KR20130027967A - Method ans system for examining exposure process in semiconductor device fabrication - Google Patents
Method ans system for examining exposure process in semiconductor device fabrication Download PDFInfo
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- KR20130027967A KR20130027967A KR1020110091518A KR20110091518A KR20130027967A KR 20130027967 A KR20130027967 A KR 20130027967A KR 1020110091518 A KR1020110091518 A KR 1020110091518A KR 20110091518 A KR20110091518 A KR 20110091518A KR 20130027967 A KR20130027967 A KR 20130027967A
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Abstract
The present invention can detect the substrate profile abnormality when measuring the CD with the SEM equipment in the inspection measurement following the exposure process, and timely when abnormality occurred while inspecting the image according to the substrate profile with the SEM equipment in the inspection measurement following the exposure process. The present invention relates to a semiconductor manufacturing process inspection system and method for stopping the progress of an exposure process and finding an abnormal part to prevent mass production of process defects.
According to the present invention, the semiconductor image obtained by photographing the semiconductor process substrate and the reference image are converted into numerical data for each pixel, so that the semiconductor image can be compared with the reference image in a short time, thereby greatly reducing the semiconductor inspection time. The semiconductor inspection process can be completed in a short time.
In addition, process operators in the vicinity of the semiconductor process inspection apparatus can immediately recognize an abnormality in the process result through a warning indication or a warning sound, and can immediately detect the shutdown of the equipment. It is possible to prevent mass production of defects.
Description
The present invention relates to a system and method for inspecting the process of an exposure inspection step in the manufacture of semiconductor devices.
A semiconductor device is a type of circuit device formed by forming an element using a semiconductor substrate, and forming and processing a plurality of conductor and non-conductor layers on the substrate to form other electrical, electronic elements, and wirings. The semiconductor device may be in the form of an integrated circuit (IC) that forms a large number of devices in a small area. Integration of such devices can be accomplished in large part by photolithography processes.
Photomasks used in photolithography include circuit patterns corresponding to individual layers of the IC. This circuit pattern can be projected onto a target area, such as a die, on a semiconductor substrate coated with a layer of photosensitive material (resist). In a manufacturing process using photolithography, the pattern of the photo mask is projected and drawn on a substrate at least partially coated with a resist layer. Before and after the imaging step, the substrate is subjected to various procedures such as priming, that is, resist coating, soft bake and post-processing, such as post-exposure bake (PEB), development, hard bake and measurement / inspection. . The patterned layer goes through various processes to finish individual layers such as etching, ion implantation (doping), metallization, oxidation, chemical-mechanical polishing, and the like.
This photolithography operation can be repeated for a plurality of layers. As a result, the device is formed on the substrate (wafer). These devices are separated from each other and form a completed semiconductor device through packaging.
The measurement / inspection process that forms part of the photolithography process is performed by measuring 'CD' to determine whether the photoresist pattern formed as a result of the exposure process on the substrate is well aligned with the lower layer and the line width is formed to a desired size.
Typically, the aforementioned design rule limitation is referred to as "critical dimensions" (CD). The critical dimension of the circuit may be defined as the minimum width of a line or hole or the minimum spacing between two lines or two holes. Thus, the CD determines the overall size and density of the designed circuit.
Certain rules apply to the formation of the mask pattern. Usually a CAD program has a set of predetermined design rules (design rules) for mask formation. For example, design rules define spacing tolerances between circuit devices (such as gates, capacitors, etc.) or interconnect lines so that the circuit devices or lines do not interact in an undesirable manner. . CD management is also done as part of this design rule.
In the CD measurement process, when the exposed and developed substrate is placed in a scanning electron microscope (SEM) device, the conditions and the order for the measurement are applied, and the substrate is moved to the desired position and the predetermined line and space ( The pattern of space, hole, etc. is measured. The measurement can be performed automatically and manually, and the position and the measurement image appear on the screen indicating the inspection result to determine whether there is an error.
Fig. 11 is a conceptual diagram showing a pattern of a substrate and a system of signal waveforms generated by the SEM equipment with respect to the pattern. The SEM equipment detects the peak value of the
On the other hand, in the exposure equipment, the exposure should be performed only at the same focal length specified when exposing the substrate. However, inadequate focusing may occur due to variations in the actual equipment and other internal and external factors. These failures have a direct impact on process yields and are often a problem because they are often found after the process has continued.
The present invention for solving the above-described problems, it is possible to detect the substrate profile abnormality when measuring the CD with the SEM equipment in the inspection measurement following the exposure process, the image according to the substrate profile with the SEM equipment in the inspection measurement following the exposure process It is an object of the present invention to provide a semiconductor manufacturing process inspection system and method for stopping the progress of an exposure process in a timely manner in which an abnormality occurs and finding a portion of the abnormality to prevent mass production of a defective process.
According to an aspect of the present invention for achieving the above object, provided with a CCTV camera for semiconductor inspection, to obtain a semiconductor image by taking a semiconductor inspection CCTV camera for the semiconductor and transmits to the management server through a communication network, An inspection apparatus for receiving a semiconductor process error from the management server; And the most ideal image of the semiconductor pattern is stored as a 'reference image', and when the semiconductor image is transmitted from the inspection apparatus, the reference image and the semiconductor image are reconstructed in pixel units to generate each standard pixel as a representative image. In addition, each pixel color of the standard image is converted into numerical data to generate an index image, and numerical data between matching pixels of the reference image and the semiconductor image is compared to determine whether there is an abnormality in the manufacturing process through the similarity between the reference image and the semiconductor image. The semiconductor manufacturing process includes a management server for determining, and if it is determined that the abnormality has occurred, transmitting a message indicating that there is an abnormality in the manufacturing process to the inspection apparatus and the manager terminal, and transmitting a command to the semiconductor manufacturing apparatus to stop the manufacturing process. An inspection system is provided.
On the other hand, according to another aspect of the present invention for achieving the above object, a communication unit for communicating with the inspection device and the manager terminal through a communication network; A semiconductor image database storing the most ideal image of the semiconductor pattern as a 'reference image' and storing each semiconductor image transmitted from the inspection apparatus; Reconstruct the reference image and the semiconductor image by pixel unit to generate a standard image by uniting each pixel into a representative color, and convert the color data of each pixel of the standard image into numerical data to generate an initial index image, and an initial index image. In order to generate the adjustment index image by removing the row and column pixels of the region not corresponding to the search object, the numerical data between the matching image of the reference image and the semiconductor images is adjusted for the adjustment index images in which each pixel is converted into numerical data. An image comparison unit for comparing; Determine whether there is an abnormality of the semiconductor image according to a result of comparing the similarity between the reference image and the semiconductor image through the image comparator, and when an error occurs, transmits a message indicating that there is an error in the manufacturing process to the inspection apparatus and the manager terminal. A control unit for controlling and transmitting a command to stop the manufacturing process to the inspection apparatus or the semiconductor manufacturing apparatus; And a process alarm unit which transmits a message indicating that there is an error in the manufacturing process to the inspection apparatus and the manager terminal, and transmits a command to stop the manufacturing process to the semiconductor manufacturing apparatus.
On the other hand, according to another aspect of the present invention for achieving the above object, (a) the inspection apparatus photographing the semiconductor through a camera to obtain a semiconductor image and transmitting to the management server through a communication network; (b) The management server reconstructs the reference image and the semiconductor image pixel by pixel to unify each pixel into a representative color to generate a standard image, convert each pixel color of the standard image into numerical data to generate an index image, Comparing numerical data between matching pixels of the image and the semiconductor image to determine whether there is an abnormality in the manufacturing process based on the similarity between the reference image and the semiconductor image; (c) transmitting, by the management server, a message indicating that there is an abnormality in the manufacturing process when it is determined that the abnormality has occurred, the inspection server and the manager terminal; (d) the management server transmitting a command to stop the semiconductor manufacturing process to the inspection apparatus or the semiconductor manufacturing apparatus; And (e) an inspection device outputting a warning indication indicating that an abnormality has occurred in the manufacturing process and outputting a warning sound.
On the other hand, according to another aspect of the present invention for achieving the above object, as a semiconductor manufacturing process inspection method of the management server that stores the most ideal image of the semiconductor pattern as a 'reference image', (a) from the inspection apparatus semiconductor Receiving an image; (b) reconstructing the reference image and the semiconductor image on a pixel-by-pixel basis to generate a standard image by uniting each pixel into a representative color; (c) converting color data of each pixel of the standard image into numerical data to generate an initial index image; (d) generating an adjustment index image by removing row and column pixels of an area that does not correspond to the comparison object from the initial index image; (e) comparing the adjusted index images with numerical data between matching pixels of the reference image and the semiconductor image to determine similarity between the reference image and the semiconductor image;
(f) determining that an abnormality has occurred in the manufacturing process of the semiconductor when the similarity of the semiconductor image is lower than a predetermined criterion; And (g) transmitting a message indicating that there is an error in the manufacturing process of the semiconductor to an inspection apparatus and a manager terminal.
On the other hand, according to another aspect of the present invention for achieving the above object, a storage unit for storing the most ideal image of the semiconductor as a 'reference image', each of the semiconductor images taken; A CCTV photographing unit which acquires a semiconductor image by photographing the semiconductor through a CCTV camera for semiconductor inspection; Reconstruct the reference image and the semiconductor image by pixel unit to generate a standard image by uniting each pixel into a representative color, and convert the color data of each pixel of the standard image into numerical data to generate an initial index image, and an initial index image. In order to generate the adjustment index image by removing the row and column pixels of the region not corresponding to the search object, the numerical data between the matching image of the reference image and the semiconductor images is adjusted for the adjustment index images in which each pixel is converted into numerical data. An image comparison unit for comparing; According to a result of comparing the similarity between the reference image and the semiconductor image through the image comparison unit, it is determined whether there is an abnormality of the semiconductor image, and when an error occurs, a message indicating that there is an abnormality in the manufacturing process is displayed on the screen, and an alarm sound A control unit which outputs a command to the semiconductor manufacturing apparatus; An output unit configured to display an abnormality notification message of the semiconductor manufacturing process on a screen; And an alarm unit for outputting an alarm sound indicating that there is an abnormality in the manufacturing process of the semiconductor.
On the other hand, according to another aspect of the present invention for achieving the above object, a semiconductor manufacturing process inspection method of the inspection apparatus for storing the most ideal image of the semiconductor as a 'reference image,' (a) using the semiconductor camera Photographing through to obtain a semiconductor image; (b) reconstructing the reference image and the semiconductor image on a pixel-by-pixel basis to generate a standard image by uniting each pixel into a representative color; (c) converting color data of each pixel of the standard image into numerical data to generate an initial index image; (d) generating an adjustment index image by removing row and column pixels of an area that does not correspond to the comparison object from the initial index image; (e) comparing the adjusted index images with numerical data between matching pixels of the reference image and the semiconductor image to determine similarity between the reference image and the semiconductor image; (f) determining that an abnormality has occurred in the manufacturing process of the semiconductor when the similarity of the semiconductor image is lower than a predetermined criterion; And (g) displaying a message informing that there is an abnormality in the manufacturing process of the semiconductor, and outputting an alarm sound informing of abnormality of the manufacturing process.
According to the present invention, the defective exposure pattern profile caused by the failure of the focusing of the exposure equipment or other equipment can be immediately recognized through the inspection equipment such as the SEM.
Therefore, when the CD is measured by the exposure equipment, such a profile defect can be detected to prevent the wafer lot from proceeding to the subsequent process and undergoing the subsequent process, and the exposure process REWORK can be performed at the minimum damage state. Do it.
In addition, according to the present invention, by converting and comparing the semiconductor image obtained by photographing the semiconductor process substrate and the reference image into numerical data for each pixel, it is possible to compare the semiconductor image with the reference image in a short time, significantly reducing the semiconductor inspection time The entire semiconductor inspection process can be completed quickly.
In addition, process operators in the vicinity of the semiconductor process inspection apparatus can immediately recognize an abnormality in the process result through a warning indication or a warning sound, and can immediately detect the shutdown of the equipment. It is possible to prevent mass production of defects.
1 is a configuration diagram schematically showing the overall configuration of a semiconductor manufacturing process inspection system according to a first embodiment of the present invention.
2 is a configuration diagram schematically showing an internal functional block of the inspection apparatus according to the first embodiment of the present invention.
3 is a configuration diagram schematically showing an internal functional block of the management server according to the first embodiment of the present invention.
4 is a flowchart illustrating a semiconductor manufacturing process inspection method according to a first embodiment of the present invention.
5 is a flowchart illustrating a method of inspecting a semiconductor manufacturing process of a management server according to a first exemplary embodiment of the present invention.
6 is a configuration diagram schematically showing an internal functional block of an inspection apparatus according to a second embodiment of the present invention.
7 is a flowchart illustrating a semiconductor manufacturing process method of an inspection apparatus according to a second exemplary embodiment of the present invention.
8 is a diagram illustrating an example of generating a reference image through a standardization process according to an embodiment of the present invention.
9 is a diagram illustrating an example of an initial index image generated by converting color data of each pixel of a standard image into numerical data according to an exemplary embodiment of the present invention.
10 illustrates an example of generating an initial index image as an adjustment index image according to an embodiment of the present invention.
Fig. 11 is a conceptual diagram showing a pattern of a substrate and a system of signal waveforms generated by the SEM equipment with respect to the pattern.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the like elements throughout. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 is a configuration diagram schematically showing the overall configuration of a semiconductor manufacturing process inspection system according to a first embodiment of the present invention.
Referring to FIG. 1, a semiconductor manufacturing
The
The
The
At this time, the
2 is a configuration diagram schematically showing an internal functional block of the inspection apparatus according to the first embodiment of the present invention.
2, the
The
The
The
The
The
3 is a configuration diagram schematically showing an internal functional block of the management server according to the first embodiment of the present invention.
3, the
The communication unit 310 communicates with the
The semiconductor image database 320 stores the most ideal image of the semiconductor pattern as a reference image, and stores each semiconductor image transmitted from the
The image comparator 330 generates a standard image by reconstructing the reference image and the semiconductor images in pixel units, uniting each pixel into a representative color, and converts the color data of each pixel of the standard image into numerical data to generate an initial index image. Generating an adjustment index image by removing row and column pixels of an area that does not correspond to the search object in the initial index image, and matching the reference image and the semiconductor images with respect to the adjustment index images in which each pixel is converted into numerical data. Compares numeric data between pixels.
The controller 340 determines whether there is an abnormality of the semiconductor image according to a result of comparing the similarity between the reference image and the semiconductor image through the image comparator 330, and when the abnormality occurs, a message indicating that there is an abnormality in the manufacturing process. Control to transmit to the
The process warning unit 350 transmits a message indicating that there is an error in the manufacturing process to the
4 is a flowchart illustrating a semiconductor manufacturing process inspection method according to a first embodiment of the present invention.
Referring to FIG. 4, in the semiconductor manufacturing
Thus, the
Subsequently, when it is determined that the abnormality has occurred, the
In addition, the
On the other hand, the
Therefore, the process operator in the vicinity of the
5 is a flowchart illustrating a method of inspecting a semiconductor manufacturing process of a management server according to a first exemplary embodiment of the present invention.
Referring to FIG. 5, when the
Subsequently, the
For example, if numbers are assigned by arranging colors in a similar order from white to black, red may be converted into 1, yellow is 2, blue is 3, white is 0, black is 4, green is 5, and FIG. 9 An example of converting a standard image into an initial index image based on these criteria is shown.
Here, an example of converting the color and the number is an example for easy understanding, and means that the color is different if the number is different. The color of each pixel of the standard image is not limited to several colors, and there is a similar degree between the colors. Therefore, when the color of each pixel is converted into numerical data, the difference of the numerical data means the difference of the color, and at the same time, the degree of the difference can be expressed.
Accordingly, in the embodiment of the present invention, each color may be expressed as a ratio of three primary colors of the color. All colors can be implemented as a mixture of three primary colors: red (more precisely magenta), blue (more precisely cyan), and yellow (yellow). When the primary colors have a specific gravity of 100 (0 to 99), and the order of each primary color in the order of red, blue, and yellow, the numbers 990000 for converting colors to numerical data are red, 009900 is blue, 000099 is yellow, 999999 means black and 000000 means white.
Subsequently, the
That is, the image comparator 330 may store all zero columns and rows or one or two non-zero columns and rows in the initial index image in order to secure similarity between the reference image and the semiconductor image. To remove it.
FIG. 10 illustrates the same adjustment index image by removing pixels of rows and columns of regions not corresponding to the comparison object from two initial index images having different positions (pixels represented by
The image comparator 330 naturally removes the rows and columns that do not have any values (4 and 5 in the drawing) corresponding to the comparison object in the initial index image, and there is a number corresponding to the comparison object in the rows and columns. When the number of pixels present is significantly less than the total number of pixels in that row and column, the rows and columns can be removed.
Subsequently, the
For example, in the case where the index image is numerical data displayed by mixing the colors of each pixel as three primary colors, the numerical data is extracted from each pixel of the reference image and the semiconductor image, and the same position of the reference image and the semiconductor image is extracted. Compute the difference value of the numerical data for each primary color (red, blue, yellow) in the pixel (i.e. the matching pixel), calculate the average of the difference between the three primary color data of the pixel, calculate the similarity of the pixel, and After the similarity is calculated for the pixels, the average of the similarity of the reference image and the entire semiconductor image is determined.
Subsequently, when the similarity of the semiconductor image is lower than a predetermined standard (90%) or less (S512-Yes), the
6 is a configuration diagram schematically showing an internal functional block of an inspection apparatus according to a second embodiment of the present invention.
Referring to FIG. 6, the
The
The
The
The
The
The
7 is a flowchart illustrating a semiconductor manufacturing process method of an inspection apparatus according to a second exemplary embodiment of the present invention.
Referring to FIG. 7, the
Subsequently, the
Next, the
Subsequently, the
That is, the
Subsequently, the
For example, in the case where the index image is numerical data displayed by mixing the colors of each pixel as three primary colors, the numerical data is extracted from each pixel of the reference image and the semiconductor image, and the same position of the reference image and the semiconductor image is extracted. Compute the difference value of the numerical data for each primary color (red, blue, yellow) in the pixel (i.e. the matching pixel), calculate the average of the difference between the three primary color data of the pixel, calculate the similarity of the pixel, and After the similarity is calculated for the pixels, the average of the similarity of the reference image and the entire semiconductor image is determined.
Subsequently, when the similarity of the semiconductor image is lower than a predetermined reference (90%) or less (S714-Yes), the
As described above, according to the present invention, the substrate profile abnormality can be detected when the CD is measured by the SEM equipment in the inspection measurement following the exposure process, and the image according to the substrate profile is inspected by the SEM equipment in the inspection measurement following the exposure process. In the meantime, it is possible to realize a semiconductor manufacturing process inspection system and method for stopping the progress of the exposure process in a timely manner in which an abnormality occurs and finding a defective part to prevent mass production of a defective process.
It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the present invention as defined by the following claims and their equivalents. Only. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. .
The present invention can be applied to a system and apparatus for inspecting a semiconductor manufacturing process.
100: semiconductor manufacturing process inspection system 110: first embodiment inspection apparatus
120: communication network 130: management server
140: manager terminal 210: communication unit
220: image acquisition unit 230: control unit
240: storage unit 250: output unit
310: communication unit 320: semiconductor image DB
330: Image comparison unit 340: Control unit
350: process alarm unit 600: second embodiment inspection device
610: CCTV shooting unit 620: image comparison unit
630: control unit 640: storage unit
650: output unit 660: alarm unit
Claims (6)
The most ideal image of the semiconductor pattern is stored as a 'reference image'. When the semiconductor image is received from the inspection apparatus, the reference image and the semiconductor image are reconstructed in pixel units to generate each image as a standard image by unifying each pixel into a representative color. In addition, each pixel color of the standard image is converted into numerical data to generate an index image. By comparing numerical data between matching pixels of the reference image and the semiconductor image, the abnormality of the manufacturing process is determined by the similarity between the reference image and the semiconductor image. And, if it is determined that the abnormality has occurred, the management server for transmitting a message indicating that there is an abnormality in the manufacturing process to the inspection apparatus and the manager terminal, and a command to stop the manufacturing process to the semiconductor manufacturing apparatus;
Semiconductor manufacturing process inspection system comprising a.
A semiconductor image database storing the most ideal image of the semiconductor pattern as a 'reference image' and storing each semiconductor image transmitted from the inspection apparatus;
Reconstruct the reference image and the semiconductor image by pixel unit to generate a standard image by uniting each pixel into a representative color, and convert the color data of each pixel of the standard image into numerical data to generate an initial index image, and an initial index image. In order to generate the adjustment index image by removing the row and column pixels of the region not corresponding to the search object, the numerical data between the matching image of the reference image and the semiconductor images is adjusted for the adjustment index images in which each pixel is converted into numerical data. An image comparison unit for comparing;
Determine whether there is an abnormality of the semiconductor image according to a result of comparing the similarity between the reference image and the semiconductor image through the image comparator, and when an error occurs, transmits a message indicating that there is an error in the manufacturing process to the inspection apparatus and the manager terminal. A control unit for controlling and transmitting a command to stop the manufacturing process to the inspection apparatus or the semiconductor manufacturing apparatus; And
A process alarm unit which transmits a message indicating that there is an error in the manufacturing process to an inspection apparatus and a manager terminal, and transmits a command to stop the manufacturing process to a semiconductor manufacturing apparatus;
Management server comprising a.
(b) The management server reconstructs the reference image and the semiconductor image pixel by pixel to unify each pixel into a representative color to generate a standard image, convert each pixel color of the standard image into numerical data to generate an index image, Comparing numerical data between matching pixels of the image and the semiconductor image to determine whether there is an abnormality in the manufacturing process based on the similarity between the reference image and the semiconductor image;
(c) transmitting, by the management server, a message indicating that there is an abnormality in the manufacturing process when it is determined that the abnormality has occurred, the inspection server and the manager terminal;
(d) the management server transmitting a command to stop the semiconductor manufacturing process to the inspection apparatus or the semiconductor manufacturing apparatus; And
(e) the inspection apparatus outputting a warning indication indicating that an abnormality has occurred in the manufacturing process and outputting a warning sound;
Semiconductor manufacturing process inspection method comprising a.
(a) receiving a semiconductor image from an inspection apparatus;
(b) reconstructing the reference image and the semiconductor image on a pixel-by-pixel basis to generate a standard image by uniting each pixel into a representative color;
(c) converting color data of each pixel of the standard image into numerical data to generate an initial index image;
(d) generating an adjustment index image by removing row and column pixels of an area that does not correspond to the comparison object from the initial index image;
(e) comparing the adjusted index images with numerical data between matching pixels of the reference image and the semiconductor image to determine similarity between the reference image and the semiconductor image;
(f) determining that an abnormality has occurred in the manufacturing process of the semiconductor when the similarity of the semiconductor image is lower than a predetermined criterion; And
(g) transmitting a message indicating that there is an error in the manufacturing process of the semiconductor to an inspection apparatus and a manager terminal;
Semiconductor manufacturing process inspection method of the management server comprising a.
A CCTV photographing unit which acquires a semiconductor image by photographing the semiconductor through a CCTV camera for semiconductor inspection;
Reconstruct the reference image and the semiconductor image by pixel unit to generate a standard image by uniting each pixel into a representative color, and convert the color data of each pixel of the standard image into numerical data to generate an initial index image, and an initial index image. In order to generate the adjustment index image by removing the row and column pixels of the region not corresponding to the search object, the numerical data between the matching image of the reference image and the semiconductor images is adjusted for the adjustment index images in which each pixel is converted into numerical data. An image comparison unit for comparing;
According to a result of comparing the similarity between the reference image and the semiconductor image through the image comparison unit, it is determined whether there is an abnormality of the semiconductor image, and when an error occurs, a message indicating that there is an abnormality in the manufacturing process is displayed on the screen, and an alarm sound A control unit which outputs a command to the semiconductor manufacturing apparatus;
An output unit configured to display an abnormality notification message of the semiconductor manufacturing process on a screen; And
An alarm unit for outputting an alarm sound indicating that there is an error in the semiconductor manufacturing process;
Inspection device comprising a.
(a) photographing the semiconductor with a camera to obtain a semiconductor image;
(b) reconstructing the reference image and the semiconductor image on a pixel-by-pixel basis to generate a standard image by uniting each pixel into a representative color;
(c) converting color data of each pixel of the standard image into numerical data to generate an initial index image;
(d) generating an adjustment index image by removing row and column pixels of an area that does not correspond to the comparison object from the initial index image;
(e) comparing the adjusted index images with numerical data between matching pixels of the reference image and the semiconductor image to determine similarity between the reference image and the semiconductor image;
(f) determining that an abnormality has occurred in the manufacturing process of the semiconductor when the similarity of the semiconductor image is lower than a predetermined criterion; And
(g) displaying a message informing that there is an abnormality in the manufacturing process of the semiconductor and outputting an alarm sound informing the abnormality of the manufacturing process;
Semiconductor manufacturing process inspection method of the inspection apparatus comprising a.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101640181B1 (en) * | 2015-06-15 | 2016-07-18 | 주식회사 피스웰 | Apparatus for Statistical Process Control and method for controling the same |
| KR20170013423A (en) * | 2015-07-15 | 2017-02-07 | 아토큐브 주식회사 | Cube-type puzzle assembling method, computer program for the same and cube-type puzzle assembling system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101640181B1 (en) * | 2015-06-15 | 2016-07-18 | 주식회사 피스웰 | Apparatus for Statistical Process Control and method for controling the same |
| KR20170013423A (en) * | 2015-07-15 | 2017-02-07 | 아토큐브 주식회사 | Cube-type puzzle assembling method, computer program for the same and cube-type puzzle assembling system |
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