KR20120103026A - Back light unit and liquid crystal display device using the same - Google Patents

Back light unit and liquid crystal display device using the same Download PDF

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Publication number
KR20120103026A
KR20120103026A KR1020110021010A KR20110021010A KR20120103026A KR 20120103026 A KR20120103026 A KR 20120103026A KR 1020110021010 A KR1020110021010 A KR 1020110021010A KR 20110021010 A KR20110021010 A KR 20110021010A KR 20120103026 A KR20120103026 A KR 20120103026A
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South Korea
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led
cover bottom
metal cover
mounting area
led mounting
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KR1020110021010A
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Korean (ko)
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염문수
어찬경
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엘지디스플레이 주식회사
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Priority to KR1020110021010A priority Critical patent/KR20120103026A/en
Publication of KR20120103026A publication Critical patent/KR20120103026A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133524—Light-guides, e.g. fibre-optic bundles, louvered or jalousie light-guides
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134363—Electrodes characterised by their geometrical arrangement for applying an electric field parallel to the substrate, i.e. in-plane switching [IPS]
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1343—Electrodes
    • G02F1/134309—Electrodes characterised by their geometrical arrangement
    • G02F1/134372—Electrodes characterised by their geometrical arrangement for fringe field switching [FFS] where the common electrode is not patterned
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1347—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells
    • G02F1/13471—Arrangement of liquid crystal layers or cells in which the final condition of one light beam is achieved by the addition of the effects of two or more layers or cells in which all the liquid crystal cells or layers remain transparent, e.g. FLC, ECB, DAP, HAN, TN, STN, SBE-LC cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
  • Liquid Crystal (AREA)

Abstract

PURPOSE: A backlight unit and a liquid crystal display device using the same are provided to directly transfer heat, which is generated from an LED(Light Emitting Diode) package, to a metal cover bottom, thereby enhancing heat emitting features. CONSTITUTION: A metal cover bottom(120) has an LED mounting area. The LED mounting area includes an insulated wire. An LED package is mounted in the LED mounting area of the metal cover bottom. The LED mounting area includes a first insulating layer, a wiring layer, and a second insulating layer. The wiring layer is formed on the first insulating layer. The second insulating layer is formed on the wiring layer.

Description

백라이트유닛과 이를 이용한 액정표시장치{Back Light Unit and Liquid Crystal Display Device using the same}Back light unit and liquid crystal display device using the same

본 발명의 실시예는 백라이트유닛과 이를 이용한 액정표시장치에 관한 것이다.An embodiment of the present invention relates to a backlight unit and a liquid crystal display device using the same.

정보화 기술이 발달함에 따라 사용자와 정보간의 연결 매체인 표시장치의 시장이 커지고 있다. 이에 따라, 액정 표시장치(Liquid Crystal Display: LCD), 유기전계 발광소자(Organic Light Emitting Diodes: OLED) 및 플라즈마 디스플레이 패널(Plasma Display Panel: PDP) 등과 같은 평판 표시장치(Flat Panel Display: FPD)의 사용이 증가하고 있다. 그 중 고해상도를 구현할 수 있고 소형화뿐만 아니라 대형화가 가능한 액정 표시장치가 널리 사용되고 있다.As the information technology is developed, the market of display devices, which is a connection medium between users and information, is getting larger. Accordingly, flat panel displays (FPDs) such as liquid crystal displays (LCDs), organic light emitting diodes (OLEDs), and plasma display panels (PDPs) may be used. Usage is increasing. Among them, a liquid crystal display capable of realizing high resolution and capable of miniaturization as well as a large size is widely used.

액정표시장치는 수광형 표시장치로 분류된다. 이러한 액정표시장치는 액정패널의 하부에 위치하는 백라이트유닛으로부터 광원을 제공받아 영상을 표현할 수 있다. 백라이트유닛은 액정패널에 효율적인 광을 제공하기 위해 광원 및 광학필름층 등을 포함할 수 있다. 여기서, 광학필름층은 확산시트, 프리즘시트, 보호시트 등을 포함할 수 있다.Liquid crystal displays are classified into light receiving displays. Such a liquid crystal display may display an image by receiving a light source from a backlight unit positioned under the liquid crystal panel. The backlight unit may include a light source and an optical film layer in order to provide efficient light to the liquid crystal panel. Here, the optical film layer may include a diffusion sheet, a prism sheet, a protective sheet and the like.

최근 백라이트유닛에 포함된 광원으로는 패키지로 구성되어 단위 광원을 이루는 점광원(Point Light Source)으로써 LED(발광다이오드)가 주로 사용된다. LED 패키지는 LED용 인쇄회로기판에 실장되어 방열기능을 갖는 써멀패드(Thermal pad)에 의해 커버버텀에 부착된다.Recently, as a light source included in a backlight unit, a light emitting diode (LED) is mainly used as a point light source configured as a package and forming a unit light source. The LED package is mounted on the printed circuit board for the LED and attached to the cover bottom by a thermal pad having a heat dissipation function.

그런데 종래 구조는 LED 패키지, LED용 인쇄회로기판, 써멀패드 및 커버버텀과 같이 많은 구성물이 요구되므로 조립불량 유발과 비용 상승 그리고 열 방출시 여러 단계를 거쳐야함에 따른 방열특성 저하 문제가 있어 이의 개선이 요구된다.
However, the conventional structure requires many components such as LED package, LED printed circuit board, thermal pad, and cover bottom, so there is a problem of causing poor assembly, increased cost, and deterioration of heat dissipation characteristics due to several steps in heat dissipation. Required.

상술한 배경기술의 문제점을 해결하기 위한 본 발명의 실시예는, 백라이트유닛의 구조 단순화를 통한 조립불량 방지와 더불어 방열특성을 향상시킬 수 있는 백라이트유닛과 이를 이용한 액정표시장치를 제공하는 것이다.
Embodiments of the present invention for solving the above problems of the background art, to provide a backlight unit and a liquid crystal display device using the same that can improve the heat dissipation characteristics as well as preventing assembly defects by simplifying the structure of the backlight unit.

상술한 과제 해결 수단으로 본 발명의 실시예는, 절연된 배선을 포함하는 LED 실장영역을 갖는 금속 커버버텀; 및 금속 커버버텀의 LED 실장영역에 실장된 LED 패키지를 포함하는 백라이트유닛을 제공한다.Embodiment of the present invention by the above-described problem solving means, the metal cover bottom having an LED mounting area including an insulated wiring; And it provides a backlight unit comprising an LED package mounted in the LED mounting area of the metal cover bottom.

LED 실장영역은 금속 커버버텀 상에 형성된 제1절연층과, 제1절연층 상에 형성된 배선층과, 배선층 상에 형성된 제2절연층을 포함할 수 있다.The LED mounting region may include a first insulating layer formed on the metal cover bottom, a wiring layer formed on the first insulating layer, and a second insulating layer formed on the wiring layer.

금속 커버버텀은 배면 및 배면과 수직 하는 측면을 포함하는 몸체부와, 배면 및 측면과 일체형으로 형성되며 측면의 양측 끝단이 내부를 향하여 구부러진 절곡부를 포함할 수 있다.The metal cover bottom may include a body portion including a rear surface and a side perpendicular to the rear surface, and a bent portion formed integrally with the rear surface and the side, and both ends of the side surface are bent toward the inside.

LED 패키지는 LED 실장영역에 적어도 하나가 실장되고, LED 실장영역은 절곡부에 형성될 수 있다.At least one LED package may be mounted in the LED mounting area, and the LED mounting area may be formed in the bent portion.

LED 패키지는 LED 실장영역에 적어도 하나가 실장되고, LED 실장영역은 몸체부와 절곡부에 형성될 수 있다.At least one LED package may be mounted in the LED mounting area, and the LED mounting area may be formed in the body part and the bent part.

절곡부의 구부러진 각도는 몸체부와 30˚ ~ 50˚를 이룰 수 있다.The bending angle of the bent portion can be made with the body portion 30˚ ~ 50˚.

금속 커버버텀은 배면 및 측면을 포함하는 니은(ㄴ)자 형상 또는 배면, 측면 및 측면과 수직 하고 배면과 대향 하는 상면을 포함하는 디귿(ㄷ)자 형상일 수 있다.The metal cover bottom may have a needle-shaped shape including a back side and a side, or a Di-shaped (C) shape including a top surface perpendicular to the back side, side, and side and facing the back side.

다른 측면에서 본 발명의 실시예는, 절연된 배선을 포함하는 LED 실장영역을 갖는 금속 커버버텀과 금속 커버버텀의 LED 실장영역에 실장된 LED 패키지를 포함하는 백라이트유닛; 및 백라이트유닛으로부터 제공된 광을 이용하여 영상을 표시하는 액정패널을 포함하는 액정표시장치를 제공한다.In another aspect, an embodiment of the present invention, a backlight unit including a metal cover bottom having an LED mounting area including an insulated wiring and an LED package mounted on the LED mounting area of the metal cover bottom; And a liquid crystal panel which displays an image using light provided from the backlight unit.

금속 커버버텀은 니은(ㄴ)자 형상 또는 디귿(ㄷ)자 형상을 갖는 몸체부와, 몸체부의 양측 끝단에서 몸체부의 내부를 향하여 구부러진 절곡부를 포함하며, 절곡부에 LED 패키지가 실장되는 LED 실장영역이 형성될 수 있다.The metal cover bottom includes a body portion having a needle-shaped or di-shaped shape, and a bent portion bent toward the inside of the body portion at both ends of the body portion, and an LED mounting area in which the LED package is mounted on the bent portion. This can be formed.

절곡부의 구부러진 각도는 몸체부와 30˚ ~ 50˚를 이룰 수 있다.
The bending angle of the bent portion can be made with the body portion 30˚ ~ 50˚.

본 발명의 실시예는, 커버버텀과 인쇄회로기판이 일체화된 금속 커버버텀으로 백라이트유닛이 구성되므로 구조의 단순화를 통해 조립불량을 방지할 수 있고 LED 패키지로부터 형성된 열이 금속 커버버텀으로 직접전달됨으로써 방열특성을 향상시킬 수 있는 백라이트유닛과 이를 이용한 액정표시장치를 제공하는 효과가 있다.
In the embodiment of the present invention, since the backlight unit is composed of a metal cover bottom in which the cover bottom and the printed circuit board are integrated, assembly failure can be prevented by simplifying the structure, and heat formed from the LED package is directly transferred to the metal cover bottom. There is an effect of providing a backlight unit and a liquid crystal display device using the same that can improve the heat radiation characteristics.

도 1은 본 발명의 제1실시예에 따른 백라이트유닛의 일부 도면.
도 2는 도 1에 도시된 A1-A2 영역의 단면도.
도 3은 도 2에 도시된 A1-A2 영역의 평면도 및 이의 절단면도.
도 4는 본 발명의 제1실시예에 따른 백라이트유닛의 제조방법을 설명하기 위한 평면도.
도 5는 제1실시예의 변형된 실시예에 따른 백라이트유닛의 일부 도면.
도 6은 본 발명의 제2실시예에 따른 백라이트유닛의 일부 도면.
도 7은 도 6에 도시된 B1-B2 영역의 단면도.
도 8은 본 발명의 제2실시예에 따른 백라이트유닛의 제조방법을 설명하기 위한 평면도.
도 9는 제2실시예의 변형된 실시예에 따른 백라이트유닛의 일부 도면.
도 10은 실시예에 따른 액정표시장치의 일부 단면도.
도 11은 도 10에 도시된 도광판의 평면도.1 is a partial view of a backlight unit according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of region A1-A2 shown in FIG. 1. FIG.
FIG. 3 is a plan view and a cutaway view of the region A1-A2 shown in FIG. 2; FIG.
4 is a plan view for explaining a method of manufacturing a backlight unit according to a first embodiment of the present invention.
5 is a partial view of a backlight unit according to a modified embodiment of the first embodiment.
6 is a partial view of a backlight unit according to a second embodiment of the present invention.
FIG. 7 is a cross-sectional view of the region B1-B2 shown in FIG. 6. FIG.
8 is a plan view for explaining a method of manufacturing a backlight unit according to a second embodiment of the present invention.
9 is a partial view of a backlight unit according to a modified embodiment of the second embodiment.
10 is a partial cross-sectional view of a liquid crystal display device according to an embodiment.
FIG. 11 is a plan view of the light guide plate shown in FIG. 10; FIG.

이하, 본 발명의 실시를 위한 구체적인 내용을 첨부된 도면을 참조하여 설명한다.DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<제1실시예>&Lt; Embodiment 1 >

도 1은 본 발명의 제1실시예에 따른 백라이트유닛의 일부 도면이고, 도 2는 도 1에 도시된 A1-A2 영역의 단면도이며, 도 3은 도 2에 도시된 A1-A2 영역의 평면도 및 이의 절단면도이다.1 is a partial view of a backlight unit according to a first embodiment of the present invention, Figure 2 is a cross-sectional view of the region A1-A2 shown in Figure 1, Figure 3 is a plan view of the region A1-A2 shown in Figure 2 and It is a cutaway view thereof.

도 1 내지 도 3에 도시된 바와 같이, 본 발명의 제1실시예에 따른 백라이트유닛에는 절연된 배선을 포함하는 LED(Light Emitting Diode) 실장영역(130)을 갖는 금속 커버버텀(120)과 금속 커버버텀(120)의 LED 실장영역(130)에 실장된 LED 패키지(LED)가 포함된다. 이와 더불어, 백라이트유닛에는 LED 패키지(LED)로부터 출사된 점광원을 면광원으로 변환하는 도광판과 도광판을 통해 출사된 광의 효율을 증가시키는 광학부재 등이 더 포함되나 이의 설명은 생략한다.As shown in FIGS. 1 to 3, the backlight unit according to the first embodiment of the present invention includes a metal cover bottom 120 and a metal having a light emitting diode (LED) mounting area 130 including insulated wiring. An LED package (LED) mounted in the LED mounting area 130 of the cover bottom 120 is included. In addition, the backlight unit further includes a light guide plate for converting the point light source emitted from the LED package (LED) into a surface light source and an optical member for increasing the efficiency of the light emitted through the light guide plate, but description thereof will be omitted.

금속 커버버텀(120)에는 배면(121) 및 배면(121)과 수직 하는 측면(122)을 포함하는 몸체부(120a)와, 배면(121) 및 측면(122)과 일체형으로 형성되며 측면(122)의 양측 끝단이 내부를 향하여 구부러진 절곡부(120b)가 포함된다. 즉, 금속 커버버텀(120)은 배면(121) 및 측면(122)을 포함하는 니은(ㄴ)자 형상으로 형성된다.The metal cover bottom 120 has a body portion 120a including a rear surface 121 and a side surface 122 perpendicular to the rear surface 121, and is integrally formed with the rear surface 121 and the side surface 122 and has a side surface 122. Both ends of the bent portion is bent toward the inside (120b) is included. That is, the metal cover bottom 120 is formed in the shape of a needle (b) including a rear surface 121 and a side surface 122.

LED 패키지(LED)는 LED 실장영역(130)에 적어도 하나가 실장되고, LED 실장영역(130)은 절곡부(120b)에 형성된다.At least one LED package (LED) is mounted in the LED mounting region 130, and the LED mounting region 130 is formed in the bent portion 120b.

금속 커버버텀(120)은 절곡 가능한 재질 예컨대 알루미늄과 철(Al + Fe)로 이루어진 재질을 사용할 수 있다. 따라서, 금속 커버버텀(120) 상에 형성된 LED 실장영역(130)은 절연된 배선이 포함되도록 다음과 같이 구성된다.The metal cover bottom 120 may be formed of a bendable material such as aluminum and iron (Al + Fe). Therefore, the LED mounting region 130 formed on the metal cover bottom 120 is configured as follows to include insulated wiring.

LED 실장영역(130)에는 커버버텀(120)의 측면(122) 상에 형성된 제1절연층(131)과, 제1절연층(131) 상에 형성된 배선층(132)과, 배선층(132) 상에 형성된 제2절연층(133)이 포함된다. 제1절연층(131)은 제1절연층(131) 상에 형성되는 배선층(132)과 금속 커버버텀(120) 간의 전기적인 절연을 목적으로 형성된다. 배선층(132)은 LED 실장영역(130)에 형성되는 LED 패키지(LED)에 전기적인 신호를 전달하도록 전도성 재료로 형성된다. 제2절연층(133)은 LED 패키지(LED)의 리드부(L)가 배선층(132)에 접촉되며 실장되도록 배선층(132)의 일부를 노출하며 형성된다.In the LED mounting region 130, a first insulating layer 131 formed on the side surface 122 of the cover bottom 120, a wiring layer 132 formed on the first insulating layer 131, and an upper portion of the wiring layer 132. A second insulating layer 133 formed in the is included. The first insulating layer 131 is formed for electrical insulation between the wiring layer 132 and the metal cover bottom 120 formed on the first insulating layer 131. The wiring layer 132 is formed of a conductive material to transmit an electrical signal to the LED package (LED) formed in the LED mounting region 130. The second insulating layer 133 is formed by exposing a part of the wiring layer 132 so that the lead portion L of the LED package LED contacts the wiring layer 132 and is mounted.

절곡부(120b)의 구부러진 각도(r)는 몸체부(120a)와 30˚ ~ 50˚를 이룰 수 있으나 적어도 41˚를 이룰 때, 몸체부(120a) 영역에서 발생할 수 있는 암부를 줄이며 LED 패키지(LED)로부터 출사된 광을 도광판에 효율적으로 전달할 수 있게 된다.The bending angle r of the bent portion 120b may be 30 ° to 50 ° with the body part 120a, but when at least 41 °, the bent part r may reduce the dark part that may occur in the area of the body part 120a and may reduce the LED package ( It is possible to efficiently transmit the light emitted from the LED) to the light guide plate.

이하, 제1실시예에 따른 금속 커버버텀(120)을 제작하는 방법에 대해 설명한다.Hereinafter, a method of manufacturing the metal cover bottom 120 according to the first embodiment will be described.

도 4는 본 발명의 제1실시예에 따른 백라이트유닛의 제조방법을 설명하기 위한 평면도이다.4 is a plan view illustrating a method of manufacturing a backlight unit according to a first embodiment of the present invention.

도 4에 도시된 바와 같이, 금속 커버버텀(120)의 영역을 직선형을 취하는 몸체부(120a)와 몸체부(120a)의 내측으로 절곡하여 구부릴 절곡부(120b)를 정의한다.As shown in FIG. 4, the area of the metal cover bottom 120 is bent into the body portion 120a and the body portion 120a taking a straight line to define the bent portion 120b.

몸체부(120a) 및 절곡부(120b)에 도 3에서 설명한 형태로 금속 커버버텀(120)의 측면(122)에 제1절연층(131), 배선층(132) 및 제2절연층(133)을 형성한다.The first insulating layer 131, the wiring layer 132, and the second insulating layer 133 on the side surface 122 of the metal cover bottom 120 in the body portion 120a and the bent portion 120b in the form described with reference to FIG. 3. To form.

LED 실장영역(130)이 되는 절곡부(120b)에는 LED 패키지(LED)를 실장하고 LED 실장영역(130)이 아닌 몸체부(120a)에는 LED 커넥터(140)를 형성한다. LED 패키지(LED)는 LED 커넥터(140)를 통해 전달된 신호에 의해 광을 출사한다. LED 패키지(LED)와 LED 커넥터(140)는 배선층(132)에 의해 전기적으로 연결된다.The LED package (LED) is mounted on the bent portion 120b to be the LED mounting region 130, and the LED connector 140 is formed on the body portion 120a instead of the LED mounting region 130. The LED package (LED) emits light by a signal transmitted through the LED connector 140. The LED package (LED) and the LED connector 140 are electrically connected by the wiring layer 132.

금속 커버버텀(120)의 배면(121)과 측면(122)이 수직을 이루며 니은(ㄴ)자 형상을 갖도록 절곡하여 구부린다.The back surface 121 and the side surface 122 of the metal cover bottom 120 are perpendicular to each other and bent to bend to have a needle-shaped (b) shape.

절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 절곡부(120b)의 구부러진 각도가 몸체부(120a)와 30˚ ~ 50˚를 이루도록 구부려 디귿(ㄷ)자 형상에 가깝도록 형성한다.The bent portion 120b is bent into the inner portion of the body portion 120a to bend so that the bent angle of the bent portion 120b forms a 30 ° to 50 ° angle with the body portion 120a, so that the bent portion 120b is formed to be close to the shape of the depressed (C). .

위의 설명에서, 금속 커버버텀(120)의 배면(121)과 측면(122)을 구부리는 공정과 절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 구부리는 공정은 LED 패키지(LED)와 LED 커넥터(140)의 용이한 실장을 위해 이와 같이 부품 실장 공정 후에 형성하는 것이 바람직하다. 그리고 금속 커버버텀(120)의 배면(121)과 측면(122)을 구부리는 공정과 절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 구부리는 공정의 순서는 바뀔 수도 있다.In the above description, the process of bending the back surface 121 and the side surface 122 of the metal cover bottom 120 and the process of bending the bent portion 120b by bending the inner portion of the body portion 120a are LED packages (LEDs). ) And the LED connector 140 may be formed after the component mounting process. The order of bending the back surface 121 and the side surface 122 of the metal cover bottom 120 and bending the bending portion 120b into the body portion 120a may be reversed.

한편, 제1실시예와 같이 절곡부(120b)에만 LED 패키지(LED)를 실장할 경우, 종래 대비 LED 패키지(LED)의 개수가 대략 1/10 수준으로 줄어들기 때문에 LED 패키지(LED)당 광속이 10배 정도 높은 것을 사용하는 것이 바람직하다.On the other hand, when the LED package (LED) is mounted only on the bent portion (120b) as in the first embodiment, the number of LED package (LED) is reduced to approximately 1/10 level compared to the conventional light flux per LED package (LED) It is preferable to use this 10 times higher.

도 5는 제1실시예의 변형된 실시예에 따른 백라이트유닛의 일부 도면이다.5 is a partial view of a backlight unit according to a modified embodiment of the first embodiment.

한편, 제1실시예에서는 열 방출 특성을 향상시킬 수 있는 구조를 갖도록 금속 커버버텀(120)의 배면(121) 형상이 넓은 면적을 가지며 유선형으로 마련된 것을 일례로 하였다.On the other hand, the first embodiment has an example in which the back 121 of the metal cover bottom 120 has a large area and is streamlined so as to have a structure capable of improving heat dissipation characteristics.

그러나, 금속 커버버텀(120)의 배면(121) 형상은 도 5와 같이 절곡부(120b)의 형상을 따라 디귿(ㄷ)자 형상에 가깝도록 마련되거나 이와 다른 형태로 목적에 맞게 변형될 수도 있다. 또한, LED 실장영역(130)은 몸체부(120a)의 영역에서 발생할 수 있는 암부 보상을 위해 몸체부(120a)에도 형성하고 LED 실장영역(130)에 적어도 하나의 LED 패키지(LED)를 실장할 수도 있다. 이 구조의 경우, 제1실시예 대비 LED 패키지(LED)당 광속을 낮출 수 있다.
However, the shape of the rear surface 121 of the metal cover bottom 120 may be provided to be close to the shape of the recess (c) along the shape of the bent portion 120b as shown in FIG. 5, or may be deformed according to the purpose. . In addition, the LED mounting region 130 is also formed in the body portion 120a to compensate for dark parts that may occur in the region of the body portion 120a and mount at least one LED package (LED) in the LED mounting region 130. It may be. In this structure, the luminous flux per LED package (LED) can be lowered compared to the first embodiment.

<제2실시예>&Lt; Embodiment 2 >

도 6은 본 발명의 제2실시예에 따른 백라이트유닛의 일부 도면이고, 도 7은 도 6에 도시된 B1-B2 영역의 단면도이다.6 is a partial view of a backlight unit according to a second embodiment of the present invention, and FIG. 7 is a cross-sectional view of the region B1-B2 shown in FIG. 6.

도 6 및 도 7에 도시된 바와 같이, 본 발명의 제2실시예에 따른 백라이트유닛에는 절연된 배선을 포함하는 LED 실장영역(130)을 갖는 금속 커버버텀(120)과 금속 커버버텀(120)의 LED 실장영역(130)에 실장된 LED 패키지(LED)가 포함된다.6 and 7, the backlight unit according to the second embodiment of the present invention includes a metal cover bottom 120 and a metal cover bottom 120 having an LED mounting area 130 including insulated wiring. LED package (LED) mounted in the LED mounting area 130 of the.

금속 커버버텀(120)에는 배면(121), 배면(121)과 수직 하는 측면(122) 및 측면(122)과 수직하고 배면(121)과 대향 하는 상면(123)을 포함하는 몸체부(120a)와, 배면(121), 측면(122) 및 상면(123)과 일체형으로 형성되며 측면(122)의 양측 끝단이 내부를 향하여 구부러진 절곡부(120b)가 포함된다. 금속 커버버텀(120)은 배면(121), 측면(122) 및 상면(123)을 포함하는 디귿(ㄷ)자 형상으로 형성된다.The body cover 120a includes a rear surface 121, a side surface 122 that is perpendicular to the rear surface 121, and an upper surface 123 that is perpendicular to the side surface 122 and faces the rear surface 121. And a bent portion 120b formed integrally with the rear surface 121, the side surface 122, and the upper surface 123 and bent toward both ends of the side surface 122. The metal cover bottom 120 is formed in a Di-shaped (c) shape including a rear surface 121, a side surface 122, and an upper surface 123.

LED 패키지(LED)는 LED 실장영역(130)에 적어도 하나가 실장되고, LED 실장영역(130)은 절곡부(120b)에 형성된다.At least one LED package (LED) is mounted in the LED mounting region 130, and the LED mounting region 130 is formed in the bent portion 120b.

금속 커버버텀(120)은 절곡 가능한 재질 예컨대 알루미늄과 철(Al + Fe)로 이루어진 재질을 사용할 수 있다. 따라서, 금속 커버버텀(120) 상에 형성된 LED 실장영역(130)은 절연된 배선이 포함되도록 다음과 같이 구성된다.The metal cover bottom 120 may be formed of a bendable material such as aluminum and iron (Al + Fe). Therefore, the LED mounting region 130 formed on the metal cover bottom 120 is configured as follows to include insulated wiring.

LED 실장영역(130)에는 제1실시예의 도 3을 참조하여 설명한 바와 같이 커버버텀(120)의 측면(122) 상에 형성된 제1절연층(131)과, 제1절연층(131) 상에 형성된 배선층(132)과, 배선층(132) 상에 형성된 제2절연층(133)이 포함된다. 제1절연층(131)은 제1절연층(131) 상에 형성되는 배선층(132)과 금속 커버버텀(120) 간의 전기적인 절연을 목적으로 형성된다. 배선층(132)은 LED 실장영역(130)에 형성되는 LED 패키지(LED)에 전기적인 신호를 전달하도록 전도성 재료로 형성된다. 제2절연층(133)은 LED 패키지(LED)의 리드부(L)가 배선층(132)에 접촉되며 실장되도록 배선층(132)의 일부를 노출하며 형성된다.In the LED mounting region 130, the first insulating layer 131 formed on the side surface 122 of the cover bottom 120 and the first insulating layer 131 are described with reference to FIG. 3 of the first embodiment. The formed wiring layer 132 and the second insulating layer 133 formed on the wiring layer 132 are included. The first insulating layer 131 is formed for electrical insulation between the wiring layer 132 and the metal cover bottom 120 formed on the first insulating layer 131. The wiring layer 132 is formed of a conductive material to transmit an electrical signal to the LED package (LED) formed in the LED mounting region 130. The second insulating layer 133 is formed by exposing a part of the wiring layer 132 so that the lead portion L of the LED package LED contacts the wiring layer 132 and is mounted.

절곡부(120b)의 구부러진 각도(r)는 몸체부(120a)와 30˚ ~ 50˚를 이룰 수 있으나 적어도 41˚를 이룰 때, 몸체부(120a) 영역에서 발생할 수 있는 암부를 줄이며 LED 패키지(LED)로부터 출사된 광을 도광판에 효율적으로 전달할 수 있게 된다.The bending angle r of the bent portion 120b may be 30 ° to 50 ° with the body part 120a, but when at least 41 °, the bent part r may reduce the dark part that may occur in the area of the body part 120a and may reduce the LED package ( It is possible to efficiently transmit the light emitted from the LED) to the light guide plate.

이하, 제2실시예에 따른 금속 커버버텀(120)을 제작하는 방법에 대해 설명한다.Hereinafter, a method of manufacturing the metal cover bottom 120 according to the second embodiment will be described.

도 8은 본 발명의 제2실시예에 따른 백라이트유닛의 제조방법을 설명하기 위한 평면도이다.8 is a plan view illustrating a method of manufacturing a backlight unit according to a second embodiment of the present invention.

도 8에 도시된 바와 같이, 금속 커버버텀(120)의 영역을 직선형을 취하는 몸체부(120a)와 몸체부(120a)의 내측으로 절곡하여 구부릴 절곡부(120b)를 정의한다.As shown in FIG. 8, the area of the metal cover bottom 120 is bent into the body portion 120a and the body portion 120a taking a straight line to define the bent portion 120b.

몸체부(120a) 및 절곡부(120b)에 도 3에서 설명한 형태로 금속 커버버텀(120)의 측면(122)에 제1절연층(131), 배선층(132) 및 제2절연층(133)을 형성한다.The first insulating layer 131, the wiring layer 132, and the second insulating layer 133 on the side surface 122 of the metal cover bottom 120 in the body portion 120a and the bent portion 120b in the form described with reference to FIG. 3. To form.

LED 실장영역(130)이 되는 절곡부(120b)에 LED 패키지(LED)를 실장하고 LED 실장영역(130)이 아닌 몸체부(120a)에 LED 커넥터(140)를 형성한다.The LED package (LED) is mounted on the bent portion 120b that becomes the LED mounting region 130, and the LED connector 140 is formed on the body portion 120a instead of the LED mounting region 130.

금속 커버버텀(120)의 배면(121)과 측면(122)이 수직을 이루고 측면(122)과 상면(123)이 수직을 이루며 배면(121)과 대향 하며 디귿(ㄷ)자 형상을 갖도록 절곡하여 구부린다.The back surface 121 and the side surface 122 of the metal cover bottom 120 are perpendicular to each other, and the side surface 122 and the top surface 123 are vertical to face the rear surface 121 and bent to have a diagonal shape. Bend over.

절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 절곡부(120b)의 구부러진 각도가 몸체부(120a)와 30˚ ~ 50˚를 이루도록 구부려 디귿(ㄷ)자 형상에 가깝도록 형성한다.The bent portion 120b is bent into the inner portion of the body portion 120a to bend so that the bent angle of the bent portion 120b forms a 30 ° to 50 ° angle with the body portion 120a, so that the bent portion 120b is formed to be close to the shape of the depressed (C). .

위의 설명에서, 금속 커버버텀(120)의 배면(121), 측면(122) 및 상면(123)을 구부리는 공정과 절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 구부리는 공정은 LED 패키지(LED)와 LED 커넥터(140)의 용이한 실장을 위해 이와 같이 부품 실장 공정 후에 형성하는 것이 바람직하다. 그리고 금속 커버버텀(120)의 배면(121), 측면(122) 및 상면(123)을 구부리는 공정과 절곡부(120b)를 몸체부(120a)의 내측으로 절곡하여 구부리는 공정의 순서는 바뀔 수도 있다.In the above description, the process of bending the back surface 121, the side surface 122, and the upper surface 123 of the metal cover bottom 120 and the process of bending the bent portion 120b by bending the inner portion of the body portion 120a. In order to facilitate mounting of the LED package (LED) and the LED connector 140, it is preferable to form after the component mounting process as described above. The order of bending the back surface 121, the side surface 122, and the upper surface 123 of the metal cover bottom 120 and the bending process of bending the bent portion 120b into the body portion 120a may be changed. It may be.

한편, 제2실시예와 같이 절곡부(120b)에만 LED 패키지(LED)를 실장할 경우, 종래 대비 LED 패키지(LED)의 개수가 대략 1/10 수준으로 줄어들기 때문에 LED 패키지(LED)당 광속이 10배 정도 높은 것을 사용하는 것이 바람직하다. 이와 같이, LED 패키지(LED)당 광속이 높아지면 전류를 많이 인가해야 하고 방열 특성이 매우 중요해진다. 이러한 이유로 본 발명은 LED 패키지(LED)가 실장되는 인쇄회로기판과 커버버텀을 일체화하여 방열 특성을 향상시키고자 실시예와 같은 구조로 형성한다.
On the other hand, when the LED package (LED) is mounted only on the bent portion (120b), as in the second embodiment, the number of LED package (LED) is reduced to approximately 1/10 level compared to the conventional light flux per LED package (LED) It is preferable to use this 10 times higher. As such, when the luminous flux per LED package (LED) increases, a large amount of current must be applied and heat dissipation characteristics become very important. For this reason, the present invention is formed in the same structure as the embodiment to improve the heat dissipation characteristics by integrating the printed circuit board and the cover bottom on which the LED package (LED) is mounted.

도 9는 제2실시예의 변형된 실시예에 따른 백라이트유닛의 일부 도면이다.9 is a partial view of a backlight unit according to a modified embodiment of the second embodiment.

한편, 제2실시예에서는 열 방출 특성을 향상시킬 수 있는 구조를 갖도록 금속 커버버텀(120)의 배면(121) 형상이 넓은 면적을 가지며 유선형으로 마련된 것을 일례로 하였다.On the other hand, in the second embodiment, the back 121 of the metal cover bottom 120 has a large area and has a streamlined shape so as to have a structure capable of improving heat dissipation characteristics.

그러나, 금속 커버버텀(120)의 배면(121) 형상은 도 9와 같이 절곡부(120b)의 형상을 따라 디귿(ㄷ)자 형상에 가깝도록 마련되거나 이와 다른 형태로 목적에 맞게 변형될 수도 있다. 또한, LED 실장영역(130)은 몸체부(120a)의 영역에서 발생할 수 있는 암부 보상을 위해 몸체부(120a)에도 형성하고 LED 실장영역(130)에 적어도 하나의 LED 패키지(LED)를 실장할 수도 있다. 이 구조의 경우, 제2실시예 대비 LED 패키지(LED)당 광속을 낮출 수 있다.
However, the shape of the rear surface 121 of the metal cover bottom 120 may be provided to be close to the shape of the recess (c) along the shape of the bent portion 120b as shown in FIG. 9, or may be modified in accordance with the purpose in other forms. . In addition, the LED mounting region 130 is also formed in the body portion 120a to compensate for dark parts that may occur in the region of the body portion 120a and mount at least one LED package (LED) in the LED mounting region 130. It may be. In this structure, the luminous flux per LED package (LED) can be lowered compared to the second embodiment.

앞서 설명한 제1 및 제2실시예에 따른 백라이트유닛을 포함하는 액정표시장치는 다음과 같다.The liquid crystal display device including the backlight unit according to the first and second embodiments described above is as follows.

도 10은 실시예에 따른 액정표시장치의 일부 단면도이고, 도 11은 도 10에 도시된 도광판의 평면도이다.FIG. 10 is a partial cross-sectional view of the liquid crystal display according to the embodiment, and FIG. 11 is a plan view of the light guide plate shown in FIG. 10.

도 10에 도시된 바와 같이, 실시예에 따른 액정표시장치에는 LED 패키지(LED)가 실장된 금속 커버버텀(120), 도광판(110), 광학부재(150) 및 액정패널(160)이 포함된다.As shown in FIG. 10, the liquid crystal display according to the embodiment includes a metal cover bottom 120 on which an LED package (LED) is mounted, a light guide plate 110, an optical member 150, and a liquid crystal panel 160. .

액정패널(160)은 영상을 표시하는 역할을 한다. 액정패널(160)에는 박막 트랜지스터 어레이 기판(160a)과 컬러필터 기판(160b) 사이에 형성된 액정층을 포함하는 서브 픽셀들이 포함된다. 박막 트랜지스터 어레이 기판(160a)과 컬러필터 기판(160b)에는 게이트라인으로부터 공급된 게이트신호에 의해 구동하는 스위칭 트랜지스터와, 스위칭 트랜지스터의 스위칭 동작에 의해 데이터라인으로부터 공급된 데이터전압을 저장하는 스토리지 커패시터와, 스위칭 트랜지스터로부터 픽셀전압을 제공받는 픽셀전극과, 공통전압라인으로부터 공통전압을 공급받는 공통전극과, 픽셀전극과 공통전극에 의해 형성된 전계에 의해 구동하는 액정과, 액정의 구동에 의해 출사된 광을 적색, 녹색 및 청색 등으로 변환하는 컬러필터와, 컬러필터 간의 혼색을 방지하는 블랙매트릭스 등이 포함된다. 액정패널(160)은 TN(Twisted Nematic) 모드, VA(Vertical Alignment) 모드, IPS(In Plane Switching) 모드, FFS(Fringe Field Switching) 모드, ECB(Electrically Controlled Birefringence) 모드 등으로 동작하도록 구현된다.The liquid crystal panel 160 displays an image. The liquid crystal panel 160 includes subpixels including a liquid crystal layer formed between the thin film transistor array substrate 160a and the color filter substrate 160b. The thin film transistor array substrate 160a and the color filter substrate 160b may include a switching transistor driven by a gate signal supplied from a gate line, a storage capacitor storing a data voltage supplied from the data line by a switching operation of the switching transistor; A pixel electrode supplied with the pixel voltage from the switching transistor, a common electrode supplied with the common voltage from the common voltage line, a liquid crystal driven by an electric field formed by the pixel electrode and the common electrode, and light emitted by driving the liquid crystal A color filter for converting the color into red, green, blue, and the like, and a black matrix for preventing color mixing between the color filters. The liquid crystal panel 160 may be implemented to operate in a twisted nematic (TN) mode, a vertical alignment (VA) mode, an in plane switching (IPS) mode, a fringe field switching (FFS) mode, an electrically controlled irefringence (ECB) mode, and the like.

액정패널(160)을 구성하는 박막 트랜지스터 어레이 기판(160a)과 컬러필터 기판(160b)에는 백라이트유닛(110, 120, 150)을 통해 입사된 광의 편광 특성을 변환하는 하부편광판(161)과 상부편광판(161)이 각각 부착된다.The lower polarizing plate 161 and the upper polarizing plate convert the polarization characteristics of the light incident through the backlight units 110, 120, and 150 to the thin film transistor array substrate 160a and the color filter substrate 160b constituting the liquid crystal panel 160. 161 are attached respectively.

백라이트유닛(110, 120, 150)은 액정패널(160)에 광을 제공하는 역할을 한다. 백라이트유닛(110, 120, 150)에는 금속 커버버텀(120), 도광판(110), 광학부재(150)가 포함된다.The backlight units 110, 120, and 150 serve to provide light to the liquid crystal panel 160. The backlight units 110, 120, and 150 include a metal cover bottom 120, a light guide plate 110, and an optical member 150.

금속 커버버텀(120)은 도광판(110) 및 광학부재(150) 등을 수납하는 역할을 한다. 금속 커버버텀(120)은 앞서 제1 및 제2실시예에서 설명한 바와 같이 절곡부 또는 절곡부와 몸체부에 LED 패키지(LED)가 실장된 구조를 갖는다.The metal cover bottom 120 serves to receive the light guide plate 110 and the optical member 150. The metal cover bottom 120 has a structure in which an LED package (LED) is mounted in the bent portion or the bent portion and the body portion as described above in the first and second embodiments.

도광판(110)은 LED 패키지(LED)로부터 출사된 점광원을 면광원으로 전환하여 출사한다. 도광판(110)의 경우, 도 11과 같이 금속 커버버텀(120)의 몸체부 및 절곡부의 형상에 대응하여 직선형의 제1면부(110a) 및 모서리가 삭제된 제2면부(110b)를 포함하여 평면 상에서 육면을 갖는 구조로 형성된다.The light guide plate 110 converts the point light source emitted from the LED package (LED) into a surface light source and emits the light. In the case of the light guide plate 110, as shown in FIG. 11, the planar surface includes a straight first surface portion 110a and a second surface portion 110b having a corner corresponding to the shape of the body portion and the bent portion of the metal cover bottom 120. It is formed into a structure having a hexagonal surface.

광학부재(150)는 도광판(110)을 통해 출사된 광의 효율을 증가시키는 역할을 한다. 광학부재(150)에는 확산시트, 프리즘시트(또는 렌즈시트), 보호시트 등과 같은 시트층이 포함된다. 이와 더불어, 광학부재(150)에는 도광판(110)의 하부에서 출사 광을 반사시키는 반사시트도 포함될 수 있다.The optical member 150 serves to increase the efficiency of the light emitted through the light guide plate 110. The optical member 150 includes a sheet layer such as a diffusion sheet, a prism sheet (or lens sheet), a protective sheet, or the like. In addition, the optical member 150 may also include a reflective sheet reflecting the light emitted from the lower portion of the light guide plate 110.

이상 본 발명은 커버버텀과 인쇄회로기판이 일체화된 금속 커버버텀으로 백라이트유닛이 구성되므로 구조의 단순화(부품의 개수 저감에 따른 비용 절감)를 통해 조립불량을 방지할 수 있고 LED 패키지로부터 형성된 열이 금속 커버버텀으로 직접전달됨으로써 방열특성을 향상시킬 수 있는 백라이트유닛과 이를 이용한 액정표시장치를 제공하는 효과가 있다.Since the backlight unit is composed of a metal cover bottom in which the cover bottom and the printed circuit board are integrated, it is possible to prevent assembly defects by simplifying the structure (cost reduction due to the reduction of the number of parts) and heat formed from the LED package. It is effective to provide a backlight unit and a liquid crystal display device using the same that can be directly transferred to the metal cover bottom to improve the heat radiation characteristics.

이상 첨부된 도면을 참조하여 본 발명의 실시예를 설명하였지만, 상술한 본 발명의 기술적 구성은 본 발명이 속하는 기술 분야의 당업자가 본 발명의 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. 그러므로 이상에서 기술한 실시 예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 한다. 아울러, 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어진다. 또한, 특허청구범위의 의미 및 범위 그리고 그 등가 개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.
While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. It is therefore to be understood that the embodiments described above are to be considered in all respects only as illustrative and not restrictive. In addition, the scope of the present invention is indicated by the following claims rather than the detailed description. Also, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

110: 도광판 120: 금속 커버버텀
120a: 몸체부 120b: 절곡부
130: LED 실장영역 140: 커넥터
150: 광학부재 160: 액정패널
LED: LED 패키지110: light guide plate 120: metal cover bottom
120a: body portion 120b: bend portion
130: LED mounting area 140: connector
150: optical member 160: liquid crystal panel
LED: LED package

Claims (10)

절연된 배선을 포함하는 LED 실장영역을 갖는 금속 커버버텀; 및
상기 금속 커버버텀의 상기 LED 실장영역에 실장된 LED 패키지를 포함하는 백라이트유닛.A metal cover bottom having an LED mounting area including insulated wiring; And
And a LED package mounted on the LED mounting area of the metal cover bottom. 제1항에 있어서,
상기 LED 실장영역은
제1절연층과,
상기 제1절연층 상에 형성된 배선층과,
상기 배선층 상에 형성된 제2절연층을 포함하는 백라이트유닛.The method of claim 1,
The LED mounting area is
A first insulating layer,
A wiring layer formed on the first insulating layer;
And a second insulating layer formed on the wiring layer. 제1항에 있어서,
상기 금속 커버버텀은
배면 및 상기 배면과 수직 하는 측면을 포함하는 몸체부와,
상기 배면 및 상기 측면과 일체형으로 형성되며 상기 측면의 양측 끝단이 내부를 향하여 구부러진 절곡부를 포함하는 백라이트유닛.The method of claim 1,
The metal cover bottom is
A body portion including a rear surface and a side surface perpendicular to the rear surface,
The backlight unit is integrally formed with the rear surface and the side surface and includes a bent portion bent toward both ends of the side. 제3항에 있어서,
상기 LED 패키지는 상기 LED 실장영역에 적어도 하나가 실장되고,
상기 LED 실장영역은 상기 절곡부에 형성된 것을 특징으로 하는 백라이트유닛.The method of claim 3,
At least one LED package is mounted in the LED mounting area,
The LED mounting region is a backlight unit, characterized in that formed in the bent portion. 제3항에 있어서,
상기 LED 패키지는 상기 LED 실장영역에 적어도 하나가 실장되고,
상기 LED 실장영역은 상기 몸체부와 절곡부에 형성된 것을 특징으로 하는 백라이트유닛.The method of claim 3,
At least one LED package is mounted in the LED mounting area,
The LED mounting area is a backlight unit, characterized in that formed in the body portion and the bent portion. 제3항에 있어서,
상기 절곡부의 구부러진 각도는
상기 몸체부와 30˚ ~ 50˚를 이루는 것을 특징으로 하는 백라이트유닛.The method of claim 3,
The bent angle of the bent portion
Backlight unit, characterized in that forming the body portion 30˚ ~ 50˚. 제3항에 있어서,
상기 금속 커버버텀은
상기 배면 및 상기 측면을 포함하는 니은(ㄴ)자 형상 또는 상기 배면, 상기 측면 및 상기 측면과 수직 하고 상기 배면과 대향 하는 상면을 포함하는 디귿(ㄷ)자 형상인 것을 특징으로 하는 백라이트유닛.The method of claim 3,
The metal cover bottom is
The backside and the needle including the side (b) is a shape or a back-shaped (c) shape comprising a top surface perpendicular to the back, the side and the side surface and facing the back surface. 절연된 배선을 포함하는 LED 실장영역을 갖는 금속 커버버텀과 상기 금속 커버버텀의 상기 LED 실장영역에 실장된 LED 패키지를 포함하는 백라이트유닛; 및
상기 백라이트유닛으로부터 제공된 광을 이용하여 영상을 표시하는 액정패널을 포함하는 액정표시장치.A backlight unit including a metal cover bottom having an LED mounting area including an insulated wiring and an LED package mounted on the LED mounting area of the metal cover bottom; And
And a liquid crystal panel for displaying an image using light provided from the backlight unit. 제8항에 있어서,
상기 금속 커버버텀은
니은(ㄴ)자 형상 또는 디귿(ㄷ)자 형상을 갖는 몸체부와,
상기 몸체부의 양측 끝단에서 상기 몸체부의 내부를 향하여 구부러진 절곡부를 포함하며,
상기 절곡부에 상기 LED 패키지가 실장되는 상기 LED 실장영역이 형성된 것을 특징으로 하는 액정표시장치.The method of claim 8,
The metal cover bottom is
A body portion having a b-shaped or a d-shaped,
It includes a bent portion bent toward the inside of the body portion at both ends of the body portion,
And the LED mounting area in which the LED package is mounted is formed in the bent portion. 제8항에 있어서,
상기 절곡부의 구부러진 각도는
상기 몸체부와 30˚ ~ 50˚를 이루는 것을 특징으로 하는 액정표시장치.The method of claim 8,
The bent angle of the bent portion
The liquid crystal display device comprising 30 to 50 degrees with the body portion.
KR1020110021010A 2011-03-09 2011-03-09 Back light unit and liquid crystal display device using the same KR20120103026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
KR1020110021010A KR20120103026A (en) 2011-03-09 2011-03-09 Back light unit and liquid crystal display device using the same

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Publication Number Publication Date
KR20120103026A true KR20120103026A (en) 2012-09-19

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