KR20120083039A - Apparatus and method for vacuum molding substrate - Google Patents

Abstract

PURPOSE: A device for vacuum-molding a board and a method thereof are provided to add a transparent partition film to an upper part of a mold, thereby reducing the volume of a UV(Ultra Violet) resin necessary for a high vacuum degree. CONSTITUTION: A mold(20), an elevating mold frame(170), and a transparent partition wall(30) are formed in a vacuum chamber body. The mold transfers an optical pattern on a board. The elevating mold frame fixes edges of the mold. The transparent partition wall covers the mold and the mold frame. The transparent partition wall is extended to a side.

Description

Substrate Vacuum Forming Apparatus and Vacuum Forming Method {APPARATUS AND METHOD FOR VACUUM MOLDING SUBSTRATE}

The present invention relates to an apparatus and method for manufacturing an optical substrate or a functional substrate, for example, a vacuum forming apparatus capable of forming a three-dimensional pattern on a large-area substrate such as a light guided panel (LGP) and It relates to a vacuum forming method.

The light guide plate is a component of a backlight device used in a liquid crystal display device, and has one or both optical patterns for converting a line light source such as a CCFL (cold cathode fluorescent lamp) or a point light source such as an LED into a surface light source.

In order to mold such an optical pattern on a light guide plate, injection molding, silk printing using reflective ink, a UV curing resin (hereinafter referred to as UV resin), a molding method using a thermosetting resin, and the like have been used.

The injection method is suitable for molding complex structures, but the printing method with a long molding time and a cooling time and a relatively simple process cannot be applied to a complicated optical pattern. For this reason, many attempts have been made on a thermosetting resin or a method of molding an optical pattern of a light guide plate using a more preferable UV resin because the process is relatively simple and the curing time is short.

The UV molding method adheres a stamper to a large area substrate coated with a UV resin, and allows the UV resin in between to be filled without gaps (without empty space), and then cures it with UV light and releases the stamper. The engraved optical pattern shape is used to transfer the substrate to the substrate.

However, in the case of using a roll stamper or a flat hard stamper in the conventional UV molding method, it is difficult to precisely control the flatness between the large-area substrate and the stamper. In addition to the UV resin, empty spaces are generated between the substrates, which causes defects such as unmolding and bubbles.

In addition, when the resin applied to the substrate is in close contact with the stamper to the outside of the substrate may be a problem that the appearance is damaged.

As one of the parts of the backlight, a method of forming an optical pattern using a UV resin on a sheet continuously supplied like a prism sheet is already in the mass production stage, but the optical sheet is supplied to a substrate supplied (discontinuously supplied) using the UV molding method. The method of molding the pattern has not yet reached the stage of commercialization due to the above problems.

On the other hand, the UV resin is coated on the substrate by a silk printing method, a slit coating method, a roll coating method, etc., but a relatively high-viscosity UV resin (usually having a viscosity of 100 cps to 10,000 cps) ) Is coated by the silk printing method, a large number of micro bubbles are generated by the fine lattice of the silk plate making and the surface tension of the UV resin, and these fine bubbles pass through the silk plate to be coated on the substrate to affect the optical pattern of the substrate. Giving problems arise. The slit coating method is disadvantageous in economics because the slit coater mechanism is expensive, and the roll coating method is disadvantageous in mass productivity due to frequent defects due to low process stability.

Korean Laid-Open Patent Publication No. 2009-0109755 discloses a substrate manufacturing method and apparatus capable of silk printing a UV resin by molding a three-dimensional pattern using a transparent and flexible molding mold in a vacuum chamber. However, as the size of the substrate increases, the volume of the chamber to be evacuated also increases, which increases the time required for vacuum formation, thereby lowering productivity.

The present invention is to solve the above-mentioned conventional problems, by further comprising a transparent diaphragm on the upper part of the molding mold, by reducing the volume of the UV resin side that actually requires high vacuum, achieve a desired level of vacuum in a short time An object of the present invention is to provide a substrate vacuum forming apparatus that can be used.

In addition, another object of the present invention is to provide a substrate vacuum forming method using the substrate vacuum forming apparatus.

In order to achieve the above object, the vacuum forming method and apparatus according to the present invention use (1) a transparent diaphragm of transparent elastic resin and a transparent and flexible molding mold, and (2) apply a high vacuum only to the lower portion of the transparent diaphragm to obtain a vacuum. Shortening time, (3) forming a three-dimensional pattern in the vacuum chamber, (4) the molding mold to be in close contact with the substrate by the pressure difference, and the main features.

The gist of the present invention is as follows.

Substrate vacuum forming apparatus of the present invention

A substrate vacuum forming apparatus for molding a three-dimensional pattern on a resin-coated substrate, comprising: a vacuum chamber body composed of a normal side wall, a cover and a bottom plate sealing upper and lower sides of the side wall,

The vacuum chamber body includes a molding mold for transferring an optical pattern to a substrate, a liftable molding mold frame for fixing an edge of the molding mold, and a transparent diaphragm covering the molding mold and the molding mold frame and extending to sidewalls. ,

The space sealed by the cover, the side wall and the bottom plate is divided into an upper chamber and a lower chamber by the transparent diaphragm.

In addition, in the substrate vacuum forming apparatus of the present invention, the molding mold, the molding mold frame and the bottom plate, or the molding mold, the molding mold frame, the side wall and the bottom plate may seal the space by the lowering of the molding mold frame.

In addition, a holder for fixing the substrate may be attached to the bottom plate.

The bottom plate is also detachable and configured to elevate and may seal down the sidewall at the highest raised position.

In addition, the upper chamber and the lower chamber may be pressure controlled independently.

In addition, the pressure difference in the vacuum of the upper chamber and the lower chamber is preferably 1 to 100 torr.

In addition, the vacuum chamber body may be provided with a ventilation line communicating with each of the upper chamber and the lower chamber.

In addition, the cover may be made of a material that is transparent to UV light.

In addition, an ultraviolet lamp stage may be disposed above the cover.

In addition, the side wall may be formed in an L-shaped cross section to prevent mutual interference of the rise of the molding die frame and the rise of the bottom plate.

On the other hand, the substrate vacuum molding method of the present invention for molding a three-dimensional pattern on the substrate,

(A) applying a resin to the substrate,

(B) mounting the substrate and the transparent diaphragm in a vacuum chamber and sealing the vacuum chamber and then forming a vacuum in the upper and lower regions of the transparent diaphragm,

(C) contacting a molding mold with one surface of the substrate to which the resin is applied in a vacuum state,

(D) maintaining the upper region and the lower region of the molding mold to be airtight with respect to each other, and

(E) generating a pressure difference at the boundary of the molding mold, characterized in that it comprises the step of bringing the molding mold in close contact with the substrate.

In the substrate vacuum forming method of the present invention, in the step (E), the lower region of the molding mold may be maintained in a vacuum state, and the vacuum of the upper region of the molding mold may be released.

In addition, the substrate vacuum forming method of the present invention, after the step (E), (F) curing the resin, (G) releasing the pressure difference between the upper region and the lower region of the molding mold, (H) The method may include separating the molding mold from the substrate.

In the substrate vacuum forming method of the present invention, in step (B), the pressure difference between the upper region and the lower region of the transparent diaphragm is preferably 1 to 100 torr.

In addition, it is preferable that the said resin is UV resin.

In addition, the molding mold may be made of a flexible and transparent plastic.

In addition, the transparent diaphragm may be made of a transparent elastic resin.

In addition, the substrate vacuum forming method of the present invention can be carried out by the silk printing process in the vacuum step (A).

In addition, the substrate vacuum forming method of the present invention can be carried out by the silk printing apparatus provided with a precision nozzle for discharging the UV resin on the silk plate as much as 1 to 10 coatings on the substrate. .

In addition, in the substrate vacuum forming method of the present invention, after the step (E), the substrate may be irradiated with ultraviolet rays through the molding mold.

In addition, the transparent diaphragm may be made of silicone rubber or urethane rubber.

In addition, the upper edge of the molded mold frame may be round.

In addition, a ventilation line horizontal to the upper or upper core portion of the molded mold frame may be installed.

According to the present invention, even if the flatness of the substrate and the molding mold is not precisely controlled, the substrate and the molding mold can be brought into perfect contact with a uniform pressure. Even in the case of the dimensional pattern, unmolded portions that are not formed between the molding mold and the substrate may be prevented from occurring, or defects such as bubbles. In addition, since it is possible to form a uniform three-dimensional pattern regardless of the size and thickness of the substrate, it is possible to manufacture a large-area product by applying the method and apparatus according to the present invention, there is a great contribution to the art. Furthermore, the introduction of a transparent diaphragm induces a high level of vacuum around the substrate requiring a relatively high vacuum, while allowing a defect-free pattern to be formed even with a relatively low level of vacuum in the remaining space where a high vacuum is not required. Through this, it is possible to drastically reduce the cost and time required to form a vacuum, and there is a merit that the work efficiency is significantly increased.

1 is a flowchart showing a substrate forming method according to an embodiment according to the present invention.
It is a figure which shows the surface state of resin after apply | coating resin on the light guide plate by the silk printing method.
3 to 6 are schematic views of a vacuum forming apparatus for forming an optical pattern on a resin applied to a substrate according to a preferred embodiment of the present invention.
7 to 10 are schematic views of a vacuum forming apparatus for forming an optical pattern in a resin applied to a substrate according to another preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to FIGS. 1 to 10.

1 is a flowchart showing a substrate forming method according to an embodiment of the present invention, FIG. 2 is a view showing the surface state of the resin after the resin is coated on the light guide plate by the silk printing method, and FIGS. 3 to 6 7 is a schematic diagram of a vacuum forming apparatus for forming an optical pattern on a resin applied to a substrate according to a preferred embodiment of the present invention, and FIGS. 7 to 10 are optical patterns on a resin applied to a substrate according to another preferred embodiment of the present invention. Is a schematic diagram of a vacuum forming apparatus for forming a mold.

As shown in FIG. 1, in the present invention, a substrate is manufactured by a process of applying a resin to a bare substrate and a process of forming a three-dimensional pattern in the resin, and in particular, it is preferable to use a UV resin as the resin. Do. Hereinafter, a process of applying a UV resin and a process of forming a three-dimensional pattern will be described with reference to specific examples.

<UV resin coating process>

In applying the UV resin, a silk printing method, a slit coating method, a roll coating method, or the like may be used, but in one embodiment of the present invention, the silk printing method is used, and the resin coating is applied to solve the problem related to bubble generation. It was carried out in a vacuum chamber.

Inside the vacuum chamber, a transfer device equipped with silk engraving and two squeezes for silk printing was installed. The degree of vacuum that did not occur was determined. The results are shown in the table below.

UV resin viscosity Engraving carpenter Bubble-free vacuum degree 100 cps 200 Th 400 torr 200 cps 150 Th 300 torr 300 cps 100 Th 100 torr

Figure 2 is a photograph showing the appearance of the UV resin after applying a UV resin with a viscosity of 100 cps on the substrate by the silk printing method, (a) and (b) are at atmospheric pressure and vacuum conditions of 400 torr, respectively The surface state at the time of apply | coating UV resin is shown.

As shown in FIG. 2B, by setting an appropriate vacuum degree according to the silk printing condition and applying the UV resin onto the light guide plate, it was possible to prevent bubbles from being generated in the UV resin.

In another embodiment, a precision nozzle that can control the amount of UV resin coated on the substrate in a small amount, paying attention to the phenomenon that the bubble generation becomes more severe as the silk printing is repeated at atmospheric pressure, coating 1 to 10 times Silk printing was performed at atmospheric pressure using the method of dispensing only the possible amount of UV resin onto the plate making. In the case of a conventional UV resin, an amount that can be coated once or twice is suitable. However, when a UV resin having excellent antifoaming property is used, silk printing can be performed in an amount that can be coated 10 times or more.

<Optical pattern molding>

In the process of molding the optical pattern on the resin after applying the resin to the substrate according to the present invention, a transparent and flexible soft molding mold (eg, Regiflex mold, Minutatec, Korea) was used, and the vacuum It is characterized by molding in a chamber.

3 to 6 illustrate a vacuum molding apparatus 100 of the present invention for molding a three-dimensional pattern by pressing a resin (not shown in the drawing) applied to one surface of the substrate 10 by a flexible molding mold 20. An Example is shown.

Vacuum forming apparatus 100 includes a vacuum chamber body 140 having a cover 110, sidewalls 120, and bottom plate 130.

The side wall 120 is a conventional shape such as a cylinder, a cylinder, or the like surrounding a predetermined space, and the shape thereof is not particularly limited. In the embodiment of FIG. 3, the bottom plate 130 extends integrally from the bottom of the side wall 120, and the cover 110 covers the upper side of the side wall 120, thereby bottom plate 130 and side wall 120. And the vacuum chamber 150 is partitioned by the cover 110.

The side wall 120 may be provided with an openable door (not shown) to transfer the resin-coated substrate 10 into the vacuum chamber 150 to be seated on the bottom plate 130. At this time, in order to fix the substrate 10, the holder 132 is preferably attached to the bottom plate 130.

The sealing member 152 is disposed at the connection portion between the cover 110 and the side wall 120 so that the vacuum chamber 150 maintains an airtight state with the outside.

The vacuum chamber 150 has a molding mold 20 for transferring a three-dimensional pattern to the substrate 10, a molding mold frame 170 for fixing the edge of the molding mold 20, and the molding mold 20 and molding. A transparent diaphragm 30 is formed to cover the mold frame 170 and extend to the side wall, and the molding mold frame 170 is configured to be liftable by the lifting mechanism 180.

The transparent diaphragm 30 divides the outer and hermetic vacuum chamber 150 into an upper chamber and a lower chamber.

The molding mold 20 is made of a flexible plastic material having a thickness of about 1mm to 2mm, and is fixed to the molding mold frame 170 in the form of a picture frame. The molding mold frame 170 is preferably made of a rigid material such as metal, and the top edge is preferably rounded to prevent the transparent membrane 30 from being damaged by friction.

The transparent diaphragm 30 is preferably made of a transparent elastic resin such as silicone rubber or urethane rubber, and more preferably made of silicone rubber or urethane rubber.

When the molding mold frame 170 descends to the lowest position and contacts the bottom plate 130, the molding mold 20 is configured to approach the substrate 10. At this time, the molding mold 20 so that the space surrounded by the molding mold 20, the molding mold frame 170 and the bottom plate 130 maintains a space and an airtight state including the upper region of the molding mold 20. ) And sealing members 156 and 158 are disposed at the fixing portion of the molding mold frame 170 and the contact portion of the molding mold frame 170 and the bottom plate 130.

When the vacuum chamber 150 is divided into an upper chamber and a lower chamber, three ventilation lines 162, 164, and 168 are provided in the vacuum chamber body 140 so that the vacuum degree of the upper and lower chambers can be controlled, respectively. In the embodiment illustrated in FIG. 3, vent lines 162, 164, and 168 are arranged in the cover 110, the sidewalls 120 and the bottom plate 130 so as to communicate with the upper chamber and the lower chamber, respectively.

The process of transferring the optical pattern to the substrate 10 using the vacuum forming apparatus 100 having the above-described configuration will be described.

After transferring the substrate 10 into the vacuum chamber 150 and closing the vacuum chamber 150 as shown in FIG. 3, a vacuum pump (not shown in FIG. 3) is operated to close the aeration lines 162 and 168. The air in the vacuum chamber 150 is discharged through. At this time, the vent line 164 may or may not be connected to the vacuum pump. The pressure of the vacuum chamber 150 is preferably 100 torr or less in order to reduce the occurrence of defects due to residual air and to remove bubbles of the resin 20 coated on the substrate 10. When the degree of vacuum is increased, Expensive equipment is required, so it is preferable to set it in the range of 10 ^-3 torr to 100 torr.

However, if the main purpose of the vacuum is to suppress the generation of bubbles in the UV resin coated on the substrate 10 as described above, the idea that a high level of vacuum is not required to apply to the entire vacuum chamber 150 is It is a major focus. That is, the actual high vacuum is applied only around the substrate 10 coated with the UV resin, and a relatively low level of vacuum is sufficient for the remaining areas.

As the size of the substrate 10 increases in size to improve yield, the importance of the vacuum chamber 150 for manufacturing the same also increases in size. That is, as the volume of the region to which high vacuum is to be applied in the region inside the vacuum chamber 150 is reduced, the time and power cost required for the vacuum are reduced, thereby improving productivity.

In the present invention, the transparent diaphragm 30 is introduced to reduce the volume of the high vacuum application. The transparent diaphragm 30 divides the vacuum chamber 150 sealed by the cover 110, the side wall 120, and the bottom plate 130 up and down to be divided into an upper chamber and a lower chamber.

In this state, a high level of vacuum (relatively low pressure) is applied to the lower chamber including the substrate 10 through the vent line 168, while a lower level of vacuum (relatively high pressure) is provided to the upper chamber through the vent line 162. ), The transparent diaphragm 30 is in close contact with the molding mold 20 to form a shape as shown in FIG. 4. This process makes it possible to remove bubbles from the resin coated on the substrate 10 in a shorter time, lower operating cost than conventional.

However, if a pressure difference occurs above and below the transparent diaphragm 30 due to the difference in the degree of vacuum, the transparent diaphragm 30 sags downward to closely adhere to the forming mold 20 as shown in FIG. 4, in which case the forming mold 20 is pressurized. It receives the mechanical loads from the car. Therefore, it is necessary to properly control this mechanical load applied to the molding mold 20, which can be achieved by controlling the pressure difference between the upper chamber and the lower chamber within 1 to 100 torr.

On the other hand, the transparent diaphragm 30 used in the present invention causes friction by contacting the molding mold frame 170 during the rising and falling of the molding mold frame 170 and vacuum. In particular, such friction occurring at the upper edge of the molded mold frame 170 may cause damage to the transparent diaphragm 30. Therefore, the upper edge of the molded mold frame 170 is preferably finished in a round shape as shown in FIGS.

In addition, when the vacuum is applied, the transparent diaphragm 30 is in close contact with the center of the molding mold 20 to extend the contact portion toward the molding mold frame 170. In this case, in order to smoothly discharge the air between the transparent diaphragm 30 and the molding mold 20, it is preferable that a horizontal vent line 166 is provided at the upper or upper core portion of the molding mold frame 170. 3 to 6 illustrate a case where the ventilation line 166 is installed on the upper core portion of the molding mold frame 170.

As described above, after the vacuum chamber 150 is set in a vacuum state, the lifting mechanism 180 is operated to gradually lower the molding mold frame 170 so that the molding mold 20 fixed to the molding mold frame 170 is formed of resin. One surface of the coated substrate 10 is to be contacted as shown in FIG.

At this time, the vacuum chamber 150 is formed by the sealing member 156 between the molding mold 20 and the molding mold frame 170 and the sealing member 158 between the molding mold frame 170 and the bottom plate 130. The space including the upper region and the lower region of the molding mold 20 in the cavities is kept airtight with respect to each other. That is, the vacuum chamber 150 is further divided into two chambers which are not in communication with each other in addition to being divided into an upper chamber and a lower chamber by the transparent diaphragm 30, and the molding mold 20 is bounded by two chambers. It acts as a bulkhead.

Thereafter, if the vacuum is released through the vent lines 162 and 168 communicating with the upper region of the molding mold 20 and the lower region of the molding mold 20 is kept in vacuum, the molding mold 20 is bounded. Due to the pressure difference generated by the molding mold 20 is in close contact with the substrate 10 perfectly. For example, when atmospheric pressure acts on the upper region of the molding mold 20, a difference of approximately 1 atmosphere can be generated above and below the molding mold 20.

During the vacuum release, the pressure difference between the upper chamber and the lower chamber of the transparent diaphragm 30 is preferably controlled in the range of 1 to 100 torr, in order to prevent damage to the transparent diaphragm 30. When the vacuum release is completed, the pressure difference between the upper chamber and the lower chamber disappears, and the transparent diaphragm 30 becomes flat as shown in FIG. 6.

When the resin is cured in close contact with the molding mold 20, the three-dimensional pattern engraved on the molding mold 20 is transferred to the substrate 10. When curing of the resin is completed, the vacuum is released through the vent line 164 communicating with the lower region of the molding mold 20, and the molding mold frame 170 is raised to lift the molding mold 20 and the substrate 10. Mold.

According to a modified embodiment of the vacuum forming method according to the present invention, it is preferable to use the substrate 10 to which the UV resin is applied, and more preferably to use the process described in "UV resin application process". In this case, the vacuum forming apparatus 100 may also include an UV lamp stage.

7 to 10 show another embodiment of the vacuum forming apparatus 100 according to the present invention. Among the components of the vacuum forming apparatus 100 shown in FIGS. 7 to 10, the same or corresponding members as those of the vacuum forming apparatus 100 of FIGS. Detailed description thereof will be omitted.

The vacuum forming apparatus 100 includes a vacuum chamber body 140 having a cover 110, a side wall 120, and a bottom plate 130, and within the vacuum chamber body 140, a lifting and molding mold frame 170. ) And a molding mold 20 fixed to the molding mold frame 170 is provided. In this embodiment, the vacuum forming apparatus 100 also includes a UV lamp stage 190 for curing the UV resin to be suitable for the process of forming an optical pattern on the substrate 10 to which the UV resin is applied.

The bottom plate 130 in the embodiment of FIG. 7, unlike the bottom plate formed integrally with the side wall in the embodiment of FIG. 3, is detachable and is configured to move up and down by a lifting mechanism, not shown, with the highest lift Seal the underside of sidewall 120 in position. The space enclosed by the cover 110, the side wall 120, and the bottom plate 130 forms a vacuum chamber 150.

The side wall 120 has an extension portion 122 extending substantially in an L shape so as not to interfere with the lifting mechanism 180 of the forming mold 20, and the bottom plate 130 extends of the side wall 120 when raised. It is in close contact with the portion 122.

In addition, the cover 110 and the side wall 120 are provided with ventilation lines 162, 164, and 168 at three positions for depressurizing or injecting the vacuum chamber 150. One of the three vent lines 162, 164, 168 is disposed on the cover 110 and the other two on the side wall 120. The three ventilation lines 162, 164, and 168 are configured to communicate with three chambers in which the vacuum chamber 150 is divided, which will be described with reference to FIG. 10 again.

The molding mold 20 is made of a plastic material which is flexible and transparent to UV light. The molding mold 20 can move up and down by the lifting mechanism 180 together with the molding mold frame 170. When the molding mold frame 170 descends, the sealing member at the contact portion between the molding mold 20 and the molding mold frame 170 so that the space below the molding mold 20 is separated from the upper space and maintained in an airtight state. 156 is disposed, and the sealing member 158 is also disposed at the contact portion between the extension portion 122 of the side wall 120 and the molding mold frame 170.

Next, the operation of the vacuum forming apparatus 100 will be described with reference to FIGS. 7 to 10.

First, the cover 110 is removed and the bottom plate 130 is lowered to open the upper and lower portions of the vacuum chamber body 140. The molding mold 20 is fixed to the molding mold frame 170, the cover 100 is closed after covering the transparent diaphragm 30, and the holder 132 on which the substrate 10 is mounted is transferred to a transfer device (not shown in the drawing). When transferred to the bottom plate 130 by the), it becomes a ready state for vacuum molding as shown in FIG.

Subsequently, when the bottom plate 130 is raised to closely adhere the bottom plate 130 to the extension 122 of the side wall 120, the space partitioned by the cover 110, the side wall 120, and the bottom plate 130. The seal is formed to form a vacuum chamber 150, and a vacuum pump (not shown in the drawing) is operated to discharge air in the vacuum chamber 150 through the vent lines 162 and 168, and as shown in FIG. 30 is in close contact with the molding mold 20. At this time, the vent line 164 may or may not be connected to the vacuum pump.

After the vacuum chamber 150 is in a vacuum state, the lifting mechanism 180 is operated to gradually lower the molding mold frame 170 so that the molding mold 20 fixed to the molding mold frame 170 is coated with UV resin. One surface of the substrate 10 is brought into contact as shown in FIG. 9.

At this time, the sealing member 156 between the molding mold 20 and the molding mold frame 170 and the sealing member 158 between the molding mold frame 170 and the extension part 122 of the side wall 120 are formed. In addition, the space including the upper region and the lower region of the molding mold 20 in the vacuum chamber 150 is maintained in an airtight state not communicating with each other. This operating state is shown in FIG. 9, wherein the vacuum chamber 150 is divided into two chambers, and the molding mold 20 serves as a partition wall as a boundary of the two divided chambers.

When the two chambers are divided, the vacuum is released through the vent lines 162 and 168 and the vacuum under the molding mold 20 is maintained. As shown in FIG. It adheres perfectly to the board | substrate 10, and the transparent diaphragm 30 becomes flat.

When the cover 110 is opened and irradiated with UV through the transparent molding mold 20 by the UV lamp stage 190 without removing or removing the transparent diaphragm 30, the UV resin coated on the substrate 10 is It hardens in the state in which it is in close contact with the molding mold 20, and the three-dimensional pattern engraved on the molding mold 20 is transferred to the substrate 10. In the case of using the cover 110 as a transparent material that is transparent to UV light such as quartz, an operation of opening the cover 110 may not be necessary.

When curing of the UV resin is completed, the vacuum under the molding mold 20 is released and the molding mold frame 170 on which the molding mold 20 is mounted is lifted to release the molding mold 20 and the substrate 10. .

According to the above-described process sequence, even if the substrate 10 is enlarged, it is possible to prevent the occurrence of defects such as bubble generation or unmolding regardless of the flatness, and by forming a high vacuum only around the substrate 10, it is more rapid. It is possible to perform a vacuum process to improve the productivity.

As mentioned above, although preferred embodiment of this invention was described, the scope of the present invention is not limited to the said embodiment, Of course, various modification forms are possible without deviating from the essential and essential characteristic structure of this invention. Particularly, in the embodiment of the present invention, the substrate holder and the upper cover which are attached to or detached from the vacuum chamber are introduced for the efficiency of the continuous manufacturing process, but the input method of the substrate or the shape of the vacuum chamber may be modified in various ways at the level of those skilled in the art. . The foregoing embodiments are, therefore, to be considered in all respects only as illustrative and not restrictive, and the scope of the present invention is to be understood to include the matters set forth in the appended claims and all modifications that may be understood therefrom. do.

10: substrate 20: molding mold
30: transparent diaphragm
100: vacuum forming apparatus 110: cover
120: side wall 122: extension
130: bottom plate 140: vacuum chamber body
150: vacuum chamber 152,154,156,158: sealing member
162,164,166,168: Aeration line 170: Molded mold frame
180: lifting mechanism 190: ultraviolet lamp stage

Claims (22)

A substrate vacuum forming apparatus for molding a three-dimensional pattern on a resin-coated substrate, comprising: a vacuum chamber body composed of a normal side wall, a cover and a bottom plate sealing upper and lower sides of the side wall,
The vacuum chamber body includes a molding mold for transferring an optical pattern to a substrate, a liftable molding mold frame for fixing an edge of the molding mold, and a transparent diaphragm covering the molding mold and the molding mold frame and extending to sidewalls. ,
The space enclosed by the cover, the side wall and the bottom plate is divided into an upper chamber and a lower chamber by the transparent diaphragm. The method according to claim 1,
And the molding mold, the molding mold frame and the bottom plate, or the molding mold, the molding mold frame, the side wall and the bottom plate seal the space by the lowering of the molding mold frame. The method according to claim 1 or 2,
Substrate vacuum forming apparatus, characterized in that the holder is attached to the bottom plate for fixing the substrate The method according to claim 1 or 2,
And the bottom plate is detachable and configured to elevate and seal down the sidewall at the highest raised position. The method according to claim 1 or 2,
And the upper chamber and the lower chamber are capable of independently controlling pressure. The method according to claim 1 or 2,
Substrate vacuum forming apparatus, characterized in that the pressure difference in the vacuum of the upper chamber and the lower chamber is 1 to 100 torr. The method according to claim 1 or 2,
And said vent chamber communicating with said upper chamber and said lower chamber, respectively, is provided in said vacuum chamber body. The method according to claim 1 or 2,
The molding mold substrate vacuum forming apparatus, characterized in that made of a flexible and transparent plastic. The method according to claim 1 or 2,
The transparent diaphragm is a substrate vacuum forming apparatus, characterized in that made of a transparent elastic resin. The method according to claim 1 or 2,
The cover is a substrate vacuum forming apparatus, characterized in that consisting of a material which is transparent to UV light. The method according to claim 1 or 2,
An ultraviolet lamp stage is disposed above the cover, characterized in that the substrate vacuum forming apparatus. The method of claim 4,
The side wall is a substrate vacuum forming apparatus, characterized in that the cross section is formed in an L-shape in order to prevent mutual interference of the rise of the molding mold frame and the rise of the bottom plate. A substrate vacuum molding method for forming a three-dimensional pattern on a substrate,
(A) applying a resin to the substrate,
(B) mounting the substrate and the transparent diaphragm in a vacuum chamber, sealing the vacuum chamber, and then forming a vacuum in the upper and lower regions of the transparent diaphragm,
(C) contacting a molding mold with one surface of the substrate to which the resin is applied in a vacuum state,
(D) maintaining the upper region and the lower region of the molding mold to be airtight with respect to each other, and
(E) a substrate vacuum forming method comprising the step of generating a pressure difference to the molding mold in close contact with the molding mold to the substrate. The method according to claim 13,
In the step (E), the lower region of the molding mold is maintained in a vacuum state, the substrate vacuum forming method, characterized in that to release the vacuum of the upper region of the molding mold. The method according to claim 13 or 14,
After step (E), (F) curing the resin, (G) releasing the pressure difference between the upper region and the lower region of the molding mold, and (H) separating the molding mold from the substrate. Substrate vacuum forming method, characterized in that. The method according to claim 13 or 14,
In the step (B), the pressure difference between the upper region and the lower region of the transparent diaphragm, characterized in that 1 to 100 torr. The method according to claim 13 or 14,
And the resin is a UV resin. The method according to claim 13 or 14,
The molding mold is a substrate vacuum forming method, characterized in that made of a flexible and transparent plastic. The method according to claim 13 or 14,
The transparent diaphragm is a substrate vacuum forming method, characterized in that made of a transparent elastic resin. 18. The method of claim 17,
The vacuum forming method of the substrate, characterized in that the step (A) is carried out by a silk printing process in a vacuum. 18. The method of claim 17,
The step (A) is carried out by a silk printing apparatus provided with a precision nozzle for discharging the UV resin on the silk plate by an amount capable of coating the substrate 1 to 10 times. 19. The method of claim 18,
After the step (E), the substrate vacuum forming method, characterized in that for irradiating the ultraviolet light to the substrate through the molding mold.

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