KR20120134421A

KR20120134421A - Wire and sealer for the same

Info

Publication number: KR20120134421A
Application number: KR1020110053309A
Authority: KR
Inventors: 정재호
Original assignee: (주)씨제이텍; 정재호
Priority date: 2011-06-02
Filing date: 2011-06-02
Publication date: 2012-12-12

Abstract

The present invention relates to a wire used in a wire connecting device for arranging and connecting wires in a pattern set on a substrate, wherein the wire is a conductor, and an insulating layer is formed to surround the outer circumferential surface of the conductor. A fusion layer is formed to surround, and the fusion layer is heated to provide a wire patterned on the substrate.
The wire and the wire connecting device according to the present invention are simple in structure and easy to operate, and have an effect of more fusion bonding of the wire on the substrate using a wire provided with a fusion layer. At the same time, since the substrate and the conductor are fused at the same time, the fixing is performed, thereby shortening the process time and increasing productivity.

Description

Wire and Wire Junctions {Wire and sealer for the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire and a wire connecting device, and more particularly, to a wire and a wire connecting device which enables the wire to be more firmly fused on a substrate.

In general, smart cards are formed by arranging multiple wires on a plastic substrate and connecting chips to ends of the wires. For the purpose of forming a frequency coil with this wire, wires made of conductive conductors such as copper, aluminum, silver, gold, copper plated aluminum, and copper + silver alloy are used. Conventionally, vertical and vertical movements induced by ultrasonic waves are used. The wire is arranged on the substrate through the device having.

For example, the wire conductor connecting device of Korean Patent Application No. 1998-0706216 of the prior art arranges wires while generating a predetermined pattern on the substrate surface by generating vibration in a vertical direction by a wiring apparatus including an ultrasonic generator.

By vibrating the vibration punch up and down through the ultrasonic wave by the ultrasonic generator, the wire is embedded in the substrate surface, a coil is formed while forming a predetermined pattern, and the end of the wire is connected to the chip module.

However, the conventional wire conductor connecting apparatus using the ultrasonic method has a problem that the manufacturing cost is increased and difficult to manage due to the ultrasonic generator, and the method of driving the wire conductor connecting apparatus using the ultrasonic method is difficult.

In addition, there is a structural limitation that the wire conductors are not firmly fused on the substrate so that defects and breakages frequently occur.

The present invention relates to a wire and a wire connecting device, and more particularly, to provide a wire and a wire connecting device which enables the wire to be more firmly embedded on a substrate.

The present invention relates to a wire used in a wire connecting device for arranging and connecting wires in a pattern set on a substrate, wherein the wire is a conductor, and an insulating layer is formed to surround the outer circumferential surface of the conductor. A fusion layer is formed to surround, and the fusion layer is heated to provide a wire patterned on the substrate.

The fusion layer may include one selected from the group consisting of polyamide, epoxy, butylal and polyester.

In another aspect, the present invention provides a bed for transferring a substrate to be processed, a wire supply unit for continuously supplying the wire of claim 1 or claim 2, moving to form a conductor of the wire in a predetermined pattern on the substrate, and the wire supply unit It provides a wire connecting device comprising a hot air supply portion for applying the hot air to the wire is fixed to the substrate by the fusion layer, and a cut portion for cutting the wire after the conductor is fixed to the substrate.

The substrate may include one selected from paper coated with an adhesive material, cotton paper coated with an adhesive material, and aluminum sheet coated with an adhesive material.

The wire connecting device may further include a heating unit to preheat the substrate on the bed in the range of 60 ~ 100 ℃.

Wire and wire connection device according to the present invention,

The structure is simple and the operation method is easy, and there is an effect that the wire can be more firmly fused on the substrate by using the wire provided with the fusion layer.

In addition, since the fixing is performed while the substrate and the conductor are fused at the same time as supplying the wire, there is an effect of shortening the process time and increasing productivity.

1 is a perspective view showing a wire connecting device according to an embodiment of the present invention,
2 is a perspective view showing a wire according to another embodiment of the present invention;
3 is a perspective view showing a state in which the wire shown in FIG. 2 is connected to a substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Prior to this, terms and words used in the present specification and claims should not be construed as limited to ordinary or dictionary terms, and the inventor should appropriately interpret the concepts of the terms appropriately The present invention should be construed in accordance with the meaning and concept consistent with the technical idea of the present invention.

1 is a perspective view showing a wire connection device 100 according to an embodiment of the present invention.

Referring to FIG. 1, the wire connection device 100 includes a bed 110 for transferring a substrate 111 to be processed and a wire supply part 120 for fusion welding the wire 200 in a pattern set on the substrate 111. ), A hot air supply unit 130 for supplying hot air into the wire supply unit 120, and a cutting unit 140 for fusion of the wire 200 to the substrate 111 and cutting the wire 200. It includes.

The wire supply unit 120 has a flow path 121 for transferring heated air supplied from the hot air supply unit 130 therein, and the heated air and the wire 200 at an end of the flow path 121. It is formed to discharge at the same time. Of course, after the wire 200 is formed in the set pattern on the substrate 111, the heated air is sequentially supplied to the wire 200 to fuse the wire 200 to the substrate 111. have.

An end of the wire supply unit 120 is formed with a discharge hole 122 through which the wire 200 and heated air are discharged, and the wire 200 may be supplied from the outside adjacent to the discharge hole 122. The supply hole 123 is formed. Therefore, since hot air is discharged through the discharge hole 122 of the wire supply unit 120, the discharge hole 122 may be prevented from being blocked by the wire 200.

The hot air supply unit 130 has a heater (not shown) therein to heat external air and supply it to the flow passage 121. At this time, the temperature of the heated air supplied to the passage 121 is Supply about 130 ~ 450 ℃.

At this time, the wire 200 is introduced into the supply hole 123 and the heating is started by the hot air supply unit 130, the heating of the wire 200 is processed by the wire 200 on the substrate 111 The degree of heating can be controlled in accordance with the time required, and the degree of heating can also be controlled by adjusting the temperature of the heated air.

The heated air supplied on the flow path 121 heats the outside of the wire 200 and dissolves the surface of the substrate 111 appropriately in a range in which damage is not applied to the substrate 111. The 200 is fused so as to be indented by the set depth.

In this case, the wire connection device 100 includes a heating unit 160 installed inside the bed 110 or adjacent to the substrate 111 to preheat the substrate 111. The heating unit 160 may heat the substrate 111 to about 60 ~ 100 ℃ to facilitate the operation when the wire 200 is fused.

The cutting unit 140 is disposed adjacent to the discharge hole 122 formed at the end of the wire supply unit 120, and is provided with a separate cutter (not shown) to cut the wire 200.

2 is a perspective view illustrating a wire 200 according to another embodiment of the present invention, and FIG. 3 is a perspective view illustrating a state in which the wire 200 illustrated in FIG. 2 is connected to the substrate 111.

2 and 3, the wire 200 has a wire-shaped conductor 210 disposed therein, an insulating layer 220 is formed to surround the outer circumferential surface of the conductor 210, and the insulating layer A fusion layer 230 is formed to surround the outer circumferential surface of 220.

The conductor 210 is mainly copper, and may be replaced with another type of conductor in some cases. The conductor 210 is disposed in a pattern set on the substrate 111 together with the insulating layer 220 and the fusion layer 230.

The insulating layer 220 is coated to prevent the conductor 210 from being exposed to the outside for the purpose of insulating the conductor 210 from the outside.

The fusion layer 230 is coated on the outside of the insulating layer 220 as a covering of an electric wire, and is heated by the heated air supplied by the hot air supply unit 130 according to an embodiment of the present invention. It melts when it is fused to the substrate 111. Therefore, the adhesive force is increased as compared to the case in which the surface of the substrate 111 is fused to fuse the wire 200, and the fusion layer 230 and the surface of the substrate 111 are cooled and adhered with higher strength. do.

At this time, the fusion layer 230 is formed including one or a plurality selected from the group consisting of polyamide, epoxy, butyl al and polyester.

In addition, the substrate 111 is coated on the outer surface of the adhesive material so that the wire 200 is bonded with high strength after fusion with the fusion layer 230 formed on the wire 200. In this case, the substrate 111 may be formed of one or more selected from a paper coated with an adhesive material, a cotton paper, and an aluminum sheet, and may be formed of a substrate of a chemical material such as PVC, PE, and PC. Of course it can be used.

Hereinafter, an installation method of the wire 200 according to the present invention will be described with reference to the accompanying drawings.

1 to 3, when the substrate 111 positioned on the bed 110 is transferred to the lower side of the wire supply unit 120, the wire 200 flows through the supply hole 123. do.

At this time, the inside of the wire supply unit 120 is heated by air to discharge the heated air toward the discharge hole 122, the heated air is introduced into the wire supply unit 120 inside the wire 200 Is heated, and the wire 200 is discharged to the discharge hole 122 and the melting of the fusion layer 230 is started. In addition, the melting is performed at the portion where the wire 200 is fused on the substrate 111.

The wire supply unit 120 is disposed by melting the wire 200 in a pattern set above the substrate 111, and the fusion layer 230 and the substrate 111 of the wire 200 melted over time. The silver sticks to each other as it cools down.

Therefore, the conductor 210 including the insulating layer 220 may be more firmly fused on the substrate 111 by the fusion layer 230.

When the setting pattern formation of the wire 200 by the wire supply unit 120 is completed, the cutting unit 140 cuts the wire 200, and heated air supplied from the inside of the wire supply unit 120. Emissions are also blocked.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

100: wire connection device 110: bed
111: substrate 120: wire supply
121: euro 122: discharge hole
123: supply hole 130: hot air supply
140: cutting unit 160: heating unit
200: wire 210: conductor
220: insulating layer 230: fusion layer

Claims

In the wire used in the wire connecting device for arranging and connecting the wire in a pattern set on the substrate,
The wire is a conductor, an insulating layer is formed to surround the outer peripheral surface of the conductor, a fusion layer is formed to surround the outer peripheral surface of the insulating layer,
The wire is patterned on the substrate by heating the fusion layer.

The method according to claim 1,
The fusion layer,
A wire comprising one selected from the group consisting of polyamide, epoxy, butylal and polyester.

A bed for transporting the substrate to be processed;
A wire supply part which continuously supplies the wire of claim 1 or 2, and moves to form a conductor of the wire in a predetermined pattern on the substrate;
A hot air supply unit applying hot air to the wire supplied to the wire supply unit to fix the conductor to the substrate by the fusion layer; And
And a cutting portion for cutting the wire after the conductor is fixed to the substrate.

The method according to claim 3,
The substrate,
A wire connecting device comprising one selected from paper coated with an adhesive material, cotton paper coated with the adhesive material, and aluminum sheet coated with the adhesive material.

The method according to claim 3,
And a heating unit for preheating the substrate on the bed in a range of 60 to 100 ° C.