KR20120121219A - Manufacturing method of printed circuit board using laser - Google Patents

Abstract

PURPOSE: A method for manufacturing a printed circuit board using laser is provided to form a circuit pattern with a fine line width by forming a seed pattern using laser having a pulse width less than 1 micro second. CONSTITUTION: A substrate(100) is manufactured. The substrate includes a base material and a metal compound. The metal compound is dispersed in the base material. A seed pattern is formed by emitting laser to the substrate. The seed pattern is processed by oxygen plasma. A circuit pattern is formed by electroless-planting the seed pattern. [Reference numerals] (AA) O2 plasma processing

Description

Manufacturing method of a printed circuit board using a laser {MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD USING LASER}

The present invention relates to a method of manufacturing a printed circuit board, and more particularly, to a method of manufacturing a printed circuit board using a laser.

With the development of information and communication technology and semiconductor technology, the demand for printed circuit boards (PCB) is steadily increasing. PCB manufacturing technology is also becoming more specialized according to the characteristics of the final product. In addition, in recent years, in order to meet the demand for high performance and miniaturization of electronic devices, electronic products have become high density and high performance.

In order to manufacture such a printed circuit board, a conventional etching method (Subtractive Process) is applied. The circuit pattern formation process of an etched printed circuit board is performed through a complex process, which consists of several processes of photoresist (PR) lamination, exposure, development, etching, and photoresist removal.

In addition, in the process of forming a circuit pattern of an etched printed circuit board, a high-precision mask used for exposure is expensive, and there is a problem such as a warpage that occurs when used for a long time. In order to form the circuit pattern according to the conventional method, the manufacturing process of the circuit pattern is complicated and there is a problem of increasing the manufacturing cost.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the background art described above, and to provide a method of manufacturing a printed circuit board which simply forms a circuit pattern on a substrate using a laser.

In addition, there is no limitation on the selection of the base material of the laser and the substrate to provide a method of manufacturing a printed circuit board that can reduce the manufacturing cost and simplify the manufacturing process.

The method of manufacturing a printed circuit board according to an embodiment of the present invention includes the steps of manufacturing a substrate, a substrate including a metal compound dispersed in the substrate, irradiating a laser on the substrate to form a seed pattern, the seed Performing an oxygen plasma treatment on the pattern, and electroless plating the seed pattern to form a circuit pattern.

The laser may have a wavelength absorbed by both the substrate and the metal compound of the substrate.

The laser may have a wavelength in the ultraviolet region.

The laser may have a pulse width of 1 femtosecond or more and a pulse width of 1 microsecond or less.

The metal compound is titanium (Ti), iron (Fe), zinc (Zn), antimony (Sb), nickel (Ni), aluminum (Al), manganese (Mn), strontium (Sr), chromium (Cr), copper (Cu), cobalt (Co) may be a metal oxide, metal nitride or metal carbide containing any one or a combination thereof.

After electroless plating the seed pattern, the method may further include electroplating the seed pattern.

According to an embodiment of the present invention, the electroless plating may be easily performed on the seed pattern formed on the substrate including the chromatic metal compound by performing oxygen plasma treatment on the seed pattern formed on the substrate including the chromatic metal compound. Can be.

In addition, the laser having a wavelength in the ultraviolet region can be used to minimize the thermal effect on the substrate.

In addition, a seed pattern may be formed using a laser having a pulse width of 1 microsecond or less, thereby forming a circuit pattern having a fine line width.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
2 is a perspective view showing a laser irradiation pattern designed on a substrate.
3 is a cross-sectional view illustrating a step of irradiating a laser onto a substrate.
4 is a perspective view illustrating a seed pattern formed by irradiating a laser onto a substrate.
5 is a cross-sectional view showing a metal seed and a by-product formed by irradiating a laser on a substrate.
6 is a cross-sectional view showing a step of performing an oxygen plasma treatment on a substrate.
7 is a cross-sectional view illustrating a step of forming a circuit pattern by performing electroless plating on a substrate.
8 is a perspective view illustrating a circuit pattern formed by performing electroless plating on a substrate.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. Parts irrelevant to the description are omitted in order to clearly describe the present invention, and the size and the like of each component shown in the drawings are arbitrarily shown for convenience of description and the present invention is not necessarily limited to the illustrated.

1 is a flowchart illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention, FIG. 2 is a perspective view illustrating a laser irradiation pattern designed on a substrate, and FIG. 3 illustrates a step of irradiating a laser onto a substrate. 4 is a perspective view illustrating a seed pattern formed by irradiating a laser onto a substrate, and FIG. 5 is a cross-sectional view showing metal seeds and by-products formed by irradiating a laser onto a substrate, and FIG. 7 is a cross-sectional view showing a step of performing a plasma treatment, Figure 7 is a cross-sectional view showing a step of forming a circuit pattern by performing an electroless plating on a substrate, Figure 8 is a circuit pattern formed by performing an electroless plating on a substrate It is a perspective view showing.

First, as shown in FIGS. 1 and 3, the method of manufacturing a printed circuit board according to an exemplary embodiment of the present invention manufactures a substrate 100 including a metal complex 120 (S10). . The substrate 100 includes a base material 110 and a metal compound 120 dispersed in the base material.

The base material 110 may use a material having excellent thermal stability so that electronic devices such as a chip may be soldered. The base material 110 may include glass epoxy (GE), bismaleimide triazine (BT), polyesteresterimide, teflon, and polyimide of FR-4 (Flame Retardant composition 4). Polyimide (PI), Polyamide (PA), Polyethylene Terephthalate (PET), Polybutylene Terephthalate (PBT) and Polycarbonate (PC) can be used. It can also be used in combination.

The metal compound 120 is a metal oxide, metal nitride, or metal carbide, and generates a metal seed 111 when the laser 10 is irradiated onto the metal compound 120. The metal compound 120 includes titanium (Ti), iron (Fe), zinc (Zn), antimony (Sb), nickel (Ni), aluminum (Al), manganese (Mn), strontium (Sr), and chromium (Cr). It may be a metal oxide, a metal nitride or a metal carbide containing any one selected from among (Cu), cobalt (Co), or a combination thereof. As a specific example of the metal compound 120, achromatic color-based CuCr ₂ O ₄ , (CuFe) (CrFe) ₂ O ₄ , (NiMn) (CrFe) ₂ O ₄ , NiCr ₂ O ₄ , CuCO ₃ and the like are colored Al ₂ Metal oxides, metal nitrides, or metal carbides such as O ₃ , AlN, and the like are typical, but the present invention is not limited to these kinds of metal compounds 120. Colored metal compounds include yellow (Ti, Sb, Ni) O ₂ , (Ti, Sb, Ni, Co) O ₂ , (Ti, Nb, Ni) O ₂ , (Ti, Nb, Ni, Co) O ₂ , (Ti, Ni, W) O ₂ , (Ti, Fe, W) O ₂ , 2NiO, 3BaO, 17TiO ₂ , (Zn, Fe) Fe ₂ O ₄ , brown (Ti, Sb, Cr) O ₂ , (Zn, Fe) (Fe, Cr) 2O ₄ , blue CoAl ₂ O ₄ , Co ₂ SiO ₄ , CoAl ₂ O ₄ : TiO ₂ : Li ₂ O, Co (Al, Cr) ₂ O ₄ , ( Co, Zn) ₂ SiO ₄ , C ₃₂ H ₁₆ CuN ₈ , green Co ₂ TiO ₄ : NiO: Li ₂ O, (Co, Ni, Zn) ₂ TiO ₄ , Cr ₂ O ₃ : Fe ₂ O ₂ , C ₅₅ H ₇₂ O ₅ N ₄ Mg, C ₅₅ H ₇₀ O ₆ N ₄ Mg, purple CoLiPO ₄ and the like.

The metal compound 120 may be formed of a metal organic powder, and the metal organic powder is chemically and thermally stable and is mixed well when combined with the base material 110 made of a polymer or the like. In addition, the metal organic powder in the present embodiment is not conductive, and when irradiating the laser 10, the metal seed 111 is generated, and the conductivity is finally generated.

Next, as shown in FIGS. 2 to 4, the seed pattern 12 is formed on the substrate 100 by irradiating the laser 10 onto the substrate 100 (S20).

Hereinafter, the step of forming the seed pattern on the substrate 100 will be described in detail with reference to FIGS. 2 to 4.

As shown in FIG. 2, the laser irradiation pattern 11 is designed in advance according to a circuit pattern to be formed on the substrate 100. 2 illustrates a case in which the laser irradiation pattern 11 is formed along a substantially H-shaped line to connect four points A, B, C, and D on the substrate 100. The circuit pattern 13 may be formed according to the laser irradiation pattern 11 designed at the time of laser irradiation by inputting information about the laser irradiation pattern 11 to the controller of the laser generator.

3 and 4, the seed pattern 12 is formed on the substrate 100 by irradiating the laser 10 along the laser irradiation pattern 11.

When the laser beam 10 is irradiated onto the substrate 100, the metal compound 120 contained in the substrate 100 absorbs the laser 10 so that copper (Cu), chromium (Cr), nickel (Ni), and aluminum are absorbed. Metal seeds 111 such as (Al) are generated. Therefore, the seed pattern 12 of the substrate 100 is in a state capable of electroless plating so as to form the circuit pattern 13.

At this time, the laser 10 is irradiated to form the seed pattern 12 on the substrate 100, the metal compound consisting of the base material 110 and the metal oxide, metal nitride or metal carbide of the substrate 100 ( 120) may have a wavelength absorbed by all. That is, the laser 10 may have a wavelength in the ultraviolet region of 10 nm to 400 nm. When the laser 10 has a wavelength larger than the wavelength of the ultraviolet region, the laser 10 is hardly absorbed by both the base material 110 and the metal compound 120.

As such, the thermal effect on the substrate 100 may be minimized by using the laser 10 having the wavelength in the ultraviolet region as compared to the laser 10 having the wavelength in the infrared region, which is a hot wire.

Further, the laser 10 has a pulse width of 1 femtosecond (ps) or more and a pulse width of 1 microsecond (μs) or less, and preferably has a pulse width of 100 nanoseconds (ns) or less.

Laser 10 having a pulse width less than 1 femtosecond (ps) is difficult to fabricate, and laser 10 having a pulse width greater than 1 microsecond (μs) is applied to both the base material 110 and the metal compound 120. It is difficult to cause photochemical reactions.

As such, since the laser 10 has a pulse width of 1 microsecond or less that can easily cause photochemical reactions to both the base material 110 and the metal compound 120, the circuit pattern 13 having a fine line width ) Can be easily formed.

In the method of manufacturing a printed circuit board according to the exemplary embodiment of the present invention, the substrate 110 absorbs the laser 10 so that by-products 112 such as carbon (C) and hydrocarbons (CnHm) are formed in the seed pattern 12. The present invention is applicable to the substrate 100 including the laser 10 having the wavelength of the near infrared region and the achromatic-based metal compound 120, because the present invention is applicable. That is, only the metal compound 120 is selectively heated without being absorbed by the base material 110 of the substrate 100, so that by-products 112 of carbon (C) and hydrocarbons (CnHm) are not formed in the seed pattern 12. In order to do so, the achromatic-based metal compound 120 and the laser 10 having a wavelength of the near-infrared region which are well absorbed thereto were used, but the seed pattern (a method of manufacturing a printed circuit board) Since the carbon and the hydrocarbon formed in 12) are removed by performing an oxygen plasma treatment in a subsequent process, the substrate 100 including the chromatic metal compound 120 and the laser having a wavelength in the ultraviolet region or the wavelength in the green region ( 10) can also be used.

The seed pattern 12 is formed in a groove shape having a predetermined depth. The depth of the groove may be formed to about 5㎛ to 1mm, the depth of the groove can be adjusted by controlling the intensity of the laser 10 irradiated along the laser irradiation pattern 11 on the substrate 100.

As shown in FIG. 5, when the laser 10 is irradiated, not only the metal compound 120 but also the base material 110 absorbs the laser 10 so that the base material 110 made of the metal compound 120 and polyimide is formed. Since all are decomposed, not only metal seeds 111 such as copper (Cu) and chromium (Cr) but also by-products 112 such as carbon (C) and hydrocarbons (CnHm) are formed in the seed pattern 12. The by-products 112, such as carbon and hydrocarbons, have water repellent properties, thereby preventing the electroless plating from being performed on the seed pattern 12.

Next, as shown in FIG. 6, oxygen (O ₂ ) plasma treatment is performed on the seed pattern 12 to remove the by-products 112 such as carbon and hydrocarbons (S30). As such, the by-products 112, such as carbon and hydrocarbons, are removed from the seed pattern 12 of the substrate 100, leaving only the metal seed 111.

Next, as shown in FIGS. 7 and 8, the seed pattern 12 is electroless plated to form a circuit pattern 13 on the substrate 100 (S40). At this time, copper (Cu), nickel (Ni), gold (Au), silver (Ag), or the like can be used as a material for electroless plating. As such, when the substrate 100 includes the metal compound 120, the metal seed 111 is generated when the laser is irradiated, and the metal 100 is plated to form the seed pattern 12 and the circuit pattern 13. The circuit pattern 13 can be formed in a simple manner without a process or the like.

Meanwhile, after the electroless plating is performed, the seed pattern 12 may be electroless plated as necessary, followed by further electroplating. Electrolytic plating is to form a thicker plating layer to form a thick circuit pattern 13, which can be selectively performed according to the thickness of the circuit pattern 13 required.

In the above, the present invention has been described through preferred embodiments, but the present invention is not limited to these embodiments. As described above, the scope of the present invention is determined by the description of the claims, and various modifications and variations are possible without departing from the concept and scope of the claims. Those will easily understand.

10: laser 11: laser irradiation pattern
12: seed pattern 13: circuit pattern
100: substrate 110: base material
111: metal seed 112: by-product
120: Metal Organic Complex

Claims (6)

Preparing a substrate comprising a base material and a metal compound dispersed in the base material,
Irradiating a laser on the substrate to form a seed pattern;
Performing an oxygen plasma treatment on the seed pattern;
Electroless plating the seed pattern to form a circuit pattern;
Method of manufacturing a printed circuit board comprising a. The method of claim 1,
And the laser has a wavelength absorbed by both the substrate and the metal compound of the substrate. The method of claim 2,
And the laser has a wavelength in the ultraviolet region. The method of claim 1,
Wherein the laser has a pulse width of at least 1 femtosecond and a pulse width of at most 1 microsecond. The method of claim 1,
The metal compound is titanium (Ti), iron (Fe), zinc (Zn), antimony (Sb), nickel (Ni), aluminum (Al), manganese (Mn), strontium (Sr), chromium (Cr), copper The manufacturing method of the printed circuit board which is a metal oxide, metal nitride, or metal carbide containing any one or combination of (Cu) and cobalt (Co). The method of claim 1,
After electroless plating the seed pattern, electroplating the seed pattern.

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