KR20130019272A - Photosensitive paste composition for plasma display panel barrier rib - Google Patents
Photosensitive paste composition for plasma display panel barrier rib Download PDFInfo
- Publication number
- KR20130019272A KR20130019272A KR1020110081339A KR20110081339A KR20130019272A KR 20130019272 A KR20130019272 A KR 20130019272A KR 1020110081339 A KR1020110081339 A KR 1020110081339A KR 20110081339 A KR20110081339 A KR 20110081339A KR 20130019272 A KR20130019272 A KR 20130019272A
- Authority
- KR
- South Korea
- Prior art keywords
- paste composition
- partition wall
- photosensitive paste
- weight
- pdp
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0042—Photosensitive materials with inorganic or organometallic light-sensitive compounds not otherwise provided for, e.g. inorganic resists
- G03F7/0043—Chalcogenides; Silicon, germanium, arsenic or derivatives thereof; Metals, oxides or alloys thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
The present invention relates to a novel photosensitive paste composition for forming PDP partition walls and a method for forming a PDP partition wall using the same.
Competition is accelerating due to the increase in demand for flat panel displays such as plasma display panels (PDP), LCDs, OLEDs, etc., and the increase in size and resolution of display devices. Realization of full HD (high definition) image quality is required.
Plasma display panel (PDP) is a vacuum ultraviolet ray (mainly 147 nm wavelength) emitted from the plasma generated during gas discharge of Ne, Xe, etc. filled between the upper plate and the lower plate collides with the phosphor, red, green, blue light in the visible region It is a flat panel display that uses a changing phenomenon.
In the PDP, the partition wall is a structure formed on the back substrate of the PDP in order to secure a discharge space and to prevent electrical and optical cross talk between adjacent cells, and is an important factor in determining the image display quality of the PDP. Acts as.
Conventionally, as a method of forming a partition, a printing method, a sand blast method, a wet-etching method, and the like are known. However, the above methods are complicated in the process, and it is difficult to form a structure satisfying a high aspect ratio. In particular, the sand blasting method and the wet etching method are very difficult to implement a fine pattern, and there is a problem in terms of green environment due to serious environmental pollution problems.
Thus, Matsushita, Japan, has long been successful in commercializing the photolithography method and its material for forming PDP bulkheads for high resolution. There are limitations in the process, such as the need to repeat the coating and exposure process several times and the material is harmful to the environment.
In order to solve the above problems, the present invention is capable of forming a pattern even with a minimum exposure amount, it is possible to form a multi-layer by one or two coating and exposure as a single high-sensitivity composition, to improve the environmental problems by using an eco-friendly plasticizer In addition, it is an object of the present invention to provide a photosensitive paste composition for forming PDP barrier ribs capable of realizing high resolution through high sensitivity and fine line width control, and forming a stable barrier rib pattern by securing a plastic margin.
It is another object of the present invention to provide an environmentally friendly PDP partition wall formation method which is suitable for the photolithography method using ultraviolet irradiation and which can realize a simplified process and a lower cost, and a partition wall formed by the above method.
In order to achieve the above object, the present invention provides a photosensitive paste composition for forming a PDP partition wall,
(1) 45 to 90 weight percent of the glass powder;
(2) 1 to 10% by weight of one or more inorganic fine particles selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, barium oxide and mixtures thereof;
(3) 5 to 50 wt% binder;
(4) 1 to 20% by weight of the photosensitive monomer;
(5) 0.01 to 5 wt% of a photopolymerization initiator;
(6) 1 to 10 weight percent dibutyl ester; And
(7) residual solvent
It provides a photosensitive paste composition for forming a PDP partition wall comprising a.
The present invention also provides a PDP partition wall formation method using the photosensitive paste composition for PDP partition wall formation and a PDP partition wall formed according to the method.
The photosensitive paste composition for forming PDP barrier ribs according to the present invention contains a binder, a photosensitive monomer, a photopolymerization initiator, a dibutyl ester and an organic solvent in an optimum ratio as a photosensitive resin composition, and is suitable for the photolithography method using ultraviolet irradiation, and the minimum It is possible to form patterns with the exposure dose, and to form multilayers with one or two coatings and exposures as a single high-sensitivity composition, and to improve environmental problems by using eco-friendly plasticizers, and to control high sensitivity and fine line width. High resolution can be realized, and a stable bulkhead pattern can be formed by securing a plastic margin.
Therefore, by using the composition of the present invention, it is possible to realize the simplification and low cost of the process in forming the PDP partition wall.
PDP partition wall forming photosensitive paste composition according to the present invention, in the PDP partition wall forming photosensitive paste composition,
(1) 45 to 90 weight percent of the glass powder;
(2) 1 to 10% by weight of one or more inorganic fine particles selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, barium oxide and mixtures thereof;
(3) 5 to 50 wt% binder;
(4) 1 to 20% by weight of the photosensitive monomer;
(5) 0.01 to 5 wt% of a photopolymerization initiator;
(6) 1 to 10 weight percent dibutyl ester; And
(7) residual solvent
And a control unit.
Each component is demonstrated below.
(1) glass powder
As the glass powder usable in the photosensitive paste composition of the present invention, conventional glass used for PDP partition walls can be used, and both spherical or crushed shapes can be used. Particularly, in the case of using spherical glass powder, resolution and partition walls Preferred in terms of firing profile. In addition, the glass powder is more preferably a spherical particle size distribution of D 50 = 4.4 ㎛.
As a specific example, the glass powder may be a glass powder of SiO 2 -B 2 O 3 -Al 2 O 3 -ZnO system.
The glass powder is preferably contained in 45 to 90% by weight, preferably 50 to 70% by weight relative to the total weight of the photosensitive paste composition, when the content is in the above range, excellent coating properties, developability, resolution, calcined density And storage stability can be obtained.
(2) inorganic components
As an inorganic component usable in the photosensitive paste composition of the present invention, an inorganic component for a known tube used for forming a PDP partition wall may be used, and an average particle size is D 50 = 2 μm or less, preferably an average particle size D 50 = 1 μm or less. It is preferable to have the characteristic of.
Specific examples of the inorganic component may be one or more selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, barium oxide, and mixtures thereof, ceramics (alumina, cordierite, etc.), metals (gold, Silver, nickel, etc.) can also be used. The inorganic component is preferably used in 1 to 10% by weight based on the total weight of the photosensitive paste composition. When the content is in the above range can control the shape during the partition wall firing can satisfy the high resolution, coating properties and plastic stability at the same time.
(3) binder
In the present invention, a binder is included as a component of the photosensitive resin composition in order to impart bonding and developability of the paste component before firing the photosensitive paste composition. Examples of the binder that can be used in the present invention include acrylic copolymers, polyvinyl butyral, and acrylic acid ester polymers, and have a molecular weight (Mw) of 5,000 to 100,000, preferably 20,000 to 60,000, and an acid value (mgKOH / g). 50 to 100, preferably 60 to 70 may be used.
The binder is preferably included in 5 to 50% by weight of the total weight of the photosensitive paste composition, the workability is good when the content is in the above range, the pattern is not entangled during firing.
(4) photosensitive monomer
As the photosensitive monomer usable in the photosensitive paste composition in the present invention, a monomer for a known tube used for forming a PDP partition wall, preferably a monomer having a polyfunctional group, may be used. Specifically, the photosensitive monomer is triacrylic acid, dipenta reagent monohydroxypentaacrylate, methyl acrylate, butoxyethyl acrylate, 2-hydroxypropyl acrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylic At least one selected from the group consisting of latex (DPHA) and mixtures thereof.
The photosensitive monomer may be used in an amount of 1 to 20% by weight, preferably 2 to 10% by weight based on the total weight of the photosensitive paste composition.
(5) photopolymerization initiator
As the photopolymerization initiator that can be used in the photosensitive paste composition of the present invention, a photopolymerization initiator for a known tube used to form a PDP barrier rib for controlling the barrier rib shape may be used, and specific examples thereof include alpha amino ketone, 4,4'-bis- (di Ethylamino) -benzophenone, benzophenone, 4,4-dichlorobenzophenone and dibenzylketone and mixtures thereof.
The photopolymerization initiator may be included in 0.01 to 5% by weight, preferably 0.01 to 2% by weight of the total weight of the photosensitive paste composition. At this time, if the amount of the initiator is too small, the sensitivity is insufficient, the bottom hardening of the partition wall is not made, the pattern is dropped, if the content of the initiator is too large, there is a fear that the partition pattern is blocked by increasing the residual ratio.
In particular, in the present invention, it is preferable to use a photopolymerization initiator in which two or more kinds of initiators are mixed for optimal partition shape control.
(6) dibutyl ester
The present invention uses dibutyl ester, which is an environmentally friendly material, as a plasticizer in the photosensitive paste composition. The content of the dibutyl ester may be 1 to 10% by weight, preferably 1 to 5% by weight of the total weight of the photosensitive paste composition.
(7) organic solvent
As an organic solvent which can be used for the photosensitive paste composition of this invention, what is excellent in affinity with an inorganic component can be selected suitably and can be used by adjusting a viscosity, facilitating a paste forming and a paste application | coating process, and an inorganic component. Specific examples of such organic solvents include ethyl beta-ethoxypropionic acid (EEP), butyl carbitol acetate (BCA), terpinol, methyl ethyl ketone, methyl cellosolve, butyl carbitol, and mixtures thereof. It may be one or more selected, preferably a 1: 2 mixture of butyl carbitol acetate and ethyl beta-ethoxypropionic acid. When using the mixture, it is possible to shorten the drying time than when using the BCA alone.
The photosensitive paste composition for forming a PDP partition wall according to the present invention comprising the components of (1) to (7) as described above is used in ethyl acrylate / 2-ethylhexyl acrylic acid in order to improve the surface leveling characteristics during bubble removal and coating of the composition. The copolymer may further include, and the copolymer may be included in an amount of 0.01-5% by weight based on the total weight of the photosensitive paste composition.
In addition, the photosensitive paste composition of the present invention may use an ammonium salt of the acid copolymer in order to improve the even distribution of each component and stability and precision of the partition after firing, which is contained in an amount of 0.01-5% by weight relative to the total weight of the photosensitive paste composition. It is good.
In addition, the photosensitive paste composition of the present invention may include various additives, such as UV absorbers, tackifiers, surface tension regulators, stabilizers, antifoaming agents, polypropylene glycol as an optional component, if necessary, the content of the additive is a photosensitive paste It is preferred to include 0.01-5% by weight, independently of the total weight of the composition.
The paste composition for forming a PDP partition wall of the present invention can be prepared by kneading the components of the above (1) to (7) and the components additionally added as necessary according to a conventional method, and as a specific method, a roll kneader, Kneaders such as mixers, homomixers, ball mills and bead mills can be used.
The photosensitive paste composition for PDP partition wall formation of this invention manufactured as mentioned above is a paste-like composition which has the fluidity suitable for application | coating.
The photosensitive paste composition for forming PDP partition walls according to the present invention contains a glass powder, an inorganic component, a binder, a photosensitive monomer, a photopolymerization initiator, a dibutyl ester and a solvent in an optimum ratio, and is suitable for the photolithography method, even at a minimum exposure dose. It is possible to form a pattern, and to form a multilayer with one or two coatings and exposures as a high-sensitivity single composition, and to improve environmental problems by using an eco-friendly plasticizer, and to realize high resolution through high sensitivity and fine line width control. It is possible to secure a plastic margin to form a stable partition pattern.
In addition, the present invention provides a PDP partition wall using the photosensitive paste composition for PDP partition wall formation, the method of forming a PDP partition wall of the present invention
a) coating the photosensitive paste composition for forming a PDP partition on a substrate on which a partition is to be formed and drying the same;
b) exposing the dried substrate using a photolithography method to shape partition walls; and
c) can be manufactured through the step of firing the shaped partition wall.
In the PDP partition wall forming method, other processes except for using the photosensitive paste composition according to the present invention, for example, coating, drying, photolithography and firing process is a method used in the conventional PDP partition wall forming method Can be used.
Specific examples of the PDP partition wall forming method of the present invention are as follows. First, a film of a partition composition paste composition is formed on the surface of a flat substrate material (for example, a glass plate). As the method for forming the film, a conventional coating film forming method can be used, and in particular, a coating method is used. Specific examples include a screen printing method, a roll coating method, a rotary coating method, a cast coating method, a bar coater method, and the like, and the thickness of the film is preferably 100 to 300 µm after drying. The drying temperature of the membrane can be arbitrarily selected as long as the organic solvent in the membrane can be removed to such an extent that the later steps are not affected, and the temperature is preferably around 80 to 150 ° C.
Then, a predetermined pattern is formed by irradiating visible light, ultraviolet rays, far ultraviolet rays, electron beams, X-rays, or the like, preferably ultraviolet rays on the formed coating film according to a previously prepared pattern, and developing with a developer to remove unnecessary portions.
In the exposure process, in the case of forming a single partition, the exposure amount is adjusted to 50 to 100 mJ / cm 2, preferably 60 to 70 mJ / cm 2.
In the case of forming the double partition wall, the exposure amount of the lower layer (primary coating layer) is adjusted to 30 to 60 mJ / cm 2, preferably 40 to 50 mJ / cm 2, and the upper layer (second coating layer) exposure amount is 70 to 100 mJ / cm 2, preferably It is adjusted to 80 ~ 90mJ / ㎠. The exposure amount is to significantly improve the sensitivity of the exposure amount of 150-500 mJ / ㎠ when using the conventional photosensitive partition wall paste.
In addition, in the case of forming the double partition, after the first coating, drying and exposure processes are completed, the same paste composition may be applied thereon, and the drying and exposure processes may be repeated.
The developer is preferably an aqueous alkali solution, specifically, inorganic alkalis such as sodium hydroxide, potassium hydroxide and sodium carbonate; Primary amines such as ethylamine and n-propylamine; Secondary amines such as diethylamine and n-propylamine; Tertiary amines such as trimethylamine, methyldiethylamine, dimethylethylamine and triethylamine; Alcohol amines such as dimethylethanolamine, methyldiethanolamine and triethanolamine; Or an aqueous solution of a quaternary ammonium salt such as tetramethylammonium hydroxide or tetraethylammonium hydroxide. In this case, the developer is used by dissolving the alkaline compound at a concentration of 0.1 to 10 parts by weight, and may be added an appropriate amount of a water-soluble organic solvent and a surfactant such as methanol, ethanol and the like.
In addition, after developing with the developer as described above, washing with ultrapure water for 30 to 90 seconds to remove unnecessary parts and drying, followed by a calcination process, the organic material is lost during the firing and the partition is produced on the substrate. The temperature of the said baking process needs to be the temperature which the organic substance contained in the composition for partition formation loses, and is 400-600 degreeC normally.
According to the PDP partition wall forming method using the photosensitive paste composition of the present invention, it is possible to form a fine pattern having a line width (upper line width) of 20-30 ㎛, simplification and low cost of the process by shortening the drying and exposure process time in panel production Can be realized, and the panel production can be increased by increasing the plastic strength and reducing the occurrence of cracks.
Hereinafter, the present invention will be described in more detail with reference to the following examples. However, the scope of the present invention is not limited to the following examples.
Examples 1-4 and Comparative Examples 1-5
After quantitating the components according to the composition and content shown in Table 1 below, the quantitatively weighed mixture was mixed for 4 hours using a Planetary mixer (Mixer) (INOUE Co.), and 3 roll mill (INOUE Co.) Kneading in a uniform dispersed state to prepare a photosensitive paste composition for forming partitions.
Manufacturing example 1: Manufacture of single bulkhead
The paste of Examples 1-4 prepared above was front coated on a glass substrate (200 cm x 200 cm) on which a back dielectric was formed, using a bar coater, and heated at 138 ° C. for 20 minutes using a hot air drying furnace. Dried. The dried substrate was mounted on an exposure machine (SEIWA Co., Ltd.) and subjected to UV irradiation once with an exposure dose of 70 mJ / cm 2 using a photomask having a partition wall shape (30 μm in width).
The exposed substrate was developed using an aqueous 0.4% sodium carbonate (Na 2 CO 3 ) solution and washed with pure water (DI water). The substrate on which the pattern was formed in the above process was fired using a belt type firing furnace, subjected to binder removal, and then fired at 570 ° C. for 10 minutes. The temperature increase rate was 10 degrees C / min. The prepared partition wall showed a good shape, and it was confirmed that a good partition wall can be formed by only one UV irradiation at an exposure dose of 70 mJ / cm 2.
Preparation Example 2 Preparation of Double Bulkhead
On the glass substrate (200 cm x 200 cm) on which the back dielectric was formed, the pastes of Example 1-4 and Comparative Example 1-5 prepared above were firstly coated using a bar coater, and then heated to 138 ° C. using a hot air drying furnace. Dried for 9 min. The dried substrate was mounted on an exposure machine (SEIWA Co., Ltd.) and subjected to UV irradiation once at an exposure dose of 40 mJ / cm 2 using a photomask having a partition wall shape (50 µm in width). The paste was secondarily coated on the substrate using a bar coater and dried at 138 ° C. for 12 minutes using a hot air drying furnace. The dried substrate was mounted on an exposure machine (SEIWA Co., Ltd.) and subjected to UV irradiation once at an exposure dose of 80 mJ / cm 2 using a photomask having a partition wall shape (30 μm in width).
The substrate on which the exposure was completed was washed and baked in the same manner as in Preparation Example 1, and the shape of the prepared partition wall is shown in Table 2 below.
In this case, the exposure sensitivity was manufactured by exposing a mask having 100 holes and then exposed to light, and counting the remaining stages to compare the sensitivity, and the more the remaining stages, the better the sensitivity.
The coating property, the drying property, the exposure sensitivity, the developability, the upper / lower line width, the lower width / upper width ratio, the plastic strength of the substrate on which the pattern was formed using the pastes prepared in Examples 1 to 4 and Comparative Examples 1 to 4, The firing crack was measured by the following method and shown in Table 2.
The measurement method for each item is as follows.
1. Coating: ◎-no stains and pinholes, ○-stains and pinholes 3 points or less, △-stains and pinholes 10 points or less, X-stains and pinholes on the entire surface
2. Drying: ○-Very good drying characteristics, △-Normal (slightly overdrying or tacky), X-Poor drying (overdrying over 10% or tacky)
3. Sensitivity (100 stages): Using the exposure mask with 100 holes on the substrate with a thickness of 110um, check the remaining stages after exposing at 70mJ (Transmittance is different for each of 1 ~ 100 holes, and the transmittance decreases to 100). box)
4. Developability: ○-Good partition shape, △-Increased lower line width or under cut, X-Blocking or full peeling
5. Plastic strength: Check the number of broken bulkheads by dropping metal balls (weight 15g) at 50mm height.
6. Firing crack: ◎-none, ○-5 points or less, △-10 points or less, X-occurs on the front
As shown in Table 2, in the case of Example 1-4 according to the present invention, it was confirmed that the drying property and developability were very good, the plastic crack was small, and the sensitivity was increased to 98 or more at the same time.
Claims (13)
(1) 45 to 90 weight percent of the glass powder;
(2) 1 to 10% by weight of one or more inorganic fine particles selected from the group consisting of silicon oxide, aluminum oxide, titanium oxide, barium oxide and mixtures thereof;
(3) 5 to 50 wt% binder;
(4) 1 to 20% by weight of the photosensitive monomer;
(5) 0.01 to 5 wt% of a photopolymerization initiator;
(6) 1 to 10 weight percent dibutyl ester; And
(7) residual solvent
PDP bulkhead forming photosensitive paste composition comprising a.
The glass powder is SiO 2 -B 2 O 3 -Al 2 O 3 -ZnO-based glass powder, characterized in that the photosensitive paste composition for forming a PDP partition wall.
The binder is a photosensitive paste composition for forming a PDP partition wall, characterized in that the molecular weight (Mw) is 5,000 to 100,000 and the acid value (mgKOH / g) is 50 to 100 acrylic copolymer, polyvinyl butyral or acrylic acid ester polymer.
The photosensitive monomer is triacrylic acid, dipenta reagent monohydroxypentaacrylate, methyl acrylate, butoxyethyl acrylate, 2-hydroxypropyl acrylate, polyethylene glycol diacrylate, dipentaerythritol hexaacrylate and these Photosensitive paste composition for forming a PDP partition wall, characterized in that at least one member selected from the group consisting of a mixture of.
The photopolymerization initiator is one selected from the group consisting of alpha amino ketone, 4,4'-bis- (diethylamino) -benzophenone, benzophenone, 4,4-dichlorobenzophenone and dibenzylketone and mixtures thereof The photosensitive paste composition for PDP partition wall formation characterized by the above-mentioned.
PDP partition wall, characterized in that the organic solvent is at least one selected from the group consisting of ethyl beta-ethoxypropionic acid, butyl carbitol acetate, terpinol, methyl ethyl ketone, methyl cellosolve, butyl carbitol and mixtures thereof Photosensitive paste composition for formation.
A photosensitive paste composition for forming a PDP partition wall, further comprising 0.01-5% by weight of an ethyl acrylic acid / 2-ethylhexyl acrylic acid copolymer based on the total weight of the photosensitive paste composition.
A photosensitive paste composition for forming a PDP partition wall, further comprising 0.01-5% by weight of an ammonium salt of an acidic copolymer based on the total weight of the photosensitive paste composition.
a) coating and drying the photosensitive paste composition of any one of claims 1 to 8 on a substrate to form a partition;
b) exposing the dried substrate by photolithography to shape the partition wall; And
c) firing the shaped partition wall.
PDP partition wall forming method characterized in that the exposure amount is 50 ~ 100 mJ / ㎠.
After the first coating, drying and exposure process of step a) and b) is completed, the same paste composition as the primary coating is applied thereon, and the drying and exposure process is repeated PDP partition wall forming method.
The exposure amount of a primary coating layer (lower layer) is 30-60 mJ / cm <2>, and the exposure amount of a secondary coating layer (upper layer) is 70-100 mJ / cm <2>.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110081339A KR20130019272A (en) | 2011-08-16 | 2011-08-16 | Photosensitive paste composition for plasma display panel barrier rib |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020110081339A KR20130019272A (en) | 2011-08-16 | 2011-08-16 | Photosensitive paste composition for plasma display panel barrier rib |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20130019272A true KR20130019272A (en) | 2013-02-26 |
Family
ID=47897468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110081339A KR20130019272A (en) | 2011-08-16 | 2011-08-16 | Photosensitive paste composition for plasma display panel barrier rib |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR20130019272A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210070598A (en) * | 2019-12-05 | 2021-06-15 | 한국다이요잉크 주식회사 | Etching resist ink composition |
-
2011
- 2011-08-16 KR KR1020110081339A patent/KR20130019272A/en not_active Application Discontinuation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20210070598A (en) * | 2019-12-05 | 2021-06-15 | 한국다이요잉크 주식회사 | Etching resist ink composition |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1980910A1 (en) | Photosensitive composition, display member, and process for producing the same | |
| JP4642593B2 (en) | Photosensitive resin composition for forming functional pattern and method for forming functional pattern | |
| KR20130095637A (en) | Light-sensitive paste, method for forming pattern, and method for producing flat display panel member | |
| KR100889774B1 (en) | A photosensitive paste composition, a barrier rib prepared using the composition and a plasma display panel comprising the barrier rib | |
| JP3827196B2 (en) | Photosensitive insulating paste composition and photosensitive film using the same | |
| KR100868550B1 (en) | Photosensitive insulative paste composition and photosensitive film using the same | |
| KR101404459B1 (en) | Photosensitive paste composition for plasma display panel barrier rib and method for forming plasma display panel barrier rib | |
| JPH09110466A (en) | Photosensitive insulating glass paste | |
| JP3239759B2 (en) | Photosensitive paste | |
| KR20130019272A (en) | Photosensitive paste composition for plasma display panel barrier rib | |
| KR100327360B1 (en) | Photosensitive paste composition with low temperature firing property for plasma display panel | |
| JP2010092785A (en) | Photosensitive paste, manufacturing method of plasma display member using the same, and plasma display | |
| KR20120069614A (en) | Glass paste for forming a photosensitive sealing layer, plasma display manufacturing method using the same, and plasma display | |
| KR101216647B1 (en) | Paste composition for plasma display panel barrier rib | |
| KR101299111B1 (en) | Paste composition for plasma display panel barrier rib | |
| KR20130019867A (en) | Photosensitive paste composition for barrier rib | |
| JP5516244B2 (en) | Photosensitive paste composition, method for producing metal wiring, and method for producing display member | |
| JP4613503B2 (en) | Display member manufacturing method, display member manufactured by the method, and display | |
| JP2003242895A (en) | Plasma display member, plasma display, and method for manufacturing the same | |
| JP4432523B2 (en) | Display member manufacturing method | |
| KR20020011560A (en) | Photopolymerization type photosensitive phosphor paste composition and method for making fluorescent layer of PDP using them | |
| KR20060084620A (en) | Method for preparing barrier rib of plasma display panel | |
| JP5417747B2 (en) | Negative photosensitive paste, pattern forming method and flat display panel member manufacturing method. | |
| KR20090049579A (en) | Plasma display rear panel and its manufacturing method | |
| KR101130296B1 (en) | A photosensitive paste composition for a barrier rib of Plasma display panel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WITN | Withdrawal due to no request for examination |