a perspective view showing an example of a cooling apparatus according to an embodiment of the present invention.
2 is a flow chart for explaining the operation of the cooling apparatus according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited to or limited by the embodiments. In describing the present invention, a detailed description of well-known functions or constructions may be omitted for clarity of the present invention.

1 and 2 will be described in detail with respect to the configuration and operation of the cooling apparatus according to an embodiment of the present invention.

Referring to the drawings, the cryogenic chiller includes a first cooling unit 10 using liquid nitrogen and a second cooling unit 20 using Peltier element 21.

The first cooling unit 10 has a structure in which a circulation passage 13 for flowing liquid nitrogen is provided inside the housing 11.

Here, the housing 11 has a form that can be heat-exchanged with the outside, and may have a substantially various shape in addition to the rectangular parallelepiped shape as shown in the figure. In addition, the housing 11 is formed of a conductor material having high heat transfer efficiency so that heat exchange between the liquid nitrogen flowing through the circulation passage 13 and the outside can be performed smoothly. And the housing 11 is formed of a material that flows liquid nitrogen and is not damaged even at cryogenic temperatures of -196 ℃ or less.

The circulation passage 13 may be provided inside the housing 11, and may be disposed in a zigzag form in order to form the flow length of the liquid nitrogen as long as possible in the housing 11.

For reference, in FIG. 1, reference numerals 131 and 132 denote a liquid nitrogen injection unit 131 and a liquid nitrogen discharge unit 132 for circulating by injecting and discharging liquid nitrogen into the circulation passage 13.

The second cooling unit 20 includes a Peltier element 21 mounted on one surface of the housing 11 and a power supply unit 23 for supplying power to the Peltier element 21.

The Peltier element 21 is mounted on one surface of the housing 11 in the form of a plate or sheet. However, the present invention is not limited by the drawings, and the size, shape, thickness, etc. of the Peltier element 21 may be substantially modified.

In addition, when the power is applied, the Peltier element 21 emits heat from one surface, and heat is emitted from the other surface (hereinafter referred to as a 'cooling surface') of the surface from which the heat is emitted (hereinafter, referred to as a 'heating surface'). It is absorbed and cooled. And the Peltier element 21 is mounted so that the heating surface is attached to the housing 11 side, the cooling surface facing outward.

The operation of the cooling apparatus according to the present embodiment is as follows.

In the cooling apparatus according to the present embodiments, the first cooling unit 10 operates up to −196 ° C., and the second cooling unit 20 operates and cools down to a temperature of −196 ° C. or lower.

In detail, the temperature of the object to be cooled is measured (S1), and if it is -196 ° C or more, liquid nitrogen is supplied to the first cooling unit 10 (S11) to operate the first cooling unit 10 ( S12).

When the cooling is performed for a predetermined time and the temperature is -196 ° C, since the cooling effect is reduced only by the liquid nitrogen since the temperature is below the boiling point of the liquid nitrogen, power is supplied to the second cooling unit 20 (S21). 2 Cooling unit 20 is operating.

In the step not described in FIG. 2, the step S1 of measuring the temperature in the cooling apparatus and the step S3 of comparing the temperatures to selectively operate the first cooling unit 10 and the second cooling unit 20 and In step S2, it is determined whether the measured temperature T reaches the target temperature in order to terminate the operation of the cooling device.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. In addition, the present invention is not limited to the above-described embodiments, and various modifications and variations are possible to those skilled in the art to which the present invention pertains. Therefore, the spirit of the present invention should not be construed as being limited to the above-described embodiments, and all of the equivalents or equivalents of the claims, as well as the following claims, are included in the scope of the present invention.

10: first cooling unit
11: Housing
13: liquid nitrogen circulation flow path
131: liquid nitrogen injection unit
132: liquid nitrogen discharge portion
20: second cooling unit
21: Peltier element
23: power supply

Claims (6)

A first cooling unit flowing liquid nitrogen to cool the first temperature; And
A second cooling unit mounted on one surface of the first cooling unit to operate at a temperature lower than the first temperature, and configured of a Peltier element;
Chiller comprising a.
The method of claim 1,
The first cooling unit is cooled to -196 ℃ the boiling point of the liquid nitrogen, the second cooling unit is operated at a temperature of -196 ℃ or less.
The method of claim 1,
The first cooling unit,
housing; And
A circulation passage provided in the housing to flow the liquid nitrogen;
Chiller including
The method of claim 3,
The housing is a cooling device formed of a conductive material.
The method of claim 3,
The second cooling unit,
A Peltier device mounted on one surface of the housing and mounted in a plate shape; And
A power supply unit applying power to the Peltier device;
Chiller comprising a.
The method of claim 5,
The Peltier device is a cooling device is mounted so that the heating surface is mounted on the housing and the cooling surface facing out.
KR1020110108549A 2011-10-24 2011-10-24 Cooling device KR20130044467A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110108549A KR20130044467A (en) 2011-10-24 2011-10-24 Cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110108549A KR20130044467A (en) 2011-10-24 2011-10-24 Cooling device

Publications (1)

Publication Number Publication Date
KR20130044467A true KR20130044467A (en) 2013-05-03

Family

ID=48656850

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110108549A KR20130044467A (en) 2011-10-24 2011-10-24 Cooling device

Country Status (1)

Country Link
KR (1) KR20130044467A (en)

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