KR20120123185A - Organic electroluminescence display device - Google Patents

Abstract

PURPOSE: An organic electroluminescent display device is provided to maximize a light emitting area by using a printed circuit board as a deposition substrate of the organic electroluminescent display device. CONSTITUTION: A printed circuit board includes a first area(C) and a second area(E). The first area has one or more first through holes(112). The second area has one or more second through holes(114). A second through electrode is provided in the second through hole. A first electrode includes a first through electrode and a first conductive layer. An organic light emitting layer is provided on the first electrode.

Description

Organic electroluminescent display device {ORGANIC ELECTROLUMINESCENCE DISPLAY DEVICE}

The present invention relates to an organic light emitting display device, and more particularly, to an organic light emitting display device using a printed circuit board as a deposition substrate.

An organic electroluminescent device is a self-luminous display device which electrically excites an organic compound to emit light. Organic electroluminescent devices are attracting attention as next generation displays because they can be driven with low voltage, have high brightness, wide viewing angle and fast response speed.

Recently, due to the large area of the organic EL device, problems such as deterioration of organic materials due to heat generation, uneven image quality due to voltage drop, and increase in non-light emitting area due to complicated current injection pass are caused. . In order to remove heat generated in the device, a method of encapsulation using a metal and a filler is used, but the effect is long. Auxiliary electrodes are used to eliminate the problem of image quality non-uniformity, but there are difficulties in increasing the process process and decreasing the aperture ratio. In addition, the introduction of a bag using a printed circuit board (PCB) has been progressed in order to eliminate the non-emitting region, but there is a limit.

An object of the present invention is to provide an organic light emitting display device in which the light emitting area is maximized by using a printed circuit board (PCB) as a deposition substrate of an organic light emitting device.

Another object of the present invention is to provide an organic light emitting display device having excellent heat dissipation efficiency and minimizing voltage drop.

According to embodiments of the present invention, an organic light emitting display device using a printed circuit board as a deposition substrate of an organic light emitting display device is provided.

The organic light emitting display device includes: a printed circuit board having a first area having at least one first through hole and a second area provided at an edge of the first area and having at least one second through hole; A second through electrode provided in the second through hole; A first electrode including a first through electrode provided in the first through hole, and a first conductive layer spaced apart from the second through electrode and provided on the first through electrode and the printed circuit board; An organic light emitting layer provided on the first electrode; And a second electrode provided on the organic emission layer and connected to the second through electrode.

The first electrode may further include a second conductive layer provided under the first through electrode and the printed circuit board. The display device may further include a third conductive layer connected to the second through electrode and provided along an edge of the printed circuit board. The third conductive layer may be formed in a closed loop shape spaced apart from the second conductive layer and surrounding the second conductive layer.

Any one of the first electrode, the second through electrode, or the third conductive layer may be formed of a metal having high thermal conductivity, which may be copper (Cu) or gold (Au).

The first electrode is an anode, the second electrode is a cathode, and the first electrode is made of a material having a larger work function than the second electrode. The first electrode is a cathode, the second electrode is an anode, and the first electrode is made of a material having a lower work function than the second electrode.

The second electrode is made of a transparent electrode. The display device may further include a reflective film provided between the first electrode and the organic light emitting layer.

At least one of the printed circuit board, the first conductive layer, the reflective film, and the transparent conductive film includes a plurality of light extraction patterns, and the light extraction patterns are directed toward the second electrode of the light generated by the organic light emitting layer. Light other than the emitted light can be reflected.

The organic light emitting display device includes a first region having at least one first through hole provided at one edge, and a second region provided at the other edge of the first region and having at least one second through hole. A printed circuit board; A second through electrode provided in the second through hole; A first electrode including a first through electrode provided in the first through hole, and a first conductive layer spaced apart from the second through electrode and provided on the first through electrode and the printed circuit board; An organic light emitting layer provided on the first electrode; And a second electrode provided on the organic emission layer and connected to the second through electrode.

The first electrode may further include a second conductive layer provided under the first through electrode and the printed circuit board, and the second conductive layer is adjacent to one side edge of the printed circuit board. Extends to the area.

The second conductive layer may further include a third conductive layer spaced apart from the second conductive layer and extending from the other edge of the printed circuit board to a region adjacent thereto. The second conductive layer and the third conductive layer have L-shaped cross sections, and the extension ends of the L-shaped cross sections face each other.

The display device may further include a fourth conductive layer spaced apart from the first conductive layer on the second through electrode and provided at the other edge of the printed circuit board.

Any one of the first electrode, the second through electrode, the third conductive layer or the fourth conductive layer is made of a metal having high thermal conductivity, and may be copper (Cu) or gold (Au).

The second electrode is made of a transparent electrode. The display device may further include a reflective film provided between the first electrode and the organic light emitting layer.

At least one of the printed circuit board, the first conductive layer, the reflective film, and the transparent conductive film includes a plurality of light extraction patterns, and the light extraction patterns are directed toward the second electrode of the light generated by the organic light emitting layer. Light other than the emitted light can be reflected.

According to the embodiments of the present invention, since the PCB substrate is used as the deposition substrate, an electrode portion for external connection required for driving the organic light emitting layer does not need to be manufactured on the PCB substrate, thereby maximizing the light emitting area. By forming a first electrode in the first region of the PCB substrate and a second electrode connected to the through electrode formed in the second region of the PCB substrate, the distance between the first electrode and the second electrode is shortened, thereby providing a current path. It can be made shorter, which minimizes the voltage drop and improves image quality unevenness. In addition, since the conductive layer and the through electrode made of a metal having high thermal conductivity are formed in the upper and lower parts and the inside of the substrate, the heat dissipation efficiency can be increased and the voltage drop phenomenon can be further minimized.

1A and 1B are plan and bottom views of an organic light emitting display device according to a first embodiment of the present invention.
2A to 7A are plan views illustrating a manufacturing method according to a first exemplary embodiment of the present invention, and FIGS. 2B to 7B are cross-sectional views taken along line AA ′ of FIGS. 2A to 7A.
8A and 8B are top and bottom views of an organic light emitting display device having an inverted structure according to a first embodiment of the present invention.
FIG. 9 is a cross-sectional view taken along the line AA ′ of FIG. 8A.
10A and 10B are plan and bottom views of an organic light emitting display device according to a second embodiment of the present invention.
11A through 16A are plan views illustrating a manufacturing method according to a second exemplary embodiment of the present invention, and FIGS. 11B through 16B are cross-sectional views taken along line AA ′ of FIGS. 11A through 16A.
17A and 17B are top and bottom views of an organic light emitting display device having an inverted structure according to a second embodiment of the present invention.
18 is a cross-sectional view taken along the line AA ′ of FIG. 17A.
19A and 19B are plan and bottom views of an organic light emitting display device according to a third embodiment of the present invention.
20A to 25A are plan views illustrating a manufacturing method according to a third exemplary embodiment of the present invention, and FIGS. 20B to 25B are cross-sectional views taken along line AA ′ of FIGS. 20A to 25A.
26A and 26B are top and bottom views of an organic light emitting display device having an inverted structure according to a third embodiment of the present invention.
FIG. 27 is a cross-sectional view taken along the line AA ′ of FIG. 26A.
28A to 28C are plan views illustrating modified examples of the organic light emitting display device according to the third embodiment of the present invention.
29A and 29B are plan and bottom views of an organic light emitting display device according to a fourth embodiment of the present invention.
FIG. 30A is a cross-sectional view taken along line AA ′ of FIG. 29A.
FIG. 30B is a cross-sectional view along the BB ′ line of FIG. 29A.
FIG. 30C is an enlarged view of the region H in FIG. 30B.
31A is a cross-sectional view illustrating a modified example of an organic light emitting display device according to a fourth embodiment of the present invention.
FIG. 31B is an enlarged view of the region H ′ of FIG. 31A.
32A and 32B are plan and bottom views of an organic light emitting display device according to a fifth embodiment of the present invention.
FIG. 33A is a cross-sectional view taken along the line AA ′ of FIG. 32A.
FIG. 33B is a cross-sectional view along the BB ′ line of FIG. 32A.
33C is an enlarged view of region I of FIG. 32B.
34A is a cross-sectional view for describing a modification of the organic light emitting display device according to the fifth embodiment of the present invention.
FIG. 34B is an enlarged view of the region H ′ of FIG. 34A.

The present invention is capable of various modifications and various forms, and specific embodiments are illustrated in the drawings and described in detail in the text. It should be understood, however, that the invention is not intended to be limited to the particular forms disclosed, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. Singular expressions include plural expressions unless the context clearly indicates otherwise.

In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof. In addition, when a part such as a layer, film, region, plate, etc. is said to be "on" another part, this includes not only when the other part is "right on" but also another part in the middle. Conversely, when a part such as a layer, film, region, plate, etc. is "below" another part, this includes not only the other part "below" but also another part in the middle.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B are plan and bottom views of an organic light emitting display device according to a first embodiment of the present invention, and FIGS. 2A to 7A are plan views illustrating a manufacturing method according to the first embodiment of the present invention. 2B-7B are cross-sectional views taken along line AA ′ of FIGS. 2A-7A.

1A, 1B, 2A, and 2B, a first region C having at least one first through hole 112 and at least one edge provided at an edge of the first region C are provided. A Printed Circuit Board (hereinafter referred to as a "PCB substrate") 110 having a second region E having a second through hole 114 is provided. The PCB substrate 110 is a printed circuit board for driving an organic light emitting layer (not shown) in the organic light emitting display device 100A. The PCB substrate 110 is made of plastic, copper (Cu), aluminum (Al), and an iron alloy (Fe alloy). Metal, glass, ceramics, and the like.

The first through hole 112 may be arranged radially in the first region (C). At least one second through-hole 114 may be arranged in one line on each side of the second region E. FIG. The second through hole 114 is preferably formed to have a size that can minimize the non-light emitting area. The first and second through holes 112 and 114 may be formed by drilling or laser drilling.

1A, 1B, 3A, and 3B, a first through electrode 116b is formed in the first through hole 112, and a second through electrode 118b in the second through hole 114. ) Is formed. A first conductive layer 116a, spaced apart from the second through electrode 118b, is formed on the first through electrode 116b and the PCB substrate 110. The first conductive layer 116a exposes the second through electrode 118b. A second conductive layer 116c spaced apart from the second through electrode 118b may be formed below the first through electrode 116b and the PCB substrate 110.

A third conductive layer 118c may be formed below the second through electrode 118b and the PCB substrate 110 along the second region E of the PCB substrate 110. The third conductive layer 118c may be formed in a closed loop shape spaced apart from the second conductive layer 116c and surrounding the second conductive layer 116c. In this case, the second through electrode 118b and the third conductive layer 118c may be formed as the connection electrode 118.

Here, the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 are thick and have high thermal conductivity to reflect incident light. It may be made of metal. For example, the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 may include copper (Cu), gold (Au), and the like. It may include any one of the alloys.

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 have a metal material sufficiently high to minimize voltage drop. It is desirable to pile up and lower resistance to the maximum. On the other hand, the second conductive layer 116c is formed to improve heat dissipation efficiency and minimize voltage drop, and the third conductive layer 118c is preferably formed to minimize voltage drop, but may be omitted. .

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 may be printed by a plating method, screen printing, or the like. After the thin film is formed using a method, a deposition method, or a combination thereof, the thin film may be patterned and formed.

For example, when the first and second through holes 112 and 114 are filled with a metal paste by using a screen printing method, the first and second through electrodes 116b and 118b are formed. Thereafter, a thin film (not shown) is formed on the upper and lower portions of the PCB substrate 110 using a plating method, and then the thin film is patterned to form the first, second and third conductive layers 116a, 116c, and 118c. Is formed.

1A, 1B, 4A, and 4B, the reflective film 120 and the transparent conductive film 122 may be sequentially formed on the first conductive layer 116a. The reflective film 120 may be formed of a metal having conductivity and high thermal conductivity and high reflectance. For example, the reflective film 120 may include any one of silver (Ag), nickel (Ni), and an alloy thereof. The reflective film 120 may be formed by forming a thin film (not shown) using a deposition method or a paste method, and then patterning the thin film.

The transparent conductive film 122 may include indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium doped zinc oxide (GZO), zinc tin oxide (ZTO), and gallium tin oxide (GTO). And a transparent conductive oxide of any one of fluorine doped tin oxide (FTO). The transparent conductive film 122 may be formed by forming a thin film (not shown) using a deposition method and then patterning the thin film.

In this case, a first electrode including the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, the reflective film 120, and the transparent conductive film 122 ( 124 may be formed.

When the first electrode 124 includes the first conductive layer 116a and the reflective film 120, the heat dissipation and the reflectance are maximized to improve performances such as lifespan and efficiency of the organic light emitting display device 100A. Can be improved. When the first electrode 124 is configured to include the transparent conductive film 122, the luminance uniformity can be maximized without the auxiliary electrode. On the other hand, the reflective film 120 and the transparent conductive film 122 is preferably formed in order to improve heat dissipation, reflectance and brightness uniformity, but may be omitted.

1A, 1B, 5A, and 5B, an organic emission layer 126 is formed on the first electrode 124. The organic emission layer 126 discharges energy emitted by recombination of supplied holes and electrons to the outside in the form of light. That is, the organic light emitting layer 126 generates the light. In addition, the organic light emitting layer 126 may include an organic light emitting material emitting one of red (R), green (G), blue (B), and white (W) light. The organic light emitting material may be a polyfluorene derivative, a (poly) paraphenylenevinylene derivative, a polyphenylene derivative, a polyvinylcarbazole derivative, or a polythiophene polythiophene derivatives, anthracene derivatives, butadiene derivatives, tetratracene derivatives, tetratracene derivatives, distyrylarylene derivatives, benzazole derivatives or carbazole derivatives . The organic light emitting materials may be used as a host material, and a dopant may be doped into the host material to increase light emission efficiency. The dopant may include xanthene, perylene, cumarine, cumarine, rhodamine, rubrene, dicyanomethylenepyran, thiopyran, and thia. Pyrilium, periflanthene derivatives, indenoperylene derivatives, carbostyryl, nile red, or quinacridone Can be.

The organic light emitting layer 126 may further include an auxiliary layer (not shown) in order to increase luminous efficiency. The auxiliary layer may include a hole injecting layer, a hole transfer layer, an electron transfer layer, or an electron injecting layer.

Since the first electrode 124 is used as an anode, the hole transport layer and the hole injection layer have a HOMO level between the work function of the first electrode 124 and the highest occupied molecular orbital (HOMO) level of the organic light emitting material. It can be formed of a material. The electron transport layer and the electron injection layer may be formed of a material having a LUMO level between a work function of the second electrode 128 (see FIGS. 6A and 6B) and a lower unoccupied molecular orbital (LUMO) level of an organic light emitting material. .

Materials that can be used as the hole transport layer or the hole injection layer are diamines, MTDATA ([4,4 ', 4 "-tris (3-methylphenylphenylamino] triphenylamine] ([4,4', 4"-). tris (3-methylphenylphenylamino) triphenylamine]), TPD (N, N'-diphenyl-N, N'-di (3-methylphenyl) -1,1-biphenyl-4,4'-diamine (N, N ' -diphenyl-N, N'-di (3-methylphenyl) -1,1'-biphenyl-4,4'-diamine)), 1,1-bis (4-di-p-tolylaminophenyl) cyclohexane ( 1,1-bis (4-dip-tolylaminophenyl) cyclohexane), N, N, N ', N'-tetra (2-naphthyl) -4,4-diamino-p-terphenyl (N, N, N ', N'-tetra (2-naphthyl) -4,4-diamino-p-terphenyl), polypyrrole, polyaniline, or a mixture of polyethylenedioxythiophene and polystyrenesulfonic acid (poly- (3,4 -ethylenedioxythiophene: polystyrenesulfonate, PEDOT: PSS) The material that can be used as the electron injection layer may include an alkali metal, alkaline earth metal or oxides thereof. Substances that can be used as the transport layer include tris (8-hydroxyquinolinato) aluminum derivatives, o-, m-, or p-phenanthroline derivatives, oxadiazole ) Derivatives, or triazole derivatives.

The organic emission layer 126 may be formed through a deposition method using a shadow mask. In addition, the organic light emitting layer 126 may be formed by forming a thin film (not shown) by spin coating or inkjet printing, and then patterning the thin film. In this case, a photoresist pattern may be used as an etching mask. In this case, the photosensitive film pattern may be formed by exposing and developing the photosensitive material on the PCB substrate 110 to expose the second through electrode 118b using an exposure mask after the photosensitive film is formed. .

1A, 1B, 6A, and 6B, a second electrode 128 is formed on the organic light emitting layer 126. The second electrode 128 is electrically connected to the second through electrode 118b. The second electrode 128 may transmit the light generated by the organic emission layer 126.

Meanwhile, the second electrode 128 may have various shapes according to the first electrode 124. For example, the first electrode 124 may include the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, the reflective film 120, and the transparent conductive film ( If the structure including the 122, the second electrode 128 may include a material having a work function lower than the work function of the transparent conductive film 122. Here, the second electrode 128 may include any one of silver (Ag), aluminum (Al), magnesium (Mg), molybdenum (Mo), and an alloy thereof, and the organic light emitting layer 126 The light generated in the) may be formed to a thin thickness of 25nm or less so that it can be emitted to the outside. The transparent conductive film 122 may be an anode for supplying holes to the organic light emitting layer 126, and the second electrode 128 may be a cathode for supplying electrons to the organic light emitting layer 128. have.

1A, 1B, 7A, and 7B, an encapsulation layer 130 is formed on the second electrode 128. The encapsulation layer 130 is to protect the organic EL device from external moisture and oxygen, and may be formed of a transparent material. The encapsulation layer 130 is not particularly limited as long as it is a transparent material. For example, the encapsulation layer 130 may be formed of a glass substrate or an insulating film. When the encapsulation layer 130 is an insulating film, the encapsulation layer 130 may be formed through deposition. In addition, when the encapsulation layer 130 is a glass substrate, the encapsulation layer 130 may be attached to the second electrode 128 using a sealant.

In the first embodiment of the present invention, the encapsulation layer 130 is formed in overall contact with the second electrode 128, but the encapsulation layer 130 is attached to only the edge region of the second electrode 128 and is absorbent. Of course, it may be formed to include more.

The organic light emitting display device 100A having the above structure corresponds to a top emission type in which light emitted from the organic light emitting layer 126 is extracted to an upper portion of the encapsulation layer 130 through the second electrode 128. . Therefore, when a voltage is applied to the first electrode 124 and the second electrode 128 of the organic light emitting display device 100A, a part of the light emitted from the organic light emitting layer 126 is the second electrode ( Through 128). The remaining light passes through the transparent conductive film 122 and then is reflected through the reflective film 120, and then passes through the transparent conductive film 122 and the organic light emitting layer 126 in order to pass through the second electrode 128. Is extracted to outside.

In general, large-area organic light emitting display devices have difficulty in easily dissipating heat generated from the inside to the outside, resulting in deterioration of organic materials and uneven image quality due to voltage drop.

However, according to the first embodiment of the present invention, the first conductive layer 116a, the first through electrode 116b and the second conductive layer 116c are made of a metal having high thermal conductivity, Since the layer 116a and the second conductive layer 116c are connected to each other through the first through electrode 116b, heat generated inside the organic light emitting display device 100A may be efficiently emitted to the outside. do. Therefore, the heat dissipation efficiency of the organic light emitting display device 100A can be improved. In addition, the first electrode 124 is formed in the first region C of the PCB substrate 110, and the second electrode 128 connected to the second through electrode 118b is formed. The distance between the first electrode 124 and the second electrode 128 can be shortened. As a result, the current pass can be made shorter, and the voltage drop phenomenon can be minimized, thereby improving image quality unevenness. In addition, since the metal material may be stacked high enough on the inside and the upper and lower portions of the PCB substrate 110, the resistance may be minimized to further minimize the voltage drop phenomenon.

In particular, according to the first embodiment of the present invention, since the PCB substrate 110 is used as the deposition substrate of the organic electroluminescent device, the electrode unit for external connection required for driving the organic light emitting layer 126 (the PCB substrate ( Since it does not need to be manufactured separately on the 110, it is possible to maximize the light emitting area.

8A and 8B are plan and bottom views of an organic light emitting display device having an inverted structure according to a first embodiment of the present invention, and FIG. 9 is a cross-sectional view taken along the line A-A 'of FIG. 8A. Here, the same reference numerals are used for the same or equivalent parts as those of the first embodiment, and detailed description thereof may be omitted.

8A, 8B, and 9, the organic light emitting display device 100A ′ having an inverted structure according to the first embodiment of the present invention includes a PCB substrate 110 and a first electrode 124. '), An organic emission layer 126, a second electrode 128, and a connection electrode 118 electrically connected to the second electrode 128.

The first electrode 124 ′ may be formed to include a first conductive layer 116a, a first through electrode 116b, a second conductive layer 116c, and a reflective film 120.

The first electrode 124 ′ may be a cathode for providing electrons to the organic emission layer 126. The second conductive layer 116c and the reflective film 120 are preferably formed in order to improve heat radiation efficiency, reflectivity, and minimize voltage drop, but may be omitted.

The second electrode 128 may be formed as a transparent electrode having a higher work function than the first electrode 124 ′. For example, the second electrode 128 may be formed of indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium doped zinc oxide (GZO), zinc tin oxide (ZTO), gallium tin oxide (GTO), and FTO (GTO). fluorine doped tin oxide). The second electrode 128 may be an anode for providing holes to the organic light emitting layer 126.

The connection electrode 118 may be formed to include a second through electrode 118b and a third conductive layer 118c. In order to minimize voltage drop, the third conductive layer 118c is preferably formed, but may be omitted.

In the organic light emitting display device 100A 'having an inverted structure according to the first embodiment of the present invention, the first electrode 124' is formed of a cathode, and the second electrode 128 is an anode. In the first embodiment and the remaining configuration except that the first electrode 124 'does not include a transparent electrode provided on the reflective film 120. same. Accordingly, the organic light emitting display device 100A 'may have a slightly lower external light efficiency than that of the first embodiment. The same effect can be obtained.

10A and 10B are plan and bottom views of an organic light emitting display device according to a second embodiment of the present invention, and FIGS. 11A to 16A are plan views illustrating a manufacturing method according to a second embodiment of the present invention. 11B through 16B are cross-sectional views taken along the line AA ′ of FIGS. 11A through 16A. Here, the same reference numerals are used for the same or equivalent parts as those of the first embodiment, and detailed description thereof may be omitted.

10A, 10B, 11A, and 11B, a first region C having at least one first through hole 112 and at least one edge provided at an edge of the first region C may be provided. A PCB substrate 110 having a second region E having a second through hole 114 is provided.

Since the forming material of the PCB substrate 110 and the arrangement position and forming method of the first and second through holes 112 and 114 may be the same as those of the first embodiment, a description thereof will be omitted.

10A, 10B, 12A, and 12B, a first through electrode 116b is formed in the first through hole 112, and a second through electrode 118b in the second through hole 114. ) Is formed. A first conductive layer 116a is formed on the first through electrode 116b and the PCB substrate 110. A second conductive layer 116c may be formed below the first through electrode 116b and the PCB substrate 110.

A third conductive layer 118c may be formed below the second through electrode 118b and the PCB substrate 110 along the second region E of the PCB substrate 110. A fourth conductive layer 118a may be formed along the second region E on the second through electrode 118b and the PCB substrate 110. The third conductive layer 118c may be formed in a closed loop shape spaced apart from the second conductive layer 116c and surrounding the second conductive layer 116c. The fourth conductive layer 118a may be formed in a closed loop shape spaced apart from the first conductive layer 116a and surrounding the first conductive layer 116a. The third conductive layer 118c is provided at a position corresponding to the fourth conductive layer 118a. In this case, the fourth conductive layer 118a, the second through electrode 118b, and the third conductive layer 118c may be formed as the connection electrode 118.

Here, the material for forming the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, the second through electrode 118b, and the third conductive layer 118c may be formed. Since it may be the same as the first embodiment, a description thereof will be omitted. The fourth conductive layer 118a may be made of a metal that is thick and has high thermal conductivity to allow total reflection. For example, the fourth conductive layer 118a may be made of copper (Cu) or gold (Au).

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 are stacked with a metal material sufficiently high to minimize a voltage drop phenomenon to maximize resistance. Lowering is preferable.

In this case, the second conductive layer 116c is formed to improve heat dissipation efficiency and minimize voltage drop, and the third and fourth conductive layers 118c and 118a are formed to minimize voltage drop. It is preferable, but it can be omitted.

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 may be a plating method, a printing method such as screen printing, a deposition method, or a combination thereof. After the thin film is formed using the thin film or the like, the thin film may be formed by patterning.

For example, when the first and second through holes 112 and 114 are filled with a metal paste using a screen printing method, the first through electrode 116b and the second through electrode 118b are formed. Thereafter, a thin film (not shown) is formed on the upper and lower portions of the PCB substrate 110 including the first and second through electrodes 116b and 118b using a plating method, and then the thin film is patterned to form the first layer. And second conductive layers 116a and 116c and the third and fourth conductive layers 118c and 118a.

10A, 10B, 13A, and 13B, the reflective film 120 and the transparent conductive film 122 may be sequentially formed on the first conductive layer 116a. The reflective film 120 and the transparent conductive film 122 are formed on the first conductive layer 116a in the first region C, except that the first embodiment of the forming material and the forming method. Since it may be the same as the description thereof will be omitted.

In this case, a first electrode including the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, the reflective film 120, and the transparent conductive film 122 ( 124 may be formed. The first electrode 124 may be an anode that provides holes to the organic light emitting layer (not shown).

When the first electrode 124 includes the reflective film 120, the heat dissipation and the reflectance may be maximized to improve performances such as lifespan and efficiency of the organic light emitting display device 100B. When the first electrode 124 is configured to include the transparent conductive film 122, the luminance uniformity can be maximized without the auxiliary electrode. The reflective film 120 and the transparent conductive film 122 are preferably formed to improve heat dissipation, reflectance, and luminance uniformity, but may be omitted.

10A, 10B, 14A, and 14B, an organic emission layer 126 is formed on the first electrode 124. Since the organic light emitting layer 126 is the same as that of the first embodiment in the forming material except that the organic light emitting layer 126 is formed only in the first region C, a description thereof will be omitted.

The organic emission layer 126 may be formed through a deposition method using a shadow mask. In addition, the organic light emitting layer 126 may be formed by forming a thin film (not shown) by spin coating or inkjet printing, and then patterning the thin film. In this case, a photoresist pattern may be used as an etching mask. In this case, the photoresist pattern may be formed by applying a photosensitive material on the PCB substrate 110 to form a photoresist film, and then exposing and developing the photoresist layer so that the fourth conductive layer 118a is exposed using an exposure mask. .

10A, 10B, 15A, and 15B, a second electrode 128 is formed on the organic light emitting layer 126. The second electrode 128 is electrically connected to the connection electrode 118.

Since the second electrode 128 is the same as that of the first embodiment in the forming material and the forming method except that the second electrode 128 is formed on the organic light emitting layer 126 and the fourth conductive layer 118a, the description thereof is omitted. Let's do it.

10A, 10B, 16A, and 16B, an encapsulation layer 130 is formed on the second electrode 128. Since the material and the method of forming the encapsulation layer 130 are the same as in the first embodiment, description thereof will be omitted.

The organic light emitting display device 100B having the above structure corresponds to a top emission type in which light emitted from the organic light emitting layer 126 is extracted to an upper portion of the encapsulation layer 130 through the second electrode 128. . Therefore, when a voltage is applied to the first electrode 124 and the second electrode 128 of the organic light emitting display device 100B, a part of the light emitted from the organic light emitting layer 126 is the second electrode ( Through 128). The remaining light passes through the transparent conductive film 122 and then is reflected through the reflective film 120, and then passes through the transparent conductive film 122 and the organic light emitting layer 126 in order to pass through the second electrode 128. Is extracted to outside.

According to the second embodiment of the present invention, since the PCB substrate 110 is used as a deposition substrate of the organic electroluminescent device as in the first embodiment, the electrode unit for external connection required for driving the organic light emitting layer 126 is Since it is not necessary to separately fabricate the PCB substrate 110, the light emitting area can be maximized. In addition, the first electrode 124 is formed in the first region C of the PCB substrate 110, and the second electrode 128 connected to the second through electrode 118b is formed. The distance between the first electrode 124 and the second electrode 128 can be shortened. As a result, the current path can be made shorter, thereby minimizing voltage drop, thereby improving image quality non-uniformity. Furthermore, as the connection electrode 118 is further formed to include the fourth conductive layer 118a, the voltage drop phenomenon can be minimized as compared with the first embodiment.

17A and 17B are plan and bottom views of an organic light emitting display device having an inverted structure according to a second embodiment of the present invention, and FIG. 18 is a cross-sectional view taken along the line A-A 'of FIG. 17A. Here, the same reference numerals are used for the same or equivalent parts as those of the second embodiment, and detailed description thereof may be omitted.

17A, 17B, and 18, an organic light emitting display device 100B ′ having an inverted structure according to a second embodiment of the present invention is a PCB substrate 110 and a first electrode 124. '), An organic emission layer 126, a second electrode 128, and a connection electrode 118 electrically connected to the second electrode 128.

The first electrode 124 ′ may be formed to include a first conductive layer 116a, a first through electrode 116b, a second conductive layer 116c, and a reflective film 120. The first electrode 124 ′ may be a cathode for providing electrons to the organic emission layer 126. The second conductive layer 116c and the reflective film 120 are preferably formed in order to improve heat radiation efficiency, reflectivity, and minimize voltage drop, but may be omitted.

The second electrode 128 may be formed as a transparent electrode having a higher work function than the first electrode 124 ′. For example, the second electrode 128 may be made of ITO or IZO. The second electrode 128 may be an anode for providing holes to the organic light emitting layer 126.

The connection electrode 118 may include a fourth conductive layer 118a, a second through electrode 118b, and a third conductive layer 118c. In order to minimize the voltage drop, the third conductive layer 118c and the fourth conductive layer 118a are preferably formed, but may be omitted.

In the organic light emitting display device 100B 'having an inverted structure according to the second embodiment of the present invention, the first electrode 124' is formed of a cathode, and the second electrode 128 is an anode. In the second embodiment and the rest of the configuration except that the first electrode 124 'does not include a transparent electrode provided on the reflective film 120. same. Accordingly, the organic light emitting display device 100B 'may have a lower external light efficiency than that of the second embodiment. The same effect can be obtained.

19A and 19B are plan and bottom views of an organic light emitting display device according to a third embodiment of the present invention, and FIGS. 20A to 25A are plan views illustrating a manufacturing method according to a third embodiment of the present invention. 20B to 25B are cross-sectional views taken along line AA ′ of FIGS. 20A to 25A. Here, the same reference numerals are used for the same or equivalent parts as those of the first and second embodiments, and detailed description thereof may be omitted.

Referring to FIGS. 19A, 19B, 20A, and 20B, a first region C having at least one first through hole 112 provided at one edge thereof, and at another edge of the first region C, may be used. Provided is a PCB substrate 110 having a second region E provided with at least one second through hole 114.

Except for the arrangement positions of the first and second through holes 112 and 114, the forming material of the PCB substrate 110 and the method of forming the first and second through holes 112 and 114 may be implemented. Since it may be the same as Example 1, description thereof will be omitted.

19A, 19B, 21A, and 21B, a first through electrode 116b is formed in the first through hole 112, and a second through electrode 118b in the second through hole 114. ) Is formed. A first conductive layer 116a is formed on the first through electrode 116b and the PCB substrate 110. A second conductive layer 116c having an “L” shaped cross section extending from one edge to an adjacent region thereof may be formed under the first through electrode 116b and the PCB substrate 110.

Under the second through electrode 118b and the PCB substrate 110, a third conductive material having an “L” shaped cross section spaced apart from the second conductive layer 116c and extending from the other edge to a region adjacent thereto. Layer 118c may be formed. That is, the third conductive layer 118c extends from the second region E to the first region C. In addition, the third conductive layer 118c and the second conductive layer 116c have a symmetrical structure, and the extension ends of the L-shaped cross sections face each other and are spaced apart from each other.

A fourth conductive layer 118a may be formed on the second through electrode 118b and the PCB substrate 110 in the second region E to be spaced apart from the first conductive layer 116a. The fourth conductive layer 118a is provided at the other edge of the PCB substrate 110. In this case, the second through electrode 118b, the third conductive layer 118c, and the fourth conductive layer 118a may be formed as the connection electrode 118.

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 may be formed of the same material as those of the first and second embodiments. The description thereof will be omitted.

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 are stacked with a metal material sufficiently high to minimize a voltage drop phenomenon to maximize resistance. Lowering is preferable.

In this case, the second conductive layer 116c is formed to improve heat dissipation efficiency and minimize voltage drop, and the third and fourth conductive layers 118c and 118a are formed to minimize voltage drop. It is preferable, but it can be omitted.

The first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection electrode 118 may be a plating method, a printing method such as screen printing, a deposition method, or a combination thereof. After the thin film is formed using the thin film or the like, the thin film may be formed by patterning. Except for the shapes of the first to fourth conductive layers 116a, 116c, 118c, and 118a, the method of forming the first to fourth conductive layers 116a, 116c, 118c, and 118a using the above method may be performed. Since it may be the same as Example 2, description thereof will be omitted.

19A, 19B, 22A, and 22B, the reflective film 120 and the transparent conductive film 122 may be sequentially formed on the first conductive layer 116a. The reflective film 120 and the transparent conductive film 122 expose the connection electrode 118.

The reflective film 120 and the transparent conductive film 122 are formed on the first conductive layer 116a in the first region C, except that the first embodiment of the forming material and the forming method. Since it may be the same as the description thereof will be omitted.

In this case, a first electrode including the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, the reflective film 120, and the transparent conductive film 122 ( 124 may be formed. The first electrode 124 may be an anode that provides holes to the organic light emitting layer (not shown).

When the first electrode 124 includes the reflective film 120, the heat dissipation and the reflectance may be maximized to improve performances such as lifespan and efficiency of the organic light emitting display device 100C. When the first electrode 124 is configured to include the transparent conductive film 122, the luminance uniformity can be maximized without the auxiliary electrode. The reflective film 120 and the transparent conductive film 122 are preferably formed to improve heat radiation, reflectance, and luminance uniformity, but may be omitted.

19A, 19B, 23A, and 23B, an organic emission layer 126 is formed on the first electrode 124. Since the organic light emitting layer 126 is the same as that of the first embodiment in the forming material except that the organic light emitting layer 126 is formed only in the first region C, a description thereof will be omitted.

The organic emission layer 126 may be formed through a deposition method using a shadow mask. In addition, the organic light emitting layer 126 may be formed by forming a thin film (not shown) by spin coating or inkjet printing, and then patterning the thin film. In this case, a photoresist pattern may be used as an etching mask. In this case, the photosensitive film pattern may be formed by exposing and developing the photosensitive material on the PCB substrate 110 to expose the fourth conductive layer 118a using an exposure mask after the photosensitive film is formed. .

19A, 19B, 24A, and 24B, a second electrode 128 is formed on the organic light emitting layer 126. The second electrode 128 is electrically connected to the connection electrode 118.

Since the second electrode 128 is formed on the organic light emitting layer 126 and the fourth conductive layer 118a, the forming material and the forming method may be the same as those of the first embodiment. Will be omitted.

19A, 19B, 25A, and 25B, an encapsulation layer 130 is formed on the second electrode 128. Since the material and the method of forming the encapsulation layer 130 may be the same as in the first embodiment, description thereof will be omitted.

The organic light emitting display device 100C having the above structure corresponds to a top emission type in which light emitted from the organic light emitting layer 126 is extracted to an upper portion of the encapsulation layer 130 through the second electrode 128. . Therefore, when a voltage is applied to the first electrode 124 and the second electrode 128 of the organic light emitting display device 100C, a part of the light emitted from the organic light emitting layer 126 is the second electrode ( Through 128). The remaining light passes through the transparent conductive film 122 and then is reflected through the reflective film 120, and then passes through the transparent conductive film 122 and the organic light emitting layer 126 in order to pass through the second electrode 128. Is extracted to outside.

According to the third embodiment of the present invention, since the PCB substrate 110 is used as the deposition substrate of the organic electroluminescent device as in the first embodiment and the second embodiment, an external connection required for driving the organic light emitting layer 126 is used. Since the electrode unit for the need not be manufactured separately on the PCB substrate 110, the light emitting area can be maximized. In addition, the first electrode 124 is formed in the first region C of the PCB substrate 110, and the second electrode 128 connected to the second through electrode 118b is formed. The distance between the first electrode 124 and the second electrode 128 can be shortened. As a result, the current path can be made shorter, thereby minimizing voltage drop, thereby improving image quality non-uniformity. Further, the first conductive layer 116a, the first through electrode 116b, the second conductive layer 116c, and the connection made of a metal having high thermal conductivity in the upper and lower portions of the PCB substrate 110 and the inside thereof. Since the electrode 118 is formed, it is possible to increase heat dissipation efficiency and minimize a voltage drop phenomenon.

26A and 26B are plan and bottom views of an organic light emitting display device having an inverted structure according to a third embodiment of the present invention, and FIG. 27 is a cross-sectional view taken along the line A-A 'of FIG. 26A. Here, the same reference numerals are used for the same or equivalent parts as those of the third embodiment, and detailed description thereof may be omitted.

26A, 26B, and 27, an organic light emitting display device 100C ′ having an inverted structure according to a third embodiment of the present invention may include a PCB substrate 110 and a first electrode 124. '), An organic emission layer 126, a second electrode 128, and a connection electrode 118 electrically connected to the second electrode 128.

The first electrode 124 ′ may be formed to include a first conductive layer 116a, a first through electrode 116b, a second conductive layer 116c, and a reflective film 120. The first electrode 124 ′ may be a cathode for providing electrons to the organic emission layer 126. The second conductive layer 116c and the reflective film 120 are preferably formed in order to improve heat radiation efficiency, reflectivity, and minimize voltage drop, but may be omitted.

The second electrode 128 may be formed as a transparent electrode having a higher work function than the first electrode 124 ′. For example, the second electrode 128 may be made of ITO or IZO. The second electrode 128 may be an anode for providing holes to the organic light emitting layer 126.

The connection electrode 118 may include a fourth conductive layer 118a, a second through electrode 118b, and a third conductive layer 118c. In order to minimize voltage drop, the third conductive layer 118c and the fourth conductive layer 118a are preferably formed, but may be omitted.

In the organic light emitting display device 100C 'having an inverted structure according to the third embodiment of the present invention, the first electrode 124' is formed of a cathode, and the second electrode 128 is an anode. In the third embodiment and the rest of the configuration except that the first electrode 124 'does not include a transparent electrode provided on the reflective film 120. same. Accordingly, the organic light emitting display device 100C ′ may have a slightly lower external light efficiency than that of the third embodiment. However, the organic light emitting display device 100C ′ is substantially the same as the third embodiment in terms of increasing the remaining light emission area, improving heat dissipation efficiency, and minimizing voltage drop. The same effect can be obtained.

28A to 28C are plan views illustrating modified examples of the organic light emitting display device according to the third embodiment of the present invention. The same reference numerals are given to the same or corresponding parts as in the third embodiment.

28A to 28C, the organic electroluminescent display according to the third embodiment of the present invention has a shape of the first conductive layer 116c formed under the PCB substrate 110 in the first region C. Referring to FIGS. Of course, it can be formed by various modifications as shown.

29A and 29B are plan and bottom views of an organic light emitting display device according to a fourth embodiment of the present invention. FIG. 30A is a cross-sectional view taken along line AA ′ of FIG. 29A, and FIG. 30B is a line BB ′ of FIG. 29A. 30C is an enlarged view of the region H in FIG. 30B. Here, the same reference numerals are used for the same or equivalent parts as those of the first to third embodiments, and detailed description thereof may be omitted.

29A, 29B, 30A, 30B, and 30C, the organic light emitting display device 100D according to the fourth embodiment may include a PCB substrate 110, a first electrode 124, and an organic light emitting layer 126. ), A second electrode 128, and an encapsulation layer 130.

The PCB substrate 110 is provided with a first region C having at least one first through hole 112 and at least one second through hole 114 provided at an edge of the first region C. FIG. A second region E having That is, the second region E may be disposed to surround the first region C. FIG.

The first electrode 124 supplies holes or electrons to the organic emission layer 126. In addition, the first electrode 124 may include a first through electrode 116b, a first conductive layer 116a, a second conductive layer 116c, a reflective film 120, and a transparent conductive film 122. have.

The first through electrode 116b may be disposed in the first through hole 112. The first conductive layer 116a may be electrically connected to the first through electrode 116b and disposed on the PCB substrate 110. The second conductive layer 116c may be electrically connected to the first through electrode 116b and may be disposed in the first region C below the PCB substrate 110. The reflective film 120 may be disposed on the first conductive layer 116a, and the transparent conductive film 122 may be disposed on the reflective film 120.

The organic emission layer 126 is disposed between the first electrode 124 and the second electrode 128 so that holes and electrons supplied between the first electrode 124 and the second electrode 128 are formed. The energy released by recombination is emitted to the outside in the form of light. That is, the organic light emitting layer 126 generates the light.

The second electrode 128 is disposed on the organic light emitting layer 126, and supplies electrons or holes to the organic light emitting layer 126 to the organic light emitting layer 126.

Meanwhile, in the organic light emitting display device 100D according to the present embodiment, at least one of the PCB substrate 110, the first conductive layer 116a, the reflective film 120, and the transparent conductive film 122 may be formed. The display apparatus may further include a plurality of light extraction patterns GP1. For example, the light extraction patterns GP1 may be disposed on all of the PCB substrate 110, the first conductive layer 116a, the reflective film 120, and the transparent conductive film 122.

In more detail, the light extraction patterns GP1 are disposed on any one of the PCB substrate 110, the first conductive layer 116a, the reflective layer 120, and the transparent conductive layer 122. It may be in the form of a recess and may be circular on a plane.

The height of the top of the light extraction patterns GP1 may be higher than the height of the bottom of the organic light emitting layer 126 based on the bottom surface of the PCB substrate 110. Accordingly, the light extraction patterns GP1 reflect light other than the light emitted from the organic light emitting layer 126 toward the second electrode 128 in the light extraction patterns GP1. The emission may be directed toward the second electrode 128.

In the present exemplary embodiment, the light extraction pattern GP1 is disposed on all of the PCB substrate 110, the first conductive layer 116a, the reflective film 120, and the transparent conductive film 122. As described above, it will be satisfied if it can reflect light other than the light generated by the organic light emitting layer 126 and emitted toward the second electrode 128.

In the organic light emitting display device 100D according to the fourth embodiment as described above, the light extraction patterns GP1 ′ are emitted toward the second electrode 128 among the light generated by the organic light emitting layer 126. Since light other than the light may be reflected, light extraction efficiency from the PCB substrate 110 toward the second electrode 128 may be improved.

FIG. 31A is a cross-sectional view illustrating a modified example of the organic light emitting display device according to the fourth embodiment of the present invention, and FIG. 31B is an enlarged view of the region H ′ of FIG. 31A. Here, the same reference numerals are used for the same or equivalent parts as those of the fourth embodiment, and detailed description thereof may be omitted.

Referring to FIGS. 31A and 31B, the organic light emitting display device may include light extraction patterns GP1 ′ having a protrusion pattern shape.

Here, the height of the uppermost end of the light extraction patterns GP1 in the region between the light extraction patterns GP1 ′ adjacent to each other may be higher than the height of the lowermost part of the organic light emitting layer 126. Therefore, in the organic light emitting display device including the light extraction patterns GP1 ′ having the protrusion pattern shape, a second electrode among the light generated in the organic light emitting layers 126 between the light extraction patterns GP 1 ′ adjacent to each other. Light other than the light emitted in the (128) direction may be reflected to be emitted toward the second electrode 128.

As described above, in the organic light emitting display device, light extraction efficiency from the PCB substrate 110 toward the second electrode 128 may be improved by the light extraction pattern GP1 ′.

32A and 32B are a plan view and a bottom view of an organic light emitting display device according to a fifth embodiment of the present invention. FIG. 33A is a cross-sectional view taken along line AA ′ of FIG. 32A, and FIG. 33B is a line BB ′ of FIG. 32A. 33C is an enlarged view of region I of FIG. 32B. Here, the same reference numerals are used for the same or equivalent parts as those of the first to fourth embodiments, and a detailed description thereof may be omitted.

32A, 32B, 33A, 33B, and 33C, the organic light emitting display device 100E according to the fifth embodiment includes a PCB substrate 110, a first electrode 124, and an organic light emitting layer 126. ), A second electrode 128, and an encapsulation layer 130.

In the organic light emitting display device 100E according to the present embodiment, at least one of the PCB substrate 110, the first conductive layer 116a, the reflective film 120, and the transparent conductive film 122 has a groove shape. It may further comprise a plurality of light extraction patterns (GP2). In addition, the light extraction patterns GP2 may be polygonal on a plane.

The uppermost height of the light extraction patterns GP2 may be higher than the lowermost height of the organic light emitting layer 126 based on the lower surface of the PCB substrate 110. Accordingly, the light extraction patterns GP2 reflect light other than the light emitted from the organic light emitting layer 126 toward the second electrode 128 in the light extraction patterns GP1. The emission may be directed toward the second electrode 128.

In the organic light emitting display device 100E according to the fourth embodiment, the light extraction patterns GP2 are emitted from the organic light emitting layer 126 toward the second electrode 128. Since light other than the light may be reflected, light extraction efficiency from the PCB substrate 110 toward the second electrode 128 may be improved.

34A is a cross-sectional view illustrating a modified example of an organic light emitting display device according to a fifth exemplary embodiment of the present invention, and FIG. 34B is an enlarged view of the region H ′ of FIG. 34A. Here, the same reference numerals are used for the same or equivalent parts as those of the fifth embodiment, and detailed description thereof may be omitted.

34A and 34B, the organic light emitting display device may include light extraction patterns GP2 ′ having a protrusion pattern shape.

Here, the height of the uppermost end of the light extraction patterns GP2 'in the region between the light extraction patterns GP2' adjacent to each other may be higher than the height of the bottom of the organic light emitting layer 126. Therefore, in the organic light emitting display device including the light extraction patterns GP2 'having the protruding pattern shape, a second electrode of the light generated in the organic light emitting layer 126 between the light extraction patterns GP2' adjacent to each other. Light other than the light emitted in the (128) direction may be reflected to be emitted toward the second electrode 128.

As described above, in the organic light emitting display device, light extraction efficiency from the PCB substrate 110 toward the second electrode 128 may be improved by the light extraction pattern GP2 ′.

The foregoing description is intended to illustrate and describe the present invention. In addition, the foregoing description merely shows and describes preferred embodiments of the present invention, and as described above, the present invention can be used in various other combinations, modifications, and environments, and the scope of the concept of the invention disclosed in the present specification and writing Modifications or variations are possible within the scope equivalent to one disclosure and / or within the skill or knowledge in the art. Accordingly, the foregoing description of the invention is not intended to limit the invention to the precise embodiments disclosed. Also, the appended claims should be construed as including other embodiments.

100A, 100A ', 100B, 100B', 100C, 100C ': organic electroluminescent display
110: PCB substrate 112: first through hole
114: second through hole 116a: first conductive layer
116b: first through electrode 116c: second conductive layer
118: connecting electrode 118a: fourth conductive layer
118b: second through electrode 118c: third conductive layer
120: reflective film 122: transparent electrode
124 and 124 ': first electrode 126: organic light emitting layer
128: second electrode 130: encapsulation layer

Claims (35)

A printed circuit board having a first region having at least one first through hole and a second region provided at an edge of the first region and having at least one second through hole;
A second through electrode provided in the second through hole;
A first electrode including a first through electrode provided in the first through hole, and a first conductive layer electrically separated from the second through electrode and provided on the first through electrode and the printed circuit board;
An organic light emitting layer provided on the first electrode; And
And a second electrode provided on the organic light emitting layer and connected to the second through electrode. The method according to claim 1,
And the first electrode further comprises a reflective film disposed between the first conductive layer and the organic light emitting layer and having a conductivity. The method of claim 2,
The reflective layer includes one of Ag, Ni, and an alloy thereof. The method of claim 2,
The first electrode further comprises a transparent conductive film disposed between the reflective film and the organic light emitting layer. 5. The method of claim 4,
The transparent conductive film may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium doped zinc oxide (GZO), zinc tin oxide (ZTO), gallium tin oxide (GTO) and fluorine (FTO) An organic electroluminescent display comprising any one of doped tin oxide. 5. The method of claim 4,
At least one of the printed circuit board, the first conductive layer, the reflective film, and the transparent conductive film includes a plurality of light extraction patterns, and the light extraction patterns are directed toward the second electrode of the light generated by the organic light emitting layer. An organic light emitting display device for reflecting light other than emitted light. The method of claim 6,
And the light extraction patterns are recesses. The method of claim 7, wherein
And an uppermost height of the light extraction patterns based on a lower surface of the printed circuit board is higher than a height of a lowermost part of the organic light emitting layer. The method of claim 6,
The light extraction pattern is a protrusion pattern. 10. The method of claim 9,
On the bottom surface of the printed circuit board
In an area between the light extraction patterns adjacent to each other, the height of the top of the light extraction patterns is higher than the height of the bottom of the organic light emitting layer. The method of claim 6,
The uneven pattern is an organic light emitting display device having a circular shape on a plane. The method of claim 6,
The uneven pattern is an organic light emitting display device having a polygonal plane. The method according to claim 1,
And the first electrode further comprises a second conductive layer provided under the first through electrode and the printed circuit board. The method of claim 13,
And a third conductive layer connected to the second through electrode and provided along an edge of the printed circuit board. 15. The method of claim 14,
The third conductive layer is spaced apart from the second conductive layer and is formed in a closed loop type surrounding the second conductive layer. 15. The method of claim 14,
The at least one of the first electrode, the second through electrode, and the third conductive layer includes any one of copper (Cu), gold (Au), and an alloy thereof. The method according to claim 1,
The second electrode is an organic light emitting display device capable of transmitting light. A printed circuit board having a first region having at least one first through hole provided at one edge and a second region provided at the other edge of the first region and having at least one second through hole;
A second through electrode provided in the second through hole;
A first electrode including a first through electrode provided in the first through hole, and a first conductive layer spaced apart from the second through electrode and provided on the first through electrode and the printed circuit board;
An organic light emitting layer provided on the first electrode; And
And a second electrode provided on the organic light emitting layer and connected to the second through electrode. 19. The method of claim 18,
And the first electrode further comprises a second conductive layer provided under the first through electrode and the printed circuit board. The method of claim 19,
And the second conductive layer extends from one edge of the printed circuit board to a region adjacent to the printed circuit board. The method of claim 19,
And a third conductive layer spaced apart from the second conductive layer below the second through electrode and extending from the other edge of the printed circuit board to a region adjacent to the printed circuit board. The method of claim 21,
And the second conductive layer and the third conductive layer have L-shaped cross sections, and end portions of the extension portions of the L-shaped cross sections face each other. The method of claim 22,
And a fourth conductive layer spaced apart from the first conductive layer on the second through electrode and provided on the other edge of the printed circuit board. The method of claim 21,
The at least one of the first electrode, the second through electrode, and the third conductive layer includes any one of copper (Cu), gold (Au), and an alloy thereof. 19. The method of claim 18,
And the first electrode further comprises a reflective film disposed between the first conductive layer and the organic light emitting layer and having a conductivity. The method of claim 25,
The reflective layer includes one of Ag, Ni, and an alloy thereof. The method of claim 25,
The first electrode further comprises a transparent conductive film disposed between the reflective film and the organic light emitting layer. 28. The method of claim 27,
The transparent conductive film may be formed of indium tin oxide (ITO), indium zinc oxide (IZO), aluminum zinc oxide (AZO), gallium doped zinc oxide (GZO), zinc tin oxide (ZTO), gallium tin oxide (GTO) and fluorine (FTO) An organic electroluminescent display comprising any one of doped tin oxide. 28. The method of claim 27,
At least one of the printed circuit board, the first conductive layer, the reflective film, and the transparent conductive film includes a plurality of light extraction patterns, and the light extraction patterns are directed toward the second electrode of the light generated by the organic light emitting layer. An organic light emitting display device for reflecting light other than emitted light. 30. The method of claim 29,
And the light extraction patterns are recesses. 31. The method of claim 30,
And an uppermost height of the light extraction patterns based on a lower surface of the printed circuit board is higher than a height of a lowermost part of the organic light emitting layer. 30. The method of claim 29,
The light extraction pattern is a protrusion pattern. 33. The method of claim 32,
On the bottom surface of the printed circuit board
In an area between the light extraction patterns adjacent to each other, the height of the top of the light extraction patterns is higher than the height of the bottom of the organic light emitting layer. 30. The method of claim 29,
The uneven pattern is an organic light emitting display device having a circular shape on a plane. 30. The method of claim 29,
The uneven pattern is an organic light emitting display device having a polygonal plane.

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