KR20130000729A - Apparatus and method for cutting non-metallic substrate - Google Patents

Apparatus and method for cutting non-metallic substrate Download PDF

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Publication number
KR20130000729A
KR20130000729A KR1020110061434A KR20110061434A KR20130000729A KR 20130000729 A KR20130000729 A KR 20130000729A KR 1020110061434 A KR1020110061434 A KR 1020110061434A KR 20110061434 A KR20110061434 A KR 20110061434A KR 20130000729 A KR20130000729 A KR 20130000729A
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KR
South Korea
Prior art keywords
substrate
metal substrate
laser beam
scribing
suction means
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Application number
KR1020110061434A
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Korean (ko)
Inventor
문성욱
박혁
조용흠
Original Assignee
로체 시스템즈(주)
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Priority to KR1020110061434A priority Critical patent/KR20130000729A/en
Publication of KR20130000729A publication Critical patent/KR20130000729A/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE: A nonmetallic substrate cutting apparatus and method are provided to simply cut a nonmetallic substrate using a suction unit and to cut to form cells in a glass substrate or to cut a dummy. CONSTITUTION: A nonmetallic substrate cutting apparatus comprises a table(100), a laser beam control unit(110), a quenching nozzle(120), and a first suction unit(130). The laser beam control unit controls the shape and intensity distribution of a laser beam provided to a nonmetallic substrate(20) placed on the table. The quenching nozzle interlocks with the laser beam control unit to move along the nonmetallic substrate and sprays water onto the nonmetallic substrate to quench the nonmetallic substrate. The first suction unit sucks water while moving along the nonmetallic substrate and sucks a scribed part of the nonmetallic substrate to provide physical stress in the scribed part, thereby cutting the nonmetallic substrate along the scribed part. [Reference numerals] (AA) Scribing direction; (BB) Laser beam

Description

Apparatus and method for cutting non-metallic substrate}

The present invention relates to an apparatus and method for cutting a non-metal substrate, and more particularly, to an apparatus and method for cutting a non-metal substrate, such as a glass substrate using a laser beam.

In general, non-metal substrates, particularly glass substrates, are formed by scribing using a laser beam, and then cutting by applying an impact to the scribing treatment unit using a mechanical cutting device, that is, a breaking device.

However, when the non-metal substrate is cut by applying an impact to the scribing treatment unit of the non-metal substrate using the mechanical cutting equipment as described above, there is a problem that particles are generated and the product yield is reduced.

In addition, the conventional general non-metal substrate cutting device and method as described above has a problem that can not be used in the OLED or AMOLED process that requires ultra-clean cutting due to the particle generation problem.

In addition, the conventional cutting device and method for cutting the non-metal substrate by the mechanical cutting equipment as described above had a problem that it is difficult to use for cutting the glass substrate formed in a thin plate form of 0.3T or less.

Accordingly, it is an object of the present invention to provide a non-metal substrate cutting apparatus and method capable of cutting a non-metal substrate scribed by a laser beam without mechanical cutting equipment and a cutting process.

Cutting device for a non-metal substrate according to the present invention, the table on which the non-metal substrate to be cut is mounted; The laser is installed on the non-metal substrate mounted on the table so that the laser beam irradiated for scribing to the non-metal substrate can be transmitted to adjust the shape and intensity distribution of the laser beam irradiated on the non-metal substrate Beam adjusting means; Quenching is installed to be located on one side of the laser beam control means and quenched by quenching by spraying water onto the scribed non-metal substrate while moving along the non-metal substrate in conjunction with the laser beam control means. ) Nozzle; And installed to be located at one side of the quenching nozzle, interlocked with the laser beam control means and the quenching nozzle, and moving along a nonmetal substrate to suck water used in the quenching process and simultaneously to the nonmetal. And a first suction means for suctioning and raising the scribing processing unit of the substrate to generate a physical stress in the scribing processing unit to cut the non-metal substrate along the scribing processing unit.

Here, a plurality of support blocks may be further interposed between the table and the substrate to support the non-metal substrate by the support blocks.

And, the height of the support block for supporting the scribing processing portion of the non-metal substrate is formed the highest, it can be formed so that the height thereof becomes smaller toward both ends in the scribing portion of the non-metal substrate.

On the other hand, the table may be further provided with a plurality of second suction means for pulling both sides of the non-metal substrate mounted on the table to the table side.

The laser beam adjusting means may include, for example, a beam block housing installed to be positioned on an upper portion of a nonmetallic substrate mounted on the table; A lens unit installed on the beam block housing; And a sliding fastening to the beam block housing such that a part is inserted into the beam block housing, and a cooling water circulation line is formed therein to block a part of the laser beam passing through the lens unit, thereby setting the laser beam in a shape and intensity distribution. It may include; at least one beam block to be irradiated to the non-metal substrate.

In addition, the cutting method of the non-metal substrate according to the present invention, the step of mounting the substrate on the table (S1): the position of the beam block of the laser beam adjusting means so that the laser beam can be irradiated to the non-metal substrate in the shape and intensity distribution set Controlling cooling water and circulating the cooling water in the cooling water circulation line of the beam block (S2); Irradiating a laser beam onto the nonmetal substrate with a shape and intensity distribution set while moving the laser beam adjusting means along the nonmetal substrate to form scribing on the nonmetal substrate (S3); The scribing processing unit generates a thermal stress on the non-metal substrate by quenching by quenching water while the quenching nozzle is moved to the scribing processing unit formed on the non-metal substrate to move in conjunction with the laser beam control unit. Propagating the cracks along (S4); And the laser beam adjusting means, the quenching nozzle, and the first suction means move in conjunction with each other to suck the water sprayed into the scribing processing part during the quenching process and simultaneously quench the non-metal substrate. A step of cutting the non-metallic substrate by generating a physical stress on the quenching processing portion in which the quenching process is performed by raising the portion of the scribing processing portion formed toward the first suction means (S5); Can be.

In addition, in the step S1, the nonmetallic substrate may be supported in a convex gradient shape in the upward direction by the supporting blocks interposed between the nonmetallic substrate and the table.

In addition, in the step S5, the portion of the non-metal substrate is raised to the first suction means side by the first suction means while the end portion is formed by the first suction means is pulled to the table side by the second suction means installed on the table It may be in close contact with the block.

For example, in step S5, the nonmetallic substrate may be lifted by the first suction means such that the scribing treatment part is adsorbed with the first suction means.

On the contrary, in step S5, the non-metal substrate may be lifted by the first suction means such that the scribing processing portion is kept spaced apart from the first suction means by a predetermined distance.

In addition, in step S5, the physical stress of cutting the scribing processing unit to which the crack is propagated may cause a portion of the non-metal substrate scribing processing unit formed by the suction force of the first suction unit to rise toward the first suction unit. Physical stress generated at the time, and physical stress generated by the gas sucked into the first suction means through the cut portion of the scribing processing portion from the lower portion of the non-metal substrate by the suction force of the first suction means. can do.

As described above, the non-metal substrate cutting apparatus and method according to the present invention can simply cut the non-metal substrate by the first suction means without a separate mechanical braking device.

Thus, the non-metal substrate cutting apparatus and method according to the present invention can also be used for cutting for forming cells of 0.3T or less glass substrates or for cutting of dummy portions, which are difficult to process with conventional general non-metal substrate cutting apparatuses and methods.

By removing mechanical cutting processes and cutting devices, the cutting process of nonmetallic substrates can be simplified, and the cutting equipment can be simplified, thereby improving the cutting speed of nonmetallic substrates, improving productivity, and simplifying the production process. There is an effect that can reduce the manufacturing and maintenance cost of the facility.

In addition, as the mechanical cutting process is eliminated, particle generation, which is a problem of the mechanical cutting process, is eliminated at the source to significantly improve the yield.

On the other hand, by eliminating particles inherently, there is an advantage that the equipment can be used in the OLED, AMOLED process, such as ultra-clean glass cutting process.

1 is a schematic side view of a cutting device of a non-metal substrate according to the present invention
2 is a view showing a state in which a non-metal substrate is mounted on a table
3 is a perspective view of the laser beam adjusting means
4 is a front view of FIG. 3
5 is a diagram for explaining a beam block.
6 is a block diagram illustrating a cutting method of a nonmetallic substrate according to the present invention.
7 is a schematic view for explaining a cutting method of a non-metal substrate according to the present invention
8 illustrates an example of a laser beam shape that may be formed by a beam block.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

The terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art.

Terms such as those defined in commonly used dictionaries are to be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are to be interpreted as ideal or overly formal in meaning unless explicitly defined in the present application Do not.

Hereinafter, a configuration of a cutting apparatus for a non-metallic substrate according to the present invention will be described with reference to the drawings.

1 is a schematic side view of an apparatus for cutting a non-metal substrate according to the present invention. 2 is a diagram illustrating a state in which a nonmetallic substrate is mounted on a table.

1 and 2, a cutting apparatus of a non-metal substrate according to the present invention includes a table 100, a laser beam adjusting means 110, a quenching nozzle 120, and a first suction means 130. can do.

The non-metal substrate 20 to be cut is mounted on the upper surface of the table 100 of the cutting device of the non-metal substrate according to the present invention configured as described above. In this case, a plurality of support blocks 140 are further interposed between the lower surface of the nonmetallic substrate 20 and the upper surface of the table 100 so that the nonmetallic substrate 20 may be supported by the support blocks 140. It may be. Meanwhile, the support block 140 having the highest height is disposed in the scribing processing unit of the nonmetallic substrate 20, and the height thereof gradually decreases toward both ends in the scribing processing unit of the nonmetallic substrate 20. It is preferable that the support block 140 is disposed to be supported in a convexly convex shape in the upper direction of the nonmetallic substrate 20.

The laser beam adjusting means 110 is disposed on the non-metal substrate 20 mounted on the table 100 so that the laser beam irradiated for scribing to the non-metal substrate 20 can be transmitted. It is installed to be located. Thus, the laser beam is transmitted before the laser beam irradiated from the laser beam irradiating means (not shown) is irradiated onto the nonmetal substrate 20, thereby adjusting the shape and intensity distribution of the laser beam to irradiate the nonmetal substrate 20. To be possible.

The configuration of the laser beam adjusting means 110 as described above will be described in more detail with reference to FIGS. 2 to 4 as follows.

3 is a perspective view of a laser beam adjusting means, FIG. 4 is a front view of FIG. 3, and FIG. 5 is a diagram for explaining a beam block.

2 to 5, the laser beam adjusting means 110 may include a beam block housing 111, a lens unit 112, and at least one beam block 113.

The beam block housing 111 is installed so that a beam through hole (not shown) penetrates from an upper surface to a lower surface, and is positioned above the non-metal substrate 20 mounted on the table 100.

The lens unit 112 is installed above the beam block housing 111. The lens unit 112 will be described in more detail with reference to the lens unit 112. The CX lens 112a is installed on the beam block housing 111 and the CX lens 112a. CC lens 112b may be included.

The at least one beam block 113 is slidingly fastened to the beam block housing 111 so that a part of the beam block 113 is inserted into the beam block housing 111, and the coolant circulation line 113a is shown in FIG. 5. Is formed. Therefore, the shape of the laser beam irradiated onto the non-metallic substrate 20 by sliding the beam block 113 inward or outward of the beam block housing 111 to block a part of the laser beam passing through the lens unit 112. Can be adjusted to the desired shape. In addition, cooling water is circulated in the cooling water circulation line 113a formed in the beam block 113 to cool the beam block 113 heated by a laser beam passing through the lens unit 112 to increase the temperature. By doing so, the intensity distribution of the laser beam irradiated onto the nonmetallic substrate 20 can be adjusted.

Here, one side of the beam block 113 inserted into the beam block housing 111 may be formed to be inclined downward in the outer direction of the beam block housing 111.

The quenching nozzle 120 is installed to be located at one side of the laser beam adjusting means 110 so that the laser beam can be irradiated with a shape and intensity distribution set on the non-metal substrate 20. The quenching process is performed by interlocking with the beam adjusting unit 110 and spraying water on the non-metal substrate 20 having the scribing formed while moving along the non-metal substrate 20. As described above, the water is sprayed through the quenching nozzle to the scribing processing unit to perform a quenching process to generate thermal stress on the non-metal substrate 20, thereby cracking the crack along the scribing processing unit. To spread.

The first suction means 130 is installed to be located at one side of the quenching nozzle 120 to be interlocked with the laser beam adjusting means 110 and the quenching nozzle 120 to form the non-metal substrate 20. While moving along), the water used for the quenching process is sucked, and at the same time, the scribing processing unit of the non-metal substrate 20 is raised to generate a physical stress in the scribing processing unit so that the scribing processing unit The non-metal substrate 20 can be cut along. Here, the physical stress to cut the scribing processing unit propagated by the crack, the first suction means (the portion formed with the scribing processing unit of the non-metal substrate 20 by the suction force of the first suction means 130) 130, the scribing treatment unit is formed from the lower portion of the non-metallic substrate 20 by the physical stress generated when lifting to the side 130 and the suction force of the first suction means 130. It may include a physical stress generated by the gas sucked into the first suction means 130 through the cut portion.

In addition, a plurality of second suction means 150 may be further installed on both sides of the table 100. Here, the second suction means 150 pulls both sides of the non-metal substrate 20 mounted on the table 100 toward the table 100 so that both sides of the non-metal substrate 20 are provided on both sides of the table 100. To be in close contact with the upper surface of the support block 140 is installed. Thus, even though the scribing treatment of the nonmetallic substrate 20 is raised by the suction force of the first suction means 130, both ends of the nonmetallic substrate 20 are supported by the second suction means 150. By maintaining the state in close contact with the 140 so that the scribing processing unit of the non-metal substrate 20 can be cut stably.

Next, a method of cutting the nonmetal substrate using the cutting device of the nonmetal substrate according to the present invention will be described with reference to FIGS. 1 to 8.

6 is a block diagram illustrating a cutting method of a nonmetallic substrate according to the present invention, FIG. 7 is a schematic diagram illustrating a cutting method of a nonmetallic substrate according to the present invention, and FIG. 8 may be formed by a beam block. It is an illustration of a laser beam shape.

1 to 8, in order to cut the non-metal substrate 20 using the cutting device of the non-metal substrate according to the present invention, the non-metal substrate 20 is first mounted on the table 100 (S1). In this case, a plurality of support blocks 140 may be further interposed between the table 100 and the non-metal substrate 20 to support the non-metal substrate 20 by the support block 140. Meanwhile, the support blocks 140 interposed between the non-metal substrate 20 and the table 100 have the highest height of the support block 140 supporting the scribing process of the non-metal substrate 20. As the direction from the scribing portion of the non-metal substrate 20 toward both ends thereof, the height gradually decreases. Thus, the non-metal substrate 20 is preferably supported in a convex upward shape by the support blocks 140 interposed between the non-metal substrate 20 and the table 100. The reason for supporting the non-metal substrate 20 to be gradient in the convex shape in the upward direction by the support blocks 140 as described above is that when the quenching treatment is performed on the scribing process of the non-metal substrate 20 Cracks can be more easily propagated to the scribing processing unit formed on the nonmetallic substrate 20 due to the physical stress generated by the gradient of the nonmetallic substrate 20 together with the thermal stress generated on the substrate 20. To do this.

After mounting the non-metal substrate 20 on the table 100 as described above, the beam block of the laser beam adjusting means 110 so that the laser beam can be irradiated to the non-metal substrate 20 in the shape and intensity distribution set ( The cooling water is circulated in the cooling water circulation line 113a of the beam block 113 while adjusting the position of the 113 (S2). That is, as shown in FIG. 8, the beam block 113 of the laser beam adjusting means 110 is slidably moved so that the laser beam is irradiated onto the non-metal substrate 20 in various shapes. ), And then the coolant is circulated in the coolant circulation line 113a of the beam block 113 so that the laser beam can be irradiated onto the non-metal substrate 20 in a desired intensity distribution.

After setting the laser beam adjusting means 110 so that the laser beam can be irradiated onto the nonmetal substrate 20 in the shape and intensity distribution set as described above, the laser beam adjusting means 110 is set to the nonmetal substrate 20. The laser beam is irradiated onto the nonmetallic substrate 20 with the shape and intensity distribution set while moving along the C) to form scribing on the nonmetallic substrate 20 (S3).

In the scribing processing unit formed on the non-metal substrate 20, a quenching nozzle 120 moves in conjunction with the laser beam control unit 110 to quench water by spraying water (S4). When quenching is performed on the scribing processing unit as described above, thermal stress is generated on the non-metal substrate 20 so that cracks propagate along the scribing processing unit.

When cracks propagate in the scribing processing unit as described above, the first suction means 130 moves together with the laser beam adjusting means 110 and the quenching nozzle 120 to quench the same while moving. The water injected into the scribing processing unit is sucked in. At the same time, the portion of the quenched non-metal substrate 20 on which the scribing processing portion is formed is lifted toward the first suction means 130, so that the quenching treatment is performed so that the crack is propagated. By generating a stress to cut the non-metal substrate 20 (S5).

In step S5, the portion of the non-metal substrate 20 on which the scribing processing unit is formed is lifted to the first suction unit 130 by the first suction unit 130 and at the same time, the scribing of the non-metal substrate 20 is performed. Areas other than the processing unit may be pulled toward the table 100 by the second suction means 150 installed on the table 100 so as to be in close contact with the support block 140. That is, regions other than the scribing portion of the non-metal substrate 20 The cracks propagated by raising the portion where the scribing treatment portion of the non-metal substrate 20 is formed by the first suction means 130 while being in close contact with the support block 140 by the second suction means 150. Allow the criving treatment to be cut. At this time, the scribing processing unit propagated by the crack is cut by the physical stress generated by the first suction means 130 and at the same time by the suction force of the first suction means 130, the non-metal substrate 20 From the lower part of the After passing through the cut portion is also cut by the physical stress generated by the gas sucked into the first suction means (130). Thus, the cutting of the nonmetallic substrate 20, in particular, the glass substrate, has the advantage of not only generating particles but also cutting the nonmetallic substrate 20 so that a cleaner cutting surface can be formed compared to the conventional cutting apparatus and method.

In addition, the non-metallic substrate 20 may be lifted by the first suction means 130 such that the scribing treatment part is adsorbed with the first suction means 130 in step S5. Alternatively, in the step S5, the non-metallic substrate 20 may be lifted by the first suction means 130 to maintain the scribing processing part spaced apart from the first suction means 130 by a predetermined distance.

As described above, the non-metal substrate cutting apparatus and method according to the present invention may simply cut the non-metal substrate 20 by the first suction means 130 without a separate mechanical breaking device.

Thus, the non-metal substrate cutting apparatus and method according to the present invention can also be used for cutting for forming cells of 0.3T or less glass substrates or for cutting of dummy portions, which are difficult to process with conventional general non-metal substrate cutting apparatuses and methods.

In addition, since the cutting process of the nonmetallic substrate 20 can be simplified and the cutting equipment can be simplified by removing the mechanical cutting process and the cutting device, the productivity of the nonmetallic substrate 20 can be improved and the productivity can be improved. By reducing the production line, there is an advantage that can reduce the production and maintenance cost of equipment.

In addition, as the mechanical cutting process is eliminated, there is an advantage that the yield of the particles can be greatly improved by fundamentally eliminating particle generation, which is a problem of the mechanical cutting process.

On the other hand, as the particle generation is eliminated at the source, the equipment can be used in the OLED, AMOLED process, etc., which are ultra-clean glass cutting processes.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

20: non-metallic substrate 100: table
(110): laser beam adjusting means (111): beam block housing
(112): Lens unit 112a: CX lens
112b: CC lens 113: beam block
113a: cooling water circulation line 120: quenching nozzle
(130): first suction means 140: support block
150: second suction means

Claims (11)

A table on which a nonmetallic substrate to be cut is mounted;
The laser is installed on the non-metal substrate mounted on the table so that the laser beam irradiated for scribing to the non-metal substrate can be transmitted to adjust the shape and intensity distribution of the laser beam irradiated on the non-metal substrate Beam adjusting means;
Quenching is installed to be located on one side of the laser beam control means and quenched by quenching by spraying water onto the scribed non-metal substrate while moving along the non-metal substrate in conjunction with the laser beam control means. ) Nozzle; And
It is installed to be located on one side of the quenching nozzle, and interlocked with the laser beam control means and the quenching nozzle to move along the non-metal substrate while inhaling water used in the quenching process and simultaneously the non-metal substrate. And a first suction means for sucking and raising the scribing processing unit to generate a physical stress in the scribing processing unit to cut the non-metal substrate along the scribing processing unit. The method of claim 1,
And a plurality of support blocks are interposed between the table and the substrate to support the non-metal substrate by the support blocks. The method of claim 2,
The height of the support blocks,
The height of the support block for supporting the scribing processing unit of the non-metal substrate is formed to be the highest, the height of the non-metal substrate is characterized in that the height becomes smaller toward both ends in the direction of the scribing portion of the non-metal substrate Cutting device. The method of claim 1,
And a plurality of second suction means for pulling both sides of the nonmetal substrate mounted on the table to the table. The method of claim 1,
The laser beam adjusting means,
A beam block housing installed on an upper portion of the nonmetallic substrate mounted on the table;
A lens unit installed on the beam block housing; And
Sliding and fastening to the beam block housing so that a portion is inserted into the beam block housing, a cooling water circulation line is formed therein to block a portion of the laser beam passing through the lens portion, the laser beam is non-metal with a shape and intensity distribution set At least one beam block for irradiating the substrate; cutting device comprising a. Mounting the substrate on the table (S1):
Adjusting the position of the beam block of the laser beam adjusting means so that the laser beam can be irradiated onto the nonmetallic substrate in a set shape and intensity distribution, and allowing the cooling water to circulate in the cooling water circulation line of the beam block (S2);
Irradiating a laser beam onto the nonmetal substrate with a shape and intensity distribution set while moving the laser beam adjusting means along the nonmetal substrate to form scribing on the nonmetal substrate (S3);
The scribing processing unit generates a thermal stress on the non-metal substrate by quenching by quenching water while the quenching nozzle is moved to the scribing processing unit formed on the non-metal substrate to move in conjunction with the laser beam control unit. Propagating the cracks along (S4); And
The laser beam adjusting means, the quenching nozzle, and the first suction means move in conjunction with each other, while the quenching process sucks water sprayed into the scribing unit and quenches the quenched nonmetal substrate. Non-metal substrate cutting step (S5) by generating a physical stress to the quenching processing portion quenched by the quenching process by raising the portion formed with the scribing treatment portion to the first suction means (S5); Substrate cutting device. The method according to claim 6,
In step S1,
The nonmetallic substrate,
And a support block interposed between the nonmetallic substrate and the table so as to be supported in an upwardly convex gradient shape. The method according to claim 6,
In step S5,
The non-metal substrate has a portion formed with a scribing treatment portion is raised to the first suction means by the first suction means and both ends are pulled toward the table by the second suction means installed on the table and in close contact with the support block. A method of cutting a nonmetallic substrate. The method according to claim 6,
In step S5,
And the non-metal substrate is lifted by the first suction means such that a scribing treatment portion is adsorbed with the first suction means. The method according to claim 6,
In step S5,
And the non-metal substrate is lifted by the first suction means such that the scribing processing portion is spaced apart from the first suction means by a predetermined distance. The method according to claim 6,
In step S5,
Physical stress to cut the scribing processing unit propagated the crack is,
Physical stress generated when the portion of the non-metal substrate scribing portion formed by the suction force of the first suction means is raised to the first suction means;
The scribing processing unit from the lower portion of the non-metal substrate by the suction force of the first suction means And a physical stress generated by the gas sucked into the first suction means through the cut portion.
KR1020110061434A 2011-06-24 2011-06-24 Apparatus and method for cutting non-metallic substrate KR20130000729A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103862180A (en) * 2014-01-29 2014-06-18 苏州兰叶光电科技有限公司 Glass cover sheet laser scribing device
CN106041331A (en) * 2016-06-21 2016-10-26 昆山国显光电有限公司 OLED substrate cooling system
CN114620488A (en) * 2022-03-24 2022-06-14 业泓科技(成都)有限公司 Chip taking jig of electronic component module and operation method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103862180A (en) * 2014-01-29 2014-06-18 苏州兰叶光电科技有限公司 Glass cover sheet laser scribing device
CN106041331A (en) * 2016-06-21 2016-10-26 昆山国显光电有限公司 OLED substrate cooling system
CN114620488A (en) * 2022-03-24 2022-06-14 业泓科技(成都)有限公司 Chip taking jig of electronic component module and operation method thereof
CN114620488B (en) * 2022-03-24 2023-06-02 业泓科技(成都)有限公司 Piece taking jig of electronic component module and operation method thereof

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