KR20120100408A - Copper clad laminate having a structure of preventing warpage and manufacturing method of the same - Google Patents

Abstract

PURPOSE: A laminated cooper foil with two glass fiber layers in a core is provided to comprise a bending prevention structure by widening a width between glass fiber layers at forming a laminated cooper foil. CONSTITUTION: A laminated cooper foil with two glass fiber layers comprises a first copper foil(121), a core layer(110), and a second copper foil(122). The core layer is on the first copper foil. The core layer comprises a first insulating resin layer(112a), a first glass fiber layer(111a), a second insulating resin layer(112b), and a second glass fiber layer(111b), and a third insulating resin layer(112c) in order. The second foil is laminated on the top of the core layer. A perpendicular distance between a transverse section including the top of the first glass fiber layer and a transverse section including the bottom of the second glass fiber layer is 13-27% based on 100% of a thickness of the core layer.

Description

Copper clad laminate having a warp-proof structure and a manufacturing method thereof {COPPER CLAD LAMINATE HAVING A STRUCTURE OF PREVENTING WARPAGE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a copper clad laminate having a warpage prevention structure and a method of manufacturing the same, and more particularly, to a copper foil laminated plate that can prevent the warpage phenomenon by improving the structure of the copper clad laminate having a glass fiber layer of two layers in the core It relates to a manufacturing method.

With the recent miniaturization and thinning of electronic products, the size of a semiconductor package is also decreasing in parallel, and the size of a substrate applied to such a semiconductor package also has an absolute influence.

As the size reduction of the semiconductor package is important, excellent reliability is required in terms of dimensional stability, adhesion, planarity, and the like against temperature changes of rigid and flexible substrates. JEITA (Japan Electronics & Information Technology Industries Association) adds a limit on the warpage of components as a regulation item for semiconductor packages. To increase the package density, finer pitch is essential and finer pitch is required. If this is the case, the warpage allowance is lowered.

Meanwhile, copper clad laminate (CCL), which is used as a raw material for both / cross-section and multilayer printed circuit boards, is a core component of electronic devices such as mobile phones, digital cameras, and notebook computers. A copper foil laminated plate 1000 reinforced with an insulating resin such as a glass fiber layer and an epoxy is used. As shown in FIG. 1, the copper-clad laminate 1000 has a single ply structure (a) and a glass fiber layer 1110 formed of two layers on the core 1100 having one glass fiber layer 1110. There is a ply structure (b). That is, the copper foil 1200 is laminated on the upper and lower surfaces of the core 1100, and the glass fiber layer 1110 is impregnated into the insulating resin layer 1120. In this case, the filler 1130 may be dispersed in the insulating resin layer 1120.

Despite the effect of increasing the stiffness of the copper-clad laminate by the reinforcement of the glass fiber layer, due to the thermal expansion coefficient between the glass fiber layer and the insulating resin, the material itself, etc., the planarity of the substrate is reduced due to the heat applied during the manufacture of the copper-clad laminate or the printed circuit board. There is a problem that the warpage phenomenon is further increased.

Accordingly, the necessity of preventing the warpage phenomenon of the copper clad laminate having a glass fiber layer in the core is increasing.

Accordingly, the present invention has been made to solve the above problems, and to provide a copper-clad laminate that can prevent the warpage phenomenon by improving the structure of the copper-clad laminate having a glass fiber layer of two layers in the core.

In addition, the present invention is to provide a manufacturing method that can easily form a structure that can prevent the warpage phenomenon of the copper clad laminated board having two layers of glass fiber layer on the core.

According to an aspect of the present invention,

(1) first copper foil; A core layer in which a first insulating resin layer, a first glass fiber layer, a second insulating resin layer, a second glass fiber layer, and a third insulating resin layer are sequentially stacked on the first copper foil; And a second copper foil laminated on the upper surface of the core layer. In the copper-clad laminate comprising a, the vertical distance between the cross section including the top end of the first glass fiber layer and the cross section including the bottom end of the second glass fiber layer is 13 to 27% based on 100% of the core layer thickness. Provided is a copper clad laminate.

(2) The cross section including the vertical distance between the first copper foil and the cross section including the lowermost end of the first insulating resin layer and the top end of the second copper foil and the second insulating resin layer according to (1). The vertical distance of the copper foil laminated plate, characterized in that 3 to 10% based on the core layer thickness 100%.

(3) The copper foil laminated sheet according to the above (1), wherein the core layer further comprises a filler.

(4) The copper clad laminate according to (1), wherein the second insulating resin layer has a higher drying degree than that of the first insulating resin layer and the third insulating resin layer.

The present invention for solving the another problem,

(5) (a) impregnating an insulating resin with a glass cloth to form a glass fiber layer and an insulating resin layer separated above and below the glass fiber layer; (b) drying the insulating resin impregnated with the glass fiber yarns, but drying the difference in the dryness of the separated insulating resin layer; (c) manufacturing a first prepreg and a second prepreg by laminating copper foil on an insulating resin layer surface having low dryness of the separated insulating resin layer; And (d) heat pressing the surface of the insulating resin layer having the high dryness of the second prepreg on the upper surface of the insulating resin layer having the high dryness of the first prepreg. It provides a manufacturing method.

(6) In the above (5), the hot pressing is a vertical distance between the cross section including the top end of the glass fiber layer of the first prepreg and the cross section including the bottom end of the glass fiber layer of the second prepreg. It provides a copper foil laminated plate manufacturing method characterized in that it is carried out until 13 to 27% based on 100% of thickness except for the copper foil of the copper foil laminated plate.

According to the present invention, it is possible to provide a copper-clad laminate that can prevent a warpage phenomenon through a structural improvement of extending the length between the glass fiber layers in the copper-clad laminate having two layers of glass fibers in the core.

In addition, according to the present invention, by providing a difference in the dryness of the insulating resin layer separated between the glass fiber layer provides a method for producing a copper foil laminated plate to easily widen the length between the glass fiber layer in the formation of copper foil laminated plate through heat compression. can do.

1 is a cross-sectional view showing that a glass fiber layer is formed in one layer (a) and two layers (b) in a conventional copper clad laminate core;
2 is a cross-sectional view for comparing the structure of a copper foil laminated plate (a) having two glass fiber layers and a copper foil laminated sheet (b) having two conventional glass fiber layers according to the present invention;
3 is a view showing a copper clad laminate manufacturing process according to an embodiment of the present invention,
4 is a view for explaining the heat pressing process of FIG.
5 is a view showing a copper clad laminate manufacturing process according to another embodiment of the present invention,
6 is a graph showing the simulation results for the bending strength according to the arrangement of the glass fiber layer,
Figure 7 is a photograph showing the results of DoE (Design of Experiments) evaluation in the model produced under the conditions of Comparative Example 1 and Example 3.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In the drawings, the same or equivalent reference numerals are given to the same or equivalent materials, and the directions are described based on the drawings. In addition, throughout the specification, when a part is said to "include" a certain component, it means that unless otherwise stated, it may further include other components other than the other components.

First, the structure of the copper-clad laminate 100 according to the present invention will be described in detail.

2 is a cross-sectional view for comparing the structures of a copper foil laminated plate (a) having two glass fiber layers and a copper foil laminated sheet (b) having two conventional glass fiber layers according to the present invention.

2, the copper clad laminate 100 according to the present invention, the copper foil laminated plate 100 having two layers of glass fiber layer 111 in the core 110, the first copper foil 121; The first insulating resin layer 112a, the first glass fiber layer 111a, the second insulating resin layer 112b, the second glass fiber layer 111b, and the third insulating resin layer 112c are formed on the upper surface of the first copper foil 121. Core layers 110 are stacked in this order; And a second copper foil 122 stacked on an upper surface of the core layer 110.

In general, in the case of a copper foil laminated plate used in a small semiconductor package, the thickness d1 of the core layers 110 and 1100 is about 150 μm, and each of the conventional copper foil laminated plates 1000 is based on the core layer thickness d1. Looking at the material thickness (up and down length), the glass fiber layer 1110 has a curved shape up and down, the distance (d2) between the top and the bottom end is about 50㎛, the first copper foil 1210 and the first glass fiber layer ( The vertical distance d3 between the cross section including the bottom end of 1110a and the vertical distance d3 between the cross section including the top end of the second copper foil 1220 and the second glass fiber layer 1110b are about 20 μm, The vertical distance d4 between the cross section including the top end of the first glass fiber layer 1110a and the cross section including the bottom end of the second glass fiber layer 1110b is about 10 to 15 μm. That is, d4 is in the range of about 7 to 10% when d1 is regarded as 100%. In this case, as the vertical distance d4 between the cross section including the top end of the first glass fiber layer 1110a and the cross section including the bottom end of the second glass fiber layer 1110b becomes longer, the first copper foil 1210 and the Vertical distance d3 between the cross section including the bottom end of the first glass fiber layer 1110a and vertical distance d3 between the cross section including the top end of the second copper foil 1220 and the second glass fiber layer 1110b. Becomes relatively short.

Here, the present invention, as a result of careful attention to the relationship between the thickness between the material and the warpage phenomenon in the structure of the copper clad laminate, the cross section including the top end of the first glass fiber layer (111a) and the bottom end of the second glass fiber layer (111b) As the vertical distance (d4) between the cross-section including the longer, it was found that the warpage phenomenon of the copper-clad laminate 100 is significantly reduced.

That is, in the copper-clad laminate 100 according to the present invention, the vertical distance d4 between the cross section including the top end of the first glass fiber layer 111a and the cross section including the bottom end of the second glass fiber layer 111b is The core layer 110 has a thickness d1 of 13 to 27% based on 100%. Here, when the vertical distance d4 between the cross section including the top end of the first glass fiber layer 111a and the cross section including the bottom end of the second glass fiber layer 111b is less than 13%, the degree of warpage phenomenon is rapidly improved. If not more than 27%, the vertical distance (d3) or the second copper foil (122) between the cross section including the lowest end of the first copper foil 121 and the first glass fiber layer (111a) The vertical distance d3 between the cross sections including the uppermost end of the second glass fiber layer 111b may be narrowed to about 5 μm or less so that the glass fiber layer 111 may be exposed out of the core layer 110.

According to the optimum range of the vertical distance d4 between the cross section including the top end of the first glass fiber layer 111a and the bottom cross section including the bottom end of the second glass fiber layer 111b, the first copper foil 121 ) And the vertical distance d3 between the cross section including the bottom end of the first glass fiber layer 111a and the vertical distance between the cross section including the top end of the second copper foil 122 and the second glass fiber layer 111b. (d3) is preferably 3 to 10% based on 100% of the thickness d1 of the core layer 110.

In the copper clad laminate 100 according to the present invention, the core layer 110 may further include a filler 113. The filler 113 is distributed in the insulating resin 112 and serves to compensate for the warpage and the glass transition temperature of the copper clad laminate (100).

Hereinafter, a method for manufacturing a copper clad laminate according to the present invention will be described in detail.

3 is a view showing a copper clad laminate manufacturing process according to an embodiment of the present invention, Figure 4 is a view for explaining the heat pressing process of FIG.

Referring to FIGS. 3 and 4, a process of manufacturing a copper clad laminate 100 according to the present invention is shown by using a method of manufacturing a conventional panel type copper clad laminate.

First, a mixture 4 of a resin (1), a solvent (2), a chemical agent (3), etc. for forming the insulating resin layer 112 is mixed (4) and introduced into the impregnator (6) from the supply tank (5), The glass fiber yarn 111 'is impregnated from the glass fiber yarn feed roller 7 to form the glass fiber layer 111 and the insulating resin layer 112 separated above and below the glass fiber layer 111. (S110)

Thereafter, the insulating resin layer 112 impregnated with the glass fiber yarn 111 ′ is dried by passing through the dryer 8, and the upper and lower dryers 8a and 8b are differently set to separate the insulating resin layer. After drying to make a difference in the degree of drying of 112 is cut to a certain size. (S120)

The copper foil 120 'of the size similar to the cut size of the core layer 110 including the glass fiber layer 111 and the insulating resin layer 112 passed through the dryer 8 is separately cut to form the insulating resin layer ( To 112). In this case, the prepreg P having the copper foil 120 'laminated on the surface of the insulating resin layers 112a and 112c having low dryness of the separated insulating resin layer 112 is manufactured.

Thereafter, the two prepregs (P) are heated and pressed (S140) to face each of the two prepregs (P) by using a heating press molding machine 9, and after the cutting finish and inspection (S150), the copper foil laminated plate 100 is manufactured. . Here, the insulating resin layer having a high dryness of the second prepreg P2 on the upper surface of the insulating resin layer 112b having a high dryness of the first prepreg P1 when the two prepregs P face each other. (112b) by facing the surface (see Fig. 4 (a)) by heat compression (see Fig. 4 (b)), the glass fiber layer (111a, 111b) toward the relatively less dry insulating resin layers (112a, 112c) during compression ) So that the distance d4 between the glass fiber layers 111a and 111b can be widened. Therefore, it is possible to form the copper-clad laminate 100 having a structure having two layers of glass fiber layers 111a and 111b capable of preventing warpage as shown in FIG. 4C.

5 is a view showing a copper clad laminate manufacturing process according to another embodiment of the present invention.

Referring to FIG. 5, a process of manufacturing a copper clad laminate 200 according to the present invention is shown by using a method of manufacturing a conventional roll type copper clad laminate.

First, a mixture for forming an insulating resin layer as shown in FIG. 3 is prepared in the impregnator 10, and the glass fiber yarns 211 'are impregnated from two glass fiber yarn feed rollers 11 to form a glass fiber layer 211) and the insulating resin layer 212 formed above and below the glass fiber layer 211 is formed.

Subsequently, the degree of drying of the separated insulating resin layer 212 is different in the preheating stage 12 using infrared heat, that is, the preheating stage 12a disposed at the center as shown in FIG. 5. Set a relatively high temperature of and leave to dry. (S220)

After the drying process, the copper foil layer 220 is formed on the surface of the insulating resin layers 212a and 212c having a low degree of drying of the copper foil 220 'from the upper and lower copper foil supply rollers 14 using the laminating roller 13. It will be laminated. (S230)

Thereafter, by heating using an oven 14 and the like and pressing by using a pressing roller 15 (S240), a copper foil laminated plate 200 having a structure of two layers having a glass fiber layer capable of preventing warpage may be rolled. It can be formed. In addition, the glass fiber layers 211a and 211b are pushed toward the insulating resin layers 212a and 212c which are relatively less dry during the heating and pressing, so that the distance between the insulating resin layers can be increased. The same principle will be seen.

6 is a graph showing simulation results for bending stiffness according to the arrangement of the glass fiber layers. Simulation conditions are shown in Table 1 below. Here, d1-d4 refer to the thickness (length) (micrometer) of each material of FIG. 2, and a percentage shows the ratio with respect to d1.

division d1 d2 d3 d4 Comparative Example 1
150 50 20 10 100% 33.3% 13.3% 6.7% Example 1
150 50 15 20 100% 33.3% 10.0% 13.3% Example 2
150 50 10 30 100% 33.3% 6.7% 20.0% Example 3
150 50 5 40 100% 33.3% 3.3% 26.7%

6 and 2, it can be seen that the bending strength increases as d4 increases and d3 decreases. That is, the copper-clad laminate 100 having the two layers of glass fiber layers 111 is manufactured by varying the degree of dryness in the insulating resin layer 112, and thus the distance d4 between the glass fiber layers 111 inside the core 110 is determined. It can be seen that by increasing the bending strength of the copper-clad laminate 100 can be prevented from bending.

FIG. 7 is a photograph showing DoE (Design of Experiments) evaluation results with models manufactured under the conditions of Comparative Examples 1 and 3. FIG.

Referring to FIG. 7, it can be seen that the bending strength of Example 3 is improved by about 2 times compared to that of Comparative Example 1 (b). That is, as described with reference to FIG. 6, the copper-clad laminate 100 having the two layers of glass fiber layers 111 is manufactured by varying the degree of drying of the insulating resin layer 112, thereby forming the glass fiber layer 111 inside the core 110. By widening the distance (d4) between the bend can be confirmed by increasing the bending strength of the copper-clad laminate 100 can be prevented.

The foregoing is a description of specific embodiments of the present invention. The above embodiments according to the present invention are not to be understood as limiting the scope of the present invention or the matter disclosed for the purpose of description, and those skilled in the art without departing from the spirit of the present invention various changes and modifications It should be understood that this is possible. It is therefore to be understood that all such modifications and alterations are intended to fall within the scope of the invention as disclosed in the following claims or their equivalents.

100, 200: copper clad laminate 110: core layer
111, 211: glass fiber layer 111a: first glass fiber layer
111b: second glass fiber layer 112 and 212: insulating resin layer
112a and 212a: first insulating resin layer 112b and 212b: second insulating resin layer
112c and 212c: third insulating resin layer 113: filler
120, 220: copper foil 121: first copper foil
122: second copper foil

Claims (6)

First copper foil;
A core layer in which a first insulating resin layer, a first glass fiber layer, a second insulating resin layer, a second glass fiber layer, and a third insulating resin layer are sequentially stacked on the first copper foil; And
A second copper foil laminated on an upper surface of the core layer;
In the copper-clad laminate comprising a,
The vertical distance between the cross section including the top end of the first glass fiber layer and the cross section including the bottom end of the second glass fiber layer is 13 to 27% based on 100% of the core layer thickness. The method of claim 1,
The vertical distance between the first copper foil and the cross section including the lowest end of the first insulating resin layer and the vertical distance between the second copper foil and the cross section including the uppermost end of the second insulating resin layer are 100% of the thickness of the core layer. Copper foil laminated plate, characterized in that 3 to 10% on the basis of. The method of claim 1,
The core layer is a copper foil laminated plate further comprises a filler. The method of claim 1,
And the second insulating resin layer has a higher drying degree than that of the first insulating resin layer and the third insulating resin layer. (a) impregnating an insulating resin with a glass cloth to form a glass fiber layer and an insulating resin layer separated above and below the glass fiber layer;
(b) drying the insulating resin impregnated with the glass fiber yarns, but drying the difference in the dryness of the separated insulating resin layer;
(c) manufacturing a first prepreg and a second prepreg by laminating copper foil on an insulating resin layer surface having low dryness of the separated insulating resin layer; And
(d) heating and compressing the insulating resin layer having the high dryness of the second prepreg on the upper surface of the insulating resin layer having the high dryness of the first prepreg;
Copper foil laminated plate manufacturing method comprising a. The method of claim 5,
The heat compression may be performed in such a way that the vertical distance between the cross section including the top end of the glass fiber layer of the first prepreg and the cross section including the bottom end of the glass fiber layer of the second prepreg is 100% of the thickness excluding the copper foil of the copper clad laminate. Copper foil laminated plate manufacturing method characterized in that carried out until 13 to 27% on the basis of.

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