KR20120109595A - Antenna devices having frequency-dependent connection to electrical ground - Google Patents

Abstract

Antenna devices and techniques are provided that provide specific control of the spatial distribution of DC and RF signals at various locations of a wireless device. The wireless apparatus includes various device components, each of which has a specification for achieving a desired operation in the antenna devices.

Description

ANTENNA DEVICES HAVING FREQUENCY-DEPENDENT CONNECTION TO ELECTRICAL GROUND

As designers add communication capabilities to more and more devices, antenna circuits are developed to communicate in various scenarios. Within a single device, multiple applications can operate integrated antennas as transmitters, receivers, or both. The combination of such various applications and communication signals requires direct current (DC) and RF signals to coexist at various points without interference with the operation of these device components. Various configurations exist to implement the antennas for these devices.

Above all, the description herein describes antenna devices and techniques that provide appropriate control of the spatial distribution of DC and RF signals in various device components to achieve desired operations in antenna devices.

1-3 illustrate examples of one dimensional composite right and left handed metamaterial transmission lines based on four unit cells, according to an exemplary embodiment.
FIG. 4A shows a two-port network matrix representation for a one-dimensional composite transverse meta-material transmission line equivalent circuit as in FIG. 2, in accordance with an exemplary embodiment.
FIG. 4B shows a dual port network matrix representation for a one-dimensional composite transverse meta-material transmission line equivalent circuit as in FIG. 3, in accordance with an exemplary embodiment.
5 illustrates a one-dimensional complex transverse meta-material transmission line based on four unit cells, according to an exemplary embodiment.
FIG. 6A illustrates a dual port network matrix representation for a one-dimensional complex cross-talk metamaterial antenna equivalent circuit, similar to the transmission line case as in FIG. 4A, in accordance with an exemplary embodiment.
FIG. 6B shows a dual port network matrix representation for a one-dimensional compound cross-talk metamaterial antenna equivalent circuit similar to transmission line TL as in FIG. 4B, in accordance with an exemplary embodiment.
7A and 7B are dispersion curves of the unit cell as in FIG. 2 considering each of the balanced and unbalanced cases, according to an exemplary embodiment.
8 illustrates a one-dimensional complex transverse meta-material transmission line with truncated ground based on four unit cells, in accordance with an exemplary embodiment.
FIG. 9 illustrates an equivalent circuit of a one-dimensional composite transverse meta-material transmission line with a truncated ground as in FIG. 8, in accordance with an exemplary embodiment.
FIG. 10 illustrates an example of a one-dimensional composite side-by-side metamaterial antenna having a truncated ground based on four unit cells, in accordance with an exemplary embodiment.
FIG. 11 illustrates another example of a one-dimensional composite transverse right and left metamaterial antenna having a truncated ground based on four unit cells, in accordance with an exemplary embodiment.
FIG. 12 illustrates an equivalent circuit of a one-dimensional complex transverse meta-material transmission line with a truncated ground as in FIG. 11, in accordance with an exemplary embodiment.
13 illustrates a first configuration of a wireless device having a frequency dependent connection with respect to the ground plane, in accordance with an exemplary embodiment.
14 illustrates a second configuration of a wireless device having a frequency dependent connection with respect to the ground plane, in accordance with an exemplary embodiment.
15A and 15B illustrate an MTM antenna structure with a frequency dependent connection to a ground plane that can be used in a universal serial bus (USB) dongle device application, according to an exemplary embodiment.
16A-16C illustrate implementation of an MTM antenna structure used in a wireless device having a frequency dependent connection to a ground plane, in accordance with an exemplary embodiment.
FIG. 17 illustrates return loss for an MTM antenna, such as the MTM antenna structure shown in FIGS. 16A-16C, and a return loss for direct connection to the ground plane, in accordance with an exemplary embodiment.
18A shows a comparison of the low frequency range of the radiation antenna efficiency of an MTM antenna, such as the MTM antenna structure shown in FIGS. 16A-16C, and the antenna efficiency for a direct connection to the ground plane, in accordance with an exemplary embodiment.
18B shows a comparison of the high frequency range of measured radiation antenna efficiencies of the MTM antenna shown in FIGS. 16A-16C and the same antenna with metal plates directly connected to the ground plane.
19A shows a 3D perspective view of a planar MTM antenna used in a wireless device having a frequency dependent connection to a ground plane configuration, according to an exemplary embodiment.
19B illustrates a top view of the planar MTM antenna of FIG. 8A, in accordance with an exemplary embodiment.
19C shows a bottom view of the planar MTM antenna of FIGS. 19A and 19B, in accordance with an exemplary embodiment.
20A-20E show multiple views of an elevated MTM antenna structure with a frequency dependent connection to a ground plane, in accordance with an exemplary embodiment.
21 shows return losses of the planar MTM antenna shown in FIGS. 19A-19C and the raised MTM antenna shown in FIGS. 20A-20C, according to an exemplary embodiment.
22 illustrates a comparison of radiation efficiency between raised MTM antennas and planar MTM antennas for low frequency ranges, in accordance with an exemplary embodiment.
FIG. 23 illustrates a comparison of radiation efficiency between elevated MTM antennas and planar MTM antennas for high frequency ranges, in accordance with an exemplary embodiment.
FIG. 24 shows the low frequency range of antenna efficiencies measured over various frequency ranges comparing planar MTM antennas and elevated MTM antennas for radiation performance testing involving human brain applications.
FIG. 25 shows a high frequency range of measured efficiencies over various frequency ranges comparing planar MTM antennas and elevated MTM antennas for radiation performance testing involving human brain applications.
FIG. 26A shows a 3D perspective view of a planar MTM antenna with multiple cell patch structures used in a wireless device having a frequency dependent connection to a ground plane, according to an exemplary embodiment.
FIG. 26B illustrates a top view of a planar MTM antenna configuration as in FIG. 26A, in accordance with an exemplary embodiment.
FIG. 26C shows a bottom view of the planar MTM antenna configuration of FIGS. 26A and 26B, in accordance with an exemplary embodiment.
27 illustrates return loss of the planar MTM antenna configuration of FIGS. 26A-26C, in accordance with an exemplary embodiment.
28 illustrates radiation efficiency in operating frequency bands, in accordance with an exemplary embodiment.
29A illustrates a top view of a USB dongle application using an MTM antenna structure with a frequency dependent connection to a ground plane, in accordance with an exemplary embodiment.
29B shows a bottom view of the USB dongle application of FIG. 29A, in accordance with an exemplary embodiment.
29C shows a side view of the USB dongle application of FIGS. 29A and 29B, in accordance with an exemplary embodiment.
30 illustrates return losses and isolation between the antennas of FIGS. 29A-29C, in accordance with an exemplary embodiment.
FIG. 31 illustrates antenna efficiencies of the antennas of FIGS. 29A-29C in a low band, in accordance with an exemplary embodiment. FIG.
32 illustrates antenna efficiencies of the antennas of FIGS. 29A-29C in high band, in accordance with an exemplary embodiment.
In the appended figures, similar components and / or features may have the same reference numerals. Various components of the same type are also distinguished by a second label accompanying the reference number. If only the first reference number is used in the specification, the detailed description of the invention will be applicable to any one of the similar components having the same first reference number regardless of the second reference number.

The shape, dimension, and position of the electrical grounding structure of the antenna device may affect the spatial distribution of the RF antenna signal and thus affect the operation of the antenna device in receiving or transmitting the RF antenna signal. In the antenna devices of some embodiments, the electrical ground structure may be formed by one or more conductive ground electrodes and components located in a common metallization layer or different metallization layers. The shape, dimension and position of the electrical ground of a given antenna device tends to be fixed when the antenna device is manufactured. In operation, the antenna device is electrically coupled to other circuits or devices. Electrical coupling with such other circuits or devices is such that an effective form, dimension, or both, in which the effective electrical ground to the antenna device for at least certain operations differs from the original form, original dimension, or both of the antenna device's original electrical ground. To have both, the electromagnetic configuration of the antenna device may be changed.

For example, the electrical ground of the antenna device may be permanently connected to the electrically conductive component of the circuit. Such a connection may change the electromagnetic configuration of the antenna device. In another embodiment, the antenna device may be detachably connected to an electrically conductive component of another device, where after another device is connected to the antenna device, the electrical ground of the antenna device is connected to the electrically conductive component of the other device. This connection may change the electromagnetic configuration of the antenna device. Such a connection may change the electromagnetic configuration of the antenna device.

The altered electromagnetic configuration of the antenna device can degrade antenna device performance in transmitting or receiving one or more RF signals. The antenna devices and techniques described herein include one or more frequency dependent connectors to control the electromagnetic configuration of the antenna device at one or more operating RF frequencies of the antenna device. Such a frequency dependent connector may be connected between an electrical ground electrode structure having one or more ground electrodes and another electrically conductive component or metal plate to change the impedance of the connector to the signal depending on the frequency of the signal. . For example, such frequency dependent connectors generate low impedance to allow transmission of DC signals between the electrically conductive component or the metal plate and the ground electrode and at least one antenna signal between the electrically conductive component or the metal plate and the ground electrode. It may have a structure for generating high impedance in the one or more antenna signals to prevent their transmission. In this particular example, the frequency dependent connector may be an inductor or circuit with the desired frequency dependent behavior.

One embodiment of an antenna device based on the above examples includes one or more antennas that transmit or receive one or more antenna signals at one or more RF antenna frequencies, antenna circuitry in communication with the one or more antennas, and a ground electrode structure, The antenna circuit is connected to the ground electrode structure to provide electrical ground for the antenna circuit and one or more antennas. The antenna circuit generates one or more antenna signals or receives one or more antenna signals from one or more antennas for transmission by one or more antennas. In such an antenna device, an electrically conductive component or metal plate is provided and spaced apart from the ground electrode structure without direct contact with the ground electrode structure. Frequency dependent connectors are provided for connecting electrically conductive components or metal plates to the ground electrode structure, generating low impedance and allowing the transmission of DC signals between the electrically conductive components or metal plate and the ground electrode structure. And configured to generate high impedance at one or more RF antenna frequencies to block transmission of one or more antenna signals between the element or metal plate and the ground electrode structure. The ground electrode structure may comprise a single ground electrode or a combination of two or more ground electrodes. The two or more ground electrodes may be of a common metallization layer or of two or more different metallization layers. In this embodiment, the ground electrode structure is isolated by a frequency dependent connector from the electrically conductive component or metal plate at one or more RF antenna frequencies and connected to the electrically conductive component or metal plate for the DC signal.

One or more antennas and the other antenna devices described herein may be comprised of a variety of antenna structures, including right-handed (RH) antenna structures and composite right and left handed (CRLH) meta Material (MTM) structures. In starboard antenna structures, the propagation of electromagnetic waves is the right hand for (E, H, β) vector fields when considering electric field (E), magnetic field (H), and wave vector (β) (or propagation constant). Follow the law. The phase velocity direction is the same as the signal energy propagation (group velocity) direction, and the refractive index is positive. Such materials are referred to as starboard (RH) materials. Most natural materials are starboard materials. Artificial materials can also be starboard materials.

Metamaterials have an artificial structure. When designed with a structural average unit cell size ρ which is much smaller than the wavelength λ of the electromagnetic energy induced by the metamaterial, the metamaterial can behave like a homogeneous medium for the induced electromagnetic energy. Unlike RH materials, metamaterials may exhibit negative refractive indices, the phase velocity direction may be opposite to the signal energy propagation direction, and the relative directions of the (E, H, β) vector fields follow the left hand law. . Metamaterials having a negative refractive index and at the same time having a negative permittivity (ε) and permeability (μ) are referred to as pure LH metamaterials.

Many metamaterials are mixtures of LH and RH materials and thus CRLH metamaterials. CRLH metamaterials behave like LH metamaterials at low frequencies and behave like RH materials at high frequencies. Examples and properties of various CRLH metamaterials are described, for example, in " Electromagnetic Metamaterials: Transmission Line Theory and Microwave Application " John Wiley & Sons (2006) by Caloz and Itoh. CRLH metamaterials and their applications in antennas are described in Tatsuo Itoh's "Invited paper: Prospects for Metamaterials" Electronic Letters, Vol. 40, no. 16 (August 2004).

CRLH metamaterials can be constructed and engineered to exhibit electromagnetic properties tailored for specific applications, and can be used in applications where other materials may be difficult, impractical or impractical to use. In addition, CRLH metamaterials may be used to develop new applications and construct new devices that are not possible with RH materials.

Metamaterial (MTM) structures can be used to construct antennas, transmission lines, and other RF components and devices, enabling a wide range of technical advancements such as improved functionality, reduced size, and improved performance. The MTM structure has one or more MTM unit cells. Equivalent circuits for MTM unit cells include RH series inductance (LR), RH shunt capacitance (CR), LH series capacitance (CL), and LH class inductance (LL). MTM based components and devices can be designed based on these CRLH MTM unit cells that can be executed using distributed integer circuit elements, lumped circuit elements, or a combination of both. have. Unlike conventional antennas, MTM antenna resonances are affected by the presence of the LH mode. In general, the LH mode not only improves matching of high frequency resonances but also promotes low frequency resonances and helps to better match. MTM antenna structures may be configured to support a plurality of frequency bands including “low band” and “high band”. The low band includes at least one LH mode resonance and the high band includes at least one RH mode resonance associated with the antenna signal.

Some examples and embodiments of MTM antenna structures are described in US patent application Ser. No. 11 / 741,674, filed April 27, 2007, "Antennas, Devices and Systems Based on Metamaterial Structures," and US issued September 22, 2009. Patent 7,592,957 is described in "Antennas Based on Metamaterials Structures". The disclosures of the above U.S. patent documents are incorporated herein by reference. Such MTM antenna structures may be fabricated using conventional FR-4 printed circuit boards (PCBs) or flexible printed circuit (FPC) boards. Examples of other fabrication techniques include thin film fabrication techniques, System On Chip (SOC) techniques, Low Temperature Co-Fired Ceramic (LTCC) techniques, and Monolithic Microwave Integrated Circuit (MMIC) techniques.

One type of MTM antenna structures is a single-layer metallization (SLM) MTM antenna structure. Conductive portions of the MTM structure are located in the SLM layer formed on one side of the substrate.

The Two-Layer Metallizaton Via-Less (TLM-VL) MTM antenna structure is another type of MTM antenna structure with two metallization layers on two parallel surfaces of the substrate. The TLM-VL does not have conductive vias connecting the conductive portions of one metallization layer to the conductive portions of the other metallization layer. Examples and embodiments of SLM and TLM-VL MTM antenna structures are described in US Patent Application No. 12 / 259,477, "Single-Layer Metallization and Via-Less Metamaterial Structures," filed October 13, 2008, The disclosure is incorporated herein by reference.

1 shows an example of a one-dimensional (1D) CRLH MTM transmission line (TL) based on four unit cells. One unit cell includes cell patches and vias and is a component for constructing a desired MTM structure. The TL example shown includes four unit cells formed of two conductive metallization layers of the substrate, with four conductive cell patches formed on the top conductive metallization layer of the substrate and the other side of the substrate being a metal as a ground electrode. It is equipped with a fire layer. Four centered conductive vias are each formed through the substrate to connect the four cell patches to the ground plane. The unit cell patch on the left side is electromagnetically coupled to the first supply line and the unit cell patch on the right side is electromagnetically coupled to the second supply line. In some embodiments, each unit cell patch is electromagnetically coupled to adjacent unit cell patches without direct contact with adjacent unit cells. This structure forms an MTM transmission line to receive an RF signal from one supply line and output an RF signal from another supply line.

FIG. 2 shows an equivalent network circuit of the 1D CRLH MTM TL of FIG. 1. ZLin 'and ZLout' correspond to TL input load impedance and TL output load impedance, respectively, and are due to TL coupling at each end. This is an example of a printed double layer structure. LR is due to the cell patch on the dielectric substrate and CR is due to the dielectric substrate sandwiched between the cell patch and the ground plane. CL is due to the presence of two adjacent cell patches, vias lead to LL.

Each individual unit cell may have two resonances ω _SE and ω _SH corresponding to the series (SE) impedance Z and the classification (SH) admittance Y. In FIG. 2, the Z / 2 block includes a series combination of LR / 2 and 2CL, and the Y block includes a parallel combination of LL and CR. The relationships between these parameters are expressed as follows:

식(1)

Equation (1)

The two unit cells at the input / output edges of FIG. 1 do not include CL. This is because CL represents the capacitance between two adjacent cell patches and disappears at these input / output edges. The absence of the CL portion in the edge unit cell prevents the ω _SE frequency from resonating. Therefore, only ω _SH appears as m = 0 resonance frequency.

To simplify computational analysis, portions of the ZLin 'and ZLout' series capacitors are included to compensate for the missing CL portion, and the remaining input and output load impedances are shown in Figure 3, as ZLin 'and ZLout', respectively. Is displayed. Under these conditions, all unit cells are represented by the two series Z / 2 blocks and one class Y block of FIG. 3, where the Z / 2 block contains a series combination of LR / 2 and 2CL, and the Y block is the LL. And a parallel combination of CR.

4A and 4B show dual port network matrix representations for the TL circuits without load impedance shown in FIGS. 2 and 3, respectively.

5 shows an example of a 1D CRLH MTM antenna based on four unit cells. Unlike the 1D CRLH MTM TL of FIG. 1, the antenna of FIG. 5 couples the unit cell on the left to the supply line to connect the antenna to the antenna circuit and the unit cell on the right allows four cells to transmit or receive an RF signal. It is open circuited to interface with air.

6A shows a dual port network matrix representation for the antenna circuit in FIG. 5. 6B shows a dual port network matrix representation for the antenna circuit of FIG. 5 with a change in edges to calculate the missing CL portion to equalize all unit cells. 6A and 6B are similar to the TL circuits shown in FIGS. 4A and 4B, respectively.

In matrix notation, FIG. 4B shows the following relation:

식(2)

Equation (2)

Where AN = DN since the CRLH MTM TL circuit of FIG. 3 is symmetrical when viewed from the V _in and V _out ends.

In FIGS. 6A and 6B, parameters GR 'and GR represent radiation resistance, and parameters ZT' and ZT represent termination impedance. Each of ZT ', ZLin' and ZLout 'includes contributions from additional 2CL as indicated below:

식(3)

Equation (3)

Since radiation resistances GR and GR 'can be derived only by building or simulating the antenna, it may be difficult to optimize the antenna design. Therefore, it is desirable to adopt a TL approach and then simulate its corresponding antennas with various terminators (ZT). The relationships in equation (1) are valid for the circuit of FIG. 2 with modified values AN ', BN', CN 'reflecting the missing CL portion at both edges.

The frequency bands can be determined from the dispersion equation derived by causing the N CRLH cell structure to resonate with nπ propagation phase length, where n = 0, ± 1, ± 2, ... ± N. Here, each of the N CRLH cells is represented by Z and Y in equation (1), which is different from the structure shown in FIG. 2, and CL disappears from the end cells. Therefore, one can expect that the resonances associated with these two structures are different. However, the extended calculations show that all resonances are the same except when n = 0 where ω _SE and ω _SH resonate in the structure of FIG. 3 and only ω _SH resonates in the structure of FIG. 2. Positive phase offsets n> 0 correspond to RH region resonances and negative values n <0 are associated with LH region resonances.

The spreading relationship of N identical CRLH cells with Z and Y parameters is given below:

식(4)

Formula (4)

Where Z and Y are given in equation (1), AN is derived from a linear cascade of N identical CRLH unit cells as in FIG. 3, p is the cell size. Odd n = (2m + 1) and even n = 2m resonances are associated with AN = −1 and AN = 1, respectively. For AN ′ of FIGS. 4A and 6A, the n = 0 mode resonates only at ω ₀ = ω _SH and does not resonate at both ω _SE and ω _SH due to the absence of CL in the end cells. The higher-order frequencies are given by the following equations for the different values of x specified in Table 1:

식(5)

Formula (5)

Table 1 provides the χ values for N = 1, 2, 3, and 4. It should be noted that the higher order resonances (| n |> 0) are the same regardless of whether there is a complete CL in the edge cells (FIG. 3) or no CL (FIG. 2). In addition, resonances close to n = 0 have small χ values (close to χ lower limit 0), while higher order resonances tend to reach χ upper 4 as shown in equation (4).

Table 1: Resonances for N = 1, 2, 3, and 4 Cells

Diffusion curve as the frequency ω function β is in Fig. 7a and 7b with respect to ω _SE and ω _SH (equilibrium (balanced), i.e., LR CL = LL CR) and ω _SE and ω _SH (non-equilibrium (unbalanced)) if Shown. In the latter case, there is a frequency gap between the minimum value (ω _SE , ω _SH ) and the maximum value (ω _SE , ω _SH ). The limiting frequencies ω _min and ω _Smax values are given by the same resonance equations of equation (5) when χ reaches the upper limit χ = 4 as shown in the following equations.

식(6)

Formula (6)

In addition, FIGS. 7A and 7B provide examples of resonant positions along dispersion curves. In the RH region (n> 0), the structure size l = Np (p is the cell size) increases with decreasing frequency. In contrast, in the LH region, the smaller the value of Np is, the lower frequencies are reached, and thus a size reduction occurs. Diffusion curves provide some indication of the bandwidth around these resonances. For example, LH resonances have a narrow bandwidth because the diffusion curves are nearly flat. In the RH region, the bandwidth is wider because the diffusion curves are steeper. The first condition, i.e., the first BB condition, for obtaining broadbands can be expressed as follows:

식(7)

Formula (7)

Where χ is given by equation (4) and ω _R is defined in equation (1). The dispersion relationship of equation (4) causes resonances when | AN | = 1 which leads to a zero denominator in the first BB condition COND1 of equation (7). Recall that AN is the first transmission matrix input of N identical unit cells (FIGS. 4B and 6B). The calculation indicates that COND1 is actually independent of N and given by the second equation in equation (7). Defining the possible bandwidths by defining the slope of the diffusion curves are the values of molecules and χ at resonances as shown in Table 1. Targeted structures have a maximum Np = λ / 40 for a size with bandwidth exceeding 4%. For structures with small cell sizes p, equation (7) indicates that high ω _R values satisfy COND1, ie low CR and LR values, which means that for n <0, other items (1-χ) This is because resonances occur at χ values close to 4 in Table 1 in / 4 → 0).

As indicated above, once the diffusion curve slopes have steep values, the next step is to confirm proper matching. Ideal matching impedances have fixed values and may not require large matching network footprints. “Matched impedance” herein refers to the supply line and terminator in the case of a single side feed as in the antenna. To analyze the input / output matching network, Zin and Zout can be calculated for the TL circuit in FIG. 4B. Since the network of FIG. 3 is symmetric, it is simple to prove that Zin = Zout. It can be proved that Zin is independent of N as shown in the following formula.

식(8)

Formula (8)

This has negative mistakes. One reason that B1 / C1 is greater than zero is due to the condition of | AN | ≤1 in equation (4), which results in the following impedance condition:

A second broadband (BB) condition is that Zin varies slightly with frequency close to resonances to maintain constant matching. It should be remembered that the actual input impedance Zin 'includes the contribution from the CL series capacitance as shown in equation (3). The second BB condition is given as follows:

식(9)

Formula (9)

Unlike the transmission line example of FIGS. 2 and 3, antenna designs have an open-ended side with infinite impedance that poorly matches the structural edge impedance. Capacitance terminator is given by the following equation:

식(10)

Equation (10)

This depends on N and is purely hypothetical. Since the LH resonances are typically narrower than the RH resonances, the selected matching values are closer to those derived in the n <0 region than in the n> 0 region.

One way to increase the bandwidth of the LH resonances is to reduce the classification capacitor CR. This reduction can lead to higher ω _R values of the steeper diffusion curves described in equation (7). There are various ways to reduce the CR, which is 1) increasing the substrate thickness, 2) reducing the cell patch area, and 3) the ground area under the top cell patch, resulting in truncated ground. Reducing, or combinations of these techniques, but not limited thereto.

The MTM TL and antenna structures of FIGS. 1 and 5 use a conductive layer to cover the entire bottom surface of the substrate as a complete ground electrode. A truncated ground electrode patterned to expose one or more portions of the substrate surface can be used to reduce the area of the ground electrode to be smaller than the area of the complete substrate surface. This increases the resonance bandwidth and tunes the resonance frequency. Two examples of a truncated ground structure are discussed with reference to FIGS. 8 and 11, where the amount of ground electrode in the area of the footprint of the cell patch on the ground electrode side of the substrate is reduced, and the remaining strip line (via Via lines are used to connect the cell patch to the main ground electrode outside the footprint of the cell patch. This truncated ground approach may be implemented in various configurations to achieve wideband resonances.

8 shows an example of a truncated ground electrode for a four-cell MTM transmission line when the ground electrode has smaller dimensions than the cell patch along one direction below the cell patch. The ground conductive layer includes a via line connected to the vias and passing through under the cell patches. The via line has a width smaller than the dimension of the cell patch of each unit cell. The use of truncated ground may be the preferred choice superior to other methods in implementations of commercial devices when the substrate thickness cannot be increased or the cell patch area cannot be reduced due to a related decrease in antenna efficiency. have. When the ground is truncated, another inductor Lp (FIG. 9) is introduced by a metallization strip (via line) connecting the vias to the main ground as shown in FIG. 8. FIG. 10 illustrates a four-cell antenna counterpart with a truncated ground similar to the TL structure in FIG. 8.

11 shows another example of an MTM antenna having a truncated ground structure. In this example, the ground conductive layer includes via lines and main ground formed outside the footprint of the cell patches. Each via line is connected to the main ground at the first distal end and to the via at the second distal end. The via line has a width smaller than the dimension of the cell path of each unit cell.

Equations for the truncated ground structure can be derived. In the truncated grounding examples, the class capacitance CR becomes small and the resonances follow the equations as in equations (1), (5) and (6) and in Table 1. There are two approaches. 8 and 9 present the first approach, approach 1, where the resonances are the same as in equations (1), (5), and (6) and Table 1 after being replaced by (LR + Lp). For n | ≠ 0, each mode is (1) ω ± n for LR is replaced by (LR + Lp) (2) ω ± n for LR is replaced by (LR + Lp / n) With two resonances corresponding to being, N is the number of unit cells. Under this approach 1, the impedance equation becomes:

Formula (11)

Where Zp = jωLp and Z, Y are defined in equation (2). The impedance equation of equation (11) provides that the two resonances ω and ω 'have low impedance and high impedance, respectively. Thus, in most cases it is easy to tune in the vicinity of ω resonances.

A second approach, approach 2, is shown in Figures 11 and 12, where the resonances are the same as in equations (1), (5), and (6) and Table 1 after LL has been replaced by (LL + Lp). In a second approach, the combined inductor (LL + Lp) increases while the sorting capacitor CR decreases, which results in lower LH frequencies.

The above example MTM structures are formed on two metallization layers and one of the two metallization layers is used as the ground electrode, and is connected to the other metallization layer through conductive vias. Antennas with such double layer CRLH MTM TLs and vias may be composed of the complete ground electrode shown in FIGS. 1 and 5 or the truncated ground electrode shown in FIGS. 8 and 10.

In one embodiment, the SLM MTM structure comprises a substrate having a first substrate surface and an opposite substrate surface; And a metallization layer formed on the first substrate surface and patterned with two or more conductive portions to form an SLM MTM structure without conductive vias penetrating through the dielectric substrate. The conductive portions in the metallization layer may comprise a cell patch of SLM MTM structure; Ground spatially separated from the cell patch; Via lines interconnected with ground and cell patches; And a supply line that is capacitively coupled to the cell patch without directly contacting the cell patch. LH series capacitance CL is produced by capacitive coupling through the gap between the supply line and the cell patch. RH series inductance LR is mainly generated at the supply line and cell patch. In this SLM MTM structure, there is no dielectric material sandwiched vertically between the two conductive portions. As a result, the RH class capacitance CR of the SLM MTM structure may be designed to be negligibly small. Small RH class capacitance CR can still be induced between cell patch and ground, both in a single metallization layer. The LH class inductance LL in the SLM MTM structure is negligible because there are no vias through the substrate, but a via line connected to ground can produce an inductance equivalent to the LH class inductance LL. The TLM-VL MTM antenna structure may have supply lines and cell patches located on two different layers to create vertical capacitive coupling.

Unlike the SLM and TLM-VL MTM antenna structures, the multilayer MTM antenna structure has conductive portions in two or more metallization layers connected by at least one via. Examples and embodiments of such multilayer MTM antenna structures are described in US Patent Application No. 12 / 270,410, "Metamaterial Structures with Multilayer Metallization and Via," filed October 13, 2008, the disclosure of which is incorporated by reference. Are incorporated herein by reference. These multiple metallization layers are patterned to have multiple conductive portions based on a substrate, film, or plate structure in which the two metallization layers are separated by an electrically insulating material (eg, a dielectric material). Two or more substrates may be stacked with or without a dielectric spacer to provide multiple surfaces for multiple metallization layers to achieve particular technical features or advantages. Such multilayer MTM antenna structures may carry at least one conductive via that connects one conductive portion of one metallization layer to another conductive portion in another metallization layer. This allows the connection of one conductive portion in one metallization layer with another conductive portion in another metallization layer.

Embodiments of a dual layer MTM antenna structure include a substrate having a first substrate surface and a second substrate surface opposite the first substrate surface; A first metallization layer formed on the first substrate surface; And a second metallization layer formed on the surface of the second substrate, wherein the two metallization layers have at least one conductive via connecting one conductive portion in the first metallization layer to another conductive portion in the second metallization layer. It is patterned to have one or more conductive portions. The truncated ground may be formed on the first metallization layer with a portion of the surface exposed. The conductive portions of the second metallization layer can include the MTM structure and the cell patch of the supply line, the distal end of the supply line being located proximate to the cell patch and transmitting to the cell patch to transmit antenna signals to or from the cell patch. Capacitively coupled. The cell patch is formed parallel to at least a portion of the exposed surface. The conductive portions in the first metallization layer include via lines connecting the truncated ground in the first metallization layer and the cell patch in the second metallization layer through vias formed in the substrate. LH series capacitance CL is produced by capacitive coupling through the gap between the supply line and the cell patch. RH series inductance LR is mainly generated at the supply line and cell patch. LH classification inductance LL is mainly induced by vias and via lines. The RH class capacitance CR is mainly derived between the cell patch in the second metallization layer and the portion of the via line of the footprint of the cell patch projected on the first metallization layer. Additional conductive lines, such as meander lines, can be attached to the supply lines to induce RH monopole resonance to support wideband or multiband antenna operation.

Examples of various frequency bands that may be supported by MTM antennas include frequency bands for cell phone and mobile device applications, WiFi applications, WiMax applications, and other wireless communication applications. Examples of frequency bands for cell phone and mobile device applications include: cellular band 824-960 MHz, including two bands: CDMA (824-894 MHz) and GSM (880-960 MHz) bands; And the PCS / DCS band (1710-2170 MHz), including three bands: DCS (1710-1880 MHz), PCS (1850-1990 MHz), and AWS / WCDMA (2110-2170 MHz).

The MTM structure may be specifically tailored to comply with the needs of the application, device performance requirements, and other specifications, such as PCB real-estate factors. The cell patch in the MTM structure can have various geometric shapes and dimensions, including, for example, rectangular, polygonal, irregular, zigzag, circular, oval, or a combination of different shapes. Via lines and supply lines may also include various geometric shapes and dimensions, including, for example, rectangular, polygonal, irregular, and zigzag, circular, oval, or a combination of different shapes. The distal end of the supply line can be modified to form a launch pad that alters the capacitive coupling. The springboard may have a variety of geometric shapes and dimensions including, for example, rectangular, polygonal, irregular, zigzag, circular, elliptical, or a combination of different shapes. The gap between the springboard and the cell patch can take various forms, including, for example, straight lines, curved lines, L-shaped lines, zigzag lines, discontinuities, enclosing lines, and combinations of different forms. Some of the supply lines, hops, cell patches, and bylines may be formed in a different layer than others. Some of the supply lines, hops, cell patches, and via lines may extend from one metallization layer to another metallization layer. The antenna portion may be located several millimeters above the main substrate. A plurality of cells may be cascaded in series to form a multicell 1D structure. A plurality of cells may be cascaded in an orthogonal direction to form a 2D structure. In some embodiments, a single supply line may be configured to deliver power to a plurality of cell patches. In other embodiments, the additional conductive line may be a variety of such additional conductive lines including, for example, rectangular, irregular, zigzag, planar spiral, vertical spiral, meander, or a combination of different forms. It may be added to a supply line or springboard which may have geometric shapes and dimensions. Additional conductive lines may be located at the top, middle, or bottom layer of the substrate, but a few millimeters above the substrate.

Another type of MTM antenna includes non-planar MTM antennas. Such non-planar MTM antenna structures allow the antenna sections of the MTM antenna to be spatially distributed in a non-planar configuration to provide a compact structure adapted to the allocated space or volume of a wireless communication device such as a portable wireless communication device. One or more antenna sections are arranged to be remote from one or more other antenna sections of the same MTM antenna. For example, one or more antenna sections of the MTM structure may be positioned while placing one or more other antenna sections of the MTM antenna on another dielectric substrate such that one or more antenna sections of the MTM structure are spatially distributed in a non-planar configuration, such as an L-shaped antenna configuration. And may be located on the dielectric substrate. In various applications, the antenna portions of the MTM antenna may be arranged to accommodate the various portions parallel or non-parallel in a three dimensional (3D) substrate structure. Such non-planar MTM antenna structures may be enclosed within or around the product enclosure. Antenna sections in a non-planar MTM antenna structure may be arranged to engage an enclosure, housing walls, antenna carrier, or other packaging structures that save space. In some embodiments, at least one antenna section of the non-planar MTM antenna structure is located close to or substantially parallel to the near plane of such packaging structure, where the antenna section is present inside or outside of such packaging structure. Can be. In some other embodiments, the MTM antenna structure may be conformal to the inner wall of the article's housing, the outer surface of the antenna carrier, or the contour of the device package. Such non-planar MTM antenna structures can have a smaller footprint than similar antennas in a planar configuration, and thus can be adapted to the limited space available in portable communication devices such as cellular phones. In some non-planar MTM antenna designs, a swivel mechanism or sliding mechanism can be combined such that part or all of the MTM antenna can be folded or slid inward to save space while not in use. Additionally, the stacked substrates combine mechanical and electrical contacts between the stacked substrates to utilize the space on the main board and support different antenna sections of the MTM antenna, with or without dielectric spacers. May be used.

Non-planar, 3D MTM antennas can be implemented in a variety of configurations. For example, the MTM cell segments described herein may be arranged in non-planar, 3D configurations to implement a design with tuning elements formed around the various MTM structures. US Patent Application No. 12 / 465,571, filed May 13, 2009, "Non-Planar Metamaterial Antenna Structures," discloses 3D antenna structures capable of executing tuning elements, for example, in the vicinity of MTM structures. The entire disclosure of US patent application Ser. No. 12 / 465,571 is incorporated by reference as part of the disclosure.

In one aspect, US patent application Ser. No. 12 / 465,571 includes walls forming an enclosure, a first antenna portion located inside the device housing and located closer to the first wall than the other walls, the second antenna portion An antenna device comprising a device housing is disclosed. The first antenna portion includes one or more first antenna components arranged in a first plane proximate the first wall. The second antenna portion includes one or more second antenna components arranged in a second plane different from the first plane. Such a device includes one or more first antenna components and a second of the first antenna section to form a CRLH MTM antenna supporting at least one resonant frequency of the antenna signal and having a dimension less than half of one wavelength of the resonant frequency. And a joint antenna part connecting the first antenna portion and the second antenna portion such that one or more second antenna components of the antenna portion are electromagnetically coupled. In another aspect, US Application No. 12 / 465,571 discloses an antenna device configured to engage a packaging structure. Such an antenna device includes a first antenna section configured proximate to a first planar section of a packaging structure, the first antenna section including a first planar substrate and at least one first conductive portion associated with the first planar substrate. . A second antenna section is provided for this device and is configured in proximity to the second planar section of the packaging structure. The second antenna section includes a second planar substrate, at least one second conductive portion associated with the second planar substrate. Such a device may also comprise a joint antenna section which houses the first and second antenna sections. The at least one first conductive portion, the at least one second conductive portion, and the joint antenna section collectively form a CRLH MTM structure to support at least one frequency resonance in the antenna signal. However, in another embodiment, US patent application Ser. No. 12 / 465,571 is configured to engage a packaging structure and includes at least one in the antenna signal comprising a substrate having a flexible dielectric material and two or more conductive portions associated with the substrate. An antenna device is disclosed that forms a CRLH MTM structure configured to support frequency resonance. The CRLH MTM structure is formed between a first antenna section configured to proximate a first planar section of the packaging structure, a second antenna section configured to proximate a second planar section of the packaging structure, and between the first antenna section and the second antenna section; A third antenna section bent near a corner formed by the first planar section and the second planar sections of the packaging structure.

Return loss, gain, and radiation efficiency are important antenna performance indicators, especially for small mobile communication devices when PCP real-estate is limited. In general, reducing the antenna size reduces the efficiency. Acquiring a high performance indicator with some limited space is a big challenge, especially in antenna design for cell phones and other small mobile communication devices. For example, because placement on the PCB is limited due to the smaller mobile device size, the design of RF circuits, keypads, microphones, liquid crystal displays (LCDs), batteries, and cameras can be more difficult. Antenna performance, including return loss, gain, and radiation efficiency, can be significantly degraded by other objects on the same PCB adjacent to the antenna. Other external objects include a human body that can also interfere with antenna performance. In some cases, it is important to shield the antenna from human effects to minimize the absorption of RF signals into the human body.

Antenna structures may be installed on other small devices such as Universal Serial Bus (USB) adapters and Personal Computer Memory Card International Association (PCMCIA) cards. Such devices are typically plugged into a host device, such as a laptop or desktop computer, to serve as a peripheral interface for communicating with external devices such as network cards, external storage, print, and multimedia devices. Antenna performance may be affected by the proximity of these additional objects, such as host device PCB ground and host device LCD. Performance may also vary based on host device size, shape, and structure. Therefore, ensuring that the embedded device operates independently of the host device is an important design element to achieve acceptable and stable antenna performance. For example, some design features used to isolate an embedded device from a host device are frequency dependent connectors or active as a method of mitigating interference introduced by surrounding objects without affecting the operation of other circuit components and devices. It may include antenna devices that use components. This disclosure describes several frequency-dependent isolation techniques and structures for removing or minimizing the proximity effect of objects in proximity to an MTM antenna structure.

An embodiment of a wireless device that supports an antenna and uses one or more frequency dependent structures to isolate certain circuit components from the antenna includes one or more substrates; One or more metallization layers supported by one or more substrates; A ground electrode formed in one of the one or more metallization layers; One or more metal plates formed in at least one of the one or more metallization layers; Several conductive portions formed in at least one of the one or more metallization layers; And one or more electrical components, each of which is electrically coupled with one or more metal plates and a ground electrode, the RF frequency source determining an impedance associated with the one or more electrical components.

13 illustrates an example of isolation techniques and structures used to improve the performance of an antenna in a wireless device 1300. In FIG. 13, the metal plate 1301 is located close to the antenna 1303 and the ground plane 1305. According to one example, metal plate 1301 may be configured to support integrated cellular components such as a keypad, key domes, microphone, and camera module. Ground plane 1305 may be shared by antennas 1303 and integrated components located on metal plate 1301 to allow proper grounding. An antenna source 1309, such as a wireless transceiver, may be used to supply RF input signals to the antenna 1303 and connect the antenna 1303 to the ground plane 1305. During DC operation, a DC current can be supplied to the metal plate 1301 to support integrated cellular components. However, in high RF operation, there may be undesirable interactions between these integrated components and antenna 1303 to reduce the performance of the antenna. Thus, at certain frequencies, isolating antenna 1303 from such integrated cellular components located on metal plate 1301 is of particular interest and benefit in antenna performance. Various isolation techniques and structures are described herein that allow one or more antennas to operate adjacent to integrated components. For example, an electrical component having frequency dependent characteristics such as inductor 1307 may be used to couple metal plate 1301 to ground plane 1305 and isolate metal plate 1301 from antenna 1303 at certain frequencies. It may be. In DC operation, the inductor 1307 may act as a low impedance component that allows DC current from integrated components to be delivered to other circuit components in the ground plane 1305 without distortion. In the high frequency range or microwave frequency, the inductor 1307 may act as a high impedance component that can prevent the RF current from moving to the metal plate 1301, which creates reverse interactions with the antenna 1303. Thus, by using such a frequency dependent connector, such as the inductor 1307, between the metal plate 1301 and the ground plane 1305, integrated components such as keypads, key domes, microphones, and camera modules can be used for antenna 1303 during high frequency operation. Can be safely operated on the metal plate 1301 without adversely affecting the performance.

Other wireless device configurations may include a non-planar wireless device. For example, the antenna 1303 shown in FIG. 13 may be formed on different planes substantially parallel to and spatially distributed from the metal plate 1301 and the ground plane 1305 to form a non-planar wireless device. . Additionally, the previously presented isolation techniques and structures can be applied to non-planar wireless devices to provide isolation, which allows one or more antennas to operate adjacent to other circuit components.

In FIG. 14, for example, the non-planar wireless device 1400 may include an antenna 1403 formed on the first surface and two conductive elements, the metal plate 1401, and the ground plane 1405. An antenna source 1409, such as a wireless transceiver, may be used to supply RF input signals to the antenna 1403 and connect the antenna 1403 to a ground plane 1405. The metal plate 1401 may be configured to be substantially parallel to the antenna 1403 and positioned below the antenna 1403, thus adjacent objects such as the human body to reduce radio interference caused by objects such as human effects. And act as a physical barrier or shield between the antenna and the antenna 1403. Additionally, metal plate 1401 may be configured to support integrated cellular components such as keypads, key domes, microphones, and camera modules. Ground plane 1405 may be shared by antenna 1403, other circuitry and cellular components formed in metal plate 1401. In DC operation, DC current can be supplied to the metal plate 1401 to support these integrated cellular components. However, at high frequencies, such cellular components as described in previous embodiments may interfere with antenna 1403 and result in reduced antenna performance.

Similar isolation techniques and structures described in the previous embodiments can be applied to the non-planar wireless device 1400. For example, electrical component 1407 with frequency dependent characteristics, such as an inductor, couples metal plate 1401 to ground plane 1405 and isolates metal plate 1401 from ground plane 1405 at certain frequencies. It can also be used to. In DC operation, for example, inductor 1407 may act as a low impedance component that allows DC current from integrated components to be delivered to other circuit components without distortion. At high frequencies or microwave frequencies, the inductor 1407 can act as a high impedance component that can prevent RF current from moving to the metal plate 1401 to eliminate or minimize interference to the antenna 1403. By using a frequency dependent connector such as inductor 1407 between metal plate 1401 and ground plane 1407, integrated components such as keypads, key domes, microphones, and camera modules adversely affect antenna performance during high frequency operation. It can be mounted on the metal plate 1401 without. In addition, in combination with the inductor 1407, the metal plate 1401 can act as a shield for the antenna 1403 to mitigate the human body effect and reduce the specific absorption rate (SAR) absorbed by the human body. May help

15A illustrates an example of isolation techniques and structures used to improve the performance of a plurality of antennas used in a USB dongle device application 1500. One example of a USB dongle device 1501 is a portable hardware having a USB male connector or plug 1507 that may be inserted into a USB port 1503 of a host device 1505 such as a laptop or desktop computer. The USB dongle device 1501 supports wireless applications and includes a plurality of internal antennas. In FIG. 15A, antenna performance may depend on peripheral objects such as LCD panel size and ground plane size associated with host device 1505. Such objects can make it difficult or unstable to optimize the performance of multiple antennas, including impedance matching and radiation efficiency. 15B illustrates one embodiment of a plurality of antenna structures integrated into the USB dongle device 1501 to overcome optimization problems created by surrounding objects.

In FIG. 15B, the USB dongle device 1501 has an RF input to each of the first antenna 1525 and the second antenna 1527, the first antenna source 1531, the first antenna 1525, and the second antenna 1527. Ground plane 1523 via a second antenna source 1533, a ground plane 1523 connected to the first antenna source 1531 and the second antenna source 1533, and an electrical component 1529 used to supply signals. A metal plate 1521 coupled to the metal plate 1521, which is also connected to the USB male connector 1507.

In operation, ground plane 1523 is configured to provide ground to host device 1505 connected to USB male connector 1507 via metal plate 1521 and two antennas 1525 and 1527. However, peripheral objects associated with the computer 1505 may interfere with and reduce the performance of both antennas at certain frequencies. Thus, isolating the two antennas 1525 and 1527 from peripheral objects associated with the computer 1505 at certain frequencies may be beneficial with respect to antenna performance. For example, in order to connect the metal plate 1521 to the ground plane 1523 and to isolate the metal plate 1521 from the two antennas 1525 and 1527 at certain frequencies, the electrical component 1529 is a frequency dependent connector such as an inductor. May be replaced by In DC operation, for example, the inductor may act as a low impedance component that allows for DC current. When the USB dongle device 1501 is plugged into the USB slot 1503 of the host device 1505 through the USB connector 1507, DC and low frequency signals are received from the USB dongle from the host device 1505 through the metal plate 1521. It may be supplied to device 1501 and supplied to all circuits fabricated on ground plane 1523 of USB dongle device 1501.

At high frequencies or microwave frequencies, for example, an inductor may act as a high impedance component that can block the movement of RF current. For example, RF interference caused by an LCD panel or a large ground plane associated with the host device 1505 at two antennas 1525 and 1527 in the USB dongle device 1501 may be prevented by the inductor 1529. Thus, a frequency dependent connector may be used to effectively isolate the ground plane from both antennas to maintain or improve the performance of multiple antennas used in USB dongle applications.

Other signals transmitted between the host device 1505 and the USB dongle device 1501 may include digital signals. However, these signals typically do not require or use ground plane 1523. Thus, isolating ground plane 1523 from host device 1505 may not affect transmitted digital signals.

One embodiment of a wireless device that supports an MTM antenna and uses one or more frequency dependent structures to isolate specific circuit elements from the MTM antenna includes: device enclosure; A substrate structure positioned within the device enclosure and having a first surface and a second surface different from the first surface; A ground electrode supported by the substrate structure; A first metal plate supported by the first surface of the substrate structure; An electrical component coupled to a first metal plate and a ground electrode, the RF frequency source determining an impedance associated with the electrical component; A second metal plate supported by a second surface of the substrate structure; Some vias formed in the substrate structure for connecting the first metal plate to the second metal plate; Some electrically conductive portions supported by the substrate structure, wherein the ground electrode, at least a portion of the substrate structure, and the electrically conductive portions exhibit composite right and left handed (CRLH) meta, indicating one or more frequency resonances associated with the antenna signal. It is configured to form a material antenna structure.

16A-16D illustrate isolation techniques and structures for improving the performance of an MTM antenna used in a small handheld wireless device 1600 where other circuit elements are in close proximity to the MTM antenna. The small handheld device 1600 may be configured as a multi-band device capable of supporting two frequency ranges, 880 MHz to 960 MHz, and 1710 MHz to 1880 MHz.

16A shows a side view of a small handheld wireless device 1600. The handheld wireless device 1600 may include a top layer 1601 and a bottom layer 1602 formed on each side of the substrate 1653 shown in FIG. 16A. Front views of the top layer 1601 and the bottom layer 1602 are shown in FIGS. 16B and 16C, respectively.

16B shows structural elements of top layer 1601 of wireless device 1600. These structural elements include a top ground plane 1615, a top metal plate 1605 connected to the top ground plane 1615 by an electrical component 1607, and an MTM antenna 1651 adjacent the metal plate 1605.

16C illustrates structural elements of the bottom layer 1602 of the wireless device 1600. These structural elements include a bottom ground plane 1633; Bottom metal plate 1631; Via lines 1621 for connecting the MTM antenna 1651 on the top layer 1601 to the bottom ground plane 1633; A pair of vias 1635 for connecting bottom metal plate 1631 to top metal plate 1605; And some key domes 1603 that are designed to connect phone keys to the PCB. Because the key domes 1603 follow the same layout as the phone keys, the key domes 1603 are the bottom ground plane 1633, the bottom metal plate 1631, and other substrates shown in FIG. 16C such as the exposed substrate. The structures may overlap.

Top ground plane 1615 and bottom ground plane 1633 may be connected to form a single ground plane by using an array of vias (not shown) formed in the substrate or by conductive lines formed along the right edge of the substrate. have. As shown in FIGS. 16B-16C, a ground plane including both the top ground plane and the bottom ground planes 1615, 1633 is connected to the MTM antenna 1651, and the top metal plate and the bottom metal plate 1605, 1631. Is shared by

Due to the compactness of the handle-held device 1600, the key domes 1603 and surrounding objects such as the top metal plate and bottom metal plate 1605, 1631 are adjacent to the MTM antenna 1651 and the MTM antenna May interfere with performance. Thus, during operation, these objects may interfere with or reduce the performance of the MTM antenna 1651 at certain frequencies. Thus, isolating the MTM antenna 1651 from the top metal plate and bottom metal plates 1605 and 1631 may be of particular interest in certain antenna performance indicators. In particular, the top metal plate 1605 and bottom metal plate 1631 match impedance without RF interference due to the proximity of the bottom ground plane 1633 used by the key domes 1603 and the DC power traces. And top ground plane 1615 and bottom ground plane 1633, respectively, to maintain antenna performance such as radiation efficiency. For example, to connect top metal plate 1605 to ground plane 1615 and to isolate top metal plate 1605 including bottom metal plate 1631 from MTM antenna 1651 at certain frequencies, electrical component 1607. ) May be replaced by a frequency dependent connector such as an inductor. At DC frequency, the inductor may act as a low impedance component that allows for DC current. Thus, a DC bias may be supplied through the inductor to the top and bottom metal plates 1605 and 1631 so that the key domes 1603 can function properly.

At the RF frequency, the inductor provides high impedance to isolate top metal plate and bottom metal plate 1605, 1631 from top ground plane and bottom ground plane 1615, 1633, respectively. In other words, the top metal plate and bottom metal plate 1605, 1631 may appear as two separate metal plates instead of a single ground plane, thus sufficient current flow or interference that may reduce the performance of the MTM antenna 1651. Lack of this.

16D shows a front view of two stacked layers, top layer 1601 and bottom layer 1602 associated with wireless device 1600.

FIG. 17 shows an MTM antenna as a function of signal frequency between the top metal plate 1605 directly connected to the ground plane and the top metal plate 1605 connected to the ground plane via an inductor and a frequency dependent connector 1607 as shown in FIG. 16D. Indicate a comparison of the measured return loss of 1165. In FIG. 17, the horizontal axis is the frequency of the signal transmitted through the MTM antenna 1651, and the vertical axis is the return loss expressed in dB of the signal. The comparison plot of the measured return loss of FIG. 17 shows that when the top metal plate 1605 is directly connected to the ground plane, the result is that the inductor is coupled between the top metal plate 1605 and the ground plane at most all frequencies. Results in a greater return loss than ever. In these figures, lower return loss numbers generally indicate better impedance matching from source to load, thus showing a better performance indicator achieved when the metal plate and ground plane are connected through an inductor instead of directly connected.

18A and 18B show a low frequency between a top metal plate 1605 directly connected to the ground plane and a top metal plate 1605 connected to the ground plane via a frequency dependent connector 1607 such as an inductor as shown in FIG. 16D. And a comparison of the radiating antenna efficiency of the MTM antenna 1651 over each of the high frequency ranges. The results in both figures show that the efficiency of the low frequency and high frequency range MTM antenna 1651 is higher when the top metal plate is connected to the ground plane through the inductor. Thus, as demonstrated in FIGS. 17 and 18A-18B, a frequency dependent connector, such as an inductor, isolates RF interference associated with the peripheral object draw from the MTM antenna 1651 and provides antenna performance indicators such as box loss or efficiency. It may be used in small integrated circuit designs to improve.

Other MTM antenna designs of the wireless device shown in FIGS. 16A-16D may include the planar antenna design 1901 shown in FIGS. 19A-19C. An isometric view of the planar MTM antenna 1901, a front view of the top layer, and a front view of the bottom layer are shown in FIGS. 19A-19C, respectively.

In the isometric view shown in FIG. 19A, the MTM antenna 1901 is located at the distal end of the substrate 1903. Top ground plane 1905 is formed on top layer 1902 and is formed adjacent to MTM antenna 1901. For clarity, a front view of the top layer 1902 is also provided in FIG. 19B to distinguish the MTM antenna 1901 from some overlapping structural elements shown in FIG. 19A. 19A and 19B, planar MTM antenna 1901 may include some conductive portions, such as cell patch 1931 formed on top layer 1902 of substrate 1901; A supply line 1933 capacitively coupled to the cell patch 1931 through the coupling gap 1941 to direct antenna signals to and from the cell patch 1931; It may also include a conductive helical portion 1935 attached to the supply line 1933 and formed on the top layer 1902 and bottom layer 1904 of the substrate 1903. The distal end of the supply line 1933 feed port 1911, which may communicate with an antenna circuit for generating and supplying an antenna signal to be transmitted to the outside via the antenna, or for receiving or processing the antenna signal received through the antenna. Is coupled to. Some vias 1937 are inserted in respective via holes to provide conductive connections between conductive portions in top layer 1902 and conductive portions in bottom layer 1904. In this example, conductive helical portion 1935 is attached to supply line 1933. Conductive helical portion 1935 includes top helical portion 1951, bottom helical portion 1953, and vias 1937 through substrate 1901. Both the top helical portion and the bottom helical portion 1951, 1953 are referenced in FIGS. 19B and 19C, respectively. A front view of the bottom layer 1904 is also provided in FIG. 19C to distinguish the antenna structure from some of the overlapping structural elements shown in FIG. 19A. In FIG. 19B, the top helical portion 1951 consists of individual segments formed within the top layer 1902.

Referring to FIG. 19C, the bottom spiral portion 1953 consists of another set of individual segments shown in the bottom layer 1904 shown; Vias 1937 are used to connect the top and bottom individual segments to form the vertical spiral shape shown in FIG. 19A. An additional conductive line attached to supply line 1933 can induce RH monopole resonance. Instead of the vertical spiral used in this example, meander lines, zigzag lines, or other types of lines or strips may be used. Alternatively, the supply line 1933 and the conductive spiral 1935 can be connected directly but with different total lengths. Via line 1909 is formed in bottom layer 1904 and is connected to bottom ground plane 1907. Via 1939 connects cell patch 1931 in top layer 1902 to via line 1909 of bottom layer 1904.

In operation, the performance of this planar MTM antenna 1901 in the wireless device 1600 is reduced when located in nearby objects such as a human body, thus degrading overall handheld device performance. Other isolation techniques and structures described in previous embodiments may be applied to this MTM antenna configuration to maintain antenna performance when the MTM antenna 1901 is adjacent to another conducting surface. For example, to remove or minimize interference from nearby sources, such as a human body or other external objects, the planar MTM antenna 1901 may be raised, and the metal plates may be flat MTM antenna 1901 to shield such interference. It may be added below. However, in cases where these metal plates are connected to the ground plane to support other circuit elements, these metal plates may interfere with or degrade the performance of the MTM antenna 1901. Therefore, controlling and isolating RF interference from the metal plate below the MTM antenna raised from the ground plane is important for antenna performance. An embodiment of an elevated MTM antenna using isolation techniques and structures is provided next.

20A-20D show multiple views of a wireless device 2000 having an elevated MTM antenna 2007 and a frequency dependent connection to a ground plane. Elevated antenna designs may be configured to improve antenna performance by forming an antenna across a plurality of surfaces and substrates.

Embodiments of a wireless device that supports raised MTM antennas and uses one or more frequency dependent structures to isolate certain circuit components from the raised MTM antennas include device enclosures; A first planar substrate having a first surface and a second surface different from the first surface; A ground plane supported by the first and second surfaces of the first planar substrate; A first metal plate supported by the first surface of the first planar substrate; A second metal plate supported by a second surface of the first planar substrate; Some vias formed in the first planar substrate for connecting the first metal plate and the second metal plate; An electrical component supported by a first surface of a first planar substrate for connecting the first metal plate to a ground plane, the electrical component for determining an impedance associated with the electrical component; An antenna section substantially parallel to the planar section of the device enclosure and configured to be proximate to the planar section of the device enclosure, the antenna section including a second planar substrate and at least one conductive portion associated with the second planar substrate; And a third planar substrate configured substantially parallel to the planar section of the device enclosure and proximate to the planar section of the device enclosure, wherein the at least one conductive portion is at least one frequency in the first antenna signal associated with the antenna section. It forms a CRLH metamaterial structure configured to support resonance.

20A shows an isometric view of a wireless device 2000 that supports an elevated MTM antenna and uses one or more frequency dependent structures to isolate certain circuit components from the elevated MTM antenna. The wireless device 2000 includes three substrates, a first substrate 2001, a second substrate 2003, and a third substrate 2005. These three substrates are configured such that the first substrate 2001 is the top layer, the third substrate 2005 is the bottom layer, and the second substrate 2003 is the first substrate 2001 and the third substrate ( 2005) may be stacked in the order in which they are configured. Various types of substrate materials may be used in the wireless device 2000 design shown in FIGS. 20A-20D. For example, FR-4 material may be used for the first substrate 2001 and the third substrate 2005 while air may be used for the second substrate 2003.

The wireless device 2000 includes an elevated MTM antenna 2007 fabricated on the first substrate 2001 shown in FIG. 20A. 20B and 20C show front views of the top and bottom layers, respectively, of the elevated MTM antenna 2007 to distinguish the antenna from some of the other overlapping structural elements shown in FIG. 20A. 20B and 20C, the elevated MTM antenna 2007 directs antenna signals from and to cell patch 2051 and cell patch 2051 formed on the top layer of the first substrate 2001. Conductive lines attached to the supply lines 2053, supply lines 2053, which are capacitively coupled to the cell patch 2051 through coupling gaps 2055, and formed on the top and bottom layers of the first substrate 2001 for coupling. It may also include some conductive portions, such as helical portion 2057. The distal end of the supply line 2053 is shown in FIGS. 20A and 20D by a conductive line 2071 connecting the supply line 2053 to the antenna input port 2009 and a via 2059 penetrating through the first substrate 2001. To the antenna input port 2009. Supply line 2053 may communicate with an antenna circuit that generates and supplies an antenna signal to be transmitted to the outside via the antenna or receives and processes the antenna signal received through the antenna. Referring again to FIGS. 20B and 20C, some vias 2061 are formed in individual via holes to provide conductive connections between conductive portions in the bottom layer of the first substrate 2001 and conductive portions in the top layer. Is inserted. In this example, conductive helical portion 2057 is attached to supply line 2053. The conductive helical portion 2057 includes a top helical portion, a bottom helical portion, and vias 2061 penetrating the first substrate 2001. The top helical portion consists of individual segments formed in the top layer; The bottom helical portion consists of another set of individual segments formed in the bottom layer; Vias 2061 are used to connect the top individual segments and the bottom individual segments to form a vertical spiral shape. Additional conductive line attached to supply line 2053 may induce RH monopole resonance. Instead of the vertical spiral used in this example, a meander line, a zigzag line or other types of lines or strips may be used. Alternatively, supply line 2053 and conductive spiral portion 2057 may be directly connected but have different total lengths. Referring to FIG. 20C, long via lines 2063 are formed in the bottom layer of the first substrate 2001 and connected to the short via lines 2067 shown in FIG. 20B, the short via lines 2067 being the vias 2069. ) Is formed on the uppermost layer of the first substrate 2001. Short via line 2067 is connected to top ground plane 2013 by a vertical strip of metal 2073 extending along the vertical side of first substrate 2001 and second substrate 2003. Via 2065 connects cell patch 2051 of the top layer to via line 2063 of the bottom layer of first substrate 2001.

Additional structural elements shown in FIG. 20A include a ground plane formed on both sides of the third substrate 2005. The ground plane comprises two conductive planes, the top ground plane 2013 and the bottom ground plane 2023, by using an array of vias (not shown) formed in the third substrate 2005 or It may be connected by conductive lines formed along the vertical edge of the third substrate 2005. The antenna via line 201 may be connected to the top ground plane 2013 through a via line 2011 extending along vertical sides of the first substrate 2001 and the second substrate 2004. By terminating via line 2011 to top ground plane 2013, MTM antenna 2007 may use the entire ground plane 2013 as part of a radiator to increase efficiency. Top and bottom metal plates 2015 and 2017 have the same footprint as the first substrate 2001 and are added to both sides of the third substrate 2005. The two metal plates 2015, 2017 are connected by several vias 2019.

In operation, the top and bottom metal plates 2015, 2017 of the wireless device 2000 shown in FIGS. 20A, 20D, and 20E can act as shielding, and thus from the bottom side of the third substrate 2005. Minimize the effects of the human effect. While these metal plates 2015, 2017 can provide sufficient shielding for the elevated MTM antenna 2007, integrating other RF circuits within the metal plates 2015, 2017 is an additional feature on the wireless device 2000. Space can be saved. During DC operation, a DC current can be supplied to the metal plates 2015 and 2017 to support the RF circuits. However, in high RF operation, there may be undesirable interactions between these RF circuits and the elevated MTM antenna 2007 to reduce the performance of the antenna. Thus, isolating the elevated MTM antenna 2007 from the metal plates 2015, 2017 at a particular frequency may be of particular interest and benefit in antenna performance.

In FIG. 20E, an electrical component 2021 having frequency dependent characteristics, such as, for example, an inductor, isolates the top metal plate 2015 from the elevated MTM antenna 2007 at certain frequencies, including the bottom metal plate 2017. May be coupled between top metal plate 2015 and bottom ground plane 2023. In DC operation, for example, inductor 2021 is a low impedance component that allows DC current from integrated circuits formed on metal plates 2015, 2017 to be delivered to other circuit components in wireless device 2000 without distortion. Can act as However, at high or microwave frequencies, the inductor 2021 prevents RF current from flowing into the metal plates 2015 and 2017 such that interference associated with the metal plates 2015 and 2017 may cause MTM antenna performance during high frequency operation. It can act as a high-impedance component that can prevent it from affecting.

FIG. 21 shows a graph of the return loss of a planar MTM antenna as shown in FIGS. 19A-19C compared to the return loss of the raised MTM antenna used in the wireless device 2000 shown in FIGS. 20A-20E. Return loss is expressed in dB as a function of transmission efficiency. The results indicated in FIG. 21 show that in some embodiments the elevated MTM antenna 2007 has a similar impedance match to the planar MTM antenna 1901 at a particular frequency. Thus, the elevated MTM antenna 2007 of FIG. 20 provides similar impedance matching in comparison with the planar MTM antenna shown in FIG. 19, while providing the advantage of providing adequate shielding through the use of metal plates 2015, 2017. Calculate the results

22 and 23 show radiation efficiencies for elevated MTM antennas and planar MTM antennas for low and high band frequencies, respectively. In FIG. 22, the elevated MTM antenna exhibits more efficient antenna efficiency in the low band than the planar MTM antenna. In Figure 23, both the planar MTM antenna and the raised MTM antenna exhibit similar antenna efficiencies in the high band. Thus, the raised MTM antenna 2007 of FIG. 20 provides the advantage of providing adequate shielding through the use of metal plates 2015 and 2017, while better or similar to the planar MTM antenna shown in FIG. 19. Calculate efficiency results.

Figures 24 and 25 show various frequencies comparing the raised MTM antenna and the planar MTM antenna for radiation performance testing involving the human head application, such as the left and right sides of the human head phantom. The antenna efficiencies for the ranges are shown. In contrast, the figures show that a raised MTM antenna has a better antenna efficiency than a planar MTM antenna in human head applications. These results also support the efficiency of metal plates employed in applications involving proximity effects caused by the human body.

Embodiments of a wireless device having a plurality of cell patch structures and supporting a planar MTM antenna using one or more frequency dependent structures to isolate specific circuit components from an elevated MTM antenna include: device enclosure; A substrate structure disposed within the device enclosure and having a first surface and a second surface different from the first surface; A ground electrode supported by the first and second surfaces of the substrate structure; A first metal plate and a second metal plate supported by the first surface of the substrate structure; A first electrical component, wherein the RF frequency source determines an impedance associated with the first electrical component as a first electrical component for connecting the first metal plate to a ground electrode; A second electrical component for connecting the second metal plate to the ground electrode, the second electrical component determining an impedance associated with the second electrical component; And some electrically conductive portions supported by the substrate structure, wherein the ground electrode, at least a portion of the substrate structure, and the electrically conductive portions are configured to form a CRLH metamaterial antenna structure exhibiting one or more frequency resonances associated with the antenna signal. .

26A, 26B, 26C are isometric views of an embodiment of a planar MTM antenna having a plurality of cell patch structures used in a wireless device 2600 having a frequency dependent connection to a ground plane, top layer 2600-1. A front view and a front view of the bottom layer 2600-2 are respectively shown.

Referring to the isometric and top layer 2600-1 of FIG. 26B, the MTM antenna 2601 includes a launch pad 2603 connected to a supply line 2602, a proximal end of the supply line 2602; Meander structure 2605 connected to supply line, cell patch 2607 capacitively coupled to distal end of supply line 2602, and cell patch on top ground plane 2610 printed on top of substrate 2611 It may include via lines 2609 used to connect 2607. In this example, cell patch 2607 includes two sections separated by cut slots 2608. Substrate 2611 may be formed of a PCB material such as, for example, FR-4 having a dielectric constant of 4.4 and a height of 1 mm. An antenna input 2625 formed at the distal end of the hop stand 2603 is used to feed RF input signals to the MTM antenna structure 2601.

Referring to the isometric view of FIG. 26A and the bottom layer 2600-2 of FIG. 26C, two metal plates 2613 and 2615 are formed below the substrate 2611. The two metal plates 2613, 2615 are connected to the bottom ground plane 2615 through each of a pair of electrical components, such as two inductors 2621, 2621. Top ground plane 2610 is connected to bottom ground plane 2617 by an array of vias (not shown) through substrate 2611 to form a single ground plane on both sides of substrate 2611.

In operation, at the DC frequency, the DC current can be supplied to other components formed on the metal plates 2613, 2615 through two inductors 2621, 2621.

At RF frequency, both inductors work like high impedance components that can reduce negative effects on antenna performance. In addition, the metal plates 2613 and 2615 may provide shielding to the MTM antenna 2601 which may improve antenna performance when the antenna is located near peripheral objects such as a human body. Additionally, these metal plates 2613 and 2615 can reduce antenna radiation on the bottom side of the substrate 2611, which can improve antenna performance associated with SAR measurements. An L-shaped cut out area 2623 on the metal plate 2615 may be used for this application to aid in the radiation efficiency and impedance matching of the monopole mode, which may be contributed by the springboard 2603. The width of the cut slot 2608 and the space between the metal plates 2613 and 2615 can be optimized to achieve improved impedance matching in the LH mode and the meander mode.

27 shows the return loss in dB of the planar MTM antenna 2601 used in the wireless device 2600 shown in FIGS. 26A-26C. The planar MTM antenna 2601 of FIG. 26 yields similar return loss results compared to the planar MTM antenna shown in FIG. 19, while providing the advantage of providing adequate shielding through the use of metal plates 2613 and 2615. .

28A and 28B show the radiation efficiency for the planar MTM antenna 2601 shown in FIGS. 26A-26C over a plurality of frequency ranges. The planar MTM antenna 2601 of FIG. 26 yields radiation efficiency results compared to the planar MTM antenna shown in FIG. 19, while providing the advantage of providing adequate shielding through the use of metal plates 2613 and 2615.

An embodiment of a wireless USB dongle device that uses one or more frequency dependent structures to support one or more non-planar MTM antennas and to isolate certain circuit components from an elevated MTM antenna, includes a device enclosure; A first planar substrate positioned within the device enclosure and having a first surface and a second surface different from the first surface; A ground plane formed on the first and second surfaces of the first planar substrate; A first metal plate formed on the first surface of the first planar substrate; A second metal plate formed on the second surface of the first planar substrate; Some vias formed in the first planar substrate for connecting the first metal plate and the second metal plate; An electrical component formed on a second surface of the first planar substrate for connecting the first metal plate to a ground plane, the electrical component for determining an impedance associated with the electrical component; A first antenna section configured to be substantially parallel to the device enclosure and close to the first planar section of the device enclosure, the first antenna section including a first planar substrate and at least one first conductive portion associated with the first planar substrate; A second antenna section configured to be substantially parallel to and close to the second planar section of the device enclosure, the second antenna section including a second planar substrate and at least one second conductive portion associated with the second planar substrate; A joint antenna section connecting the first antenna section and the second antenna section; A third antenna section configured substantially parallel to the device enclosure and proximate to the first planar section of the device enclosure, the third antenna section including a first planar substrate and at least one third conductive portion associated with the first planar substrate; A fourth antenna section substantially parallel to the device enclosure and configured to be close to the fourth planar section of the device enclosure, the fourth antenna section including a fourth planar substrate and at least one fourth conductive portion associated with the fourth planar substrate; And a joint antenna section connecting the third antenna section and the fourth antenna section, wherein the at least one first conductive portion and the at least one second conductive portion are associated with the first antenna section and the second antenna section. Forming a CRLH metamaterial structure configured to support at least one frequency resonance within the signal, wherein at least one third conductive portion and at least one fourth conductive portion are associated with a third antenna section and a fourth antenna section; Form a CRLH metamaterial structure configured to support at least one frequency resonance.

29A, 29B, 29C are top, bottom, and side views of a wireless USB dongle device 2900 with two non-planar, L-type MTM antennas 2907, 2905 having a frequency dependent connection to the ground plane. Show each of them. The USB dongle device 2900 includes a USB connector 2901 that can be connected to a USB port of a host device, such as a laptop or other device (not shown). The USB dongle device 2900 may include two antennas, namely, a first antenna 2907 and a second antenna 2905. The first antenna 2907 is formed at the distal end of the USB dongle device 2900, and the second antenna 2905 is formed at the side edge adjacent to the USB connector 2901.

In FIG. 29A, the USB dongle device 2900 consists of three substrates, namely, a first substrate 2907, a second substrate 2909, and a third substrate 2911. The first substrate 2907 and the second substrate 2909 are mounted perpendicular to the third substrate 2911, respectively. Elements of the first antenna 2907 are made on the first substrate 2907 and the third substrate 2911. Elements of the second antenna 2905 are made on the second substrate 2909 and the third substrate 2911. Making portions of the first antenna elements 2903 and the second antenna elements 2905 on a plurality of substrates, such as the first substrate 2907 and the second substrate 2909, can be used for third components for mounting other components. Space on the substrate can be saved.

Referring back to FIG. 29A, the non-planar, L-shaped MTM antennas 2905 and 2905 are each polygonal in shape and extend from the third substrate 2911 to the respective vertical substrates 2907 and 2909. 2953) each. A supply line 2957 associated with the first antenna 2903 is also formed on the third substrate 2911 and is electromagnetically coupled to the cell patch 2953 through the coupling gap 2971. Supply line 2955 associated with second antenna 2905 is formed on second substrate 2909 and extends to third substrate 2911 and is electromagnetically coupled to cell patch 2951 through coupling gap 2973. . A midder line may be added to the supply line at each of the two antennas to induce monopole mode.

29A and 29B, the top via line 2959 associated with the second antenna 2905 is formed on the second substrate 2909. The top via line 2959 is connected to the via 2963 and the cell patch 2951 formed on the third substrate 2911. Via 2963 is connected to bottom via line 2917 shown in FIG. 29B which is connected to bottom ground 2919. Thus, cell patch 2951 of second antenna 2905 is coupled to bottom ground 2919 through top via line 2959, via 2963, and bottom via line 2917. The top via line 2961 associated with the first antenna 2907 is formed on the first substrate 2907. Top via line 2961 is connected to via 2965 and cell patch 2953 formed in third substrate 2911. Via 2965 is connected to bottom via line 2916, shown in FIG. 29B, connected to bottom ground 2919. Thus, cell patch 2953 of first antenna 2907 is coupled to bottom ground 2919 through top via line 2901, via 2965, and bottom via line 2916.

In FIG. 29B, bottom ground 2919 is formed by using an array of vias (not shown) formed in third substrate 2911 or vertical edge of third substrate 2911 to form a single ground plane. It may be connected to the top ground plane 2915 by conductive lines formed along. Via lines 2917 of both first antenna 2907 and second antenna 2905 are terminated on bottom ground plane 2919 of third substrate 2911 to maximize antenna efficiency.

Improved performance indicators for the USB connector 2901 when connected to a USB port of a host device (not shown) may be used for a USB dongle device 2900 including two antennas 2907 and 2905 and other RF and baseband circuits. It may be achieved when the ground plane is isolated from the host device. Isolating the ground plane comprises two small metal plates, a top metal plate 2921, and a bottom metal plate 2913, respectively, with top ground planes and bottom ground planes 2915 and 2919 shown in FIGS. 29A-29B. It may also be accomplished by running around a USB dongle connector 2901 that is separate from it. In addition to the improved performance indicators, the antenna performance of the USB dongle device 2900 may be made independent of the host device connected to the USB dongle device 2900 using such isolation techniques.

Since power for the USB dongle device 2900 is typically supplied by the host device, a DC connection from the USB connector 2901 to other components fabricated on the third substrate may be required. In the illustrated embodiment, to support DC bias conducted from the host device to the USB connector 2901, an electrical component such as the inductor 2925 may be mounted between the top metal plate 2921 and the top ground plane 2915. It may be. Top metal plate 2921 and bottom metal plate 2913 are also connected to each other via vias 2913. The shape and size of the top metal plate and bottom metal plate 2921 can be optimized to achieve optimal antenna matching, antenna efficiency, and antenna far-field correlation with the two antennas 2907 and 2909. .

FIG. 30 shows measured return loss and isolation between antenna 1 and antenna 2 of FIGS. 29A-29C, showing that both antennas operate in the frequency range of 740 MHz to 900 MHz and 1850 MHz to 1990 MHz.

31 and 32 show the measured antenna efficiencies of antenna 1 and antenna 2 in the low band and the high band, respectively.

Isolated grounding techniques and the associated structures described in this document provide antenna configurations that represent non-MTM antenna designs, planar MTM antenna designs, multilayer MTM antenna designs, and non-planar MTM antenna designs, described above. present. Other isolated grounding techniques may be implemented in the antenna configurations described above involving different types of electrical components that act as frequency dependent connectors. For example, although cited examples of electrical components included the use of inductors, other components may include capacitors or other passive components such as a combination of capacitors and inductors. For example, when a capacitor is attached between the ground plane and the metal plate, high frequency signals can propagate between circuits mounted to the ground plane and the metal plate. Due to the high impedance provided by the capacitor, the DC and low frequency signals are blocked at both ends of the capacitor. Thus, the design of the antenna and other RF circuits may be changed based on the use of capacitors as frequency dependent connectors.

Other embodiments of frequency dependent connectors may include a plurality of passive components, such as inductors and capacitors, used in combination to connect the ground plane and the metal plate. For example, in one embodiment, the metal plate may be connected to one end of the inductor, and the other end of the inductor is connected to one end of the capacitor. The other end of the capacitor can then be connected to a ground plane that forms an L-C circuit. In this case, DC and high frequency signals cannot pass through this L-C circuit, only intermediate frequency signals can propagate between circuits mounted on the ground plane and the metal plate. Based on different applications where different frequency signals need to propagate between the ground plane and the metal plate, different configurations of passive components may be implemented, and the antenna and other RF circuits may change accordingly.

Additionally, electrical components in these examples may include active components such as RF switches, time dependent switches, and pin diodes. However, additional control circuits may need to be able to determine the on and off states of these active devices according to a dependent factor such as frequency, time or voltage threshold. For example, in one embodiment of a device that uses an active component connected to ground, the RF switch can be turned on in a second frequency state to transmit RF signals from circuitry on the ground plane to circuitry on the metal plate. In other frequency states, the RF switch may be turned off to prevent the RF signal from propagating to the metal plate, which may reduce the SAR level of the antenna device.

Although the specification includes many specific examples, these should not be construed as limitations on the claims or the scope of any invention, but rather should be regarded as a description of features inherent in certain embodiments. Any features described herein in the context of separate embodiments can also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may be implemented in multiple embodiments individually or in any particular subcombination. In addition, the features described above as functioning in a particular combination may in some cases be implemented for a combination, and the claimed combination relates to a subcombination or to variations of the subcombination.

Specific embodiments have been described herein. Modifications and improvements of the embodiments can be made based on the embodiments described above and other described and illustrated herein.

Claims (49)

One or more substrates;
One or more metallization layers supported by the one or more substrates;
A ground electrode formed on one of the one or more metallization layers;
One or more metal plates formed in at least one of the one or more metallization layers;
A plurality of conductive portions formed in at least one of the one or more metallization layers; And
At least one electrical component, each comprising the electrical component electrically coupled to the at least one metal plate and the ground electrode,
The impedance associated with the one or more electrical components is determinable from an external RF frequency source. The method of claim 1,
And a plurality of integrated components are formed in at least one housing of the one or more metal plates. The method of claim 2,
And the plurality of integrated components comprises a plurality of key domes. The method of claim 2,
And the plurality of integrated components comprises a microphone. The method of claim 2,
The at least one electrical component is an active electrical component. The method of claim 2,
The at least one electrical component is a passive electrical component. The method according to claim 6,
And the at least one electrical component is an inductor. The method of claim 1,
Each of the one or more substrates is comprised of a dielectric material having a first surface and a second surface,
And the plurality of conductive portions are patterned onto the one or more metal layers formed on at least one of the first and second surfaces. 9. The method of claim 8,
The first substrate is substantially parallel to the first planar section of the enclosed structure and proximate the first planar section and comprises a first conductive portion,
A second substrate configured differently from the first substrate, substantially parallel to the second planar section of the enclosed structure, proximate the second planar section, and including a second conductive portion;
A joint section couples the first substrate and the second substrate. The composite left and right handed (CRLH) meta of claim 8, wherein the plurality of conductive portions and at least a portion of the first and second substrates represent a plurality of frequency resonances associated with an antenna signal. And configured to form a material structure. 10. The method of claim 9,
And the plurality of conductive portions and at least portions of the first substrate and the second substrate are configured to form a CRLH metamaterial structure representing a plurality of frequency resonances associated with the antenna signal. The method of claim 10,
The plurality of conductive portions,
Cell patch;
A supply line having a distal end proximate to the cell patch, the feed line being capacitively coupled to the cell patch and coupled to a supply port for directing the antenna signal to and from the cell patch a feed line having a proximal end; And
A via line coupling the cell patch to ground. The method of claim 12,
And the distal end portion of the supply line forms a launch pad to change the capacitive coupling. The method of claim 12,
And the supply line comprises a conductive line attachment. 15. The method of claim 14,
Wherein the conductive line attachment is configured to have a meander line form, a planar spiral form, a zigzag line form, a vertical spiral form, or a combination of different forms. 9. The method of claim 8,
The plurality of conductive portions,
A cell patch formed on the first metallization layer;
A supply line having a distal end proximate the cell patch, the supply line having a proximal end capacitively coupled to the cell patch and coupled to a supply port for directing the antenna signal to and from the cell patch; The supply line;
A via line formed in the second metallization layer and coupled to ground; And
And a via formed between the first metallization layer and the second metallization layer and coupling the cell patch and the via line. The method of claim 1,
The plurality of conductive portions,
A plurality of cell patches;
Coupled to a supply port proximate to and capacitively coupled to one or more cell patches of the plurality of cell patches and to direct an antenna signal to or from the cell patch of the plurality of cell patches. A supply line having a proximal end; And
And a plurality of via lines coupling each of the plurality of cell patches to the ground electrode. Device enclosure;
A substrate structure located within the device enclosure and having a first surface and a second surface;
A ground electrode supported by the substrate structure;
A first metal plate supported by the first surface of the substrate structure;
An electrical component connected to the first metal plate and the ground electrode, the electrical component determining an impedance with which an RF frequency source is associated with the electrical component;
A second metal plate supported by the second surface of the substrate structure;
A plurality of vias formed in the substrate structure for connecting the first metal plate to the second metal plate; And
A plurality of electrically conductive portions supported by the substrate structure,
And the ground electrode, at least a portion of the substrate structure, and the plurality of electrically conductive portions are configured to form a CRLH metamaterial antenna structure exhibiting one or more frequency resonances associated with an antenna signal. 19. The method of claim 18,
The plurality of conductive portions,
Cell patches;
A supply line proximate to the cell patch and having a capacitively coupled end and a proximal end coupled to a supply port for directing the antenna signal to and from the cell patch; And
And a via line coupling the cell patch to ground. 20. The method of claim 19,
The electrical component is comprised of a passive electrical component or an active electrical component. 21. The method of claim 20,
And the passive electrical component consists of an inductor. Device enclosure;
A first planar substrate having a first surface and a second surface different from the first surface;
A ground plane supported by the first and second surfaces of the first planar substrate;
A first metal plate supported by the first surface of the first planar substrate;
A second metal plate supported by the second surface of the first planar substrate;
A plurality of vias formed in the first planar substrate to connect the first metal plate and the second metal plate;
An electrical component supported by a first surface of the first planar substrate for connecting the metal plate to the ground plane, wherein the RF frequency source determines an impedance associated with the electrical component;
An antenna section configured to be substantially parallel to and in close proximity to the planar section of the device enclosure, the antenna section comprising a second planar substrate and at least one conductive portion associated with the second planar substrate; And
A third planar substrate configured to be substantially parallel to and in proximity to the planar section of the device enclosure,
Wherein the at least one conductive portion forms a CRLH metamaterial structure configured to support at least one resonance in a first antenna signal associated with the antenna section. The method of claim 22,
The at least one conductive portion,
Cell patches;
A supply line having a distal end proximate and capacitively coupled to the cell patch and a proximal end coupled to the cell patch and to a supply port for directing an antenna signal from the cell patch; And
And a via line coupling the cell patch to ground. 24. The method of claim 23,
And the via line extends along an edge of the second planar substrate and the third planar substrate. The method of claim 22,
And the third planar substrate is comprised of air. The method of claim 22,
The electrical component consists of a passive electrical component or an active electrical component. The method of claim 26,
And the passive electrical component consists of an inductor. Device enclosure;
A substrate structure positioned within the device enclosure and having a first surface and a second surface different from the first surface;
A ground electrode supported by the first and second surfaces of the substrate structure;
A first metal plate and a second metal plate supported by the first surface of the ground electrode;
A first electrical component for connecting the first metal plate to the ground electrode, the RF frequency source determining an impedance associated with the first electrical component;
A second electrical component for connecting the second metal plate to the ground electrode, the RF frequency source determining an impedance associated with the second electrical component; And
A plurality of electrically conductive portions supported by the substrate structure,
And the ground electrode, at least a portion of the substrate structure, and the plurality of electrically conductive portions are configured to form a CRLH metamaterial antenna structure exhibiting one or more frequency resonances associated with an antenna signal. 29. The method of claim 28,
The plurality of electrically conductive portions,
Cell patches;
A supply line having a distal end proximate and capacitively coupled to the cell patch and a proximal end coupled to the cell patch and to a supply port for directing an antenna signal from the cell patch; And
A via line coupling the cell patch to the ground electrode. 30. The method of claim 29,
The cell patch,
A first cell plate coupled to the via line and projected onto the first metal plate; And
And a second cell plate adjacent to the first cell plate and projected onto the second metal plate. 31. The method of claim 30,
And the first cell plate and the second cell plate are separated by slots. 31. The method of claim 30,
One corner of the second metal plate is configured to have an L-shaped cutout. Device enclosure;
A first planar substrate having a first surface and a second surface different from the first surface and located within the device enclosure;
A ground plane formed on the first surface and the second surface of the first planar substrate;
A first metal plate formed on the first surface of the first planar substrate;
A second metal plate formed on the second surface of the first planar substrate;
A plurality of vias formed in the first planar substrate for connecting the first metal plate and the second metal plate;
An electrical component formed on a first surface of the first planar substrate for connecting the first metal plate to the ground plane, the impedance associated with the electrical component being determinable by an external RF frequency source;
A first antenna section configured substantially parallel to and in close proximity to the first planar section of the device enclosure, the first planar substrate and at least one first conductivity associated with the first planar substrate The first antenna section comprising a portion;
A second antenna section substantially parallel to the second planar section of the device enclosure and configured to be proximate to the second planar section, the second planar substrate and at least one second conductive portion associated with the second planar substrate A second antenna section comprising a;
A joint antenna section connecting the first antenna section and the second antenna section;
A third antenna section configured substantially parallel to the first planar section of the device enclosure and proximate to the first planar section, the first planar substrate and at least one third conductivity associated with the first planar substrate The third antenna section comprising a portion;
A fourth antenna section substantially parallel to the fourth planar section of the device enclosure and configured to be proximate to the fourth planar section, the fourth planar substrate and at least one fourth conductive portion associated with the fourth planar substrate A fourth antenna section comprising a; And
A joint antenna section connecting the third antenna section and the fourth antenna section,
The at least one first conductive portion and the at least one second conductive portion form a CRLH metamaterial structure configured to support at least one resonance in a first antenna signal associated with the first antenna section and the second antenna section; ,
The at least one third conductive portion and the at least one fourth conductive portion comprise another CRLH metamaterial structure configured to support at least one resonance in a second antenna signal associated with the third antenna section and the fourth antenna section. Forming a wireless device. 34. The method of claim 33,
The at least one conductive portion,
Cell patches;
A supply line having a distal end proximate and capacitively coupled to the cell patch and a proximal end coupled to a supply port for directing an antenna signal to and from the cell patch; And
And a via line coupling the cell patch to ground. 35. The method of claim 34,
And the device enclosure is comprised of a USB dongle. One or more antennas for transmitting or receiving one or more antenna signals at one or more RF antenna frequencies;
An antenna circuit, in communication with the one or more antennas, generating the one or more antenna signals for receiving by the one or more antennas or receiving one or more antenna signals from the one or more antennas;
A ground electrode structure, wherein the antenna circuit is connected to provide electrical ground for the antenna circuit and the one or more antennas;
An electrically conductive component spaced apart from the ground electrode structure without direct contact with the ground electrode structure; And
Connect the electrically conductive component to the ground electrode structure, create a low impedance to allow the transmission of a DC signal between the electrically conductive component and the ground electrode structure and between the at least one electrically conductive component and the ground electrode structure And a frequency dependent connector configured to generate high impedance at the one or more RF frequencies to block transmission of an antenna signal. 37. The method of claim 36,
Each antenna comprising a metamaterial structure. 37. The method of claim 36,
Each antenna comprising a CRLH metamaterial structure. 37. The method of claim 36,
And the frequency dependent connector comprises an inductor. 37. The method of claim 36,
And the frequency dependent connector comprises a transistor. 37. The method of claim 36,
And the frequency dependent connector comprises a diode. 37. The method of claim 36,
And the frequency dependent connector comprises a capacitor. 37. The method of claim 36,
An electrical unit coupled to the electrically conductive component and electrically isolated from the one or more antennas at the one or more RF antenna frequencies. 42. The method of claim 41,
And the electrical unit comprises one or more key domes. 42. The method of claim 41,
And the electrical unit comprises a microphone. 37. The method of claim 36,
And a metallization layer patterned to form the at least one antenna and the ground electrode structure. 37. The method of claim 36,
And a plurality of metallization layers patterned to form the at least one antenna and the ground electrode structure. 37. The method of claim 36,
And the ground electrode structure comprises a single ground electrode. 37. The method of claim 36,
And the ground electrode structure comprises two or more ground electrodes.

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