KR20120107903A - The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method - Google Patents

The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method Download PDF

Info

Publication number
KR20120107903A
KR20120107903A KR1020120100824A KR20120100824A KR20120107903A KR 20120107903 A KR20120107903 A KR 20120107903A KR 1020120100824 A KR1020120100824 A KR 1020120100824A KR 20120100824 A KR20120100824 A KR 20120100824A KR 20120107903 A KR20120107903 A KR 20120107903A
Authority
KR
South Korea
Prior art keywords
pva
embossing roller
cleaning
embossing
roller
Prior art date
Application number
KR1020120100824A
Other languages
Korean (ko)
Inventor
윤정혜
Original Assignee
윤정혜
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 윤정혜 filed Critical 윤정혜
Priority to KR1020120100824A priority Critical patent/KR20120107903A/en
Publication of KR20120107903A publication Critical patent/KR20120107903A/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning In General (AREA)

Abstract

PURPOSE: A PVA(Polyvinyl Acetate) embossing roller for cleaning a semiconductor and a manufacturing method thereof are provided to prevent fine dust from being reabsorbed on the surface of a PVA roller by eliminating a thin film formed on the surface of a protrusion which is generated in the formation process of the PVA embossing roller. CONSTITUTION: A PVA embossing roller is manufactured. A fixing shaft is inserted into a central part of the PVA embossing roller. The PVA embossing roller is fixed to a rotator of a metal processing shelf. A left and right operation part with a grinding stone moves to the front and back and the left and right. A ground PVA embossing roller is separated. [Reference numerals] (AA) Process of manufacturing a PVA embossing roller; (BB) Process of inserting a fixing shaft; (CC) Process of fixing a PVA embossing roller shelf; (DD) Grinding process; (EE) Separation process

Description

The PVA embossing roller to enhance the cleaning power of the semiconductor cleaning fV embossing roller and its manufacturing method

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a FV embossing roller and a method of manufacturing the same for increasing cleaning power of a PVA embossing roller for cleaning contaminants on a surface of a semiconductor wafer, a hard disk, and an LCD glass substrate manufacturing process.

In general, as semiconductor wafers, hard disks, and LCD glass substrates become finer, removal of impurities such as metal impurities, organic impurities, and natural oxide films has become an important process.

Since these impurities are important factors that determine the performance and lifespan of the semiconductor device, a cleaning process for removing impurities is required before each process for manufacturing a semiconductor wafer, a hard disk, and an LCD glass substrate.

In other words, before the semiconductor wafer, hard disk, and LCD glass substrates are processed, the surface of the semiconductor wafer, hard disk, and LCD glass substrates is cleaned using chemicals and water. The brush was then used to remove the chemicals and water on the surface.

On the other hand, in order to remove the impurities on the surface of the semiconductor wafer, hard disk, LCD glass substrate as described above, foreign substances were removed using a PVA embossing brush roller.

PVA embossing brush rollers that have been used in the past use a lot of sponge brushes of PVA material in order to effectively remove fine dust when cleaning the semiconductor wafer and hard disk. PVA embossing brush uses strong moisture absorbing power and soft material to clean the surface of sensitive high-tech materials without scratches, and it can remove various fine pollutants and fine dust.

However, since the PVA embossing brush rollers used in the related art depend entirely on imports, the waste of foreign currency was severe, and the consumption of the PVA embossing brush rollers increased the price of the wafer.

In order to solve the above problems, the present applicant has developed a LCD glass cleaning FV brush roller, a manufacturing method and a device thereof, and a semiconductor wafer cleaning FV embossing brush roller. .

However, the conventionally used FV embossing rollers require the development of more effective PVA embossing rollers as the technical environment becomes more advanced, and for this purpose, PVA embossing rollers having enhanced absorption and cleaning power are required. .

The PVA embossing roller used in the prior art inevitably has a problem in that a film is formed on the surface of the embossing during the manufacturing process and the washing power is lowered.

In more detail, the PVA embossing roller is manufactured through a foaming process through high heat, and thus, a film is naturally formed on the surface of each embossing during the foaming and molding process.

As described above, the film automatically formed in the foaming and molding process blocks the pores on the surface of the PVA embossing roller, thereby preventing the foreign matter from being cleaned.

Republic of Korea Patent No. 10-1118161 (announced March 12, 2012) Republic of Korea Patent Publication No. 10-2012-0085075 (published July 31, 2012)

The present invention is to solve the above problems, the purpose of the cleaning power of the PVA embossing roller, that is, to improve the water absorption and dust collecting ability.

An additional object of the present invention is to further improve the cleaning power of the inventors invented by the present inventors to achieve export to foreign countries.

Means for solving the above problems will be described as follows.

 PVA embossing roller manufacturing process for producing a PVA embossing roller;

A fixing shaft insertion step of inserting a fixing shaft into a central portion of the PVA embossing roller manufactured through the PVA embossing roller manufacturing process;

A PVA embossing roller fixing step of fixing the PVA embossing roller on which the fixing shaft is fixed to the rotating body of the lathe for processing metal through the fixing shaft insertion step;

 By rotating the rotating body to which the PVA embossing roller is fixed by the PVA embossing roller fixing process, the left and right operating holes on which the abrasive stone is fixed are operated front / back / left / right, and the embossed portion of the PVA embossing roller using an abrasive stone or abrasive knife. A polishing step of causing the embossed portion to be polished by contact;

When the polishing process is finished, the shelf is stopped and the fixed shaft fixed to the rotating body is separated, and then the separation process of separating the PVA embossing roller polished from the fixed shaft.

The present invention removes the thin film surrounding the surface of the projections generated during the molding process of the PVA embossing roller and is easy to manufacture due to the simple method and structure.

The present invention removes the thin film surrounding the surface of the projections generated during the molding process of the PVA embossing roller to open the pores of the sponge and the scrubber structure appears on the surface to increase the absorption of water when the wafer contacts the water pumping action is desired. It is a useful invention that prevents fine dust from re-adsorption on the surface of the PVA roller and the surface scrubber structure is opened to greatly improve the fine dust removal force on the wafer surface, thereby greatly improving the cleaning effect.

1 is a block diagram showing a manufacturing process of the present invention
2 is a schematic perspective view showing a PVA embossing roller of the present invention
3 is a schematic side view showing a PVA embossing roller of the present invention.
4 is a side cross-sectional view showing a state in which a fixed shaft is inserted and fixed to a PVA embossing roller as a manufacturing process diagram of the present invention.
5 is a side cross-sectional view showing a state in which the embossed portion is polished while the PVA embossing roller is in contact with the abrasive stone as a manufacturing process diagram of the present invention.
7 and 8 are enlarged views of an embossed portion of a PVA embossing roller of another company
9 is an enlarged view showing an enlarged embossing portion of the present invention PVA embossing roller.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In describing the present invention, when it is determined that the detailed description of the method for manufacturing the PVA embossing roller and related known functions or configurations may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

As shown in FIG. 1, the fixing shaft 4 is inserted into and fixed to the center portion of the PVA embossing roller 1 having the washing protrusion 2 protruding at regular intervals.

As described above, the PVA embossing roller 1 into which the fixed shaft 4 is inserted and fixed is bitten and fixed to the rotating body of the lathe, and also fixed to the front / rear / left / right operating device of the lathe by the abrasive stone 3.

When the rotary body is rotated by applying power to the shelf in the above state, the fixed shaft 4 fixed to the rotating body rotates together, and thus the PVA embossing roller 1 fixed to the rotating body rotates together. Done.

PVA embossing roller in which the abrasive stone (3) is rotated by operating on the front / rear / left / right / operation tool in which the abrasive stone (3) is fixed and installed on the lathe and operated in the above state. Access to (1).

When the abrasive stone 3 is brought into contact with the washing protrusion 2 protruding from the PVA embossing roller 1 in the above state, the washing protrusion is polished by the abrasive stone 3, respectively, as shown in FIG. 9. The film blocking the outside of the washing protrusion of the polishing is polished and disappears.

Therefore, as shown in FIG. 9, the microcavity generated by the foaming of the PVA embossing roller 1 is opened as shown in FIG. 9, and thus, the water and dust can be absorbed, thereby increasing the washing power to the maximum.

When the polishing process is finished, the shelf is stopped, the fixing rod 4 is separated from the rotating body, and then the PVA embossing roller 1 is separated from the fixing rod 4 again.

1. PVA embossing roller 2. Cleaning protrusion
3. Grinding Stone 4. Fixed Rod

Claims (3)

PVA embossing roller manufacturing process for producing a PVA embossing roller;
A fixing shaft insertion step of inserting a fixing shaft into a central portion of the PVA embossing roller manufactured through the PVA embossing roller manufacturing process;
A PVA embossing roller fixing step of fixing the PVA embossing roller on which the fixing shaft is fixed to the rotating body of the lathe for processing metal through the fixing shaft insertion step;
When the rotating body to which the PVA embossing roller is fixed is rotated by the PVA embossing roller fixing process, the left and right operating holes to which the abrasive stone is fixed are operated front / back / left / right and the embossed portion of the PVA embossing roller using the abrasive stone or abrasive knife. A polishing step of causing the embossed portion to be polished by contact;
When the polishing process is completed, the shelf is stopped, the fixed shaft fixed to the rotating body is separated, and then the separation process of separating the polished PVA embossing roller from the fixed shaft, characterized in that the cleaning process of the semiconductor PV embossing roller Manufacturing method of FV embossing roller to increase the washing power. FV embossing for increasing the cleaning force of the FV embossing roller for semiconductor cleaning, characterized in that the outside of the PVA embossing roller 1 with the washing protrusion 2 protruding from the outside is polished using abrasive stone 3. roller. The semiconductor cleaning fibrous embossing roller according to claim 2, wherein the coating film is removed by cutting the end of the protrusion 2 of the PVA embossing roller 1 having the cleaning protrusion 2 protruding therefrom. FV embossing roller to increase cleaning power.




KR1020120100824A 2012-09-12 2012-09-12 The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method KR20120107903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020120100824A KR20120107903A (en) 2012-09-12 2012-09-12 The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120100824A KR20120107903A (en) 2012-09-12 2012-09-12 The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method

Publications (1)

Publication Number Publication Date
KR20120107903A true KR20120107903A (en) 2012-10-04

Family

ID=47279709

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120100824A KR20120107903A (en) 2012-09-12 2012-09-12 The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method

Country Status (1)

Country Link
KR (1) KR20120107903A (en)

Similar Documents

Publication Publication Date Title
TWI616940B (en) Method for the polishing of a semiconductor wafer
CN106170847B (en) The manufacturing method of semiconductor wafer
JP4996888B2 (en) Method for producing a semiconductor wafer
Kim et al. Study of the cross contamination effect on post CMP in situ cleaning process
JP2010283371A5 (en)
CN102528597A (en) Manufacturing process of large-diameter silicon wafer
JP2013089720A5 (en)
TW201814782A (en) Method for polishing semiconductor wafer
CN103878148A (en) Method of cleaning silicon slags on surfaces of wafers
KR20120009425A (en) Scrubber clean before oxide chemical mechanical polish(cmp) for reduced microscratches and improved yields
CN110517951B (en) Cleaning method for improving micro-scratch of wafer before STI (shallow trench isolation) grinding
KR101060744B1 (en) Wafer processing method and wafer processing apparatus
KR20120107903A (en) The pva embossing roller to enhance a cleaning power of pva embossing roller for cleaning a semiconductor and thereof manufacturing method
JP6065802B2 (en) Polishing cloth cleaning method and wafer polishing method
JP6424809B2 (en) Double sided polishing method of wafer
SG142146A1 (en) Apparatus and methods to clean copper contamination on wafer edge
CN100537142C (en) Device and method for cleaning chemical and mechanical polishing equipment
JP2005263569A (en) Method for manufacturing synthetic quartz glass substrate for polysilicon tft
JP6330628B2 (en) Manufacturing method of glass substrate
TWI668755B (en) Method for polishing semiconductor wafer
CN201410642Y (en) Semiconductor grinding and cleaning device
CN102468125A (en) Method for cleaning wafer
KR20090112952A (en) Brush Assembly for Semiconductor Package Manufacturing Machine
Kim et al. Challenges in Post CMP in-situ cleaning for sub-14nm device yield enhancement
JP2009277811A (en) Washing machine

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application