KR20120138997A - Sawing device for semiconductor material or led material and method for sawing semiconductor material or led material - Google Patents

Abstract

PURPOSE: An apparatus and method for cutting LED materials or semiconductor materials are provided to increase the lifetime of a chuck table by protecting the chuck table through a cut process based on the chuck table. CONSTITUTION: A blade assembly includes one or more blades. A chuck table includes a body block(220), a receiving unit(230), and a reference point(235). The receiving unit includes a blade escape groove(231), a vacuum tube(234), and a receiving groove(236). The vacuum tube fixes LED materials to correspond to an LED unit. The receiving groove receives a lens part of the LED material.

Description

Cutting device for semiconductor material or LED material and cutting method for semiconductor material or LED material {SAWING DEVICE FOR SEMICONDUCTOR MATERIAL OR METHOD FOR SAWING SEMICONDUCTOR MATERIAL OR LED MATERIAL}

The present invention relates to a cutting device for semiconductor materials or LED materials, and a method for cutting a semiconductor material or LED materials, specifically, a cutting device for semiconductor materials or LED materials for protecting the chuck table and improving the service life of the chuck table; The present invention relates to a method for cutting semiconductor materials or LED materials.

In the semiconductor manufacturing process, a cutting process is generally a process of separating a semiconductor material that has completed a predetermined semiconductor manufacturing process into individual unit units (for example, individual semiconductor chips or semiconductor packages).

Figure 1 schematically shows a semiconductor material (s) after a predetermined semiconductor manufacturing process, Figure 2 is a schematic side view of a cutting device for semiconductor materials according to the prior art, Figure 3 is for a semiconductor material according to the prior art A schematic plan view of a chuck table included in a cutting device.

As shown in FIG. 1, the semiconductor material s generally includes a substrate 1, a plurality of semiconductor elements 2 provided on an upper portion of the substrate 1, the substrate 1, and the semiconductor. It consists of the resin part 3 (for example, an epoxy resin part, a silicone resin part, etc.) laminated | stacked on the upper surface of the element 2. As shown in FIG.

As shown in FIG. 2, the cutting device for semiconductor materials according to the related art includes a main block including a lower block 70 and an upper block 50 and a chuck table including a table portion 30 fixed to the main block. And blade assemblies 10 and 20 for cutting the semiconductor material s. The semiconductor material s is seated on the upper surface of the table portion 30, and the semiconductor material s is fixed to the upper surface of the table portion by a vacuum tube formed to penetrate the table portion 30. Thereafter, the blade assembly moves in the cutting direction of the semiconductor material to cut the semiconductor material into a plurality of unit units.

At this time, in the cutting device for semiconductor materials according to the prior art, the blade assembly cuts the semiconductor material based on the cut line determined by the fiducial mark marked on the semiconductor material, the movement of the blade relative to the semiconductor material (s) Since the path is determined, if the semiconductor material is not aligned correctly with the table portion of the chuck table, repeating the cutting process may damage the chuck table 30 and reduce the service life of the chuck table. For example, when the cutting lines formed on the chuck table during the first cutting process and the cutting lines formed on the chuck table during the second cutting process are different from each other, the overlapping portions of the cutting lines in the table portion are recessed or lost due to frictional wear or the like. There was a problem of reducing the service life of the chuck table.

In addition, in the cutting device for semiconductor materials according to the prior art, when the resin material 3 of the semiconductor material is placed in contact with the table portion 30 and the cutting process is performed with a blade, the table portion is recessed or lost. There was a problem in that the resin portion was pushed toward the portion to form a burr, thereby increasing the defective rate of the unit unit.

Accordingly, it is an object of the present invention to provide a cutting device for semiconductor materials or LED materials and a method for cutting semiconductor materials or LED materials that solves the problems of the prior art.

Specifically, it is an object of the present invention to provide a cutting device for semiconductor materials or LED materials and a method of cutting semiconductor materials or LED materials to protect the chuck table to improve the service life of the chuck table.

In addition, another object of the present invention is to provide a cutting device for a semiconductor material or LED material and a method for cutting a semiconductor material or LED material so that no burr is formed in the unit unit of the semiconductor material or the unit LED unit of the LED material. To provide.

According to an aspect of the present invention for achieving the above object, the present invention is a cutting device for semiconductor materials for cutting a semiconductor material into a plurality of unit units, the blade for cutting a semiconductor material; A chuck table having a seating portion on which the semiconductor material is seated and a reference point; And a controller configured to control a movement path of the chuck table with respect to the blade, wherein the controller determines a movement path of relative movement between the blade and the chuck table based on the reference point. Provide cutting equipment for materials.

In this case, the seating portion may include a plurality of blade escape grooves formed on the basis of the reference point.

In addition, the chuck table further includes a main body block for supporting the seating portion, the seating portion is fixed to the main body block replaceably, the seating portion may be made of a material of lower hardness than the material of the body block.

The chuck table may further include a main body block supporting the seating portion, and the seating portion may be integrally formed with the main body block.

In addition, the interval between the neighboring blade escape grooves is a cutting device for a semiconductor material, characterized in that the same as the longitudinal length or longitudinal length of the unit unit.

The chuck table may further include a main body block supporting the seating portion, and the seating portion may be fixed to protrude a predetermined height from the top surface of the main body block in the main body block.

In addition, the predetermined height may be greater than the depth of the blade escape groove.

The seating unit may include a vacuum tube that fixes the semiconductor material by a vacuum suction method at a position corresponding to the unit unit.

The seating unit may include a suction unit for enhancing vacuum suction force at a position corresponding to the unit unit, and the suction unit may be in communication with the vacuum tube.

According to another aspect of the present invention for achieving the above object, the present invention is a cutting method of a semiconductor material for cutting a semiconductor material using a blade in a plurality of unit units, the semiconductor material is seated on the chuck table Material settling step; A cutting path alignment step of determining a relative movement path between the chuck table and the blade based on a reference point formed in the chuck table; And a material cutting step of cutting the semiconductor material into a plurality of unit units through the relative movement of the chuck table and the blades.

In addition, the step of forming the escape groove for forming a blade escape groove on the seating portion of the chuck table based on the reference point.

In addition, when the deviation between the relative movement path between the chuck table and the blade and the cutting line of the semiconductor material adsorbed and fixed to the chuck table exceeds a predetermined range, the adsorption fixing of the semiconductor material to the chuck table is released. And reseating the semiconductor material from the chuck table by using a material transfer device, and then reseating the semiconductor material on the chuck table.

In addition, the cutting path alignment step and the material cutting step may be performed at the same time.

In addition, the blade escape groove may be formed through relative movement between the chuck table and the blade.

In addition, the step of forming the escape groove may be performed simultaneously with the material cutting step.

In addition, the step of forming the escape groove may be performed before the material seating step.

According to another aspect of the present invention for achieving the above object, the present invention, a plurality of LED materials including a substrate, an LED element mounted on the substrate, and a resin portion located on the substrate and forming a lens portion A cutting device for LED materials for cutting into two unit LED units, comprising: a blade for cutting the LED material; A chuck table having a seating portion on which the LED material is seated and a reference point; And a control unit controlling a movement path of relative movement between the blade and the chuck table, wherein the seating unit includes a receiving groove accommodating the lens unit and a plurality of blade escape grooves formed based on the reference point. The LED material is mounted on the seating portion so that the lens portion faces the receiving groove, and the controller determines a movement path of relative movement between the blade and the chuck table based on the reference point. Provides cutting equipment for LED materials.

According to yet another aspect of the present invention for achieving the above object, the present invention provides an LED material comprising a substrate, an LED element mounted on the substrate, and a resin portion located on the substrate and forming a lens portion. A cutting device for LED materials for cutting into a plurality of unit LED units, comprising: a blade for cutting the LED material; A chuck table having a seating portion on which the LED material is seated and a reference point; And a control unit for controlling a movement path of the chuck table with respect to the blade, wherein the seating portion has a receiving groove for receiving the lens portion, and the LED material includes the seating portion so that the lens portion faces the receiving groove. Is fixed to, the control unit provides a cutting device for LED material, characterized in that for determining the movement path of the relative movement between the blade and the chuck table based on the reference point.

In addition, the seating portion may include a plurality of blade escape grooves formed on the basis of the reference point.

In addition, the shape of the receiving groove corresponds to the shape of the lens portion, the volume of the receiving groove may be greater than the volume of the lens portion.

The chuck table may further include a main body block on which the seating part is supported, the seating part is fixedly replaceable to the main body block, and the seating part may be made of a material having a lower hardness than that of the body block. .

In addition, the chuck table may further include a main body block supporting the seating portion, and the seating portion may be integrally formed with the main body block.

In addition, the spacing between neighboring blade escape grooves may be equal to the horizontal length or the vertical length of the unit unit.

In addition, the width of the blade escape groove may be 95% to 120% of the thickness of the blade.

In addition, the chuck table may further include a main body block supporting the seating portion, and the seating portion may be fixed to protrude a predetermined height from the upper surface of the main body block in the main body block.

In addition, the predetermined height may be greater than the depth of the blade escape groove.

In addition, the seating portion may be made of a material of one of high hardness rubber, PEEK, Al and Al alloy.

The seating unit may include a vacuum tube that fixes the semiconductor material by a vacuum suction method at a position corresponding to the unit unit.

The seating unit may include an adsorption unit for enhancing vacuum suction force at a position corresponding to the unit unit, and the adsorption unit may communicate with the vacuum tube.

In addition, the suction unit may be the receiving groove.

According to yet another aspect of the present invention for achieving the above object, the present invention provides an LED material comprising a substrate, an LED element mounted on the substrate, and a resin portion located on the substrate and forming a lens portion. An LED material cutting method for cutting a blade using a plurality of unit LED units, comprising: a material seating step of seating the LED material on a chuck table; A cutting path alignment step of determining a relative movement path between the chuck table and the blade based on a reference point formed in the chuck table; And a material cutting step of cutting the LED material into a plurality of unit units through the relative movement of the chuck table and the blades.

Further, in the material mounting step, the receiving portion is formed with a receiving groove for receiving the lens portion, the LED material may be mounted to the mounting portion so that the lens portion facing the receiving groove.

In addition, the step of forming the escape groove for forming a blade escape groove on the seating portion of the chuck table based on the reference point.

In addition, when the degree of deviation between the relative movement path between the chuck table and the blade and the cutting line of the LED material adsorbed and fixed to the chuck table exceeds a predetermined range, the LED material is spaced apart from the seating portion, It may further include a material re-seating step of seating the LED material back to the chuck table.

In addition, the cutting path alignment step and the material cutting step may be performed at the same time.

In addition, the blade escape groove may be formed through relative movement between the chuck table and the blade.

In addition, the step of forming the escape groove may be performed simultaneously with the material cutting step.

In addition, the step of forming the escape groove may be performed before the material seating step.

According to the problem solving means of the present invention, the present invention can perform the cutting process on the basis of the chuck table has the effect of protecting the chuck table. For this reason, the present invention has the effect of improving the service life of the chuck table.

In addition, the present invention can produce a unit unit of a semiconductor material without a burr or a unit LED unit of an LED material. For this reason, the present invention has the effect of reducing the defective rate of the product.

In addition, the present invention has the effect that the lens unit is not damaged during the cutting process, the LED material provided with the lens unit. For this reason, the defective rate of the unit LED unit of this invention can be reduced.

1 is a schematic diagram of a semiconductor material having completed a predetermined semiconductor manufacturing process.
2 is a schematic side view of a cutting device for a semiconductor material according to the prior art.
3 is a schematic plan view of the chuck table included in the cutting device for semiconductor materials according to the prior art.
4 is a schematic perspective view of a cutting device for a semiconductor material according to the present invention.
5 is a schematic block diagram of a cutting device for a semiconductor material according to the present invention.
Figure 6 is a schematic enlarged view of the seating portion of the chuck table included in the cutting device for semiconductor materials according to the present invention.
7 is a schematic cross-sectional view of a cutting device for semiconductor materials according to the present invention.
8 schematically illustrates a state in which a semiconductor material is seated on a seating part of a chuck table according to the present invention.
9A and 9B schematically illustrate a process of forming a blade escape groove and a cutting process of a semiconductor material in a seating portion of a chuck table according to a first embodiment of the present invention.
10A and 10B schematically illustrate a process of forming a blade escape groove and a cutting process of a semiconductor material in a seating portion of a chuck table according to a second embodiment of the present invention.
11 is a schematic flowchart illustrating a cutting method of a semiconductor material according to the present invention.
12 is a schematic flowchart illustrating a cutting method of a semiconductor material in a first additional embodiment of the present invention.
13 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a second additional embodiment of the present invention.
14 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a third additional embodiment of the present invention.
15 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a fourth additional embodiment of the present invention.
16 is a schematic view of an LED material cut by the present invention.
17 is a schematic perspective view of a cutting device for LED materials according to the present invention.
18 is a schematic enlarged view of a seating portion of a chuck table included in a cutting device for LED materials according to the present invention.
19 is a schematic cross-sectional view of a cutting device for LED materials according to the present invention.
20 schematically shows a state in which the LED material is seated on the seating portion of the chuck table according to the present invention.
21A and 21B schematically illustrate a process of forming a blade escape groove and a cutting process of an LED material in a seating portion of a chuck table according to an embodiment of the present invention.
22 is a schematic flowchart showing a cutting method of a semiconductor material according to the present invention.
Fig. 23 is a schematic flowchart showing a cutting method of a semiconductor material in a first additional embodiment of the present invention.
24 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a second additional embodiment of the present invention.
25 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a third additional embodiment of the present invention.
Fig. 26 is a schematic flowchart illustrating a cutting method of a semiconductor material according to a fourth additional embodiment of the present invention.
27A and 27B are schematic views of a unit LED unit cut in accordance with the prior art and the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that the disclosure can be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. Like numbers refer to like elements throughout.

4 is a schematic perspective view of a cutting device 1000 for semiconductor materials according to the present invention, FIG. 5 is a schematic block diagram of a cutting device 1000 for semiconductor materials according to the present invention, and FIG. 6 is according to the present invention. FIG. 7 is a schematic enlarged view of a seating portion 230 of the chuck table 200 included in the cutting device 1000 for semiconductor materials, and FIG. 7 is a schematic cross-sectional view of the cutting device 1000 for semiconductor materials according to the present invention.

As shown in FIGS. 4 to 7, the cutting device 1000 for semiconductor materials according to the present invention includes a blade assembly 100 including at least one blade 110; Body blocks 210 and 220, a mounting part 230 fixed to the body blocks 210 and 220 and on which the semiconductor material s is seated, the seating part 230, and the body blocks 210 and 220. A chuck table 200 provided on at least one of upper surfaces of the chuck table, the chuck table 200 including reference points 225 and 235 to align the semiconductor material s at a reference position of the chuck table 200; And a controller 400 for controlling a movement path of the blade 110 with respect to the chuck table 200.

Further, preferably, the semiconductor material s may be provided with a cutting line CL1 or a fiducial mark to be cut into a plurality of unit units U. FIG. As described above, the cutout line CL1 may actually be provided in the semiconductor material s, but as described below, the cutout line CL1 may be a unit unit in the semiconductor material s obtained by the photographing apparatus 300. The controller 400 may virtually determine or set the location information based on the position information of (U).

Referring to FIG. 5, the semiconductor device cutting device 1000 transfers the plurality of photographing apparatuses 300 and the semiconductor material s to the chuck table 200 and simultaneously transfers the semiconductor material s to the chuck table 200. Material transfer device 500 aligned with the seating portion 230 of the blade, blade moving device 150 for adjusting the position of the blade 110 (or blade assembly 100) relative to the seating portion 230, the photographing device The material conveying apparatus 500 and / or the blade based on the position information of the unit unit U of the semiconductor material s obtained at 300 or the reference points 225 and 235 of the seating unit 230 to be described later. And a controller 400 for controlling the mobile device 150.

In addition, the plurality of photographing apparatuses 300 may include a photographing apparatus 310 photographing an upper surface of the chuck table 200, a photographing apparatus 330 photographing a side surface of the chuck table 200, and the semiconductor material s. It may include a photographing device for photographing the surface. The photographing apparatuses 300 may include positional information (eg, coordinates or angles) of the upper surface of the chuck table 200, or positional information (eg, coordinates or angles, etc.) of the semiconductor material s or will be described later. Information about whether or not the blade escape groove 231 is formed may be obtained.

In addition, the control unit 400 may be provided with the position information of the seating unit 230 or the upper surface of the chuck table based on the position information of the unit unit U obtained from the photographing apparatus 300 and / or the reference points 225 and 235. Control the material feeder 500 so that the semiconductor material s is positioned at the reference position of the seating unit 230, and / or the movement path of the blade 110 is based on the reference points 225 and 235 ( The blade moving device 150 may be controlled to be aligned with the blade escape groove 231 to be described later.

In particular, the controller 400 may determine the movement path of the relative movement between the blade 110 and the chuck table (eg, the seating unit 230) based on the reference point. That is, the controller moves at least one of the blade and the chuck table so that the blade moves based on the reference points 225 and 235 provided in the chuck table or the blade escape formed based on the reference points 225 and 235. The relative movement path between the blade 110 and the chuck table is determined to move along the groove 231.

As such, the controller 400 relatively moves the blade 110 and / or the chuck table relative to the reference point formed on the chuck table 200, thereby moving the blade 110 based on the semiconductor material s as in the prior art. Damage to the chuck table 200 generated by moving can be prevented. In addition, as described above, the cutting line CL1 of the semiconductor material s is aligned based on the reference points 225 and 235 of the chuck table 200, and then the blade 110 is moved relative to the chuck table 200. As a result, a dimensional defect of the unit unit U can be prevented.

As shown in FIG. 4, the chuck table 200 includes body blocks 210 and 220, a mounting portion 230 fixed to the body blocks 210 and 220 and on which a semiconductor material s is mounted, and the semiconductor. It includes at least one reference point (225, 235) to ensure that the material (s) is aligned to the reference position of the chuck table 200. Here, the reference position is a position corresponding to the cutout line CL1 of the semiconductor material s in the seating part 230, and preferably, the plurality of blade escape grooves 231 and the cutout line CL1 correspond to each other. Can be.

The body blocks 210 and 220 of the chuck table 200 include a lower block 210 serving as a support, and an upper block positioned at an upper portion of the lower block 210 to which the seating part 230 is fixed. The upper block is provided with a vacuum chamber 227 for forming a vacuum suction input to be delivered to the seating portion 230.

As a variant of the body blocks 210 and 220, the body blocks 210 and 220 may be a single block. In addition, the vacuum chamber 227 may not be formed in the body blocks 210 and 220, but may be formed in a separate vacuum suction device to transmit a vacuum suction input to the seating part 230.

The seating part 230 may be integrally formed with the body blocks 210 and 220.

Preferably, the mounting portion 230 is detachably fixed to the body blocks (210, 220). Specifically, the seating unit 230 may be fixed to the body blocks (210, 220) by a vacuum adsorption method or a screwing method. However, this is an exemplification and the present invention is not limited thereto. Since the seating unit 230 is detachably mounted to the main body blocks 210 and 220, the rest of the chuck table 200 may be used as it is by replacing only the seating unit 230, which is a main damage part of the chuck table 200. The maintenance cost of the chuck table 200 can be reduced, and the service life of the entire chuck table 200 can be improved.

Referring to FIG. 6, the seating unit 230 may include at least one reference point 225, 235, and / or the reference point for allowing the semiconductor material s to be aligned with a reference position of the chuck table 200. A plurality of blade escape grooves 231 formed on the basis of the 225 and 235 and forming a space in which the blade 110 can completely cut the semiconductor material, and correspond to the unit unit U of the semiconductor material s. It includes a plurality of adsorption portion 233 for fixing the semiconductor material (s) by the vacuum suction method at the position, and a vacuum tube 234 in communication with the adsorption portion 233.

The reference point 225, 235 is provided on at least one of the seating portion 230 of the chuck table 200 and the upper surface of the body block (210, 220). The reference point may be a mark artificially formed as an alignment mark as shown in the drawings, but the present invention is not limited thereto, and the reference point may be an identifiable configuration formed in the chuck table. have. For example, the reference point may be a structure formed in the chuck table, such as a dowel pin or a dowel hole, and an outer edge portion of the chuck table (for example, a body block and a seating part). It may also be a specific part of the chuck table.

The controller 400 determines position information (eg, coordinates or angles) of the seating unit 230 based on the reference points 225 and 235, and determines a plurality of reference points based on the reference points 225 and 235. Two blade escape grooves 231 are formed.

6 and 7, the plurality of blade escape grooves 231 include a plurality of lateral guide grooves 231a and a plurality of longitudinal guide grooves 231b. That is, the plurality of blade escape grooves 231 are formed in the seating portion 230 in a checkerboard shape. Here, the distance between one blade escape groove 231, one blade escape groove 231 and the adjacent blade escape groove 231 is equal to the horizontal length or vertical length of the unit unit (U). Specifically, the distance between one lateral guide groove 231a and the lateral guide groove 231a and the other lateral guide groove 231a corresponds to the longitudinal length of the unit unit U, The interval between one longitudinal guide groove 231b and the longitudinal guide groove 231b and the other longitudinal guide groove 231b corresponds to the horizontal length of the unit unit U.

Referring to FIG. 7, the width of the blade escape groove 231 is 95% to 120% of the thickness t of the blade 110. Preferably, the width of the blade escape groove 231 may be equal to the thickness (t) of the blade (110).

Thus, by forming the blade escape groove 231 so that the width of the blade escape groove 231 is equal to or substantially similar to the thickness of the blade 110, the blade can reach the blade escape groove 231 during the cutting process, the semiconductor The material can be cut completely, and at the same time, the resin portion 3 of the semiconductor material s (for example, the resin portion 3 may be composed of an epoxy resin, a silicone resin, or the like) is formed of the seating portion 230. Even when the semiconductor material s is cut by the blade 110 while being in contact with the upper surface, the gap between the blade 110 and the blade escape groove 231 is very small so that the resin part 3 has the blade escape groove 231. It can be prevented from rolling to the side, thereby producing a unit unit (U) without burrs.

Referring to FIG. 6, the seating part 230 is fixed to protrude a predetermined height h from the top surface of the body blocks 210 and 220 (that is, the upper block 220) from the body blocks 210 and 220. The predetermined height h is preferably greater than the depth d of the blade escape groove 231 in order to prevent spatial interference between the movement path of the blade 110 and the body blocks 210 and 220.

The seating portion may be made of a material having a lower hardness than the material of the body block.

However, the mounting portion 230 must firmly support the resin portion 3 so that the resin portion 3 of the semiconductor material s does not penetrate into the blade escape groove 231. To this end, the seating portion 230 is made of a material of one of a high hardness polymer material, Al and Al alloy. The high hardness polymer may be, for example, high hardness rubber or polyetheretherketone (PEEK).

Referring to FIG. 7, the blade assembly 100 includes a blade 110 and a blade grip 130 that supports the blade 110 and transmits rotational power to the blade 110. Although not shown in the drawing, the blade assembly 100 is connected to the blade 110 positioning device, the blade 110 positioning device by the control unit 400 to the blade 110 to the chuck table 200. Can be moved up, down, left, and right. Preferably, the blade 110 is a circular blade 110, the blade 110 may be rotated in the downward cutting direction.

8 schematically shows a state in which the semiconductor material s is seated on the seating portion 230 of the chuck table 200 according to the present invention.

According to the present invention, the semiconductor material s may be seated in the seating part 230 so that the resin part 3 faces toward the adsorption part 233 provided in the seating part 230, or the semiconductor material s. In the seating unit 230, the substrate 1 may be seated toward the adsorption unit 233 provided in the seating unit 230. That is, the cutting device 1000 for semiconductor materials according to the present invention executes cutting processing so that burrs do not occur in the semiconductor material s even if any surface of the semiconductor material s is disposed on the suction part 233 side. Can be.

Hereinafter, the process of forming the blade escape groove 231 provided in the seating portion 230 of the present invention will be described.

9A and 9B schematically illustrate a process of forming the blade escape groove 231 in the seating portion 230 of the chuck table 200 and the cutting process of the semiconductor material s according to the first embodiment of the present invention. Doing.

9A and 9B, after determining the mounting surface of the semiconductor material s so that the resin portion 3 of the semiconductor material s faces the adsorption portion 233 of the mounting portion 230, the semiconductor On the cutting line CL1 provided in the material s or the position information of the unit unit U in the semiconductor material s obtained by the photographing apparatus 300 and the reference points 225 and 235 of the chuck table 200. On the basis of this, the semiconductor material s is aligned with the seating part 230, and then a vacuum suction input is transmitted from the vacuum chamber 227 to the adsorption part 233 to fix the semiconductor material s to the seating part 230. In this state, after determining the movement path of the blade 110 based on the position of the blade 110 based on the reference point (225, 235), the blade 110 is seated based on the reference point (225, 235). A portion of the blade escape groove 231 having a predetermined depth d is formed in the mounting portion 230 while cutting the semiconductor material s by moving forward to the predetermined depth d. By repeating the above-described process, a plurality of blade escape grooves 231 are formed in the mounting portion 230.

The blade escape groove 231 formed as described above is aligned in the semiconductor material s with respect to the seating part 230 in the subsequent cutting process of the semiconductor material s (that is, the position and the cutting line CL1 of the blade escape groove 231). ) To correspond to the position of the blade 110 and the position alignment criteria of the blade 110 with respect to the seating part 230 to determine the moving path of the blade 110.

10A and 10B schematically illustrate a process of forming the blade escape groove 231 in the seating portion 230 of the chuck table 200 and the cutting process of the semiconductor material s according to the second embodiment of the present invention. Doing.

10A and 10B, after determining the mounting surface of the semiconductor material s such that the substrate 1 of the semiconductor material s faces the adsorption portion 233 of the mounting portion 230, the semiconductor material s is determined. Based on the cutout line CL1 provided in (s) or the position information of the unit unit U in the semiconductor material s obtained by the imaging device 300 and the reference points 225 and 235 of the chuck table 200. The semiconductor material s is aligned with the seating part 230, and then a vacuum suction input is transferred from the vacuum chamber 227 to the suction part 233 to fix the semiconductor material s to the seating part 230. In this state, after determining the movement path of the blade 110 based on the position of the blade 110 based on the reference point (225, 235), the blade 110 is seated based on the reference point (225, 235). A portion of the blade escape groove 231 having a predetermined depth d is formed in the mounting portion 230 while cutting the semiconductor material s by moving forward to the predetermined depth d. By repeating the above-described process, a plurality of blade escape grooves 231 are formed in the mounting portion 230.

The blade escape groove 231 formed as described above is aligned in the semiconductor material s with respect to the seating part 230 in the subsequent cutting process of the semiconductor material s (that is, the position and the cutting line CL1 of the blade escape groove 231). ) To correspond to the position of the blade 110 and the position alignment criteria of the blade 110 with respect to the seating part 230 to determine the moving path of the blade 110.

Referring to FIG. 7, as a modified embodiment of the process of forming the blade escape groove 231 in the seating portion 230 of the chuck table 200 according to the present invention, the semiconductor material (s) in the seating portion 230 Before being seated, the blade escape groove 231 may be formed based on the reference points 225 and 235 of the seating part 230. Specifically, the control unit 400 is a positional information and the chuck table 200 of the unit unit U in the cutting line (CL1) provided in the semiconductor material (s) or the semiconductor material (s) obtained by the imaging device 300. The virtual target incision is determined in the seating unit 230 based on the reference points 225 and 235. In this case, the target cutout is a virtual reference position corresponding to the cutting line CL1 provided in the semiconductor material s when the semiconductor material s is seated on the seating part 230. Thereafter, the position of the blade 110 is moved along the target incision to the predetermined depth d of the mounting portion 230 to form the blade escape groove 231 of the predetermined depth d in the mounting portion 230. By repeating the above-described process, a plurality of blade escape grooves 231 are formed in the mounting portion 230.

Hereinafter, a method for cutting a semiconductor material 2000 according to the present invention will be described. Preferably, the method for cutting semiconductor material 2000 according to the present invention is carried out using the above-described cutting device for semiconductor material 1000 according to the present invention, and each step is a cutting device for semiconductor materials according to the present invention ( Controlled by the control unit 400 of 1000.

11 is a schematic flowchart illustrating a cutting method of a semiconductor material according to the present invention.

As shown in FIG. 11, in the method of cutting a semiconductor material 2000 according to the present invention, a plurality of unit units include a semiconductor material s fixed to a seating part 230 of the chuck table 200 by a blade 110. As a method of cutting in (U), the semiconductor material fixed to the seating part is cut into a plurality of unit units through relative motion between the blade and the chuck table.

The cutting method 2000 of the semiconductor material may include a material seating step of seating the semiconductor material on a chuck table (S2200); Cutting path alignment step (S2300) of determining the relative movement path of the chuck table and the blade on the basis of the reference point formed on the chuck table; And a material cutting step (S2400) of cutting the semiconductor material into a plurality of unit units through relative movement of the chuck table and the blades.

Specifically, the control unit 400 first controls the material transfer device 500 to transfer the semiconductor material to the seating portion 230 of the chuck table, and then to control the vacuum suction device to the suction unit provided in the seating portion 230 A vacuum suction input is applied to 233 to fix the semiconductor material s to the seating portion 230.

In this case, before the seating step, the controller may additionally execute a material alignment step of aligning the semiconductor material with respect to the seating part based on a reference point formed in the seating part.

In the case of additionally executing the material sorting step, for example, the controller may include a dowel groove or a dowel pin provided in the chuck table, and a dowel pin or dowel groove provided in the semiconductor material to correspond to the dowel groove or the dowel pin of the chuck table. Can be used to align the semiconductor material with respect to the seat.

In addition, when the material alignment step is additionally performed, for example, the controller determines a plurality of (virtual) cutout lines CL1 in the semiconductor material s to obtain position information of the cutout line or use a semiconductor device as an imaging device. Acquire the position information of the cut line provided in the material, and based on the position information of the cut line and / or the reference point formed in the chuck table, a plurality of (virtual) target incisions to the seat 230 of the chuck table 200 After determining the portion, the controller controls the material feeder or moves the position of the chuck table to correct the position of the semiconductor material s with respect to the seating portion 230 based on the cut line CL1 and the target incision. do.

However, this is exemplary and the present invention is not limited to the material sorting step described above.

Thereafter, the controller determines a movement path of relative movement of the chuck table and the blade based on a reference point formed in the chuck table. For example, the controller determines a plurality of (virtual) target incisions on the seating part 230 of the chuck table 200 based on the position information of the perforated line obtained by the photographing apparatus and / or the reference point formed in the chuck table. The controller then controls the blade feeder or corrects the position of the blade relative to the chuck table based on the target incision by moving the position of the chuck table (ie, adjusting the relative position between the blade and the chuck table). Then, the cutting path which is the movement path of the relative motion of the chuck table and the blade is aligned.

Thereafter, the controller controls the blade feeder and / or controls the position of the chuck table to cut the semiconductor material into a plurality of unit units by moving the chuck table and the blade relative to the reference point of the chuck table. For example, the controller cuts the semiconductor material into a plurality of unit units by moving the blades along the movement paths of the relative movement of the chuck table and the blades determined in the cutting path alignment step (S2300).

The cutting path alignment step S2300 and the material cutting step S2400 may be executed sequentially or simultaneously.

The cutting method of the semiconductor material according to the present invention may additionally include a stepping groove forming step (S2100) and / or the material re-seat step (S2600), hereinafter the stepping groove forming step (S2100) and / or material reseating A method of cutting a semiconductor material including the step S2600 will be described.

12 is a schematic flow chart showing a cutting method of a semiconductor material in a first additional embodiment of the present invention, Figure 13 is a schematic flow chart showing a cutting method of a semiconductor material according to a second additional embodiment of the present invention. .

According to the first and second additional embodiments of the present invention, the present invention is the step of forming the escape grooves to form a blade escape groove in the seating portion of the chuck table on the basis of the reference point formed on the chuck table (S2100) It further includes; The blade escape groove is formed through relative movement between the chuck table and the blade.

According to a first additional embodiment of the present invention, the control unit performs the escape groove forming step (S2100) before the material seating step (S2200), and according to the second additional embodiment of the present invention, the control unit forms the escape groove (S2100). ) Is executed simultaneously with the material cutting step (S2400).

According to the first embodiment of the present invention, as shown in Figure 12, the control unit first forms a blade escape groove in the seating portion of the chuck table based on the reference point formed on the chuck table.

In detail, the control unit 400 obtains the position information of the unit unit U from the semiconductor material s with the photographing apparatus 300, and thus the position information and the seating unit of the unit unit U of the semiconductor material s. Based on the reference points 225 and 235 provided at 230, a plurality of (virtual) target incisions are determined at the mounting portion 230. Subsequently, the controller 400 controls the blade feeder 150 to move the blade 110 along a plurality of target incisions, thereby cutting the seating portion 230 by a predetermined depth d to thereby provide a plurality of blade escape grooves. 231 is formed.

As a result, the blade escape groove 231 is formed such that the width w is equal to or nearly equal to the thickness t of the blade 110.

As a modified embodiment of the stepped groove forming step (S2100), the stepped groove forming step (S2100) determines a plurality of target cutouts in the seating part 230 of the chuck table 200, and then processes the seating part along the target cutouts. A plurality of blade escape grooves 231 may be formed by cutting the seating portion 230 by a predetermined depth d by moving a tool.

Here, the seating processing tool is a tool composed of high hardness and high strength metal as a cutting tool, the seating processing tool is coupled to the blade feeder 150 to replace the blade 110 under the control of the control unit 400 Can be set. The thickness of the processing tool for the mounting portion 230 is preferably 95% to 120% of the thickness (t) of the blade (110). As a result, the blade escape groove 231 is formed such that the width w is about 95% to 120% of the thickness t of the blade 110.

After the step of forming the escape groove (S2100), the control unit executes the material seating step (S2200), material alignment step and material cutting step 2400.

According to the second embodiment of the present invention, as shown in Figure 13, the control unit first executes the material mounting step (S2200), cutting path alignment step (2300) included in the cutting method of the semiconductor material according to the present invention. .

Thereafter, the control unit forms a blade escape groove in the seating portion of the chuck table based on the reference point formed in the chuck table.

Thereafter, the control unit 400 controls the blade feeder 150 and / or controls the position of the chuck table (that is, by controlling the relative movement between the blade and the chuck table), and the semiconductor material seated on the seating portion ( While cutting s) into a plurality of unit units U, a plurality of blade escape grooves 231 are simultaneously formed in the mounting portion 230.

In this case, for example, the control unit 400 obtains the position information of the unit unit U from the semiconductor material s by the photographing apparatus 300, and thus the position information of the unit unit U of the semiconductor material s and And / or a plurality of (virtual) target incisions are determined in the seating portion 230 based on the reference points 225, 235 provided in the seating portion 230. Thereafter, the controller 400 controls the positions of the blade feeder 150 and / or the chuck table to move the blades 110 along a plurality of target incisions to move the seating portion 230 by a predetermined depth d. A plurality of blade escape grooves 231 are formed at the same time while cutting the semiconductor material s into a plurality of unit units U.

As a result, the blade escape groove 231 is formed such that the width w is equal to or nearly equal to the thickness t of the blade 110.

As described above, in the cutting cycle after the blade escape groove is formed, the controller repeatedly executes the above-described material seating step S2200, the cutting path alignment step 2300, and the material cutting step 2400.

14 is a schematic flow chart showing a cutting method of a semiconductor material according to a third additional embodiment of the present invention, Figure 15 is a schematic flow chart showing a cutting method of a semiconductor material according to a fourth additional embodiment of the present invention. to be.

According to a third and fourth additional embodiment of the present invention, a method of cutting a semiconductor material according to the present invention comprises a relative movement path between a chuck table and a blade and a cutting line of a semiconductor material adsorbed and fixed to the chuck table. When the degree of deviation exceeds the predetermined range, the fixed adsorption of the semiconductor material to the chuck table is released and the semiconductor material is separated from the chuck table using a material feeder, and then the semiconductor material is removed from the chuck table. Re-seating the material to be seated again (S2600); further comprises.

According to a third additional embodiment of the present invention, as shown in FIG. 14, the controller first executes a material seating step S2200.

Thereafter, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the semiconductor material adsorbed and fixed to the chuck table is within a preset range (S2500). The predetermined range may be, for example, about 0 to 40 μm, and preferably about 0 to 5 μm.

In this case, when the controller determines that the deviation degree is within a preset range, the controller executes the cutting path alignment step 2300 and the material cutting step 2400 described above.

On the contrary, when the controller determines that the deviation degree exceeds the preset range, the controller controls the chuck table and the material feeder, releases the adsorption fixation of the semiconductor material to the chuck table, and uses the material feeder. After separating the semiconductor material from the chuck table, the semiconductor material is seated on the chuck table again.

In this case, preferably, the material remounting step (S2600) may include the material alignment step described above before the semiconductor material is seated on the chuck table again.

Subsequently, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the semiconductor material adsorbed and fixed to the chuck table is within a predetermined range with respect to the semiconductor material remounted on the seating part ( S2500).

According to a fourth additional embodiment of the present invention, according to the third additional embodiment of the present invention, the controller executes the material remounting step (S2600) between the material seating step (S2200) and the cutting path alignment step (2300). According to the present embodiment, the control unit is the same as the third additional embodiment except that the material remounting step S2600 is executed between the cutting path alignment step 2300 and the material cutting step 2400.

That is, the controller performs the material seating step (S2200) and the cutting path alignment step (2300), relative to the semiconductor material seated on the seating portion, the relative movement path between the chuck table and the blade, and is fixed to the chuck table It is determined whether the degree of departure between the cutting lines of the semiconductor material is within a preset range (S2500).

In this case, when the controller determines that the degree of departure is within a preset range, the controller executes the above-described material cutting step 2400.

On the contrary, when the controller determines that the deviation degree exceeds the preset range, the controller controls the chuck table and the material feeder, releases the adsorption fixation of the semiconductor material to the chuck table, and uses the material feeder. After separating the semiconductor material from the chuck table, the semiconductor material is seated on the chuck table again.

In this case, preferably, the material remounting step (S2600) may include the material alignment step described above before the semiconductor material is seated on the chuck table again.

Subsequently, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the semiconductor material adsorbed and fixed to the chuck table is within a predetermined range with respect to the semiconductor material remounted on the seating part ( S2500).

According to the present invention, the present invention can perform cutting of the semiconductor material s based on the chuck table 200 (that is, based on the reference points 225 and 235 or the blade escape groove 231). Since cutting lines other than the plurality of blade escape grooves 231 are not formed in the table 200, the chuck table 200 may be protected, and the service life of the chuck table 200 may be improved.

In addition, according to the present invention, when the new seating unit 230 is installed and used in the chuck table 200 (that is, when the seating unit 230 is used for the first time), an additional step of forming the escape groove (S2100) is executed. In the subsequent cutting process of the semiconductor material s, the cutting process of the semiconductor material s may be performed based on the blade escape groove 231 formed in the stepping groove forming step S2100, and the step of forming the escape grooves ( S2100 is formed based on the positional information of the unit unit U, so that iterative accuracy with respect to the machining dimension of the unit unit U can be improved.

In addition, the blade escape groove 231 is formed of a processing tool for the mounting portion 230 having a thickness similar to the blade 110 or the thickness (t) of the blade 110, so as to have the same or similar width as the blade 110. It is possible to have the resin portion 3 of the semiconductor material s prevents burrs from occurring in the resin portion 3 even when the semiconductor material s is seated so that the seating portion 230 is seated on the upper surface. Can reduce the product failure rate.

In addition, the present invention includes the material remounting step (S2600), so that the semiconductor material can be accurately aligned to the mounting portion, thereby improving the repeatability of the machining dimension of the unit unit (U).

Fig. 16 is a schematic diagram of the LED material L cut by the present invention.

As shown in FIG. 16, the LED material L cut | disconnected by this invention is a board | substrate 1, the several LED element 5 mounted in the said board | substrate 1, the said board | substrate 1, and the said LED element. The resin part 3 laminated | stacked on the upper surface of (5), and the lens part 7 formed on the said resin part 3 are included. Preferably, the lens unit 7 may be integrally formed with the resin unit 3. The LED material L may be provided with a plurality of cutout lines CL1.

In the case of the LED material L, if the lens portion 7 provided on the light emitting surface is damaged, it is treated as a defective product. Therefore, it is important to prevent the lens portion 7 from being damaged. When the lens unit 7 is positioned to face the blade 110, a chip generated when the blade 110 cuts the LED material L into a plurality of unit LED units UL includes the lens unit ( 7) there is a concern that the damage can be applied to the bar, the cutting device for LED material 1000 'and the method for cutting the LED material (2000') according to the present invention that can prevent damage to the lens unit 7 ) Will be described.

FIG. 17 is a schematic perspective view of an LED cutting device 1000 'according to the present invention, and FIG. 18 is a schematic view of a seating part of the chuck table 200 included in the LED cutting device 1000' according to the present invention. Phosphorus is an enlarged view, and FIG. 19 is a schematic cross-sectional view of a cutting device 1000 'for LED materials according to the present invention.

As shown in FIGS. 17 to 19, the cutting device 1000 ′ for an LED material according to the present invention includes a blade assembly 100 including at least one blade 110; At least one of a main body block 210 and 220 and a seating part fixed to the main body blocks 210 and 220 and on which the LED material L is seated, the seating part, and an upper surface of the main body blocks 210 and 220. A chuck table 200 provided at the chuck table 200 including reference points 225 and 235 to align the LED material L with a reference position of the chuck table 200; And a controller 400 for controlling a movement path of the blade 110 with respect to the chuck table 200.

Further, preferably, the LED material L may be provided with a cutting line CL1 or a fiducial mark to be cut into a plurality of unit LED units UL. As described above, the cutout line CL1 may actually be provided in the LED material L, but as described below, the cutout line CL1 is a unit LED in the LED material L obtained by the photographing apparatus 300. The controller 400 may virtually determine or set the location information based on the location information of the unit UL.

Although not shown in the drawings, similar to the semiconductor material cutting device of FIG. 5, the LED material cutting device 1000 ′ transfers the plurality of photographing apparatuses 300 and the LED material L to the chuck table 200. At the same time, the material feeder 500 to align the LED material (L) to the seating portion of the chuck table 200, the blade moving device for adjusting the position of the blade 110 (or blade assembly 100) relative to the seating ( 150, the material transfer device 500 and the location information of the unit LED unit UL of the LED material L obtained by the photographing apparatus 300 or reference points 225 and 235 of the seating unit to be described later. And / or a controller 400 for controlling the blade moving device 150.

In addition, the plurality of photographing apparatuses 300 include a photographing apparatus 310 photographing the upper surface of the chuck table 200, a photographing apparatus 330 photographing the side surfaces of the chuck table 200, and the LED material (L). It may include a photographing device for photographing the surface. The photographing apparatuses 300 may include position information (eg, coordinates or angles) of the upper surface of the chuck table 200, or position information (eg, coordinates, angles, etc.) or blades of the LED material L. Information about whether the escape groove 231 is formed may be obtained.

In addition, the control unit 400 is based on the position information of the unit LED unit (UL) obtained from the photographing apparatus 300 and / or the position information of the seat or the upper surface of the chuck table based on the reference points (225, 235). The material feeder 500 is controlled such that the LED material L is located at the reference position of the seat, and / or the blade escape groove (described later) whose movement path of the blade 110 is based on the reference points 225 and 235. The blade mover 150 may be controlled to be aligned with the 231.

In particular, the controller 400 may determine the movement path of the relative motion between the blade and the chuck table based on the reference point of the chuck table. That is, the controller controls the position of the blade and the chuck table so that the blade 110 moves based on the reference points 225 and 235 provided in the seating portion or the blades formed based on the reference points 225 and 235. The movement path of the blade 110 is determined to move along the escape groove 231.

As such, the control unit 400 moves the blade 110 based on the chuck table 200, such that the chuck table 200 is generated by moving the blade 110 based on the material, such as a cutting device of a semiconductor material of the related art. ) Damage can be prevented. In addition, as described above, the unit LED unit since the cutting line (CL1) of the LED material (L) is aligned based on the reference point (225, 235) of the seating portion and then moving the blade 110 relative to the chuck table 200. It is also possible to prevent dimensional defects of UL.

As shown in FIG. 17, the chuck table 200 is fixed to the main body blocks 210 and 220 and the main body blocks 210 and 220, and a mounting portion on which the LED material L is seated, the LED material L. ) Includes at least one reference point (225, 235) to be aligned to the reference position of the chuck table 200. Here, the reference position is a position corresponding to the cut line CL1 of the LED material L in the seating portion, and preferably, a plurality of blade escape grooves 231 and the cut line CL1 correspond to each other. .

The body blocks 210 and 220 of the chuck table 200 include a lower block 210 serving as a support, and an upper block 220 positioned at an upper portion of the lower block 210 to which a seating part is fixed. The upper block 220 is provided with a vacuum chamber 227 forming a vacuum suction input to be delivered to the seating portion.

As a variant of the body blocks 210 and 220, the body blocks 210 and 220 may be a single block. In addition, the vacuum chamber 227 is not formed in the body blocks 210 and 220, but may be formed in a separate vacuum suction device to transmit a vacuum suction input to the seating part.

The seating part may be integrally formed with the body blocks 210 and 220.

However, the seating part may be detachably fixed to the body blocks 210 and 220. In this case, in detail, the seating unit may be fixed to the main body blocks 210 and 220 by a vacuum suction method or by a screwing method. However, this is an exemplification and the present invention is not limited thereto. Since the seating unit is detachably mounted to the main body blocks 210 and 220, the rest of the chuck table 200 may be used as it is by replacing only the seating unit, which is a main damaged part of the chuck table 200, and the chuck table 200. Maintenance cost can be reduced, and the service life of the entire chuck table 200 can be improved.

Referring to FIGS. 17 and 18, the seating unit may include at least one reference point 225 and 235 to allow the LED material L to be aligned with a reference position of the chuck table 200, based on the reference point. The plurality of blade escape grooves 231 and the plurality of blade escaping grooves 231 forming spaces for completely cutting the semiconductor material may be formed at the positions corresponding to the unit LED units UL of the LED material L. A plurality of receiving grooves 236 for receiving the lens portion 7 of L), and / or a vacuum tube for fixing the LED material in a vacuum suction method at a position corresponding to the unit LED unit, and / or in communication with the vacuum tube; It includes a suction unit for enhancing the vacuum suction force in a position corresponding to the unit LED unit.

Preferably, the adsorption portion may be provided in the seating portion as a separate component different from the accommodation groove, or the adsorption portion may be the accommodation groove.

On the seating portion, the LED material L is fixed in a vacuum suction method so that the lens portion 7 of the LED material L is accommodated in the receiving groove 236. That is, the LED material may be fixed to the seating portion such that the lens portion faces the receiving groove.

Preferably, the shape and size of the receiving groove 236 may correspond to the shape and size of the lens unit (7). More preferably, the shape of the accommodation groove corresponds to the shape of the lens portion, the volume of the accommodation groove may be greater than or equal to the volume of the lens portion.

Thus, the lens portion 7 of the LED material L is cut by providing the receiving groove 236 in the mounting portion and mounting the LED material L so that the lens portion 7 is accommodated in the receiving groove 236. Damage to the chip generated in the process can be prevented, and the defective rate of the LED material L in the cutting process can be reduced. In addition, when the LED material L is seated so that the lens portion 7 faces the blade 110, the blade 110 may be formed due to spatial interference between the blade holding portion 130 and the lens portion 7, which will be described later. Although the range of use may be limited, the range of use of the blade 110 may be extended by seating the lens unit 7 in the receiving groove 236 as in the present invention, thereby improving the life of the blade 110. .

Reference points 225 and 235 of the chuck table 200 are provided on at least one of a seating portion of the chuck table 200 and an upper surface of the body blocks 210 and 220. The reference point may be a mark artificially formed as an alignment mark as shown in the drawings, but the present invention is not limited thereto, and the reference point may be an identifiable configuration formed in the chuck table. have. For example, the reference point may be a structure formed in the chuck table, such as a dowel pin or a dowel hole, and an outer edge portion of the chuck table (for example, a body block and a seating part). It may also be a specific part of the chuck table.

The controller 400 determines position information (eg, coordinates or angles) of the seating part based on the reference points 225 and 235, and a plurality of blade escape grooves based on the reference points 225 and 235. 231 is formed.

18 and 19, the plurality of blade escape grooves 231 includes a plurality of lateral guide grooves and a plurality of longitudinal guide grooves. That is, the plurality of blade escape grooves 231 are formed in a checkerboard shape. Here, an interval between one blade escape groove 231, one blade escape groove 231, and a neighboring blade escape groove 231 is equal to the horizontal length or vertical length of the unit LED unit UL. Specifically, the distance between one lateral guide groove and the lateral guide groove and the other one of the neighboring lateral guide grooves corresponds to the longitudinal length of the unit LED unit UL, and one longitudinal guide groove and the The spacing between the longitudinal guide groove and another neighboring longitudinal guide groove corresponds to the width of the unit LED unit UL.

Referring to FIG. 19, the width of the blade escape groove 231 is 95% to 120% of the thickness t of the blade 110. Preferably, the width of the blade escape groove 231 may be equal to the thickness (t) of the blade (110).

As such, the blade escape groove 231 is formed such that the width of the blade escape groove 231 is equal to or substantially similar to the thickness of the blade 110, thereby facilitating the movement path of the blade 110 to the blade escape groove 231. Can be guided and at the same time with the resin part 3 of the LED material L (for example, the resin part 3 may be composed of an epoxy resin or a silicone resin) in contact with the upper surface of the seating part. Even when cutting the LED material (L) with the blade 110, the gap between the blade 110 and the blade escape groove 231 is very small to prevent the resin portion 3 from being rolled toward the blade escape groove 231. Can produce a unit LED unit (UL) without burrs.

Referring to FIG. 18, the seating part is fixed to protrude a predetermined height h from the top surface of the body blocks 210 and 220 (that is, the upper block 220) from the body blocks 210 and 220. The predetermined height h is preferably greater than the depth d of the blade escape groove 231 in order to prevent spatial interference between the movement path of the blade 110 and the body blocks 210 and 220.

Preferably, the seating portion may be made of a material having a lower hardness than the material of the body block.

In addition, the mounting portion must firmly support the resin portion 3 so that the resin portion 3 of the LED material L does not penetrate into the blade escape groove 231. For this purpose, the seating portion is composed of one of a high hardness polymer material, Al and Al alloy. The high hardness polymer may be, for example, high hardness rubber or polyetheretherketone (PEEK).

Referring to FIG. 19, the blade assembly 100 includes a blade 110 and a blade grip 130 that supports the blade 110 and transmits rotational power to the blade 110. Although not shown in the drawing, the blade assembly 100 is connected to the blade 110 positioning device, the blade 110 positioning device by the control unit 400 to the blade 110 to the chuck table 200. Can be moved up, down, left, and right. Preferably, the blade 110 is a circular blade 110, the blade 110 may be rotated in the downward cutting direction.

20 schematically illustrates a state in which the LED material L is seated on the seating portion of the chuck table 200 according to the present invention.

According to the invention, the LED material (L) may be seated so that the lens portion 7 is accommodated in the receiving groove 236 provided in the seating portion at the seating portion, the LED material (L) is the lens portion ( 7) shall not be seated facing the blade 110 side. This is to prevent the lens unit 7 from being damaged by the chip generated in the cutting process as described above. This is the difference between the cutting device for semiconductor material according to the present invention and the cutting device 1000 'for LED material according to the present invention.

Hereinafter, the process of forming the blade escape groove 231 provided in the seating portion of the present invention will be described.

21A and 21B schematically illustrate a process of forming the blade escape groove 231 and a cutting process of the LED material L in the seating portion of the chuck table 200 according to an embodiment of the present invention.

21A and 21B, after determining the mounting surface of the LED material L such that the lens portion 7 of the LED material L is accommodated in the receiving groove 236 of the mounting portion, the LED material L is determined. LEDs based on the location information of the unit LED unit UL in the cut line CL1 or the LED material L acquired by the photographing apparatus 300 and the reference points 225 and 235 of the chuck table 200. The material L is aligned with the seating portion, and then a vacuum suction input is transmitted from the vacuum chamber 227 to the receiving groove 236 to fix the LED material L to the seating portion. In this state, after determining the movement path of the blade 110 based on the position of the blade 110 based on the reference point (225, 235), the blade 110 is seated based on the reference point (225, 235). The LED material L is cut by moving forward to the predetermined depth d while the blade escape groove 231 of the predetermined depth d is formed at the mounting portion. By repeating the above-described process, a plurality of blade escape grooves 231 are formed in the seating portion.

The blade escape groove 231 thus formed is aligned with the LED material L relative to the seating part in the cutting process of the LED material L (ie, the position of the blade escape groove 231 and the position of the cut line CL1). To correspond to) and the position alignment criteria of the blade 110 relative to the seating portion to determine the movement path of the blade 110.

Referring to FIG. 19, as a modified embodiment of the process of forming the blade escape groove 231 in the mounting portion of the chuck table 200 according to the present invention, before the LED material (L) is seated in the mounting portion, the mounting portion The blade escape groove 231 may be formed based on the reference points 225 and 235. Specifically, the control unit 400 is the position information and the chuck table 200 of the unit LED unit UL in the cut line CL1 provided in the LED material L or the LED material L acquired by the photographing apparatus 300. Based on the reference points 225 and 235, the virtual target incision is determined in the seating portion. In this case, the target incision is a virtual reference position corresponding to the cut line CL1 provided in the LED material L when the LED material L is seated on the seating part. Thereafter, the position of the blade 110 is moved along the target incision to a predetermined depth d of the mounting portion to form the blade escape groove 231 of the predetermined depth d of the mounting portion. By repeating the above-described process, a plurality of blade escape grooves 231 are formed in the seating portion.

Hereinafter, the cutting method 2000 'of the LED material according to the present invention will be described. Preferably, the method for cutting the LED material 2000 'according to the present invention is carried out using the above-described cutting device for LED material 1000' according to the present invention, wherein each step is for cutting the LED material according to the present invention. Controlled by the control unit 400 of the device 1000 '.

22 is a schematic flowchart illustrating a cutting method of the LED material according to the present invention.

As shown in FIG. 22, the cutting method 2000 ′ of the LED material according to the present invention includes a plurality of units of the LED material s fixed to the seating part 230 of the chuck table 200 by the blade 110. As a method of cutting into the LED unit U, the LED material fixed to the seating part is cut into a plurality of unit LED units through relative movement between the blade and the chuck table.

The cutting method (2000 ') of the LED material includes a material seating step (S2200') for seating the LED material on the chuck table; A cutting path alignment step (S2300 ′) for determining a relative movement path between the chuck table and the blade based on a reference point formed on the chuck table; And a material cutting step (S2400 ′) of cutting the LED material into a plurality of unit LED units through relative movement of the chuck table and the blades.

Specifically, the control unit 400 first controls the material transfer device 500 to transfer the LED material to the seating portion 230 of the chuck table, and then to control the vacuum suction device suction unit provided in the seating portion 230 A vacuum suction input is applied to 233 to fix the LED material s to the seating part 230.

In the material seating step, the seating portion of the chuck table is provided with a receiving groove for receiving the lens portion of the LED material, the LED material is mounted to the seating portion so that the lens portion facing the receiving groove.

In this case, before the seating step, the controller may additionally execute a material sorting step of aligning the LED material with respect to the seating part based on a reference point formed in the seating part.

In the case of additionally executing the material sorting step, for example, the controller may include a dowel groove or a dowel pin provided in the chuck table and a dowel pin or dowel groove provided in the LED material so as to correspond to the dowel groove or the dowel pin of the chuck table. Can be used to align the LED material to the seat.

In addition, when the material alignment step is additionally performed, for example, the controller determines a plurality of (virtual) cut lines CL1 in the LED material s to obtain position information of the cut lines, or uses the LED as a photographing apparatus. Acquire the position information of the cut line provided in the material, and based on the position information of the cut line and / or the reference point formed in the chuck table, a plurality of (virtual) target incisions to the seating portion 230 of the chuck table 200 After determining the part, the controller controls the material feeder or moves the position of the chuck table to correct the position of the LED material s with respect to the seating part 230 based on the cut line CL1 and the target incision. do.

However, this is exemplary and the present invention is not limited to the material sorting step described above.

Thereafter, the controller determines a movement path of relative movement of the chuck table and the blade based on a reference point formed in the chuck table. For example, the controller determines a plurality of (virtual) target incisions on the seating part 230 of the chuck table 200 based on the position information of the perforated line obtained by the photographing apparatus and / or the reference point formed in the chuck table. The controller then controls the blade feeder or corrects the position of the blade relative to the chuck table based on the target incision by moving the position of the chuck table (ie, adjusting the relative position between the blade and the chuck table). Then, the cutting path which is the movement path of the relative motion of the chuck table and the blade is aligned.

Thereafter, the controller controls the blade feeder and / or controls the position of the chuck table to cut the LED material into a plurality of unit LED units by moving the chuck table and the blade relative to the reference point of the chuck table. For example, the controller cuts the LED material into a plurality of unit LED units by moving the blades along the movement paths of the relative movement of the chuck table and the blades determined in the cutting path alignment step (S2300 ′).

The cutting path alignment step S2300 ′ and the material cutting step S2400 ′ may be executed sequentially or simultaneously.

The cutting method of the LED material according to the present invention may additionally include a stepping groove forming step (S2100 ') and / or the material re-seat step (S2600'), hereinafter the stepping groove forming step (S2100 ') and / or It will be described with respect to the cutting method of the LED material including the material reseating step (S2600 ').

FIG. 23 is a schematic flowchart illustrating a cutting method of LED material according to the first additional embodiment of the present invention, and FIG. 24 is a schematic flowchart illustrating a cutting method of the LED material according to the second additional embodiment of the present invention. .

According to the first and second additional embodiments of the present invention, the present invention provides a step of forming an escape groove for forming a blade escape groove on a seating portion of the chuck table based on a reference point formed on the chuck table (S2100 '). ); Further includes. The blade escape groove is formed through relative movement between the chuck table and the blade.

According to a first additional embodiment of the present invention, the control unit executes the escape groove forming step (S2100 ′) before the material seating step (S2200 ′), and according to the second additional embodiment of the present invention, the controller performs the escape groove forming step. (S2100 ') is executed simultaneously with the material cutting step (S2400').

According to the first embodiment of the present invention, as shown in Figure 23, the control unit first forms a blade escape groove in the seating portion of the chuck table based on the reference point formed on the chuck table.

Specifically, the control unit 400 obtains the location information of the unit LED unit U from the LED material (s) with the photographing apparatus 300 to position information and seating of the unit LED unit (U) of the LED material (s) A plurality of (virtual) target incisions are determined on the seating part 230 based on the reference points 225 and 235 provided in the part 230. Subsequently, the controller 400 controls the blade feeder 150 to move the blade 110 along a plurality of target incisions, thereby cutting the seating portion 230 by a predetermined depth d to thereby provide a plurality of blade escape grooves. 231 is formed.

As a result, the blade escape groove 231 is formed such that the width w is equal to or nearly equal to the thickness t of the blade 110.

As a modified embodiment of the stepped groove forming step (S2100 ′), the stepped groove forming step (S2100 ′) determines a plurality of target cutouts in the seating portion 230 of the chuck table 200, and then sits along the target cutouts. The bouillon processing tool may be moved to cut the mounting portion 230 by a predetermined depth d to form a plurality of blade escape grooves 231.

Here, the seating processing tool is a tool composed of high hardness and high strength metal as a cutting tool, the seating processing tool is coupled to the blade feeder 150 to replace the blade 110 under the control of the control unit 400 Can be set. The thickness of the processing tool for the mounting portion 230 is preferably 95% to 120% of the thickness (t) of the blade (110). As a result, the blade escape groove 231 is formed such that the width w is about 95% to 120% of the thickness t of the blade 110.

After the evacuation groove forming step (S2100 ′), the controller executes a material seating step (S2200 ′), a material alignment step, and a material cutting step 2400.

According to the second embodiment of the present invention, as shown in FIG. 24, the controller first executes the material seating step (S2200 ′) and the cutting path alignment step 2300 included in the cutting method of the LED material according to the present invention. do.

Thereafter, the control unit forms a blade escape groove in the seating portion of the chuck table based on the reference point formed in the chuck table.

Thereafter, the controller 400 controls the blade feeder 150 and / or controls the position of the chuck table (i.e., controls the relative movement between the blade and the chuck table), and the LED material seated on the seating portion ( While cutting s) into a plurality of unit LED units U, a plurality of blade escape grooves 231 are simultaneously formed in the mounting portion 230.

At this time, for example, the control unit 400 obtains the location information of the unit LED unit U from the LED material (s) with the photographing apparatus 300 to position the unit LED unit (U) of the LED material (s) A plurality of (virtual) target incisions are determined at the seating portion 230 based on the reference points 225, 235 provided in the information and / or seating portion 230. Thereafter, the controller 400 controls the positions of the blade feeder 150 and / or the chuck table to move the blades 110 along a plurality of target incisions to move the seating portion 230 by a predetermined depth d. By cutting, the LED material s is cut into a plurality of unit LED units U, and a plurality of blade escape grooves 231 are formed at the same time.

As a result, the blade escape groove 231 is formed such that the width w is equal to or nearly equal to the thickness t of the blade 110.

As described above, in the cutting processing cycle after forming the blade escape groove, the controller repeatedly executes the above-described material seating step (S2200 ′), the cutting path alignment step (2300), and the material cutting step (2400).

25 is a schematic flow chart showing a cutting method of the LED material according to a third additional embodiment of the present invention, Figure 26 is a schematic flow chart showing a cutting method of the LED material according to a fourth additional embodiment of the present invention. to be.

According to the third and fourth additional embodiments of the present invention, a method of cutting an LED material according to the present invention comprises a relative movement path between a chuck table and a blade and a cut line of the LED material adsorbed and fixed to the chuck table. When the degree of separation of the chuck table exceeds a preset range, the suction of the LED material to the chuck table is released and the LED material is separated from the chuck table using a material feeder, and then the LED material is removed from the chuck table. Re-seating step of seating again in (S2600 '); further includes.

According to a third additional embodiment of the present invention, as shown in FIG. 25, the controller first executes the material seating step S2200 ′.

Thereafter, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the LED material adsorbed and fixed to the chuck table is within a preset range (S2500 ′). The predetermined range may be, for example, about 0 to 40 μm, and preferably about 0 to 5 μm.

In this case, when the controller determines that the deviation degree is within a preset range, the controller executes the cutting path alignment step 2300 and the material cutting step 2400 described above.

On the contrary, when the controller determines that the deviation degree exceeds a preset range, the controller controls the chuck table and the material feeder, releases the adsorption fixation of the LED material to the chuck table, and uses the material feeder. After separating the LED material from the chuck table, the LED material is seated on the chuck table again.

In this case, preferably, the material remounting step (S2600 ′) may include the material alignment step described above before the LED material is seated on the chuck table again.

Subsequently, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the LED material adsorbed and fixed to the chuck table is within a predetermined range with respect to the LED material remounted on the seating part ( S2500 ').

According to a fourth additional embodiment of the present invention, according to the third additional embodiment of the present invention, the controller executes the material reseating step (S2600 ′) between the material seating step (S2200 ′) and the cutting path alignment step (2300). However, according to the present exemplary embodiment, the controller is the same as the third exemplary embodiment except that the material re-seating step (S2600 ′) is executed between the cutting path alignment step 2300 and the material cutting step 2400. Do.

That is, the controller executes the material seating step (S2200 ′) and the cutting path alignment step (2300), and relative to the LED material seated on the seating part, the relative movement path between the chuck table and the blade, and the suction is fixed to the chuck table. It is determined whether the degree of departure between the cut lines of the LED material is within a predetermined range (S2500 ').

In this case, when the controller determines that the degree of departure is within a preset range, the controller executes the above-described material cutting step 2400.

On the contrary, when the controller determines that the deviation degree exceeds a preset range, the controller controls the chuck table and the material feeder, releases the adsorption fixation of the LED material to the chuck table, and uses the material feeder. After separating the LED material from the chuck table, the LED material is seated on the chuck table again.

In this case, preferably, the material remounting step (S2600 ′) may include the material alignment step described above before the LED material is seated on the chuck table again.

Subsequently, the controller determines whether the deviation between the relative movement path between the chuck table and the blade and the cutting line of the LED material adsorbed and fixed to the chuck table is within a predetermined range with respect to the LED material remounted on the seating part ( S2500 ').

According to the present invention, the present invention can execute cutting of the LED material L based on the chuck table 200 (that is, based on the reference points 225 and 235 or the blade escape groove 231). Since cutting lines other than the plurality of blade escape grooves 231 are not formed in the table 200, the chuck table 200 may be protected, and the service life of the chuck table 200 may be improved.

Further, according to the present invention, when the new seat is installed and used in the chuck table 200 (that is, when the seat is used for the first time), an additional step of forming the escape groove (S2500) is performed and the LED material (L) thereafter. In the cutting process of), the cutting process of the LED material (L) can be performed based on the blade escape groove 231 formed in the stepping groove forming step (S2500), and the stepping groove forming step (S2500) is a unit LED unit (UL). Since it is formed based on the positional information of), it is possible to improve the repeatability of the machining dimension of the unit LED unit (UL).

In addition, since the blade escape groove 231 is formed of a processing tool for the mounting portion having a thickness similar to the blade 110 or the thickness t of the blade 110, the blade escape groove 231 may have the same or similar width as that of the blade 110. Even if the LED material L is seated so that the resin part 3 of the LED material L is seated on the upper surface, burrs can be prevented from occurring in the resin part 3, thereby reducing product defect rate. You can.

In addition, by mounting the LED material (L) so that the lens portion 7 is accommodated in the receiving groove 236 and performing a cutting method, the lens portion 7 of the LED material (L) to the chip generated in the cutting process Can be prevented from being damaged, and the defective rate of the LED material L in the cutting process can be reduced. In addition, when the LED material (L) is seated so that the lens portion 7 toward the blade 110, the use range of the blade 110 due to the spatial interference between the blade holding portion 130 and the lens portion 7 However, there is a possibility that it is limited, by mounting the lens unit 7 in the receiving groove 236 as in the present invention can extend the range of use of the blade 110 can improve the life of the blade (110).

In addition, the present invention includes the material remounting step (S2600 ′), so that the LED material can be accurately aligned with the mounting part, thereby improving the repeatability of the processing dimension of the unit LED unit U.

27A and 27B are schematic views of a unit LED unit cut in accordance with the prior art and the present invention.

As shown in Figure 27a, the unit LED unit cut by the cutting device according to the prior art has generated a lot of burrs (burr) on the edge, it can be seen that the dimensional accuracy and dimensional uniformity of the unit LED units is very low.

However, as shown in FIG. 27B, the unit LED unit cut by the cutting device for LED material and the cutting method of the LED material according to the present invention did not generate burrs at the edges at all. It can be seen that the dimensional accuracy and the dimensional uniformity are very high. This is because, as described above, the blade escape groove 231 having a thickness equal to the thickness of the blade 110 or a thickness close to the thickness t of the blade 110 is formed in the seating portion of the chuck table, and the LED material This is because the resin portion 3 in (L) can be prevented from being pushed toward the blade escape groove.

While the present invention has been particularly shown and described with reference to preferred embodiments thereof, it will be understood by those skilled in the art that various changes and modifications may be made without departing from the spirit and scope of the invention as defined in the following claims. . It is therefore to be understood that the modified embodiments are included in the technical scope of the present invention if they basically include elements of the claims of the present invention.

1000: Cutting device for semiconductor material 1000 ': Cutting device for LED material
2000: Cutting method of semiconductor material 2000 ': Cutting method of LED material
100: blade assembly 110: blade
200: Chuck Table 210, 220: Body Block
230: seating portion 231: blade escape groove
236: receiving groove 300: recording device
400: control unit 500: material transfer device

Claims (38)

A cutting device for semiconductor materials for cutting semiconductor materials into a plurality of unit units,
A blade for cutting semiconductor material;
A chuck table having a seating portion on which the semiconductor material is seated and a reference point; And
And a controller configured to control a movement path of the chuck table with respect to the blade.
And the control unit determines a movement path of relative movement between the blade and the chuck table based on the reference point. The method of claim 1,
And the seating portion includes a plurality of blade escape grooves formed on the basis of the reference point. The method according to claim 1 or 2,
The chuck table further includes a main body block for supporting the seating portion, wherein the seating portion is fixedly replaceable to the body block, and the seating portion is made of a material having a lower hardness than the material of the body block. Cutting equipment for materials. The method according to claim 1 or 2,
The chuck table further includes a main body block supporting the seating portion, wherein the seating portion is formed integrally with the main body block. The method of claim 2,
The distance between neighboring blade escape grooves is a cutting device for a semiconductor material, characterized in that the same as the transverse length or longitudinal length of the unit unit. The method of claim 2,
The chuck table further includes a main body block for supporting the seating portion, wherein the seating portion is fixed to protrude a predetermined height than the upper surface of the body block in the body block. The method according to claim 6,
And the predetermined height is greater than the depth of the blade escape groove. The method according to claim 1 or 2,
And the seating portion includes a vacuum tube for fixing the semiconductor material by a vacuum suction method at a position corresponding to the unit unit. 9. The method of claim 8,
And the seating unit has an adsorption unit for enhancing vacuum suction force at a position corresponding to the unit unit, wherein the adsorption unit is in communication with the vacuum tube. A method of cutting a semiconductor material in which the semiconductor material is cut by a blade into a plurality of unit units,
A material seating step of seating the semiconductor material on a chuck table;
A cutting path alignment step of determining a moving path of relative movement between the chuck table and the blades based on a reference point formed in the chuck table;
And a material cutting step of cutting the semiconductor material into a plurality of unit units through the relative movement of the chuck table and the blades. The method of claim 10,
And an escape groove forming step of forming a blade escape groove in a seating portion of the chuck table based on the reference point. The method of claim 10,
When the deviation between the movement path of the relative movement between the chuck table and the blade and the cutting line of the semiconductor material adsorbed and fixed to the chuck table exceeds a predetermined range,
A material reseating step of releasing the adsorption fixation of the semiconductor material to the chuck table and separating the semiconductor material from the chuck table by using a material transfer device, and then seating the semiconductor material on the chuck table again; A cutting method of a semiconductor material, characterized in that. The method of claim 10,
And the cutting path alignment step and the material cutting step are performed simultaneously. The method of claim 11,
The blade escape groove is formed by the relative movement between the chuck table and the blade cutting method of the semiconductor material. 15. The method of claim 14,
And the step of forming the escape groove is performed simultaneously with the cutting of the material. The method according to claim 11 or 14,
Wherein the step of forming the escape groove is performed before the material seating step. A cutting device for an LED material for cutting an LED material including a substrate, an LED element mounted on the substrate, and a resin part disposed on the substrate and forming a lens part, into a plurality of unit LED units,
A blade for cutting the LED material;
A chuck table having a seating portion on which the LED material is seated and a reference point; And
And a controller configured to control a movement path of relative movement between the blade and the chuck table.
The seating portion has a receiving groove for receiving the lens portion and a plurality of blade escape grooves formed on the basis of the reference point, the LED material is seated on the seating portion so that the lens portion facing the receiving groove,
And the control unit determines the movement path of the relative motion between the blade and the chuck table based on the reference point. A cutting device for an LED material for cutting an LED material including a substrate, an LED element mounted on the substrate, and a resin part disposed on the substrate and forming a lens part, into a plurality of unit LED units,
A blade for cutting the LED material;
A chuck table having a seating portion on which the LED material is seated and a reference point; And
And a controller configured to control a movement path of the chuck table with respect to the blade.
The seating portion has a receiving groove for receiving the lens portion, the LED material is fixed to the seating portion so that the lens portion faces the receiving groove,
The control unit is a cutting device for LED materials, characterized in that for determining the movement path of the relative movement between the blade and the chuck table based on the reference point. 19. The method of claim 18,
And the seating part includes a plurality of blade escape grooves formed on the basis of the reference point. The method of claim 17 or 18,
The shape of the receiving groove corresponds to the shape of the lens portion, the volume of the receiving groove is LED material cutting device, characterized in that more than the volume of the lens portion. The method of claim 17 or 18,
The chuck table further includes a body block on which the seating part is supported, the seating part is fixedly replaceable to the body block, and the seating part is made of a material having a lower hardness than the material of the body block. Cutting device for LED materials. The method of claim 17 or 18,
The chuck table further includes a body block on which the seating part is supported, wherein the seating part is cut integrally with the body block. The method of claim 17 or 19,
The spacing between neighboring blade escape grooves is a cutting device for LED material, characterized in that the same as the length or length of the unit LED unit. The method of claim 17 or 19,
The width of the blade escape groove is a cutting device for LED materials, characterized in that 95% to 120% of the thickness of the blade. The method of claim 17 or 19,
The chuck table further includes a body block on which the seating part is supported, wherein the seating part is fixed to protrude a predetermined height above the upper surface of the body block in the body block. 26. The method of claim 25,
And said predetermined height is greater than the depth of said blade escape groove. The method of claim 17 or 18,
Cutting device for the LED material, characterized in that the seating portion is made of a material of one of high hardness rubber, PEEK, Al and Al alloy. The method of claim 17 or 18,
The seating part is a cutting device for LED material, characterized in that it comprises a vacuum tube for fixing the LED material in a vacuum suction method at a position corresponding to the unit LED unit. 29. The method of claim 28,
And the seating unit has an adsorption unit for enhancing vacuum suction force at a position corresponding to the unit LED unit, and the adsorption unit is in communication with the vacuum tube. 30. The method of claim 29,
Cutting device for the LED material, characterized in that the adsorption portion is the receiving groove. A cutting method of LED material for cutting an LED material including a substrate, an LED element mounted on the substrate, and a resin part disposed on the substrate and forming a lens part by a plurality of unit LED units using a blade.
A material seating step of seating the LED material on the chuck table;
A cutting path alignment step of determining a moving path of relative movement between the chuck table and the blades based on a reference point formed in the chuck table;
And a material cutting step of cutting the LED material into a plurality of unit LED units through relative movement of the chuck table and the blade. 32. The method of claim 31,
In the material mounting step,
The mounting portion is provided with a receiving groove for receiving the lens portion, the LED material is a cutting method of the LED material, characterized in that the lens portion is seated on the mounting portion facing the receiving groove. 33. The method according to claim 31 or 32,
And an escape groove forming step of forming a blade escape groove on a seating portion of the chuck table based on the reference point. 33. The method according to claim 31 or 32,
When the deviation between the movement path of the relative movement between the chuck table and the blade and the cutting line of the LED material adsorbed and fixed to the chuck table exceeds the predetermined range,
After the LED material is separated from the seating portion, the material re-seating step of mounting the LED material back to the chuck table; cutting method further comprising a. 33. The method according to claim 31 or 32,
The cutting method of cutting the LED material, characterized in that the cutting path alignment step and the material cutting step is performed at the same time. 34. The method of claim 33,
The blade escape groove is formed by the relative movement between the chuck table and the blade cutting method of the LED material. 34. The method of claim 33,
And the step of forming the escape groove is performed simultaneously with the material cutting step. 34. The method of claim 33,
The step of forming the escape groove is a cutting method of the LED material, characterized in that is carried out before the material seating step.

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