KR20130015657A - Led lighting device with structure of heat sink having high heat disspation - Google Patents

Abstract

PURPOSE: An LED lighting device having a heat radiation performance maximization heatsink structure is provided to improve effect of heat radiation by maximizing contact area with air by arranging the maximum number of multiple curved shape heat radiation pins and heat spreading holes in the minimum space. CONSTITUTION: An LED device is formed in an LED lighting main body(10). The LED device is connected with a PCB substrate. A main heat radiation unit(30) is extended to surround the outside of the light-emitting direction of the LED device. A plurality of heat radiation pins(P2) have at least one different radius of curvature. The plurality of heat radiation pins are formed in the main heat radiation unit.

Description

Maximizing Heat Dissipation Performance LED lighting device with structure of heat sink having high heat disspation

The present invention relates to an LED lighting device having a heat sink maximizing heat dissipation performance, and more specifically, to improve the heat dissipation effect by maximizing the contact area with air by arranging the maximum number of the plurality of heat dissipation fins in a minimum space. The present invention relates to an LED lighting device having a maximized heat sink structure.

In general, cooling of high power light sources, for example high power light sources including light emitting diodes (LEDs) assembled in a small area and having a high power density is desirable, but such cooling is difficult to achieve.

Moreover, when the effective area is small, it is necessary to efficiently use the effective space between other functional parts of the lighting apparatus, for example, other functional parts such as a housing, an optical element, a driver substrate, and the like.

In addition, user-friendly thermal management is required with respect to noise or the flow of hot air.

In order to achieve these contradictory goals, LED lighting devices utilize heat sinks that arrange LEDs in a relatively large area and simultaneously perform heat dissipation.

Heat sinks are divided into passive and active. Passives typically provide relatively wide spaced cooling fins that are arranged around or under the light source and form air flow channels extending from the bottom to the top to allow for natural convection. Thus, typically, the exhaust port of hot air is placed around the fins such that the tail of the exhausted hot air is directed in the opposite direction to the direction of gravity.

In the case of the active type, it means a method of forcing air flow through a submount substrate to the heat sink side that is thermally connected to a high temperature light source.

In the case of both active and passive types, there is a continuous demand for technology development for more efficient heat dissipation through the structural design of the heat sink.

[Related Technical Literature]

1. Lighting system with heat sink and heat sink (Patent application number: 10-2007-0098010)

2. Heat sink and heat sink formation method (Patent Application No .: 10-2010-7016840)

In order to solve this problem, the present invention maximizes the heat dissipation performance by maximizing the contact area with air by arranging the maximum number of heat dissipation fins and thermal diffusion holes having a different curvature in a minimum space. It is to provide an LED lighting device having.

In addition, the present invention is to provide an LED lighting device having a heat dissipation performance maximizing heat sink structure to perform a stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit, the auxiliary heat dissipation unit.

However, the objects of the present invention are not limited to the above-mentioned objects, and other objects not mentioned can be clearly understood by those skilled in the art from the following description.

In order to achieve the above object, an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention includes: an LED lighting body mounted with an LED element connected to a PCB substrate; And a main heat dissipation unit which extends to surround the outer side of the light emitting direction of the LED element and in which a plurality of heat dissipation fins having at least one or more different curvatures are formed in a direction from the outer peripheral surface formed to extend to the outside.

The main heat dissipation portion is a guard circle for collecting a plurality of heat dissipation fins formed in the lower rounding process; And a plate-shaped cap for supporting and protecting the plurality of heat dissipation fins from the bottom.

The main heat dissipation unit may be formed in a plurality of first heat dissipation member and the second heat dissipation member alternately arranged along the outer circumferential surface and spaced apart at equal intervals on the outer circumferential surface, and have a radial structure in the light emitting direction of the LED element. desirable.

The first heat dissipation member may include: a first heat diffusion hole formed through a diffusion plate formed at an upper end of the cap; A first round pin formed around the outer circumferential surface of the first thermal diffusion hole in a vertically placed plate shape; And a first diffusion pin formed of two curved pins that are bent in a direction toward the first round pin around both sides of the first round pin in a vertically elevated plate shape, wherein the first diffusion pin has a first curvature. It includes a first diffusion pin a having a, and a first diffusion pin b having a second curvature.

In addition, it is preferable that the first heat diffusion hole has two curves L1 and L2 forming holes to meet the center end C1 and the outer end C2 to form different curvatures.

In addition, the curvature of the central end (C1) is preferably larger than the curvature of the outer edge (C2).

In addition, it is preferable that the first round pin has a lower plate-like height from a portion surrounding the central end C1 to a portion surrounding the outer end C2.

In addition, it is preferable that the height of the plate shape of the first diffusion pin is lowered from the cylindrical shape forming the main heat dissipation portion toward the outside.

In addition, it is preferable that the first round pin is lower than the first diffusion pin at a point in the direction from the cylindrical shape forming the main heat dissipation portion to the outside.

In addition, the first round pin and the first diffusion pin are each formed with a curved edge, it is preferable that the protruding degree is formed to decrease toward the outside.

Thereby, the thermal diffusion provides the effect that the first round pin and the first diffusion pin is not limited to the edge but evenly distributed.

The second heat dissipation member may include a second heat diffusion hole formed in the same shape as the first heat diffusion hole; A second round pin having a direction perpendicular to the second curvature in a vertically placed plate shape and surrounding at least two or more surfaces of the outer circumferential surface of the first thermal diffusion hole; And a curved pin portion formed in a predetermined number on one side of the second round pin in the same direction as the second curvature.

The curved pin portion may be formed of a first curved pin, a second curved pin, and a third curved pin, and each of the first curved pin, the second curved pin, and the third curved pin has the same or different curvature. It is preferable to form.

In addition, it is preferable that the curved pin portion is gradually lowered from the lower end of the LED lighting body to the junction portion with the guard circle.

The second heat dissipation member may include a first joint pin J1 connecting the first curved pin and the second curved pin in a vertically placed plate shape; And a second joint pin J2 connecting the second curved pin and the third curved pin in a vertically placed plate shape, thereby widening the thermal diffusion area from the first curved pin to the third curved pin. Provide effect.

In addition, the third curved pin is formed in a curved shape bent in a direction different from the first diffusion pin a of the first diffusion pin, it is preferably bonded to the first diffusion pin a.

The first curved fin and the second curved fin between the first round fin and the first diffusion fin of the first heat dissipating member, between the second round fin and the first curved fin of the second heat dissipating member. Auxiliary thermal diffusion holes are respectively penetrated between the fins and between the second curved fins and the third curved fins to maximize contact with air.

In another embodiment, between the first curved pin and the second curved pin, two auxiliary heat diffusion holes are formed on both sides of the first joint pin, and between the second curved pin and the third curved pin. In the above, it is preferable that two auxiliary heat diffusion holes are formed on both sides of the second joint pin.

In addition, the second round pin and the curved pin portion is formed by curved corners, respectively, and the degree of protrusion is formed to decrease toward the outside, so that the heat diffusion is not limited to the edge of the second round pin and the curved pin portion It provides the effect of being evenly distributed.

The LED lighting apparatus having the heat dissipation maximizing heat sink structure may further include an auxiliary heat dissipating unit formed between the LED lighting main body and the main heat dissipating unit.

In addition, the auxiliary heat dissipation unit is preferably formed of a plurality of plate-shaped heat dissipation fins are formed in a vertical plane angled by a predetermined angle in a linear direction from the outer peripheral surface to the outside.

In addition, the heat dissipation fins of the auxiliary heat dissipation unit are preferably formed to be spaced apart from each other at equal intervals.

In addition, the heat radiation fin of the auxiliary heat dissipation portion is formed by curved corners, and the degree of protrusion is formed to decrease toward the outside, thereby providing an effect of increasing the thermal diffusion area.

In addition, the LED lighting body is formed in a shape in which the diameter of the cylindrical or cylindrical increases toward the bottom, it is preferable that the corner of the top is formed in a curve.

LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention, by maximizing the contact area with air by arranging the maximum number of the plurality of heat radiation fins and thermal diffusion holes having different curvature in a minimum space It provides the effect of maximizing heat dissipation effect.

In addition, the LED lighting device having a heat sink maximizing heat dissipation performance according to another embodiment of the present invention, provides the effect of maximizing the heat dissipation performance to perform stepwise heat dissipation in a multi-stage structure of the main heat dissipation unit and the auxiliary heat dissipation unit.

1 is a plan view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 2 is a perspective view showing an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 3 is a front view of the LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
Figure 4 is a rear view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
5 is a left side view (a) and a right side view (b) of the LED lighting apparatus having a heat sink maximizing heat sink structure according to an embodiment of the present invention.
Figure 6 is a bottom view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.
7 is a view showing a heat radiation performance simulation results for the LED lighting device having a heat sink maximizing heat sink structure according to an embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a detailed description of preferred embodiments of the present invention will be given with reference to the accompanying drawings. In the following description of the present invention, detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

1 is a plan view of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. Figure 2 is a perspective view showing an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. 3 is a front view of an LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. Figure 4 is a rear view of the LED lighting device having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention. 5 is a left side view (a) and a right side view (b) of the LED lighting apparatus having a heat sink maximizing heat sink structure according to an embodiment of the present invention. 6 is a bottom view of an LED lighting apparatus having a heat sink maximizing heat dissipation performance according to an embodiment of the present invention.

1 to 6, the LED lighting apparatus having a heat sink maximizing heat dissipation performance includes an LED lighting body 10, an auxiliary heat dissipating unit 20, and a main heat dissipating unit 30. The auxiliary heat dissipation unit 20 and the main heat dissipation unit 30 form a heat sink structure.

The LED lighting body 10 is formed in a shape in which the diameter of a cylinder or cylinder increases toward the front end, and a PCB substrate and an LED element connected to the PCB substrate are mounted in the housing. As shown in the LED lighting body 10, the upper edge is formed in a curved line.

More specifically, the LED lighting body 10 is a heat generating part, similar to a bell shape, and forms at least one curvature part in a direction from the center to the outside.

The auxiliary heat dissipation unit 20 is formed in a cylindrical shape extending from the LED light main body 10 at the front end of the LED light main body 10 and is configured to partially dissipate heat transferred to the main heat dissipation unit 30 to the outside. do.

The auxiliary heat dissipation unit 20 includes an auxiliary heat dissipation fin part 22 formed by collecting a plurality of auxiliary heat dissipation fins 21 arranged on the outer circumferential surface of the cylindrical shape.

More specifically, the auxiliary heat dissipation fin part 22 has a vertical length shorter than the main heat dissipation part 30 at the upper end of the main heat dissipation part 30.

Each of the auxiliary heat dissipation fins 21 constituting the auxiliary heat dissipation fins 22 is formed in a rectangular plate shape in which a vertical plane forms an angle by a predetermined angle in a linear direction facing outward from a cylindrical outer circumferential surface.

The corner of the auxiliary heat dissipation fin 21 is formed to be curved, so that the degree of protrusion is reduced toward the outside.

As a result, the heat diffusion is not limited to the edges of the auxiliary heat dissipation fins 21, but provides the effect of being evenly distributed.

In another embodiment of the present invention, each of the auxiliary radiating fins 21 may be formed to extend while having a curvature toward the outside in a curved manner.

The main heat dissipation unit 30 is formed in a cylindrical shape having a shorter circumference than the auxiliary heat dissipation unit 20 in order to maximize the discharge of residual heat in the state partially radiated primarily from the auxiliary heat dissipation unit 20 to the outside.

The main heat dissipation unit 30 is formed of a plurality of first heat dissipation member (P1) and the second heat dissipation member (P2) alternately arranged at equal intervals on the outer circumferential surface alternately, the overall heat dissipation member 30 from the top to the bottom for heat transfer efficiency Has a radial structure.

In addition, the main heat dissipation portion 30 is rounded around the lower portion by a short cylindrical guard circle 39, and is formed in a structure in which the lower portion is supported by the cap 40 in the form of a disk.

The first heat dissipation member P1 is formed at both sides of the second heat dissipation member P2 and includes a first heat diffusion hole 31, a first round fin 32, and a first diffusion fin 33.

The first thermal diffusion hole 31 is formed through the diffusion plate D formed at the upper end of the cap 40 of the main heat dissipation unit 30. As illustrated in FIG. 1, the first heat diffusion hole 31 has two curves L1 and L2 formed at the center end C1 and the outer end C2 to form different curvatures. It is preferable that the curvature of the center end C1 is larger than the curvature of the outer end C2.

The first round pin 32 is formed around the outer circumferential surface of the first heat diffusion hole 31, and is formed to have a shorter height from the portion surrounding the central end C1 to the outer end C2.

The first diffusion pin 33 is a first diffusion pin a (33a) and the first diffusion pin b (two curved pins bent toward both sides of the first round pin 32, the first round pin 32) 33b).

The first diffusion pin 33 is formed in a shape in which the height is lowered from the cylindrical shape constituting the main heat dissipation part 30 toward the outside.

The corners of the first round fin 32 and the first diffusion fin 33 of the first heat dissipation member P1 are curved to be formed, and the protruding degree decreases toward the outside.

This provides the effect of allowing the heat diffusion to be evenly distributed without concentrating on the edges of the first round fin 32 and the first diffusion fin 33.

The second heat dissipation member P2 is formed at both sides of the first heat dissipation member P1, and the second heat diffusion hole 34, the second round fin 35, the first curved fin 36, and the second curved fin ( 37) and a third curved pin 38.

The second heat diffusion hole 34 is formed through the diffusion plate D formed at the upper end of the cap 40 of the main heat dissipation part 30 in the same manner as the first heat diffusion hole 31 so that two curves are formed at the center end C1. It meets at the outer edges and forms different curvatures.

The second round pin 35 is formed around the outer circumferential surface of the second heat diffusion hole 34, and the portion surrounding the center end and the portion surrounding the outer edge of the second heat diffusion hole 34 are set lower than both sides or removed. Is formed.

The first curved pin 36, the second curved pin 37 and the third curved pin 38 are sequentially formed on one side of the second round pin 35, each formed of a curve having the same or different curvature. do.

The first curved fin 36, the second curved fin 37 and the third curved fin 38 are gradually lowered from the lower end of the cylindrical auxiliary heat dissipation portion 20 to the junction with the guard circle 39. Loss is formed in a curve.

Further, a plate-shaped first joint pin J1 is formed vertically like the first and second curved pins 36 and 37 connecting the first curved pin 36 and the second curved pin 37. The first joint pin J1 is formed in a form extending from the inner side of the first curved pin 36 to the outer side of the second curved pin 37.

Similarly, plate-shaped second joint pins J2 are formed vertically like second and third curve pins 37 and 38 connecting the second curved pin 37 and the third curved pin 38. .

The first joint pin J1 and the second joint pin J2 provide an effect of widening the thermal diffusion area from the first curved pin 36 to the third curved pin 38.

Finally, as shown in FIG. 3, the third curved pin 38 is formed in a curved shape having a direction different from that of the first diffusion pin a 33a among the first diffusion pins 33 to form the first diffusion pin a ( 33a).

Meanwhile, between the first round fin 32 and the first diffusion fin 33 of the first heat dissipation member P1, and the second round fin 35 and the first curved fin 36 of the second heat dissipation member P2. ) And between the first curved pin 36 and the second curved pin 37, and between the second curved pin 37 and the third curved pin 38 are formed through the secondary thermal diffusion hole, respectively.

In particular, between the first curved pin 36 and the second curved pin 37, and between the second curved pin 37 and the third curved pin 38 are respectively the first joint pin (J1) and the second joint Since it is divided into pins J2, two auxiliary thermal diffusion holes are formed through the holes.

The secondary thermal diffuser formed in this structure provides the effect of maximizing contact with air.

Corners of the second round fin 35, the first curved fin 36, the second curved fin 37, and the third curved fin 38 of the second heat dissipation member P2 are curved to protrude. The degree is formed to decrease toward the outside.

This provides the effect of dissipating the heat spread evenly without being concentrated at the edges of the second round pin 35, the first curved pin 36, the second curved pin 37 and the third curved pin 38. do.

7 is a view showing a heat radiation performance simulation results for the LED lighting device having a heat sink maximizing heat sink structure according to an embodiment of the present invention.

Maximizing the heat dissipation performance including the auxiliary heat dissipation unit 20 and the main heat dissipation unit 30 In order to confirm only the heat dissipation performance of the heat sink, all unnecessary mechanisms were removed and simulations were performed. Analysis conditions were set as shown in Table 1 below.

Interpretation condition Outside temperature 20 degrees Solve area 216m Heat Source 120 W Outdoor conditions None (natural convection) Heatsink material ALDC12 Heatsink weight 2 kg

The results for this are shown in Table 2 below.

Simulation result PCB board 109 degrees Heat sink top temperature (power supply): auxiliary heat sink (20) 101 degrees Lowest temperature in heat sink 93 degrees Temperature difference of heat sink 16 degrees

As described above, preferred embodiments of the present invention have been disclosed in the present specification and drawings, and although specific terms have been used, they have been used only in a general sense to easily describe the technical contents of the present invention and to facilitate understanding of the invention , And are not intended to limit the scope of the present invention. It is to be understood by those skilled in the art that other modifications based on the technical idea of the present invention are possible in addition to the embodiments disclosed herein.

10: LED lighting body 20: auxiliary radiator
21: auxiliary heat dissipation fin 22: auxiliary heat dissipation fin
30: main heat dissipation unit P1: first heat dissipation member
P2: second heat dissipation member 31: first heat diffusion hole
32: first round pin 33: first diffusion pin
34: second heat diffusion hole 35: second round pin
36: first curved pin 37: second curved pin
38: third curved pin 39: guard circle
J1: first joint pin J2: second joint pin
40: cap

Claims (25)

LED lighting body mounted with the LED element connected to the PCB substrate; And
A main heat dissipation unit extending to surround an outer portion of the light emitting direction of the LED device and having a plurality of heat dissipation fins having at least one or more different curvatures in a direction toward the outside from the outer peripheral surface formed to extend; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it comprises a.
The method according to claim 1, wherein the main heat dissipation unit,
A guard circle for collecting a plurality of heat dissipation fins formed at a lower portion of a rounding process; LED lighting device having a heat sink maximized heat dissipation performance, characterized in that it further comprises.
The method according to claim 2, wherein the main heat dissipation unit,
A plate-shaped cap for supporting and protecting the plurality of heat dissipation fins from the bottom; LED lighting device having a heat sink maximized heat dissipation performance, characterized in that it further comprises.
The method according to claim 3, wherein the main heat dissipation unit,
The first heat dissipation member and the second heat dissipation member disposed on the outer circumferential surface at equal intervals from each other are alternately formed along the outer circumferential surface and formed in plural, and has a radial structure in the light emitting direction of the LED element. LED lighting device with heat sink structure for maximum performance.
The method according to claim 4, wherein the first heat dissipation member,
A first thermal diffusion hole formed through the diffusion plate formed at an upper end of the cap;
A first round pin formed around the outer circumferential surface of the first thermal diffusion hole in a vertically placed plate shape; And
A first diffusion pin formed of two curved pins bent in a direction toward the first round pin around both sides of the first round pin in a vertically elevated plate shape; LED lighting device having a heat sink maximizing heat dissipation performance, comprising a.
The method of claim 5, wherein the first diffusion pin,
A first diffusion pin a having a first curvature; And
LED lighting device having a heat sink maximizing heat sink structure comprising a first diffusion pin b having a second curvature.
The method of claim 6, wherein the first thermal diffusion hole,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the two curves (L1 and L2) forming a hole meets the center end (C1) and the outer end (C2) to form a different curvature.
The curvature of the center stage C1 is
LED lighting device having a heat sink maximized heat sink structure, characterized in that greater than the curvature of the outer edge (C2).
The method according to claim 8, wherein the first round pin,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the height of the plate shape is lowered from the portion surrounding the center end (C1) to the portion surrounding the outer end (C2).
The method of claim 6, wherein the first diffusion pin,
LED illumination device having a heat sink maximizing heat sink structure, characterized in that the height of the plate shape is lowered from the cylindrical shape forming the main heat dissipation portion toward the outside.
The method of claim 10, wherein the first round pin,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the height is lower than the first diffusion pin at the time point toward the outside from the cylindrical shape forming the main heat dissipation unit.
The method according to claim 5, wherein the first round pin and the first diffusion pin,
Each corner is curved and formed, LED protrusion having a heat sink maximizing heat sink structure, characterized in that the degree of protruding is formed to decrease toward the outside.
The method according to claim 6, wherein the second heat dissipation member,
A second thermal diffusion hole formed in the same shape as the first thermal diffusion hole;
A second round pin having a direction perpendicular to the second curvature in a vertically placed plate shape and surrounding at least two or more surfaces of the outer circumferential surface of the first thermal diffusion hole; And
Curved pin portions formed in a predetermined number on one side of the second round pin in the same direction as the second curvature; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it comprises a.
The method according to claim 13, wherein the curved pin portion,
It is formed of a first curved pin, a second curved pin and a third curved pin,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that each of the first curved fin, the second curved fin and the third curved fin is formed in a curve having the same or different curvature.
The method according to claim 13, wherein the curved pin portion,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the height is gradually lowered from the bottom of the LED lighting body to the junction with the guard circle.
The method according to claim 14, wherein the second heat dissipation member,
A first joint pin J1 connecting the first curved pin and the second curved pin in a vertically placed plate shape; And
A second joint pin J2 connecting the second curved pin and the third curved pin in a vertically placed plate shape; LED lighting device having a heat sink maximized heat dissipation performance, characterized in that it further comprises.
The method of claim 16, wherein the third curved pin,
LED lighting apparatus having a heat sink maximizing heat sink structure, characterized in that formed in a curved shape bent in the direction different from the first diffusion pin a of the first diffusion pin, the first diffusion pin a.
18. The method of claim 17,
Between the first round fin and the first diffusion fin of the first heat dissipation member,
Between the second round fin and the first curved fin of the second heat dissipation member,
Between the first curved pin and the second curved pin,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the auxiliary heat diffusion hole is formed through each of the second curved pin and the third curved pin.
19. The method of claim 18,
Between the first curved pin and the second curved pin,
Two auxiliary heat diffusion holes are formed on both sides of the first joint pin,
Between the second curved pin and the third curved pin,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that the two auxiliary heat diffusion holes are formed on both sides of the second joint pin.
The method according to claim 13, wherein the second round pin and the curved pin portion,
Each corner is curved and formed, LED protrusion having a heat sink maximizing heat sink structure, characterized in that the degree of protruding is formed to decrease toward the outside.
The method according to claim 1,
An auxiliary heat dissipation unit formed between the LED lighting body and the main heat dissipation unit; LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that it further comprises.
The method according to claim 20, The auxiliary heat dissipation unit,
LED lighting device having a heat sink maximizing heat sink structure, characterized in that a plurality of plate-shaped heat dissipation fins forming a vertical angle as a predetermined angle in a linear direction from the outer peripheral surface to the outside.
The heat dissipation fin of claim 22, wherein
LED lighting device having a heat sink maximizing heat dissipation performance, characterized in that is formed spaced apart from each other at equal intervals.
The heat dissipation fin of claim 22, wherein
The corner is curved is formed, the LED lighting device having a heat sink maximizing heat sink structure, characterized in that the degree of protrusion is formed to decrease toward the outside.
The method according to claim 1, wherein the LED lighting body,
The diameter of the cylindrical or cylindrical is formed in a shape that increases toward the bottom, LED lighting device having a heat sink maximizing heat sink structure, characterized in that the upper edge is formed in a curve.

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