KR20130014113A - Cooling structure of electric power supply and water purifier having the same - Google Patents

Abstract

PURPOSE: A cooling structure of a power supply device and a water purifier having the same are provided to easily cool the power supply device without an extra cooling unit by cooling the power supply device with a part of air cooling a thermoelectric module included in an electronic cooling unit. CONSTITUTION: An electronic cooling unit(200) includes a thermoelectric module, a cold sink, a heat sink(230), and a fan(240). The cold sink is connected with a side of the thermoelectric module. The heat sink is connected with the other side of the thermoelectric module. A power supply device(300) is electrically connected with the electronic cooling unit. A cold water tank(CT) is connected with a plurality of water filters included in a water purifier(WP). [Reference numerals] (AA) Air

Description

Cooling structure of power supply device and water purifier with same {COOLING STRUCTURE OF ELECTRIC POWER SUPPLY AND WATER PURIFIER HAVING THE SAME}

The present invention relates to a cooling structure of a power supply device for supplying electric power to an electronic cooling unit including a thermoelectric module and a water purifier having the same. More specifically, at least a part of the air cooling the thermoelectric module included in the electronic cooling unit. The present invention relates to a cooling structure of a power supply device configured to cool an electric power supply device for supplying power to an electronic cooling unit and to cool the power supply device without a separate cooling means, and a water purifier having the same.

Recently, as consumer demand for kitchen design grows, miniaturization of products such as water purifiers that can be placed in kitchens is in progress.

On the other hand, the water purifier includes not only one or more water purification filters for filtering the introduced water into purified water, but also a cold water tank configured to cool the filtered water to make cold purified water or a hot water tank configured to heat the filtered water to make warm water. It is provided.

Conventionally, in order to cool the filtered water to make cold purified water, it is included in a refrigeration system in which a refrigerant flows and an evaporator in which a cold refrigerant flows is provided in a cold water tank. The refrigeration system including the evaporator includes a compressor, a condenser, a capillary tube, or an expansion valve in addition to the above-mentioned evaporator. Therefore, when the above-mentioned refrigeration system is used to cool the filtered water to form cold purified water, there is a problem in that it is difficult to miniaturize the product.

As described above, in addition to cooling the filtered water using a refrigerating system, when the power is applied, the filtered water may be cooled by using a thermoelectric module including a thermoelectric element that is cooled on one side and heated on the other side. This cooling method is called an electronic cooling method. In addition, in the electronic cooling method, a power supply device electrically connected to the thermoelectric module is required to supply power to the thermoelectric module.

In the electronic cooling method, since the cooling is performed by supplying power to the thermoelectric module as described above, a relatively large amount of power is required. Accordingly, there is a problem that a relatively large amount of heat is generated in the power supply device. And for this purpose, there is a problem that a separate cooling means such as a fan for cooling the power supply device is required. Thereby, there also exists a problem that miniaturization of products, such as a water purifier mentioned above, is difficult. In addition, since additional power is required for driving a separate cooling means for cooling the power supply device, there is a problem in that energy efficiency of a product such as a water purifier is lowered.

The present invention is realized by recognizing at least any one of the above-mentioned conventional needs or problems.

One aspect of the present invention is to at least a portion of the air cooling the thermoelectric module included in the electronic cooling unit to cool the power supply for supplying power to the electronic cooling unit.

Another aspect of the object of the present invention is to cool the power supply without having a separate cooling means.

Another aspect of the object of the present invention is to enable the miniaturization of the product.

Another aspect of the object of the present invention is to increase the energy efficiency.

The cooling structure of the power supply apparatus according to an embodiment for realizing at least one of the above problems may include the following features.

The present invention is basically based on a configuration configured to cool at least a portion of air cooled by a thermoelectric module included in the electronic cooling unit to a power supply unit supplying power to the electronic cooling unit.

A cooling structure of a power supply apparatus according to an embodiment of the present invention is a cooling structure of a power supply device configured to cool a power supply device electrically connected to an electronic cooling unit including a thermoelectric module, wherein at least a portion of the cooling structure is cooled. May be configured to cool the power supply by causing air to flow into the power supply.

In this case, the electronic cooling unit cold sink connected to one side of the thermoelectric module; A heat sink connected to the other side of the thermoelectric module; And a fan provided in the heat sink to allow external air to flow into the heat sink to cool the thermoelectric module and to flow out to the outside. . ≪ / RTI >

In addition, the power supply is located on the air outlet side of the heat sink can be directly cooled by the air discharged from the heat sink.

The air introduced into the heat sink is discharged to both sides of the heat sink, and the power supply device may be located at one side of both sides of the heat sink.

In addition, the power supply device is formed with a plurality of air inlet through which the air flows in, the power supply can be positioned so that the air outlet faces one side of both sides of the heat sink.

An air guiding means may be provided between the heat sink and the power supply device so that at least a portion of the air flowing out from the heat sink flows to the power supply device to cool the power supply device.

In addition, one side of the air guide means may be located on the air outlet side of the heat sink and the other side may be located in the power supply device.

Then, the air introduced into the heat sink is discharged to both sides of the heat sink, one side of the air guide means may be located on one side of both sides of the heat sink.

In addition, the other side of the air guide means may be located at the air outlet of some of the plurality of air outlets formed in the power supply so that the air flows in and out.

One side of the air guide means may have a larger cross-sectional area than the other side of the air guide means.

In addition, the air guide means may be a duct.

In addition, the duct may be open at one surface thereof to form an air flow path between the device and the power supply device.

In addition, the power supply device may be located above the electronic cooling unit.

The power supply device may be a switched-mode power supply (SMPS).

In addition, the heat sink may include a plurality of heat dissipation members, and air may flow between the plurality of heat dissipation members.

Water purifier according to an embodiment of the present invention a plurality of water filters for filtering water; A cooling tank connected to the plurality of water filters; An electronic cooling unit provided in the cold water tank and including a thermoelectric module to cool the water contained in the cold water tank; And a cooling structure of the above-described power supply device to cool the power supply device electrically connected to the electronic cooling unit. As shown in FIG.

As described above, according to an embodiment of the present invention, at least a part of the air cooling the thermoelectric module included in the electronic cooling unit may cool the power supply device supplying power to the electronic cooling unit.

In addition, according to an embodiment of the present invention, it is possible to cool the power supply without having a separate cooling means.

In addition, according to the embodiment of the present invention, it is possible to miniaturize the product.

In addition, according to the embodiment of the present invention, it is possible to increase energy efficiency.

1 is a perspective view showing an internal configuration of a water purifier to which an embodiment of a cooling structure of a power supply device according to the present invention is applied.
2 is a perspective view showing an internal configuration of a water purifier to which another embodiment of a cooling structure of a power supply device according to the present invention is applied.
3 is a perspective view illustrating a cold water tank to which an electronic cooling unit to which electric power is supplied is connected to a power supply device to be cooled according to an embodiment of a cooling structure of a power supply device according to the present invention.
Figure 4 is a perspective view showing the internal configuration of the cold water tank to which the electronic cooling unit is connected to the power supply to be cooled and supplied with power according to one embodiment of the cooling structure of the power supply device according to the present invention.

In order to help the understanding of the features of the present invention as described above, it will be described in more detail with respect to the cooling structure of the power supply apparatus according to the embodiment of the present invention.

Hereinafter, exemplary embodiments will be described based on embodiments best suited for understanding the technical characteristics of the present invention, and the technical features of the present invention are not limited by the illustrated embodiments, It is to be understood that the present invention may be implemented as illustrated embodiments. Accordingly, the present invention may be modified in various ways within the technical scope of the present invention through the embodiments described below, and such modified embodiments fall within the technical scope of the present invention. In order to facilitate understanding of the embodiments to be described below, in the reference numerals shown in the accompanying drawings, among the constituent elements which perform the same function in each embodiment, the related constituent elements are indicated by the same or an extension line number.

Embodiments related to the present invention are based on a configuration in which at least a portion of air cooled by a thermoelectric module included in the electronic cooling unit is configured to cool the power supply unit by flowing to a power supply unit supplying power to the electronic cooling unit. do.

1 and 2, the power supply device 300 to be cooled by the cooling structure of the power supply device according to the present invention is the thermoelectric module 210 as shown in the embodiment shown in Figs. It may be electrically connected to the electronic cooling unit 200 including. Accordingly, the power supply device to the electronic cooling unit 200, that is, to the thermoelectric module 210 or the fan 240 included in the electronic cooling unit 200 as shown in the embodiment shown in Figures 3 and 4 described later. Power may be supplied by 300.

The power supply 300 may be, for example, a switched-mode power supply (SMPS). However, the power supply device 300 is not limited thereto, and any power may be used as long as it can supply power to the electronic cooling unit 200 including the thermoelectric module 210.

3 and 4, the electronic cooling unit 200 supplied with power by the power supply device 300 may be provided in the cold water tank CT. In addition, the cold water tank CT may be provided in the water purifier WP as shown in FIGS. 1 and 2. And, although not shown cold water tank (CT) may be provided in the water purifier (WP) may be connected to a plurality of water filters for filtering water. Accordingly, the water filtered while passing through the plurality of purified water filters may be accommodated in the cold water tank CT. The water contained in the cold water tank CT may be cooled by the electronic cooling unit 200 including the thermoelectric module 210.

However, the electronic cooling unit 200 may be provided anywhere where the solid or fluid such as an ice maker is cooled, as well as the cold water tank CT. In addition, the cold water tank CT equipped with the electronic cooling unit 200 may also be provided at any place where water is cooled, such as an ice maker or an ionizer, as well as a water purifier WP.

Hereinafter, the electronic cooling unit 200 is provided in the cold water tank CT provided in the water purifier WP as shown in FIGS. 1 and 2 and the cold water tank as shown in FIGS. 3 and 4. The example used for cooling the water accommodated in (CT) is demonstrated.

The electronic cooling unit 200 may include a cold sink 220, a heat sink 230, and a fan 240 as well as the thermoelectric module 210 described above as shown in FIGS. 3 and 4. have.

The thermoelectric module 210 may include a thermoelectric element. When power is supplied to the thermoelectric module 210 by the aforementioned power supply device 300, one side of the thermoelectric module 210, that is, one side of the thermoelectric module 210 to which the cold sink 220 is connected as will be described later. Can be cooled. The other side of the thermoelectric module 210, that is, the other side of the thermoelectric module 210 to which the heat sink 230 is connected as described below, may be heated. That is, heat may be transferred from one side of the thermoelectric module 210 to the other side of the thermoelectric module 210 by the power supplied to the thermoelectric module 210.

In addition, the cold sink 220 may be connected to one side of the thermoelectric module 210 as shown in FIGS. 3 and 4. In addition, the cold sink 220 may be connected to the cover plate (P) of the cold water tank (CT) by the connection member (C) as shown in the illustrated embodiment. In addition, the heat conduction member HC may be connected to the cover plate P by the aforementioned connection member C. The heat conductive member HC may be located inside the cold water tank CT as shown in the illustrated embodiment.

Therefore, when power is supplied to the thermoelectric module 210 by the power supply device 300 as described above, heat is transferred from the other side of the thermoelectric module 210 from one side of the thermoelectric module 210 to the One side is cooled. The thermoelectric module having a relatively low temperature is passed through the heat conducting member HC, the cover plate P, and the cold sink 220 from the water contained in the cold water tank CT having a relatively higher temperature than one side of the thermoelectric module 210. Heat is transferred to one side of 210.

3 and 4, the heat sink 230 may be connected to the other side of the thermoelectric module 210. In addition, the heat sink 230 may be provided with a fan 240 as shown in the illustrated embodiment. Then, when the power is supplied to the thermoelectric module 210 by the power supply device 300 as described above, the heat transferred to one side of the thermoelectric module 210 from the water contained in the cold water tank CT as described above The other side of the thermoelectric module 210 is transferred to the heat sink 230. As a result, the temperature of the heat sink 230 is increased to be higher than the ambient temperature.

In this state, when power is supplied to the fan 240 by the power supply device 300, the fan 240 is driven. By driving the fan 240 as described above, the outside air flows into the heat sink 230 as shown in FIGS. 1 and 2. In addition, the air introduced into the heat sink 230 is relatively lower in temperature than the heat sink 230 in which the temperature is increased due to heat transfer as described above. Therefore, heat is transferred from the heat sink 230 to the air introduced into the heat sink 230. That is, the temperature of the air is raised. In addition, the air whose temperature is raised by the heat transfer from the heat sink 230 flows out from the heat sink 230 to the outside. As a result, the heat sink 230 is cooled and the thermoelectric module 210 connected to the heat sink 230 may be cooled.

To this end, the heat sink 230 may be provided with a plurality of heat dissipation members 231 as shown in FIGS. 1 to 4. Therefore, heat transferred to the heat sink 230 by the thermoelectric module 210 is transferred to the plurality of heat dissipation members 231. As described above, when external air flows into the heat sink 230 by driving the fan 240, the introduced air flows from the plurality of heat dissipation members 231 while flowing between the plurality of heat dissipation members 231. After the heat is received, it will flow out. Accordingly, the plurality of heat dissipation members 231 may be cooled to cool the heat sink 230.

As shown in FIGS. 1 and 2, the cooling structure of the power supply apparatus according to the present invention allows at least some air to cool the thermoelectric module 210 to flow to the power supply apparatus 300 as described above. It may be configured to cool the power supply 300. That is, as described above, the air flowing into the heat sink 230 and receiving heat from the heat sink 230 may have a relatively lower temperature than the temperature of the power supply device 300 even though the temperature is increased. Therefore, when the air flowing into the heat sink 230 is caused to flow to the power supply device 300, heat can be transferred from the power supply device 300 to the air, thereby cooling the power supply device 300.

Accordingly, the power supply device 300 may be cooled without providing a separate cooling means such as a fan (not shown) other than the fan 240 included in the electronic cooling unit 200 described above. As such, since it is not necessary to provide a separate cooling means for cooling the power supply device 300, the electronic cooling is supplied by the power supply device 300 as shown in the embodiment shown in Figs. It may be possible to miniaturize a product such as a water purifier (WP) that may be provided with a cold water tank (CT) having a portion 200 is provided. In addition, since the electric power supply device 300 does not need to supply additional power to a separate cooling means such as a fan other than the fan 240 included in the electronic cooling unit 200 described above, energy efficiency can be increased. have.

To this end, as shown in the embodiment shown in Figure 1, the power supply device 300 may be located on the air outlet side of the heat sink 230. Accordingly, the air flowing into the heat sink 230 and cooling the heat sink 230 flows to the power supply device 300 to directly cool the power supply device 300 as in the above-described and illustrated in FIG. 1. It can be leaked to the outside after.

Air introduced into the heat sink 230 may flow to both sides of the heat sink 230 as shown in FIG. 1. In this case, the power supply 300 may be located at one side of both sides of the heat sink 230 as shown in the illustrated embodiment. And, as shown in the embodiment shown in Figure 1, the power supply device 300 may be formed with a plurality of air outlet inlet 310 through which air flows. In this case, the power supply device 300 may be positioned such that the air outlet 310 formed thereon faces one side of both sides of the heat sink 230 as shown in the illustrated embodiment.

In this case, since a relatively large amount of air from the air cooling the heat sink 230 may flow to the power supply device 300, the cooling of the power supply device 300 may be performed evenly and relatively quickly.

Meanwhile, when the hot water tank HT is provided in addition to the cold water tank CT in which the electronic cooling unit 200 is provided in a product such as the water purifier WP as shown in FIG. There may not be enough space to position the power supply 300 on the air outlet side of the heat sink 230 as in the embodiment. Accordingly, the power supply device 300 may not be located at the air outlet side of the heat sink 230 as described above, but may be located above the electronic cooling unit 200 as shown in FIG. 1. have.

In this case, as shown in FIG. 2, an air guide means 400 may be provided between the heat sink 230 and the power supply device 300. Accordingly, as shown in the illustrated embodiment, at least a part of the air flowing out of the heat sink 230 may flow to the power supply device 300 through the air guide means 400 to cool the power supply device 300. . In addition, the air cooled by the power supply device 300 may flow out.

To this end, one side of the air guide means 400 may be located on the air outlet side of the heat sink 224 as shown in the embodiment shown in FIG. And, the other side of the air guide means 400 may be located in the power supply device (300).

As shown in FIG. 2, air introduced into the heat sink 230 may flow out to both sides of the heat sink 230. In this case, one side of the air guide means 400 may be located on one side of both sides of the heat sink 230. In addition, in the case where a plurality of air outlets 310 are formed to allow air to flow out of the power supply device 300 as shown in the illustrated embodiment, the other side of the air guide means 400 may be partially disposed among the plurality of air outlets 310. The air outlet may be located at 310.

On the other hand, as shown in the embodiment shown in Figure 2 one side of the air guide means 400 may have a larger cross-sectional area than the other side of the air guide means (400). As such, when one side of the air guide means 400 has a larger cross-sectional area than the other side of the air guide means 400, the air velocity is guided by the Bernoulli's theorem than when the air velocity is introduced into one side of the air guide means 400. It is faster when outflow to the other side of the means (400). As the air velocity increases, the convective heat transfer coefficient of the air increases. Therefore, even if some air leaked from the heat sink 230 flows into the air guide means 400 as shown in the illustrated embodiment, cooling of the power supply device 300 may be performed smoothly.

The above-described air guide means 400 may be a duct as in the embodiment shown in FIG. In addition, as shown in the illustrated embodiment, one side of the duct may be open and the power supply device 300 may be installed. In the illustrated embodiment, the air duct may be formed between the water purifier WP. That is, the open one surface of the duct is closed in contact with the housing of the water purifier may be formed an air flow path through which air can flow from one side of the duct to the other side.

However, the air guiding means 400 is not limited to the duct as in the embodiment shown in FIG. 2, and at least a part of the air flowing out of the heat sink 230 flows to the power supply device 300 so that the power supply device ( As long as it is provided between the heat sink 230 and the power supply device 300 to cool 300, any well-known thing, such as a pipe other than a duct, is possible.

As described above, when the cooling structure of the power supply apparatus according to the present invention is used, at least a part of the air cooling the thermoelectric module included in the electronic cooling unit may cool the power supply unit supplying power to the electronic cooling unit. It is possible to cool the power supply without providing a separate cooling means, it is possible to miniaturize the product, it is possible to increase the energy efficiency.

The cooling structure of the power supply apparatus described above is not limited to the configuration of the above-described embodiment, but the embodiments are configured by selectively combining all or some of the embodiments so that various modifications can be made. May be

200: electronic cooling unit 210: thermoelectric module
220: cold sink 230: heat sink
231: heat dissipation member 240: fan
300: power supply device 310: air outlet
400: Duct CT: Cold Water Tank
HT: Hot Water Tank WP: Water Purifier
C: connection member HC: heat conduction member
P: cover plate

Claims (16)

In the cooling structure of the power supply device configured to cool the power supply device 300 electrically connected to the electronic cooling unit 200 including the thermoelectric module 210,
Cooling structure of the power supply unit, characterized in that configured to cool the power supply unit 300 by allowing at least a portion of the air to cool the thermoelectric module 210 flows to the power supply unit (300). The method of claim 1, wherein the electronic cooling unit 200
A cold sink 220 connected to one side of the thermoelectric module 210;
A heat sink 230 connected to the other side of the thermoelectric module 210; And
A fan (240) provided in the heat sink (230) to allow external air to flow into the heat sink (230) to cool the thermoelectric module (210) and to flow out to the outside;
Cooling structure of the power supply device comprising a. The power supply apparatus of claim 2, wherein the power supply device 300 is located at an air outlet side of the heat sink 230 and is directly cooled by air discharged from the heat sink 230. Cooling structure. The method of claim 3, wherein the air flowing into the heat sink 230 is discharged to both sides of the heat sink 230,
The power supply device 300 is a cooling structure of the power supply device, characterized in that located on one side of both sides of the heat sink (230). According to claim 4, The power supply device 300 has a plurality of air outlet inlet 310 is formed, the air flows in and out,
The power supply device 300 is a cooling structure of the power supply device, characterized in that the air outlet 310 is located so as to face one side of both sides of the heat sink 230. The heat sink 230 and the power supply device of claim 2, wherein at least a portion of the air flowing out of the heat sink 230 flows to the power supply device 300 to cool the power supply device 300. Cooling structure of the power supply device, characterized in that the air guide means 400 is provided between the 300. The cooling structure of the power supply apparatus according to claim 6, wherein one side of the air guide means 400 is located at the air outlet side of the heat sink 230 and the other side is located at the power supply device 300. . The method of claim 7, wherein the air flowing into the heat sink 230 is discharged to both sides of the heat sink 230,
One side of the air guide means 400 is a cooling structure of the power supply device, characterized in that located on one side of both sides of the heat sink 230. The cooling structure of the power supply device according to claim 8, wherein the other side of the air guide means 400 is located at a plurality of air outlet ports 310 formed in the power supply device 300 so that air flows in and out. . The cooling structure of claim 7, wherein one side of the air guide means (400) has a larger cross-sectional area than the other side of the air guide means (400). The cooling structure of the power supply apparatus according to claim 6, wherein the air guide means is a duct. 12. The cooling structure of claim 11, wherein the duct forms an air flow path between the duct and the device on which the power supply device is installed. The cooling structure of the power supply apparatus according to claim 6, wherein the power supply unit is located above the electronic cooling unit. The cooling structure of claim 1, wherein the power supply device is a switched-mode power supply (SMPS). According to claim 2, The heat sink 230 is provided with a plurality of heat dissipation member 231,
Cooling structure of the power supply device, characterized in that the air flows between the plurality of heat radiation member (231). A plurality of water purification filters for filtering water;
A cold water tank CT connected to the plurality of water filters;
An electronic cooling unit (200) provided in the cold water tank (CT) and including a thermoelectric module (210) to cool water contained in the cold water tank (CT); And
Cooling structure of the power supply of any one of claims 1 to 15 configured to cool the power supply 300 electrically connected to the electronic cooling unit (200);
Water purifier configured including.

Images