KR20130023817A - Board chamber for heating package - Google Patents

Abstract

PURPOSE: A board chamber for heat generation package test is provided to uniformly maintain temperature distribution and to simultaneously measure DC characteristic and luminance characteristic during a burn-in test by implementing a chamber by board. CONSTITUTION: A board chamber(100) includes a test board(110), a chamber housing(120), a heater(122), and a temperature sensor(114). The test board installs a test socket(112) for mounting a heat generation package. The chamber housing forms an internal space for test by being connected with the test board. The heater maintains an internal space at a test temperature. The temperature sensor measures temperature of the test socket, the heater, or the inside of the chamber.

Description

Board chamber for heating package test {BOARD CHAMBER FOR HEATING PACKAGE}

The present invention relates to an apparatus for testing a heat generating package such as a light emitting diode (LED), and more particularly, a heat generation capable of simultaneously measuring DC characteristics and luminance characteristics during a uniform and burn-in test. It relates to a board chamber for package test.

In general, aging (also referred to as burn-in) of a semiconductor device is to predict the various quality levels of the semiconductor device over time by using various combinations of voltage, temperature and time to promote the life of the semiconductor device.

In the LED manufacturing process, the aging test is mainly performed to evaluate the life of the LED. In the conventional LED aging system, the LED is mounted in a test socket of a burn-in test board and burned in a large burn-in room. -in boards were to be stacked and tested. That is, the conventional light emitting diode aging system includes a heater next to the burn-in room, and then circulates the hot air heated by the heater through the inlet and exhaust ports of the burn-in room, thereby measuring the temperature of the burn-in room at a test temperature (eg, 80 ° C. to 80 ° C.). The electrical properties of the samples were tested while maintaining at 85 ° C.), and the luminance of each sample was measured separately at room temperature after the burn-in test was completed.

Conventional light-emitting diode aging systems stack and test burn-in boards in multiple layers in a large burn-in room, which takes time to stabilize the temperature and the temperature distribution in the burn-in room is not uniform even after stabilization. Due to the different temperature, the accuracy of the burn-in test is reduced, and the luminance measurement is performed separately from the electrical characteristic test, so that the process is complicated and takes a long time.

The present invention has been proposed to solve the above problems, and the object of the present invention is to provide a separate chamber for each burn-in test board and to perform temperature control precisely, thereby making the test temperature uniform, By simultaneously performing the characteristic and luminance measurement, burn-in test is simple and the process chamber provides a board chamber for testing a heat package.

In order to achieve the above object, the apparatus of the present invention includes a test board mounted with a test socket for mounting a heat generating package; A chamber housing coupled to the test board to form an internal space for a test; A heater for maintaining the internal space at a test temperature; And a temperature sensor for measuring a temperature inside the test socket or the heater or the chamber.

The test socket is provided with a heat sink exposed to the outside of the test board, the heater is divided into each area on the chamber housing to be separated by area to control the temperature. The chamber housing is a hole for sealing the inner space or air flow is formed, and further includes a photodiode for measuring the optical characteristics of the package under test burned in a hole formed in the chamber housing.

According to the present invention, by providing a chamber individually for each burn-in test board, the temperature control is precisely performed to improve the reliability of the burn-in test by making the test temperature uniform, and simultaneously performing electrical characteristics and luminance measurements during the burn-in test. The manufacturing time can be reduced by reducing the test time.

1 is a schematic diagram showing a board chamber for a heating package test according to the present invention,
2 is a view illustrating a region of the board chamber for heating package test according to the present invention;
3 is a first embodiment of a test socket mounted to a board chamber according to the present invention;
4 is a second embodiment of a test socket mounted to a board chamber according to the present invention;
5 is a third embodiment of a test socket mounted to a board chamber according to the present invention;
6 is a perspective view schematically showing a heating package test system using the board chamber of the present invention;
7 is a control system diagram of a heating package test system using the board chamber of the present invention;
8 is a block diagram of a heating package test system using the board chamber of the present invention;
9 is a flowchart illustrating a heating package test procedure using the board chamber of the present invention.

The technical problems achieved by the present invention and the practice of the present invention will be more clearly understood by the preferred embodiments of the present invention described below. The following examples are merely illustrative of the present invention and are not intended to limit the scope of the present invention. In the embodiment of the present invention, as the heat generating package, an LED is described as an example.

1 is a schematic diagram illustrating a board chamber for a heating package test according to the present invention, Figure 2 is a diagram showing the board chamber for the heating package test according to the invention divided into regions, Figure 3 is a board chamber in accordance with the present invention 1 is a first embodiment of a test socket to be mounted, FIG. 4 is a second embodiment of a test socket mounted to a board chamber according to the present invention, and FIG. 5 is a third embodiment of a test socket mounted to a board chamber according to the present invention. Yes.

As shown in FIG. 1, the board chamber 100 according to the present invention is coupled to the test board 110 on which the test socket 112 is mounted and the test board 110 to form an internal space for a burn-in test. Comprising a chamber housing 120, a plurality of test sockets 112 for mounting a heat dissipation package to be burn-in test, for example, LED elements are arranged on the test board 110, and some sockets for each region sense the socket temperature The temperature sensor 114 is installed.

On the upper side of the chamber housing 120, holes 120a are formed at positions corresponding to the test sockets 112, and glass 120b is installed in each hole 120a to isolate the inner space from the outer space. The photodiode 124 for sensing the brightness of the LED element is installed outside the 120b).

In addition, as shown in FIG. 2, the chamber housing 120 is divided into five regions 1 to 5, and respective heaters 122 are installed in each region to form five internal spaces of the board chamber 100. It is possible to further improve the chamber uniformity for the burn-in test by controlling the temperature independently in each area by dividing into areas.

The test socket 112 of the test board 110 includes a portion 112a for mounting the LED element in the inner space and a heat dissipation structure 112b for radiating heat generated from the LED element to the outside by being exposed to the outside. As an example of the test socket 112, the sockets illustrated in FIGS. 3 to 5 may be used. The test socket shown in FIG. 3 is a TPA type socket, the socket shown in FIG. 4 is a BPA type socket, and the test socket shown in FIG. 5 is a BMP type socket. Such a test socket may be used by selecting an appropriate type according to the type of the connection terminal of the LED device to be burned-in test.

6 is a perspective view schematically showing a heat generating package test system using the board chamber of the present invention, and FIG. 7 is a control system diagram of the heat generating package test system using the board chamber of the present invention.

As shown in FIG. 6, the heating package test system 10 using the board chamber of the present invention includes two burn-in chambers 16-1 and 16-2 having 12 board chambers 100, and a control PC ( 12) and one control rack 14 mounted with various boards for burn-in test. Each burn-in room (16-1, 16-2) may be provided with a ventilation passage (18-1, 18-2) for ventilation, in some cases through a separate heater or cooler You can also adjust the overall atmosphere of 16-2).

Referring to FIG. 7, in each burn-in chamber 16, a plurality of board chambers 100 including a test board 110 and a chamber housing 120 are stacked on the shelf 130, and the control rack 14 generates heat. Source measurement unit (SMU) 141 for testing the DC characteristics of the package (LED), matrix board 142, power supply 143, luminance measurement board 144, chamber for connection with the board chamber 100 The control board 145 and the socket temperature monitoring board 146 are mounted, and the boards mounted in the control rack 14 are connected to the control PC 12 through a standard interface such as TCP / IP, USB, or RS-485. It is connected.

8 is a block diagram illustrating a heating package test system using the board chamber of the present invention, and FIG. 9 is a flowchart illustrating a burn-in test procedure of the heating package test system according to the present invention.

As shown in FIG. 8, the heating package test system 10 using the board chamber of the present invention includes a power supply 143, an LED driver 147, a source measuring unit 141, an LED matrix board 142, The luminance measurement matrix 144, the chamber control board 145, the control PC 12, and the board chamber 100 are configured.

Referring to FIG. 8, the power supply 143 supplies DC power required for burn-in test, and the LED driver 147 is mounted in a test socket of the LED test board 110 through the LED matrix board 142. Drive the LED elements. The source measuring unit (SMU) 141 is connected to the reverse current (IR) of the LED elements mounted in the test socket 112 of the LED test board 110 via the LED matrix board 142 under the control of the control PC 12. After measuring the current and forward voltage (VF) characteristics, the measured data is transferred to the control PC 12. Since the LED matrix board 142 mounts a plurality of test sockets 112 and LED elements for each LED test board 110 of each board chamber 100, the LED driver 147 and the source measuring unit for driving and testing the LEDs. 141 is connected to the corresponding LED elements.

The luminance measurement matrix 144 measures luminance by sensing the luminance of the corresponding LED element from a plurality of photodiodes 124 mounted in the chamber housing 120 of the board chamber 100 under the control of the control PC 12. The measurement data is transmitted to the control PC 12.

The chamber control board 145 detects the socket temperature for each region of the board chamber 100 from the socket temperature sensor 114 of each board chamber 100, measures the socket temperature, and transfers the temperature data to the control PC 12. And control the heater 122 according to the setting of the control PC 12 to control each board chamber 100 so as to maintain the burn-in test temperature at which the temperature of each region is set.

As described later, the control PC 12 sets various conditions for the burn-in test, monitors the burn-in environment of each board chamber 100 through the chamber control board 145 according to the set conditions, and sets the socket temperature. When the temperature is reached, the direct current characteristics of the corresponding LED elements are measured through the source measuring unit 141 automatically or manually. The measurement result data is received and managed by a database. When the set condition is reached, the luminance measurement matrix 144 is obtained. Through measuring the luminance characteristics of the corresponding LED elements through receiving the measurement result data is managed by a database to manage the entire burn-in test.

Referring to FIG. 9, after mounting the LED elements to be burned-in to the test socket 112 of each board chamber 100, the tester sets burn-in test conditions on the control PC 12 (S1). Burn-in test conditions are the temperature of the board chamber 100, the burn-in time, the test method, the test interval, and the like.

When the burn-in test is started, the internal temperature of each board chamber 100 is monitored through the chamber control board 145 to maintain the temperature inside the chamber (S2). After monitoring the socket temperature and counting the test time to reach the test condition, the DC measurement characteristics of the corresponding LED elements, for example, reverse current (IR) and forward voltage (IR) of the LED elements are reached through the source measuring unit 141. After measuring the VF: Foward Voltage, the measurement data is received and stored in the database (S3 ~ S6).

In addition, the luminance is measured by sensing the luminance of the corresponding LED device through the luminance measurement matrix 144, and the measurement data is received and stored in the database (S7 and S8).

When the burn-in test is completed, the measured data of the database is statistically processed according to the tester's request and output in various types of graphs and tables.

The present invention has been described above with reference to one embodiment shown in the drawings, but those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom.

100: board chamber 110: test board
112: test socket 14: socket temperature sensor
120: chamber housing 122: heater
124: photodiode 141: source measuring unit
142: LED matrix board 143: power supply
144: luminance measurement matrix 145: chamber control board
147: LED driver 10: test system
12: control PC 14: control rack
16-1,16-2: Burn-in room 18-1,18-2: Ventilation passage

Claims (5)

A test board mounted with a test socket for mounting the heat generating package;
A chamber housing coupled to the test board to form an internal space for a test;
A heater for maintaining the internal space at a test temperature; And
Board chamber for testing a heating package including a temperature sensor for measuring the temperature inside the test socket or heater or chamber. The method of claim 1, wherein the test socket
The board chamber for a heating package test, characterized in that it comprises a heat sink exposed to the outside of the test board. The board chamber of claim 1, wherein the heater is dividedly installed in each area on the chamber housing so as to control the temperature by separating the areas. The method of claim 1, wherein the chamber housing
Board chamber for testing the heat generating package, characterized in that the inner space is sealed or a hole for air flow is formed. The board chamber of claim 1, further comprising a photodiode for measuring optical characteristics of the package under test burned in a hole formed in the chamber housing.

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