KR20130025113A - Method of fabricating flat display device - Google Patents

Abstract

PURPOSE: A method for manufacturing a flat panel display device is provided to cut a part of a multi film in advance and to omit a preparation process for various sizes of the multi film. CONSTITUTION: A multi film(20) is divided into a first and a second area. A buffer film(18) and a second film(16) of the multi film are cut along the boundary line of the first and the second area. The buffer film of the first area is removed. The multi film is attached to a mother board(10). A first film(14) is cut. The multi film of the second area is removed. The motherboard is cut.

Description

Manufacturing Method of Flat Panel Display {METHOD OF FABRICATING FLAT DISPLAY DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a flat panel display device capable of reducing bubble generation and damage to a unit display element in a film attaching and cutting process.

Recently, flat panel displays have been widely used as display devices due to excellent image quality, light weight, thinness, and low power. The flat panel display includes a liquid crystal display, an organic light emitting diode (OLED) display, and the like, and most of them are commercially available.

The manufacturing method of the flat panel display device includes preparing a mother substrate, forming a plurality of unit display elements on the mother substrate, and attaching a plurality of films such as a protective film and a polarizing film on the plurality of unit display elements. And cutting the mother substrate for each unit display element along the scribing line. Here, the scribing line is a line that divides a plurality of unit display elements.

Meanwhile, the attaching a plurality of films includes attaching a film to a plurality of unit display elements at the same time, and cutting and removing the attached film in an area where film attaching is unnecessary.

However, the film attaching method according to the related art has a problem in that a large amount of bubbles are generated in the process of attaching a plurality of films continuously, and there is a risk of damaging the unit display device in the process of cutting the attached film. Required.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object thereof is to provide a method of manufacturing a flat panel display device which can reduce bubble generation and damage to a unit display device in a film attaching and cutting process.

According to an aspect of the present invention, there is provided a method of manufacturing a flat panel display, including: forming a plurality of unit display elements on a mother substrate; Providing a first film, and continuously attaching a second film and a buffer film on the first film to prepare a multi film; The multi-film is divided into a first region and a second region to be attached to the plurality of unit display elements, and the buffer film and the second film of the multi-film are cut along the boundary lines of the first and second regions. Steps; Removing the buffer film of the multi film corresponding to the first region; The multi-film is disposed so that the second film and the plurality of unit display elements face each other in the first area, and the buffer film and the mother substrate face each other in the second area, and the arranged multi-film is placed on the mother substrate. Attaching; Cutting the first film along a boundary line between the first and second regions; Removing the multi film of the second region attached to the mother substrate; And cutting the mother substrate for each of the plurality of unit devices.

The adhesive force of the buffer film is characterized in that it is weaker or absent than the adhesive force of the first and second films.

The first film is a circular polarizing film for improving outdoor visibility, and the second film is a protective film for preventing scratches and moisture permeability of the plurality of unit display elements.

The plurality of unit display devices may be liquid crystal display devices including first and second substrates opposing and bonded to each other, and a liquid crystal layer between the first and second substrates, or a TFT layer formed on a substrate and the TFT layer. An organic light emitting diode display device comprising: an organic light emitting layer formed on the organic light emitting layer and a sealing member for preventing deterioration of the organic light emitting layer.

The mother substrate may be a glass substrate, a plastic including polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, or the like, or stainless steel (SUS). Stainless Steel).

In addition, a method of manufacturing a flat panel display device according to another embodiment of the present invention to achieve the above object comprises the steps of forming a plurality of unit display elements on the mother substrate; Forming and patterning a photosensitive organic layer on the mother substrate to form a sacrificial layer in a region where the plurality of unit display devices are not formed; Providing a first film, and attaching a second film on the first film to prepare a multi film; Dividing the multi film into a first area and a second area not to be attached to the plurality of unit display elements, and cutting the second film of the multi film along a boundary line between the first and second areas; The multi-film is disposed so that the second film and the plurality of unit display elements face each other in the first area, and the second film and the sacrificial layer face each other in the second area, and the arranged multi-film is mosquitoes. Attaching to the plate; Cutting the first film along a boundary line between the first and second regions; Removing the multi film of the second region attached to the mother substrate; And cutting the mother substrate for each of the plurality of unit devices.

The photosensitive organic film may be made of polymethyl methacrylate (PMMA) or photo acrylic.

According to the present invention, since some layers of the multi-film are cut in advance, the cutting and attaching structure of the film according to the size change of the multi-film does not need to be newly provided, and the process is simplified, and bubble generation during the attachment can be minimized. In addition, damage to signal lines formed on the unit display element or the mother substrate may be prevented when the multi-film is cut.

1 is a schematic configuration diagram of a liquid crystal display.
2 is a schematic configuration diagram of an OLED display.
3 is a flowchart illustrating a manufacturing method of a flat panel display device according to a first embodiment of the present invention.
4A to 4H illustrate a method of manufacturing a flat panel display device according to a first embodiment of the present invention.
5 is a flowchart illustrating a manufacturing method of a flat panel display device according to a second embodiment of the present invention.
6A to 6H illustrate a method of manufacturing a flat panel display device according to a second embodiment of the present invention.

Hereinafter, a method of manufacturing a flat panel display device according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

For reference, an embodiment relates to a method of attaching a film to a flat panel display such as a liquid crystal display or an OLED display. First, the liquid crystal display and the OLED display will be briefly described as follows.

As shown in FIG. 1, the liquid crystal display includes a liquid crystal display device including first and second substrates facing each other, a liquid crystal layer filled between the first and second substrates, and a side surface of the liquid crystal display device. It includes a backlight for irradiating light to the back, and a plurality of films attached on the liquid crystal display device.

As shown in FIG. 2, an OLED display includes an OLED display device including a TFT layer formed on a substrate, an organic light emitting layer formed on the TFT layer, an encapsulation member for preventing degradation of the organic light emitting layer, and an OLED display. And a plurality of films to be attached.

Meanwhile, the method of manufacturing a flat panel display device includes preparing a mother substrate, forming a plurality of unit display elements on the mother substrate, and cutting the mother substrate for each of the plurality of unit display elements. In the following embodiments, the unit display device is defined as a liquid crystal display device of a liquid crystal display device and an OLED display device of an OLED display device. Therefore, the mother substrate may be the first substrate of the liquid crystal display device, and may be the substrate of the OLED display device.

The embodiment relates to a method of forming a plurality of unit devices such as a liquid crystal display device or an OLED display device on a mother substrate and attaching a plurality of films on them. This embodiment is described in detail as follows.

3 is a flowchart illustrating a manufacturing method of a flat panel display device according to a first embodiment of the present invention.

The manufacturing method of the flat panel display shown in FIG. 3 includes a first step S1 of forming a plurality of unit display elements 12 on a mother substrate 10; A second step S2 of providing the first film 14 and continuously attaching the second film 16 and the buffer film 18 on the first film 14 to provide the multi-film 20; ; The multi-film 20 is divided into a first region a and a second region b which are to be attached to the plurality of unit display elements 12, and the buffer film 18 and the second of the multi-film 20 A third step S3 of cutting the film 16 along the boundaries of the first and second regions a and b; A fourth step S4 of removing the buffer film 20 of the multi-film 20 corresponding to the first region a; In the first region a, the second film 16 and the plurality of unit display elements 12 face each other, and in the second region b, the buffer film 20 and the mother substrate 10 face each other. 20 and a fifth step S5 of attaching the arranged multi-film 20 to the mother substrate 10; A sixth step S6 of cutting the first film 14 along a boundary line between the first and second regions a and b; A seventh step S7 of removing the multi-film 20 of the second region b attached to the mother substrate 10; An eighth step S8 of cutting the mother substrate 10 for each of the plurality of unit elements 12 is included.

Referring to the drawings, a method of manufacturing a flat panel display device according to a first embodiment manufactured in this order will be described in detail as follows.

4A to 4H illustrate a method of manufacturing a flat panel display device according to a first embodiment of the present invention.

As illustrated in FIG. 4A, the first step S1 is a step of forming a plurality of unit display elements 12 on the mother substrate 10. In FIG. 4A, four unit display elements 12 are formed on the mother substrate 10, but the number of unit display elements 12 formed on the mother substrate 10 is not limited thereto.

The mother substrate 10 may be a non-flexible substrate such as a glass substrate, and may include polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, and the like. It may be a flexible substrate such as plastic or stainless steel (SUS).

The plurality of unit display elements 12 may be a liquid crystal display element having a first liquid crystal layer bonded to a first substrate and a second substrate, and a TFT layer formed on the substrate and an organic light emitting layer formed on the TFT layer. And an encapsulation member for preventing deterioration of the organic light emitting layer. A scribing line to be cut after attaching the multi-film 20 is defined between the plurality of unit display elements thus formed.

As shown in FIG. 4B, the second step S2 is a step of preparing the multi film 20. The type and the number of films constituting the multi-film 20 are not limited. Hereinafter, the multi-film 20 composed of two films will be described for convenience of description. Specifically, the multi-film 20 includes a first film 14 and a second film 16 attached on the first film 14. In addition, the multi-film 20 attaches the buffer film 18 to the second film 16, and the buffer film 18 facilitates detachment of the multi-film 20 to be attached to the unit display element 12. It plays a role. To this end, the adhesion of the buffer film 18 is designed to be weaker or less than the adhesion of the first and second films 14, 16.

Meanwhile, the first film 14 may be a circular polarizing film for improving outdoor visibility, and the second film 16 may be a protective film for preventing scratches or moisture permeation of the unit display device.

The third step S3 is a step of cutting the multi film 20, as shown in FIG. 4C, wherein only the second film 16 and the buffer film 18 except the first film 14 are cut. to be. Specifically, the first embodiment defines the multi film 20 as a first area a to be attached to the plurality of unit display devices 12 and a second area b to be unattached to the unit display device 20. do. The buffer film 18 and the second film 16 are cut along the boundary lines between the first and second regions a and b. In this step, in the first embodiment, the size of the multi-film 20 can be easily adjusted according to the size change of the unit display device 12. That is, since the first embodiment cuts the multi-film 20 to a desired size in advance (except for the first film) and attaches it to the unit display element 12, the cutting and attaching structure of the film according to the size change of the film is removed. There is no need for a new installation and the process is simplified and cost reduction is expected.

The fourth step S4 is a step of removing a portion of the buffer film 18 as shown in FIG. 4D. Specifically, the buffer film 18 is removed only the portion corresponding to the first region (a) and the portion corresponding to the second region (b) is left. Accordingly, in the first region a, the buffer film 18 is removed to expose the second film 16.

As illustrated in FIG. 4E, the fifth step S5 is a step of attaching the mother substrate 10 on which the plurality of unit display elements 12 are formed and the multi-film 20. Specifically, in the first embodiment, the multi-film 20 is disposed so that the second film 16 and the plurality of unit display elements 12 face each other in the first area a, and the buffer in the second area b. The film 20 and the mother substrate 10 are disposed to face each other. Then, the arranged multi-film 20 is attached to the mother substrate 10. In this step, in the first embodiment, since the second film 16 and the buffer film 18 are already cut at the boundary between the first and second regions a and b, the multi-film 20 generates bubbles at the time of attachment. Can be minimized.

As shown in FIG. 4F, the sixth step S6 includes the first film (A) along a boundary line between the first and second regions a and b in a state in which the multi-film 20 is attached to the mother substrate 10. 14) cutting step. In this step, since the second film 16 and the buffer film 18 are already cut at the boundary between the first and second regions a and b, the first embodiment has the multi-film 20 and the mother substrate 10. Predetermined gaps are formed between the two ends of the first film 14, thereby preventing damage to the signal lines formed in the unit display element 12 or the mother substrate 10 when the first film 14 is cut.

As shown in FIG. 4G, the seventh step S7 is a step of removing the multi-film 20 attached to the second region b. At this time, as described above, the buffer film 20 is designed so that the adhesive force is weaker or less than the adhesive force of the first and second films 14 and 16, so that the multi-film 20 is easily removed. In this step, the mother substrate 10 is exposed in the second region b as the multi-film 20 is removed.

As illustrated in FIG. 4H, the eighth step S8 is a step of cutting the mother substrate 10 by a plurality of unit display elements. Specifically, the first embodiment cuts the mother substrate 10 along the scribing line defined in the second region (b).

As such, the first embodiment does not need to newly prepare cutting and attaching structures of the film according to the size change of the multi-film 20 as the pre-cutting of some layers of the multi-film 20, and the process is simplified. Bubbles can be minimized when attached. In addition, when the multi-film 20 is cut, damage to the signal wires formed on the unit display element 12 or the mother substrate 10 can be prevented.

5 is a flowchart illustrating a manufacturing method of a flat panel display device according to a second embodiment of the present invention.

The manufacturing method of the flat panel display shown in FIG. 5 includes a first step S1 of forming a plurality of unit display elements 12 on a mother substrate 10; A second step S2 of forming and patterning the photosensitive organic layer on the mother substrate 10 to form the sacrificial layer 11 in a region where the plurality of unit display elements 12 are not formed; A third step (S3) of providing a first film (14) and attaching a second film (16) on the first film (14) to provide a multi-film (20); The multi film 20 is divided into a first area a to be attached to the plurality of unit display elements 12 and a second area b that is not, and the second film 16 of the multi film 20 is removed. A fourth step S4 of cutting along the boundary lines of the first and second regions a and b; The multi-film so that the second film 16 and the plurality of unit display elements 12 are opposed to each other in the first region a, and the second film 16 and the sacrificial layer 11 are opposed to each other in the second region b. Arranging (20) and attaching the arranged multi-film (20) to the mother substrate (10) (S5); A sixth step S6 of cutting the first film 14 along a boundary line between the first and second regions a and b; A seventh step S7 of removing the multi-film 20 of the second region b attached to the mother substrate 10; An eighth step S8 of cutting the mother substrate 10 for each of the plurality of unit elements 12 is included.

In the second embodiment, the sacrificial layer 11 is formed on the mother substrate 10 instead of the buffer film 18 provided to remove the multi-film 20 attached to the mother substrate 10 in the first embodiment. do. The sacrificial layer 11 is formed of a photosensitive organic material, and is formed in the second region b in which the plurality of unit display elements 12 are not formed. In the second embodiment, the sacrificial layer 11 and the multi-film 20 attached to the sacrificial layer 11 are removed at a time by irradiating light after the multi-film 20 is attached. The second embodiment will be described in detail as follows.

6A to 6H illustrate a method of manufacturing a flat panel display device according to a second embodiment of the present invention.

As illustrated in FIG. 6A, the first step S1 is a step of forming a plurality of unit display elements 12 on the mother substrate 10. In FIG. 6A, four unit display elements 12 are formed on the mother substrate 10, but the number of unit display elements 12 formed on the mother substrate 10 is not limited thereto.

The mother substrate 10 may be a non-flexible substrate such as a glass substrate, and may include polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, and the like. It may be a flexible substrate such as plastic or stainless steel (SUS).

The plurality of unit display elements 12 may be a liquid crystal display element having a first liquid crystal layer bonded to a first substrate and a second substrate, and a TFT layer formed on the substrate and an organic light emitting layer formed on the TFT layer. And an encapsulation member for preventing deterioration of the organic light emitting layer. A scribing line to be cut after attaching the multi-film 20 is defined between the plurality of unit display elements thus formed.

As illustrated in FIG. 6B, the second step S2 is a step of forming the sacrificial layer 11 in a region where the plurality of unit display elements 12 are not formed on the mother substrate 10. Specifically, in the second embodiment, a photosensitive organic layer, for example, a spin coater method or a slit coater method, is formed on the entire surface of the mother substrate 10 including the plurality of unit display elements 12. PMMA (PolyMethylMethAcrylate) or photo acrylic (Photo acrylic) is deposited. The sacrificial layer 11 is formed in a region where the plurality of unit display devices 12 are not formed by patterning the photolithography process and the etching process.

As shown in FIG. 6C, the third step S3 is a step of preparing the multi film 20. Specifically, the multi-film 20 includes a first film 14 and a second film 16 attached on the first film 14. Meanwhile, the first film 14 may be a circular polarizing film for improving outdoor visibility, and the second film 16 may be a protective film for preventing scratches or moisture permeation of the unit display device.

As illustrated in FIG. 6D, the fourth step S4 is a step of cutting the multi film 20, wherein only the second film 16 except the first film 14 is cut. Specifically, the second embodiment defines the multi-film 20 as a first region a to be attached to the plurality of unit display elements 12 and a second region b to be unattached to the unit display element 20. do. And the 2nd film 16 is cut | disconnected along the boundary line of 1st and 2nd area | regions a and b. In this step, in the second embodiment, the size of the multi-film 20 can be easily adjusted according to the size change of the unit display device 12. That is, in the second embodiment, since the multi-film 20 is cut in advance to a desired size (except for the first film) and then attached to the unit display device 12, the cutting and attaching structure of the film according to the size change of the film is removed. There is no need for a new installation and the process is simplified and cost reduction is expected.

As illustrated in FIG. 6E, the fifth step S5 is a step of attaching the mother substrate 10 on which the plurality of unit display elements 12 are formed and the multi-film 20. Specifically, in the second embodiment, the multi-film 20 is disposed such that the second film 16 and the plurality of unit display elements 12 face each other in the first area a, and the second film 16 is disposed in the second area b. 2 The film 16 and the sacrificial layer 11 is disposed to face. Then, the arranged multi-film 20 is attached to the mother substrate 10. In this step, since the second film 16 is already cut at the boundary between the first and second regions a and b of the multi-film 20, bubble generation may be minimized during attachment.

As shown in FIG. 6F, the sixth step S6 includes the first film (A) along the boundary line between the first and second regions a and b in a state in which the multi-film 20 is attached to the mother substrate 10. 14) cutting step. In this step, since the second film 16 is already cut at the boundary between the first and second regions a and b, the second embodiment has a predetermined gap between the multi-film 20 and the mother substrate 10. The gap may prevent damage to signal wires formed in the unit display element 12 or the mother substrate 10 when the first film 14 is cut.

As shown in FIG. 6G, the seventh step S7 is a step of removing the multi-film 20 attached to the second region b. Specifically, the second embodiment irradiates light onto the mother substrate 10, wherein the light is cut along the boundaries of the first and second regions a and b. The insertion force of the sacrificial layer 11 on the mother substrate 10 is lost. Accordingly, the second embodiment can easily remove the multi film 20 in the second region (b).

As illustrated in FIG. 6H, the eighth step S8 is a step of cutting the mother substrate 10 by a plurality of unit display elements. Specifically, the second embodiment cuts the mother substrate 10 along the scribing line defined in the second region (b).

As such, according to the second embodiment, the cutting and attaching structures of the film according to the size change of the multi film 20 need not be newly provided as the partial layers of the multi film 20 are cut in advance, and the process is simplified. Bubbles can be minimized when attached. In addition, when the multi-film 20 is cut, damage to the signal wires formed on the unit display element 12 or the mother substrate 10 can be prevented.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. Will be clear to those who have knowledge of.

10: mother substrate 12: unit display element
14: first film 16: second film
18: buffer film 20: multi film

Claims (10)

Forming a plurality of unit display elements on the mother substrate;
Providing a first film, and continuously attaching a second film and a buffer film on the first film to prepare a multi film;
The multi-film is divided into a first region and a second region to be attached to the plurality of unit display elements, and the buffer film and the second film of the multi-film are cut along the boundary lines of the first and second regions. Steps;
Removing the buffer film of the multi film corresponding to the first region;
The multi-film is disposed so that the second film and the plurality of unit display elements face each other in the first area, and the buffer film and the mother substrate face each other in the second area, and the arranged multi-film is placed on the mother substrate. Attaching;
Cutting the first film along a boundary line between the first and second regions;
Removing the multi film of the second region attached to the mother substrate;
And cutting the mother substrate for each of the plurality of unit elements. The method of claim 1,
The adhesive force of the buffer film is less than or less than the adhesive force of the first and second film manufacturing method of the flat panel display device. The method of claim 1,
And the first film is a circular polarizing film for improving outdoor visibility, and the second film is a protective film for preventing scratches and moisture permeation of the plurality of unit display elements. The method of claim 1,
The plurality of unit display elements
Or a liquid crystal display device including a first and a second substrate bonded to each other and a liquid crystal layer between the first and second substrates;
An organic light emitting diode display device comprising a TFT layer formed on a substrate, an organic light emitting layer formed on the TFT layer, and a sealing member for preventing deterioration of the organic light emitting layer. The method of claim 1,
The mother substrate is
Glass substrate, plastic containing polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, or the like, or stainless steel A method of manufacturing a flat panel display, characterized in that. Forming a plurality of unit display elements on the mother substrate;
Forming and patterning a photosensitive organic layer on the mother substrate to form a sacrificial layer in a region where the plurality of unit display devices are not formed;
Providing a first film, and attaching a second film on the first film to prepare a multi film;
Dividing the multi film into a first area and a second area not to be attached to the plurality of unit display elements, and cutting the second film of the multi film along a boundary line between the first and second areas;
The multi-film is disposed so that the second film and the plurality of unit display elements face each other in the first area, and the second film and the sacrificial layer face each other in the second area, and the arranged multi-film is mosquitoes. Attaching to the plate;
Cutting the first film along a boundary line between the first and second regions;
Removing the multi film of the second region attached to the mother substrate;
And cutting the mother substrate for each of the plurality of unit elements. The method according to claim 6,
And the first film is a circular polarizing film for improving outdoor visibility, and the second film is a protective film for preventing scratches and moisture permeation of the plurality of unit display elements. The method according to claim 6,
The material of the photosensitive organic film is
Method for manufacturing a flat panel display device characterized in that the PMMA (PolyMethylMethAcrylate) or photo acrylic. The method according to claim 6,
The plurality of unit display elements
Or a liquid crystal display device including a first and a second substrate bonded to each other and a liquid crystal layer between the first and second substrates;
An organic light emitting diode display device comprising a TFT layer formed on a substrate, an organic light emitting layer formed on the TFT layer, and a sealing member for preventing deterioration of the organic light emitting layer. The method according to claim 6,
The mother substrate is
Glass substrate, plastic containing polyethylene naphthalate, polyethylene terephthalate, polycarbonate, polyether sulfone, or the like, or stainless steel A method of manufacturing a flat panel display characterized in that.

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