KR20130019045A

KR20130019045A - Enviromental-franedly ion generating one-packing pavement material and manufacturing method thereof

Info

Publication number: KR20130019045A
Application number: KR1020110080951A
Authority: KR
Inventors: 김성노
Original assignee: 에코텍 주식회사
Priority date: 2011-08-16
Filing date: 2011-08-16
Publication date: 2013-02-26

Abstract

The present invention relates to a process for producing a one-pack type anion chip-binder packaging material, and a novel one-pack type chip-binder packaging material which is easy to manufacture while emitting negative ions.
The one-pack type chip-binder packaging material according to the present invention comprises the steps of: drying an elastic chip; coating an anionic nanoparticle dispersion liquid on the elastic chip to form an anion coating film on the surface of the elastic chip; And mixing the elastic chips having an anionic coating film formed on their surfaces with a binder and packaging them.
The present invention provides a new one-pack type chip-binder packaging material which is easy to manufacture and has excellent storage stability.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an environmentally friendly negative ion generating one-pack type elastic packaging material,

The present invention relates to a process for producing a one-pack type anion chip-binder packaging material, and a novel one-pack type chip-binder packaging material which is easy to manufacture while emitting negative ions.

If the binder and chips are mixed and packaged in advance, then they are directly installed in the field or blocked by molding, that is, when used as a one-part type, the storage stability is shortened due to the moisture present in the chips. Patent Nos. 415690 and 711089, registered with Hepchem, Inc. to solve the problem of falling, have a chip and a boiling point in the range of 50-130 ° C and are incompatible with water based on the amount of the chip. Mixing in the range of 100% by weight; Heating the resultant mixture to reflux the solvent and to separate water; Removing the separated water and removing the solvent by a vacuum evaporation method; Adding and mixing the binder resin in the range of 5 to 200% by weight based on the amount of the chip while introducing an inert gas; And packaging the resulting chip-binder system. &Lt; Desc / Clms Page number 2 >

This method is meaningful in that the method of drying the chips using various drying furnaces and mixing the dried chips with the binder resin to make one-pack type can solve the problem that it is difficult to completely remove moisture and it is difficult to store after drying.

However, these methods are easy to remove moisture, but when the organic solvent such as toluene is swollen to the rubber chip in the process of removing moisture, it is not easy to dry, and if toluene remains, have.

A problem to be solved by the present invention is to provide a new one-pack type chip-binder packaging material.

Another object to be solved by the present invention is to provide a new anion-release single-component type chip-binder packaging material.

Another object of the present invention is to provide a new method of manufacturing anion-releasing single-component chip-binder packaging material.

The above problems are solved by forming a coating layer on the surface of the dried elastic chip to prevent moisture from being released from the elastic chip or to prevent re-absorption of moisture into the elastic chip, or to delay the coating layer and to mix it with a moisture hardening type binder . The coating layer can be referred to as a non-moisture-proof coating layer in that it can prevent or delay moisture from being discharged from the elastic chip or reabsorption of moisture into the elastic chip.

In one aspect of the present invention, there is provided a method of manufacturing a semiconductor device, Forming a non-moisture-proof coating layer on the elastic chip; Mixing a moisture-curing one-pack type polyurethane binder with an elastic chip having a non-moisture-proof coating layer formed thereon; And discharging and packing the mixture out of the reactor; The present invention provides a method of manufacturing a one-pack type chip-binder packaging material.

In another aspect, the present invention provides a one-pack type chip-binder packaging material comprising an elastic chip formed with a non-moisture-proof coating layer and a one-component polyurethane binder.

In another aspect, the present invention more specifically provides a one-component chip-binder packaging material including an elastic chip and a binder on which a non-moisture type coating layer that emits anions is formed.

The present invention relates to a method of manufacturing an elastic chip, Forming a non-humid anion coating layer on the elastic chip, the non-moisture anion coating layer including anion generating stone and not causing moisture hardening; And mixing the elastic chips with a moisture-curing one-pack type binder to be packaged.

The step of drying the elastic chips is to prevent the moisture contained in the elastic chips from acting as a curing catalyst for moisture-curing polyurethane during storage. In the present invention, the drying may be performed in a hot air drier at about 80 to 120 ° C, preferably about 2 hours. When the thickness of the non-moisture-proof coating layer is thick or hydrophobic or water-repellent, it is possible to reduce the drying time of the elastic chips or to omit the drying process.

In the present invention, the elastic chip may be a rubber chip, a waste rubber chip, or a mixture thereof. The rubber chip and the waste rubber chip can use various elastic rubber chips. In the practice of the present invention, the rubber chip may use polyurethane, EPDM rubber. In another embodiment of the present invention, the waste rubber chip is an elastic chip obtained by crushing an elastic body, and there is no particular limitation on the material that can provide the elasticity. In the practice of the present invention, the waste rubber chip may be a waste tire, a waste polyurethane, a recycled EPDM rubber, or a mixture thereof, in which a large amount of recycled products are produced while having a sufficient elastic property. In a preferred embodiment of the present invention, the waste tire has a constant physical property, and therefore, it is preferable to crush the waste tire to a predetermined size. In another preferred embodiment of the present invention, in the case of the waste polyurethane, it is preferable to use a variety of urethane used for shoes, a refrigerator, a sheet, etc. by sorting and crushing and scrapping. In the present invention, it is preferable that the elastic chips have an average size of 0.1-10 mm, more preferably 1-9 mm, even more preferably 2-5 mm, so that the coating material can be uniformly coated. Of the average size. Further, it is preferable that the size of the rubber chip is constant so that it can be coated while being properly stirred.

In the present invention, the step of forming the non-moisture-generating anion coating layer including the anion generating stone on the elastic chip may include forming a coating layer capable of blocking moisture on the dried elastic chip, To prevent the moisture-curing polyurethane from being cured, and to prevent the moisture in the air from being reabsorbed in the elastic chips after drying.

In the present invention, although not being limited theoretically, the non-moisture-proof coating layer increases the storage period by delaying or preventing moisture from being discharged from the elastic chips of moisture or reabsorption of moisture into elastic chips.

In the present invention, the moisture-curing polyurethane binder is mixed with the one-pack type moisture-curing polyurethane binder for at least a period of at least 30 days, more preferably not less than 60 days, and most preferably not less than 90 days, .

In the present invention, the non-moisture-proof coating layer may be a coating material containing a hydrophobic material having a low moisture content, a water-repellent material or the like, or a coating material modified with fluorine, fluorine, silicone or the like so as to have hydrophobicity or water repellency. As the non-moisture-type coating agent, an acrylic resin, a urethane resin, an acryl-urethane resin, or the like containing fluorine, fluorine, silicon, or modified with fluorine, fluorine, silicon, etc. may be used. Preferably, it is preferable to use a urethane-based binder as a coating agent so as to increase the dependency between the elastic packaging agent and the moisture-curable one-component polyurethane binder.

In one embodiment of the present invention, the non-moisture-proof urethane binder can be formed by reacting a modified silicone oil having a NCO end with a reactor. For example,

In order to compensate for the disadvantages of the product, the silicone oil having the hydroxy group as the organic functional group in the modified silicone oil is capped with the calculated amount of isocyanate -NCO- group and then reacted with the remaining NCO- Bonded polyurethane is prepared and used.

In another embodiment of the present invention, the non-humidifying urethane coating agent may be a urethane coating comprising a water-repellent additive. The water-repellent additive is _{F (CF 2) 10 (CH} 2) 10 OH, F (CF 2) 10 (CH 2) 6 OH, F (CF 2) 10 (CH 2) 4 OH, F (CF 2) 8 ( CH ₂ ) ₁₀ OH, F (CF ₂ ) ₈ (CH ₂ ) ₆ OH, F (CF ₂ ) ₈ (CH ₂ ) ₄ OH.

In the present invention, the non-moisture-proof urethane binder is preferably used in an amount of 1 to 30 parts by weight, more preferably 2 to 20 parts by weight, based on 100 parts by weight of the rubber chip. If the amount of the binder is too small, tourmaline may not be coated on the elastic chip. If the amount of the binder is excessive, the rubber is coated on the rubber chip when the binder is stirred together with the rubber chip, It may cause a problem of hardening together with other binders.

In the present invention, the anion generating stone, e.g., tourmaline, is coated on an elastic chip and then used to neutralize the odor generated in the elastic chip by spinning an anion or the like and to generate negative ions on the elastic packaging surface. The tourmaline used in the practice of the present invention is a complex borosilicate having a chemical composition of iron, magnesium, an alkali metal or the like and aluminum, and is formed into a triangular columnar shape at the time of a hexagonal or nine-angular occasion, and a hardness of 7.0 to 7.5 , And a specific gravity of 2.98 to 3.20.

In the present invention, it is preferable that the tourmaline is put into a powder state in order to release a large amount of anion due to even dispersion and a large surface area of the mineral. The tourmaline powder may be prepared by grinding tourmaline stone to a particle size of about 100-600 mesh using a crusher, or it may be commercially purchased and used. The tourmaline powder is preferably dispersed in an organic phase dispersion medium, preferably an oil and / or an organic solvent, so that the tourmaline powder can be uniformly dispersed in an elastic chip. When the oil is used, it is preferable to use silicone oil having water repellency. The silicone oil exhibits properties such as shear resistance, low surface energy, and water repellency, thereby improving the physical properties of the elastic pavement surface. In a preferred embodiment of the present invention, the liquid tourmaline is preferably used by dispersing tourmaline powder in an oil dispersion medium in a liquid dispersion medium at 20-50 wt%.

In the practice of the present invention, the tourmaline is preferably used in an amount of 1 to 20 parts by weight, more preferably 5 to 10 parts by weight, based on 100 parts by weight of the rubber chip. If the amount of the liquid phase tourmaline is too small, it is not sufficiently dispersed in the elastic chips and a desired effect can not be obtained. If the amount is too much, the price is excessively increased and the elasticity of the elastic chips is deteriorated.

In the present invention, the liquid tourmaline and the water-repellent urethane resin can be separately introduced into the reactor and there is no difference according to the order of injection. In another embodiment of the present invention, the tourmaline and the urethane resin may be mixed in separate containers, and then introduced into the reactor at one time or continuously.

In the present invention, while the liquid crystalline tourmaline, pigment and acrylic or urethane resin are coated on the surface of the elastic chip and cured, the mixtures can be agitated through various devices. The stirrer may be a conventional stirrer installed in the reactor, or a reactor equipped with a stirrer. The stirrer is not particularly limited as long as it can provide an agitating force enough to prevent the elastic tourmaline chip from being blocked due to mutual bonding of liquid tourmaline, pigment and water repellent urethane resin coated on the elastic chip.

In the present invention, the coating step may be heated to a predetermined temperature so as to shorten the time for coating and curing the surface of the elastic chip with liquid tourmaline, water repellent urethane resin, and optionally pigment. In a preferred embodiment of the present invention, the mixed coating step is preferably carried out at a temperature of 40-110 占 폚, and most preferably 80 占 폚.

In the present invention, the step of mixing and packaging the elastic chips having the water-repellent coating layer with the moisture-curing one-component binder is completed by transferring the coated chips to a separate reaction tank and then kneading them with a moisture curing one-component binder.

In the present invention, as described in JP-A-2003-0018276, as the binder resin, a polyurethane prepolymer resin containing a moisture-curing polyurethane prepolymer resin, a moisture-curing latent curing agent, and a polyurethane containing a moisture-curing blocking amine The ratio of the chip to the binder may be kneaded in a range that is used in a conventional elastic chip, and is preferably 1-10-200 parts by weight, more preferably 20-50 parts by weight Wealth.

The packaging can be a known packaging material that can prevent the permeation of moisture, and can use nitrogen filled packing, vacuum packing, vinyl bag formed with silver foil on one side where air permeation amount is low.

According to the present invention, a new one-pack type chip-binder packaging material is provided. The packaging material according to the present invention is anion release type and has excellent storage stability and can be used in a state in which it is not cured even after storage for a long time.

Hereinafter, the present invention will be described in detail through examples.

Example

Example 1

Polyurethane chip drying step

A polyurethane chip having an average diameter of about 2 to 3 mm was dried in a hot air drier maintained at 80 DEG C and then 100 parts by weight of the dried chips were put into a reactor equipped with a stirrer and stirred while being maintained at 60 deg.

Anion Segregation Coating Step

The inside of the reactor was filled with nitrogen, and 5 parts by weight (solid content ratio: 0.5) of a tourmaline solution dispersed in silicone oil was injected by spraying for 30 minutes.

Non-moisture-proof polyurethane coating step

Separately, a two-necked flask equipped with a stirrer, a thermometer, a condenser and a water separator was charged with 5.2 kg of ω-perfluorodecyl-1-decyl alcohol [F (CF ₂ ) ₁₀ (CH ₂ ) ₁₀ OH], 2.0 kg of oleic acid, 7.7 × 10 ^-2 Kg of paratoluenesulfonic acid as a catalyst was dissolved in 60 l of toluene, and the mixture was heated to reflux at 110 ° C. for 6 hours. After the reaction, the reaction product was washed with a mixed solution of ethyl acetate and water (1: 1, v / v) to remove the catalyst and unreacted material, and the solvent was distilled under reduced pressure to give 5.7 kg (89%, mp 54) as a pale yellow condensate. C) was obtained. 10 parts by weight of a mixture (weight ratio 1: 100) of a mixture of the obtained fatty acid ester and a polyurethane binder (Daewoo Chemical Co., Ltd. UD-100) was added and the temperature was gradually raised to 100 캜 with stirring. After stirring for about 1 hour, the mixture was further cooled to 60 ° C and stirred for another 1 hour.

One-component chip-binder manufacturing

100 parts by weight of the prepared elastic chips were mixed with 40 parts by weight of a one-pack type polyurethane binder resin (HEPESCEM, VAROCOAT-ONE SP-60 VA) while being kept at 60 ° C and mixed for 30 minutes or more under nitrogen. Thereafter, the obtained chip-binder system was packaged in 20 kg units in a container coated with a vinyl-based resin capable of heat sealing by heat on both sides of a silver foil where air permeation did not occur. At this time, the contents were put in a vacuum, and the air in the container was removed by vacuum, followed by vacuum sealing using a heat sealing machine.

Example 2 (using a waste elastic chip)

Polyurethane chip drying step

A waste polyurethane chip having an average diameter of about 4 mm was dried in a hot air drier maintained at 80 DEG C and then 100 parts by weight of the dried chips were put into a reactor equipped with a stirrer and stirred while being maintained at 60 DEG C. [

Anion spot and pigment coating step

The inside of the reactor was filled with nitrogen, and 5 parts by weight (solid content ratio: 0.5) of a tourmaline solution dispersed in silicone oil was injected by spraying for 30 minutes. Thereafter, 5 parts by weight of a blue toner were sprayed to coat the chips.

Polyurethane coating step

One-component chip-binder manufacturing

Example 3 (Binder layer thickness improvement)

Polyurethane chip drying step

Anion Segregation Coating Step

Non-moisture-proof polyurethane coating step

And 50 parts by weight of a polyurethane binder (Daewoo Chemical Co., Ltd. UD-100) were charged, and then the temperature was gradually raised to 100 占 폚 while stirring. After stirring for about 1 hour, the mixture was further cooled to 60 ° C and stirred for another 1 hour.

One-component chip-binder manufacturing

Example 4

The same procedure was performed as in Example 1 except for omitting the step of coating an anionic esophagus

Example 5

The same procedure was performed as in Example 3, except that the step of coating an anionic esophagus was omitted.

Comparative Example 1

Polyurethane chip drying step

One-component chip-binder manufacturing

Comparative Example 2

Comparative Example 1 was carried out in the same manner as in Comparative Example 1, except that the chip was not dried.

The physical properties and storage stability were tested for Examples 1 to 5 and Comparative Examples 1 and 2, and the results are shown in Table 1. The storage stability was determined in accordance with time after being left in an oven at 50 ° C in a packed state, and physical properties of the coating film after curing were measured according to Korean Standard (KS) KS M 6518.

Item Practice 1 Practice 2 Conduct3 Practice 4 Conduct 5 Comparison 1 Comparison 2 Storage stability (day) 150 days ↑ 150 days ↑ 90 days 130 days 60 days 30 days 10 days Tensile (kg _f / cm ²⁾ 17 15 13 15 14 13 14 Elongation (%) 140 145 155 140 150 155 150 Hardness (HS) 55 53 50 53 52 52 53 Anion (ION / cc) 100 90 - 90 - - -

As in Examples 1 and 2, the silicone oil was included in the coating of the anion attack stone, and when the water repellent additive was also used in the non-moisture type coating, the storage stability was very high. In Example 3, the silicone oil contained in the coating of the anion attack stone contributed to the storage stability. In Example 4, the silicone oil was not used, but the water-repellent additive was added to the non-moisture-proof coating film. In the case of Example 5, the water repellent additive was not used in the non-moisture-proof coating film and the silicone oil used in the coating of the anion exchange coating was not present, but showed a certain level of storage stability. This is because the urethane coating layer prevents the release of water remaining in the chip and the moisture absorption amount is smaller than that of the elastic chip.

Claims

Drying the elastic chips;
Forming a non-humid anion coating layer on the elastic chip, the non-moisture anion coating layer including anion generating stone and not causing moisture hardening; And
Mixing the elastic chips with a moisture-curing one-component binder and packaging
Wherein the one-pack type chip-binder packaging material comprises at least one binder resin.

The method of claim 1, wherein the anionic nanoparticles are tourmaline nanoparticles.

The method for manufacturing a one-part chip-binder packaging material according to claim 1 or 2, wherein the elastic chip is a new material or a reclaimed chip.

The method of claim 3, wherein the non-moisture type anion coating layer formed on the reproducing chip is a color coating layer.

The method of claim 1, wherein the non-wetting type anion coating layer comprises a hydrophobic or water repellent additive.

The method of claim 1, wherein the non-moisture type anion coating layer is a urethane or acrylic resin modified with silicon, fluorine, or a fluorine component.

The method of claim 1, wherein the non-moisture-proof coating layer has a lower moisture content than the elastic chip.

Wherein a coating layer is formed on the surface of the elastic chip to prevent moisture from being discharged from the elastic chip or reabsorption of moisture into the elastic chip or to be delayed and mixed with a moisture hardening type binder to package the chip- Way.

And a one-pack type polyurethane binder are mixed and packaged in a one-pack type chip-binder packing material.

The one-pack type chip-binder packaging material according to claim 9, wherein the coating film is a coating film including anion generating stone.

The one-part chip-binder packing material according to claim 9, wherein the coating film comprises silicon, fluorine, and fluoro-based additives.

The one-part chip-binder packing material according to claim 9 or 10, wherein the coating film is a urethane or acrylic resin modified with silicon, fluorine, or fluoro.