KR101848874B1 - Display Apparatus - Google Patents

Abstract

The present invention relates to a display device.
A display device according to the present invention includes a display panel, a frame disposed at the rear of the display panel, a driving board mounted on the frame, the driving board having a plurality of driving elements mounted thereon, and a back cover disposed behind the driving board, At least one of the plurality of driving elements mounted on the driving board may be connected to the back cover.

Description

Display Apparatus [0001]

The present invention relates to a display device.

(PDP), Electro Luminescent Display (ELD), Vacuum Fluorescent Display (VFD), and the like have been developed in recent years in response to the demand for display devices. Display) have been studied and used. Among them, a liquid crystal panel of an LCD includes a TFT substrate and a color filter substrate which are opposed to each other with a liquid crystal layer and a liquid crystal layer interposed therebetween, and an image can be displayed using light provided from the backlight unit.

An object of the present invention is to provide a display device in which a driving element and a back cover are connected to effectively discharge heat generated from a driving element.

A display device according to the present invention includes a display panel, a frame disposed at the rear of the display panel, a driving board mounted on the frame, the driving board having a plurality of driving elements mounted thereon, and a back cover disposed behind the driving board, At least one of the plurality of driving elements mounted on the driving board may be connected to the back cover.

The plurality of driving elements may include a first driving element and a second driving element, the first driving element may be connected to the back cover, and the second driving element may not be connected to the back cover.

In addition, the maximum temperature of the heat generated in the first driving device during driving may be higher than the maximum temperature of the heat generated in the second driving device.

In addition, the first driving element may contact the back cover.

An adhesive layer may be disposed between the first driving element and the back cover.

Further, the adhesive layer may include metal particles.

An elastic layer having elasticity may be disposed between the first driving element and the back cover.

In addition, the elastic layer may include a thermally conductive material.

Further, a hole may be formed in the back cover, and the hole may be located around the first driving element.

The second driving element may be a driving element having the highest height measured from the driving board among the plurality of driving elements not connected to the back cover.

The distance between the third driving element closest to the first driving element and the first driving element may be greater than the distance between the fourth driving element closest to the second driving element and the second driving element .

The height of the third driving element may be lower than the height of the fourth driving element.

In addition, the maximum temperature of the heat generated in the third driving device during driving may be lower than the maximum temperature of the heat generated in the fourth driving device.

In addition, a portion of the back cover connected to the first driving element may be formed with a depressed portion that is recessed toward the first driving element.

The thickness of the portion of the back cover connected to the first driving element may be greater than the thickness of the portion overlapping the second driving element.

In addition, a heat conductive block is disposed between the back cover and the first driving element, and an adhesive layer or elasticity is provided between the heat conductive block and the back cover and / or between the heat conductive block and the first driving element. Layer can be disposed.

The heat conduction block may include a plurality of heat dissipation fins.

Between the back cover and the frame, there is no fan for circulating air.

According to another aspect of the present invention, there is provided a display apparatus including a display panel, a frame disposed at a rear side of the display panel, a driving board disposed at the frame, the driving board having a plurality of driving elements mounted thereon, And a heat spreading plate disposed on the back cover between the driving board and the back cover. At least one of the plurality of driving elements mounted on the driving board may be connected to the thermal diffusion plate.

The plurality of driving elements may include a first driving element and a second driving element, the first driving element may be connected to the thermal diffusion plate, and the second driving element may not be connected to the thermal diffusion plate.

In addition, the thermal diffusion plate may extend to a region overlapping with the second driving device.

Further, a heat transfer layer may be further disposed between the thermal diffusion plate and the back cover.

According to another aspect of the present invention, there is provided a display device including a display panel, a frame disposed behind the display panel, a stand box disposed under the display panel, and a supporter connecting the frame and the stand box, Wherein the stand box comprises a base frame, a drive board disposed on the base frame, the drive board having a plurality of drive elements mounted thereon, a box cover disposed behind the drive board, And a heat spreading plate disposed on the cover, and at least one of the plurality of driving elements mounted on the driving board may be connected to the thermal diffusion plate.

The display device according to the present invention can effectively dissipate heat generated in the driving element by connecting the driving element disposed on the driving board and the back cover to improve the thermal stability of the driving element, And the like.

1 is a schematic view for explaining a configuration of a display device according to the present invention;
FIGS. 2 to 18 are views for explaining the configuration of a display device according to the present invention in more detail; FIG.
19 to 22 are views for explaining another display device according to the present invention; And
23 to 24 are views for explaining another display device according to the present invention.

Hereinafter, a display device according to the present invention will be described in detail with reference to the accompanying drawings.

While the invention is susceptible to various modifications and alternative forms, specific embodiments thereof are shown by way of example in the drawings and will herein be described in detail. It is to be understood that the present invention is not intended to be limited to the specific embodiments but includes all changes, equivalents, and alternatives falling within the spirit and scope of the present invention.

In describing the present invention, the terms first, second, etc. may be used to describe various components, but the components may not be limited by the terms. The terms may only be used for the purpose of distinguishing one element from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The term " and / or " may include any combination of a plurality of related listed items or any of a plurality of related listed items.

When an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may be present in between Can be understood. On the other hand, when it is mentioned that an element is "directly connected" or "directly connected" to another element, it can be understood that no other element exists in between.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. The singular expressions may include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises", "having", and the like are used interchangeably to designate one or more of the features, numbers, steps, operations, elements, components, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, or combinations thereof.

Unless otherwise defined, all terms used herein, including technical or scientific terms, may have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in commonly used dictionaries can be interpreted as having a meaning consistent with the meaning in the context of the relevant art and are, unless expressly defined in the present application, interpreted in an ideal or overly formal sense .

In addition, the following embodiments are provided to explain more fully to the average person skilled in the art. The shapes and sizes of the elements in the drawings and the like can be exaggerated for clarity.

1 is a schematic view for explaining a configuration of a display device according to the present invention.

1, a display device according to the present invention includes a display panel 10, an optical layer 11, a backlight unit 12, a frame 14, a driving board 150, And a back cover 13 as shown in FIG.

Although not shown, the display panel 10 for displaying an image in the present invention may be applied to various types of display panels such as a liquid crystal display panel, a plasma display panel, and an organic light emitting panel (OLED) .

Here, it is assumed that the display panel 10 is a liquid crystal display panel.

The optical layer 11 may be composed of a plurality of sheets. For example, the optical layer 11 may include at least one of a prism sheet and a diffusion sheet, though not shown.

The backlight unit 12 may be disposed behind the optical layer 11. Although not shown, the backlight unit 12 may include at least one light source.

Various types of light sources can be applied to the present invention. For example, the light source may be one of a light emitting diode (LED) chip or a light emitting diode package having at least one light emitting diode chip. In this case, the light source may be a colored LED or a white LED that emits at least one color among colors such as red, blue, green, and the like.

A frame 14 may be disposed behind the backlight unit 12. [ Such a frame 14 can provide a supporting force for supporting the backlight unit 12. [

The driving board 15 may be disposed behind the frame 14. [ The driving board 15 can supply a driving signal to the electrodes of the display panel 10. In addition, the driving board 15 is capable of supplying a driving signal to the backlight unit 12.

A back cover 13 may be disposed behind the driving board 15.

Here, the optical layer 11 may be in close contact with the display panel 10. Alternatively, the backlight unit 12 may be in close contact with the optical layer 11. In this case, the thickness of the display device according to the present invention can be reduced.

Although only a direct type backlight unit is shown in FIG. 1, an edge type backlight unit can also be applied in the present invention.

2 to 18 are views for explaining the configuration of a display device according to the present invention in more detail. Hereinafter, the description of the parts described in detail above will be omitted.

Referring to FIG. 2, a plurality of driving elements 100 and 110 may be disposed on the driving board 15. For example, the driving board 15 may be provided with chipsets such as a capacitor and a CPU.

Hereinafter, it is assumed that the first driving element 100 and the second driving element 110 are disposed on the driving board 15. [ Here, it is assumed that the maximum temperature of the heat generated by the first driving device 100 at the time of driving is higher than the maximum temperature of the heat generated by the second driving device 110. That is, the amount of heat generated by the first driving device 100 may be higher than the amount of heat generated by the second driving device 110. For example, the first driving device 100 may be a central processing unit (CPU) for processing data supplied to the display panel, and the second driving device 110 may be a capacitor.

At least one of the plurality of driving elements 100 and 110 disposed on the driving board 15 may be connected to the back cover 13. [

3, the first driving element 100 having a larger heating value than the second driving element 110 is connected to the back cover 130, and the second driving element 110 is connected to the back cover 130. In this case, (Not shown).

In addition, a heat conductive block 200 may be disposed between the back cover 13 and the first driving element 100 to connect the first driving element 100 to the back cover 13.

In this case, the first driving element 100 may be seen to indirectly contact the back cover 13 through the heat conduction block 200.

When the first driving element 100 is connected to the back cover 13, heat generated in the first driving element 100 can be easily transferred to the back cover 13 during driving. Accordingly, it is possible to prevent the heat of the first driving element 100 from becoming excessively high during driving. In addition, the heat generated in the first driving device 100 is prevented from being transmitted to the display panel, thereby preventing thermal damage to the display panel or deterioration of the image quality of the image implemented by the display panel.

4, when the first driving element 100 is not connected to the back cover 13, in order to effectively discharge the heat generated from the first driving element 100, A ventilation fan (Fan) 300 for generating heat may be provided between the frame 14 and the side surface of the back cover 13, preferably.

In this case, power consumption may be increased due to additional power consumption for driving the fan 300, noise may be generated by driving the fan 300, and the fan 300 may be driven Foreign matter such as dust may accumulate between the back cover 13 and the frame 14. [

On the other hand, when the first driving device 100 is connected to the back cover 13 as in the present invention, for example, the heat conductive block 200 is disposed between the first driving device 100 and the back cover 13 When the first driving element 100 and the back cover 13 are connected to each other, the heat generated in the first driving element 100 is effectively transferred to the back cover 13, 100 can be effectively discharged.

Accordingly, in the present invention, as in the case of FIG. 5, the fan 300 can be omitted.

It may be preferable that the heat conduction block 200 is made of a material having high thermal conductivity in order to effectively transmit the heat generated from the first driving element 100 to the back cover 13. [

For example, the heat conduction block 200 can be made of a metal material such as aluminum (Al) or silver (Ag). Alternatively, the heat conduction block 200 may include a ceramic material.

Referring to FIG. 6, the heat conduction block 200 may include a plurality of heat dissipation fins 210.

In this case, the heat generated in the first driving device 100 is transferred to the back cover 13 by the heat conductive block 200, and the heat conductive block 200 serves as a heat sink of the first driving device 100 It is possible to discharge heat generated by the first driving element 100 more effectively.

Although the thermal conductive block 200 is disposed between the first driving element 100 and the back cover 13 in the above description, the first driving element 100 may be formed without using the thermal conductive block 200, And the back cover 13 may be connected to each other.

7, the thickness of the portion of the back cover 13 connected to the first driving element 100, that is, the portion of the back cover 13 overlapping the first driving element 100 (for example, t1 may be thicker than the thickness t2 of another portion, for example, a portion overlapping with the second driving element 110. [

If the thickness t1 of the portion of the back cover 13 connected to the first driving element 100 is increased, the back cover 13 can be easily attached to the first driving element 100 without using the heat conductive block 200. [ It is possible to more efficiently discharge the heat generated in the first driving element 100 as well as to connect the first driving element 100. [

8, the portion of the back cover 13 connected to the first driving element 100 may include a depressed portion 800 recessed by a predetermined depth H1 in a direction toward the first driving element 100, Can be formed.

In other words, a part of the back cover 13 is bent toward the driving board 14 so that a part of the bent back cover 13 can be connected to the first driving element 100.

7 to 8, the first driving element 100 can be in contact with the back cover 13, preferably in direct contact.

In this case, it is possible to transmit the heat generated by the first driving element 100 to the back cover 13 more quickly.

Alternatively, the adhesive layer 900 may be disposed between the back cover 13 and the first driving element 100, as in the case of FIG. 9 (A). Here, the case where the depression 800 is formed in the back cover 13 is described as an example. However, the thickness of the portion of the back cover 13 connected to the first driving element 100 It may also be the case that it is thick compared to other parts.

When the adhesive layer 900 is disposed between the back cover 13 and the first driving element 100, the heat generated from the back cover 13 is effectively transferred to the first driving element 100 through the adhesive layer 900 may preferably comprise a thermally conductive material.

For example, as in the case of FIG. 9B, the adhesive layer 900 may include metal particles 910.

In this case, the heat generated from the first driving element 100 can be effectively transmitted to the back cover 13 while firmly attaching the first driving element 100 to the back cover 13. [

Alternatively, as in the case of FIG. 10A, the elastic layer 1000 having elasticity may be disposed between the back cover 13 and the first driving element 100. Here, the case where the depression 800 is formed in the back cover 13 is described as an example. However, the thickness of the portion of the back cover 13 connected to the first driving element 100 It may also be the case that it is thick compared to other parts.

In order to effectively transmit the heat generated in the back cover 13 to the first driving element 100 when the elastic layer 1000 is disposed between the back cover 13 and the first driving element 100, The layer 1000 may preferably comprise a thermally conductive material. For example, the elastic layer 1000 may comprise metal particles.

10B, when the elastic layer 1000 is disposed between the back cover 13 and the first driving element 100, the elastic layer 1000 is separated from the back cover 13, Can be depressed by the applied pressure. In addition, the elastic layer 1000 may include a portion that is pressed by the back cover 13 and positioned on the side surface of the back cover 13. [

In this case, the first driving element 100 can be prevented from being damaged by the collision between the back cover 13 and the first driving element 100, 13). ≪ / RTI >

11, a hole 1100 may be formed in the back cover 13, and a hole 1100 may be formed around the first driving element 100. As shown in FIG.

Air can be introduced from the outside into the space between the back cover 13 and the frame 14 through the hole 1100 formed in the back cover 13 and the temperature of the heat conductive block 200 Can be lowered. Thus, it is possible to discharge the heat generated by the first driving element 100 more effectively.

Alternatively, the adhesive layer 900 or the elastic layer 1000 may be disposed between the heat conduction block 200 and the back cover 13 and / or between the heat conduction block 200 and the first driving element 100 .

12, an adhesive layer 900 is disposed between the first driving element 100 and the heat conduction block 200, and an adhesive layer 900 is provided between the heat conduction block 200 and the back cover 13. [ Layer 1000 may be disposed. 12, an elastic layer 1000 is disposed between the first driving element 100 and the heat conduction block 200 and an adhesive layer 900 is provided between the heat conduction block 200 and the back cover 13. [ Can be arranged.

Or a heat spreading plate 1300 disposed on the back cover 13 between the back cover 13 and the driving board 15 to more efficiently discharge the heat generated from the first driving element 100 .

The thermal diffusion plate 1300 may be formed of a thermally conductive material to effectively diffuse the heat generated from the first driving board 100. For example, the thermal diffusion plate 1300 may comprise an aluminum (Al) material.

When the thermal diffusion plate 1300 is disposed on the back cover 13, the thermal diffusion plate 1300 can sufficiently diffuse the heat generated from the first driving board 100, so that the back cover 13 is made of a thermally conductive material Or may be made of a material having a low thermal conductivity. For example, the back cover 13 can be made of a plastic material.

In this case, it can be seen that the first driving board 100 is connected to the thermal diffusion plate 1300. Or the first driving board 100 may be indirectly connected to the back cover 13 through the thermal diffusion plate 1300. [ In other words, at least one of the plurality of driving elements may be connected to the thermal diffusion plate 1300.

Here, only the case where the heat conduction block 200 is disposed between the thermal diffusion plate 1300 and the first driving board 100 is shown, but as in the case of FIGS. 7 to 8, the heat conduction block 200 is omitted . The adhesive layer 900 may be omitted between the first driving element 100 and the heat conduction block 200 and the elastic layer 1000 may be disposed between the heat conduction block 200 and the thermal diffusion plate 1300, .

In addition, since the thermal diffusion plate 1300 functions to spread heat generated by the first driving board 100 widely, the thickness t11 of the thermal diffusion plate 1300 may be sufficiently thick. That is, the thickness t11 of the thermal diffusion plate 1300 may be thicker than the thickness t10 of the back cover 13.

In addition, the thermal diffusion plate 1300 may not be connected to the second driving element 110. In this way, the thermal diffusion plate 1300 is not connected to the second driving element 110, but may extend to a region overlapped with the second driving element 110.

For example, as in the case of FIG. 14 (A), the thermal diffusion plate 1300 may be formed on substantially the entire surface of the back cover 13.

Alternatively, the thermal diffusion plate 1300 may not be disposed in the predetermined first region AR1 on the back cover 13, as in the case of FIG. 14 (B). Here, the first area AR1 on the back cover 13 may be a region where the second driving element 110 is located. In other words, in the region AR1 overlapping with the second driving element 110, the thermal diffusion plate 1300 can be omitted.

If the thermal diffusion plate 1300 is omitted in the region AR1 overlapping with the second driving element 110, the height of the second driving element 110 may be sufficiently high. That is, when the height of the second driving element 110 is sufficiently high to extend the thermal diffusion plate 1300 to the first area AR1, the second driving element 110 collides with the thermal diffusion plate 1300, It is possible to omit the thermal diffusion plate 1300 in the first region AR1 when there is a possibility that the driving element 110 is damaged.

Alternatively, a heat transfer layer 1500 may be disposed between the thermal diffusion plate 1300 and the back cover 13 to effectively transfer the heat diffused by the thermal diffusion plate 1300 to the back cover 13. [ The heat transfer layer 1500 may be an Electrolytic Galvanized Iron (EGI) layer.

The thickness t20 of the heat transfer layer 1500 may be smaller than the thickness t10 of the back cover 13 and the thickness t11 of the thermal diffusion plate 1300. [

On the other hand, it is also possible that another driving element is disposed around the first driving element 100 and around the second driving element 110. [

For example, as in the case of FIG. 16, at least one driving element 1600, 1610, 1620 may be disposed around the first driving element 100 and around the second driving element 110. Here, the height W1 of the second driving element 110 measured from the driving board 15 among the plurality of driving elements may be higher than the heights W2, W3 and W4 of the other driving elements. That is, the driving element having the highest height measured from the driving board 15 among the plurality of driving elements not connected to the back cover 13 among the plurality of driving elements arranged on the driving board 15 is referred to as a second driving element 110).

Here, the driving element 1600 closest to the first driving element 100 among the plurality of driving elements is referred to as a third driving element 1600, and the driving element 1610 closest to the second driving element 110 is referred to as a " 4 driving element 1610. [

The distance L1 between the third driving element 1600 and the first driving element 100 may be greater than the distance L2 between the second driving element 110 and the fourth driving element 1610. [

That is, the first driving element 100 having a large amount of heat generation on the driving board 15 is separated from other driving elements. In this case, the high heat generated in the first driving element 100 can be prevented from affecting other driving elements. Further, it is possible to suppress the temperature of the first driving element 100 from rising due to heat generated in other driving elements.

The height W4 of the third driving element 1600 disposed close to the first driving element 100 is greater than the height W2 of the fourth driving element 1610 disposed close to the second driving element 110. [ ). ≪ / RTI > That is, by arranging the driving elements relatively low in height around the first driving element 100 having a large amount of heat, the first driving element 100 is driven by the air introduced through the holes 1100 formed in the back cover 13, It is possible to more effectively lower the temperature of the exhaust gas.

The maximum temperature of the heat generated in the third driving element 1600 disposed close to the first driving element 100 is generated in the fourth driving element 1610 disposed close to the second driving element 110 May be lower than the maximum temperature of the heat. In this case, the temperature of the first driving element 100 can be lowered more effectively.

Referring to FIG. 17, it can be seen that driving elements having a relatively low height are disposed around the first driving element 100 having a large amount of heat. On the other hand, driving elements having a relatively high height may be disposed around the second driving element 110. [

Data for measuring the heat of the display device according to the present invention and the display device according to the comparative example different from the present invention are shown in Fig.

The data of FIG. 18 (B) is data of the display device according to the present invention. As shown in FIG. 15, the heat conductive block 200 is disposed between the back cover 13 and the first driving element 100 A thermal diffusion plate 1300 is disposed between the heat conduction block 200 and the back cover 13 and a heat transfer layer 1500 made of an electrogalvanized steel plate is disposed between the thermal diffusion plate 1300 and the back cover 13. [ As shown in FIG.

18A is column data of a display device according to a comparative example in which the first driving device 100 and the back cover 13 are not connected unlike the present invention.

Referring to FIG. 18A, it can be seen that the heat is concentrated in the region where the first driving element 100 is disposed, and thus the temperature is high.

On the other hand, referring to FIG. 18B, it can be seen that the heat generated in the first driving device 100 is effectively discharged, and the temperature of the region in which the first driving device 100 is disposed is sufficiently low.

19 to 22 are views for explaining another display device according to the present invention. Hereinafter, the description of the parts described in detail above will be omitted. For example, the first driving device 100 and the back cover 13 are also connected to each other in the following display devices.

19 and 20, it is possible that the driving board 15 is disposed in a specific area in the frame 14. [ 19, the frame 14 can have a substantially quadrangular plate shape, and the drive board 15 can be mounted on the second long side (LS2) region of the frame 14 .

Here, the second long side LS2 faces the first long side LS1, and the second long side LS2 has a first short side SS1 and a second short side LS2, SS2. ≪ / RTI > Here, the first long side LS1 of the frame 14 may be referred to as a first region, and the second long side LS2 may be referred to as a second region.

The distance L1 between the first area LS1 of the frame 14 and the driving board 15 is set to be shorter than the distance L1 between the second area L2 facing the first area LS1 and the driving board 15 May be larger than the interval L2 between the first and second sides.

In other words, when the drive board 15 disposed at the rear of the frame 14 is disposed close to the second long side LS2 of the frame 14, the back cover 13 is also disposed in the second It can be arranged to be shifted toward the long side LS2.

As described above, the back cover 13 disposed behind the drive board 15 can cover only a part of the frame 14 without covering the entire area of the frame 14.

In this case, the back cover 13 may be connected to the frame 14 or fixed to the frame 14.

21, a wall-and-wall supporter 2110 may be disposed on the rear surface of the frame 14. [ 21, a reference numeral 2100 disposed on the front surface of the frame 14 may be a display module including a display panel. Such a display device according to Fig. 21 can be called a wall-hanging type display device.

The height R1 of the wall-mounted supporter 2110 measured from the frame 14 may be higher than the maximum height R2 of the back cover 13 measured from the frame 14. [

In this case, even when the display device according to the present invention is fixed to a predetermined wall, the wall and the back cover 13 are separated from each other by a predetermined distance, so that the first driving device 100 connected to the back cover 13 The generated heat can be effectively discharged.

Alternatively, it is possible to provide a space in which air can flow between the frame 14 and the back cover 13.

22, a base layer 2200 is disposed on the rear surface of the frame 14, a support means 2210 such as Pemnut is disposed on the base layer 2200, The driving board 15 may be disposed on the second board 2210. [

In addition, the back cover 13 can be connected to the base layer 2200. The back cover 13 may be connected to the base layer 2200 using a predetermined fastening means 2220 such as a screw so that the back cover 13 and the frame 14 are separated from each other by a predetermined distance. In this case, air can be introduced from the outside between the back cover 13 and the frame 14, and the temperature of the driving elements disposed on the driving board 15 can be sufficiently lowered.

23 to 24 are views for explaining another display device according to the present invention. Hereinafter, the description of the parts described in detail above will be omitted. The following display device may be referred to as a stand-type display device.

Another display device according to the present invention includes a stand box 1900 disposed at a lower portion of a display panel 10 and a frame 14 disposed at a rear surface of the display panel 10, And a supporter 1910 for connecting the first and second antennas 1900 and 1900. FIG.

In this configuration, the driving board may be disposed in the stand box 1900. [ That is, the image data can be supplied from the stand box 1900 to the display panel 10. To this end, a cable for transmitting driving signals or image data to the display panel 10 may be disposed in the supporter 1910.

24, the stand box 1900 includes a base frame 2000, a drive board 2010 disposed on the base frame 2000 and having a plurality of drive elements 100 and 110 mounted thereon, And a box cover 2020 disposed at a rear side of the box cover 2010.

In addition, at least one of the plurality of driving elements 100 and 110 may be connected to the box cover 2020.

This configuration may correspond to the configuration described in FIGS. 1 to 22 above.

For example, the base frame 2000 may correspond to the frame 14, the drive board 2010 may correspond to the drive board 15, and the box cover 2020 may correspond to the back cover 13 . Since the frame 14, the back cover 13, and the drive board 15 have been described in detail above, the configurations of Figs. 23 to 24 can be sufficiently deduced from the configurations of Figs.

In addition, it may further include a thermal diffusion plate 2040 disposed in the box cover 2020 between the drive board 2010 and the box cover 2020. This thermal diffusion plate 2040 may correspond to the thermal diffusion plate 1300 described above.

As described above, it is to be understood that the technical structure of the present invention can be embodied in other specific forms without departing from the spirit and essential characteristics of the present invention.

It should be understood, therefore, that the embodiments described above are to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than the foregoing description, And all changes or modifications derived from equivalents thereof should be construed as being included within the scope of the present invention.

Claims (23)

A display panel;
A frame disposed behind the display panel;
A driving board disposed in the frame and having a plurality of driving elements mounted thereon; And
A back cover disposed behind the driving board;
Lt; / RTI >
At least one of the plurality of driving elements mounted on the driving board is connected to the back cover,
Wherein the plurality of driving elements include first to fourth driving elements,
A heat conductive block is disposed between the back cover and the first driving element,
Wherein an elastic layer is disposed between the heat conduction block and the back cover when the adhesive layer is disposed between the first driving element and the heat conduction block,
Wherein when the elastic layer is disposed between the first driving element and the heat conduction block, the adhesive layer is disposed between the heat conduction block and the back cover,
The third driving element is disposed adjacent to the first driving element,
The fourth driving element is disposed adjacent to the second driving element,
And the third driving element and the fourth driving element
A second driving element which is lower in level than the second driving element and higher in height than the first driving element,
Wherein an interval between the first driving element and the third driving element is
The second driving element and the fourth driving element are wider than the interval between the second driving element and the fourth driving element,
Wherein the back cover forms a hole penetrating the back cover and the hole is located around the first driving element. delete The method according to claim 1,
Wherein a maximum temperature of the heat generated in the first driving device during driving is higher than a maximum temperature of heat generated in the second driving device. The method according to claim 1,
Wherein the first driving element contacts the back cover. delete The method according to claim 1,
Wherein the adhesive layer comprises metal particles. delete The method according to claim 1,
Wherein the elastic layer comprises a thermally conductive material. delete The method according to claim 1,
And the second driving element is the driving element having the highest height measured from the driving board among the plurality of driving elements not connected to the back cover. delete The method according to claim 1,
And the height of the third driving element is lower than the height of the fourth driving element. The method according to claim 1,
Wherein a maximum temperature of the heat generated in the third driving device during driving is lower than a maximum temperature of heat generated in the fourth driving device. The method according to claim 1,
Wherein a portion of the back cover connected to the first driving element is formed with a depression that is recessed in a direction toward the first driving element. The method according to claim 1,
Wherein a thickness of a portion of the back cover connected to the first driving element is larger than a thickness of a portion of the back cover overlapping the second driving element. delete The method according to claim 1,
Wherein the heat conduction block includes a plurality of heat dissipation fins. The method according to claim 1,
And a fan for circulating air is not provided between the back cover and the frame. The method according to claim 1,
And a heat spreading plate disposed on the back cover between the driving board and the back cover,
Wherein at least one of the plurality of driving elements mounted on the driving board is connected to the thermal diffusion plate. delete 20. The method of claim 19,
Wherein the thermal diffusion plate extends to a region overlapped with the second driving element. delete A display panel;
A frame disposed behind the display panel;
A stand box disposed at a lower portion of the display panel; And
And a supporter connecting the frame and the stand box,
The stand box
A base frame;
A driving board disposed on the base frame and having a plurality of driving elements mounted thereon;
A box cover disposed behind the drive board;
And a heat spreading plate disposed on the box cover between the drive board and the box cover,
At least one of the plurality of driving elements mounted on the driving board is connected to the thermal diffusion plate,
Wherein the plurality of driving elements include first to fourth driving elements,
A heat conduction block is disposed between the thermal diffusion plate and the first driving element,
When an adhesive layer is disposed between the first driving element and the heat conduction block, an elastic layer is disposed between the heat conduction block and the thermal diffusion plate,
Wherein when the elastic layer is disposed between the first driving element and the heat conduction block, the adhesive layer is disposed between the heat conduction block and the thermal diffusion plate,
The third driving element is disposed adjacent to the first driving element,
The fourth driving element is disposed adjacent to the second driving element,
And the third driving element and the fourth driving element
A second driving element which is lower in level than the second driving element and higher in height than the first driving element,
Wherein an interval between the first driving element and the third driving element is
The second driving element and the fourth driving element are wider than the interval between the second driving element and the fourth driving element,
Wherein the box cover forms a hole passing through the box cover, and the hole is located around the first driving element.

Images