KR20120082666A - Display apparatus - Google Patents

Abstract

PURPOSE: A display device is provided to effectively emit heat of a driving element by connecting the driving element with a back cover. CONSTITUTION: A frame(14) is arranged behind a display panel. A driving board(15) is arranged on the frame. A plurality of driving elements are mounted on the driving board. A back cover(13) is arranged behind the driving board. At least one of the driving elements is connected to the back cover. The driving elements include first and second driving elements. The first driving element is connected to the back cover. The second driving element is not connected to the back cover.

Description

Display device {Display Apparatus}

The present invention relates to a display device.

As the information society develops, the demand for display devices is increasing in various forms, and in recent years, liquid crystal display devices (LCDs), plasma display panels (PDPs), electro luminescent displays (ELDs), and vacuum fluorescents (VFDs) have been developed. Various display devices such as displays have been researched and used. Among them, the liquid crystal panel of the LCD includes a TFT substrate and a color filter substrate facing each other with the liquid crystal layer and the liquid crystal layer interposed therebetween, and can display an image using light provided from the backlight unit.

It is an object of the present invention to provide a display device in which a driving device and a back cover are connected to effectively discharge heat generated from the driving device.

The display apparatus according to the present invention includes a display panel, a frame disposed at the rear of the display panel, a driving board disposed on the frame, and a back cover disposed at the rear of the driving board, on which the plurality of driving elements are mounted. At least one of the plurality of driving elements mounted on the driving board may be connected to the back cover.

In addition, the plurality of driving devices may include a first driving device and a second driving device, the first driving device may be connected to the back cover, and the second driving device may not be connected to the back cover.

In addition, the maximum temperature of heat generated by the first driving device during driving may be higher than the maximum temperature of heat generated by the second driving device.

In addition, the first driving device may be in contact with the back cover.

In addition, an adhesive layer may be disposed between the first driving element and the back cover.

In addition, the adhesive layer may include metal particles.

In addition, an elastic layer having elasticity may be disposed between the first driving element and the back cover.

In addition, the elastic layer may include a thermally conductive material.

In addition, a hole is formed in the back cover, and the hole may be positioned around the first driving device.

The second driving device may be a driving device having the highest height measured from the driving board among the plurality of driving devices that are not connected to the back cover.

In addition, a distance between the third driving device closest to the first driving device and the first driving device may be greater than a distance between the fourth driving device closest to the second driving device and the second driving device. .

In addition, the height of the third driving device may be lower than the height of the fourth driving device.

In addition, the maximum temperature of heat generated by the third driving device during driving may be lower than the maximum temperature of heat generated by the fourth driving device.

In addition, a portion of the back cover connected to the first driving device may be provided with a depression recessed in a direction toward the first driving device.

In addition, a thickness of a portion of the back cover connected to the first driving element may be greater than a thickness of a portion overlapping with the second driving element.

In addition, a thermally conductive block is disposed between the back cover and the first driving device, and an adhesive layer or elasticity is disposed between the thermally conductive block and the back cover and / or between the thermally conductive block and the first driving device. Layers can be arranged.

In addition, the heat conduction block may include a plurality of heat dissipation fins.

In addition, there is no fan for circulating air between the back cover and the frame.

In addition, another display device according to the present invention includes a display panel, a frame disposed at the rear of the display panel, a drive board disposed on the frame, a plurality of driving elements mounted thereon, a back cover disposed at the rear of the drive board, A heat spreading plate disposed on the back cover between the driving board and the back cover, wherein at least one of the plurality of driving elements mounted on the driving board may be connected to the heat diffusion plate.

The plurality of driving devices may include a first driving device and a second driving device, the first driving device may be connected to the heat diffusion plate, and the second driving device may not be connected to the heat diffusion plate.

In addition, the thermal diffusion plate may extend to an area overlapping with the second driving device.

In addition, a heat transfer layer may be further disposed between the heat diffusion plate and the back cover.

In addition, another display apparatus according to the present invention includes a display panel, a frame disposed behind the display panel, a stand box disposed below the display panel, and a supporter for connecting the frame and the stand box. The stand box includes a base frame, a drive board disposed on the base frame and having a plurality of drive elements mounted thereon, a box cover disposed behind the drive board, between the drive board and the box cover. A heat spreading plate may be disposed on the cover, and at least one of the plurality of driving elements mounted on the driving board may be connected to the heat spreading plate.

The display device according to the present invention can effectively discharge the heat generated by the drive device by connecting the drive device and the back cover disposed on the drive board to increase the thermal stability of the drive device, the heat generated from the drive device display panel There is an effect that can be suppressed from being delivered to.

1 is a view for schematically explaining a configuration of a display device according to the present invention;
2 to 18 are views for explaining the configuration of the display device according to the invention in more detail;
19 to 22 are views for explaining another display device according to the present invention; And
23 to 24 illustrate another display apparatus according to the present invention.

Hereinafter, a display apparatus according to the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, terms such as first and second may be used to describe various components, but the components may not be limited by the terms. The terms may be used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The term and / or may include a combination of a plurality of related items or any item of a plurality of related items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a view for schematically explaining a configuration of a display apparatus according to the present invention.

Referring to FIG. 1, a display device according to the present invention includes a display panel 10, an optical layer 11, a back light unit 12, a frame 14, a driving board 150, and a display panel 10. It may include a back cover (13).

Although not shown, various types of display panels, such as a liquid crystal display panel, a plasma display panel, and an organic light emitting panel (OLED), are applied to the display panel 10 displaying an image in the present invention. It is possible to be.

Herein, it will be assumed that the display panel 10 is a liquid crystal display panel.

The optical layer 11 may be composed of a plurality of sheets. For example, although not shown, the optical layer 11 may include at least one of a prism sheet and a diffusion sheet.

The backlight unit 12 may be disposed behind the optical layer 11. Although not shown, the backlight unit 12 may include at least one light source.

Various types of light sources can be applied to the present invention. For example, the light source may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this case, the light source may be a colored LED or a white LED emitting at least one of colors such as red, blue, green, and the like.

The frame 14 may be disposed behind the backlight unit 12. Such a frame 14 may provide a supporting force for supporting the backlight unit 12.

The driving board 15 may be disposed behind the frame 14. The driving board 15 may supply a driving signal to the electrode of the display panel 10. In addition, the driving board 15 may supply a driving signal to the backlight unit 12.

The back cover 13 may be disposed behind the driving board 15.

Here, the optical layer 11 may be in close contact with the display panel 10. Alternatively, the backlight unit 12 may be in close contact with the optical layer 11. In this case, the thickness of the display device according to the present invention can be reduced.

In FIG. 1, only the case of a direct type backlight unit is illustrated, but in the present invention, an edge type backlight unit may also be applied.

2 to 18 are views for explaining the configuration of the display device according to the present invention in more detail. Hereinafter, the description of the parts described in detail above will be omitted.

Referring to FIG. 2, a plurality of driving elements 100 and 110 may be disposed on the driving board 15. For example, chipsets such as a capacitor and a CPU may be disposed on the driving board 15.

Hereinafter, it is assumed that the first driving device 100 and the second driving device 110 are disposed on the driving board 15. Here, it is assumed that the maximum temperature of heat generated by the first driving device 100 during driving is higher than the maximum temperature of heat generated by the second driving device 110. That is, the calorific value of the first driving device 100 may be higher than the calorific value of the second driving device 110. For example, the first driving device 100 may be a central processing unit (CPU) for processing data on an image supplied to the display panel, and the second driving device 110 may be a capacitor.

At least one of the plurality of driving devices 100 and 110 disposed on the driving board 15 may be connected to the back cover 13.

For example, as in the case of FIG. 3, the first driving device 100 having a larger amount of heat than the second driving device 110 is connected to the back cover 130, and the second driving device 110 is the back cover. It may not be connected to (13).

In addition, a thermally conductive block 200 may be disposed between the back cover 13 and the first driving device 100 to connect the first driving device 100 to the back cover 13D.

In this case, the first driving device 100 may be regarded as indirectly contacting the back cover 13 through the thermal conductive block 200.

As such, when the first driving device 100 is connected to the back cover 13, heat generated in the first driving device 100 may be easily transferred to the back cover 13 when driving. Accordingly, it is possible to prevent the heat of the first driving device 100 from being excessively increased during driving. In addition, by preventing the heat generated from the first driving device 100 from being transmitted to the display panel, the display panel may be thermally damaged or the image quality of the display panel may be deteriorated.

If the first driving device 100 is not connected to the back cover 13, in order to effectively dissipate heat generated by the first driving device 100, as in the case of FIG. 4, the back cover 13 may be used. Between the frame 14 and, preferably, the side of the back cover 13 may be provided with a ventilation fan (Fan, 300) for heat generation.

In this case, additional power is consumed to drive the fan 300, and thus power consumption may increase, and noise may occur according to the driving of the fan 300. In addition, according to the driving of the fan 300. Foreign matter such as dust may accumulate between the back cover 13 and the frame 14.

On the other hand, when the first driving device 100 is connected to the back cover 13 as in the present invention, for example, the thermal conductive block 200 is disposed between the first driving device 100 and the back cover 13. When the first driving device 100 and the back cover 13 are connected, heat generated from the first driving device 100 is effectively transferred to the back cover 13, so that the first driving device (even without the fan 300) is provided. The heat generated in 100) can be effectively discharged.

Accordingly, in the present invention, as in the case of Figure 5, the fan 300 can be omitted.

The thermally conductive block 200 may be made of a material having excellent thermal conductivity in order to effectively transfer heat generated from the first driving device 100 to the back cover 13.

For example, the thermally conductive block 200 may be made of a metal material such as aluminum (Al) or silver (Ag). Alternatively, the thermally conductive block 200 may include a ceramic material.

Referring to FIG. 6, the heat conduction block 200 may include a plurality of heat dissipation fins 210.

In this case, while the heat generated from the first driving device 100 is transferred to the back cover 13 by the heat conducting block 200, the heat conducting block 200 serves as a heat sink of the first driving device 100. Since it is possible to more efficiently discharge the heat generated in the first drive element (100).

In the above description, only the case where the heat conduction block 200 is disposed between the first drive element 100 and the back cover 13 is described. However, the first drive element 100 is not used without the heat conduction block 200. It may also be possible to connect the back cover 13 with.

For example, as shown in FIG. 7, the thickness of a portion of the back cover 13 connected to the first driving device 100, that is, a portion of the back cover 13 overlapping the first driving device 100 ( t1) may be thicker than the thickness t2 of another portion, for example, the portion overlapping with the second driving element 110.

As such, when the thickness t1 of the portion of the back cover 13 connected to the first driving device 100 is increased, the back cover 13 may be attached to the first driving device 100 without using the heat conductive block 200. In addition to being able to connect, it is possible to more effectively discharge the heat generated in the first driving device (100).

Alternatively, as shown in FIG. 8, a portion of the back cover 13 connected to the first driving device 100 is recessed in a predetermined depth H1 in the direction toward the first driving device 100. It is possible to be formed.

In other words, a part of the back cover 13 is bent toward the driving board 14 so that a part of the bent back cover 13 may be connected to the first driving device 100.

In the case of FIGS. 7 to 8, the first driving device 100 may be in contact with the back cover 13, preferably in direct contact.

In this case, it is possible to transfer heat generated in the first driving device 100 to the back cover 13 more quickly.

Alternatively, as shown in FIG. 9A, an adhesive layer 900 may be disposed between the back cover 13 and the first driving device 100. Here, the case in which the recessed portion 800 is formed in the back cover 13 is described as an example. However, as shown in FIG. 7, the thickness of the portion of the back cover 13 connected to the first driving device 100 is This may also be the case when thicker than other parts.

As such, when the adhesive layer 900 is disposed between the back cover 13 and the first driving device 100, the adhesive layer (eg, the adhesive layer 900) may be used to effectively transfer heat generated from the back cover 13 to the first driving device 100. 900 may preferably include a thermally conductive material.

For example, as in the case of FIG. 9B, the adhesive layer 900 may include metal particles 910.

In this case, the heat generated from the first driving device 100 can be effectively transferred to the back cover 13 while the first driving device 100 is firmly attached to the back cover 13.

Alternatively, as in the case of FIG. 10A, an elastic layer 1000 having elasticity may be disposed between the back cover 13 and the first driving device 100. Here, the case in which the recessed portion 800 is formed in the back cover 13 is described as an example. However, as shown in FIG. 7, the thickness of the portion of the back cover 13 connected to the first driving device 100 is This may also be the case when thicker than other parts.

As such, when the elastic layer 1000 is disposed between the back cover 13 and the first driving device 100, the elastic layer 1000 may be elastic to effectively transfer heat generated from the back cover 13 to the first driving device 100. Layer 1000 may preferably comprise a thermally conductive material. For example, the elastic layer 1000 may include metal particles.

As such, when the elastic layer 1000 is disposed between the back cover 13 and the first driving device 100, the elastic layer 1000 may have the back cover 13 as in the case of FIG. 10B. It can be pressed by the pressure applied. In addition, the elastic layer 1000 may include a portion that is pressed by the back cover 13 located on the side of the back cover (13).

In this case, it is possible to prevent the first driving device 100 from being damaged by the collision between the back cover 13 and the first driving device 100, and the heat generated from the first driving device 100 may be stored in the back cover ( It is possible to easily transfer to 13).

Alternatively, as shown in FIG. 11, a hole 1100 may be formed in the back cover 13, and the hole 1100 may be positioned around the first driving device 100.

Air may be introduced into the space between the back cover 13 and the frame 14 from the outside through the hole 1100 formed in the back cover 13, the temperature of the heat conductive block 200 by the introduced air Can be lowered. As a result, it is possible to more effectively discharge heat generated from the first driving device 100.

Alternatively, the adhesive layer 900 or the elastic layer 1000 may be disposed between the thermally conductive block 200 and the back cover 13 and / or between the thermally conductive block 200 and the first driving device 100. .

For example, as in the case of FIG. 12, the adhesive layer 900 is disposed between the first driving element 100 and the thermal conductive block 200, and is elastically disposed between the thermal conductive block 200 and the back cover 13. Layer 1000 may be disposed. Alternatively, unlike FIG. 12, the elastic layer 1000 is disposed between the first driving device 100 and the thermal conductive block 200, and the adhesive layer 900 is disposed between the thermal conductive block 200 and the back cover 13. This can be arranged.

Alternatively, a heat spreading plate 1300 disposed between the back cover 13 and the driving board 15 to dissipate heat generated by the first driving device 100 more effectively. It may further include.

The thermal diffusion plate 1300 may be preferably made of a thermally conductive material in order to diffuse the heat generated from the first drive board 100 effectively. For example, the thermal diffusion plate 1300 may include aluminum (Al).

As such, when the heat diffusion plate 1300 is disposed on the back cover 13, the heat diffusion plate 1300 may sufficiently diffuse the heat generated from the first driving board 100, so that the back cover 13 may be a thermally conductive material. It may be made of a material that does not include or low thermal conductivity. For example, the back cover 13 can be made of a plastic material.

In this case, it can be seen that the first driving board 100 is connected to the thermal diffusion plate 1300. Alternatively, the first driving board 100 may be viewed as being indirectly connected to the back cover 13 through the heat diffusion plate 1300. In other words, at least one of the plurality of driving elements may be connected to the thermal diffusion plate 1300.

Here, only the case in which the heat conduction block 200 is disposed between the heat diffusion plate 1300 and the first driving board 100 is illustrated, but as in the case of FIGS. 7 to 8, the heat conduction block 200 is omitted. It may be possible to be. In addition, the adhesive layer 900 is omitted between the first driving device 100 and the thermal conductive block 200, and the elastic layer 1000 is disposed or disposed between the thermal conductive block 200 and the thermal diffusion plate 1300. It may not be.

In addition, since the thermal diffusion plate 1300 performs a function of widely spreading the heat generated from the first driving board 100, the thickness t11 of the thermal diffusion plate 1300 may be sufficiently thick. That is, the thickness t11 of the thermal diffusion plate 1300 may be thicker than the thickness t10 of the back cover 13.

In addition, the thermal diffusion plate 1300 may not be connected to the second driving device 110. As such, the thermal diffusion plate 1300 may not be connected to the second driving device 110 but may extend to an area overlapping the second driving device 110.

For example, as in the case of FIG. 14A, the thermal diffusion plate 1300 may be formed on a substantially front surface of the back cover 13.

Alternatively, as in the case of FIG. 14B, the thermal diffusion plate 1300 may not be disposed in the predetermined first area AR1 on the back cover 13. Here, the first region AR1 may be a region in which the second driving element 110 is located on the back cover 13. In other words, the thermal diffusion plate 1300 may be omitted in the region AR1 overlapping the second driving element 110.

As such, when the thermal diffusion plate 1300 is omitted in the area AR1 overlapping the second driving device 110, the height of the second driving device 110 may be high enough. That is, when the height of the second driving device 110 is sufficiently high so that the thermal diffusion plate 1300 extends to the first area AR1, the second driving device 110 collides with the thermal diffusion plate 1300 and thus the second driving device 110 is extended. In the case where the driving device 110 may be damaged, the thermal diffusion plate 1300 may be omitted in the first region AR1.

Alternatively, the heat transfer layer 1500 may be disposed between the heat diffusion plate 1300 and the back cover 13 to effectively transfer the heat diffused by the heat diffusion plate 1300 to the back cover 13. The heat transfer layer 1500 may be an electrolytic galvanized iron (EGI) layer.

Here, the thickness t20 of the heat transfer layer 1500 may be smaller than the thickness t10 of the back cover 13 and the thickness t11 of the heat diffusion plate 1300.

Meanwhile, another driving device may be disposed around the first driving device 100 and around the second driving device 110.

For example, as shown in FIG. 16, at least one driving device 1600, 1610, and 1620 may be disposed around the first driving device 100 and around the second driving device 110. Here, the second driving device 110 may have a height W1 measured from the driving board 15 among the plurality of driving devices higher than the heights W2, W3, and W4 of other driving devices. That is, among the plurality of driving elements that are not connected to the back cover 13, among the plurality of driving elements disposed on the driving board 15, the driving element having the highest height measured from the driving board 15 is selected as the second driving element ( 110).

Here, the driving device 1600 which is closest to the first driving device 100 among the plurality of driving devices is called the third driving device 1600, and the driving device 1610 which is closest to the second driving device 110 is referred to as the third driving device 1600. Assume that it is four driving elements 1610.

In this case, the distance L1 between the third driving device 1600 and the first driving device 100 may be greater than the distance L2 between the second driving device 110 and the fourth driving device 1610.

That is, the first driving device 100 having a large amount of heat generated on the driving board 15 is spaced apart from other driving devices. In this case, the high heat generated in the first driving device 100 can be suppressed from affecting other driving devices. In addition, it is possible to suppress the temperature of the first driving device 100 from rising due to heat generated by other driving devices.

In addition, the height W4 of the third driving device 1600 disposed in close proximity to the first driving device 100 is the height W2 of the fourth driving device 1610 disposed in close proximity to the second driving device 110. Can be lower than). That is, by arranging relatively low height driving elements around the first driving element 100 having a large amount of heat generated, the first driving element 100 is caused by air introduced through the hole 1100 formed in the back cover 13. It is possible to lower the temperature of Mn more effectively.

In addition, the maximum temperature of heat generated in the third driving device 1600 disposed in close proximity to the first driving device 100 may be generated in the fourth driving device 1610 disposed in close proximity to the second driving device 110. It may be lower than the maximum temperature of the heat. In this case, the temperature of the first driving device 100 can be lowered more effectively.

Referring to FIG. 17, it can be seen that relatively low height driving elements are disposed around the first driving element 100 having a large amount of heat generated. On the other hand, relatively high height driving elements may be disposed around the second driving element 110.

FIG. 18 illustrates data obtained by measuring heat of a display apparatus according to the present invention and a display apparatus according to another embodiment of the present invention.

The data in FIG. 18B is data of the display device according to the present invention. As shown in FIG. 15, the heat conduction block 200 is disposed between the back cover 13 and the first driving device 100. The heat diffusion plate 1300 is disposed between the heat conduction block 200 and the back cover 13, and the heat transfer layer 1500 made of an electrogalvanized steel sheet is disposed between the heat diffusion plate 1300 and the back cover 13. Column data in the case of arranging.

FIG. 18A illustrates thermal data of a display apparatus according to a comparative example in which the first driving device 100 and the back cover 13 are not connected differently from the present invention.

Referring to FIG. 18A, it can be seen that heat is concentrated in a region in which the first driving device 100 is disposed, thereby having a high temperature.

On the other hand, referring to FIG. 18B, it can be seen that the heat generated in the first driving device 100 is effectively discharged so that the temperature of the region where the first driving device 100 is disposed is sufficiently low.

19 to 22 are views for explaining another display device according to the present invention. Hereinafter, the description of the parts described in detail above will be omitted. For example, the first driving device 100 and the back cover 13 are connected to the following display device.

19 and 20, the driving board 15 may be disposed in a specific area of the frame 14. For example, as in the case of FIG. 19, the frame 14 may have a substantially quadrangular plate shape, and the driving board 15 may be disposed in the second long side (LS2) region of the frame 14. Can be deployed.

Here, the second long side LS2 faces the first long side LS1, and the second long side LS2 has a first short side SS1 and a second short side SS1. May be disposed adjacent to SS2). Here, the first long side LS1 of the frame 14 may be referred to as a first region, and the second long side LS2 may be referred to as a second region.

In this case, the distance L1 between the first area LS1 of the frame 14 and the driving board 15 is between the second area L2 and the driving board 15 facing the first area LS1. It may be larger than the interval L2.

In other words, when the driving board 15 disposed at the rear of the frame 14 is disposed close to the second long side LS2 of the frame 14, the back cover 13 also has a second position of the frame 14. It is possible to be biased toward the long side LS2.

As such, the back cover 13 disposed at the rear of the driving board 15 may cover only a part of the frame 14 without covering the entire area of the frame 14.

In this case, the back cover 13 may be connected to or fixed to the frame 14.

In addition, as in the case of FIG. 21, the wall supporter 2110 may be disposed on the rear surface of the frame 14. In FIG. 21, reference numeral 2100 disposed on the front of the frame 14 may be a display module including a display panel. The display device according to FIG. 21 may be referred to as a wall-mounted display device.

Here, the height R1 of the wall supporter 2110 measured from the frame 14 may be higher than the maximum height R2 of the back cover 13 measured from the frame 14.

In this case, even when the display device according to the present invention is fixed to a predetermined wall, the wall and the back cover 13 are spaced apart by a predetermined distance, so that the first driving device 100 connected to the back cover 13 is separated. The heat generated can be discharged effectively.

Alternatively, it is possible to provide a space through which air can flow between the frame 14 and the back cover 13.

For example, as shown in FIG. 22, the base layer 2200 is disposed on the rear surface of the frame 14, the support means 2210 such as a pemnut is disposed on the base layer 2200, and the support means. The driving board 15 may be disposed at 2210.

In addition, the back cover 13 may be connected to the base layer 2200. Here, the back cover 13 may be connected to the base layer 2200 by using a predetermined fastening means 2220 such as a screw such that the back cover 13 and the frame 14 are spaced apart from each other by a predetermined distance. In this case, air is introduced from the outside between the back cover 13 and the frame 14 to sufficiently lower the temperature of the driving elements disposed on the driving board 15.

23 to 24 illustrate another display apparatus according to the present invention. Hereinafter, the description of the parts described in detail above will be omitted. The following display apparatus may be referred to as a stand type display apparatus.

Referring to FIG. 23, another display device according to the present invention includes a stand box 1900 disposed below the display panel 10 and a frame 14 and a stand box disposed at the rear of the display panel 10. It may include a supporter (1910) connecting the (1900).

In this configuration, the driving board may be disposed in the stand box 1900. That is, image data may be supplied from the stand box 1900 to the display panel 10. To this end, a cable for transmitting a driving signal or image data to the display panel 10 may be disposed in the supporter 1910.

Here, the stand box 1900 is, as in the case of Figure 24, the drive board 2010, the drive board disposed on the base frame 2000, the base frame 2000, the plurality of drive elements (100, 110) are mounted It may include a box cover 2020 disposed behind the (2010).

In addition, at least one of the plurality of driving devices 100 and 110 may be connected to the box cover 2020.

Such a configuration may correspond to the configuration described with reference to FIGS. 1 to 22.

For example, the base frame 2000 may correspond to the frame 14, the driving board 2010 may correspond to the driving board 15, and the box cover 2020 may correspond to the back cover 13. Can be. Since the frame 14, the back cover 13, and the driving board 15 have been described in detail above, the configuration of FIGS. 23 to 24 can be sufficiently inferred from the configuration of FIGS. 1 to 22.

In addition, the driving board 2010 may further include a heat diffusion plate 2040 disposed on the box cover 2020 between the box cover 2020. The thermal diffusion plate 2040 may correspond to the thermal diffusion plate 1300 described above.

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the appended claims rather than the foregoing detailed description, and the meaning and scope of the claims are as follows. And all changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

Claims (23)

Display panel;
A frame disposed at the rear of the display panel;
A driving board disposed in the frame and having a plurality of driving elements mounted thereon; And
A back cover disposed at the rear of the driving board;
Including,
And at least one of a plurality of driving elements mounted on the driving board is connected to the back cover. The method of claim 1,
The plurality of driving devices includes a first driving device and a second driving device,
The first driving device is connected to the back cover, and the second driving device is not connected to the back cover. The method of claim 2,
And a maximum temperature of heat generated by the first driving device during driving is higher than a maximum temperature of heat generated by the second driving device. The method of claim 2,
The first driving device is in contact with the back cover. The method of claim 2,
And a bonding layer disposed between the first driving element and the back cover. The method of claim 5, wherein
The adhesive layer comprises a metal particle. The method of claim 2,
And a resilient elastic layer disposed between the first driving element and the back cover. The method of claim 7, wherein
The elastic layer is a display device including a thermally conductive material. The method of claim 2,
A hole is formed in the back cover, and the hole is positioned around the first driving element. The method of claim 2,
And the second driving device is a driving device having the highest height measured from the driving board among the plurality of driving devices not connected to the back cover. 11. The method of claim 10,
And a distance between the third driving element closest to the first driving element and the first driving element is greater than a distance between the fourth driving element closest to the second driving element and the second driving element. The method of claim 11,
And a height of the third driving element is lower than that of the fourth driving element. The method of claim 11,
The maximum temperature of the heat generated by the third driving device during the driving is lower than the maximum temperature of the heat generated by the fourth driving device. The method of claim 2,
And a recessed portion formed in the back cover to be connected to the first driving device in a direction toward the first driving device. The method of claim 2,
And a thickness of a portion of the back cover connected to the first driving element is greater than a thickness of a portion overlapping with the second driving element. The method of claim 2,
A thermal conductive block is disposed between the back cover and the first driving element, and an adhesive layer or an elastic layer is disposed between the thermal conductive block and the back cover and / or between the thermal conductive block and the first driving element. Display device to be disposed. 17. The method of claim 16,
The thermally conductive block includes a plurality of heat dissipation fins. The method of claim 1,
And a fan for circulating air between the back cover and the frame. Display panel;
A frame disposed at the rear of the display panel;
A driving board disposed in the frame and having a plurality of driving elements mounted thereon;
A back cover disposed at the rear of the driving board;
A heat spreading plate disposed on the back cover between the driving board and the back cover;
Including,
And at least one of a plurality of driving elements mounted on the driving board is connected to the heat diffusion plate. The method of claim 19,
The plurality of driving devices includes a first driving device and a second driving device,
The first driving device is connected to the heat diffusion plate, the second driving device is not connected to the heat diffusion plate. 21. The method of claim 20,
The thermal diffusion plate extends to an area overlapping the second driving element. The method of claim 19,
And a heat transfer layer between the heat diffusion plate and the back cover. Display panel;
A frame disposed at the rear of the display panel;
A stand box disposed under the display panel; And
A supporter connecting the frame and the stand box;
Including,
The stand box
A base frame;
A driving board disposed on the base frame and having a plurality of driving elements mounted thereon;
A box cover disposed at the rear of the driving board;
A heat spreading plate disposed in the box cover between the driving board and the box cover;
Including,
And at least one of a plurality of driving elements mounted on the driving board is connected to the heat diffusion plate.

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